阅读说明：本技术 电子元件与电感器 (Electronic component and inductor ) 是由 李奇勋 谢协伸 陈森辉 于 2015-04-30 设计创作，主要内容包括：本发明提供一种电子元件与电感器,所述电子元件包括：一本体,一导电元件其具有一端部,其中端部的至少一部分露出本体的外部；一导电暨粘结层,涂布于本体并覆盖导电元件的端部的一第一部分,其中导电元件的端部的一第二部分未被导电暨粘结层覆盖；以及至少一金属层,涂布于导电暨粘结层并覆盖导电元件的端部的第二部分,其中至少一金属层电性连接于导电元件的端部的第二部分用于电性连接一外部电路。(The invention provides an electronic component and an inductor, wherein the electronic component comprises: a body, a conductive element having an end, wherein at least a portion of the end is exposed outside the body; a conductive and adhesive layer coated on the body and covering a first portion of the end of the conductive element, wherein a second portion of the end of the conductive element is not covered by the conductive and adhesive layer; and at least one metal layer coated on the conductive and adhesive layer and covering the second part of the end of the conductive element, wherein the at least one metal layer is electrically connected with the second part of the end of the conductive element and is used for electrically connecting an external circuit.)

1. An electronic component, comprising:

a body, wherein a recess is formed on a second surface opposite to the first surface;

a wire, a first end of the wire being placed on the bottom surface of the recess, wherein a first portion of the first end is embedded within the recess, wherein a second portion of the first terminal is exposed from the body; and

an electrode structure disposed on the body, wherein a first portion of the first end portion comprises a portion of an axial surface of the first end portion of the wire that is covered by the magnetic body but not by the electrode structure, wherein at least a portion of the electrode structure is disposed above a bottom surface of the recess and in contact with a second portion of the first end portion of the wire for electrical connection to an external circuit.

2. The electronic component of claim 1, wherein: further comprising a conductive and adhesive layer applied to a third portion of the second portion of the first end portion, a fourth portion of the second portion of the first end portion not covered by the conductive and adhesive layer.

3. The electronic component of claim 1, wherein: the metal layer is coated on the conductive and bonding layer and covers a fourth part of the first end of the conductive element, wherein the metal layer is electrically connected with the fourth part and the conductive and bonding layer for electrically connecting an external circuit.

4. The electronic component of claim 1, wherein: the electrode structure includes a first metal layer overlying a second portion of the first terminal.

5. The electronic component of claim 1, wherein: the electrode structure includes a second metal layer overlying the first metal layer.

6. An inductor, comprising:

a magnetic body, wherein a recess is formed on a second surface opposite to the first surface;

a coil formed of a wire and disposed within the magnetic body, wherein a first end portion of the wire is placed on the bottom surface of the recess, wherein a first portion of the first end portion is embedded within the recess, wherein a second portion of the first terminal portion is exposed from the magnetic body; and

an electrode structure disposed on the magnetic body, wherein a first portion of the first end portion includes a portion of an axial surface of the first end portion of the conductive wire, the axial surface being partially covered by the magnetic body but not covered by the electrode structure, wherein at least a portion of the electrode structure is disposed above a bottom surface of the recess and in contact with the second portion of the first end portion of the conductive wire for electrically connecting an external circuit.

7. The inductor of claim 6, wherein: further comprising a conductive and adhesive layer applied to a third portion of the second portion of the first end portion, a fourth portion of the second portion of the first end portion not covered by the conductive and adhesive layer.

8. The inductor of claim 6, wherein: the metal layer is coated on the conductive and bonding layer and covers a fourth part of the first end of the conductive element, wherein the metal layer is electrically connected with the fourth part and the conductive and bonding layer for electrically connecting an external circuit.

