阅读说明：本技术 一种微波组件 (Microwave assembly ) 是由 安理 于 2019-11-26 设计创作，主要内容包括：本发明公开了一种微波组件。所述微波组件包括具有容纳腔的盒体,位于容纳腔中的若干个射频模块以及本振功分组件；所述每个射频模块含有独立的封装壳体,每个封装壳体内固定设置有射频电路；所述射频模块的电连接端连接有电连接器；所述若干封装壳体分别可拆卸地固定在所述盒体的底面；所述本振功分组件包括有功分板和环绕所述功分板设置的框架,所述框架的侧壁上的与所述电连接器对应的位置设置有通孔；所述射频模块的电连接端通过电连接器穿过封装壳体以及通孔与功分板实现电连接。本发明提供的微波组件可实现射频模块的快速替换,并节省后期调试和售后维护的时间,提高微波组件的测试和翻修的效率,实现微波组件的通用化、系列化、组合化。(The invention discloses a microwave assembly. The microwave assembly comprises a box body with an accommodating cavity, a plurality of radio frequency modules and a local oscillator power distribution assembly, wherein the radio frequency modules and the local oscillator power distribution assembly are positioned in the accommodating cavity; each radio frequency module comprises an independent packaging shell, and a radio frequency circuit is fixedly arranged in each packaging shell; the electric connection end of the radio frequency module is connected with an electric connector; the packaging shells are detachably fixed on the bottom surface of the box body respectively; the local oscillator power dividing assembly comprises an active power dividing plate and a frame arranged around the active power dividing plate, and through holes are formed in the side wall of the frame and correspond to the electric connectors; the electric connection end of the radio frequency module penetrates through the packaging shell and the through hole through the electric connector to be electrically connected with the power dividing plate. The microwave assembly provided by the invention can realize the quick replacement of the radio frequency module, save the time of later debugging and after-sale maintenance, improve the testing and overhauling efficiency of the microwave assembly and realize the generalization, serialization and combination of the microwave assembly.)

1. A microwave assembly, characterized in that the microwave assembly comprises:

the radio frequency module comprises a box body with an accommodating cavity, a plurality of radio frequency modules and a local oscillation power distribution assembly, wherein the radio frequency modules and the local oscillation power distribution assembly are positioned in the accommodating cavity;

each radio frequency module comprises an independent packaging shell, and a radio frequency circuit is fixedly arranged in each packaging shell;

the electric connection end of the radio frequency module is connected with an electric connector;

the packaging shells are detachably fixed on the bottom surface of the box body respectively;

the local oscillator power dividing assembly comprises an active power dividing plate and a frame arranged around the active power dividing plate, and through holes are formed in the side wall of the frame and correspond to the electric connectors;

the electric connection end of the radio frequency module penetrates through the packaging shell and the through hole through the electric connector to be electrically connected with the power dividing plate.

2. The microwave assembly of claim 1, wherein the enclosure has a plurality of parallel and independent microwave receiving channels formed therein by the arrangement of partitions.

3. The microwave assembly of claim 1, wherein a first heat conducting member is disposed between a side surface of the rf module adjacent to the bottom surface of the case and the bottom surface of the case.

4. The microwave assembly of claim 3, wherein the first thermally conductive member is a thermally conductive silicone grease.

5. The microwave assembly of claim 1, wherein the enclosure housing includes a frame body having an interior cavity and an upper cover plate; the radio frequency circuit is fixedly arranged in the inner cavity;

the frame body and the upper cover plate are fixedly connected through a laser welding seam.

6. The microwave assembly of claim 1, further comprising a digital board and a power module fixed to a bottom surface of the case;

the digital board and/or the power module are respectively provided with a plurality of heating components,

the positions of the bottom surface of the box body corresponding to the plurality of heating components are respectively provided with a convex structure,

the plurality of heating components are respectively abutted against the protruding structures.

7. The microwave assembly of claim 6, wherein a second heat conducting element is disposed between the heat generating component and the raised structure on the bottom surface of the case.

