阅读说明：本技术 电子装置 (Electronic device ) 是由 丁焕熹 朴容焕 金演泰 金兑俊 于 2017-06-30 设计创作，主要内容包括：提供了一种电子装置,所述电子装置包括基底、突出图案、第一导电图案、绝缘层和第二导电图案。突出图案设置在基底上。第一导电图案设置在基底上并且覆盖突出图案。绝缘层设置在第一导电图案上。绝缘层包括与突出图案的至少一部分叠置的开口。第二导电图案设置在绝缘层上。第二导电图案通过开口连接到第一导电图案。(An electronic device is provided that includes a substrate, a protrusion pattern, a first conductive pattern, an insulating layer, and a second conductive pattern. The protrusion pattern is disposed on the substrate. The first conductive pattern is disposed on the substrate and covers the protrusion pattern. The insulating layer is disposed on the first conductive pattern. The insulating layer includes an opening overlapping at least a portion of the protrusion pattern. The second conductive pattern is disposed on the insulating layer. The second conductive pattern is connected to the first conductive pattern through the opening.)

1. An electronic device, the electronic device comprising:

a pixel array including a substrate, a display layer disposed on the substrate, and an encapsulation layer disposed on the display layer, the encapsulation layer including an organic layer and an inorganic layer;

a touch array disposed directly on the encapsulation layer, the touch array comprising: a sensing pattern configured to detect a touch provided from the outside; a line electrically connected to the sensing pattern and including a first conductive pattern and a second conductive pattern disposed on the first conductive pattern; and a touch insulating layer disposed between the first conductive pattern and the second conductive pattern; and

a protrusion pattern disposed between the substrate and the first conductive pattern;

wherein:

the touch insulating layer includes an opening defined in an area overlapping at least a portion of the protrusion pattern;

the second conductive pattern contacts the first conductive pattern through the opening;

a predetermined area for sensing an external touch and a peripheral area surrounding the predetermined area are defined in the touch array;

the sensing pattern is disposed in the predetermined region; and is

The line is disposed in the peripheral region.

2. The electronic device of claim 1, wherein the pattern of protrusions extends in a first direction, and

portions of each of the first and second conductive patterns overlapping the protrusion pattern extend in a second direction crossing the first direction.

3. The electronic device of claim 2, wherein the opening extends along the second direction.

4. The electronic device of claim 2, wherein the opening extends in the first direction.

5. The electronic device according to claim 4, wherein the opening overlaps with an entire surface of the protrusion pattern in a plan view.

6. The electronic device according to claim 2, wherein the opening is provided in plurality, and the plurality of openings are spaced apart in the second direction.

7. The electronic device according to claim 6, wherein the second conductive pattern includes a plurality of recessed portions recessed corresponding to shapes of the plurality of openings.

8. The electronic device of claim 7, wherein the plurality of recesses are defined in a border area of the protrusion pattern.

9. The electronic device of claim 1, wherein the touch array further comprises a bridge pattern electrically connected to the sensing pattern,

the bridge pattern is disposed on the same layer as the first conductive pattern, and

the sensing pattern is disposed on the same layer as the second conductive pattern.

10. The electronic device according to claim 1, wherein the protrusion pattern overlaps the peripheral region in a plan view.

11. The electronic device of claim 1, wherein the protrusion pattern comprises an organic material.

12. An electronic device, the electronic device comprising:

a display array comprising a substrate, a display layer disposed on the substrate, and an encapsulation layer disposed on the display layer;

a first protrusion pattern disposed on the substrate;

a sensing pattern disposed on the display array and spaced apart from the first protrusion pattern;

a first conductive pattern electrically connected to the sensing pattern, and a portion of the first conductive pattern overlaps the first protrusion pattern;

a touch insulating layer covering the first conductive pattern and having an opening defined therein to overlap at least a portion of the first protrusion pattern; and

a second conductive pattern disposed on the touch insulating layer and contacting the first conductive pattern through the opening.

13. The electronic device of claim 12, further comprising a second protrusion pattern disposed on the substrate and spaced apart from the first protrusion pattern, wherein the first and second conductive patterns overlap the second protrusion pattern.