9. An inductor, comprising:

a magnetic core having a first portion and a post disposed on a first surface of the first portion, wherein a recess is formed on a second surface opposite the first surface;

a coil formed of a wire and wound around the post of the magnetic core, wherein a first end of the wire is placed on a bottom surface of the recess;

a molded body encapsulating the posts, the coil and the first end portions of the wires, wherein a first portion of the molded body is disposed in the recess to encapsulate a first portion of the first end portions, a second portion of the first end portions being exposed from the molded body; and

an electrode structure disposed on the molded body, wherein the first portion of the first end portion comprises a portion of an axial surface of the first end portion of the wire that is magnetically covered but not covered by the electrode structure, wherein at least a portion of the electrode structure is disposed above a bottom surface of the recess and in contact with the second portion of the first end portion of the wire for electrical connection to an external circuit.

10. The inductor of claim 9, wherein: further comprising a conductive and adhesive layer applied to a third portion of the second portion of the first end portion, a fourth portion of the second portion of the first end portion not covered by the conductive and adhesive layer.

11. The inductor of claim 9, wherein: the metal layer is coated on the conductive and bonding layer and covers a fourth part of the first end of the conductive element, wherein the metal layer is electrically connected with the fourth part and the conductive and bonding layer for electrically connecting an external circuit.

Technical Field

The present invention relates to an electrode structure of an electronic component, particularly an electronic component, an electronic component using the electrode structure, and a method for manufacturing the electronic component.

Background

As electronic components or electronic devices become smaller and smaller, the size and reliability of the electrode configuration becomes a technical bottleneck affecting the electrical performance and reliability of the electronic components. The electrode structure is used for electrically connecting the electronic component and an external Circuit such as a Printed Circuit Board (PCB), and the end portions (terminal) of the conductive elements of the electronic component are electrically connected to corresponding electrodes such as surface-mount pads (surface-mount pads) for being soldered to corresponding soldering points of the PCB. Lead frames (lead frames) are typically soldered to the ends of electronic components, however, the use of lead frames often results in the electronic components occupying a considerable amount of space in the circuit layout of the circuit board, and therefore, lead frames are not suitable for use as electrodes for electronic components or electronic devices requiring smaller dimensions.

Surface Mount Technology (SMT) is a viable approach to reduce the overall size of electronic components or devices, such as resistors, capacitors or inductors. However, as the overall size of electronic components becomes smaller and smaller, it is an important issue to make the surface mount pads have excellent reliability in both mechanical and electrical aspects.

The electrodes formed on a silver paste layer by conventional electroplating are susceptible to temperature and humidity changes, such as: reducing the electrical and mechanical strength in certain known applications and even affecting the yield of electronic components in the manufacturing process. On the other hand, electroless plating is prone to plating propagation problems, causing plating material to diffuse into certain unwanted areas and even create short circuits.

Accordingly, the present invention provides an electrode structure, an electronic device and an inductor using the electrode structure, so as to overcome the above-mentioned problems.

Disclosure of Invention

It is an object of the present invention to provide an electronic component and an inductor having improved electrical properties and mechanical strength.

In an embodiment of the present invention, an electronic component is disclosed, the electronic component including: a body, a conductive element having an end (Terminal Part), wherein at least a portion of said end is exposed to the exterior of the body; a Conductive and Adhesive layer (Conductive and Adhesive layer) coated on the body and a first portion of the end portion, wherein a second portion of the end portion is not covered by the Conductive and Adhesive layer; and at least one metal layer coated on the conductive and bonding layer and the second portion of the end portion, wherein the at least one metal layer is electrically connected to the second portion of the end portion for electrically connecting an external circuit.

In one embodiment of the present invention, the conductive and adhesive layer is coated on a first portion of the end portion of the conductive element.

In an embodiment of the invention, the electronic component further includes an additional metal layer coated on the main body for covering an end portion of the conductive element, wherein the conductive and bonding layer is coated on the additional metal layer.

In an embodiment of the invention, the at least one metal layer includes a first metal layer and a second metal layer, the first metal layer is coated on the conductive and adhesive layer and the second portion of the end portion of the conductive element, and the second metal layer is coated on the first metal layer for electrically connecting an external circuit.

