阅读说明：本技术 一种拉丝模具内孔涂层抛光方法 (Polishing method for inner hole coating of wire drawing die ) 是由 李波涛 程延合 罗鑫 *** 丰杰 于 2019-11-13 设计创作，主要内容包括：本发明公开一种拉丝模具内孔涂层抛光方法,包括如下步骤：将拉丝模具放置在抛光刀具活动轨迹上；抛光刀具对拉丝模具内孔的压缩区进行抛光；调整拉丝模具,抛光刀具对拉丝模具内孔的定径区进行抛光；抛光刀具移出,取出拉丝模具。将通过气相沉积制备出的金刚石膜层进行抛光处理,提高拉丝模具内孔侧壁的平整度,降低线材拉拔过程中线材对金刚石涂层的应力作用,避免金刚石涂层脱落剥离造成拉丝模具损坏,增加了使用寿命。(The invention discloses a polishing method of an inner hole coating of a wire drawing die, which comprises the following steps: placing a wire drawing die on the moving track of the polishing cutter; polishing the compression area of the inner hole of the wire drawing die by using a polishing tool; adjusting the wire drawing die, and polishing the sizing area of the inner hole of the wire drawing die by a polishing cutter; and (5) moving out the polishing cutter, and taking out the wire drawing die. The diamond film layer prepared by vapor deposition is polished, the flatness of the inner hole side wall of the wire drawing die is improved, the stress effect of the wire on the diamond coating in the wire drawing process is reduced, the damage of the wire drawing die caused by the falling and stripping of the diamond coating is avoided, and the service life is prolonged.)

1. A polishing method for an inner hole coating of a wire drawing die is characterized by comprising the following steps:

placing a wire drawing die on the moving track of the polishing cutter;

polishing the compression area of the inner hole of the wire drawing die by using a polishing tool;

adjusting the wire drawing die, and polishing the sizing area of the inner hole of the wire drawing die by a polishing cutter;

and (5) moving out the polishing cutter, and taking out the wire drawing die.

2. The method for polishing the coating of the inner hole of the wire drawing die as claimed in claim 1, wherein the step of polishing the compression zone of the inner hole of the wire drawing die by the polishing tool is specifically as follows:

adding a first grinding agent into an inner hole of the wire drawing die, and primarily grinding a compression area of the inner hole of the wire drawing die by using a polishing tool;

and cleaning the wire drawing die, adding a second grinding agent into the inner hole of the wire drawing die, and grinding and polishing the compression area of the inner hole of the wire drawing die by using a polishing tool.

3. The method for polishing the coating of the inner hole of the wire drawing die as claimed in claim 1, wherein the step of adjusting the wire drawing die and polishing the sizing area of the inner hole of the wire drawing die by the polishing tool comprises the following steps:

adjusting the angle of a wire drawing die, adding a first grinding agent into an inner hole of the wire drawing die, and primarily grinding a sizing area of the inner hole of the wire drawing die by a polishing cutter;

and cleaning the wire drawing die, adding a second grinding agent into the inner hole of the wire drawing die, and grinding and polishing the sizing area of the inner hole of the wire drawing die by using a polishing tool.

4. The method for polishing the coating of the inner hole of the wire drawing die as claimed in claim 2 or 3, wherein the first abrasive comprises diamond powder with D50 of 7-10 μm and clear water; the second grinding agent comprises diamond powder with D50 of 0.5-5 μm and clear water.

5. The method for polishing the inner bore coating of a wire drawing die according to claim 2 or 3, wherein the rotation speed of the polishing tool during primary grinding is 60-70rpm, and the primary grinding time is 18-22 min; the rotating speed of the polishing cutter during polishing is 60-70rpm, and the polishing time is 10-20 min.

6. The method for polishing the coating of the inner hole of the wire drawing die as claimed in claim 5, wherein the polishing tool continuously presses against the inner hole of the wire drawing die at a pressing pressure of 0.1 to 0.2MPa during polishing.

7. The method of polishing an inner bore coating of a wire drawing die as claimed in claim 1, wherein the polishing tool has a triangular pyramid shape, and the taper of the polishing tool is 5 to 7 °.

Technical Field

The invention relates to the field of metal wire drawing die processing, in particular to a polishing method for an inner hole coating of a drawing die.

Background

The metal wire industry is the main traditional industry in China, and the drawing die is one of important consumable items in the metal wire production. The performance of the wire drawing die determines the wire quality, the production efficiency and the production cost of the metal raw material wire after being drawn.

Diamond is the substance with the highest hardness known in the nature at present, has excellent heat-conducting property, wear resistance and stable chemical property, and is an ideal material for a wire-drawing die. The diamond coating is prepared on the working surface of the processed and formed wire drawing die by a chemical vapor deposition method, so that the production process problems of difficulty in preparing the special-shaped die and poor toughness can be solved, the product added value, the drawing performance and the service life of the diamond coating wire drawing die are greatly improved, the production efficiency and the product market competitiveness of metal wire production enterprises are improved, and social resources can be effectively saved.

The problem is that the surface of diamond coatings produced by vapor deposition is not perfectly smooth and flat. With the use of the wire drawing die, the diamond coating bears the alternating stress of the drawing of the raw material wire for a long time and is transmitted to the interface of the hard alloy and the diamond coating which are taken as the substrate of the wire drawing die, so that the metallographic defect at the interface is excited and gradually evolves into cracks, the diamond coating is stripped off, the hard alloy substrate of the wire drawing die is exposed, and finally the inner hole working surface of the substrate is scratched and damaged in the wire drawing process.