14. The electronic device of claim 13, wherein the touch insulating layer further defines an additional opening that overlaps at least a portion of the second protrusion pattern, and the second conductive pattern contacts the first conductive pattern through the additional opening.

15. The electronic device of claim 13, wherein a height of the first protrusion pattern is lower than a height of the second protrusion pattern.

16. The electronic device of claim 13, wherein a number of layers comprising the first protrusion pattern is different from a number of layers comprising the second protrusion pattern.

17. The electronic device of claim 12, wherein the touch insulating layer overlaps the display layer, and the sensing pattern is disposed directly on the touch insulating layer.

18. The electronic device of claim 12, wherein the first protrusion pattern is spaced apart from the display layer in plan view.

19. The electronic device of claim 12, wherein the portion of the first conductive pattern is curved along a shape of the first protrusion pattern.

Technical Field

Exemplary embodiments relate to an electronic device, and more particularly, to an electronic device having improved reliability.

Background

The electronic device may be activated by receiving an electrical signal. The electronic device may include a display device for displaying an image and/or a touch screen for detecting a touch applied from the outside, or the like. To this end, the electronic device may include various conductive patterns to be activated by an electrical signal. The shape or characteristics of the conductive pattern may directly affect the driving efficiency of the electronic device.

The above information disclosed in this background section is only for enhancement of understanding of the background of the inventive concept and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

One or more exemplary embodiments provide an electronic device including a conductive pattern having improved reliability.

Additional aspects will be set forth in the detailed description which follows, and in part will be obvious from the disclosure, or may be learned by practice of the inventive concepts.

According to one or more exemplary embodiments, an electronic device includes a substrate, a protrusion pattern, a first conductive pattern, an insulating layer, and a second conductive pattern. The protrusion pattern is disposed on the substrate. The first conductive pattern is disposed on the substrate and covers the protrusion pattern. The insulating layer is disposed on the first conductive pattern. The insulating layer includes an opening overlapping at least a portion of the protrusion pattern. The second conductive pattern is disposed on the insulating layer. The second conductive pattern is connected to the first conductive pattern through the opening.

According to an exemplary embodiment, an electronic device includes a substrate, an insulating pattern, a conductive pattern, and an insulating layer. The insulating pattern is disposed on the substrate. The insulating pattern protrudes away from the substrate in at least a first direction. The conductive pattern is disposed on the substrate. The conductive pattern covers the insulating pattern. The insulating layer is disposed between the conductive pattern and the insulating pattern. The insulating layer includes an opening overlapping at least a portion of the insulating pattern. The conductive pattern includes a recessed portion.

The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter.

Drawings

The accompanying drawings, which are included to provide a further understanding of the inventive concepts, are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concepts and together with the description serve to explain the principles of the inventive concepts.

Fig. 1A is a perspective view of an electronic device according to one or more exemplary embodiments.

Fig. 1B is an exploded perspective view of the electronic device of fig. 1A, according to one or more exemplary embodiments.

Fig. 2 is a perspective view of an electronic device according to one or more exemplary embodiments.

Fig. 3A is a cross-sectional view taken along section line I-I' of fig. 1A according to one or more exemplary embodiments.

Fig. 3B is a cross-sectional view taken along section line II-II' of fig. 1A in accordance with one or more exemplary embodiments.

Fig. 3C is a cross-sectional view taken along section line III-III' of fig. 1A according to one or more exemplary embodiments.

Fig. 4A and 4B are cross-sectional views of an electronic device according to one or more exemplary embodiments.

Fig. 5A and 5B are cross-sectional views of an electronic device according to one or more exemplary embodiments.

Fig. 6A is a perspective view of an insulating layer according to one or more exemplary embodiments.

Fig. 6B is a cross-sectional view of an electronic device according to one or more example embodiments.

Fig. 7A is a perspective view of an electronic device according to one or more exemplary embodiments.

Fig. 7B is an exploded perspective view of the electronic device of fig. 7A according to one or more exemplary embodiments.

Fig. 7C is a cross-sectional view taken along section line IV-IV' of fig. 7A according to one or more exemplary embodiments.

