阅读说明：本技术 线路板的连孔制作方法 (Method for manufacturing connecting hole of circuit board ) 是由 杨烈文 谢承密 于 2019-10-24 设计创作，主要内容包括：本发明涉及一种线路板的连孔制作方法,包括如下步骤：提供待加工连孔的基材；在基材上对应于连孔的其中一侧的通孔的部位处加工出第一通孔；在基材上对应于连孔的另一侧的通孔的部位处加工出引导孔；采用槽刀在引导孔的部位的基础上加工出与连孔的另一侧的通孔相对应的第二通孔。由于在采用槽刀在基材上对应于连孔的另一侧的通孔的部位处加工出第二通孔的步骤之前,先在基材上对应于连孔的另一侧的通孔的部位处加工出引导孔,如此采用槽刀在基材上加工出第二通孔时,槽刀的左右两侧受力相对平衡,能避免槽刀朝向第一通孔的部位偏移,避免最终制作得到的连孔出现尺寸超标、歪斜等不良缺陷,能提高连孔制备的合格率。(The invention relates to a method for manufacturing a connecting hole of a circuit board, which comprises the following steps: providing a base material to be processed with a connecting hole; processing a first through hole at a position on the base material, which corresponds to the through hole on one side of the connecting hole; processing a guide hole at a position, corresponding to the through hole at the other side of the connecting hole, on the substrate; and processing a second through hole corresponding to the through hole on the other side of the connecting hole on the basis of the position of the guide hole by adopting the slotting tool. Because before the step of processing the second through hole at the position, corresponding to the through hole at the other side of the connecting hole, of the substrate by adopting the groove cutter, the guide hole is processed at the position, corresponding to the through hole at the other side of the connecting hole, of the substrate, when the second through hole is processed on the substrate by adopting the groove cutter, the stress on the left side and the right side of the groove cutter is relatively balanced, the position of the groove cutter facing the first through hole can be prevented from deviating, the undesirable defects that the size of the finally manufactured connecting hole exceeds the standard, the connecting hole is inclined and the like can be avoided, and the qualification rate of the preparation of the connecting hole can be improved.)

1. A method for manufacturing a connecting hole of a circuit board is characterized by comprising the following steps:

providing a base material to be processed with a connecting hole;

processing a first through hole on the base material at a position corresponding to the through hole on one side of the connecting hole;

processing a guide hole at a position, corresponding to the through hole at the other side of the continuous hole, on the substrate, wherein the guide hole is internally tangent to the through hole at the other side of the continuous hole, on the substrate;

and processing a second through hole corresponding to the through hole on the other side of the connecting hole on the basis of the position of the guide hole by adopting a slotting cutter.

2. The method for manufacturing a via hole of a circuit board according to claim 1, wherein the step of processing a first via hole on the substrate at a position corresponding to the via hole on one side of the via hole comprises:

firstly, determining a first processing position of the first through hole;

selecting a corresponding drill according to the diameter of the first through hole;

and drilling the first through hole at a first processing position on the base material by using a drill.

3. The method for manufacturing a via hole of a circuit board according to claim 1, wherein the step of processing a first via hole on the substrate at a position corresponding to the via hole on one side of the via hole comprises:

firstly, determining a first processing position of the first through hole;

and machining the first through hole at the first machining position on the base material in a reaming mode, or machining the first through hole at the first machining position on the base material in a milling mode by using a milling cutter.

4. The method for forming a via hole in a wiring board according to claim 1, wherein the step of forming a guide hole in the substrate at a position corresponding to the through hole on the other side of the via hole comprises:

firstly, determining a second machining position of the guide hole;

selecting a corresponding drill according to the diameter of the guide hole;

and drilling the guide hole at a second processing position on the base material by using a drill.

5. The method for forming a via hole in a wiring board according to claim 1, wherein the step of forming a guide hole in the substrate at a position corresponding to the through hole on the other side of the via hole comprises:

firstly, determining a second machining position of the guide hole;

and machining the guide hole at the second machining position on the base material by reaming, or machining the guide hole at the second machining position on the base material by milling by a milling cutter.

6. The method of manufacturing a via hole for a wiring board according to claim 4 or 5, wherein a center of the second processing position is located on a long axis of the via hole, and a distance between the center of the second processing position and an edge of the via hole in a longitudinal direction is equal to a radius of the guide hole.