In an embodiment of the invention, the conductive and adhesive layer is formed by mixing silver powder and epoxy resin (epoxy resin), the first metal layer may be nickel (Ni), and the second metal layer may be tin (Sn).

In an embodiment of the present invention, the conductive and adhesive layer is formed by mixing silver powder and epoxy resin (epoxy resin), the first metal layer may be copper (Cu), and the second metal layer may be tin (Sn).

In an embodiment of the invention, the first metal layer and the second metal layer are formed by electroplating.

In one embodiment of the present invention, the conductive and adhesive layer is applied to a first portion of the end portion of the conductive element and a third portion of the end portion of the conductive element, wherein the second portion is between the first portion and the third portion.

In an embodiment of the present invention, a third portion of the end portion of the conductive element is not covered by the conductive and adhesive layer, wherein the first portion of the end portion of the conductive element is interposed between the second portion and the third portion of the end portion of the conductive element.

In an embodiment of the invention, a recess is formed on a top surface of the body, wherein an end of the conductive element is disposed in the recess.

In an embodiment of the invention, the electronic component is an inductor.

In an embodiment of the invention, the electronic component is a choke.

In an embodiment of the invention, the electronic component is an inductor, and the conductive component is a coil (coil), wherein the body includes a magnetic body and a coil disposed in the magnetic body, and an end of the coil is disposed in a recess on a side surface of the body.

In an embodiment of the invention, the electronic component is an inductor, the conductive component is a coil (coil), the body is a magnetic body, the coil is disposed in the magnetic body, an end of the coil is disposed in a recess on a top surface of the body, the magnetic body includes a T-core having a magnetic pillar (pilar), the coil is wound around the magnetic pillar, and the end of the coil is disposed in the recess on the top surface of the body through a side surface of the T-core.

In an embodiment of the present invention, an inductor is disclosed, the inductor comprising: the coil is arranged on the magnetic body; wherein at least a portion of a first end of the coil is exposed outside of the magnetic body; a conductive and adhesive layer coated on the magnetic body and a first portion of the first end of the conductive element, wherein a second portion of the first end of the conductive element is not covered by the conductive and adhesive layer; and at least one metal layer coated on the conductive and adhesive layer and the second portion of the first end of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the first end of the conductive element for electrically connecting an external circuit.

In an embodiment of the invention, the magnetic body includes a T-shaped magnetic ring having a magnetic pillar, wherein the coil is wound around the magnetic pillar, and the first end of the coil is disposed in a first recess of the top surface of the magnetic body through a side surface of the T-shaped magnetic ring.

In an embodiment of the invention, the magnetic body includes a T-shaped magnetic ring having a magnetic pillar and a top plate connected to the magnetic pillar, wherein the top plate has a first through hole disposed at a first corner of the top plate, the coil is wound around the magnetic pillar, and a first end of the coil is disposed in a first recess portion of the top surface of the magnetic body through the first through hole.

In an embodiment of the invention, the top plate has a second through hole disposed at a second corner of the top plate, and the second end of the coil is disposed in a second recess portion of the top surface of the magnetic body through the second through hole.

In an embodiment of the invention, the conductive and adhesive layer is applied to the first portion of the first end of the conductive element and a third portion of the first end of the conductive element, wherein a second portion of the first end of the conductive element is between the first portion and the third portion of the first end of the conductive element.

In an embodiment of the present invention, a third portion of the first end of the conductive element is not covered by the conductive and adhesive layer, wherein the first portion of the first end of the conductive element is interposed between the second portion and the third portion of the first end of the conductive element.

Compared with the prior art, the invention has the beneficial effects that: the electrode structure of the present invention does not require the use of lead frames, thereby allowing the choke to be made smaller and thinner. The silver paste is a mixed material of a conductive material and a polymer, for example, a mixed material of silver powder and epoxy resin, wherein the mixed material contains metal powder and a binding material, so that the silver paste has conductivity and binding property, and can be coated on the surface of the magnetic body to fix the two end parts of the coil on the magnetic body. The conductive material is not limited to silver powder, but may be copper powder or other suitable conductive metal or alloy material.

