阅读说明：本技术 用于激光沉积的方法和设备 (Method and apparatus for laser deposition ) 是由 丹尼尔·E·西弗斯 彼得·J·博基尼 于 2019-08-06 设计创作，主要内容包括：本申请涉及用于激光沉积的方法和设备。一种激光沉积设备,包括：密封外壳,被配置为保持基板；粉末源,被配置为保持粉末材料；喷丸源,被配置为保持喷丸介质；以及沉积系统,流体地连接到粉末源和喷丸源。沉积系统包括被配置为生成激光束的激光器。沉积系统被配置为通过将粉末材料流注射到激光束中而在基板上沉积一个或多个层。沉积系统被配置为通过将喷丸介质推进到一个或多个层的外表面上而对该一个或多个层进行喷丸处理。(The present application relates to methods and apparatus for laser deposition. A laser deposition apparatus, comprising: a sealed housing configured to hold a substrate; a powder source configured to hold a powder material; a peening source configured to hold peening media; and a deposition system fluidly connected to the powder source and the peening source. The deposition system includes a laser configured to generate a laser beam. The deposition system is configured to deposit one or more layers on a substrate by injecting a stream of powdered material into a laser beam. The deposition system is configured to bead blast the one or more layers by propelling a peening medium onto an outer surface of the one or more layers.)

1. A laser deposition apparatus (100, 200) comprising:

a sealed housing (102) configured to hold a substrate (106);

a powder source (110, 210) configured to hold a powder material;

a peening source (112, 212) configured to hold peening media; and

a deposition system (108, 208) fluidly connected to the powder source (110, 210) and the peening source (112, 212), the deposition system (108, 208) including a laser (136, 236) configured to generate a laser beam (138), wherein the deposition system (108, 208) is configured to deposit one or more layers on the substrate (106) by injecting a flow (132) of powdered material into the laser beam (138), the deposition system (108, 208) further configured to peen the one or more layers by propelling the peening medium onto an outer surface of the one or more layers.

2. The laser deposition apparatus (100) according to claim 1, wherein the deposition system (108) further comprises a deposition head (114) fluidly connected to the powder source (110) and the peening source (112), the deposition head (114) being configured to inject the flow of powder material (132) into the laser beam (138), the deposition head (114) being configured to inject the peening medium onto the outer surface of the one or more layers.

3. The laser deposition apparatus (200) of claim 1, wherein the deposition system (208) further comprises first and second deposition heads (214a, 214b), the first deposition head (214a) being fluidly connected to the powder source (210) and configured to eject the stream of powdered material (132) into the laser beam, the second deposition head (214b) being fluidly connected to the peening source (212) and configured to eject the peening media onto the outer surface of the one or more layers.

4. The laser deposition apparatus (100) according to claim 1, wherein the deposition system (108) further comprises a deposition head (114) fluidly connected to the powder source (110) and the peening source (112), the deposition head comprising a first nozzle (126) and a second nozzle (126), the first nozzle (126) fluidly connected to the powder source (110) and configured to impinge the flow of powder material (132) into the laser beam, the second nozzle (126) fluidly connected to the peening source (112) and configured to impinge the peening medium onto the outer surface of the one or more layers.

5. The laser deposition apparatus (100, 200) according to any of claims 1 to 4, wherein the deposition system (108, 208) further comprises one or more valves (124), the one or more valves (124) being configured to selectively switch the deposition system (108, 208) between being fluidly connected to the powder source (110, 210) and being fluidly connected to the peening source (112, 212).

6. The laser deposition apparatus (100, 200) according to any of claims 1 to 4, wherein the deposition system (108, 208) further comprises a control gas subsystem (140), the control gas subsystem (140) being configured to at least partially surround the flow of powder material with an inert gas.

7. The laser deposition apparatus (100, 200) according to any of claims 1 to 4, further comprising a stage (104) held within the sealed enclosure (102), wherein the stage (104) is movable such that the stage (104) is configured to change an orientation of the substrate (106).

8. A method (300) for laser deposition, comprising:

a step (302) of depositing one or more material layers on a substrate by injecting a flow of powdered material from a powder source into a laser beam using a deposition system connected to the powder source and to a peening source; and

a step (306) of peening the one or more material layers by propelling peening media from the peening source onto an outer surface of the one or more material layers using the deposition system.

9. The method (300) of claim 8, wherein the deposition system comprises a deposition head, and wherein,

injecting the stream of powdered material into the laser beam comprises the steps (302a, 306a) of injecting the stream of powdered material from the deposition head into the laser beam; and

advancing the peening media onto the outer surface of the one or more material layers includes a step (306b) of ejecting the peening media from the deposition head onto the outer surface.

10. The method (300) according to claim 8, wherein injecting the stream of powdered material into the laser beam comprises a step (306a) of injecting the stream of powdered material from a deposition head into the laser beam, and wherein shot peening the one or more material layers comprises a step (306b) of injecting the peening media from a different deposition head onto the outer surface.

