阅读说明：本技术 一种bga焊锡球表面处理剂、制备方法及表面处理方法 (BGA solder ball surface treating agent, preparation method and surface treating method ) 是由 陈东东 孙绍福 朱俊楠 黄金鑫 谭润秋 李树祥 张欣 滕媛 于 2019-11-21 设计创作，主要内容包括：一种BGA焊锡球表面处理剂、制备方法及表面处理方法,所述表面处理剂由1—3g的药粉、500ml的甲苯和15kg的正己烷混合组成,所述药粉由聚氯乙烯、聚乙烯和一种或多种塑料稳定剂组成,聚氯乙烯：聚乙烯：塑料稳定剂的质量比为0.5:8.5:1。本发明的BGA焊锡球表面处理剂的制备原料易得、制备方法简单、对BGA焊锡球保护效果好,而且不妨害BGA焊锡球的焊接性能。(A BGA solder ball surface treatment agent, a preparation method and a surface treatment method are provided, the surface treatment agent is formed by mixing 1-3 g of medicinal powder, 500ml of toluene and 15kg of n-hexane, the medicinal powder is formed by polyvinyl chloride, polyethylene and one or more plastic stabilizers, the weight ratio of polyvinyl chloride: polyethylene: the mass ratio of the plastic stabilizer is 0.5:8.5: 1. The BGA solder ball surface treating agent has the advantages of easily available preparation raw materials, simple preparation method, good protection effect on the BGA solder balls and no harm to the welding performance of the BGA solder balls.)

1. The BGA solder ball surface treating agent is characterized by being prepared by mixing 1-3 g of medicinal powder, 500ml of toluene and 15kg of n-hexane, wherein the medicinal powder is prepared from polyvinyl chloride, polyethylene and one or more plastic stabilizers, and the weight ratio of polyvinyl chloride: polyethylene: the mass ratio of the plastic stabilizer is 0.5:8.5: 1.

2. The BGA solder ball surface treatment agent of claim 1, wherein the plastic stabilizer is one or two of a metal soap stabilizer and an organic tin stabilizer.

3. The method for preparing the BGA solder ball surface treatment agent of claim 1 or 2, wherein the method comprises putting the powder into toluene, heating with an alcohol lamp, stopping heating after heating to 55-65 ℃, cooling to room temperature, pouring into n-hexane, and fully stirring to be uniform.

4. The method for surface-treating BGA solder balls with the BGA solder ball surface-treating agent according to claim 1 or 2, wherein the BGA solder ball surface-treating agent is heated and kept at a temperature of 50 to 60 ℃, the prepared BGA solder balls are immersed in the insulated BGA surface-treating agent, the BGA solder balls are subjected to rotary immersion in a ball washing machine in both forward and reverse directions, after the immersion, the BGA solder balls are washed with pure water, the residual water is removed by a negative pressure draining machine, and the BGA solder balls are baked in an oven, so that a uniform protective film is formed on the surfaces of the BGA solder balls.

Technical Field

The invention mainly relates to the technical field of a surface treatment agent and a surface treatment process of a solder BGA (ball grid array) solder ball for chip packaging.

Background

The BGA solder ball is a new solder product produced with the development of chip packaging technology, namely a solder alloy ball for chip packaging, and is mainly characterized in that an array solder ball is manufactured at the bottom of a packaging body substrate and is used as an I/O end of a circuit to be interconnected with a Printed Circuit Board (PCB). In the continuous upgrading development of the current intelligent devices, the requirements on the core component chips of the devices are that the performance is stronger and stronger, the functions are more and more, the size is smaller and smaller, and the weight is lighter and lighter, so that the development of electronic products is driven to the directions of multifunction, high performance, miniaturization and light weight. To achieve this goal, the feature size of IC chips is getting smaller and more complex, and as a result, the number of I/os of the circuit is getting larger and the density of I/O of the package is getting higher. In order to meet the development requirements, advanced high-density packaging technologies are developed, and BGA packaging technology is one of them.