Further, the end portion of the coil is disposed outside the coil winding area of the electronic component to increase the winding space. In another aspect of the present invention, the end of the coil can also be embedded in a recess on the top surface of the magnetic body. In addition, the corner of the T-shaped magnetic ring can be provided with a concave part for the end part to pass through and firmly fix the end part at the same time, and an electrode for connecting the end part of the coil to the outside in a welding mode in the magnetic body is not needed.

In order to make the aforementioned features, functions and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIGS. 1A to 1E are cross-sectional views illustrating electrode structures of an electronic device according to an embodiment of the invention;

FIGS. 2A-2B are cross-sectional views of electrode configurations of an inductor or choke in accordance with one embodiment of the present invention;

FIGS. 3A-3G are top views of several embodiments of electrode configurations for inductors or chokes in accordance with one embodiment of the present invention;

fig. 4 is a schematic diagram illustrating a manufacturing process of an inductor or a choke according to an embodiment of the invention.

Description of reference numerals: 10-a body; 20-a first metal layer; 30-a conductive and adhesive layer; 300-a magnetic body; 301-a first end portion; 302-a second end; 303-silver glue; 304. 305 — an exposed portion of the first end; 306. 307 — an exposed portion of the second end; 314-exposed portion of the first end; 315 — exposed portion of the second end; 324 — an exposed portion of the first end; 325 — an exposed portion of the second end; 334. 335 — an exposed portion of the first end; 336. 337-exposed portion of the second end; 344 — exposed portion of the first end; 345 — an exposed portion of the second end; 354 — exposed portion of first end; 355 — an exposed portion of the second end; 40-end; 40 a-a first portion; 40 b-a second portion; 40 c-a third fraction; 40 e-a first portion of the second end; 40 f-a second portion of the second end; 40 g-a third portion of the second end; 45-a third metal layer; 50-a coil; 60-a second metal layer; a 70-T shaped magnetic ring; 80-a second end; 90 a-first recess; 90 b-a second recess; 91-lateral.

Detailed Description

The detailed description of the invention is as follows. The embodiments disclosed below are provided to illustrate and describe the technical content of the present invention and the efficacy thereof, and are not intended to limit the scope of the present invention.

An embodiment of the following discloses an electronic component, including: a body; a conductive element, which is arranged in the body, wherein at least one Part of one end (Terminal Part) of the conductive element is exposed out of the body; a conductive and adhesive layer coated on the body and covering a first portion of the end of the conductive element, wherein a second portion of the end of the conductive element is not covered by the conductive and adhesive layer; and at least one metal layer coated on the conductive and adhesive layer and covering the second portion of the end of the conductive element, wherein the at least one metal layer is electrically connected with the second portion of the end of the conductive element and is used for electrically connecting an external circuit.

Referring to fig. 1A, a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention is shown. The electrode structure can be used to electrically connect an end of a conductive element of an electronic component to an external circuit such as a printed circuit board. In an embodiment of the present invention, the electronic component includes: a body 10 and a conductive element having an end 40, wherein at least a portion of the end 40 is exposed to the exterior of the body 10; a conductive and adhesive layer 30 coated on the body 10 and a first portion 40a and a third portion 40c of the end portion 40, wherein a second portion 40b of the end portion 40 is not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30, the first portion 40a and the third portion 40c of the end portion 40, wherein the first metal layer 20 is electrically connected to the second portion 40b of the end portion 40 for electrically connecting to an external circuit.

In one embodiment, the conductive and adhesive layer 30 is a mixture of a conductive material and a polymer (polymer), such as silver Powder (Ag Powder) and epoxy resin (epoxy resin), wherein the conductive material is not limited to silver Powder, and may be copper Powder or other suitable conductive metal or alloy material. The first metal layer 20 includes tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as electroplating (electroplating).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as a Physical Vapor Deposition (PVD) process.