8. The microwave assembly of claim 1, wherein the second thermally conductive member is a thermally conductive gasket.

9. The microwave assembly of claim 6, further comprising a water cooling assembly disposed outside the enclosure;

the water cooling assembly is configured to cool the radio frequency module and the heat generating components.

Technical Field

The invention relates to the technical field of microwaves, in particular to a microwave assembly

Background

The microwave assembly is a product assembled by various microwave components and other parts. The microwave component is mainly used for realizing various transformations of frequency, power, phase and the like of microwave signals, and is mainly applied to the fields of wireless communication, automobile millimeter wave radars and the like.

At present, the microwave assembly in the prior art generally adopts an internally packaged microwave device, i.e. the microwave device is directly and fixedly installed inside a box body of the microwave assembly. If the microwave assembly contains a plurality of microwave receiving channels, the plurality of microwave receiving channels are isolated by arranging the partition wall on the assembly box body. However, once a microwave device of the microwave assembly with such a structure fails and needs to be replaced or maintained, the microwave assembly needs to be disassembled and repaired one by one, which is time-consuming and labor-consuming, and greatly limits the development of the microwave assembly to the technical direction of generalization, serialization and combination.

Therefore, in order to overcome the drawbacks of the prior art, a new type of microwave assembly needs to be provided.

Disclosure of Invention

The invention aims to provide a microwave assembly, which can realize the quick replacement of a radio frequency module, save the time of later debugging and after-sale maintenance, improve the testing and repairing efficiency of the microwave assembly and promote the development of the microwave assembly to the technical direction of universalization, serialization and combination.

In order to achieve the above object, the present invention provides a microwave assembly, which includes a box body having an accommodating cavity, a plurality of rf modules and a local oscillation power dividing assembly located in the accommodating cavity; each radio frequency module comprises an independent packaging shell, and a radio frequency circuit is fixedly arranged in each packaging shell; the electric connection end of the radio frequency module is connected with an electric connector; the packaging shells are detachably fixed on the bottom surface of the box body respectively; the local oscillator power dividing assembly comprises an active power dividing plate and a frame arranged around the active power dividing plate, and through holes are formed in the side wall of the frame and correspond to the electric connectors; the electric connection end of the radio frequency module penetrates through the packaging shell and the through hole through the electric connector to be electrically connected with the power dividing plate.

In addition, the preferable scheme is that a plurality of parallel and independent microwave receiving channels are formed in the packaging shell through arrangement of partition plates.

In addition, preferably, a first heat conducting piece is arranged between the surface of one side, close to the bottom surface of the box body, of the radio frequency module and the bottom surface of the box body.

In addition, preferably, the first heat-conducting member is heat-conducting silicone grease.

In addition, the preferable scheme is that the packaging shell comprises a frame body with an inner cavity and an upper cover plate; the radio frequency circuit is fixedly arranged in the inner cavity; the frame body and the upper cover plate are fixedly connected through a laser welding seam.

In addition, the preferable scheme is that the microwave assembly further comprises a digital board and a power supply module which are fixed on the bottom surface of the box body; the digital board and/or the power module are/is provided with a plurality of heating components, the positions of the bottom surface of the box body corresponding to the plurality of heating components are respectively provided with a protruding structure, and the plurality of heating components are respectively abutted to the protruding structures.

In addition, the preferred scheme is that a second heat conducting piece is arranged between the heating component and the protruding structure on the bottom surface of the box body.

In addition, preferably, the second heat-conducting member is a heat-conducting gasket.

In addition, the preferable scheme is that the microwave assembly further comprises a water cooling assembly arranged outside the box body; the water cooling assembly is configured to cool the radio frequency module and the heat generating components.

The invention has the following beneficial effects:

1. the microwave assembly provided by the invention can realize the quick replacement of the radio frequency module, save the time of later debugging and after-sale maintenance, improve the testing and overhauling efficiency of the microwave assembly and promote the development of the microwave assembly to the technical direction of universalization, serialization and combinatization; meanwhile, the through holes in the frame enable the electric connector to be quickly positioned on the power distribution plate, the assembly efficiency of the microwave assembly is improved, and the overall structural strength and stability of the microwave assembly are improved. In addition, the microwave assembly with the structure can prevent the situation that the electric connector is easily polluted by dust in the using process to cause poor contact between the electric connector and the power dividing plate.