Fig. 8 is an exploded perspective view of an electronic device according to one or more exemplary embodiments.

Fig. 9A, 9B, and 9C are plan views of various layers of a touch array in accordance with one or more exemplary embodiments.

Fig. 10A is a plan view of area AA in fig. 9A-9C according to one or more exemplary embodiments.

Fig. 10B is a cross-sectional view taken along section line V-V of fig. 10A in accordance with one or more exemplary embodiments.

Fig. 10C is a cross-sectional view taken along section line VI-VI' of fig. 10A according to one or more exemplary embodiments.

Fig. 11A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments.

Fig. 11B is a cross-sectional view taken along section line V-V of fig. 11A in accordance with one or more exemplary embodiments.

FIG. 11C is a cross-sectional view taken along section line VI-VI' of FIG. 11A in accordance with one or more exemplary embodiments.

Fig. 12A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments.

Fig. 12B is a cross-sectional view taken along section line V-V of fig. 12A according to one or more exemplary embodiments.

Fig. 12C is a cross-sectional view taken along section line VI-VI' of fig. 12A according to one or more exemplary embodiments.

Fig. 13A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments.

Fig. 13B is a cross-sectional view taken along section line V-V of fig. 13A in accordance with one or more exemplary embodiments.

Fig. 13C is a cross-sectional view taken along section line VI-VI' of fig. 13A according to one or more exemplary embodiments.

14A, 14B, and 14C are plan views of various layers of a touch array in accordance with one or more exemplary embodiments.

Fig. 15A is a cross-sectional view of region BB in fig. 14A-14C according to one or more exemplary embodiments.

Fig. 15B is a cross-sectional view of region CC in fig. 14A-14C according to one or more example embodiments.

Fig. 16A and 16B are plan views of a portion of an electronic device according to one or more example embodiments.

Fig. 17A, 17B, 17C, 17D, 17E, 17F, and 17G are cross-sectional views of an electronic device at various stages of manufacture according to one or more exemplary embodiments.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various exemplary embodiments. It may be evident, however, that the various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various exemplary embodiments.

Unless otherwise stated, the illustrated exemplary embodiments are to be understood as exemplary features providing varying details of various exemplary embodiments. Thus, unless otherwise specified, the various illustrated features, components, modules, layers, films, panels, regions, and/or aspects may be otherwise combined, separated, exchanged, and/or rearranged without departing from the disclosed exemplary embodiments. Further, in the drawings, the size and relative sizes of layers, films, panels, regions, and the like may be exaggerated for clarity and illustrative purposes. While example embodiments may be practiced differently, the specific process sequences may be performed in a different order than that described. For example, two processes described in succession may be executed substantially concurrently or in the reverse order to that described. In addition, like reference numerals denote like elements.

When an element or layer is referred to as being "on," "connected to" or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. Further, the DR1 axis, DR2 axis, and DR3 axis are not limited to three axes of a rectangular coordinate system, but may be interpreted in a broader sense. For example, the DR1 axis, DR2 axis, and DR3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" can be construed as any combination of two or more of X only, Y only, Z only, or X, Y and Z, such as XYZ, XYY, YZ, and ZZ, for example. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Although the terms "first," "second," etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.

Spatially relative terms, such as "below … …," "below … …," "below," "above … …," and "upper" may be used herein for purposes of illustration to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below … …" can encompass both an orientation of above and below. Further, the devices may be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when the terms "comprises" and/or "comprising" and variations thereof are used in this specification, the presence of stated features, integers, steps, operations, elements, components and/or groups thereof is stated, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.

Various exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will typically have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation occurs. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Unless expressly defined as such, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

Fig. 1A is a perspective view of an electronic device according to one or more exemplary embodiments. Fig. 1B is an exploded perspective view of the electronic device of fig. 1A, according to one or more exemplary embodiments. Fig. 2 is a perspective view of an electronic device according to one or more exemplary embodiments. Fig. 3A, 3B, and 3C are cross-sectional views taken along section lines I-I ', II-II ', and III-III ' of fig. 1A, respectively, according to one or more exemplary embodiments. Hereinafter, an electronic device according to one or more exemplary embodiments will be described with reference to fig. 1A to 3C.

