阅读说明：本技术 Qfn封装器件的加工设备 (Processing equipment for QFN (quad Flat No lead) packaging device ) 是由 马磊 党鹏 杨光 彭小虎 王新刚 庞朋涛 任斌 王妙妙 于 2019-11-27 设计创作，主要内容包括：本发明公开一种QFN封装器件的加工设备,包括支撑板、第一框架、第二框架、第三框架、打标器和打磨机构,所述第一框架、第二框架、第三框架依次连接设置于支撑板的同一侧,所述打标器设置于第二框架上方,所述打磨机构安装于第三框架上方,所述打磨机构包括顶板和活动安装于顶板下方的打磨头,所述顶板一侧与支撑板固定连接,此顶板的另一侧设置有一挡板,所述挡板上开有一风嘴,所述第三框架下方设置有一吸尘仓,所述吸尘仓内设置有一负压风机,所述第三框架下方设置有一集尘板。本发明自动实现了对安装于移动块内的半导体器件的双面打标而无需人工干预翻面,既可以避免人工翻面带来的误差而影响打标的精度,又可以提高作业的效率。(The invention discloses processing equipment of a QFN (quad Flat No-lead) packaging device, which comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, the polishing mechanism is arranged above the third frame, the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, an air nozzle is arranged on the baffle plate, a dust suction bin is arranged below the third frame, a negative pressure fan is arranged in the dust suction bin, and a dust collecting plate is arranged below the third frame. The invention automatically marks the two sides of the semiconductor device arranged in the moving block without manual intervention of turning, thereby not only avoiding the error caused by manual turning from influencing the marking precision, but also improving the operation efficiency.)

1. The processing equipment of the QFN packaging device is characterized in that: the automatic marking device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);

the electromagnetic sliding rails (5) are respectively arranged on two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4), the electromagnetic sliding rails (5) positioned on the inner walls of the same side of the first frame (2), the second frame (3) and the third frame (4) are communicated, and a moving block (6) is connected between the oppositely arranged electromagnetic sliding rails (5);

a motor (8) is arranged on one side, opposite to the second frame (3), of the supporting plate (1), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the supporting plate (1), a second gear (11) is arranged on the surface of one side, opposite to the second frame (3), of the rotary table (10), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the surface of the other side of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);

the supporting plate (1) is provided with an annular sliding chute (25), a plurality of steel balls (13) are arranged in the sliding chute (25) in a rotating mode along the circumferential direction, and the rotating disc (10) is embedded into the sliding chute (25) and is connected with the supporting plate (1) in a rotating mode through the steel balls (13);

the polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);

the baffle (26) is provided with an air nozzle (17), a dust suction bin (15) is arranged below the third frame (4), the dust suction bin (15) is communicated with the air nozzle (17) through a first air pipe (16), and a negative pressure fan (23) is arranged in the dust suction bin (15);

a dust collecting plate (19) is arranged below the third frame (4), a through hole (20) is formed in the dust collecting plate (19), and the through hole (20) is communicated with the dust collection bin (15) through a second air pipe (18);

a drawer (21) is arranged in the dust collection bin (15), a sliding block is arranged at the bottom of the drawer (21), a sliding groove matched with the sliding block is arranged in the dust collection bin (15), the sliding groove in the dust collection bin (15) is embedded into the sliding block at the bottom of the drawer (21), and the drawer (21) is connected with the dust collection bin (15) in a sliding mode.

2. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and a plurality of sliding blocks corresponding to the electromagnetic sliding rails (5) are arranged on two side surfaces of the moving block (6), and the sliding blocks are connected with the electromagnetic sliding rails (5) in a sliding manner.

3. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the second frame (3) and the third frame (4) are rectangular frames formed by sequentially connecting four beam bodies end to end.

4. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the through hole (20) is arranged on the lower surface of the dust collecting plate (19).

5. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the outer side of the drawer (21) is connected with a handle.

6. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and supporting columns are connected below the first frame (2) and the third frame (4).

7. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of a top plate (141) of the grinding mechanism (14).

8. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the number of the steel balls (13) is 10-20, and the 10-20 steel balls (13) are arranged at equal intervals along the circumferential direction.

9. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the supporting plate (1) is provided with a circular through hole for the turntable (10) to pass through, and the circular sliding groove (25) is located on the outer side of the circumference of the circular through hole.

10. The apparatus for processing QFN packaged devices as claimed in claim 9, wherein: the middle part of the rotary table (10) penetrates out of the circular through hole, and the circumferential edge of the rotary table (10) is embedded into the sliding groove (25).

Technical Field

The invention relates to the field of semiconductor device packaging, in particular to processing equipment of a QFN (quad Flat No lead) packaging device.

Background

The semiconductor device is an electronic device having a conductivity between a good conductor and an insulator and performing a specific function by utilizing the special electrical characteristics of a semiconductor material, and is used for generating, controlling, receiving, converting, amplifying a signal and performing energy conversion.

Beat the mark and can only go on one by one in the current semiconductor device packaging process, beat the mark with the semiconductor device one side and still need the manual work to carry out the turn-over, troublesome poeration, and current semiconductor device unhairing limit in-process, the plastics piece is not concentrated the collection, leads to the piece to splash, not only produces harm to staff's health, and the later stage clearance difficulty.

Disclosure of Invention

The invention aims to: in order to solve the problems that the existing semiconductor device packaging marking cannot carry out double-sided marking and burrs of the existing semiconductor device are removed and scraps are not collected, the processing equipment of the QFN packaging device is provided.