2. The frame body and the upper cover plate of the packaging shell of the microwave assembly are fixedly connected through the laser welding line, so that the air tightness of the interior of the radio frequency module can be effectively ensured, a plurality of bare chips loaded in the radio frequency module are prevented from being polluted by substances such as particles, and the chips are prevented from being influenced by moisture in the air.

3. The microwave assembly provided by the invention is provided with the first heat-conducting piece and the second heat-conducting piece, so that the contact resistance between the radio frequency module and the bottom surface of the box body and between the heating component and the protruding structure can be effectively reduced, and the cooling efficiency of the water cooling assembly on the radio frequency module and the heating component is improved.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 shows an exploded view of a microwave assembly according to the present invention.

Fig. 2 shows a schematic structural assembly diagram of the microwave module provided by the invention.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.

In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

At present, the microwave assembly in the prior art generally adopts an internally packaged microwave device, i.e. the microwave device is directly and fixedly installed inside a box body of the microwave assembly. If the microwave assembly contains a plurality of microwave receiving channels, the plurality of microwave receiving channels are isolated by arranging the partition wall on the assembly box body. However, once a microwave device of the microwave assembly with such a structure fails and needs to be replaced or maintained, the microwave assembly needs to be disassembled and repaired one by one, which is time-consuming and labor-consuming, and greatly limits the development of the microwave assembly to the technical direction of generalization, serialization and combination.

In order to overcome the technical defects, the invention provides a microwave assembly, which comprises a box body 10 with an accommodating cavity, wherein the box body can be of a cubic structure made of alumina, a plurality of radio frequency modules and a local oscillation power distribution assembly, and the radio frequency modules and the local oscillation power distribution assembly are positioned in the accommodating cavity; each radio frequency module comprises an independent packaging shell 20, and a radio frequency circuit (not shown in the figure) is fixedly arranged in each packaging shell 20; the rf module includes a plurality of bare chips and a circuit board, and the rf module can be directly soldered to the package housing 20. The electrical connection end of the rf module is connected with an electrical connector, for example, the electrical connector may be a pin connector formed on the sidewall of the package housing 20; the electric connector is used for electrically connecting the circuit board, the chip and the power dividing board in the radio frequency module. A plurality of package housings 20 are detachably fixed on the bottom surface of the box 10, for example, the package housings 20 may be fixed on the bottom surface of the box 10 by means of screws. The local oscillator power dividing assembly comprises a power dividing plate and a frame 30 arranged around the power dividing plate, the power dividing plate can be a laminar PCB (printed circuit board), for example, and a through hole is formed in the position, corresponding to the electric connector, on the side wall of the frame 30; the electrical connection end of the rf module passes through the package housing 20 and the through hole of the frame 30 through the electrical connector to be electrically connected to the power dividing board. Specifically, the pin connectors on the side wall of the package housing 20 pass through the through holes on the frame 30 and are soldered on the pads of the power dividing board.

In the installation process, firstly, the packaging shell 20 welded with the radio frequency circuit is fixed on the bottom surface of the box body 10 through screws, then the signal connector welded on the packaging shell 20 is in blind insertion connection with the signal adapter 40 positioned at the front end of the box body 10, then the electric connector on the side wall of the packaging shell 20 penetrates through the through hole in the frame 30 and is welded on the power distribution plate, so that the electric connection between the radio frequency circuit in the radio frequency module and the power distribution plate can be realized, and the radio frequency module is connected with the output end connector of the microwave assembly through the power distribution plate and a cable. When a certain rf module fails during operation, the radio frequency module can be taken out together with the rf circuit for repair or replacement only by detaching the screws on the package housing 20 of the rf module and detaching the electrical connector welded to the power dividing board.

