阅读说明：本技术 光学式感测装置和电子设备 (Optical sensing device and electronic apparatus ) 是由 林峰 董佳群 于 2019-11-22 设计创作，主要内容包括：本申请公开了一种光学式感测装置和电子设备。所述光学式感测装置包括第一图像传感裸片和镜头模块。所述第一图像传感裸片包括多个像素单元，所述像素单元用于接收光束，并转换接收到的光束为相应的电信号。所述镜头模块设置在所述第一图像传感裸片上，包括多个小透镜和遮光部。所述多个小透镜，置在所述第一图像传感裸片上，所述多个小透镜彼此间隔设置，每个所述小透镜正对多个所述像素单元，所述小透镜用于会聚光束至所述像素单元。所述遮光部设置在所述第一图像传感裸片上，所述遮光部位于所述多个小透镜之间的间隔区域且在高度上高出所述小透镜，所述遮光部用于遮挡光束。所述电子设备包括所述光学式感测装置。(The application discloses an optical sensing device and an electronic device. The optical sensing device comprises a first image sensing bare chip and a lens module. The first image sensing die includes a plurality of pixel cells for receiving light beams and converting the received light beams into corresponding electrical signals. The lens module is arranged on the first image sensing die and comprises a plurality of small lenses and a shading part. The plurality of small lenses are arranged on the first image sensing die and are spaced from each other, each small lens faces a plurality of pixel units, and the small lenses are used for converging light beams to the pixel units. The light shielding part is arranged on the first image sensing die, is positioned in a spacing region among the small lenses and is higher than the small lenses in height, and is used for shielding light beams. The electronic equipment comprises the optical sensing device.)

1. An optical sensing device, comprising:

a first image sensing die comprising a plurality of pixel cells for receiving light beams and converting the received light beams into corresponding electrical signals; and

a lens module disposed on the first image sensing die, including:

a plurality of small lenses disposed on the first image sensing die, the plurality of small lenses being spaced apart from each other, each of the small lenses facing a plurality of the pixel units, the small lenses being for converging light beams to the pixel units; and

and a light shielding part disposed on the first image sensing die, the light shielding part being located in a space region between the plurality of small lenses and higher in height than the small lenses, the light shielding part being configured to shield a light beam.

2. The optical sensing device as claimed in claim 1, wherein the optical sensing device further includes a filter layer formed between the first image sensor die and the lens module or formed on a side of the lens module opposite to the first image sensor die, the filter layer being configured to transmit the light beam of the target wavelength band and filter out the light beam of the second predetermined wavelength band, the first image sensor die converting the received light beam of the target wavelength band into corresponding electrical signals.

3. The optical sensing device of claim 2, wherein the second predetermined wavelength band is a wavelength band outside the target wavelength band.

4. The optical sensing device as claimed in claim 2, wherein the light shielding portion is configured to filter out light beams of a first predetermined wavelength band, wherein the first predetermined wavelength band is completely different from or completely the same as or partially the same as the second predetermined wavelength band.

5. The optical sensing device of claim 4, wherein the first predetermined wavelength band includes the second predetermined wavelength band when the first predetermined wavelength band is partially the same as the second predetermined wavelength band.

6. The optical sensing device of claim 5, wherein the first predetermined wavelength band comprises a visible light band and a near infrared light band, and the second predetermined wavelength band comprises a near infrared light band.

7. The optical sensing device as claimed in claim 2, wherein the filter layer is evaporated on a surface of the first image sensing die facing the lens module.

8. The optical sensing device of claim 2 or 7, wherein the plurality of lenslets are formed on the filter layer by an embossing process.

9. The optical sensing device of claim 2, wherein the filter layer is in direct contact with the first image sensing die, the lens module is in direct contact with the filter layer, and the filter layer is located between the first image sensing die and the lens module.

10. The optical sensing device of claim 1, wherein the first image sensing die serves as a carrier substrate for the plurality of lenslets during fabrication.