The electronic device EA includes a substrate SB, a protrusion pattern PP, an insulating layer IL, and a conductive pattern CP. The substrate SB may have a plate-like shape, for example, a quadrangular shape including two sides extending in the first direction DR1 and two sides extending in the second direction DR2 crossing the first direction DR 1. The upper surface SB-US of the substrate SB may include a flat surface in a plane defined by the first direction DR1 and the second direction DR2 crossing each other. In this way, the substrate SB may provide a flat upper surface SB-US on the upper side of the substrate SB. The substrate SB may include an insulating material. For example, the substrate SB may include at least one of glass, plastic, and a plurality of thin films including an inorganic film and/or an organic film.

Although not shown, an additional insulating layer and/or conductive layer may also be disposed between the substrate SB and the protrusion pattern PP. Note, however, that the upper surface SB-US of the substrate SB may correspond to the uppermost surface on which the protrusion pattern PP is disposed.

The protrusion pattern PP is disposed on the substrate SB. The protrusion pattern PP may contact the upper surface SB-US of the substrate SB. The protrusion pattern PP may be disposed on the flat surface to protrude relatively higher than the surrounding in the third direction DR3 (hereinafter, referred to as an upward direction). The protrusion pattern PP may have various shapes. According to one or more exemplary embodiments, the protrusion pattern PP may have a trapezoidal-shaped cross-section in a plane defined by the second direction DR2 and the third direction DR 3. However, the exemplary embodiments are not limited to or by the shape of the protrusion pattern PP. For example, the protrusion pattern PP may have various shapes protruding upward from the upper surface SB-US of the substrate SB.

The protrusion pattern PP may include various materials. For example, the protrusion pattern PP may include an organic material. The protrusion pattern PP may have a relatively higher height than that of the inorganic layer to increase the protrusion degree of the protrusion pattern PP with respect to the upper surface SB-US of the substrate SB. However, the exemplary embodiments are not limited to or by the material of the protrusion pattern PP. For example, the protrusion pattern PP may include an inorganic material, both of an inorganic material and an organic material, and the like.

The insulating layer IL is disposed on the substrate SB. At least a portion of the insulating layer IL overlaps the protrusion pattern PP. According to one or more exemplary embodiments, the insulating layer IL may have various shapes. For example, as shown in fig. 1B, the insulating layer IL may have a certain pattern shape covering the protrusion pattern PP. Accordingly, the insulating layer IL may overlap the protrusion pattern PP and expose a portion (e.g., a majority) of the upper surface SB-US of the substrate SB. As another example, as shown in fig. 2, the insulating layer IL-a of the electronic device EA-a may be provided as a layer covering the upper surface SB-US of the substrate SB, and may include a portion IL-P defining or covering the protrusion pattern PP. In this way, the protrusion pattern PP may not be exposed to the outside through the insulating layer IL-a and the conductive pattern CP.

With continued reference to fig. 1A-3C, the insulating layer IL may be electrically insulating. In this manner, the insulating layer IL may include various insulating materials. According to one or more exemplary embodiments, the insulating layer IL may have a thickness relatively smaller than a thickness or height of the protrusion pattern PP. Accordingly, a portion of the insulating layer IL disposed on the protrusion pattern PP may form a surface bent upward along the shape of the protrusion pattern PP.

An opening IL-OP having a certain size and shape may be defined in the insulating layer IL. The opening IL-OP may overlap at least a portion of the protrusion pattern PP, thereby exposing the protrusion pattern PP. According to one or more exemplary embodiments, the opening IL-OP may include a region in which a portion of the insulating layer IL is removed and a profile exposed by the removed region. In one or more exemplary embodiments, the insulating layer IL is disposed directly on the protrusion pattern PP. The opening IL-OP may expose at least a portion of the protrusion pattern PP.