11. The method (300) of claim 8, wherein the step (306) of peening the one or more material layers includes the step (306c) of replacing a first deposition head of the deposition system used to inject the stream of powdered material into the laser beam with a second deposition head used to propel the peening media onto the outer surface of the one or more material layers.

12. The method (300) according to claim 8, wherein injecting the stream of powdered material into the laser beam comprises a step (302a) of injecting the stream of powdered material into the laser beam from a nozzle of a deposition head, and wherein shot peening the one or more material layers comprises a step (306d) of injecting the peening media from a different nozzle of the deposition head onto the outer surface of the one or more material layers.

Technical Field

The invention relates to a method and apparatus for laser deposition.

Background

Currently, additive manufacturing processes (additive manufacturing processes) are used to produce various three-dimensional (3D) objects. Additive manufacturing includes depositing one or more layers of materials, for example, to fabricate an object, to clad an existing object, or to repair an existing structure of an object. One example of an additive manufacturing process is Laser Deposition Technology (LDT), in which a powder material is sprayed into a laser beam, causing the powder to melt and deposit a layer. The LDT process may be repeated to successively deposit multiple layers on the substrate to build up the object, which is sometimes referred to as a laser free form fabrication technique (LFMT). Other examples of using the LDT process include: laser Cladding Technology (LCT), wherein an existing object is coated with one or more coating layers; and Laser Repair Techniques (LRT) which involve depositing one or more layers on an existing object to repair the structure of the object.

Additively manufactured objects can have lower fatigue strength than objects manufactured using other processes, e.g., due to grain size, microstructure, crystallographic texture, surface finish, etc. Accordingly, objects that are additively manufactured using processes such as laser deposition are sometimes treated with a shot peening process (or other process) to improve fatigue strength. However, after the additive manufacturing process is complete, current peening (and other processes) are performed at a secondary station, which may be inefficient, time consuming, and/or expensive. Furthermore, it may be difficult to reach the surface of an object with limited or no exposure after the additive manufacturing process is completed, especially for objects with complex shapes.

There is a need for a peening process that is more efficient, time-efficient, less costly, and/or more accurate for additive manufactured objects.

Disclosure of Invention

In view of these needs, certain embodiments of the present disclosure provide a laser deposition apparatus comprising: a sealed housing configured to hold a substrate; a powder source configured to hold a powder material; a peening source configured to hold peening media; and a deposition system fluidly connected to the powder source and the peening source. The deposition system includes a laser configured to generate a laser beam. The deposition system is configured to deposit one or more layers on a substrate by injecting a stream of powdered material into a laser beam. The deposition system is further configured to bead blast the one or more layers by propelling a peening medium onto an outer surface of the one or more layers.

In at least one embodiment, the deposition system further comprises a deposition head fluidly connected to the powder source and the peening source. The deposition head is configured to inject a stream of powdered material into a laser beam. The deposition head is configured to eject a peening medium onto the outer surface of the one or more layers.

In one or more embodiments, the deposition system further comprises a first deposition head and a second deposition head. The first deposition head is fluidly connected to a powder source and configured to inject a stream of powder material into a laser beam. The second deposition head is fluidly connected to the peening source and configured to impinge peening media on the outer surface of the one or more layers.

In one or more embodiments, the deposition system further comprises a deposition head fluidly connected to the powder source and the peening source. The deposition head includes a first nozzle and a second nozzle. The first nozzle is fluidly connected to the powder source and configured to inject a stream of powder material into the laser beam. A second nozzle is fluidly connected to the peening source and configured to impinge peening media on the outer surface of the one or more layers.

Certain embodiments of the present disclosure provide a method for laser deposition, comprising: one or more material layers are deposited on a substrate by injecting a stream of powdered material from a powder source into a laser beam using a deposition system connected to the powder source and to a peening source. The method further comprises the following steps: the one or more layers are peened by propelling peening media from a peening source onto an outer surface of the one or more layers using a deposition system.

Certain embodiments of the present disclosure also provide a deposition system comprising: a laser configured to generate a laser beam; and at least one deposition head configured to be fluidly connected to a powder source containing a powder material and a peening source containing peening media. At least one deposition head is configured to deposit one or more layers of material by injecting a stream of powdered material from a powdered source into a laser beam. The at least one deposition head is further configured to peen the one or more layers by propelling peening media from a peening source onto an outer surface of the one or more layers.