Fig. 1B is a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention. The electrode structure can be used to electrically connect an end of a conductive element of an electronic component to an external circuit such as a printed circuit board. In an embodiment of the present invention, the electronic component includes: a body 10 and a conductive element having an end 40, wherein at least a portion of the end 40 is exposed to the exterior of the body 10; a conductive and adhesive layer 30 coated on the body 10 and a first portion 40a and a third portion 40c of the end portion 40, wherein a second portion 40b of the end portion 40 is not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30, the first portion 40a and the third portion 40c of the end portion 40; a second metal layer 60 coated on the conductive and adhesive layer 30, wherein the first metal layer 20 and the second metal layer 60 are electrically connected to the second portion 40b of the end portion 40 for electrically connecting an external circuit.

In one embodiment, the conductive and adhesive layer 30 is a mixture of conductive material and polymer, such as silver powder and epoxy resin, wherein the conductive material is not limited to silver powder, but copper powder (Cu powder) or other suitable conductive metal or alloy material. In one embodiment, the first metal layer 20 is nickel (Ni) and the second metal layer 60 is tin (Sn).

In one embodiment, the first metal layer may be copper (Cu) and the second metal layer may be tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as an electroplating process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Physical Vapor Deposition (PVD) process.

Fig. 1C is a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention. The electrode structure can be used to electrically connect an end of a conductive element of an electronic component to an external circuit such as a printed circuit board. In an embodiment of the present invention, the electronic component includes: a body 10 and a conductive element having an end 40, wherein at least a portion of the end 40 is exposed to the exterior of the body 10; a conductive and adhesive layer 30 coated on the body 10 and a second portion 40b of the end portion 40, wherein a first portion 40a and a third portion 40c of the end portion 40 are not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30 and the second portion 40b of the terminal portion 40, wherein the first metal layer 20 is electrically connected to the first portion 40a and the third portion 40c of the terminal portion 40 for electrically connecting to an external circuit.

In one embodiment, the conductive and adhesive layer 30 is a mixture of conductive material and polymer, such as silver powder and epoxy resin, wherein the conductive material is not limited to silver powder, but copper powder or other suitable conductive metal or alloy material. The first metal layer 20 includes tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as an electroplating process.

In one embodiment, the first metal layer 20 is covered on the conductive and adhesion layer 30 by a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 is deposited on the conductive and adhesion layer 30 by Physical Vapor Deposition (PVD).

Fig. 1D is a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention. The electrode structure can be used to electrically connect an end of a conductive element of an electronic component to an external circuit such as a printed circuit board. In an embodiment of the present invention, the electronic component includes: a body 10 and a conductive element having an end 40, wherein at least a portion of the end 40 is exposed to the exterior of the body 10; a conductive and adhesive layer 30 coated on the body 10 and a second portion 40b of the end portion 40, wherein a first portion 40a and a third portion 40c of the end portion 40 are not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30 and the second portion 40b of the end portion 40; a second metal layer 60 coated on the first metal layer 20, wherein the first metal layer 20 and the second metal layer 60 are electrically connected to the first portion 40a and the third portion 40c of the end portion 40 for electrically connecting an external circuit.

In one embodiment, the conductive and adhesive layer 30 is a mixture of conductive material and polymer, such as silver powder and epoxy resin, wherein the conductive material is not limited to silver powder, but copper powder (Cu powder) or other suitable conductive metal or alloy material. In one embodiment, the first metal layer 20 is nickel (Ni) and the second metal layer 60 is tin (Sn).

In one embodiment, the first metal layer 20 may be copper (Cu) and the second metal layer 60 may be tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as an electroplating process.

In one embodiment, the first metal layer 20 is covered on the conductive and adhesion layer 30 by a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 is deposited on the conductive and adhesion layer 30 by Physical Vapor Deposition (PVD).

