阅读说明：本技术 用于电化学传感器的物理气相沉积电极 (Physical vapor deposition electrode for electrochemical sensors ) 是由 D.L.阿什福德二世 D.P.普佐 S.E.霍赫斯特特勒 于 2018-06-05 设计创作，主要内容包括：提供的电化学电极及其制造方法改进了用于生物传感器,如血糖传感器的特性。该电极包括基底、沉积在该基底上的导电层、和沉积在该导电层上的电阻材料层。该导电层包含镍和铬,并且该电阻材料层包含碳和碳-氮物质。(The provided electrochemical electrode and the manufacturing method thereof improve characteristics for biosensors, such as blood glucose sensors. The electrode includes a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. The conductive layer comprises nickel and chromium, and the resistive material layer comprises carbon and carbon-nitrogen species.)

1. An electrochemical electrode for a biosensor, the electrode comprising:

a substrate;

a conductive layer deposited on the substrate; and

a resistive material layer deposited on the conductive layer;

wherein the resistive material layer comprises carbon and at least one C-N species; and is

Wherein the C-N species is present in an amount of at least 20 atomic% based on the entire electrical resistance material layer.

2. The electrochemical electrode of claim 1, wherein the conductive layer comprises nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer is from 25 to 100 weight percent, based on the total weight of the conductive layer equal to 100 weight percent.

3. The electrochemical electrode of claim 1 or 2, wherein the conductive layer comprises greater than 20% chromium by weight.

4. The electrochemical electrode of claim 3, wherein the balance of the conductive layer is nickel.

5. The electrochemical electrode of claim 1, wherein the conductive layer comprises nickel, chromium, and iron,

wherein the combined weight percentage of nickel and chromium in the conductive layer is from 25 to less than 95 weight%,

wherein the weight percentage of nickel in the conductive layer is at least 4 weight%,

wherein the weight percentage of chromium in the conductive layer is at least 10 weight%,

wherein the weight percentage of iron in the conductive layer is at least 2 wt%, and

wherein the conductive layer comprises 0 to 20 wt% molybdenum.

6. The electrochemical electrode of any one of claims 1 and 5, wherein the weight percentage of nickel in the conductive layer is about 8 to about 81 weight%.

7. The electrochemical electrode of any one of claims 1 and 5-6, wherein the weight percentage of chromium in the conductive layer is from about 14 to about 21 weight%.

8. The electrochemical electrode of any one of claims 1 and 5-7, wherein the weight percentage of iron in the conductive layer is about 6 to about 74 weight%.

9. The electrochemical electrode of any one of claims 1 and 5-8, wherein the weight percentage of nickel in the conductive layer is about 70 to about 81 weight%.

10. The electrochemical electrode of any one of claims 1 and 5-9, wherein the weight percentage of iron in the conductive layer is about 6 to about 10 weight%.

11. The electrochemical electrode of any one of claims 1 and 5, wherein the weight percentage of iron in the conductive layer is about 61 to about 75 weight%.

12. The electrochemical electrode of any one of claims 1-11, wherein the conductive layer comprises 0 to 13 wt% molybdenum.

13. The electrochemical electrode of claim 1, wherein the conductive layer comprises nickel, chromium, iron, and molybdenum,

wherein the weight percentage of nickel in the conductive layer is 10 to 30 weight%,

wherein the weight percentage of chromium in the conductive layer is from 16 to 26 weight%,

wherein the weight percentage of iron in the conductive layer is 39 to 71 weight%, and

wherein the weight percent of molybdenum is from 2 to 10 weight percent, all based on the total weight of the conductive layer being equal to 100 weight percent.

14. The electrochemical electrode according to claim 13,

wherein the weight percent of nickel in the conductive layer is 10 to 16 weight percent,

wherein the weight percentage of chromium in the conductive layer is 17 to 21 weight%,

wherein the weight percentage of iron in the conductive layer is from 55 to 70 weight percent, and

wherein the weight percent of molybdenum is from 2 to 5 weight percent, all based on the total weight of the conductive layer being equal to 100 weight percent.

15. The electrochemical electrode according to claim 13,

wherein the weight percent of nickel in the conductive layer is from 12.5 to 29 weight percent,

wherein the weight percentage of chromium in the conductive layer is from 16 to 24 weight%,

wherein the weight percentage of iron in the conductive layer is 46 to 66 weight%, and

wherein the weight percent of molybdenum is from 3 to 6 weight percent, all based on the total weight of the conductive layer being equal to 100 weight percent.

16. The electrochemical electrode according to claim 13,

wherein the weight percent of nickel in the conductive layer is 16 to 26.5 weight percent,

wherein the weight percentage of chromium in the conductive layer is from 18 to 23 weight%,

wherein the weight percentage of iron in the conductive layer is 41 to 62 weight%, and

wherein the weight percent of molybdenum is from 5 to 8 weight percent, all based on a total weight of the conductive layer equal to 100 weight percent.

17. The electrochemical electrode of any one of claims 1 to 16, wherein the electrode is a working or reference or counter electrode in a biosensor; and wherein the biosensor is a blood glucose sensor.

18. The electrochemical electrode of any one of claims 1 to 17, wherein the conductive layer is physically vapor deposited on the substrate and the layer of resistive material is physically vapor deposited on the conductive layer.

19. The electrochemical electrode of any one of claims 1 to 18, wherein the substrate comprises a flexible polymer film, the conductive layer is sputtered on the substrate, and the electrical resistance material layer is sputtered on the conductive layer, and wherein the electrical resistance material layer is sputtered on the conductive layer in a nitrogen-containing atmosphere.

20. The electrochemical electrode of any one of claims 1 to 19, wherein the nitrogen-containing atmosphere comprises a mixture of an inert gas and nitrogen.

21. The electrochemical electrode of any one of claims 1 to 20, wherein the nitrogen-containing atmosphere comprises a mixture of Ar gas and nitrogen gas, and

wherein the nitrogen is present in an amount of 5% to 50% by partial pressure.

Technical Field

The present invention relates generally to electrodes, such as physical vapor deposition thin film electrodes, such as those found in biosensors. More particularly, the invention relates to electrodes formed from non-noble metal alloys, such as those found in biosensor components.

Background of the invention.

Summary of The Invention

It has been found that non-noble metals can undergo aging phenomena when exposed to atmospheric conditions that result in changes in the performance of the non-noble metals for biosensor applications. It has also been found that electrodes formed by depositing non-noble metals on a substrate film require a sufficient degree of mechanical robustness (e.g., scratch resistance and a sufficiently low coefficient of friction) to provide sufficient latitude for manufacturing operations and to achieve adequate performance for biosensor applications. Thus, there is a need for an electrode formed from a non-noble metal alloy that can be used in a biosensor assembly for consistent and accurate measurement of biological samples, and that has good mechanical robustness to allow processing and to achieve or maintain electrical performance.

One or more embodiments of the present disclosure may be directed to an electrode that may include a substrate, at least one non-noble metal alloy conductive layer deposited on the substrate, and at least one resistive material layer deposited on the non-noble metal layer. In certain embodiments, the conductive layer may comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer may be at least 24, or at least 25, or at least 50, or at least 60, or at least 70, or at least 80, or at least 90, or at least 95 weight percent, based on the total weight of the conductive layer. In certain embodiments, the conductive layer may include nickel in an amount of less than 80 wt% and chromium in an amount of greater than 20 wt%, based on the total weight of the conductive layer. In certain embodiments, the conductive layer may comprise nickel and chromium, wherein nickel is present in an amount of at least 4, or 5, or 6, or 8 weight percent and chromium is present in an amount of at least 10 weight percent, based on the weight of the conductive layer. In one embodiment, the layer of resistive material has a thickness of less than 20 nm. In certain embodiments, the electrical resistance material layer allows fluid communication between an external liquid (e.g., saline solution or a liquid coating containing a biological reactant) and the electrically conductive layer.

In one embodiment, the conductive layer may comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer may be 24 or 25 to less than 95 weight percent, at least 10 weight percent chromium and at least 4, or 5, or 6, or 8 weight percent nickel, based on the total weight of the conductive layer. In addition to nickel and chromium, the conductive layer may also include iron, wherein the iron is present in an amount greater than 2 wt% based on a total weight of the conductive layer equal to 100 wt%. In embodiments, the conductive layer may comprise 0 to less than 20, or 0 to 17, or 0 to 13, or 0 to 10, or 0 to 9, or 0 to 8, or 0 to 7, or 0 to 6, or 0 to 5, or 0 to 4, or 0 to 3, or 0 to 2, or 0 to 1, or 0 to 0.5, or 0 to 0.1 weight percent molybdenum. In certain embodiments, the conductive layer may comprise 2 to 10, or 2 to 8, or 2 to 7.5, or 2 to 7.0, or 2 to 6.5, or 2.5 to 8, or 2.5 to 7.5, or 2.5 to 7.0, or 2.5 to 6.5, or 3 to 8, or 3 to 7.5, or 3 to 7.0, or 3 to 6.5, or 3.5 to 8, or 3.5 to 7.5, or 3.5 to 7.0, or 3.5 to 6.5, or 4 to 8, or 4 to 7.5, or 4 to 7.0, or 4 to 6.5, or 4.5 to 8, or 4.5 to 7.5, or 4.5 to 7.0, or 4.5 to 6.5 weight percent molybdenum. In certain embodiments, the conductive layer may comprise 2 to 6.5, or 2 to 6.0, or 2 to 5.5, or 2 to 5, or 2 to 4.5, or 2 to 4, or 2.5 to 6.5, or 2.5 to 6.0, or 2.5 to 5.5, or 2.5 to 5, or 2.5 to 4.5, or 2.5 to 4, or 3 to 6.5, or 3 to 6.0, or 3 to 5.5, or 3 to 5, or 3 to 4.5, or 3 to 4, or 3.5 to 6.5, or 3.5 to 6.0, or 3.5 to 5.5, or 3.5 to 5, or 4 to 6.5, or 4 to 6.0, or 4 to 5.5, or 4 to 5, or 4.5 to 6, or 4.5 to 5, or 5.5 to 6, or 4.5 to 5, or 5 to 6.5, or 5 wt% molybdenum. While the present disclosure is directed generally to electrodes for use as biosensor components, it is contemplated that the electrodes may be used in other end applications as well. Accordingly, any disclosure herein relating to electrodes for biosensors is intended to include herein all electrodes suitable for use in the technology that one of ordinary skill in the art could reasonably apply.

In a first aspect, the conductive layer may comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer may be at least 50, or at least 60, or at least 70, or at least 80, or at least 90, or at least 95 weight%, based on the total weight of the conductive layer equal to 100 weight%, and the thickness of the electrical resistance material layer is less than 20 nm. In one embodiment, the combined weight percentage of nickel and chromium in the conductive layer is 90 to 100 wt% and the thickness of the resistive layer is 5 to 15 nm.

In an embodiment of the first aspect, the weight percentage of chromium in the conductive layer is from about 25 to about 95 weight percent, and the balance of the conductive layer is substantially nickel. In an embodiment of the first aspect, the resistive material layer comprises amorphous carbon, the weight percentage of chromium in the conductive layer is greater than 50 to about 95 weight%, and the balance of the conductive layer is substantially nickel.

In a second aspect, the conductive layer may comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer may be at least 25, or at least 50, or at least 60, or at least 70, or at least 80, or at least 90, or at least 95 weight percent, based on the total weight of the conductive layer equal to 100 weight percent. In embodiments of the second aspect, the conductive layer may comprise nickel and chromium, wherein nickel is present in an amount of at least 4, or 5, or 6, or 8 wt% and chromium is present in an amount of at least 10 wt%, based on the weight of the conductive layer. In an embodiment of the second aspect, the conductive layer comprises greater than 20% by weight chromium. In an embodiment of the second aspect, the substrate has a thickness of 25 to 500 μm, the electrically conductive layer has a thickness of 15 to 200 nm, and the layer of electrical resistance material has a thickness of 5 to 200 nm, or 5 to 100 nm.

In embodiments of the second aspect, the conductive layer may comprise less than 80 wt.%, or less than 75 wt.% nickel, and greater than 20, or greater than 25 wt.% chromium, based on the total weight of the conductive layer equal to 100 wt.%, wherein the total combined weight percentage of nickel and chromium in the conductive layer is 90 to 100, or 95 to 100 wt.%.

In an embodiment of the second aspect, the weight percentage of chromium in the conductive layer is from about 25 to about 95 weight percent, and the balance of the conductive layer is substantially nickel. In other embodiments of the second aspect, the weight percent of chromium in the conductive layer is from about 30 to about 95 weight percent, and the balance of the conductive layer is substantially nickel. In a further embodiment of the second aspect, the weight percent of chromium in the conductive layer is from about 40 to about 95 weight percent, and the balance of the conductive layer is substantially nickel. In still other embodiments of the second aspect, the weight percent of chromium in the conductive layer is from about 50 to about 95 weight percent, and the balance of the conductive layer is substantially nickel. In another embodiment of the second aspect, the weight percentage of chromium in the conductive layer is greater than 50 to about 95 weight percent, and the balance of the conductive layer is substantially nickel.

In an embodiment of the second aspect, the resistive layer comprises amorphous carbon. In an embodiment of the second aspect, the resistive layer comprises amorphous carbon, the weight percentage of chromium in the conductive layer is about 25 to about 95 weight%, and the balance of the conductive layer is substantially nickel. In another embodiment of the second aspect, the resistive layer comprises amorphous carbon, the weight percentage of chromium in the conductive layer is greater than 50 to about 95 weight%, and the balance of the conductive layer is substantially nickel. In an embodiment of the second aspect, the resistive layer comprises amorphous carbon, and the resistive material layer has a thickness of 5 to 30 nm, or 5 to 20 nm.

In a third aspect, the conductive layer can comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer can be 24 or 25 to 90 weight%, or 26 to 89 weight%, based on the total weight of the conductive layer equal to 100 weight%. In addition to nickel and chromium, the conductive layer may also include iron, wherein the weight percentage of iron in the conductive layer may be greater than 5 wt% to less than 75 wt%, or about 6 to about 74 wt%, based on the total weight of the conductive layer equal to 100 wt%.

In embodiments of the third aspect, the conductive layer may comprise greater than 7 wt.% nickel and greater than 13 to less than 25 or less than 21 wt.% chromium, based on the total weight of the conductive layer equal to 100 wt.%, and wherein the total combined weight percentage of nickel and chromium in the conductive layer is greater than 24 or greater than 25 to less than 90 wt.%, or 26 to 89 wt.%.

In further embodiments of the third aspect, the conductive layer can comprise 8 to 72 wt.% nickel, about 14 to about 25 or 14 to about 20 wt.% chromium, and about 6 to about 74 wt.% iron, based on a total weight of the conductive layer equal to 100 wt.%, and wherein the total combined weight percent of nickel and chromium in the conductive layer is about 24 or about 25 to about 90 wt.%, or 26 to 89 wt.%.