7. The method of manufacturing a via for a wiring board according to claim 6, wherein the diameter of the guide hole is D, the length of the long axis of the via is L, the diameter of the first through hole is R1, the diameter of the second through hole is R2, and the diameter of the guide hole D, the length of the long axis of the via L, the diameter of the first through hole R1, and the diameter of the second through hole R2 satisfy the relationship: L-R1 is not less than D and is less than R2.

8. The method for manufacturing the connecting hole of the circuit board according to claim 1, wherein the specific method for processing the second through hole corresponding to the through hole on the other side of the connecting hole on the basis of the position of the guide hole by using the slotting tool comprises the following steps: and a slotting cutter is arranged in the guide hole, and the side wall of the guide hole is subjected to cutting treatment, so that the guide hole is gradually enlarged to form the second through hole.

9. The method for manufacturing the connecting hole of the circuit board according to any one of claims 1 to 5, wherein the operating speed of the slot cutter is 20Krpm to 100Krpm, the feed speed is 1mm/S to 10mm/S, and the withdrawal speed is 100mm/S to 500 mm/S.

10. The method for manufacturing the connecting hole of the circuit board according to claim 9, wherein the helix angle of the slot cutter is 25 to 30 degrees, and the blade length of the slot cutter is 4.5 to 5 mm; the working speed of the groove cutter is 40-60 Krpm, the feed speed is 5-6 mm/S, and the withdrawal speed is 250-350 mm/S.

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a connecting hole of a circuit board.

Background

The connecting hole of the circuit board refers to a hole structure formed by combining two through holes which are partially overlapped in the opening area on the surface of the circuit board. Conventionally, when a connecting hole of a circuit board is processed, one of the through holes is drilled on the circuit board by a drill, and then another through hole overlapping with an opening area portion of the one through hole is drilled on the circuit board by a cutter. However, when the second through hole is drilled in the circuit board, since the material at the position corresponding to the first through hole on the circuit board is completely drilled, the left side and the right side of the cutter are unbalanced by the reverse acting force of the circuit board, so that the cutter is deviated towards the first through hole, the finally manufactured connecting hole has the defects of overproof size, deflection and the like, and the qualified rate of the preparation of the connecting hole of the circuit board is low.

Disclosure of Invention

Therefore, the defects of the prior art need to be overcome, and the method for manufacturing the connecting hole of the circuit board is provided, which can improve the qualification rate of the preparation of the connecting hole.

The technical scheme is as follows: a method for manufacturing a connecting hole of a circuit board comprises the following steps:

providing a base material to be processed with a connecting hole;

processing a first through hole on the base material at a position corresponding to the through hole on one side of the connecting hole;

processing a guide hole at a position, corresponding to the through hole at the other side of the continuous hole, on the substrate, wherein the guide hole is internally tangent to the through hole at the other side of the continuous hole, on the substrate;

and processing a second through hole corresponding to the through hole on the other side of the connecting hole on the basis of the position of the guide hole by adopting a slotting cutter.

According to the method for manufacturing the connecting hole of the circuit board, before the step of processing the second through hole at the position, corresponding to the through hole at the other side of the connecting hole, of the substrate by using the slot cutter, the guide hole is processed at the position, corresponding to the through hole at the other side of the connecting hole, of the substrate, so that when the second through hole is processed on the substrate by using the slot cutter, the stress on the left side and the right side of the slot cutter is relatively balanced, the situation that the slot cutter deviates towards the first through hole can be avoided, the bad defects that the size of the finally manufactured connecting hole exceeds the standard, the connecting hole is inclined and the like are avoided, and the qualified rate of preparing the connecting hole can be greatly improved.

In one embodiment, the step of forming the first through hole on the substrate at a position corresponding to the through hole on one side of the via hole includes:

firstly, determining a first processing position of the first through hole;

selecting a corresponding drill according to the diameter of the first through hole;

and drilling the first through hole at a first processing position on the base material by using a drill.

In one embodiment, the step of forming the first through hole on the substrate at a position corresponding to the through hole on one side of the via hole includes:

firstly, determining a first processing position of the first through hole;

and machining the first through hole at the first machining position on the base material in a reaming mode, or machining the first through hole at the first machining position on the base material in a milling mode by using a milling cutter.

In one embodiment, the step of processing a guide hole on the substrate at a position corresponding to the through hole on the other side of the via hole includes:

firstly, determining a second machining position of the guide hole;

selecting a corresponding drill according to the diameter of the guide hole;

and drilling the guide hole at a second processing position on the base material by using a drill.