Fig. 1E is a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention. The electrode structure can be used to electrically connect an end of a conductive element of an electronic component to an external circuit such as a printed circuit board. In an embodiment of the present invention, the electronic component includes: a body 10 and a conductive element having an end 40, wherein at least a portion of the end 40 is exposed to the exterior of the body 10; a third metal layer 45 covering the end portion 40; a conductive and adhesive layer 30 coated on the body 10 and the third metal layer 45, wherein a first portion 40a and a third portion 40c of the end portion 40 are both covered by the conductive and adhesive layer 30, and a second portion 40b of the end portion 40 is not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30 and the third metal layer 45; a second metal layer 60 coated on the first metal layer 20, wherein the first metal layer 20 and the second metal layer 60 are electrically connected to the second portion 40b of the end portion 40 for electrically connecting an external circuit. In one embodiment, the third metal layer 45 completely covers the end portion 40.

In one embodiment, the third metal layer 45 covering the end portion 40 is made of copper.

In one embodiment, the conductive and adhesive layer 30 is a mixture of a conductive material and a polymer, such as silver powder and epoxy resin, wherein the conductive material is not limited to silver powder, but copper powder or other suitable conductive metal or alloy material. In one embodiment, the first metal layer 20 is nickel (Ni) and the second metal layer 60 is tin (Sn).

In one embodiment, the first metal layer 20 is copper (Cu) and the second metal layer 60 is tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as an electroplating process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Physical Vapor Deposition (PVD) process.

The embodiments of the electrode structure of the present invention illustrated in fig. 1A-1E can be applied to many different products including inductors or chokes, which will be described in detail later.

Referring to fig. 2A, a cross-sectional view of an electrode structure of an electronic device according to an embodiment of the invention is shown. Disclosed herein is an electronic component including: a T-shaped magnet ring 70 (T-core); a coil 50 having a first end 40, wherein the first end 40 of the coil 50 passes through the side 91 of the T-shaped magnetic ring 70 and is disposed in a first recess 90a of the top surface of the T-shaped magnetic ring 70; a conductive and adhesive layer 30 coated on the body 10 and a first portion 40a and a third portion 40c of the first end portion 40, wherein a second portion 40b of the first end portion 40 is not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30 and the first portion 40a and the third portion 40c of the first end portion 40; a second metal layer 60 coated on the first metal layer 20, wherein the first metal layer 20 and the second metal layer 60 are electrically connected to the second portion 40b of the first end portion 40 for electrically connecting an external circuit.

Likewise, the electrode configuration of the first end portion 40 may also be applied to a second end portion 80 of the coil 50. As shown in fig. 2B, the second end 80 of the coil 50 passes through the side 91 of the T-shaped magnetic ring 70 and is disposed in a second recess 90B on the top surface of the T-shaped magnetic ring 70; the conductive and adhesive layer 30 coated on the top surface of the T-shaped magnetic ring 70 and a first portion 40e and a third portion 40g of the second end portion 80, wherein the second portion 40f of the second end portion 80 of the coil 50 is not covered by the conductive and adhesive layer 30; a first metal layer 20 coated on the conductive and adhesive layer 30 and the first portion 40e and the third portion 40g of the second end 80 of the coil 50; a second metal layer 60 coated on the first metal layer 20, wherein the first metal layer 20 and the second metal layer 60 are electrically connected to the second portion 40f of the second end portion 80 for electrically connecting an external circuit.

In one embodiment, the magnetic body includes a T-shaped magnetic ring having a magnetic pillar and a top plate connected to the magnetic pillar, wherein the top plate has a first through hole formed at a first corner of the top plate, wherein the coil is wound around the magnetic pillar, and a first end of the coil is disposed in a recess of the top surface of the magnetic body through the first through hole of the top plate. The top plate is provided with a second through hole arranged at a second corner of the top plate, and a second end part of the coil is arranged at a second concave part of the top surface of the magnetic body through the second through hole of the top plate.

The coil may be made of an enameled wire (enameled wire), and the outer insulation material of the enameled wire for covering the inner wire may be removed by a process of removing the enameled wire by using a laser, so that the inner wire of the enameled wire can be exposed to electrically connect the first end 40 to the metal layer, wherein the enameled wire may be a flat wire or a round wire or another enameled wire having a suitable cross-sectional shape. In an embodiment of the present invention, the enameled wire of the round wire or the flat wire can be automatically wound around a magnetic pillar (pilar) of the T-shaped magnetic ring 70 by using a winding device.