The BGA solder ball is one of the main materials for packaging the chip, the quality of the BGA solder ball plays an important role in the performance of the electronic chip, and in order to realize good packaging process quality, the BGA solder ball which is a packaging material needs to have better sphericity, the surface of the BGA solder ball has no scratch and no oxide, and solder alloy is a metal material which is easy to oxidize, so that a thin protective film needs to be formed on the surface of the BGA solder ball to prevent the oxidation of the BGA solder ball, and the BGA solder ball surface treating agent is just used for realizing the purpose.

The prior BGA solder balls are mainly subjected to surface treatment by substances such as phytic acid and the like, have poor oxidation resistance, and are easy to yellow, blacken and the like under the shaking of the BGA solder balls in the transportation process.

Disclosure of Invention

The invention aims to provide a BGA solder ball surface treatment agent and a surface treatment method.

The purpose of the invention is realized by the following technical scheme:

a BGA solder ball surface treatment agent, the surface treatment agent is formed by mixing 1-3 g of medicinal powder, 500ml of toluene and 15kg of n-hexane, the medicinal powder is formed by polyvinyl chloride, polyethylene and one or more plastic stabilizers, the weight ratio of polyvinyl chloride: polyethylene: the mass ratio of the plastic stabilizer is 0.5:8.5: 1.

The plastic stabilizer provided by the invention is one or two of a metal soap stabilizer and an organic tin stabilizer.

The preparation method of the BGA solder ball surface treating agent comprises the steps of putting the medicinal powder into toluene, heating the medicinal powder by using an alcohol lamp, stopping heating after the medicinal powder is heated to 55-65 ℃, cooling the medicinal powder to room temperature, pouring the cooled medicinal powder into n-hexane, and fully stirring the mixture until the mixture is uniform.

The method for performing surface treatment on the BGA solder balls by adopting the BGA solder ball surface treating agent comprises the steps of heating the BGA solder ball surface treating agent, keeping the temperature at 50-60 ℃, soaking the prepared BGA solder balls in the heat-preservation BGA surface treating agent, performing rotary soaking in a ball washing machine in the forward and reverse directions, after soaking is completed, taking pure water to wash the BGA solder balls, removing residual moisture by using a negative pressure draining machine, and then sending the BGA solder balls into an oven for baking, namely forming a uniform protective film on the surfaces of the BGA solder balls.

The toluene used by the surface treatment agent mainly has the effect of dissolving medicinal powder, and because the solubility of the medicinal powder in the toluene is very low at room temperature, the heating temperature is 60-65 ℃, the medicinal powder is well dissolved, and the boiling point of the toluene is 110.6 ℃, so that the toluene is heated to 60-65 ℃ and does not cause boiling of the toluene.

The n-hexane used in the invention mainly has the main function of further diluting the medicinal powder, the boiling point of the n-hexane is 68 ℃, the heating temperature of the n-hexane is controlled below 60 ℃ in order to prevent the boiling of the n-hexane, and the medicinal powder for washing the balls dissolved in the toluene can be uniformly distributed in the medicinal powder.

The plastic stabilizer used in the invention has the function of preventing or relieving the stability of film formation on the surface of the BGA.

After the BGA solder ball prepared by the forming process is treated by the medicament, a thin protective film can be formed on the surface of the BGA solder ball after being dried, and under the protection of the protective film, the surface of the BGA solder ball does not yellow after being subjected to a 150 ℃ high-temperature baking experiment; or after 2000 times of ball shaking tests on a ball shaking machine, the surface of the BGA solder ball does not turn black, the formed protective film is thinner, and the technological performance of the BGA solder ball cannot be influenced when the BGA solder ball is applied.

The BGA solder ball surface treating agent has the advantages of easily available preparation raw materials, simple preparation method, good protection effect on the BGA solder balls and no harm to the welding performance of the BGA solder balls.

Detailed Description

The present invention will be further illustrated with reference to the following examples.