In one embodiment, the step of processing a guide hole on the substrate at a position corresponding to the through hole on the other side of the via hole includes:

firstly, determining a second machining position of the guide hole;

and machining the guide hole at the second machining position on the base material by reaming, or machining the guide hole at the second machining position on the base material by milling by a milling cutter.

In one embodiment, the center of the second processing position is located on the long axis of the connecting hole, and the distance between the center of the second processing position and the edge of the connecting hole in the length direction is equal to the radius of the guide hole.

In one embodiment, the diameter of the guide hole is D, the length of the long axis of the connecting hole is L, the diameter of the first through hole is R1, the diameter of the second through hole is R2, and the diameter D of the guide hole, the length L of the long axis of the connecting hole, the diameter R1 of the first through hole and the diameter R2 of the second through hole satisfy the following relationship: L-R1 is not less than D and is less than R2.

As an alternative, the diameter D of the guide hole, the length L of the long axis of the connecting hole, the diameter R1 of the first through hole, and the diameter R2 of the second through hole satisfy the relationship: d is less than L-R1 and D is less than R2. A second through hole corresponding to the through hole on the other side of the connecting hole can be machined on the basis of the position of the guide hole by adopting the slotting cutter, and the qualified rate of the connecting hole preparation is slightly reduced compared with that of the connecting hole prepared by L-R1 which is more than or equal to D which is less than R2.

Specifically, the diameter R1 of the first through hole is the same as the diameter R2 of the second through hole.

In one embodiment, the specific method for processing the second through hole corresponding to the through hole on the other side of the connecting hole on the basis of the position of the guide hole by using the slotting tool includes: and a slotting cutter is arranged in the guide hole, and the side wall of the guide hole is subjected to cutting treatment, so that the guide hole is gradually enlarged to form the second through hole.

In one embodiment, the working rotating speed of the groove cutter is 20-100 Krpm, the feed speed is 1-10 mm/S, and the withdrawal speed is 100-500 mm/S.

In one embodiment, the spiral angle of the groove cutter is 25-30 degrees, and the edge length of the groove cutter is 4.5-5 mm; the working speed of the groove cutter is 40-60 Krpm, the feed speed is 5-6 mm/S, and the withdrawal speed is 250-350 mm/S.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a via hole of a circuit board according to an embodiment of the invention;

fig. 2 is a flowchart illustrating a step S120 of a method for manufacturing a via hole of a circuit board according to an embodiment of the present invention;

fig. 3 is a flowchart illustrating a step S130 of a method for manufacturing a via hole of a circuit board according to an embodiment of the invention;

fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the present invention after a first through hole is processed by the method for manufacturing a connection hole;

fig. 5 is a schematic structural diagram of a first through hole and a guide hole processed by the method for manufacturing a connection hole of a circuit board according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a first through hole and a guide hole formed by the method for forming a connection hole of a circuit board according to another embodiment of the present invention;

fig. 7 is a schematic structural view of a first through hole and a guide hole formed by the method for forming a connection hole of a circuit board according to yet another embodiment of the present invention;

fig. 8 is a schematic structural diagram of a connecting hole manufactured by the method for manufacturing a connecting hole of a circuit board according to an embodiment of the present invention.

Reference numerals:

10. connecting holes; 11. a first through hole; 12. a second through hole; 13. and (4) guiding the hole.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1, 4 to 8, a method for manufacturing a via hole 10 of a circuit board includes the following steps:

step S110, providing a base material of the connecting hole 10 to be processed;

step S120, processing a first through hole 11 on the substrate at a position corresponding to the through hole on one side of the connecting hole 10 (the processed first through hole 11 is shown in fig. 4);

step S130, processing a guide hole 13 at a position on the substrate corresponding to the through hole on the other side of the continuous hole 10, wherein the guide hole 13 is inscribed in the through hole on the other side of the continuous hole 10 on the substrate (the processed guide hole 13 and the guide hole 13 are respectively in the positional relationship with the first through hole 11 and the second through hole 12 as shown in any one of fig. 5 to 7);

step S140 is to machine a second through hole 12 corresponding to the through hole on the other side of the connecting hole 10 on the basis of the position of the guide hole 13 by using a slotting cutter (the machined first through hole 11 and second through hole 12 are shown in fig. 8).