The conductive pattern CP is disposed on the substrate SB. The conductive pattern CP overlaps the protrusion pattern PP and the opening IL-OP. The conductive pattern CP may contact at least a portion of the protrusion pattern PP through the opening IL-OP. The upper surface of the conductive pattern CP may include a first surface CP-US1, a second surface CP-US2, and a third surface CP-US 3. The first surface CP-US1 is disposed in the opening IL-OP. The second surface CP-US2 overlaps the insulating layer IL. The third surface CP-US3 may connect the first surface CP-US1 to the second surface CP-US2 and may be bent from each of the first surface CP-US1 and the second surface CP-US 2. The first and third surfaces CP-US1 and CP-US3 may define a recess CP-R of a certain size and shape recessed from the second surface CP-US 2. Note, however, that each of the first, second, and third surfaces CP-US1, CP-US2, and CP-US3 may be regarded as a recess CP-R defining the conductive pattern CP.

According to one or more exemplary embodiments, a portion of the first surface CP-US1 disposed adjacent to the third surface CP-US3 and the second surface CP-US2 is recessed downward from a portion of the second surface CP-US2 disposed adjacent to the third surface CP-US 3. Accordingly, the conductive pattern CP may include the recess CP-R having a certain size and shape. For example, the recess CP-R may have a shape corresponding to the shape of the opening IL-OP. Accordingly, as shown in fig. 3A to 3C, the recess CP-R may be disposed in a region in which the opening IL-OP is defined.

According to one or more exemplary embodiments, the recess CP-R may be defined to overlap the protrusion pattern PP. Provided that the conductive pattern CP according to one or more exemplary embodiments may further include a recess CP-R defined in an area overlapping the protrusion pattern PP through the opening IL-OP, the conductive pattern CP may be stably disposed even on the protrusion pattern PP. A more detailed description thereof will be described later.

Fig. 4A and 4B are cross-sectional views of an electronic device EA10, according to one or more exemplary embodiments. Fig. 5A and 5B are cross-sectional views of an electronic device EA20, according to one or more exemplary embodiments. Note that fig. 4A and 4B show cross sections of the electronic device EA10 corresponding to the regions of the electronic device EA shown in fig. 3B and 3C, respectively. Further, fig. 5A and 5B show cross sections of the electronic device EA20 corresponding to the regions of the electronic device EA shown in fig. 3B and 3C, respectively. In this way, each of the electronic devices EA10 and EA20 may be similar to the electronic device EA, and thus, a repetitive description will be omitted to avoid obscuring the exemplary embodiments.

As shown in fig. 4A and 4B, the protrusion pattern PP10 may have a cross section in a polygonal shape. In fig. 4A and 4B, the protrusion pattern PP10 is exemplarily illustrated as having a quadrangular shape. However, it is contemplated that any other suitable cross-sectional shape may be used in connection with the exemplary embodiments. For example, the protrusion pattern PP10 may have a hexagonal shape or the like. An opening IL10-OP having a certain size and shape may be defined in the insulating layer IL 10. The openings IL10-OP may expose at least a portion of the protrusion pattern PP 10. The conductive pattern CP10 may be directly disposed on a portion of the protrusion pattern PP10 exposed by the opening IL 10-OP. The conductive pattern CP10 may form a recess CP10-R having a certain size and shape and be disposed on the protrusion pattern PP 10.

As shown in fig. 5A and 5B, the protrusion pattern PP20 may have a cross section of a circular shape. For example, in fig. 5A and 5B, the protrusion pattern PP20 is exemplarily shown to have an elliptical shape. As previously mentioned, it is contemplated that any other suitable cross-sectional shape may be used in connection with the exemplary embodiments. An opening IL20-OP having a certain size and shape may be defined in the insulating layer IL 20. The conductive pattern CP20 may include a recess CP20-R having a certain size and shape, and may be defined along the shape of the opening IL 20-OP.

According to one or more exemplary embodiments, assuming that the conductive patterns CP10 and CP20 are partially recessed along the opening IL10-OP on the protrusion pattern PP10 and the opening IL20-OP on the protrusion pattern PP20, the protrusion degree of each of the conductive patterns CP10 and CP20 may be relatively reduced in the protrusion area. In this way, the conductive patterns CP10 and CP20 may define the recesses CP10-R and CP20-R, respectively, and be stably disposed on the protrusion patterns PP10 and PP20 having various shapes.