In order to achieve the purpose, the invention adopts the technical scheme that: the processing equipment of the QFN packaging device comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, and the polishing mechanism is arranged above the third frame;

the electromagnetic sliding rails positioned on the inner walls of the first frame, the second frame and the third frame on the same side are communicated, and a moving block is connected between the oppositely arranged electromagnetic sliding rails;

a motor is arranged on one side, opposite to the second frame, of the supporting plate, a first gear is connected to an output shaft of the motor, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on the surface, opposite to the second frame, of one side of the rotary table, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the surface, opposite to the second frame, of the other side of the rotary table, and the connecting blocks are fixedly connected with the second frame;

the supporting plate is provided with an annular chute, a plurality of steel balls are arranged in the chute in a rotatable manner along the circumferential direction, and the turntable is embedded in the chute and is connected with the supporting plate in a rotatable manner through the steel balls;

the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, and the baffle plate is arranged on the third frame;

the baffle is provided with an air nozzle, a dust collection bin is arranged below the third frame, the dust collection bin is communicated with the air nozzle through a first air pipe, and a negative pressure fan is arranged in the dust collection bin;

a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate, and the through hole is communicated with the dust collection bin through a second air pipe;

the dust collection box is characterized in that a drawer is arranged in the dust collection box, a sliding block is arranged at the bottom of the drawer, a sliding groove matched with the sliding block is arranged in the dust collection box, and the sliding groove in the dust collection box is embedded into the sliding block at the bottom of the drawer to connect the drawer in the dust collection box in a sliding mode.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, a plurality of sliding blocks corresponding to the electromagnetic sliding rails are arranged on two side surfaces of the moving block, and the sliding blocks are connected with the electromagnetic sliding rails in a sliding manner.

2. In the above scheme, the second frame and the third frame are both rectangular frames formed by sequentially connecting four beam bodies end to end.

3. In the above scheme, the through hole is formed in the lower surface of the dust collecting plate.

4. In the scheme, the outer side of the drawer is connected with a handle.

5. In the above scheme, the supporting columns are connected below the first frame and the third frame.

6. In the scheme, the lower surface of the top plate of the grinding mechanism is provided with the transverse sliding rail and the longitudinal sliding rail.

7. In the scheme, the number of the steel balls is 10-20, and the 10-20 steel balls are arranged at equal intervals along the circumferential direction.

8. In the above scheme, the supporting plate is provided with a circular through hole for the turntable to pass through, and the circular sliding groove is located on the outer side of the circumference of the circular through hole.

9. In the scheme, the middle part of the rotary disc penetrates out of the circular through hole, and the circumferential edge of the rotary disc is embedded into the sliding groove.

Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:

1. the processing equipment of the QFN packaging device realizes the rotation of the second frame, so that a moving block moved into the second frame can be turned, the marking of the double surfaces of the semiconductor device installed in the moving block is automatically realized without manual intervention for turning, the marking precision can be prevented from being influenced by errors caused by manual turning, the labor and the operation time can be saved, and the operation efficiency is improved; furthermore, an annular chute is arranged on the supporting plate, a plurality of steel balls are arranged in the chute in a rotating mode along the circumferential direction, the rotary table is embedded into the chute and is connected with the supporting plate in a rotating mode through the steel balls, resistance in the process of turning the second frame is reduced on the basis that the second frame can be turned, turning actions of the second frame are smooth, and position accuracy of stopping in the turning process is better, so that quality and accuracy of double-sided marking are guaranteed.

2. The processing equipment for the QFN packaging device realizes the polishing of the semiconductor device moved to the third frame, enriches the connotation of the device, improves the automation degree of the processing of the semiconductor device, and can also avoid the splashing of scraps generated in the polishing process; the air nozzle is arranged on the baffle, the dust collection bin is arranged below the third frame and is communicated with the air nozzle through a first air pipe, the negative pressure fan is arranged in the dust collection bin, and debris generated in the polishing process can be absorbed into the dust collection bin through the negative pressure fan and the dust collection bin, so that the influence of air pollution caused by the debris on the health of workers is avoided, and meanwhile, the difficulty in cleaning by later-stage cleaning personnel can be avoided; furthermore, a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate, the through hole is communicated with the dust collection bin through a second air pipe, the dust collecting plate and the second air pipe are arranged on the basis of the first air pipe, the first air pipe can further miss re-absorption of the chips which are not sucked, comprehensive absorption of the chips generated in the polishing process is guaranteed, and the conditions that air pollution caused by the chips affects the body health of workers and the cleaning difficulty in the later period are avoided; in addition, a drawer is arranged in the dust collection bin, the arrangement of the drawer is convenient for cleaning up the chips absorbed into the dust collection bin, and the situation that the chips in the bin are accumulated too much to influence the efficiency of the fan is prevented.

Drawings

FIG. 1 is a schematic structural diagram of a processing device of a QFN package device of the present invention;

FIG. 2 is a schematic view of a motor connection structure of a processing device of the QFN package device of the present invention;

FIG. 3 is a cross-sectional view of a support plate of the QFN package device processing equipment;

FIG. 4 is a cross-sectional view of a dust collection bin of the processing equipment of the QFN package device of the invention;

FIG. 5 is a schematic view of a dust collection bin connection structure of a processing device of the QFN package device of the present invention;

fig. 6 is a schematic partial structure diagram of processing equipment of the QFN packaged device of the invention.

In the above drawings: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. connecting blocks; 13. steel balls; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 18. a second air duct; 19. a dust collecting plate; 20. a through hole; 21. a drawer; 23. a negative pressure fan; 25. a chute; 26. and a baffle plate.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.