In one embodiment, the conductive and adhesive layer 30 is a mixture of conductive material and polymer, such as silver powder and epoxy resin, wherein the conductive material is not limited to silver powder, but copper powder or other suitable conductive metal or alloy material. The first metal layer 20 may be nickel (Ni) and the second metal layer 60 may be tin (Sn).

In one embodiment, the first metal layer 20 may be copper (Cu) and the second metal layer 60 may be tin (Sn).

In one embodiment, the first metal layer 20 is covered on the conductive and adhesive layer 30 by a thin film process such as an electroplating process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Chemical Vapor Deposition (CVD) process.

In one embodiment, the first metal layer 20 and the second metal layer 60 are formed by a Physical Vapor Deposition (PVD) process.

Referring to fig. 3A-3G, top views of electrode structures of an inductor or a choke according to an embodiment of the present invention are shown, in which several embodiments of using silver paste 303 as the conductive and adhesive layer 30 and coating the silver paste 303 at different positions relative to the exposed first end 301 and second end 302 of the coil are shown.

Referring to fig. 3A, according to the view shown in the figure, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke and have at least a portion thereof exposed, and the silver paste 303 is not coated on the bottom surface of the magnetic body 300.

Referring to fig. 3B, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, and in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is applied to the magnetic body 300, but the exposed portions 304,305 of the first end portion 301 and the exposed portions 306,307 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) can be formed on the bottom surface of the choke for electrically connecting the exposed portions 304,305 of the first end portion 301 and the exposed portions 306,307 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) can be formed on the bottom surface of the choke for electrically connecting the first metal layer (e.g., a nickel layer) to form an electrode structure of the choke.

Referring to fig. 3C, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is coated on the magnetic body 300, but the exposed portion 314 of the first end portion 301 and the exposed portion 315 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) can be formed on the bottom surface of the choke for electrically connecting the exposed portion 314 of the first end portion 301 and the exposed portion 315 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) can be formed on the bottom surface of the choke for electrically connecting the first metal layer (nickel metal layer) to form an electrode structure of the choke.

Referring to fig. 3D, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, and in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is coated on the magnetic body 300, but the exposed portion 324 of the first end portion 301 and the exposed portion 325 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) may be formed on the bottom surface of the choke for electrically connecting the exposed portion 324 of the first end portion 301 and the exposed portion 325 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) may be formed on the bottom surface of the choke for electrically connecting the first metal layer (nickel metal layer) to form an electrode structure of the choke.

Referring to fig. 3E, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, and in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is applied to the magnetic body 300, but the exposed portions 334,335 of the first end portion 301 and the exposed portions 336,337 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) can be formed on the bottom surface of the choke for electrically connecting the exposed portions 334,335 of the first end portion 301 and the exposed portions 336,337 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) can be formed on the bottom surface of the choke for electrically connecting the first metal layer (e.g., a nickel metal layer) to form an electrode structure of the choke.

Referring to fig. 3F, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is coated on the magnetic body 300, but the exposed portion 344 of the first end portion 301 and the exposed portion 345 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) can be formed on the bottom surface of the choke for electrically connecting the exposed portion 344 of the first end portion 301 and the exposed portion 345 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) can be formed on the bottom surface of the choke for electrically connecting the first metal layer (e.g., a nickel metal layer) to form an electrode structure of the choke.

Referring to fig. 3G, the first end portion 301 and the second end portion 302 of the coil are disposed on the bottom surface of a choke, in an embodiment, the conductive and adhesive layer 30 (e.g., silver paste 303) is applied to the magnetic body 300, but the exposed portion 354 of the first end portion 301 and the exposed portion 355 of the second end portion 302 are not covered by the silver paste 303, so that a first metal layer (e.g., a metal layer made of nickel) can be formed on the bottom surface of the choke for electrically connecting the exposed portion 354 of the first end portion 301 and the exposed portion 355 of the second end portion 302, wherein a second metal layer (e.g., a metal layer made of tin) can be formed on the bottom surface of the choke for electrically connecting the first metal layer (e.g., a nickel metal layer) to form an electrode structure of the choke.