Drawings

These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:

FIG. 1 is a schematic diagram illustrating a laser deposition apparatus according to one embodiment of the present disclosure;

FIG. 2 is an enlarged schematic view of a deposition system of the laser deposition apparatus of FIG. 1, according to one embodiment of the present invention;

FIG. 3 is an enlarged schematic view of the deposition system shown in FIG. 2 illustrating a deposition operation according to one embodiment of the present disclosure;

FIG. 4 is an enlarged schematic view of the deposition system shown in FIG. 2 illustrating a peening operation according to one embodiment of the present disclosure;

FIG. 5 is an enlarged schematic view of the deposition system shown in FIG. 2 illustrating an intermediate peening process according to one embodiment of the present disclosure;

FIG. 6 is an enlarged schematic view illustrating a laser deposition apparatus according to another embodiment of the present disclosure; and

fig. 7 is a flow chart illustrating a method for laser deposition according to one embodiment of the present disclosure.

FIG. 8 is a block diagram of an aircraft manufacturing and service method.

Fig. 9 is a schematic perspective view of an aircraft.

Detailed Description

The foregoing summary, as well as the following detailed description of certain embodiments, will be better understood when read in conjunction with the appended drawings. As used herein, an element or step recited in the singular and proceeded with the word "a" or "an" should be understood as not necessarily excluding plural elements or steps. Further, references to "one embodiment" are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments "comprising" or "having" an element or a plurality of elements having a particular property may include additional elements not having that property.

Although various spatial and directional terms, such as "top," "bottom," "upper," "lower," "vertical," and the like, may be used to describe embodiments of the present disclosure, it is understood that such terms are used only with respect to the orientations shown in the figures. This orientation may be reversed, rotated, or otherwise altered such that if the structure is flipped 180 degrees, the top side becomes the bottom side, if the structure is pivoted 90 degrees, the top side becomes the left or right side, and so on.

Certain embodiments of the present disclosure include a laser deposition apparatus configured to deposit one or more layers on a substrate by injecting a stream of powdered material into a laser beam. The deposition system is further configured to bead blast the one or more layers by propelling a peening medium onto an outer surface of the one or more layers. The laser deposition process is more efficient, less time consuming, and/or less costly because one or more layers (or objects formed therefrom) do not have to be moved to another apparatus for the peening operation. In addition, a more accurate shot peening process for additive manufacturing the object may be obtained.

Fig. 1 is a block diagram illustrating a laser deposition apparatus 100 according to one embodiment of the present disclosure. The laser deposition apparatus 100 is configured to additively manufacture an object by depositing one or more layers of material on a substrate or an existing object. For example, the laser deposition apparatus 100 may be used to fabricate an object. In one example, the laser deposition apparatus 100 is a laser deposition apparatus that has been supplied with powder, but other laser deposition processes (e.g., a laser deposition apparatus that has been supplied with liquid, etc.) are used in other embodiments. This exemplary embodiment of a laser deposition apparatus will be described and illustrated herein with respect to fabricating an object, sometimes referred to as laser free form fabrication (LFM). However, the laser deposition apparatus 100 may also be used to coat an existing object with a coating material, to repair the structure of the existing object, and so on.

The laser deposition apparatus 100 includes a sealed housing 102 and a stage 104 held within the sealed housing 102. The sealed enclosure 102 is hermetically sealed and contains an inert gas, such as argon (Ar), helium (He), or the like. In some examples, the oxygen level within the sealed enclosure 102 is maintained below a minimum level (e.g., below five parts per million (ppm), etc.). Optionally, the sealed housing 102 includes a front cavity (not shown) for entry and exit of objects into and out of the sealed housing 102.

The platen 104 is configured to hold a substrate 106 to deposit one or more layers of material on the substrate 106 to build (i.e., fabricate) an object on the substrate 106. Additionally or alternatively, as described above, the table 104 is configured to hold an existing object (not shown) for cladding, repair, or the like. Optionally, the table 104 is movable such that the table 104 is configured to change the orientation of the substrate 106 (or an existing object held on the table 104), for example, to facilitate peening of the object.

As will be described in greater detail below, the laser deposition apparatus 100 of the present disclosure includes a deposition system 108 configured to deposit one or more layers of material on a substrate 106 to fabricate (or in other examples clad, repair, etc.) an object. The deposition system 108 is also configured to bead blast the outer surface of the deposition layer(s) to apply a surface treatment to the object comprised of the deposition layer(s). As used herein, a "substrate" (e.g., substrate 106) is a surface or material on which one or more layers are deposited, for example, to fabricate an object, and may also be used to refer to an existing object on which one or more layers are deposited for cladding, repair, etc.

The laser deposition apparatus 100 includes a deposition source, which in the illustrated embodiment is a powder source 110, that holds a powder deposition material (i.e., the material that makes up the resulting object) that is deposited on the substrate 106 to build the object. It should be noted that while in one example the material held by the powder source 110 is a powder material, other materials may be used. For example, other deposition sources may be used to hold the material (e.g., liquid, etc.) in any other form that enables deposition of one or more material layers. Examples of materials that may be used to fabricate the object (or in other examples to clad, repair, etc. the object) include, but are not limited to, metal, composite metal, another composite material, plastic, epoxy, etc. Although only one deposition source is shown, the laser deposition apparatus 100 may include any number of deposition sources.