Compared with the structural form that the radio frequency module is integrally welded on the box body of the assembly in the prior art, the preferred microwave assembly can realize the quick repair/replacement of the radio frequency module without dismantling all the radio frequency modules, and the radio frequency module and the power dividing board are independently electrically connected through the electric connector, so that the assembly is easier to disassemble compared with the circuit connection in the prior art; in addition, the microwave assembly provided by the optimal mode can save the time of later-stage debugging and after-sale maintenance, improve the testing and repairing efficiency of the microwave assembly and promote the development of the microwave assembly to the technical direction of universalization, serialization and combination; meanwhile, the through holes in the frame of the power splitting plate can realize that the electric connector is quickly positioned on the power splitting plate and fixed, so that the assembly efficiency of the microwave assembly is improved, and the integral structural strength and stability of the microwave assembly are enhanced. In addition, the electric connector on the radio frequency module of the microwave assembly of the preferred embodiment passes through the through hole to be connected with the power dividing plate, so that poor contact between the electric connector and the power dividing plate caused by dust contamination of the electric connector in the use process can be effectively prevented.

Further preferably, a plurality of parallel and independent microwave receiving channels are formed in the package housing 20 by disposing the partition 23, so that mutual interference and crosstalk between the microwave receiving channels can be minimized, and mutual interference between the microwave receiving channels is not affected. In addition, as shown in fig. 1-2, the package housing 20 may include a frame body 22 having an inner cavity and an upper cover plate 21; the radio frequency circuit is fixedly arranged in the inner cavity; the frame body 22 and the upper cover plate 21 are fixedly connected through laser welding seams. It will be understood by those skilled in the art that the frame 22 and the upper cover plate 21 can also be connected and fixed by a laser tin sealing process or other sintering process of the electrical connector, and this preferred structure can effectively ensure complete sealing performance in the rf module, ensure that the bare chips and the circuit board loaded in the rf module are protected from particles and other substances, and simultaneously avoid moisture in the air from affecting the chips.

In addition, the microwave assembly further comprises a digital board and a power module 50 fixed on the bottom surface of the box body 10; the digital board and/or the power module 50 are respectively provided with a plurality of heating components on one side of the bottom surface of the box body 10, and because the heating components generate a large amount of heat, if the heat is not dissipated in time, the digital board and the power module are damaged. Therefore, the positions of the bottom surface of the box body 10 corresponding to the plurality of heating components are respectively provided with a protruding structure 11, the size of the protruding structure 11 is equal to that of the plurality of heating components, and the plurality of heating components are respectively abutted against the protruding structure 11. Further, the microwave assembly further comprises a water cooling assembly arranged outside the box body 10; the water cooling assembly is configured to cool the radio frequency module and the heat generating components. The water cooling component can be a water cooling plate arranged on the surface of one side of the bottom of the box body 10, which is far away from the accommodating cavity, and the internal heat of the radio frequency module is conducted to the water cooling plate through the bottom surface of the box body 10; the internal heat of the heating components on the digital board and the power module 50 is conducted to the water cooling board through the protruding structure 11 on the bottom surface of the box body 10.

In order to increase the thermal conductivity between the rf module and the bottom surface of the box 10, a first thermal conductive member is disposed between a side surface of the rf module close to the bottom surface of the box 10 and the bottom surface of the box 10. Preferably, the first heat-conducting piece can be heat-conducting silicone grease, and by arranging the first heat-conducting piece between the radio frequency module and the bottom surface of the box body, the contact resistance between the radio frequency module and the bottom surface of the box body can be effectively reduced, and the cooling efficiency of the water-cooling assembly on the radio frequency module is improved; it will be understood by those skilled in the art that a second heat conducting member may be disposed between the heat generating component and the protruding structure 11 on the bottom surface of the case 10. Preferably, the second heat conducting member is a heat conducting gasket 60, which can effectively reduce the contact resistance between the heat generating component and the protruding structure, and increase the heat conductivity between the heat generating component and the protruding structure.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.