In certain embodiments of the third aspect, the conductive layer can comprise 8 to 72 weight percent nickel, 14 to 25 or 14 to 20 weight percent chromium, and 6 to 74 weight percent iron, based on a total weight of the conductive layer equal to 100 weight percent.

In certain embodiments of the third aspect, the conductive layer can comprise 8 to 72 weight percent nickel, 14 to 25 or 14 to 20 weight percent chromium, 6 to 74 weight percent iron, and 0 to 10 weight percent molybdenum, based on a total weight of the conductive layer equal to 100 weight percent, and wherein the conductive layer does not comprise any other elemental species present in an amount greater than 6 weight percent, or greater than 5 weight percent, or greater than 4 weight percent, or greater than 3 weight percent, or greater than 2 weight percent, based on a total weight of the conductive layer equal to 100 weight percent. In one embodiment, the conductive layer further comprises 0.01 to 7.0 wt% molybdenum and 0.01 to 6.0 wt% manganese, based on the total weight of the conductive layer equal to 100 wt%, and does not include any other elemental species present in an amount greater than 1.5 wt% or greater than 1.0 wt%. In one embodiment, the conductive layer further comprises 0.01 to 2.0 wt.% manganese, based on the total weight of the conductive layer equal to 100 wt.%, and does not comprise any other elemental species present in an amount greater than 1.0 wt.%.

In certain embodiments of the third aspect, the conductive layer can comprise 8 to 72 weight percent nickel, 14 to 24 or 14 to 20 weight percent chromium, and 6 to 74 weight percent iron, based on a total weight equal to 100 weight percent of the conductive layer, and wherein the conductive layer further comprises 0.01 to 2.0 weight percent manganese, 0.01 to 1.0 weight percent silicon, 0 to 3.0 weight percent molybdenum, and 0 to 0.5 weight percent copper, based on a total weight equal to 100 weight percent of the conductive layer. In one embodiment, the conductive layer contains less than 0.2 wt% of each of the following elemental species: carbon, sulfur, phosphorus, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer does not contain the following elemental species: niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer contains less than 0.2 wt% of each of the following elemental species: carbon, sulfur, phosphorus, molybdenum, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer does not contain the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, or boron.

In a fourth aspect, the conductive layer can comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer can be 80 to less than 95 wt.%, or 81 to 94 wt.%, or 82 to 94 wt.%, or 83 to 94 wt.%, or 85 to 94 wt.%, or 86 to 94 wt.%, based on the total weight of the conductive layer equal to 100 wt.%. In addition to nickel and chromium, the conductive layer may also include iron, wherein the weight percentage of iron in the conductive layer may be greater than 5 wt.% to less than 12 wt.%, or about 6 to about 11 wt.%, or 6 to 10 wt.%, or 6 to 9 wt.%, or 7 to 10 wt.%, or 7 to 9 wt.%, or about 8 or about 9 wt.%, based on the total weight of the conductive layer equal to 100 wt.%.

In embodiments of the fourth aspect, the conductive layer can comprise greater than 70 wt% nickel and greater than 13 to less than 20 wt% chromium, based on the total weight of the conductive layer equal to 100 wt%, and wherein the total combined weight percentage of nickel and chromium in the conductive layer is greater than 80 to less than 95 wt%, or 81 to 94 wt%, or 82 to 94 wt%, or 83 to 94 wt%, or 85 to 94 wt%, or 86 to 94 wt%.

In further embodiments of the fourth aspect, the conductive layer can comprise 70 to 81 weight percent nickel, about 14 to about 19 weight percent chromium, and about 6 to about 11 weight percent iron, based on a total weight of the conductive layer equal to 100 weight percent, and wherein the total combined weight percent of nickel and chromium in the conductive layer is about 84 to about 94 weight percent, or 85 to 94 weight percent, or 86 to 94 weight percent.

In certain embodiments of the fourth aspect, the conductive layer can comprise 70 to 81 weight percent nickel, 14 to 17 weight percent chromium, and 6 to 11 weight percent iron, based on a total weight equal to 100 weight percent of the conductive layer.

In certain embodiments of the fourth aspect, the conductive layer can comprise 72 to 81 weight percent nickel, 14 to 17 weight percent chromium, and 6 to 11, or 6 to 10 weight percent iron, based on a total weight of the conductive layer equal to 100 weight percent, and wherein the conductive layer does not comprise any other elemental species present in an amount greater than 1 weight percent, based on the total weight of the conductive layer equal to 100 weight percent. In one embodiment, the conductive layer further comprises 0.01 to 1.0 wt.% manganese, based on the total weight of the conductive layer equal to 100 wt.%, and does not comprise any other elemental species present in an amount greater than 0.5 wt.%.

In certain embodiments of the fourth aspect, the conductive layer can comprise 72 to 81 weight percent nickel, 14 to 17 weight percent chromium, and 6 to 11, or 6 to 10 weight percent iron, based on a total weight equal to 100 weight percent of the conductive layer, and wherein the conductive layer further comprises 0.01 to 1.0 weight percent manganese, 0.01 to 0.5 weight percent copper, and 0.01 to 0.5 weight percent silicon, based on a total weight equal to 100 weight percent of the conductive layer. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, phosphorus, or boron, or if any is present, such is present in an amount of less than 0.25 wt.%, or less than 0.2 wt.%, or less than 0.1 wt.%, or less than 0.05 wt.%, or trace amounts or less. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, phosphorus, or boron.

In a fifth aspect, the conductive layer can comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer can be 24 to 55, or 25 to 33, or greater than 25 and less than 33 weight percent, based on the total weight of the conductive layer equal to 100 weight percent. In some embodiments, the combined weight percentage of nickel and chromium in the conductive layer may be 25 to less than 32 weight%, or 26 to 31 weight%, or 26 to 30.5 weight%, or 28 to 32 weight%, or 38 to 49 weight%, or 42 to 47 weight%, based on the total weight of the conductive layer equal to 100 weight%. In some embodiments, the combined weight percentage of nickel and chromium in the conductive layer may be 25 to less than 33 weight%, or 26 to 32 weight%, based on the total weight of the conductive layer equal to 100 weight%.

In a fifth aspect, the conductive layer can comprise iron in addition to nickel and chromium, wherein the weight percentage of iron in the conductive layer can be at least 35 wt.%, or at least 44 wt.%, or at least 60 wt.% to less than 75 wt.%, or greater than 61 wt.% to 74 wt.%, based on the total weight of the conductive layer equal to 100 wt.%. In some embodiments, the weight percentage of iron in the conductive layer is 61 to 75, or 65 to 75, or greater than 65 to less than 75, or 66 to less than 75, or greater than 66 to 74. In some embodiments, the weight percentage of iron in the conductive layer is 60 to 73 weight%, greater than 60 to less than 73 weight%, or greater than 61 weight% to less than 73 weight%, or greater than 61.5 weight% to 72 weight%, or about 61.85 to about 72 weight%, based on the total weight of the conductive layer equal to 100 weight%. In some embodiments, the weight percentage of iron in the conductive layer is 44 to 73 weight%, or 44 to 50 weight%, or 44 to 48 weight%, or 44 to 46 weight%, based on the total weight of the conductive layer equal to 100 weight%.

In embodiments of the fifth aspect, the conductive layer may comprise 7 to 15 wt.%, or greater than 7 and less than 15 wt.%, or 8 to 14 wt.% nickel, and 15 to 21 wt.%, or greater than 15 to less than 21 wt.%, or 16 to 20 wt.% chromium, based on the total weight of the conductive layer equal to 100 wt.%, and wherein the total combined weight percentage of nickel and chromium in the conductive layer is 25 to 33 wt.%, or greater than 25 and less than 33 wt.%, or 26 to 32 wt.%.

In further embodiments of the fifth aspect, the conductive layer can comprise 8 to 11, or 8 to 10.5 weight percent nickel, about 18 to about 20 weight percent chromium, and about 66 to about 74 weight percent iron, based on a total weight of the conductive layer equal to 100 weight percent, and wherein the total combined weight percent of nickel and chromium in the conductive layer is about 26 to about 31 weight percent, or 26 to 30.5 weight percent.

In certain embodiments of the fifth aspect, the conductive layer can comprise 10 to 14 weight percent nickel, 16 to 18 weight percent chromium, and 61 to 72 weight percent iron, based on a total weight equal to 100 weight percent of the conductive layer.

In certain embodiments of the fifth aspect, the conductive layer can comprise 8 to 10.5 wt.% nickel, 18 to 20 wt.% chromium, and 66 to 74 wt.% iron, based on a total weight of the conductive layer equal to 100 wt.%, and wherein the conductive layer does not comprise any other elemental species present in an amount greater than 2 wt.% based on the total weight of the conductive layer equal to 100 wt.%. In one embodiment, the conductive layer further comprises 0.01 to 2.0 wt.% manganese and 0.01 to 1.0 wt.% silicon, based on the total weight of the conductive layer equal to 100 wt.%, and does not comprise any other elemental species present in an amount greater than 0.2 or 0.1 wt.%.

In certain embodiments of the fifth aspect, the conductive layer can comprise 8 to 10.5 wt.% nickel, 18 to 20 wt.% chromium, and 66 to 74 wt.% iron, based on a total weight equal to 100 wt.% of the conductive layer, and wherein the conductive layer further comprises 0.01 to 2.0 wt.% manganese, 0.01 to 1.0 wt.% silicon, and each further comprises carbon, sulfur, and phosphorus in an amount less than 0.1 wt.%, based on a total weight equal to 100 wt.% of the conductive layer. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, copper, or boron, or if any is present, such is present in an amount of less than 0.25 wt.%, or less than 0.2 wt.%, or less than 0.1 wt.%, or less than 0.05 wt.%, or trace amounts or less. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, copper, or boron.

In certain embodiments of the fifth aspect, the conductive layer can comprise 10 to 14 weight percent nickel, 16 to 18 weight percent chromium, and 61 to 72 weight percent iron, based on a total weight of the conductive layer equal to 100 weight percent, and wherein the conductive layer does not comprise any other elemental species present in an amount greater than 3 weight percent, based on the total weight of the conductive layer equal to 100 weight percent. In one embodiment, the conductive layer further comprises 2 to 3 weight percent molybdenum, 0.01 to 2.0 weight percent manganese, and 0.01 to 1.0 weight percent silicon, based on the total weight of the conductive layer equal to 100 weight percent, and does not comprise any other elemental species present in an amount greater than 0.2, or 0.1 weight percent.

In certain embodiments of the fifth aspect, the conductive layer can comprise 10 to 14 weight percent nickel, 16 to 18 weight percent chromium, and 61 to 72 weight percent iron, based on a total weight equal to 100 weight percent of the conductive layer, and wherein the conductive layer further comprises 2 to 3 weight percent molybdenum, 0.01 to 2.0 weight percent manganese, 0.01 to 1.0 weight percent silicon, based on a total weight equal to 100 weight percent of the conductive layer, and each further comprises carbon, sulfur, and phosphorus in an amount less than 0.1 weight percent. In one embodiment, the conductive layer is free or substantially free of the following elemental species: niobium, cobalt, aluminum, titanium, copper, or boron, or if any is present, such is present in an amount of less than 0.25 wt.%, or less than 0.2 wt.%, or less than 0.1 wt.%, or less than 0.05 wt.%, or trace amounts or less. In one embodiment, the conductive layer is free or substantially free of the following elemental species: niobium, cobalt, aluminum, titanium, copper, or boron.

In a sixth aspect, the conductive layer can comprise 10 to 30 wt.%, or greater than 10 and less than 30 wt.%, or 11 to 29 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 16 to 26 weight percent, or 17 to 26 weight percent, or greater than 17 to less than 26 weight percent, or 18 to 25 weight percent chromium; and 2 to 8 wt.%, or greater than 2 and less than 8 wt.%, or 2.5 to 7 wt.% molybdenum.

In embodiments of the sixth aspect, the conductive layer may comprise 10 to 16 wt.%, or greater than 10 and less than 16 wt.%, or 11 to 15 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 17 to 21 wt%, or greater than 17 to less than 21 wt%, or 18 to 20 wt% chromium; 2 to 5 wt.%, or greater than 2 and less than 5 wt.%, or 3 to 4 wt.% molybdenum; and 55 to 70 wt.%, or greater than 55 to less than 70 wt.%, or 57 to 68 wt.% iron.

In an embodiment of the sixth aspect, the conductive layer can comprise 12.5 to 29 wt.%, or greater than 12.5 and less than 29 wt.%, or 13.5 to 28 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 16 to 24 wt%, or greater than 16 to less than 24 wt%, or 17 to 23 wt% chromium; 3 to 6 wt.%, or greater than 3 and less than 6 wt.%, or 4 to 5 wt.% molybdenum; and 46 to 66 wt.%, or greater than 46 to less than 66 wt.%, or 47 to 65 wt.% iron.

In an embodiment of the sixth aspect, the conductive layer can comprise 16 to 26.5 wt.%, or greater than 16 and less than 26.5 wt.%, or 17 to 25.5 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 18 to 23 wt%, or greater than 18 to less than 23 wt%, or 19 to 22 wt% chromium; 5 to 8 wt.%, or greater than 5 and less than 8 wt.%, or 6 to 7 wt.% molybdenum; and 41 to 62 wt.%, or greater than 41 to less than 62 wt.%, or 42 to 61 wt.% iron.

In an embodiment of the sixth aspect, the conductive layer does not comprise any other elemental species (other than those specified above) present in an amount greater than 2 wt%, based on the total weight of the conductive layer equal to 100 wt%. In one embodiment, the conductive layer further comprises 0.01 to 2.0 wt.% manganese and 0.01 to 1.0 wt.% silicon, based on the total weight of the conductive layer equal to 100 wt.%, and does not comprise any other elemental species present in an amount greater than 0.2, or 0.1, or 0.05 wt.%.

In an embodiment of the invention, the conductive layer is a metal comprising or made from one or more of the following alloys: stainless Steel (SS) 354 SMO, SS304, SS316, SS 317L, SS 317LM, SS 317LMN, SS 904, SS AL-6XN or SS Alloy 24. In an embodiment of the invention, the conductive layer is a metal selected from one or more of the following alloys: stainless Steel (SS) 354 SMO, SS304, SS316, SS 317L, SS 317LM, SS 317LMN, SS 904, SS AL-6XN or SS Alloy 24.

In certain embodiments of the present disclosure, the conductive layer may be coated on a substrate that may comprise at least one of any of the polymers described in the art and/or described herein, including but not limited to polycarbonate obtained by physical vapor deposition, silicone polymers, acrylics, PET, modified PET such as PETG or PCTG, PCT, modified PCT, polyesters comprising TMCD and CHDM, PCCD, PEN, or polyimide.