The laser deposition apparatus 100 includes a peening source 112 that holds peening media that is propelled onto the outer surface of the object to apply a surface treatment to the object. Examples of peening media for surface treating an object include, but are not limited to, metal, composite metal, another composite material, cast steel, plastic, sand, glass, and the like. The peening media held by the peening source 112 is of any size that enables the deposition system 108 to surface treat the object, such as, but not limited to, media sizes in accordance with 930 of AMS2430 Table 1, 930ASH in accordance with AMS2431/2, and the like. In one example, the nominal size of the peening media used on the radiused corner surface is no greater than 1/2 for the smallest radius of the radius that occurs in the area being peened. In another example, CW-32 or 280 or smaller size castings are used for shot peening, flash forging, and/or casting a parting line extension radius of 0.04 inches or greater. In one example in which the peening media passes through the grooves and/or through the openings of the object, the nominal diameter of the peening media is no greater than 25% of the width of the grooves and/or openings. Although only one peening source is shown, the laser deposition apparatus 100 can include any number of peening sources 112.

In one example of the laser deposition apparatus 100, the deposition system 108 includes a single deposition head 114 fluidly connected to the powder source 110 and the peening source 112 via conduits 116 and 118, respectively. The fluid connection of deposition head 114 to sources 110 and 112 enables deposition head 114 to build objects from powdered material and to bead blast the objects with a peening medium, respectively. Deposition head 114 is described in more detail below with reference to FIG. 2.

The deposition system 108 includes one or more compressed gas sources 120 (a single compressed gas source 120 is shown). A compressed gas source 120 drives the deposition head 114 into operation. For example, the compressed gas source 120 is fluidly connected to the conduit 116 such that the compressed gas source 120 is configured to move the powdered material from the powder source 110 to the deposition head 114 to enable the deposition head 114 to eject the powdered material. Similarly, a source of compressed gas 120 is fluidly connected to the conduit 118 such that the source of compressed gas 120 is configured to move peening media from the peening source 112 to the deposition head 114 to enable the deposition head 114 to eject peening media.

Deposition system 108 includes one or more regulator assemblies 122 (one regulator assembly 122 is shown) configured to regulate the pressure of gas released into conduits 116 and 118 from compressed gas source 120, thereby regulating the intensity of the jet from deposition head 114. The regulator assembly 122 also includes one or more valves 124 that selectively switch the deposition system 108 between being fluidly connected to the powder source 110 and being fluidly connected to the peening source 112. For example, the valve 124 includes a position in which the deposition head 114 is fluidly connected to the powder source 110 and the corresponding conduit 116 is fluidly connected to the compressed gas source 120 such that the deposition head 114 is configured to eject the powder material from the powder source 110. The valve 124 includes another position in which the deposition head 114 is fluidly connected to the peening source 112 and the corresponding conduit 118 is fluidly connected to the source of compressed gas 120 such that the deposition head 114 is configured to eject peening media from the peening source 112.

Any compressible gas (such as, but not limited to, air, inert gas, etc.) may be maintained by the compressed gas source 120 and used to drive the deposition head 114 into operation. Although shown and described as having only a single source of compressed gas 120 to enable the deposition head 114 to eject the powdered material from the powder source 110 and the peening media from the peening source 112, the deposition system 108 may include any number of sources of compressed gas 120. In another example, the deposition system 108 includes two sources of compressed gas 120, namely a source of compressed gas dedicated to the powder source 110 to enable the deposition head 114 to eject the powdered material from the powder source 110 and a source of compressed gas dedicated to the peening source 112 to enable the deposition head 114 to eject the peening media from the peening source 112.

Referring now to fig. 2, deposition head 114 includes one or more nozzles 126. Each nozzle 126 includes a channel 128 having an outlet 130, the outlet 130 configured to thereby eject a stream of the powdered material (e.g., stream 132 of the powdered material shown in fig. 3) and/or a stream of the peening medium (e.g., stream 134 of the peening medium shown in fig. 4). The outlet 130 of each nozzle 126 has any shape that enables the nozzle 126 to generate a spray pattern that enables the laser deposition apparatus to function as described and/or illustrated herein. The channel 128 of each nozzle 126 is fluidly connected to one or both of the conduits 116 and 118 (shown in FIG. 1) for ejecting the powdered material from the powder source 110 (shown in FIG. 1) and/or the peening media from the peening source 112 (shown in FIG. 1). In the example of the deposition head 114 shown, the channel 128 of each nozzle 126 is fluidly connected to the conduits 116 and 118 such that each nozzle 126 is configured to selectively eject a stream of the powdered material from the powder source 110 and a stream of the peening media from the peening source 112. In other examples, one or more nozzles 126 are dedicated to ejecting powdered material from the powder source 110 and/or one or more nozzles 126 are dedicated to ejecting a stream of peening media from the peening source 112. For example, one or more nozzles 126 are fluidly connected only to the conduit 116 of the powder source 110 such that the nozzle(s) 126 are configured to only eject powder material, while one or more other nozzles 126 are fluidly connected only to the conduit 118 of the peening source 112 such that the nozzle(s) 126 are configured to only eject peening media. Although two nozzles are shown, deposition head 114 may include any number of nozzles 126. Each nozzle 126 in the various examples is referred to herein as a "first" and/or a "second" nozzle.