Disclosure of Invention

In view of the above, the application provides a polishing method for an inner hole coating of a wire drawing die, which is used for polishing a diamond film layer prepared by vapor deposition, so that the flatness of the inner hole side wall of the wire drawing die is improved, the stress effect of a wire on the diamond coating in the wire drawing process is reduced, the wire drawing die is prevented from being damaged due to the fact that the diamond coating falls off and peels off, and the service life of the die is prolonged.

In order to solve the technical problems, the technical scheme provided by the invention is a polishing method of an inner hole coating of a wire-drawing die, which comprises the following steps:

placing a wire drawing die on the moving track of the polishing cutter;

polishing the compression area of the inner hole of the wire drawing die by using a polishing tool;

adjusting the wire drawing die, and polishing the sizing area of the inner hole of the wire drawing die by a polishing cutter;

and (5) moving out the polishing cutter, and taking out the wire drawing die.

Preferably, the polishing step of the polishing tool on the compression area of the inner hole of the wire-drawing die specifically comprises:

adding a first grinding agent into an inner hole of the wire drawing die, and primarily grinding a compression area of the inner hole of the wire drawing die by using a polishing tool;

and cleaning the wire drawing die, adding a second grinding agent into the inner hole of the wire drawing die, and grinding and polishing the compression area of the inner hole of the wire drawing die by using a polishing tool.

Preferably, the step of adjusting the wire drawing die and the step of polishing the sizing area of the inner hole of the wire drawing die by the polishing tool specifically comprise:

adjusting the angle of a wire drawing die, adding a first grinding agent into an inner hole of the wire drawing die, and primarily grinding a sizing area of the inner hole of the wire drawing die by a polishing cutter;

and cleaning the wire drawing die, adding a second grinding agent into the inner hole of the wire drawing die, and grinding and polishing the sizing area of the inner hole of the wire drawing die by using a polishing tool.

Preferably, the first grinding agent comprises diamond powder with D50 of 7-10 μm and clear water; the second grinding agent comprises diamond powder with D50 of 0.5-5 μm and clear water.

Preferably, the rotation speed of the polishing cutter during primary grinding is 60-70rpm, and the primary grinding time is 18-22 min; the rotating speed of the polishing cutter during polishing is 60-70rpm, and the polishing time is 10-20 min.

Preferably, the polishing cutter continuously presses the inner hole of the wire-drawing die during polishing, and the pressing pressure is 0.1-0.2 MPa.

Preferably, the polishing tool has a triangular pyramid shape, and the taper of the polishing tool is 5 to 7 °.

Compared with the prior art, the application has the beneficial effects that:

the diamond coating on the surface of the inner hole of the wire drawing die is polished, the surface roughness of the diamond film layer is reduced, the surface stress of the diamond film layer in the use process is reduced, the wear resistance and the service life of the diamond coating of the wire drawing die can be effectively improved, and the use requirements of wire rod production enterprises on high-performance diamond coating wire drawing dies are met.

The inner hole tool of the wire drawing die comprises a plurality of working areas such as an inlet area, a compression area and a sizing area, and is used for polishing an area bearing large stress during wire drawing operation, so that the alternating stress generated in the area during wire drawing is reduced, and the condition that a diamond coating falls off is avoided. The same procedure is adopted to polish the compression area and the sizing area, so that the surface roughness of the compression area and the surface roughness of the sizing area tend to be consistent, the deformation and stress conditions of the wire rod in the whole wire drawing process are more uniform, and the stress concentration is avoided.

The grinding efficiency of the primary grinding to the diamond coating is higher, and the grinding degree of the primary grinding to the diamond coating is more consistent by adopting the diamond powder with larger granularity and relatively accurate grinding time. Polishing grinding adopts thinner diamond powder, and grinding efficiency is lower but the fineness is higher to compare and have wider grinding time requirement in the primary grinding, reduced the artifical working strength who looks over.

The cross section of the triangular pyramid-shaped polishing cutter is triangular, so that the triangular polishing cutter has stronger structural strength, more gaps are formed between the triangular polishing cutter and the circumscribed circle, and more diamond powder can be contained to be in contact with the side wall of the inner hole of the wire drawing die to be polished in the polishing process.

Drawings

FIG. 1 is a schematic cross-sectional view of a wire drawing die;

FIG. 2 is a schematic view of the polishing tool of the present invention;

FIG. 3 is a Raman spectrum of the diamond coating at different positions of the polished wire drawing die.

Reference numerals: the device comprises an inlet zone 1, a compression zone 2, a sizing zone 3 and an outlet zone 4.

Detailed Description

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.

Reference herein to "D50" refers to the median particle diameter, i.e.: the physical meaning of the particle size corresponding to the cumulative percent particle size distribution of a sample reaching 50% is that particles larger than it and particles smaller than it each account for 50%.

Referring to fig. 1, an inner hole of a conventional wire drawing die is sequentially divided into an inlet area 1, a compression area 2, a sizing area 3 and an outlet area 4 according to the difference of the inner diameter and the taper of a side wall. When drawing wire, the wire stock gets into from entry district 1, and entry district 1 internal diameter is great, and is little to the extrusion effect of wire, mainly used guide wire gets into compression district 2. The wire is extruded and drawn in the compression area 2 and is compressed into a preset thickness; the compressed wire may expand and recover to some extent when pushed, so that a fixed diameter area 3 with a constant inner diameter is arranged after the compression area 2 to ensure that the diameter of the wire is fixed. The wire rod after completion of drawing is drawn out from the exit area 4 and sent to the subsequent process. Therefore, the compression zone 2 and the sizing zone 3 are subjected to larger stress action in the whole wire drawing die, and the inner hole coating polishing method provided by the application is mainly applied to the two zones.