In certain embodiments of the present disclosure, the layer of resistive material may comprise a thin film of resistive material deposited on the surface of the conductive layer. The term "resistive material" refers to a material that is more resistive than the conductive layer, allows current to flow after application of a constant potential, and when formed into a thin film electrode having a conductive layer and a resistive material layer on the conductive layer, increases the anode stability of the electrode and/or increases the electron transfer kinetics (as determined by a 1-type linear sweep voltammetry test) as compared to a similar electrode having the conductive layer alone. In certain embodiments, the resistive material layer comprises carbon.

In certain embodiments, the resistive material layer comprises carbon and carbon-nitrogen ("C-N") species, such as carbo-nitrides. In some embodiments, the resistive material layer comprises amorphous carbon. In certain embodiments, the resistive material layer is amorphous carbon and carbon-nitrogen (C-N) species deposited by sputtering. In certain embodiments, the resistive material layer is amorphous carbon and carbon-nitrogen (C-N) species deposited by sputtering using a carbon source and a nitrogen-containing atmosphere. In certain embodiments, the resistive material layer is amorphous carbon and a C-N species deposited by sputtering in a nitrogen-containing atmosphere using a carbon source in a separate sputtering step (i.e., without co-sputtering of the conductive layer and the layer of carbon and C-N material) from the sputtering step used to deposit the conductive layer.

In certain embodiments, the resistive layer comprises amorphous carbon consisting essentially of sp2 hybridized carbon, sp3 hybridized carbon, or a combination thereof, and at least one C-N species. In certain embodiments, an amorphous carbon layer comprising sp2 hybridized carbon, sp3 hybridized carbon, or a combination thereof may be formed using the following suggested techniques/methods: onprienko, A., Shaginyan, L. R., Role of microstructure in forming a in carbon file properties. Diamond relates to Mater. 1994, 3, 1132-1136; onpropenko, A., In Carbon, The futureMaterial for Advanced Technology Applications; messina, g., Santangelo, s., eds.; Springer Berlin Heidelberg, 2006; or Cho, N.H., Krishnan, K.M., Veirs, D.K., Rubin, M.D., Hopper, C.B., Bhushan, B., Bogy, D.B. chemical structure and physical properties of diamond-like carbon film compressed by magnetic neutron scattering, J.Mater. Res. 1990, 5, 2543-. However, it has been found that such a method can be improved by depositing the carbon material in an atmosphere containing a selected amount of nitrogen (e.g., via magnetron sputtering). The improvements may include increased deposition rates of carbon-containing resistive layers, improved electrochemical stability, sufficiently fast heterogeneous electron transfer kinetics, and improved mechanical properties (for the bulk electrode film).

In certain embodiments of the present disclosure, the electrical resistance material layer may have a thickness of 5 to 200 nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm. In certain embodiments, the biosensor component may also have a visible light transmittance of no more than 20% or no more than 15% or no more than 10% or no more than 5 or 0.01 to 20% or 0.01 to 15% or 0.01 to 10% or 0.01 to 5% as measured by ASTM D1003.

In certain embodiments of the present disclosure, the layer of resistive material may have a thickness of 5 to 200 nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm, wherein the biosensor component has a visible light transmittance of no more than 20%.

In certain embodiments of the present disclosure, the layer of resistive material may have a thickness of 5 to 200 nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm, wherein the biosensor component has a visible light transmittance of no more than 15%.

In certain embodiments of the present disclosure, the layer of resistive material may have a thickness of 5 to 200 nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm, wherein the biosensor component has a visible light transmittance of no more than 10%.

In certain embodiments of the present disclosure, the layer of resistive material may have a thickness of 5 to 200 nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm, wherein the biosensor component has a visible light transmittance of no more than 5%.

In certain embodiments, the electrical resistance material layer has a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 30 nm, or 5 to 25nm, or 5 to 20 nm, or 5 to less than 20 nm, or 5 to 15 nm. In embodiments, the electrical resistance material layer comprises amorphous carbon and at least one C — N species and has a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 30 nm, or 5 to 25nm, or 5 to 20 nm, or 5 to less than 20 nm, or 5 to 15 nm. In an embodiment, the electrical resistance material layer comprises amorphous carbon and at least one C-N species and has a thickness of 5 to 20 nm, or 5 to less than 20 nm, or 5 to 15 nm. In embodiments, the electrical resistance material layer contains less than 10, or 5, or 4, or 3, or 2, or 1 wt.%, or is substantially free of any oxygen-containing species. In embodiments, no oxygen containing species is intentionally added to the electrical resistance material layer. For example, there is no oxygen intentionally added to the sputtering atmosphere used to sputter the layer of resistive material. However, it is contemplated that small amounts of oxygen may be present as a sputter source material or as an impurity in the sputtering atmosphere (e.g., from air or water vapor that is not completely removed from the sputtering atmosphere).

In one aspect, certain embodiments of the present disclosure relate to a biosensor component comprising a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer, wherein the resistive material layer comprises carbon and at least one C-N species, wherein the conductive layer may comprise 25 to less than 95 weight percent of nickel and chromium in combined weight, based on the total weight of the conductive layer equal to 100 weight percent, chromium in an amount of at least 10 weight percent, nickel in an amount of at least 8 weight percent, iron in an amount of at least 2 weight percent, and molybdenum in an amount of 0 to 20 weight percent, and wherein the substrate may comprise at least one of any of the polymers described in the art and/or described herein, including but not limited to polycarbonate, silicone polymer, obtained by any method known in the art (including but not limited to physical vapor deposition), and a resistive material layer deposited on the conductive layer, wherein the conductive layer may comprise at least one of nickel and chromium in an amount of 0 to 20 weight percent, Acrylic, PET, modified PET such as PETG or PCTG, PCT, PCTA, polyesters comprising TMCD and CHDM, PCCD, PEN or polyimide. In an embodiment, the resistive layer may have a thickness of 5 to 100nm, the conductive layer may have a thickness of 15 to 200 nm, and the substrate may have a thickness of 25 to 500 μm, so that the biosensor assembly has a visible light transmittance of not more than 20% or not more than 15% or not more than 10% or not more than 5%.

One or more embodiments of the present disclosure may be directed to an electrode for a biosensor, wherein the electrode includes a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. In certain embodiments, the conductive layer can comprise nickel and chromium, and the conductive layer can have less than 1000, or less than 950, or less than 925, or less than about 900 millivolts (mV) of fe (ii) [ CN) measured in a 1-line linear sweep voltammetry test (as described in the examples section)]₆The oxidation wave voltage of the mediator (hereinafter identified as the E peak, anode). In certain embodiments, the conductive layer can comprise nickel and chromium, and the conductive layer can have an fe (ii) [ CN) of less than 450, or less than 400, or less than 375, or less than 350, or less than 325, or less than 300, or less than 275 millivolts (mV) as determined in a type 1 linear sweep voltammetry test (as described in the examples section)]₆The oxidation wave voltage of the mediator (hereinafter identified as the E peak, anode).

In one aspect, embodiments of the present disclosure may relate to an electrode for a biosensor, wherein the electrode comprises a substrate, a conductive layer deposited on the substrate, and a layer of resistive material (e.g., amorphous carbon and at least one C-N species) deposited on the conductive layer, wherein the conductive layer may comprise nickel, chromium, and iron (as described in aspects and embodiments above), and wherein the electrode may have an fe (ii) [ CN) of less than 1000, or less than 950, or less than 925, or less than about 900 millivolts (mV) as determined in a 1-type linear sweep voltammetry test (as described in the examples section)]₆The oxidation wave voltage of the mediator (hereinafter identified as the E peak, anode). In embodiments, the conductive layer may comprise nickel, chromium, and iron (as described in aspects and embodiments above), and wherein the electrode may have an fe (ii) ([ CN) of less than 450, or less than 400, or less than 375, or less than 350, or less than 325, or less than 300, or less than 275 millivolts (mV) as determined in a 1-type linear sweep voltammetry test (as described in the examples section)]₆The oxidation wave voltage of the mediator (hereinafter identified as the E peak, anode). In one embodiment, the conductive layer may comprise nickel in an amount of at least 8 wt.%, chromium in an amount of at least 10 wt.%, based on the total weight of the conductive layer equal to 100 wt.%, wherein the combined weight percent of nickel and chromium in the conductive layer may be 25 to 95 wt.%, and wherein the conductive layer may comprise iron in an amount of at least 2 wt.%, and molybdenum in an amount of 0 to 20 wt.%. In another embodiment, the conductive layer may comprise nickel in an amount of 8 to 72 wt.%, chromium in an amount of 14 to 20 wt.%, based on the total weight of the conductive layer equal to 100 wt.%, wherein the combined weight percentage of nickel and chromium in the conductive layer may be 25 to 90 wt.%, and wherein the conductive layer may comprise iron in an amount of at least 2 to 75 wt.%, and molybdenum in an amount of 0 to 20, or 0 to 10, or 0 to 5, or 0 to 2, or 0 to 1 wt.%.

In one aspect, embodiments of the present disclosure may relate to an electrode for a biosensor, wherein the electrode includes a substrate, deposited on the substrateAnd a resistive material layer deposited on the conductive layer, wherein the conductive layer can comprise nickel, chromium, and iron, and can have an fe (ii) [ CN) of less than 400, or less than 375, or less than 350, or less than 325, or less than 300, or less than 275 millivolts (mV) as determined in a 1-line linear sweep voltammetry test (as described in the examples section)]₆An oxidation wave voltage of a mediator (hereinafter identified as E peak, anode), and based on a total weight of the conductive layer equal to 100 wt.%, wherein the conductive layer may comprise nickel in an amount greater than 70 wt.%, chromium in an amount greater than 13 to less than 20 wt.%, wherein a combined weight percentage of nickel and chromium in the conductive layer may be 80 to less than 95 wt.%, or 81 to 94 wt.%, or 82 to 94 wt.%, or 83 to 94 wt.%, or 84 to 94 wt.%, or 85 to 94 wt.%, or 86 to 94 wt.%, and wherein the conductive layer may comprise iron in an amount greater than 5 to less than 12 wt.%, or 6 to 11 wt.%.

In one aspect, embodiments of the present disclosure may relate to an electrode for a biosensor, wherein the electrode comprises a substrate, a conductive layer deposited on the substrate, and a layer of resistive material deposited on the conductive layer, wherein the conductive layer may comprise nickel, chromium, and iron, and may have an fe (ii) ([ CN) of less than 400, or less than 375, or less than 350, or less than 325, or less than 300, or less than 275 millivolts (mV) as determined in a 1-type linear sweep voltammetry test (as described in the examples section)]₆An oxidation wave voltage of a mediator (hereinafter identified as E peak, anode), and based on a total weight of the conductive layer equal to 100 wt.%, wherein the conductive layer may comprise nickel in an amount of 7 to less than 15 wt.%, chromium in an amount of greater than 15 to less than 22 wt.%, wherein the combined weight percentage of nickel and chromium in the conductive layer may be 25 to 33 wt.%, or 25 to less than 33 wt.%, or 26 to 32 wt.%, and wherein the conductive layer may comprise iron in an amount of 60 to less than 75 wt.%, or 61 to 74 wt.%. In one embodiment, the conductive layer may comprise nickel in an amount of 8 to 11 wt.%, or 8 to less than 11 wt.%, or 8 to 10.5 wt.%, chromium in an amount of 17 to 21 wt.%, or 18 to 20 wt.%, based on the total weight of the conductive layer equal to 100 wt.%, wherein the combined weight of nickel and chromium in the conductive layerThe percentage may be 25 to 32 wt%, or 26 to 31 wt%, or 26 to 30.5 wt%, and wherein the conductive layer may comprise iron in an amount of 65 to less than 75 wt%, or 66 to 74 wt%. In one embodiment, the conductive layer may comprise nickel in an amount of 9 to 15 wt.%, or 10 to 14 wt.%, chromium in an amount of 15 to 19 wt.%, or 16 to 18 wt.%, based on the total weight of the conductive layer equal to 100 wt.%, wherein the combined weight percentage of nickel and chromium in the conductive layer may be 25 to 33 wt.%, or 26 to 32 wt.%, and wherein the conductive layer may comprise iron in an amount of 60 to less than 73 wt.%, or 61 to 72 wt.%, or 61.5 to 72 wt.%.

The substrate may comprise any polymer composition known in the art including, but not limited to, at least one polymer selected from the group consisting of: nylon, polyester, copolyester, polyethylene, polypropylene, polyamide; polystyrene, polystyrene copolymers, styrene-acrylonitrile copolymers, acrylonitrile-butadiene-styrene copolymers, poly (methyl methacrylate), acrylic acid copolymers, polyimides, poly (ether-imides); polyphenylene ether or poly (phenylene ether)/polystyrene blends, polystyrene resins; polyphenylene sulfide; polyphenylene sulfide/sulfone; poly (ester-carbonates); a polycarbonate; polysulfones; polysulfone ethers; and poly (ether-ketones); or mixtures of any other of the foregoing polymers.

In one embodiment, the substrate may comprise at least one polyester comprising residues of at least one glycol selected from the group consisting of ethylene glycol, 1, 4-cyclohexanedimethanol, and 2,2,4, 4-tetramethyl-1, 3-cyclobutanediol.

In one embodiment, the substrate may comprise at least one polyester comprising residues of terephthalic acid and/or dimethyl terephthalate and residues of at least one glycol selected from the group consisting of ethylene glycol, 1, 4-cyclohexanedimethanol, and 2,2,4, 4-tetramethyl-1, 3-cyclobutanediol.

In one embodiment, the substrate can comprise at least one polyester comprising an acid component comprising residues of terephthalic acid and isophthalic acid and/or esters thereof, such as dimethyl terephthalate, and a glycol component comprising at least one glycol residue selected from the group consisting of ethylene glycol residues, 1, 4-cyclohexanedimethanol residues, and 2,2,4, 4-tetramethyl-1, 3-cyclobutanediol.

In one embodiment, the substrate may comprise at least one polyester comprising terephthalic acid residues or esters thereof or mixtures thereof, and 1, 4-cyclohexanedimethanol residues.

In one embodiment, the substrate can comprise at least one polyester made from terephthalic acid residues or esters thereof or mixtures thereof, and 1, 4-cyclohexanedimethanol residues and/or 2,2,4, 4-tetramethyl-1, 3-cyclobutanediol residues.

In one embodiment, the substrate can comprise at least one polyester made from terephthalic acid residues or esters or mixtures thereof, 2,4, 4-tetramethyl-1, 3-cyclobutanediol residues and 1, 4-cyclohexanedimethanol residues.

In one embodiment, the substrate can comprise at least one polyester made from terephthalic acid residues or esters or mixtures thereof, 2,4, 4-tetramethyl-1, 3-cyclobutanediol residues and ethylene glycol residues.

In one embodiment, the substrate may comprise at least one polyester comprising terephthalic acid residues or esters or mixtures thereof, ethylene glycol residues, and 1, 4-cyclohexanedimethanol residues.