In the illustrated example of deposition system 108, deposition head 114 includes a laser 136 configured to generate a laser beam (e.g., laser beam 138 shown in fig. 3). In some examples, the laser beam generated by laser 136 is a focused laser beam. As will be described below with reference to fig. 3, the outlet 130 of any nozzle 126 configured to eject powder material from the powder source 110 is positioned relative to the laser beam such that the nozzle 126 ejects a stream of powder material into the laser beam, thereby melting the powder material and depositing a layer of material on the substrate 106. Laser 136 generates a laser beam having any power and/or intensity that enables deposition system 108 to function as described and/or illustrated herein.

Although shown as a component of deposition head 114, in other examples, laser 136 is a separate component of deposition system 108 that is positioned relative to deposition head 114 such that the laser beam generated by laser 136 is configured to receive a flow of powdered material from deposition head 114.

In some examples, deposition system 108 includes a control gas subsystem 140 as shown in fig. 1 and 2. The control gas subsystem 140 helps to protect the reaction between the powder material and the laser beam, for example, by controlling the reaction in the region where the powder flow and the laser beam intersect. Control gas subsystem 140 includes a source of compressed gas 142 (not shown in FIG. 2), a regulator assembly 144 (not shown in FIG. 2), and one or more nozzles 146. The nozzle 146 is positioned to emit a flow of control gas (e.g., control gas flow 148 shown in fig. 3) that at least partially surrounds the flow of powder material to help protect the reaction between the powder material and the laser beam. In some examples, the control gas stream(s) emitted by control gas subsystem 140 also help control the size, shape, direction, geometry, etc. of the flow of powder material to facilitate deposition of the material layer(s) on substrate 106 in a manner such that the resulting object has a predetermined size, shape, geometry, etc. Optionally, a control gas subsystem is used during peening processing of the object to facilitate control of the size, shape, direction, geometry, etc. of the peening media stream. The control gas flow generated by the control gas subsystem 140 is any inert gas, such as argon (Ar), helium (He), and the like.

In this exemplary embodiment of deposition system 108, nozzles 146 of control gas subsystem 140 are shown as components of deposition head 114. However, in other examples, one or more nozzles 146 are separate components of deposition system 108 positioned relative to deposition head 114 such that control gas subsystem 140 can function as described and/or illustrated herein.

In operation, referring now to FIG. 3, a laser deposition process is shown in which a laser 136 emits a laser beam 138 toward the substrate 106. The nozzles 126 of the deposition head 114 eject streams of powder material 132 from the powder source 110 (shown in FIG. 1) such that the streams of powder material 132 are injected into a laser beam 138. The laser beam 138 melts the powdered material so that a layer of material is deposited on the substrate 106. The deposition process is repeated layer by layer to build up the object 150 on the substrate 106. During the deposition process, a nozzle 146 of the control gas subsystem 140 injects a control gas stream 148 that at least partially surrounds the flow of powder material 132 to facilitate protecting the reaction between the powder material and the laser beam 138. Fig. 3 shows an intermediate stage of the deposition process in which the build of the object 150 is only partially complete.

Referring now to fig. 4, the structure of object 150 is shown as having been completely built by the deposition process shown in fig. 3. The object 150 shown here is intended only as an example. The object 150 may have any other size, shape, geometry, etc. than shown herein. Fig. 4 shows a peening operation performed on a finished object 150 by the laser deposition apparatus 100. The nozzles 126 of the deposition head 114 eject (e.g., propel) a stream 134 of peening media from a peening source 112 (shown in FIG. 1) onto the outer surface of the object 150, thereby surface treating the object 150. The peening media 134 is projected onto the outer surface of the object 150 at any intensity that enables the laser deposition apparatus 100 to surface treat the object 150.

Optionally, the stage 104 and/or the deposition head 114 are moved to change the orientation of the object 150 to increase coverage of the peening media. For example, changing the orientation of the object 150 enables the peening media to impinge on the outer surface of the object 150 (e.g., a crevice surface, a recessed surface, a surface below an opening, a surface below an overhang, etc.) that has limited exposure after the structure of the object 150 has been completed by the laser deposition process.

