阅读说明：本技术 焊接部件 (Welded component ) 是由 桥口徹 于 2019-07-01 设计创作，主要内容包括：一种焊接部件,能够进行表面贴装并能够进行可靠性高的连接。该焊接部件具备：触头、侧面部(18)和背面部(19),分别具有朝向与基板的表面交叉的方向弯折的弯折部(20、21)；以及四个以上的基板连接部(13A、13A、18A、18A、19A),形成在触头、侧面部(18)和背面部(19)的前端；三个基板连接部(18A、18A、19A)分别具有比对应的弯折部的宽度窄的宽度；在焊接部件(11)放置在基板的表面上的状态下,仅三个基板连接部与基板的表面接触,即使三个基板连接部的每一个中的任意一点成为与基板的表面接触的接触点(P),焊接部件的重心(G)也位于由三个基板连接部的三个接触点(P)形成的三角形(T1)的内侧。(A soldered component capable of surface mounting and highly reliable connection. The welding member includes: a contact, a side surface section (18), and a rear surface section (19) each having a bent section (20, 21) bent in a direction intersecting the surface of the substrate; and four or more substrate connection portions (13A, 18A, 19A) formed at the tips of the contact, the side surface portion (18), and the back surface portion (19); the three substrate connection parts (18A, 19A) respectively have a width narrower than the width of the corresponding bending part; in a state where the soldering member (11) is placed on the surface of the substrate, only the three substrate connecting portions are in contact with the surface of the substrate, and even if any one point of each of the three substrate connecting portions becomes a contact point (P) in contact with the surface of the substrate, the center of gravity (G) of the soldering member is located inside a triangle (T1) formed by the three contact points (P) of the three substrate connecting portions.)

1. A solder part having a surface mounted on a substrate, comprising:

one or more terminal members each having a bent portion bent in a direction intersecting with a surface of the substrate and connected to the surface of the substrate by the surface mounting; and

four or more substrate connection portions formed at the tip of the one or more terminal members;

three of the four or more substrate connection portions each have a width narrower than a width of the bent portion of the corresponding terminal member;

in a state where the soldering member is placed on the surface of the substrate, only the three substrate connecting portions are in contact with the surface of the substrate, and even if any one point in each of the three substrate connecting portions becomes a contact point with the surface of the substrate, the center of gravity of the soldering member is located inside a triangle formed by the three contact points of the three substrate connecting portions.

2. The welding component according to claim 1, wherein the three substrate connecting portions each have a shape that cuts a leading end of the corresponding terminal member.

3. The welding component according to claim 1 or 2, wherein one substrate connection portion is formed at each tip of the one or more terminal members.

4. The welding component according to claim 1 or 2, wherein two or more of the substrate connecting portions are formed at a leading end of at least one of the one or more terminal members.

Technical Field

The present invention relates to a soldered part, and more particularly, to a soldered part having a surface attached to a substrate.

Background

Conventionally, a surface mounting method has been known as one of methods for mounting a solder member such as an electronic component or a semiconductor device on a substrate. The surface mounting method is as follows: after a solder member is disposed on the surface of the substrate coated with the solder paste, the solder is melted by heating in a high-temperature furnace, and the solder member is fixed to the substrate.

For example, patent document 1 discloses a soldered component attached by such a surface mounting method. As shown in fig. 11, the soldering member includes a plurality of lead portions 2 led out from a member body 1, each lead portion 2 has a flat surface portion 3 facing a substrate not shown, and a projection 4 projecting toward the substrate is formed on the flat surface portion 3.

As shown in fig. 12, for example, eight lead portions 2 may be provided, and the respective protrusions 4 may be arranged such that the gravity center G of the soldering member is located inside a quadrangle S1 formed by the protrusions 4 of the eight lead portions 2, thereby stabilizing the posture of the soldering member when the soldering member is placed on the surface of the substrate.

Disclosure of Invention

Technical problem to be solved by the invention

However, even with eight lead portions 2, when the soldering member is placed on the surface of the substrate, the soldering member is actually supported only by the protrusions 4 of any three lead portions 2 surrounding the center of gravity G of the soldering member.