The conductive layer in the present disclosure may be comprised of a single layer comprising any of the alloy compositions disclosed in the present application. In certain embodiments, the alloy compositions contain an alloy that may be a solid solution of the elements (a single phase), a mixture of metallic phases (two or more solid solutions), or an intermetallic compound with no distinct boundaries between the phases.

One or more embodiments of the present disclosure relate to methods of forming electrodes, for example, electrodes for biosensors. The method includes (a) providing a substrate; (b) providing a conductive layer target; (c) forming a conductive layer on the substrate by physical vapor deposition of at least a portion of the substrate with material from the conductive layer target, thereby forming a conductive layer on the substrate having a conductive layer surface facing away from the substrate; (d) providing a target that produces a resistive material when used as a source material for physical vapor deposition, hereinafter referred to as a "resistive material target"; (e) providing a nitrogen-containing atmosphere for the resistive material target and the surface of the conductive layer; and (f) forming a resistive material layer by physical vapor deposition of at least a portion of the conductive layer (surface) with a material from a resistive material target in a nitrogen-containing atmosphere, thereby forming a resistive material layer on the surface of the conductive layer. For clarity, it should be understood that the resistive material target may have a different composition and/or structure than the deposited resistive material. In an embodiment of the invention, the atmosphere used to deposit the electrical resistance material layer contains a mixture of at least one inert gas (e.g., Ar) and nitrogen. In embodiments of the invention, nitrogen may comprise from about 0.5 to about 50%, 1 to 50%, 5 to 50%, 10 to 50%, 20 to 50%, 10 to 45%, 10 to 40%, or 20 to 40% of the atmosphere (for resistive material deposition) on a partial pressure basis.

In certain embodiments of the present invention, the atmosphere used to deposit the electrical resistance material layer contains at least one inert gas (e.g., Ar) and no other intentionally added gases. However, it is contemplated that small amounts of oxygen or other elements may be present as a sputter source material or as an impurity in the deposition (e.g., sputtering) atmosphere (e.g., from air or water vapor that is not completely removed from the sputtering atmosphere).

In some embodiments of the method, the conductive material can comprise at least 8 wt% nickel, greater than 10 wt% chromium, and at least 2 wt% iron, based on the total weight of the conductive layer equal to 100 wt%, wherein the total combined weight percentage of nickel and chromium in the conductive layer is 25 to less than 95 wt%, or 25 to 90 wt%, or 26 to 89 wt%. In one embodiment, the conductive material may include 0 to 20 wt% molybdenum, based on the total weight of the conductive layer equal to 100 wt%. The resistive material layer may include amorphous carbon and at least one C-N containing species, and may have a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 25nm, or 5 to less than 20 nm. Further, the combined conductive layer and resistive material layer may have a sheet resistance of less than 2000 ohms/square.

In some embodiments of the method, the conductive material can comprise 8 to 72 wt.% nickel, 14 to 20 wt.% chromium, and greater than 5 to 75 wt.% iron, based on the total weight of the conductive layer equal to 100 wt.%, wherein the total combined weight percentage of nickel and chromium in the conductive layer is 25 to less than 95 wt.%, or 25 to 90 wt.%, or 26 to 89 wt.%. The resistive material layer may include amorphous carbon and at least one C-N species and have a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 25nm, or 5 to less than 20 nm. Further, the combined conductive layer and resistive material layer may have a sheet resistance of less than 2000 ohms/square. In addition to nickel, chromium and iron, the conductive layer may also comprise up to 2 wt.% manganese and up to 1 wt.% silicon, based on the total weight of the conductive layer equal to 100 wt.%.

In some embodiments of the method, the conductive material can comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer can be 80 to less than 95 weight%, or 81 to 94 weight%, or 82 to 94 weight%, or 83 to 94 weight%, or 85 to 94 weight%, or 86 to 94 weight%, based on the total weight of the conductive layer equal to 100 weight%. In addition to nickel and chromium, the conductive layer can also include iron, wherein the weight percentage of iron in the conductive layer can be greater than 5 wt.% to less than 12 wt.%, or about 6 to about 11 wt.%, or 6 to 10 wt.%, or 6 to 9 wt.%, or 7 to 10 wt.%, or 7 to 9 wt.%, or about 9 wt.%, based on the total weight of the conductive layer equal to 100 wt.%. The resistive material layer may include amorphous carbon and at least one C-N species and have a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 25nm, or 5 to less than 20 nm. Further, the combined conductive layer and resistive material layer may have a sheet resistance of less than 2000 ohms/square.

In some embodiments of the method, the conductive material can comprise nickel and chromium, wherein the combined weight percentage of nickel and chromium in the conductive layer can be 25 to 33 weight percent, or 25 to less than 33 weight percent, or 26 to 32 weight percent, based on the total weight of the conductive layer equal to 100 weight percent. In addition to nickel and chromium, the conductive layer may also include iron, wherein the weight percentage of iron in the conductive layer may be from 60 wt% to less than 75 wt%, or from about 61 to about 74 wt%, or from greater than 61 to 74 wt%, based on the total weight of the conductive layer equal to 100 wt%. The resistive material layer may include amorphous carbon and at least one C-N species and have a thickness of 5 to 100nm, or 5 to 50 nm, or 5 to 25nm, or 5 to less than 20 nm. Further, the combined conductive layer and resistive material layer may have a sheet resistance of less than 2000 ohms/square.

In some embodiments of the method, the conductive material can comprise 10 to 30 wt.%, or greater than 10 and less than 30 wt.%, or 11 to 29 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 17 to 26 wt%, or greater than 17 to less than 26 wt%, or 18 to 25 wt% chromium; and 2 to 8 wt.%, or greater than 2 and less than 8 wt.%, or 2.5 to 7 wt.% molybdenum.

In some embodiments of the method, the conductive material can comprise 10 to 16 wt.%, or greater than 10 and less than 16 wt.%, or 11 to 15 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 17 to 21 wt%, or greater than 17 to less than 21 wt%, or 18 to 20 wt% chromium; 2 to 5 wt.%, or greater than 2 and less than 5 wt.%, or 3 to 4 wt.% molybdenum; and 55 to 70 wt.%, or greater than 55 to less than 70 wt.%, or 57 to 68 wt.% iron.

In some embodiments of the method, the conductive material can comprise 12.5 to 29 wt.%, or greater than 12.5 and less than 29 wt.%, or 13.5 to 28 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 16 to 24 wt%, or greater than 16 to less than 24 wt%, or 17 to 23 wt% chromium; 3 to 6 wt.%, or greater than 3 and less than 6 wt.%, or 4 to 5 wt.% molybdenum; and 46 to 66 wt.%, or greater than 46 to less than 66 wt.%, or 47 to 65 wt.% iron.

In some embodiments of the method, the conductive material can comprise 16 to 26.5 wt.%, or greater than 16 and less than 26.5 wt.%, or 17 to 25.5 wt.% nickel, based on the total weight of the conductive layer equal to 100 wt.%; 18 to 23 wt%, or greater than 18 to less than 23 wt%, or 19 to 22 wt% chromium; 5 to 8 wt.%, or greater than 5 and less than 8 wt.%, or 6 to 7 wt.% molybdenum; and 41 to 62 wt.%, or greater than 41 to less than 62 wt.%, or 42 to 61 wt.% iron.

In some embodiments of the method, the conductive material does not include any other elemental species (other than those described above) present in an amount greater than 2 wt%, based on a total weight of the conductive layer equal to 100 wt%. In one embodiment, the conductive material further comprises 0.01 to 2.0 wt.% manganese and 0.01 to 1.0 wt.% silicon, based on the total weight of the conductive layer equal to 100 wt.%, and does not comprise any other elemental species present in an amount greater than 0.2, or 0.1, or 0.05 wt.%.

In some embodiments of the method, the electrically conductive material is a metal comprising or made from one or more of the following alloys: stainless Steel (SS) 354 SMO, SS304, SS316, SS 317L, SS 317LM, SS 317LMN, SS 904, SSAL-6XN or SS Alloy 24. In some embodiments of the method, the conductive material is a metal selected from one or more of the following alloys: stainless Steel (SS) 354 SMO, SS304, SS316, SS 317L, SS 317LM, SS 317LMN, SS 904, SS AL-6XN or SS Alloy 24.

One or more embodiments of the present disclosure relate to a method of forming an electrode for a biosensor. The combined conductive and resistive material layers may have a sheet resistance of no more than 5000, 2000, 100, 80, 60, 50, 40, 20, 10, or 5 ohms/square as measured by ASTM F1711-96. In some embodiments, the layer can have a sheet resistance of 1 to 5000 ohms/square, 1 to 4000 ohms/square, 1 to 3000 ohms/square, 1 to 2000 ohms/square, 1 to 1000 ohms/square, 1 to 500 ohms/square, 5 to 100 ohms/square, 5 to 20 ohms/square, 5 to 15 ohms/square, 5 to 10 ohms/square, 10 to 80 ohms/square, 20 to 60 ohms/square, or 40 to 50 ohms/square as measured by ASTM F1711-96. The layer may have a sheet resistance of less than 2000 ohms/square.

Brief description of the drawings

Embodiments of the present disclosure are described herein with reference to the accompanying drawings, wherein:

FIG. 1 is a schematic cross-sectional view of a thin film electrode biosensor assembly according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram of a test strip biosensor assembly of an embodiment of the present disclosure;

FIG. 3 is a graph depicting a cyclic sweep voltammogram of a thin film electrode in a solution containing a mediator and showing the E peak, the anodic point;

FIG. 4 is a graph showing a plot of increasing deposition rate as a function of nitrogen content;

FIG. 5 is a graph showing a plot of discharge voltage as a function of nitrogen content;

FIG. 6 is a graph showing the percentage of C-N species as a function of nitrogen content;

FIG. 7 is a series of curves for X-ray photoelectron spectroscopy testing of different nitrogen content levels;

FIG. 8 is a series of curves for X-ray photoelectron spectroscopy testing of different nitrogen content levels;

FIG. 9 is a graph depicting a linear sweep voltammogram of a thin film electrode comparing the carbon coating sputtered in Ar without a carbon layer and the coating sputtered in Ar with Ar at 50/50 Ar/N in a buffer solution without a mediator₂Carbon-coated stainless steel 316 sputtered in the mixture (in partial pressure);

FIG. 10 is a graph depicting a linear scanning voltammogram of a thin film electrode, in the presence of Fe (II) [ CN ]]₆Buffer solutions of mediators comparing carbon coating sputtered in Ar without carbon layer and carbon coating sputtered in Ar with that used in 50/50 Ar/N₂Carbon-coated stainless steel 316 sputtered in the mixture (in partial pressure);

FIG. 11 is a graph depicting a linear scanning voltammogram of a thin film electrode, in the presence of Fe (II) [ CN ]]₆Comparison of carbon coating sputtered in Ar, for 80/20 Ar/N in buffer solution of mediator₂Carbon coating sputtered in mixture (in partial pressure) and used at 50/50 Ar/N₂Carbon coated stainless steel 304 sputtered in the mixture (by partial pressure);

FIG. 12 is a graph depicting cyclic voltammograms of thin film electrodes, containing [ RuIII (NH)₃)₆]Cl₃The mediator was used in buffer solutions containing 0, 5, 10, 15, 20, 40 and 50% N, respectively₂(by partial pressure) of mixed Ar and N₂Carbon-coated stainless steel 304 sputtered in an atmosphere;

FIG. 13 is a graph showing a plot of coefficient of friction as a function of normal force for a thin film electrode comparing carbon layer-free, carbon coated with sputtered carbon in Ar, and 79/21 Ar/N₂Carbon-coated stainless steel 316 sputtered in the mixture (in partial pressure);

FIG. 14 is a graph depicting the gradient normal force application as a function of distance for a thin film nano scratch test; and

FIGS. 15A-C are images showing the results of a nano-scratch test of thin film electrodes comparing carbon coating without a carbon layer, with carbon sputtered in Ar, and with 79/21 Ar/N at a distance of 200 microns₂Sputtered carbon-coated stainless steel 316 in the mixture (in partial pressure).

Detailed Description

The present invention relates generally to assemblies for electrodes, such as those used in biosensors. The term "biosensor" as used herein shall refer to a device for analyzing a biological sample. In some embodiments, as shown in fig. 1, the biosensor component may be a layered thin film electrode 100 and may generally include a substrate 102, a conductive layer 104 deposited on at least a portion of the substrate 102, and a resistive material layer 106 deposited on at least a portion of the conductive layer 104. In some embodiments, the biosensor may be a medical sensor, such as a glucose measurement system, and the biosensor component may be a test strip for the biosensor. The term "medical sensor" as used herein shall refer to a biosensor for medical monitoring and/or diagnosis. For example, as shown in fig. 2, some embodiments contemplate that the biosensor assembly will include a test strip 110, the test strip 110 including a first electrode 100 separated from a second electrode 100a by a reaction space 112. The first electrode 100 can include a working electrode and the second electrode 100a can include a reference electrode or a counter electrode or a combination of a reference electrode and a counter electrode. Thus, a biological sample (e.g., a drop of blood) can be placed in the reaction space 112 and in electrical contact with the first and second electrodes 100 and 100a for analysis. It should be understood that fig. 2 is not intended to be limiting and shows one possible embodiment of a test strip. Other embodiments of the test strip may include different configurations of one or more electrodes, such as a co-planar electrode configuration. The term "blood glucose sensor" as used herein shall refer to a medical sensor for determining the concentration of glucose in blood. In addition, biological reactants (e.g., proteins, enzymes (e.g., glucose oxidase, glucose dehydrogenase, etc.)) and mediators (e.g., ferricyanide, ruthenium complexes, osmium complexes, quinones, phenothiazines, phenoxazines, etc.) that react with a biological sample can be formed on one or both electrodes (e.g., working electrode).

Unlike conventional physical vapor deposition biosensor components, which typically comprise and/or use noble metals such as palladium and/or gold, the biosensor components described herein may be formed from non-noble metal alloys, such as those comprising nickel and chromium. However, biosensor components (e.g., thin film electrodes) formed from non-noble metal alloys having a layer of resistive material deposited thereon as described herein may exhibit excellent consistency and accuracy when measuring biological samples. Thus, by using a biosensor component composed of a non-noble metal alloy and a layer of resistive material as described herein, the material and manufacturing costs typically associated with the manufacture and use of a biosensor component may be significantly reduced.

Embodiments of the present disclosure provide a substrate 102 formed from any type of material that may be flexible or rigid, is generally electrically non-conductive, and is chemically inert to the intended chemical reactions described herein. In certain embodiments, the substrate 102 of the biosensor assembly may comprise a flexible, non-conductive film, including polymers, such as polymer films, polyester films, polycarbonate films, and the like. In certain particular embodiments, the substrate 102 may comprise a polyethylene terephthalate (PET) film. Embodiments of the present disclosure contemplate that the substrate 102 may have a thickness of at least 25 μm, 125 μm, or 250 μm and/or no more than 800 μm, 500 μm, or 400 μm. In certain embodiments, the substrate 102 may have a thickness of 25 to 800 μm, 25 to 500 μm, or 25 to 400 μm, 125 to 800 μm, 125 to 500 μm, or 125 to 400 μm, or 250 to 800 μm, 250 to 500 μm, or 250 to 400 μm.