In some examples, referring now to fig. 5, the bead blasting process shown in fig. 4 is used prior to completion of the laser deposition process shown in fig. 3. For example, the outer surface of object 150 that will be unexposed or have limited exposure once the structure of object 150 has been fully created will be shot peened by laser deposition apparatus 100 before the structure of the object is completed by the laser deposition process. In other words, the laser deposition process is stopped after the structure of the object 150 is only partially completed. The outer surface that will be unexposed or have limited exposure once the laser deposition process is complete is shot peened by the laser deposition apparatus 100 before resuming the laser deposition process to complete the structure of the object 150. As such, the laser deposition apparatus 100 alternates the peening process and the laser deposition process as needed during build to surface treat the outer surface of the object 150 that is difficult or impossible to peen once the structure of the object 150 is complete. Fig. 5 illustrates an intermediate peening process in which, between the deposition of two adjacent layers using a laser deposition process, the nozzles 126 of the deposition head 114 impinge a stream 134 of peening media onto the outer surface of the partially completed structure of the object 150 shown in fig. 3.

As described above, the illustrated embodiment of the laser deposition apparatus 100 includes a single deposition head 114 that performs the laser deposition process and the shot peening process of the laser deposition apparatus 100, but the present disclosure contemplates examples of one or more deposition heads dedicated to performing the laser deposition process and one or more deposition heads dedicated to performing the shot peening process. That is, the laser deposition apparatus 100 may include any number of deposition heads 114. For example, fig. 6 shows another embodiment of a laser deposition apparatus 200 including a deposition system 208 having two deposition heads 214a and 214 b. Deposition head 214a includes a laser 236 and one or more nozzles 226a fluidly connected to powder source 210 such that deposition head 214a is configured to inject a flow of powdered material into a laser beam generated by laser 236 to perform a laser deposition process. In some examples, the laser beam generated by laser 236 is a focused laser beam. The deposition head 214b includes one or more nozzles 226b fluidly connected to the peening source 212 such that the deposition head 214b is configured to impinge a stream of peening media to perform peening.

Although shown as a component of deposition head 214a, in some examples, laser 236 is a separate component of laser deposition apparatus 200 that is positioned relative to deposition head 214a such that the laser beam generated by laser 236 is configured to receive the flow of powdered material from nozzle 226 a. In various examples, deposition head 214a is referred to herein as a "first" deposition head, while deposition head 214b is referred to herein as a "second" deposition head.

In some other examples, deposition heads 214a and 214b are configured to be interchangeably mounted to deposition system 208 to selectively switch between a laser deposition process and a bead blasting process, respectively.

FIG. 7 is a flow chart illustrating a method 300 for laser deposition, according to one embodiment. At 302, the method 300 deposits one or more material layers on a substrate by injecting a stream of powdered material from a powder source into a laser beam using a deposition system connected to both the powder source and a peening source. Optionally, injecting the stream of powdered material into the laser beam at 302 includes injecting the stream of powdered material from the deposition head into the laser beam at 302 a.

At 304, the method 300 switches a deposition head of the deposition system between being fluidly connected to a powder source and being fluidly connected to a shot blasting source.

At 306, the method 300 peens the one or more layers by propelling peening media from a peening source onto an outer surface of the one or more layers using a deposition system. Optionally, advancing the peening media onto the outer surface of the one or more layers at 304 includes ejecting the peening media from the deposition head onto the outer surface at 306 a. In some examples, peening the one or more layers at 304 includes, at 306b, blasting peening media onto the outer surface from a different deposition head than used to blast the stream of powdered material into the laser at 302 a. Optionally, peening the one or more layers at 306 includes, at 306c, replacing a first deposition head of the deposition system for injecting the stream of powdered material into the laser beam at 302 with a second deposition head for advancing peening media onto the outer surface of the at least one layer at 306. In one example, peening the one or more layers at 304 includes, at 306d, blasting shot media onto the outer surface from different nozzles of the same deposition head used to blast the stream of powdered material into the laser beam at 302 a. Optionally, peening the one or more layers at 306 includes, at 306e, changing the orientation of the substrate.

At 308, the method 300 includes, after bead blasting at least a portion of an outer surface of the one or more layers using the deposition system at 306, depositing at least one additional layer using the deposition system.

Although the exemplary embodiments disclosed herein relate to an already-supplied powder laser deposition apparatus capable of performing a peening operation, the present disclosure is not limited to an already-supplied powder laser deposition apparatus. Rather, other additive manufacturing apparatuses, such as powder layer melting apparatuses (e.g., powder layer apparatuses, wire feeding apparatuses, etc.), metal spraying apparatuses, directional energy deposition apparatuses, etc., may be enabled to perform shot blasting operations.