According to the method for manufacturing the connecting hole 10 of the circuit board, before the step of processing the second through hole 12 on the substrate corresponding to the through hole on the other side of the connecting hole 10 by using the slot cutter, the guide hole 13 is processed on the substrate corresponding to the through hole on the other side of the connecting hole 10, so that when the second through hole 12 is processed on the substrate by using the slot cutter, the stress on the left side and the right side of the slot cutter is relatively balanced, the deviation of the slot cutter towards the first through hole 11 can be avoided, the undesirable defects that the finally manufactured connecting hole 10 exceeds the standard in size, is inclined and the like are avoided, and the qualified rate of the preparation of the connecting hole 10 can be greatly improved.

Further, the step S120 of processing the first through hole 11 on the substrate at a position corresponding to the through hole on one side of the connecting hole 10 includes:

step S121, first determining a first processing position of the first through hole 11;

step S122, selecting a corresponding drill according to the diameter of the first through hole 11;

in this embodiment, the diameter of the drill is equal to the diameter of the first through hole 11, so that the first through hole 11 can be directly drilled. Alternatively, the order of step S122 and step S121 may be replaced, and is not limited herein.

Step S123, drilling the first through hole 11 at the first processing position on the substrate by using a drill.

Therefore, the error of the first through hole 11 directly processed on the base material by the drill according to the diameter of the first through hole 11 is small, the manufacturing precision of the first through hole 11 is high, and the qualified rate of the preparation of the connecting hole 10 is high.

In another embodiment, different from the steps S122 and S123, the step of processing the first through hole 11 on the substrate at a position corresponding to the through hole on one side of the via hole 10 includes:

firstly, determining a first processing position of the first through hole 11;

the first through hole 11 is machined at a first machining position on the base material in a hole expanding mode.

The hole enlarging method is as follows: a plurality of small holes which are internally tangent to the first through hole 11 are drilled in sequence along the circumferential direction of the first through hole 11, the diameter of each small hole is smaller than that of the first through hole 11, and the small holes can be reamed to form the first through hole 11.

As an alternative, after the step of determining the first machining position of the first through hole 11, the first through hole 11 may be machined at the first machining position on the base material by milling with a milling cutter. Specifically, the base material is cut along the circumference of the first through hole 11 using a milling cutter, thereby forming the first through hole 11 at a first machining position on the base material.

Further, the step S130 of processing the guide hole 13 on the substrate at a portion corresponding to the through hole on the other side of the via hole 10 includes:

step S131, first determining a second machining position of the guide hole 13;

step S132, selecting a corresponding drill according to the diameter of the guide hole 13;

in this embodiment, the diameter of the drill is the same as the diameter of the guide hole 13, so that the guide hole 13 can be drilled. Optionally, the sequence of step S132 and step S131 may be replaced, and will not be described herein.

And step S133, drilling the guide hole 13 at the second processing position on the base material by using a drill.

In this way, the error of the guide hole 13 directly processed on the substrate by the drill according to the diameter of the guide hole 13 is small, the manufacturing precision of the guide hole 13 is high, the manufactured guide hole 13 is internally tangent to the second through hole 12, the position is accurate, and the preparation yield of the continuous hole 10 is high.

In another embodiment, unlike the steps S132 and S133, the step of processing the guide hole 13 on the substrate at the position corresponding to the through hole on the other side of the through hole 10 includes:

firstly, determining a second machining position of the guide hole 13;

the guide hole 13 is machined at a second machining position on the substrate by reaming.

The hole enlarging method is as follows: and sequentially drilling a plurality of small holes inscribed with the guide hole 13 along the circumferential direction of the guide hole 13, wherein the diameters of the small holes are smaller than that of the guide hole 13, and reaming to form the guide hole 13 can be realized after the small holes are drilled.

As an alternative, the step of determining the second machining position of the guide hole 13 further includes a step of machining the guide hole 13 at the second machining position on the base material by milling with a milling cutter. Specifically, the base material is cut along the circumference of the guide hole 13 using a milling cutter, thereby forming the guide hole 13 at the second machining position on the base material.

Further, referring to fig. 5 to 7 again, the center n (corresponding to the center of the guide hole 13) of the second processing position is located on the long axis ab of the connecting hole 10, and the distance between the center of the second processing position and the edge of the connecting hole 10 in the length direction is equal to the radius of the guide hole 13. Further, the center m of the first machining position (corresponding to the center of the first through hole 11) is located on the long axis ab of the connecting hole 10.