Fig. 6A is a perspective view of an insulating layer IL30 according to one or more exemplary embodiments. Fig. 6B is a cross-sectional view of an electronic device EA30, according to one or more example embodiments. Note that fig. 6B shows a cross section of the electronic device EA30 including the insulating layer IL30 of fig. 6A and a cross-sectional view corresponding to the view of fig. 3C. In this manner, the electronic device EA30 may be similar to the electronic device EA, and as such, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

As shown in FIG. 6A, a plurality of openings IL-OP1 and IL-OP2 may be defined in insulating layer IL 30. The insulating layer IL30 may have various shapes according to the shape of the protrusion pattern PP 30. According to one or more exemplary embodiments, the insulating layer IL30 covers the protrusion pattern PP30 having a cross-section of a polygonal shape. The plurality of openings IL-OP1 and IL-OP2 include a first opening IL-OP1 and a second opening IL-OP 2. The first opening IL-OP1 and the second opening IL-OP2 are arranged in the direction in which the conductive pattern CP30 extends and are spaced apart from each other in the direction in which the conductive pattern CP30 extends. According to one or more exemplary embodiments, the first opening IL-OP1 and the second opening IL-OP2 may be arranged in the second direction DR2 and spaced apart from each other in the second direction DR 2.

The first and second openings IL-OP1 and IL-OP2 expose portions of the protrusion pattern PP30, respectively, which are different from each other. The first and second openings IL-OP1 and IL-OP2 may expose angled corner portions of the protrusion pattern PP 30. Such as shown in fig. 6B, the angled corner portions may project relatively outward. The conductive pattern CP30 includes first and second recesses CP-R1 and CP-R2 defined along the first and second openings IL-OP1 and IL-OP2, respectively. The conductive pattern CP30 may be relatively recessed on the corner portions of the protrusion pattern PP30 through the plurality of openings IL-OP1 and IL-OP 2.

Since the electronic device EA30 according to one or more exemplary embodiments may further include the insulating layer IL30 having the plurality of openings IL-OP1 and IL-OP2 defined therein, the degree of protrusion of the conductive pattern CP30 in the relatively protruding region may be reduced. In addition, since the conductive pattern CP30 according to one or more exemplary embodiments may be selectively recessed with respect to the opposite further protruding portions of the protrusion pattern PP30, the conductive pattern CP30 may have improved reliability and correspond to the shapes of various protrusion patterns.

Fig. 7A is a perspective view of an electronic device EA40 in accordance with one or more exemplary embodiments. Fig. 7B is an exploded perspective view of the electronic device EA40 of fig. 7A, according to one or more example embodiments. Fig. 7C is a cross-sectional view taken along section line IV-IV' of fig. 7A according to one or more exemplary embodiments. Note that the electronic device EA40 may be similar to the electronic device EA, and thus, duplicate description will be omitted to avoid obscuring the exemplary embodiments.

Referring to fig. 7A to 7C, the electronic device EA40 includes a substrate SB, a protrusion pattern PP, a first conductive pattern CP1, an insulating layer IL40, and a second conductive pattern CP 2. The substrate SB and the protrusion pattern PP may correspond to the substrate SB and the protrusion pattern PP of fig. 1, respectively.

The first conductive pattern CP1 is disposed between the protrusion pattern PP and the insulating layer IL 40. The first conductive pattern CP1 may extend in a direction crossing the protrusion pattern PP. According to one or more exemplary embodiments, the first conductive pattern CP1 extends in the second direction DR 2. The first conductive pattern CP1 is overlapped with the protrusion pattern PP. The first conductive pattern CP1 may be divided into (or otherwise include) a first portion CP1a overlapping the protrusion pattern PP and a second portion CP1b disposed on the substrate SB. Each of the first and second portions CP1a and CP1b may have a different upper surface according to the shape of the surface on which the first conductive pattern CP1 is disposed. For example, the upper surface of the first portion CP1a may include a curved or bent surface, and the upper surface of the second portion CP1b may include a surface parallel to the substrate SB.

