阅读说明：本技术 包括菌丝及包埋材料的真菌复合材料 (Fungal composite comprising hyphae and embedding material ) 是由 J.蔡斯 N.温纳 P.罗斯 W.莫里斯 于 2019-06-26 设计创作，主要内容包括：具有工程化的(engineered)和/或改善的机械性能,例如,撕裂强度、抗张强度和抗分离性的柔性真菌复合材料(fungal composite)。所述真菌复合材料通过将第二种材料包埋在真菌基质(fungal matrix)中产生。所述真菌复合材料的撕裂强度大于所述真菌基质的撕裂强度。所述真菌复合材料的抗张强度至少等于所述包埋材料的抗张强度。并且所述真菌基质和所述包埋材料之间的抗分层性使得将所述真菌基质和所述包埋材料彼此分离所需的力大于或等于将所述真菌基质或所述包埋材料与其自身分离所需的力。(Flexible fungal composites (fungal composites) with engineered and/or improved mechanical properties, e.g., tear strength, tensile strength and separation resistance. The fungal composite is produced by embedding a second material in a fungal matrix. The tear strength of the fungal composite is greater than the tear strength of the fungal matrix. The tensile strength of the fungal composite is at least equal to the tensile strength of the embedding material. And the delamination resistance between the fungal matrix and the embedding material is such that the force required to separate the fungal matrix and the embedding material from each other is greater than or equal to the force required to separate the fungal matrix or the embedding material from itself.)