Further, since the projections 4 are formed on the flat surface portions 3 of all the lead portions 2, when the soldering member is placed on the surface of the substrate, which of the projections 4 of the eight lead portions 2 is in contact with the surface of the substrate depends on manufacturing variations in shape such as burrs occurring in the projections 4, and even if the soldering member is of the same design, the projections 4 of the three lead portions 2 that actually support the soldering member cannot be determined.

Therefore, for example, when the welding member is supported by the three protrusions 4A shown in fig. 12, the gravity center G of the welding member is positioned on the oblique side 5 of the triangle S2 formed by connecting the three protrusions 4A, and the welding member is in an extremely unstable state, and even if a slight external force is applied during welding, the posture of the welding member changes, and there is a possibility that a connection failure may occur.

Means for solving the problems

The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a solder member that can be connected with high reliability even when surface mounting is performed.

The welding member of the present invention is a welding member having a surface mounted on a substrate, and includes: one or more terminal members each having a bent portion bent in a direction intersecting a surface of a substrate and connected to the surface of the substrate by surface mounting; and four or more substrate connection portions formed at the front ends of the one or more terminal members; three of the four or more substrate connection portions each have a width narrower than a width of the bent portion of the corresponding terminal member; in a state where the soldering member is placed on the surface of the substrate, only the three substrate connecting portions are in contact with the surface of the substrate, and even if any one point of each of the three substrate connecting portions becomes a contact point with the surface of the substrate, the center of gravity of the soldering member is located inside a triangle formed by the three contact points of the three substrate connecting portions.

The three substrate connection portions may be configured to have shapes each of which cuts the front end of the corresponding terminal member.

One substrate connection portion may be formed at each of the front ends of one or more terminal members. Or two or more substrate connection portions may be formed at the tip of at least one of the one or more terminal members.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a welded member includes: one or more terminal members each bent toward a bending portion bent in a direction intersecting a surface of the substrate; and four or more substrate connection portions formed at the front ends of the one or more terminal members; three of the four or more substrate connection portions each have a width narrower than the width of the bent portion of the corresponding terminal member, and only three substrate connection portions are in contact with the surface of the substrate in a state where the solder part is placed on the surface of the substrate, and even if any one point of each of the three substrate connection portions becomes a contact point in contact with the surface of the substrate, the center of gravity of the solder part is located inside a triangle formed by the three contact points of the three substrate connection portions, so that surface mounting can be performed, and connection with high reliability can be performed.

Drawings

Fig. 1 is a perspective view of a welded component according to embodiment 1 of the present invention, as viewed from obliquely above.

Fig. 2 is a side cross-sectional view of the welded component according to embodiment 1.

Fig. 3 is a perspective view of the welded component according to embodiment 1, as viewed obliquely from below.

Fig. 4 is a side view of a welded component according to embodiment 1.

Fig. 5 is a rear view of the welded component according to embodiment 1.

Fig. 6 is a perspective view of the welded component according to embodiment 2, as viewed obliquely from below.

Fig. 7 is a perspective view of the welded component according to embodiment 3, as viewed from obliquely above.

Fig. 8 is a perspective view of the welded component according to embodiment 3, as viewed obliquely from below.

Fig. 9 is a front view showing a welded component according to embodiment 4.

FIG. 10 is a partial perspective view showing a terminal member of a welded component according to embodiment 4

Fig. 11 is a front view showing a conventional welded component.

Fig. 12 is a plan view showing a conventional welded component.

Reference numerals

1 part body 2 lead 3 plane part 4, 4A projection 5 inclined edge

11. 31, 41, 51 welding part 12 substrate 13 contact (terminal member)

13A, 18B, 18C, 19A, 19C, 53A substrate connecting part 13B contact part

14 insulator 14B bottom surface 15 metal shell 16 counterpart connector housing

17 upper surface 18 side surface (terminal member) 19 back surface (terminal member)

20. 21, 22, 55 bent portion 52 semiconductor chip 53 pin terminal (terminal member)

54 Package W1, W2, W3, W4, W5, W6 Width P contact point G center of gravity

T1, T2, T3 triangle S1 quadrilateral S2 triangle

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.