Fig. 3A to 3G are diagrams for explaining several embodiments of the electrode structure of the present invention in which silver paste 303 is applied to the exposed portion of the coil end, and are not intended to limit the electrode structure of the present invention.

Referring to fig. 4, a schematic diagram of a manufacturing process of an inductor or a choke according to an embodiment of the invention is shown. Essentially comprising the steps of: step 501, forming a T-shaped magnetic ring; step 502, winding a coil around a magnetic column of the T-shaped magnetic ring, wherein the coil may be a flat wire or a round wire, but not limited thereto; step 503, configuring a first end and a second end of the coil at predetermined positions on a surface of the T-shaped magnetic ring; step 504, encapsulating the coil and the T-shaped magnetic ring together to form a magnetic body through a molding process; step 505, removing the insulating layers at the first end and the second end of the coil, so that the conductive parts at the first end and the second end of the coil are exposed out of the surface of the magnetic body; step 506, forming a conductive and adhesive layer (e.g., silver paste) on the magnetic body and covering the exposed portions of the first end and the second end of the coil on the surface of the magnetic body; step 507, forming a nickel metal layer on the magnetic body and covering the silver paste, and the exposed portions of the first end and the second end of the coil on the surface of the magnetic body, and forming a tin metal layer covering the nickel metal layer, thereby forming an electrode structure of the choke. In an embodiment, the step 504 includes winding the coil around the magnetic pillar of the T-shaped magnetic ring, and then filling magnetic powder to encapsulate the magnetic pillar and the coil of the T-shaped magnetic ring to form a magnetic body.

In one embodiment, the magnetic pole of the T-shaped magnetic ring is preferably a short pole, which has the advantages of having higher shielding density (shielding density) and increasing Permeability (Permeability) of the choke. In an embodiment of the present invention, the coil may be manufactured using an enamel wire, and the outer insulation material of the enamel wire for covering the inner wire may be removed using a laser. In one embodiment, the enameled wire used for manufacturing the coil may be a flat wire or a round wire, wherein the dc resistance dcr (dc resistance) of the flat wire is lower than that of the round wire. In one embodiment, the round wire or the flat wire can be wound around the magnetic pole of the T-shaped magnetic ring by using an automatic winding device.

The electrode structure of the present invention does not require the use of lead frames, thereby allowing the choke to be made smaller and thinner. The silver paste is a mixed material of a conductive material and a polymer, for example, a mixed material of silver powder and epoxy resin, wherein the mixed material contains metal powder and a binding material, so that the silver paste has conductivity and binding property, and can be coated on the surface of the magnetic body to fix the two end parts of the coil on the magnetic body. The conductive material is not limited to silver powder, but may be copper powder or other suitable conductive metal or alloy material.

Further, the end portion of the coil is disposed outside the coil winding area of the electronic component to increase the winding space. In another aspect of the present invention, the end of the coil can also be embedded in a recess on the top surface of the magnetic body. In addition, the corner of the T-shaped magnetic ring can be provided with a concave part for the end part to pass through and firmly fix the end part at the same time, and an electrode for connecting the end part of the coil to the outside in a welding mode in the magnetic body is not needed.

According to the foregoing embodiment of the present invention, the electrode structure proposed by the present invention includes two conductive paths, a first conductive path formed by a first stacked layer of copper, silver paste, nickel and tin, and a second conductive path formed by a second stacked layer of copper, nickel and tin. The first stacked layer can fix the end part of the coil to the magnetic body by using silver paste, and silver powder in the silver paste can also conduct electricity; the metal bonding of copper, nickel and tin in the second stack layer can achieve better conductive effect, so that the Direct Current Resistance (DCR) value of the magnetic pillar element is not easily affected by the change of temperature or moisture.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.