The conductive layer 104 coated on the substrate 102 may comprise one or more non-noble metals. Such conductive layers 104 can be coated on the substrate 102 via one or more physical vapor deposition techniques, such as sputter coating (e.g., magnetron sputtering, unbalanced magnetron sputtering, ion beam sputtering, facing target sputtering, etc.), thermal evaporation, electron beam evaporation, arc evaporation, co-evaporation, ion plating, and the like, or combinations thereof. The conductive layer 104 can be coated on the substrate 102 to a thickness of at least 1, 10, 15, or 30 nm and/or no more than 1000, 200, 100, or 50 nm. In some embodiments, the conductive layer 104 may have a thickness of 1 to 1000 nm, 1 to 200 nm, 1 to 100nm, or 1 to 50 nm, 10 to 1000 nm, 10 to 200 nm, 10 to 100nm, or 10 to 50 nm, 15 to 1000 nm, 15 to 200 nm, 15 to 100nm, or 15 to 50 nm, or 30 to 1000 nm, 30 to 200 nm, 30 to 100nm, or 30 to 50 nm.

The resistive material layer 106 can be coated on the conductive layer 104 via one or more physical vapor deposition techniques, such as sputter coating (e.g., magnetron sputtering, unbalanced magnetron sputtering, ion beam sputtering, facing target sputtering, etc.), thermal evaporation, electron beam evaporation, arc evaporation, co-evaporation, ion plating, plasma enhanced vapor deposition, atomic layer deposition, etc., or combinations thereof. In certain embodiments, the layer of resistive material 106 may be coated on the substrate 104 to a thickness of at least 1, 5, 10, or 15 nm and/or no more than 200, 100, 50, 25, 20, less than 20, or 15 nm. In some embodiments, the resistive layer 106 may have a thickness of 1 to 200 nm, 1 to 100nm, 1 to 50 nm, 1 to 20 nm, 1 to less than 20 nm, or 1 to 15 nm; or 5 to 200 nm, 5 to 100nm, 5 to 50 nm, 5 to 25nm, 5 to 20 nm, 5 to less than 20 nm, or 5 to 15 nm; or a thickness of 10 to 200 nm, 10 to 100nm, 10 to 50 nm, or 10 to 25nm, 10 to 20 nm, 10 to less than 20 nm, or 10 to 15 nm.

The conductive layer 104 and the resistive material layer 106 may be deposited on the substrate 102 such that the resulting thin film electrode 100 is generally opaque to visible light. For example, the resulting thin-film electrode 100 can have a visible light transmission of no more than 50%, no more than 40%, no more than 30%, or no more than 20% as measured by ASTM D1003. In certain embodiments, the resulting thin film electrode 100 can have a visible light transmittance of 1 to 50%, 10 to 40%, 15 to 30%, or about 20%. In addition, the resulting thin film electrode 100 can have a sheet resistance of no more than 5000, 2000, 100, 80, 60, 50, 40, 20, 10, or 5 ohms/square as measured by ASTM F1711-96. In some embodiments, the resulting thin film electrode 100 can have a sheet resistance of 1 to 5000 ohms/square, 2 to 2000 ohms/square, 5 to 100 ohms/square, 10 to 80 ohms/square, 20 to 60 ohms/square, or 40 to 50 ohms/square.

The non-noble metals described herein that form the conductive layer 104 may comprise an alloy of nickel and chromium. For example, a non-noble metal alloy comprising at least 4, or 5, or 6, or 8 wt% nickel and at least 10 wt% chromium is used to prepare the conductive layer 104 of the biosensor component, wherein the conductive layer is further coated by depositing a resistive material layer 106 (comprising amorphous carbon and at least one C-N species) on the conductive layer 104. Table 1 includes alloys containing nickel and chromium used to make electrodes comprising a conductive layer and a resistive material layer. The prepared electrical resistance material layer includes a layer containing amorphous carbon and at least one C-N substance. It should be understood that, unless otherwise explicitly stated, the weight percentages provided herein for the elements contained in the conductive layer are based solely on the total weight of the conductive layer and do not include the elements contained in the resistive layer.

In addition to the alloys described in table 1, in certain embodiments, the amount of nickel and chromium and the amount of elements included in the non-noble metal alloy comprising the conductive layer of the electrode (e.g., the conductive layer 104 of the biosensor component) may vary depending on the particular requirements of the electrode (e.g., the biosensor component). In various embodiments, the non-noble metal alloy can include at least about 4, or 5, or 6, or 8 to about 72 wt% nickel. Further, in various embodiments, the non-noble metal alloy can include at least about 10, 13, 14, and/or up to about 30, 25, 20, 19, 18, or 17 weight percent chromium. More particularly, in embodiments, the non-noble metal alloy may include about 12 to 30, 12 to 25, 13 to 20, 13 to 19, 13 to 18, 13 to 17, 14 to 20, 14 to 19, 14 to 18, or 14 to 17 weight percent chromium.

In various embodiments, the non-noble metal alloy can comprise at least about 5 to about 95 weight percent nickel. Further, in various embodiments, the non-noble metal alloy can include at least about 5, 10, 20, greater than 20, 25, 30, 40, 50, or greater than 50, 60 and/or up to about 95, 90, 80, 70, 60, greater than 50, or 40 weight percent chromium. More particularly, in embodiments, the first and second electrodes, the non-noble metal alloy may comprise chromium in an amount of about 5 to 95, 10 to 90, 10 to 80, 10 to 70, 10 to 60, 10 to 50, 10 to 40, 20 to 90, 20 to 80, 20 to 70, 20 to 60, 20 to 50, 20 to 40, greater than 20 to 90, greater than 20 to 80, greater than 20 to 70, greater than 20 to 60, greater than 20 to 50, greater than 20 to 40, 25 to 90, 25 to 80, 25 to 70, 25 to 60, 25 to 50, 25 to 40, 30 to 90, 30 to 80, 30 to 70, 30 to 60, 30 to 50, 30 to 40, 40 to 90, 40 to 80, 40 to 70, 40 to 60, 40 to 50, 50 to 90, 50 to 80, 50 to 70, 50 to 60, greater than 50 to 95, greater than 50 to 90, greater than 50 to 80, greater than 50 to 70, greater than 50 to 60, 60 to 95, 60 to 90, 60 to 80, 60 to 70, 70 to 95, 80 to 80, 80 to 90, or 90 wt%. In one embodiment, the balance of the alloy, other than the amount of chromium as specified above, is nickel. It will be appreciated that the alloy contains nickel and chromium in a combined amount of 100% by weight of the alloy, the alloy still containing minor amounts of other elements as impurities.

In certain embodiments, the amount of nickel and chromium contained in the non-noble metal alloy that makes up the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 10 to 95 weight percent chromium and 5 to 90 weight percent nickel; 10 to 90 weight percent chromium and 10 to 90 weight percent nickel; or 10 to 80 weight percent chromium and 20 to 90 weight percent nickel; or 10 to 70 weight percent chromium and 30 to 90 weight percent nickel; or 10 to 60 weight percent chromium and 40 to 90 weight percent nickel; or 10 to 50 weight percent chromium and 50 to 90 weight percent nickel, or 10 to 40 weight percent chromium and 60 to 90 weight percent nickel; or 20 to 90 weight percent chromium and 10 to 80 weight percent nickel; or 20 to 80 weight percent chromium and 20 to 80 weight percent nickel; or 20 to 70 weight percent chromium and 30 to 80 weight percent nickel; or 20 to 60 weight percent chromium and 40 to 80 weight percent nickel; or 20 to 50 weight percent chromium and 50 to 80 weight percent nickel; or 20 to 40 weight percent chromium and 60 to 80 weight percent nickel; or from greater than 20 to 90 weight percent chromium and from 10 to less than 80 weight percent nickel; or from greater than 20 to 80 weight percent chromium and from 20 to less than 80 weight percent nickel; or from greater than 20 to 70 weight percent chromium and from 30 to less than 80 weight percent nickel; or from greater than 20 to 60 weight percent chromium and from 40 to less than 80 weight percent nickel; or from greater than 20 to 50 weight percent chromium and from 50 to less than 80 weight percent nickel; or from greater than 20 to 40 weight percent chromium and from 60 to less than 80 weight percent nickel; or 25 to 90 weight percent chromium and 10 to 75 weight percent nickel; or 25 to 80 weight percent chromium and 20 to 75 weight percent nickel; or 25 to 70 weight percent chromium and 30 to 75 weight percent nickel; or 25 to 60 weight percent chromium and 40 to 75 weight percent nickel; or 25 to 50 weight percent chromium and 50 to 75 weight percent nickel; or 25 to 40 weight percent chromium and 60 to 75 weight percent nickel; or 30 to 90 weight percent chromium and 10 to 70 weight percent nickel; or 30 to 80 weight percent chromium and 20 to 70 weight percent nickel; or 30 to 70 weight percent chromium and 30 to 70 weight percent nickel; or 30 to 60 weight percent chromium and 40 to 70 weight percent nickel; or 30 to 50 weight percent chromium and 50 to 70 weight percent nickel; or 30 to 40 weight percent chromium and 60 to 70 weight percent nickel; or 40 to 90 weight percent chromium and 10 to 60 weight percent nickel; or 40 to 80 weight percent chromium and 20 to 60 weight percent nickel; or 40 to 70 weight percent chromium and 30 to 60 weight percent nickel; or 40 to 60 weight percent chromium and 40 to 60 weight percent nickel; or 40 to 50 weight percent chromium and 50 to 60 weight percent nickel; or from 50 to 95% by weight of chromium and from 5 to 50% by weight of nickel, from 50 to 90% by weight of chromium and from 10 to 50% by weight of nickel; or from 50 to 80 weight percent chromium and from 20 to 50 weight percent nickel; or from 50 to 70 weight percent chromium and from 30 to 50 weight percent nickel; or 50 to 60 weight percent chromium and 40 to 50 weight percent nickel; or from greater than 50 to 95 weight percent chromium and from 5 to less than 50 weight percent nickel; or from greater than 50 to 90 weight percent chromium and from 10 to less than 50 weight percent nickel; or from greater than 50 to 80 weight percent chromium and from 20 to less than 50 weight percent nickel; or from greater than 50 to 70 weight percent chromium and from 30 to less than 50 weight percent nickel; or from greater than 50 to 60 weight percent chromium and from 40 to less than 50 weight percent nickel; or 60 to 95 weight percent chromium and 5 to 40 weight percent nickel; or 60 to 90 weight percent chromium and 10 to 40 weight percent nickel; or 60 to 80 weight percent chromium and 20 to 40 weight percent nickel; or 60 to 70 weight percent chromium and 30 to 40 weight percent nickel; or 70 to 95 weight percent chromium and 5 to 30 weight percent nickel; or 70 to 90 weight percent chromium and 10 to 30 weight percent nickel; or 70 to 80 weight percent chromium and 20 to 30 weight percent nickel; or 80 to 95 weight percent chromium and 5 to 20 weight percent nickel; or 80 to 90 weight percent chromium and 10 to 20 weight percent nickel; all of these weight percentages are based on the total weight percentage of the conductive layer equal to 100 weight%.

In certain embodiments, the conductive layer, if present, contains molybdenum in an amount of 0 to 2, or 0 to 1 weight percent, based on the total weight of the conductive layer. In certain embodiments, the conductive layer, if present, contains molybdenum in an amount of less than 1, or less than 0.8, or less than 0.6, or less than 0.4, or less than 0.2, or less than 0.1 weight percent, based on the total weight of the conductive layer. In embodiments, the conductive layer is substantially free of molybdenum. In embodiments, the conductive layer does not contain molybdenum.

In certain embodiments, the conductive layer contains less than 1.0, or less than 0.5, or less than 0.2 weight percent of each of the following elemental species: iron, carbon, sulfur, phosphorus, molybdenum, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: carbon, sulfur, phosphorus, molybdenum, niobium, cobalt, aluminum, titanium, or boron. In certain embodiments, the conductive layer comprises nickel and chromium, and contains less than 1.0, or less than 0.5, or less than 0.2, or less than 0.1, or less than 0.05 weight percent of any other elemental species. In certain embodiments, the conductive layer comprises nickel and chromium, and contains a total amount of all other elemental species of less than 2.0, or less than 1.0, or less than 0.5, or less than 0.2, or less than 0.1, or less than 0.05 weight percent.

In certain embodiments, the amount of nickel and chromium contained in the non-noble metal alloy that makes up the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 10 to 30 weight percent chromium and 4 to 81 weight percent nickel; 10 to 30 weight percent chromium and 8 to 81 weight percent nickel; or 10 to 25 weight percent chromium and 8 to 81 weight percent nickel; or 12 to 25 weight percent chromium and 8 to 81 weight percent nickel; or 13 to 23 weight percent chromium and 8 to 81 weight percent nickel; or 13 to 21 weight percent chromium and 8 to 81 weight percent nickel; or 14 to 20 weight percent chromium and 8 to 81 weight percent nickel; or 12 to 25 weight percent chromium and 8 to 75 weight percent nickel; or 13 to 23 weight percent chromium and 8 to 75 weight percent nickel; or 13 to 21 weight percent chromium and 8 to 75 weight percent nickel; or 14 to 20 weight percent chromium and 8 to 75 weight percent nickel; or 12 to 25 weight percent chromium and 8 to 72 weight percent nickel; or 13 to 23 weight percent chromium and 8 to 72 weight percent nickel; or 13 to 21 weight percent chromium and 8 to 72 weight percent nickel; or 14 to 20 weight percent chromium and 8 to 72 weight percent nickel. In certain embodiments, these metal alloys may also include at least 2 wt.% iron; or 2 to 75 weight percent iron, or 3 to 75 weight percent iron; or 4 to 75 weight percent iron; or 5 to 75 weight percent iron.