Embodiments of the present disclosure may be described in the context of aircraft manufacturing and service method 400 shown in fig. 8 and aircraft 500 shown in fig. 9. During pre-production, the exemplary method 400 may include specification and design 402 of the aircraft 500 and material procurement 404. During production, component and subassembly manufacturing 406 and system integration 408 of the aircraft 500 occurs. Thereafter, the aircraft 500 may be certified and delivered 410 by a manager for use 412. When used by a customer, the aircraft 500 is scheduled for routine maintenance and service 414 (which may also include modification, reconfiguration, refurbishment, and so on).

The various processes of the illustrated method 400 may be performed or carried out by a system integrator, a third party, and/or an operator (e.g., a customer). For purposes of this description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and major-system subcontractors; the third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and the operator may be an airline, leasing company, military entity, service organization, and so forth.

As shown in fig. 9, the aircraft 500 produced by the illustrative method 400 may include an airframe 502 with a plurality of advanced systems 504 and an interior 506. Examples of high-level systems 504 include one or more of a propulsion system 508, an electrical system 510, a hydraulic system 512, and an environmental system 514. Any number of other systems may be included. Although an aerospace example is shown, the principles may be applied to other industries, such as the automotive industry.

The apparatus and methods shown or described in this disclosure may be employed at any one or more of the stages of the manufacturing and service method 400. For example, components or subassemblies corresponding to components and subassembly manufacturing 406 may be fabricated or manufactured in a manner similar to components or subassemblies already produced when aircraft 500 is put into service. Moreover, one or more aspects of the apparatus, methods, or combinations thereof may be used during manufacturing states 406 and 408, for example, by substantially expediting assembly of aircraft 500 or reducing the cost of aircraft 500. Also, for example and without limitation, one or more aspects of an apparatus or method, or a combination thereof, may be implemented when aircraft 500 is placed into service, for example, maintenance and repair 414.

Accordingly, various embodiments include a laser deposition apparatus and method that selectively accesses a powder source configured to hold a powder material and a peening source configured to hold a peening medium with a deposition system fluidly connected to the powder source and the peening source. The laser deposition apparatus and method allow for selective deposition of multiple layers to form and shot blast the object without having to move the object between different apparatuses to perform layer deposition and shot blast.

As used herein, a structure, limitation, or element that is "configured to" perform a task or operation is particularly structurally formed, constructed, or adapted in a manner that corresponds to the task or operation. For the sake of clarity and for the avoidance of doubt, an object that can only be modified to perform this task or operation is not "configured to" perform the task or operation as used herein.

As will be apparent to those skilled in the art, any of the ranges or values set forth herein can be altered or extended without losing the practical effect.

Although the subject matter has been described in language specific to structural features and methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

It is to be understood that the benefits and advantages described above may relate to one embodiment, or may relate to multiple embodiments. Embodiments are not limited to those embodiments that solve any or all of the stated problems or those embodiments that have any or all of the stated benefits and advantages. It will be further understood that reference to "an" item refers to one or more of those items.

The embodiments shown and described herein, as well as embodiments not specifically described herein but falling within the scope of the aspects of the claims, constitute exemplary apparatus for laser deposition and peening.

The term "comprising" is used in this specification to specify the inclusion of feature(s) or action(s) thereinafter, but does not preclude the presence or addition of one or more additional features or actions.

The order of execution or performance of the operations in the examples of the disclosure illustrated and described herein is not essential, unless otherwise specified. That is, the operations may be performed in any order, unless otherwise specified, and examples of the disclosure may include more or less operations than those disclosed herein. For example, it is contemplated that implementing or performing a particular operation (e.g., a different step) before, contemporaneously with, or after an operation is within the scope of aspects of the disclosure.

When introducing elements of aspects of the present disclosure or examples thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements. The term "exemplary" is intended to mean "… an instance". The phrase "one or more of: A. b and C "mean" at least one of a and/or at least one of B and/or at least one of C ".

Having described aspects of the present disclosure in detail, it will be apparent that modifications and variations are possible without departing from the scope of aspects of the present disclosure as defined in the appended claims. As various changes could be made in the above constructions, products, and methods without departing from the scope of aspects of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.

It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the various embodiments of the disclosure without departing from the scope thereof. While the dimensions and types of materials described herein are intended to define the parameters of the various embodiments of the disclosure, these embodiments are by no means limiting and are representative embodiments. Many other embodiments will be apparent to those of ordinary skill in the art upon review of the above description. The scope of various embodiments of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms "including" and "in which" are used as the plain-english equivalents of the respective terms "comprising" and "in which". Moreover, the terms "first," "second," and "third," etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in a device-plus-function manner, and are not intended to be interpreted based on section 112(f) of the U.S. code 35, unless and until such claim limitations explicitly use the phrase "device for …" followed by a functional statement that lacks further structure.

This written description uses examples to disclose various embodiments of the disclosure, including the best mode, and also to enable any person skilled in the art to practice various embodiments of the disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of various embodiments of the disclosure is defined by the claims, and may include other examples that occur to those of ordinary skill in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.