Further, referring to fig. 5 to 7 again, the diameter of the guide hole 13 is D (corresponding to the length between nb), the length of the long axis of the connecting hole 10 is L (corresponding to the length between ab), the diameter of the first through hole 11 is R1 (corresponding to the length between two times am), the diameter of the second through hole 12 is R2 (corresponding to the length between mb minus the length between ma), the diameter D of the guide hole 13, the length L of the long axis of the connecting hole 10, the diameter R1 of the first through hole 11 and the diameter R2 of the second through hole 12 satisfy the following relations: L-R1 is not less than D and is less than R2. Therefore, when the groove cutter is used for processing the second through hole 12 on the base material, the stress balance degree of the left side and the right side of the groove cutter is good, the deviation of the groove cutter towards the first through hole 11 can be avoided, the bad defects that the size of the finally manufactured connecting hole 10 exceeds the standard, the connecting hole is inclined and the like are avoided, and the qualified rate of the preparation of the connecting hole 10 can be greatly improved.

When the L-R1 is equal to the D, that is, the guide hole 13 is both internally tangent to the second through hole 12 and externally tangent to the first through hole 11, the position of the processed guide hole 13 is relatively accurate, so that the yield of the preparation of the connecting hole 10 can be ensured.

As an alternative, referring to fig. 7, the diameter D of the guide hole 13, the length L of the long axis of the connecting hole 10, the diameter R1 of the first through hole 11, and the diameter R2 of the second through hole 12 satisfy the relationship: d is less than L-R1 and D is less than R2. The second through hole 12 corresponding to the through hole on the other side of the connecting hole 10 can be processed on the basis of the guide hole 13 by adopting the slotting cutter, and only compared with the condition that D is more than or equal to L-R1 and less than R2, the qualification rate of the connecting hole 10 is slightly reduced, and compared with the qualification rate of the traditional connecting hole 10, the qualification rate is greatly improved.

Specifically, referring to fig. 5 to 7, the diameter R1 of the first through hole 11 is the same as the diameter R2 of the second through hole 12.

In one embodiment, the specific method for processing the second through hole 12 corresponding to the through hole on the other side of the connecting hole 10 on the basis of the position of the guide hole 13 by using the slotting tool includes: the slotting cutter is placed in the guide hole 13, and the side wall of the guide hole 13 is subjected to cutting treatment, so that the guide hole 13 is gradually enlarged to form the second through hole 12. Therefore, in the process of placing the slotting cutter in the area limited by the guide hole 13 and cutting the side wall of the guide hole 13 by the slotting cutter to form the second through hole 12, the stress on the left side and the right side of the slotting cutter is relatively balanced, the slotting cutter can be prevented from deviating towards the first through hole 11, the finally manufactured connecting hole 10 is prevented from having the undesirable defects of overproof size, deflection and the like, and the qualified rate of the preparation of the connecting hole 10 is greatly improved.

Generally, when the operation rotation speed of the slot cutter is larger, the feed speed is larger, and the retracting speed is larger, although the second through hole 12 can be processed on the basis of the guide hole 13 quickly, the processed connecting hole 10 is prone to have defects such as over-standard size and skew.

Furthermore, the working speed of the groove cutter is 20-100 Krpm, the feed speed is 1-10 mm/S, and the withdrawal speed is 100-500 mm/S. Therefore, when the groove cutter works according to the process parameters, the defects that the finally manufactured connecting hole 10 has over-standard size, deflection and the like can be avoided, and the qualified rate of the preparation of the connecting hole 10 can be greatly improved. In addition, the preparation efficiency of the via 10 can be ensured.

Furthermore, the working speed of the groove cutter is 40-60 Krpm, the feed speed is 5-6 mm/S, and the withdrawal speed is 250-350 mm/S. Therefore, when the groove cutter works according to the process parameters, the defects that the finally manufactured connecting hole 10 has over-standard size, deflection and the like can be avoided, and the qualified rate of the preparation of the connecting hole 10 can be greatly improved. In addition, the preparation efficiency of the via 10 can be ensured.

In one embodiment, the spiral angle of the slotting cutter is 25-30 degrees, the spiral angle of the drill cutter is generally 40-45 degrees, and the spiral angle of the slotting cutter is smaller, so that the guide hole side wall can be further machined and cut to form the second through hole. In addition, the edge length of the groove cutter is 4.5 mm-5 mm, the edge length of the drill cutter is generally 0.7mm, and the edge length of the groove cutter is shorter than that of the drill cutter, so that the groove cutter has higher rigidity than the drill cutter, is not easy to deviate and break, and is generally used for drilling slotted holes (hanging in the air while being on a base material), thereby improving the qualification rate of hole connection preparation. In addition, the core thickness of the slot cutter is thicker, and is about 15 to 30 percent thicker than the core thickness of the drill cutter with the same diameter.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.