In certain embodiments, the amount of nickel and chromium contained in the non-noble metal alloy that makes up the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 12 to 25 weight percent chromium and 70 to 81 weight percent nickel; or 13 to 20 weight percent chromium and 70 to 81 weight percent nickel; or 13 to 19 weight percent chromium and 70 to 81 weight percent nickel; or 13 to 18 weight percent chromium and 70 to 81 weight percent nickel; or 13 to 17 weight percent chromium and 70 to 81 weight percent nickel, or 14 to 20 weight percent chromium and 70 to 81 weight percent nickel; or 14 to 19 weight percent chromium and 70 to 81 weight percent nickel; or 14 to 18 weight percent chromium and 70 to 81 weight percent nickel; or 14 to 17 weight percent chromium and 70 to 81 weight percent nickel; or 13 to 20 weight percent chromium and 71 to 81 weight percent nickel; or 13 to 19 weight percent chromium and 71 to 81 weight percent nickel; or 13 to 18 weight percent chromium and 71 to 81 weight percent nickel; or 13 to 17 weight percent chromium and 71 to 81 weight percent nickel; or 14 to 20 weight percent chromium and 71 to 81 weight percent nickel; or 14 to 19 weight percent chromium and 71 to 81 weight percent nickel; or 14 to 18 weight percent chromium and 71 to 81 weight percent nickel; or 14 to 17 weight percent chromium and 71 to 81 weight percent nickel; or 13 to 20 weight percent chromium and 72 to 81 weight percent nickel; or 13 to 19 weight percent chromium and 72 to 81 weight percent nickel; or 13 to 18 weight percent chromium and 72 to 81 weight percent nickel; or 13 to 17 weight percent chromium and 72 to 81 weight percent nickel; or 14 to 20 weight percent chromium and 72 to 81 weight percent nickel; or 14 to 19 weight percent chromium and 72 to 81 weight percent nickel; or 14 to 18 weight percent chromium and 72 to 81 weight percent nickel; or 14 to 17 weight percent chromium and 72 to 81 weight percent nickel; or 13 to 18 weight percent chromium and 70 to 80 weight percent nickel; or 13 to 17 weight percent chromium and 70 to 80 weight percent nickel; or 14 to 18 weight percent chromium and 70 to 80 weight percent nickel; or 14 to 17 weight percent chromium and 70 to 80 weight percent nickel; or 13 to 18 weight percent chromium and 71 to 80 weight percent nickel; or 13 to 17 weight percent chromium and 71 to 80 weight percent nickel; or 14 to 18 weight percent chromium and 71 to 80 weight percent nickel; or 14 to 17 weight percent chromium and 71 to 80 weight percent nickel; or 13 to 18 weight percent chromium and 72 to 80 weight percent nickel; or 13 to 17 weight percent chromium and 72 to 80 weight percent nickel; or 14 to 18 weight percent chromium and 72 to 80 weight percent nickel; or 14 to 17 weight percent chromium and 72 to 80 weight percent nickel; all of these weight percentages are based on the total weight percentage of the conductive layer equal to 100 weight%. In certain embodiments, these metal alloys may also include at least 5 weight percent iron; or 5 to 12 weight percent iron, or 6 to 12 weight percent iron; or 6 to 11 weight percent iron.

In certain embodiments, the amount of nickel and chromium contained in the non-noble metal alloy that makes up the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 14 to 22 weight percent chromium and 7 to 15 weight percent nickel; or 15 to 21 weight percent chromium and 7 to 15 weight percent nickel; or 16 to 20 weight percent chromium and 7 to 15 weight percent nickel; or 14 to 22 weight percent chromium and 8 to 14 weight percent nickel; or 15 to 21 weight percent chromium and 8 to 14 weight percent nickel; or 16 to 20 weight percent chromium and 8 to 14 weight percent nickel. In certain embodiments, these metal alloys may also include at least 61 wt.% iron; or 61 to 75 weight percent iron, or 61 to 74 weight percent iron; or 61.5 to 75 weight percent iron. In some embodiments, the conductive layer comprises 17 to 21 weight percent chromium and 7 to 11 weight percent nickel; or 18 to 20 weight percent chromium and 7 to 11 weight percent nickel; or 17 to 21 weight percent chromium and 8 to 11 weight percent nickel; or 18 to 20 weight percent chromium and 8 to 11 weight percent nickel; or 18 to 20 weight percent chromium and 8 to 10.5 weight percent nickel; and in embodiments, the conductive layer further comprises 65 to 75 weight percent iron, or 66 to 74 weight percent iron; or greater than 66 up to 75 weight percent iron. In some embodiments, the conductive layer comprises 17 to 19 weight percent chromium and 9 to 15 weight percent nickel; or 16 to 18 weight percent chromium and 9 to 15 weight percent nickel; or 17 to 19 weight percent chromium and 10 to 14 weight percent nickel; or 16 to 18 weight percent chromium and 10 to 14 weight percent nickel; and in embodiments, the conductive layer further comprises 60 to 73 weight percent iron, or 61 to 72 weight percent iron; or greater than 61.5 up to 72 wt.% iron.

The non-noble metal alloy that makes up the conductive layer of the electrode (e.g., the biosensor component) may also include iron. In various embodiments, the non-noble metal alloy may comprise at least about 2, 3, 4, 5, 6, or 7 and/or up to about 80, 75, or 74 weight percent iron. In certain embodiments, the non-noble metal alloy can include 2 to less than 80, or approximately 2 to 75, 3 to 75, 4 to 75, 5 to 75, 6 to 75, 7 to 75, 2 to 74, 3 to 74, 4 to 74, 5 to 77, 6 to 74, 7 to 74 weight percent iron, based on the total weight of the conductive layer equal to 100 weight percent. In certain embodiments, the non-noble metal alloy may comprise at least about 5, 6, or 7 and/or up to about 12, 11, 10, or 9 wt.% iron. In certain embodiments, the non-noble metal alloy can include greater than 5 to less than 12, or about 6 to 11, 6 to 10, 6 to 9, 7 to 11, 7 to 10, 7 to 9, or about 9 wt.% iron, based on the total weight of the conductive layer equal to 100 wt.%. In certain embodiments, the non-noble metal alloy may comprise at least about 60, 61, 62, 63, 64, 65, or 66 and/or up to about 80, 78, 76, 75, or 74 wt.% iron. In certain embodiments, the non-noble metal alloy can include 60 to 80, or approximately 61 to 79, or 61 to 75, or 61 to 74, or 61 to 73, or 61 to 72, or 62 to 78, or 63 to 77, or 64 to 76, or 65 to 75, or 65 to less than 74, or 66 to less than 75, or 66 to 74 weight percent iron, based on the total weight of the conductive layer equal to 100 weight percent.

In certain embodiments, non-noble metal alloys may comprise, in addition to nickel, chromium, and iron that may be present in the present invention, one or more of group I: manganese and copper, and/or one or more of group II: carbon and silicon. All weight percentages of metal alloys useful in the present invention are based on the total weight percentage of material in the conductive layer equal to 100 weight%.

In certain embodiments, the conductive layer may further comprise at least about 0.001, 0.01, or 0.1 and/or up to 2.0, 1.5, 1.0, 0.9, 0.8, 0.7, or 0.6 weight percent manganese. In certain embodiments, the non-noble metal alloy may comprise about 0.001 to 2.0, less than about 2.0, 0.001 to 1.0, 0.01 to 1.0, 0.1 to 1.0, or less than about 1.0 wt.% manganese.

In certain embodiments, the conductive layer may further comprise at least about 0.001, 0.01, 0.1, or 0.2 and/or up to about 1.0, 0.5, 0.4, or 0.3 weight percent copper. In certain embodiments, the non-noble metal alloy may comprise about 0.001 to 1.0, less than about 1.0, 0.001 to 0.5, 0.01 to 0.5, 0.1 to 0.5, or less than about 0.5 wt% copper.

In certain embodiments, the conductive layer may further comprise up to 3.0, 2.5, 2.0, 1.5, 1.0, 0.5, 0.3, 0.2, 0.1, 0.05, or 0.015 wt% silicon. In certain embodiments, the conductive layer may comprise up to 0.15 wt.% carbon.

In certain embodiments, the conductive layer, if present, contains molybdenum in an amount of 0 to 20, 0 to 15, 0 to 13, 0 to 10, 0 to 5, 0 to 4, 0 to 3, 0 to 2.5, 0 to 2, or 0 to 1 weight percent, based on the total weight of the conductive layer. In certain embodiments, the conductive layer, if present, contains molybdenum in an amount of less than 1, or less than 0.8, or less than 0.6, or less than 0.4, or less than 0.2, or less than 0.1 weight percent, based on the total weight of the conductive layer. In embodiments, the conductive layer is substantially free of molybdenum. In embodiments, the conductive layer does not contain molybdenum.

In certain embodiments, the conductive layer contains 2 to 10, or 2 to 8, or 2 to 7.5, or 2 to 7.0, or 2 to 6.5, or 2.5 to 8, or 2.5 to 7.5, or 2.5 to 7.0, or 2.5 to 6.5, or 3 to 8, or 3 to 7.5, or 3 to 7.0, or 3 to 6.5, or 3.5 to 8, or 3.5 to 7.5, or 3.5 to 7.0, or 3.5 to 6.5, or 4 to 8, or 4 to 7.5, or 4 to 7.0, or 4 to 6.5, or 4.5 to 8, or 4.5 to 7.5, or 4.5 to 7.0, or 4.5 to 6.5 weight percent molybdenum. In certain embodiments, the conductive layer contains 2 to 6.5, or 2 to 6.0, or 2 to 5.5, or 2 to 5, or 2 to 4.5, or 2 to 4, or 2.5 to 6.5, or 2.5 to 6.0, or 2.5 to 5.5, or 2.5 to 5, or 2.5 to 4.5, or 2.5 to 4, or 3 to 6.5, or 3 to 6.0, or 3 to 5.5, or 3 to 5, or 3 to 4.5, or 3 to 4, or 3.5 to 6.5, or 3.5 to 6.0, or 3.5 to 5.5, or 3.5 to 4.5, or 4 to 6.5, or 4 to 6.0, or 4 to 5.5, or 4 to 5, or 4.5 to 6, or 4.5 to 5.5, or 5 to 6, or 4.5 to 5.5, or 6.5 to 6, or 5 to 6 wt% molybdenum.

In certain embodiments, the conductive layer contains less than 0.2 wt% of each of the following elemental species: carbon, sulfur, phosphorus, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer does not contain the following elemental species: niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer contains less than 0.2 wt% of each of the following elemental species: carbon, sulfur, phosphorus, molybdenum, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, or boron. In one embodiment, the conductive layer does not contain the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, or boron.

In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, phosphorus, or boron, or in embodiments where any species are present, the amount of such species is less than 0.25 wt.%, or less than 0.2 wt.%, or less than 0.1 wt.%, or less than 0.05 wt.%, or trace amounts or less. In certain embodiments, the conductive layer is free or substantially free of the following elemental species: molybdenum, niobium, cobalt, aluminum, titanium, phosphorus, or boron. In one embodiment, the conductive layer is free or substantially free of the following elemental species: molybdenum, copper, niobium, cobalt, aluminum, titanium, or boron, or in embodiments where any species are present, the amount of such species is less than 0.25 wt.%, or less than 0.2 wt.%, or less than 0.1 wt.%, or less than 0.05 wt.%, or trace amounts or less. In certain embodiments, the conductive layer is free or substantially free of the following elemental species: molybdenum, copper, niobium, cobalt, aluminum, titanium, or boron.

In certain embodiments, the amount of nickel, chromium, and iron included in the non-noble metal alloy comprising the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 10 to 30 weight percent chromium, 8 to 75 weight percent nickel, and 2 to 75 weight percent iron; or 10 to 25 weight percent chromium, 8 to 75 weight percent nickel, and 3 to 75 weight percent iron; or 10 to 25 weight percent chromium, 8 to 75 weight percent nickel, and 4 to 75 weight percent iron; or 10 to 25 weight percent chromium, 8 to 75 weight percent nickel, and 5 to 75 weight percent iron; or 13 to 21 weight percent chromium, 8 to 73 weight percent nickel, and 6 to 75 weight percent iron, or 14 to 20 weight percent chromium, 8 to 72 weight percent nickel, and 6 to 74 weight percent iron, all based on a total weight percent of the conductive layer equal to 100 weight percent.

In certain embodiments, the amount of nickel, chromium, and iron included in the non-noble metal alloy comprising the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 13 to 25 weight percent chromium, 70 to 81 weight percent nickel, and greater than 5 to less than 12 weight percent iron; or 13 to 20 weight percent chromium, 70 to 81 weight percent nickel, and 6 to 11 weight percent iron; or 13 to 18 weight percent chromium, 70 to 81 weight percent nickel, and 6 to 11 weight percent iron; or 14 to 17 weight percent chromium, 70 to 81 weight percent nickel, and 6 to 11 weight percent iron; or 13 to 18 weight percent chromium, 72 to 81 weight percent nickel, and 6 to 11 weight percent iron, or 14 to 17 weight percent chromium, 72 to 81 weight percent nickel, and 6 to 11 weight percent iron; or 14 to 17 weight percent chromium, 72 to 81 weight percent nickel, and 6 to 10 weight percent iron, all based on a total weight percent of the conductive layer equal to 100 weight percent.

In certain embodiments, the amount of nickel, chromium, and iron included in the non-noble metal alloy comprising the conductive layer of the electrode (e.g., the biosensor component) may vary with the particular requirements of the biosensor component as follows: 14 to 22 weight percent chromium, 7 to 15 weight percent nickel, and 60 to 75 weight percent iron; or 15 to 21 weight percent chromium, 7 to 15 weight percent nickel, and 61 to 75 weight percent iron; or 16 to 20 weight percent chromium, 7 to 15 weight percent nickel, and 61 to 75 weight percent iron; or 16 to 20 weight percent chromium, 8 to 14 weight percent nickel, and 61 to 75 weight percent iron; or 16 to 20 weight% chromium, 8 to 14 weight% nickel and 61 to 74 weight% iron, or 16 to 20 weight% chromium, 8 to 14 weight% nickel and 61.5 to 74 weight% iron, all based on the total weight percentage of the conductive layer equal to 100 weight%. In some embodiments, the conductive layer of the electrode may comprise: 16 to 22 weight percent chromium, 7 to 12 weight percent nickel, and 65 to 75 weight percent iron; or 17 to 21 weight percent chromium, 7 to 12 weight percent nickel, and 65 to 75 weight percent iron; or 18 to 20 weight percent chromium, 7 to 12 weight percent nickel, and 65 to 75 weight percent iron; or 16 to 22 weight percent chromium, 8 to 12 weight percent nickel, and 65 to 75 weight percent iron; or 16 to 22 weight percent chromium, 8 to 11 weight percent nickel, and 65 to 75 weight percent iron, or 18 to 20 weight percent chromium, 8 to 11 weight percent nickel, and 66 to 74 weight percent iron, all based on a total weight percent of the conductive layer equal to 100 weight percent. In some embodiments, the conductive layer of the electrode may comprise: 14 to 20 weight percent chromium, 8 to 16 weight percent nickel, and 60 to 74 weight percent iron; or 15 to 19 weight percent chromium, 8 to 16 weight percent nickel, and 60 to 74 weight percent iron; or 16 to 18 weight percent chromium, 8 to 16 weight percent nickel, and 60 to 74 weight percent iron; or 14 to 20 weight percent chromium, 9 to 15 weight percent nickel, and 60 to 74 weight percent iron; or 14 to 20 weight% chromium, 10 to 14 weight% nickel and 60 to 74 weight% iron, or 16 to 18 weight% chromium, 10 to 14 weight% nickel and 61 to 72 weight% iron, all based on the total weight percentage of the conductive layer equal to 100 weight%.