The following clauses describe further aspects:

clause group a:

A1. a laser deposition apparatus, comprising:

a sealed housing configured to hold a substrate;

a powder source configured to hold a powder material;

a peening source configured to hold peening media; and

a deposition system fluidly coupled to the powder source and the peening source, the deposition system including a laser configured to generate a laser beam, wherein the deposition system is configured to deposit one or more layers on the substrate by injecting a stream of powdered material into the laser beam, the deposition system further configured to peen the one or more layers by propelling a peening medium onto an outer surface of the one or more layers.

A2. The laser deposition apparatus of clause a1, wherein the deposition system further comprises a deposition head fluidly connected to the powder source and the peening source, the deposition head configured to impinge a stream of powdered material into the laser beam, the deposition head configured to impinge peening media onto the outer surface of the one or more layers.

A3. The laser deposition apparatus of clause a1, wherein the deposition system further comprises a first deposition head fluidly connected to the powder source and configured to eject the stream of powdered material into the laser beam, and a second deposition head fluidly connected to the peening source and configured to eject the peening media onto the outer surface of the one or more layers.

A4. The laser deposition apparatus of clause a1, wherein the deposition system further comprises a deposition head fluidly connected to the powder source and the peening source, the deposition head comprising a first nozzle fluidly connected to the powder source and configured to impinge a flow of powdered material onto the laser beam and a second nozzle fluidly connected to the peening source and configured to impinge peening media onto the outer surface of the one or more layers.

A5. The laser deposition apparatus of clause a1, wherein the deposition system further comprises one or more valves configured to selectively switch the deposition system between being fluidly connected to the powder source and being fluidly connected to the peening source.

A6. The laser deposition apparatus of clause a1, wherein the deposition system further includes a control gas subsystem configured to at least partially surround the flow of powdered material with an inert gas.

A7. The laser deposition apparatus of clause a1, further comprising a stage held within the sealed enclosure, wherein the stage is movable such that the stage is configured to change the orientation of the substrate.

Clause group B:

B1. a method for laser deposition, comprising:

depositing one or more material layers on a substrate by injecting a stream of powdered material from a powder source into a laser beam using a deposition system connected to the powder source and to a peening source; and

the one or more layers are peened by propelling peening media from a peening source onto an outer surface of the one or more layers using a deposition system.

B2. The method of clause B1, wherein the deposition system includes a deposition head, and wherein:

injecting the stream of powdered material into the laser beam includes injecting the stream of powdered material from the deposition head into the laser beam; and

propelling the peening media onto the outer surface of the one or more layers includes ejecting the peening media from the deposition head onto the outer surface.

B3. The method of clause B1, wherein injecting the stream of powdered material into the laser beam includes ejecting the stream of powdered material from a deposition head into the laser beam, and wherein peening the one or more layers includes ejecting peening media from a different deposition head onto the outer surface.

B4. The method of clause B1 further includes depositing at least one additional layer using the deposition system after bead blasting the outer surface of the one or more layers using the deposition system.

B5. The method according to clause B1, wherein peening the one or more layers includes replacing a first deposition head of a deposition system for injecting a stream of powdered material into the laser beam with a second deposition head for propelling a peening medium onto an outer surface of the at least one layer.

B6. The method of clause B1, wherein injecting a stream of powdered material into the laser beam includes ejecting the stream of powdered material from a nozzle of the deposition head into the laser beam, and wherein peening the one or more layers includes ejecting peening media from a different nozzle of the deposition head onto the outer surface of the one or more layers.

B7. The method of clause B1, further comprising switching a deposition head of the deposition system between being fluidly connected to the powder source and being fluidly connected to the peening source.

B8. The method of clause B1, wherein peening the one or more layers includes changing an orientation of the substrate.

Clause group C:

C1. a deposition system, comprising:

a laser configured to generate a laser beam; and

at least one deposition head configured to be fluidly connected to a powder source containing a powder material and a peening source containing a peening medium, wherein the at least one deposition head is configured to deposit one or more layers of material by injecting a stream of the powder material from the powder source into a laser beam, the at least one deposition head configured to peen the one or more layers by propelling the peening medium from the peening source onto an outer surface of the one or more layers.

C2. The deposition system according to clause C1, wherein the deposition head includes a first nozzle fluidly connected to the powder source and configured to inject the stream of powdered material into the laser beam, and a second nozzle fluidly connected to the laser beam and configured to inject the peening medium onto the outer surface of the one or more layers.

C3. The deposition system according to clause C1, further comprising one or more valves configured to selectively switch the at least one deposition head between being fluidly connected to the powder source and being fluidly connected to the peening source.

C4. The deposition system according to clause C1 further includes a control gas subsystem configured to surround the flow of powdered material and the laser beam with an inert gas for controlling the injection of the flow of powdered material into the laser beam.

C5. The deposition system of clause C1, wherein at least one deposition head comprises a laser.