The conductive layer in the present disclosure may be comprised of a single layer comprising any of the alloy compositions disclosed in the present application. In certain embodiments, the alloy compositions contain alloys that may be solid solutions of elements (single phases), mixtures of metallic phases (two or more solid solutions), or intermetallic compounds with no distinct boundaries between the phases.

As will be readily understood by those skilled in the art, the elements of the non-noble metal alloy may contain incidental impurities. As used herein, "incidental impurities" refers to any impurities that are naturally present in the ore used to make the non-noble metal alloy or that are inadvertently added during production. The non-noble metal alloy may include less than about 0.1, 0.05, or 0.001 wt.% incidental impurities.

The non-noble metal alloys described herein may also contain one or more additional alloying elements, which do not include the elements described above. However, in various embodiments, the non-noble metal alloy may be substantially free of such additional alloying elements. As used herein, the terms "substantially free" and "substantially free" mean that the non-noble metal alloy contains less than 0.001 weight percent of such additional alloying components. Furthermore, the terms "substantially free" and "substantially free" may be used interchangeably.

In various embodiments, the layer of resistive material comprises at least one C — N species in an amount greater than 20 atomic percent (at%), or greater than 25 atomic percent, or greater than 30 atomic percent as determined by X-ray photoelectron spectroscopy (XPS) analysis (as described in the examples section below). In embodiments, the electrical resistance material layer contains less than 20, or less than 15, or less than 14, or less than 13, or less than 12, or less than 11 atomic percent of C-O species as determined by XPS analysis.

In certain embodiments of the present disclosure, the biosensor components described herein can be prepared by performing the following steps:

(a) providing a substrate;

(b) providing a conductive layer target;

(c) forming a conductive layer on the substrate by physical vapor deposition of at least a portion of the substrate with material from the target, thereby forming a conductive layer on the substrate having a conductive layer surface facing away from the substrate;

(d) providing a target of resistive material;

(e) providing a nitrogen-containing atmosphere for the resistive material target and the surface of the conductive layer; and

(f) forming a resistive material layer by physical vapor depositing at least a portion of the conductive layer with a material from a resistive material target in a nitrogen-containing atmosphere, thereby forming a resistive material layer on a surface of the conductive layer.

Providing the substrate of step (a) may comprise providing any type of substrate material as previously described, such as PET. In certain embodiments, the substrate will comprise a sheet of substrate material that can be driven (activated) in a high vacuum chamber. The sheet of base material may comprise a single segment of material, such as a square sheet. In some other embodiments, the sheet of base material may comprise a roll of material that passes through the high vacuum chamber via a roll-to-roll configuration, as will be described in detail below. In other embodiments, as will also be described below, the substrate may remain stationary, or it may rotate and/or orbit during deposition.

Providing the target of step (b) can include providing a physical vapor deposition target comprising any of the non-noble metal alloys described previously. For example, in some embodiments, a physical vapor deposition target comprising the alloys listed in table 1 is used to fabricate a thin film conductive layer. Such alloy targets may include less than about 0.1, 0.05, or 0.001 weight percent incidental impurities. In some embodiments, during the physical vapor deposition process, the physical vapor deposition target will be housed within an electrode and/or will comprise an electrode, such as a sputtering cathode. In certain embodiments, the physical vapor deposition target can be circular, having a diameter of at least 2,4, 8, 12, 16, or 20 cm. In other embodiments, the physical vapor deposition target can be a tubular target having an inner diameter of at least 2,4, 8, or 16cm and an outer diameter of 20, 24, 28, or 32 cm. In still other embodiments, the physical vapor deposition target can be rectangular, having the following dimensions: a width of 5 to 25 cm, a length of 25 to 75 cm and a thickness of 0.3 to 5 cm. However, it should be understood that embodiments of the present disclosure contemplate the use of targets of other shapes and sizes.

The physical vapor deposition of step (c) generally includes coating the substrate with material from the non-noble metal alloy target to form an electrically conductive layer. The term "physical vapor deposition" as used herein shall mean the deposition of a thin film by condensing vaporized material onto a substrate. The pvd coating may be performed using any type of pvd process previously described, i.e., sputter coating, thermal evaporation, e-beam evaporation, arc evaporation, co-evaporation, ion plating, and the like. For example, in some embodiments, the physical vapor deposition step will be performed via a sputtering process in which a non-noble metal alloy target is sputtered via a sputtering apparatus to coat the substrate with a conductive layer. Specific examples of such sputtering type of physical vapor deposition will be described in more detail below. The resulting substrate with the conductive layer coated thereon can be used as a biosensor component, such as an electrode. Such electrodes may include a working electrode, a reference electrode, and/or a counter electrode. In certain embodiments, for example, when a roll of substrate material is vacuum coated with a conductive layer via a roll-to-roll physical vapor deposition process, the resulting thin film sheet can be cut to the appropriate size to form a thin film electrode having the particular dimensions for the biosensor component. In other embodiments, the biosensor component may be formed from the thin film sheet by etching, such as chemical or laser etching (or ablation). In still other embodiments, the biosensor component may be formed using a patterned mask that is laid over a substrate and on which the conductive layer is physically vapor deposited to form the conductive layer of the biosensor component.

Providing the target of step (d) can include providing a physical vapor deposition target comprising the electrically resistive material described previously. For example, in some embodiments, a physical vapor deposition target comprising carbon is used to fabricate a thin film amorphous carbon containing layer. Such resistive material targets may include less than about 0.1, 0.05, or 0.001 weight percent incidental impurities. In embodiments, the target may comprise a material that may be different from the deposited resistive layer material, but which yields the resistive material when used as a source material for physical vapor deposition. It should be understood that the resistive material target may have a different composition and/or structure than the resistive material being deposited. In some embodiments, the physical vapor deposition target will be housed within an electrode and/or will comprise an electrode, such as a sputtering cathode, during the physical vapor deposition process. In certain embodiments, the physical vapor deposition target can be circular, having a diameter of at least 2,4, 8, 12, 16, or 20 cm. In other embodiments, the physical vapor deposition target can be a tubular target having an inner diameter of at least 2,4, 8, or 16cm and an outer diameter of 20, 24, 28, or 32 cm. In still other embodiments, the physical vapor deposition target can be rectangular, having the following dimensions: a width of 5 to 25 cm, a length of 25 to 75 cm and a thickness of 0.3 to 5 cm. However, it should be understood that embodiments of the present disclosure contemplate the use of targets of other shapes and sizes.

The provision of the nitrogen-containing atmosphere of step (e) may be carried out in a vacuum chamber of a physical vapor deposition apparatus (or apparatus), wherein the chamber is initially brought to vacuum and subsequently filled with a mixture of inert gas and nitrogen. In certain embodiments, nitrogen may constitute from about 0.5 to about 50%, 1 to 50%, 5 to 50%, 10 to 50%, 20 to 50%, 10 to 45%, 10 to 40%, or about 20 to about 40% of the atmosphere (in the chamber) on a partial pressure basis. In one embodiment, the gas mixture is argon and nitrogen, where the amount of nitrogen can be selected.

The physical vapor deposition of step (f) generally includes coating the substrate with material from the resistive material target to form a layer of resistive material. The term "physical vapor deposition" as used herein shall mean the deposition of a thin film by condensing vaporized material onto a substrate. The pvd coating may be performed using any type of pvd process previously described, such as sputter coating, thermal evaporation, e-beam evaporation, arc evaporation, co-evaporation, ion plating, and the like. For example, in some embodiments, the physical vapor deposition step will be performed via a sputtering process in which a target of resistive material is sputtered via a sputtering apparatus to coat the conductive layer (previously deposited on the substrate) with a layer of resistive material. Specific examples of such sputtering type of physical vapor deposition will be described in more detail below. The resulting substrate having the conductive layer and the resistive material layer coated thereon can be used as a biosensor component, such as an electrode. In embodiments, the "resistive material" layer is typically a layer other than a conductive layer, forming a layered structure with distinct interfaces between the layers, such that the resistive material layer and the conductive layer are each separate and distinct layers, having different compositions.

In one aspect of the invention, a method of modulating the electron transfer kinetics of a thin film electrode is provided, wherein the partial pressure of nitrogen in a nitrogen-containing atmosphere (in conjunction with the methods of forming an electrode described herein) is selected to tune the heterogeneous electron transfer kinetics of the electrode to obtain the desired profile of a linear scan or cyclic voltammogram. It may be advantageous to provide electrodes with slower electron transfer kinetics for certain applications.

In certain embodiments, for example, when a roll of substrate material is vacuum coated with a conductive layer via a roll-to-roll physical vapor deposition process, and then the conductive layer surface is vacuum coated with a layer of resistive material, the resulting thin film sheet can be cut to the appropriate size to form a thin film electrode having the particular dimensions for the biosensor component. Such electrodes may include a working electrode, a reference electrode, and/or a counter electrode. Electrodes may also include those used to detect conductivity of a sample, whether or not a sample is applied to the biosensor assembly, or other electrical characteristics of the sample or sample environment that may be used in the biosensor. In other embodiments, the biosensor component may be formed from the thin film sheet by etching, such as chemical or laser etching. In still other embodiments, the biosensor component may be formed using a patterned mask that is laid over the substrate and/or conductive layer and onto which a conductive layer and/or resistive material layer is physically vapor deposited to form the biosensor component.

In certain embodiments, the biosensor component may be produced via a roll-to-roll physical vapor deposition process, including roll-to-roll magnetron sputtering. For example, a base sheet (25 to 250 μm in thickness and 33.02 cm in width) comprising a polymer film made of PET (polyethylene terephthalate) may be sputtered using a web roll-to-roll magnetron sputter coater 77.50 cm in width (such as Smartweb coater supplied by Applied Materials, inc. or Mark 80 supplied by chan industries, inc.). Single target or dual target configurations can be used to deposit non-noble goldA conductive layer of a metal alloy (e.g., certain alloys from table 1). Targets consisting of non-noble metal alloy plates (such as available from Tricor industries inc.) may be used. The vacuum chamber of the sputter coater can be pumped to at least 10 using a combination of diffusion and mechanical pumps^-5Base pressure of Torr. In other embodiments, a combination of mechanical pumps, turbo pumps, cryogenic pumps, and/or oil diffusion pumps may be used. A magnetron sputtering cathode containing a non-noble metal alloy target having a generally rectangular shape can be powered using a 2 KW power supply (as provided by Advanced Energy inc.). The argon flow into the vacuum chamber can be controlled (e.g., via MKS model 1179A flow controller) to set the sputtering pressure to 3 to 10 mtorr for use during the sputtering process.

The thickness and sheet resistance of the sputtered conductive layer can be effectively controlled in-situ by controlling certain process parameters. Examples of process parameters include roll-to-roll web speed (i.e., the speed at which the base sheet is controlled as it passes through the vacuum chamber during sputtering), electrical energy provided to the sputtering target (i.e., the product of voltage and current applied to the plasma formed near the target surface), gas pressure in the sputtering chamber, and the number of targets present in the chamber. For example, for sputtering of a conductive layer of a given alloy, the web speed can be set to 0.1 to 3.5 meters per minute and the sputtering power density set to 1 to 8 watts per square centimeter. In an embodiment, a sputtered conductive layer of an alloy having a measured thickness value of about 25nm and a sheet resistance of about 45 ohms/square may be formed. In some embodiments, it is contemplated that the layer thickness can be controlled by real-time measurement (e.g., optical monitoring) and feedback to the deposition process.

The resistive material layer may be deposited on top of the conductive layer via one of the deposition techniques described above. For example, in one embodiment, the resistive layer may be deposited using DC magnetron sputtering from a carbon target. The thickness of the resistive material layer may be controlled by controlling certain process parameters. Examples of process parameters include roll-to-roll web speed (i.e., the speed at which the base sheet is controlled as it passes through the vacuum chamber during sputtering), electrical energy provided to the sputtering target (i.e., the product of voltage and current applied to the plasma formed near the target surface), gas pressure in the sputtering chamber, and the number of targets present in the chamber. For example, in certain embodiments, the web speed may be set to 0.1 to 3.5 meters per minute and the sputtering power density set to 1 to 8 watts per square centimeter for sputtering of a resistive layer of a given alloy. In embodiments, a sputtered resistive layer may be formed having measured thickness values of about 1-200 nm. It has also been found that the thickness and deposition rate of the carbon-containing resistive material can be varied by adjusting the partial pressure of nitrogen in the nitrogen-containing atmosphere of the vacuum chamber.

In an embodiment of the invention, the atmosphere used to deposit the electrical resistance material layer contains a mixture of at least one inert gas (e.g., Ar) and nitrogen. In embodiments of the invention, nitrogen may constitute from about 0.5 to about 50%, 1 to 50%, 5 to 50%, 10 to 50%, 20 to 50%, 10 to 45%, about 10 to about 40%, about 20 to about 40%, 10 to 40%, or 20 to 40% of the atmosphere (for resistive material deposition) on a partial pressure basis. It has been found that the deposition rate of carbon-containing resistive materials is a function of increasing nitrogen partial pressure (e.g., in a mixture of Ar and N)₂In an atmosphere), but appears to be at about 40% N₂The partial pressure reaches the saturation point, where additional N is present₂The deposition rate cannot be further increased.

It has also been found that nitrogen is enhanced during the carbonaceous resistive material deposition step (e.g., in the presence of mixed Ar and N₂In an atmosphere) may result in a thin film electrode having a reduced coefficient of friction and improved scratch resistance compared to a similar conductive layer film (without a resistive material layer) or a similar film having a carbon-containing resistive material layer deposited in a pure Ar atmosphere (from the same resistive material source).

In addition to the roll-to-roll process described above, the biosensor component may be manufactured using a large scale roll-to-roll process, using an enlarged version of the same geometry. In such large scale roll-to-roll processes, the maximum web velocity may be from 0.1 to 10 meters per minute, for example from 3 to 7 meters per minute, or above 10 meters per minute. The large scale roll-to-roll process can provide a sputtering power density of 0.1 to 13, 2 to 10, or 5 to 8 watts per square centimeter. Further, the number of targets can include 2,4, 6, or more, and the web width of the base sheet can be 75 centimeters or more. In an embodiment of the invention, the depositing steps of the conductive layer and the resistive material layer may each be performed by a sputtering system operating at a power of 1.5 to 40 kW, or 1.75 to 18 kW, or 1.75 to 9 kW, or about 2 kW. While embodiments having specific ranges have been provided above, it should be understood that deposition is controlled by the applied power and that the rates (deposition and web speeds) are proportional to the power. Thus, it is desirable to operate at the highest power available for a given material, whereby a stable process (thermal mitigation, cathode stability, voltage and current limits of the power supply, arcing) can be established. The resulting voltage for a given applied power depends on the composition of the target material, i.e. is mainly determined by the secondary electron yield of the material. Embodiments additionally contemplate that a physical vapor deposition process may be used in which batches of substrate sheet are moved orbitally and/or rotationally in a vacuum chamber. Certain such embodiments are described in detail below in the examples section. In some embodiments where the base sheet is deposited batchwise (e.g., suitably including, but not limited to, orbital and/or rotational movement), the deposition time for depositing the conductive layer on the base sheet may be 5, 10, 15, 30 minutes, or more.

As previously mentioned, the biosensor components described herein that include a conductive layer formed from the non-noble metal alloy and a resistive material layer formed from a carbon material (in a nitrogen-containing atmosphere) can exhibit desirable electrochemical properties, which makes them particularly suitable as a replacement for biosensor components that incorporate noble metals, such as palladium and/or gold. For example, a biosensor component of an embodiment of the present disclosure may include a thin film electrode formed with a non-noble metal alloy conductive layer and a resistive material layer that exhibits desirable dose response characteristics when tested by chronoamperometry.

In various embodiments, the conductive layer can comprise nickel, chromium, and iron (in the amounts described above), and the conductive layer in combination with the resistive material layer can have a linear sweep voltammetry test at 1 (e.g., as described above)Less than 400, or less than 390, or less than 380, or less than 375, or less than 360, or less than 350, or less than 340, or less than 330, or less than 325, or less than 320, or less than 310, or less than 300, or less than 290, or less than 280, or less than 275, or less than 270, or less than 260 millivolts (mV) of Fe (II) ([ CN) (-) [ CN) ]determined in the examples section)]₆Oxidation wave voltage of the mediator (hereinafter identified as E)_{Peak, anode}）。

In one embodiment of the invention, the conductive layer comprises nickel, chromium, and iron (in the amounts described above), and the conductive layer in combination with the resistive material layer may have an fe (ii) [ CN) of less than 275 millivolts (mV) as determined in a 1-type linear sweep voltammetry test (as described in the examples section)]₆Oxidation wave voltage of the mediator (hereinafter identified as E)_{Peak, anode}）。

The invention may be further illustrated by the following examples of embodiments of the invention, although it will be understood that these examples are included merely for purposes of illustration and are not intended to limit the scope of the invention unless otherwise specifically indicated.

Examples

Preparation of thin film electrodes

For each of the following examples (and comparative examples), biosensor components in the form of thin film electrodes were formed by the following physical vapor deposition process. It is to be understood that the following process may be used to form thin film electrodes to include conductive layers of a variety of different types of elements and alloys of elements (e.g., non-noble metal compositions listed in table 1). The thin-film electrode of this embodiment further comprises a layer of resistive material comprising carbon, or a resistive layer comprising carbon and at least one C-N substance, deposited on top of the conductive layer. The method includes forming a thin film electrode film as follows:

(a) depositing a metal or metal alloy on a 10.16 cm x 10.16 cm square PET base sheet using direct current ("DC") magnetron sputtering in a high Vacuum chamber, with sputtering being performed with a Denton Vacuum Desktop Pro sputtering apparatus;

(b) evacuating the vacuum chamber to-10 deg.C^-5An initial base pressure of Torr;

(c) introducing 10 sccm of argon gas into the high vacuum chamber to generate a deposition pressure of-5 mTorr;

(d) rotating the base sheet in the vacuum chamber at about 2 revolutions per minute;

(e) a 5.08 cm diameter target of metal or metal alloy is kept under a DC magnetron sputtering device at a constant power of 40 watts for a deposition time of 15 minutes in order to coat at least a portion of the substrate sheet with a conductive layer (to initialize the target, the target is kept under a DC magnetron sputtering device at a constant power of 40 watts for a pre-sputtering time of 5 minutes, followed by introducing the substrate into a vacuum chamber);

(f) after depositing the conductive layer, evacuating the vacuum chamber to-10 deg.C^-5An initial base pressure of Torr;

(g) 10 sccm of argon or a mixture of argon and nitrogen (varying the amount of nitrogen depending on the embodiment) was introduced into the high vacuum chamber to produce a deposition pressure of 5 mTorr;

(h) a carbon-containing layer is then deposited onto the surface of the conductive layer. Maintaining a 5.08 cm diameter target of graphite material at a constant power of 48 watts for a deposition time of 1 hour under a DC magnetron sputtering apparatus in order to coat at least a portion of the conductive layer (deposited in step e) with a carbon-containing layer (to initialize the target, the target is maintained at a constant power of 48 watts for a pre-sputtering time of 5 minutes under a DC magnetron sputtering apparatus, followed by introducing the conductive layer coated substrate into a vacuum chamber); and

(i) all depositions were performed at room temperature (i.e., -25 ℃).

A similar procedure is performed in a roll-to-roll apparatus, where three sputtering targets are used in the differentially pumped deposition zone. In the first target area, a metal or metal alloy film is deposited using an Ar atmosphere. The carbon-containing layer is deposited under a specific argon/nitrogen atmosphere in the second and third target zones.

Individual thin-film electrodes having a size of 5.08 cm × 7.62cm were cut from the thin-film electrode film formed by physical vapor deposition as provided above. Electrochemical experiments were performed using a Gamry Instruments Reference 600 potentiostat in a three-electrode configuration in which the electrochemical cell containing the thin film electrode membrane was located inside a Gamry Instruments vistashield faraday cage. Each thin film electrode was formed as a working electrode by partially masking the thin film electrode with a plating tape having a die-cut single 3 mm diameter hole. Thus, the unmasked portions formed by the die-cut holes of the thin-film electrodes provide a geometric working electrode surface area of 0.0707 square centimeters. A different area of the unmasked portion of the thin film electrode serves as an electrical connection point for the working electrode lead of the potentiostat. The masked portions of the film electrodes are placed on a flat support block of a non-conductive material, such as plastic. The thin film electrode was then placed in the working electrode port of a glass electrochemical cell. The exposed 3 mm diameter portion of the membrane electrode was placed near the center of the bottom opening of the working electrode port of the electrochemical cell. The working electrode port of the electrochemical cell is sealed with a clamp and an O-ring. The electrochemical cell also includes a reference electrode comprising a saturated calomel reference electrode and a carbon auxiliary electrode. The reference electrode and the auxiliary electrode are placed in the reference electrode port and the auxiliary electrode port, respectively. In addition, the reference electrode and the auxiliary electrode are connected to a reference lead and an auxiliary lead of the potentiostat, respectively. The electrochemical cell also includes a gas flow port through which the test solution is degassed and blanketed with an inert gas (e.g., nitrogen). It should be noted that nitrogen is considered to be an inert gas for the electrochemical cell reaction, but is not considered to be inert to the plasma reaction that occurs during the deposition process (described above).

Thin film electrodes were prepared from stainless steel 304 and 316 alloys (both with and without a carbon-containing resistive material layer), respectively, according to the procedure discussed above. The thin film electrodes were prepared from stainless steel 317L and AL-6XN alloys, respectively, with a carbon-containing electrical resistance material layer according to the procedure discussed above, but no test data was provided. Although not presented in the experimental section herein, it is believed that other conductive layer alloys (e.g., Inconel 600) and other alloys containing Ni and Cr can be used in order to provide electrodes useful in accordance with the present invention.

The stainless steel alloy compositions are listed in table 1 below. The thin film electrodes having conductive layers as listed in table 1 also included carbon-containing resistive layers prepared according to the procedure described above. The carbon resistive layer thickness was approximately 15 to 45 nm (depending on the embodiment) as determined by TEM imaging of a cross-sectional electrode.

Table 1: alloy (Source: www.matweb.com)

Denotes the maximum concentration.

1 description of Linear sweep voltammetry test

Type 1 linear sweep voltammetry tests can be used to test the electrochemical response of thin film electrodes. The 1-type linear sweep voltammetry test comprises the following steps: 50 ml of 10 mM potassium phosphate buffer containing 145 mM sodium chloride at pH 7.1 were placed in the electrochemical cell, and the electrochemical cell was sealed with a stopper. Gas inlet and outlet fittings associated with the gas flow ports enable inert gas sparging (i.e., degassing) of the buffer solution via a nitrogen gas flow using a mesoporous filter rod. The airflow port additionally allows airflow to be switched from the filter rod to the headspace covering arrangement. The gas outlet is connected to an oil bubbler to prevent back-diffusion of external gas (e.g. air) into the electrochemical cell. The buffer solution was stirred with a magnetic stir bar while bubbling with nitrogen for at least 5 minutes, after which the gas flow was switched to the blanket configuration. During the electrochemical experiments performed via the type 1 linear sweep voltammetry test, there was no agitation of the buffer solution (i.e., the solution was stationary during the electrochemical test) due to bubbling or other causes.

Linear sweep voltammetry tests were performed on thin film electrodes including the working electrode in an electrochemical cell. The initial voltage potential of the linear sweep voltammetry, as measured between the working electrode and the reference electrode (i.e., the saturated calomel reference electrode), was 0V relative to the open circuit potential (also referred to as the rest potential) and after a rest period of at least 10 seconds prior to the voltammetry experiment, the voltage potential was anodically scanned at 25 mv/sec until a current of at least 50 μ Α was observed. For the Fe (II) containing [ CN ]]₆Solution of mediatorThe mediator is present at a concentration of 1 or 2 mM, and the linear sweep voltammetry conditions are otherwise identical to those of the mediator-free solution.

Determination of the Peak Voltage of the Oxidation wave ("E_{Peak, anode}") wherein such E_{Peak, anode}Defined as the voltage at which a local maximum current is observed due to oxidation of the electroactive species in solution, as measured between the working and counter electrodes relative to the reference electrode. The oxidation wave and associated E obtained from the thin film electrode using 1-line linear sweep voltammetry is illustrated in FIG. 3_{Peak, anode}Examples of (2). As can be seen from FIG. 3, the measured E_{Peak, anode}(or E-peak) values were about-76 mV, as measured against a reference electrode.

Description of type 1 cyclic voltammetry test

The type 1 cyclic voltammetry test can be used to test the electrochemical response of the thin film electrode. The type 1 cyclic voltammetry test comprises the following steps: 50 ml of 10 mM potassium phosphate buffer containing 145 mM sodium chloride at pH 7.1 were placed in the electrochemical cell, and the electrochemical cell was sealed with a stopper. Gas inlet and outlet fittings associated with the gas flow ports enable inert gas sparging (i.e., degassing) of the buffer solution via a nitrogen gas flow using a mesoporous filter rod. The airflow port additionally allows airflow to be switched from the filter rod to the headspace covering arrangement. The gas outlet is connected to an oil bubbler to prevent back-diffusion of external gas (e.g. air) into the electrochemical cell. The solution was stirred with a magnetic stir bar while bubbling with nitrogen for at least 5 minutes, then the gas flow was switched to the blanket configuration. During the electrochemical experiments performed via the type 1 cyclic voltammetry test, there was no agitation of the buffer solution (i.e., the solution was stationary during the electrochemical test) due to bubbling or other causes.

Cyclic voltammetry is performed on a thin film electrode comprising a working electrode in an electrochemical cell. The initial voltage potential of linear sweep voltammetry, as measured between the working electrode and the reference electrode (i.e., the saturated calomel reference electrode), is 0V relative to the open circuit potential (also referred to as the rest potential) and at least 10 seconds prior to the voltammetry experimentAfter the rest period, the voltage potential was scanned cathodically at a scan rate of 25 mv/sec, followed by scanning of the anodic potential. For the Fe (II) containing [ CN ]]₆A solution of mediator, the mediator being present at a concentration of 1 or 2 mM, and the cyclic sweep voltammetry conditions are otherwise the same as the conditions for the mediator-free solution.

X-ray photoelectron spectroscopy (XPS)

All X-ray photoelectron spectroscopy (XPS) data were collected using a Kratos Axis Nova spectrometer. Data was processed with CasaXPS software version 2.3.17. Prior to data collection, the sample surface was cleaned in situ with a Gas Cluster Ion Source (GCIS) using the following conditions: mode-argon cluster (10 kV 1000 Ar +), grating-1 mm × 1 mm, etch time-60 seconds. Quantification is based on a broad scan measurement spectrum and is reported in relative atomic mole%. All measurement spectra were collected using the following conditions: x-ray source-Al K_αA monochromatic source, operated at 150W (15 kV, 10 mA), passed energy-80 eV, acceptance angle-15 ℃ in spectral mode, divergence angle-90 ℃, analysis area-700X 300 μm, charge neutralization-on, charge correction-C1 s 284.8 eV.

Narrow scan (high resolution) spectra were collected using a 20 eV pass energy for the C1 s region of the spectrum.

To determine the carbon structure, the C1 s shell was fitted by sequential addition and subsequent fitting of synthetic peaks until a residual STD < 2 was achieved. Furthermore, the FWHM was limited to < 1.4 eV for peaks b.e. < 288 eV and < 2.0 eV for peaks b.e. > 288 eV.

Transmission Electron Microscopy (TEM)

Narrow scan (high resolution) spectra of the relevant elements were collected for peak fitting to elucidate the oxidation state/chemical environment. These narrow scan spectra are collected using the same parameters described above for the wide scan, except by energy. Unless otherwise stated, narrow scan spectra were collected using 20 eV pass energy. The depth distribution parameters are: mode-argon cluster (10 kV 1000 Ar +), grating-1 mm x 1 mm, etch time/period-30 seconds, total number of cycles-65, and high resolution spectral data were collected for carbon, oxygen and chromium between etches.

The film samples were cut into approximately 2X 5 mm pieces and embedded in EpoFix Cold set epoxy systems (Electron Microcopy Sciences) under a nitrogen atmosphere for at least 12 hours. The sample was then trimmed and segmented by a microtome to produce a 100nm thick cross section of the film. The resulting 100nm thick section was transferred onto a TEM gate. The samples were imaged in bright field TEM mode using a JEOL 2100F transmission electron microscope operated at an accelerating voltage of 200 keV. Data were collected with a 2.5 kx4 k Gatan Orius fiber optically coupled to a CCD camera and processed with Gatan digital micrograph software.

Nano scratch and coefficient of friction test

The scratch test was conducted via a progressive load scratch test using a Bruker UMT tribometer in order to evaluate the cohesion and adhesion properties of various sputtered films on top of the PET substrate. All samples were scratched with a 12.5 μm diamond cone tip. The tip of the needle was moved over the sample surface at a rate of 16 mN/min with a linearly increasing load of from 3 mN to 50 mN. At a scratch speed of 0.33 mm/min, the overall scratch length was 1 mm. A small prescan load of 2.5 mN was applied to ensure complete contact with the sample. The normal force (Fz) and tangential force (Fx) were recorded and used to calculate the coefficient of friction (COF = Fx/Fz). The damage events were examined via Scanning Electron Microscopy (SEM). The critical load of damage is strongly related to adhesion, mechanical properties of the material and internal stress.