According to one or more exemplary embodiments, the first portion CP1a is in contact with the protrusion pattern PP and the second portion CP1b is in contact with the substrate SB, but the exemplary embodiments are not limited thereto or thereby. The upper surface of the first portion CP1a may include a curved surface corresponding to the upper surface of the protrusion pattern PP, and the upper surface of the second portion CP1b may include a flat surface corresponding to the upper surface of the substrate SB.

The insulating layer IL40 is disposed between the first and second conductive patterns CP1 and CP 2. The insulating layer IL40 partially insulates the first and second conductive patterns CP1 and CP 2. The insulating layer IL40 may be a layer covering the substrate SB. Accordingly, the insulating layer IL40 may overlap the second portion CP1b of the first conductive pattern CP 1. An opening IL40-OP having a certain size and shape is defined in the insulating layer IL 40. The openings IL40-OP may be defined in areas overlapping the protrusion pattern PP. The insulating layer IL40 exposes at least a portion of the first conductive pattern CP1 through the opening IL 40-OP. According to one or more exemplary embodiments, the opening IL40-OP may overlap the entire surface of the protrusion pattern PP in a plan view. In this way, the first portion CP1a of the first conductive pattern CP1 overlapping the protrusion pattern PP may be completely exposed by the insulating layer IL 40.

The second conductive pattern CP2 is disposed on the insulating layer IL 40. The second conductive pattern CP2 may overlap at least a portion of the protrusion pattern PP. The second conductive pattern CP2 may extend in a direction crossing the protrusion pattern PP. In one or more exemplary embodiments, the second conductive pattern CP2 may extend in parallel with the first conductive pattern CP 1. According to one or more exemplary embodiments, the second conductive pattern CP2 may extend in the second direction DR 2. The second conductive pattern CP2 may include a recess CP2-R having a certain size and shape. A recess CP2-R may be defined along opening IL 40-OP. The recessed portion CP2-R overlaps the protrusion pattern PP. The second conductive pattern CP2 may be connected to the first conductive pattern CP1 through the opening IL 40-OP. The recess CP2-R may be more recessed than another portion of the second conductive pattern CP2 disposed on the insulating layer IL 40. In this way, the recess CP2-R may be in contact with the first portion CP1a of the first conductive pattern CP 1.

Since the electronic device EA40 according to one or more exemplary embodiments may further include the insulating layer IL40 having the opening IL40-OP defined therein, the recess CP2-R may be defined in an area of the second conductive pattern CP2 disposed on the protrusion pattern PP. Accordingly, the second conductive pattern CP2 may relatively reduce the degree of protrusion of the protrusion pattern PP and may be stably disposed even on the protrusion pattern PP.

Fig. 8 is an exploded perspective view of an electronic device EA-1 in accordance with one or more exemplary embodiments. An electronic device EA-1 according to one or more exemplary embodiments will be described with reference to fig. 8. Note that some components and/or features may be similar to those described previously in connection with fig. 1-7C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

As shown in fig. 8, the electronic device EA-1 may include a display array DA, a dam member (or portion) DM, and a touch array TA. The display array DA provides an image to the outside. The display array DA may include a base substrate BS, a display layer DSL, and an encapsulation layer TFE. The touch array TA may include a first detection layer TL1, an interlayer insulation layer ILD, and a second detection layer TL 2.

The base substrate BS may have a plate-like shape including a plane defined by the first direction DR1 and the second direction DR2 crossing each other and a thickness in the third direction DR 3. The base substrate BS may include an insulating material. For example, the base substrate BS may include plastic, glass, and a plurality of organic and/or inorganic films, etc. The display layer DSL is provided on the base substrate BS. Although not shown, the display layer DSL may include a plurality of signal lines and a plurality of pixels to which an electric signal is applied through the signal lines. The display layer DSL displays an image by the pixels driven according to the electric signal.

According to one or more exemplary embodiments, one end of each of the signal lines may be connected to each of the plurality of pixels, and the other end of each of the signal lines may extend to the first pad area PA1 defined in (or on) the base substrate BS. The certain pads may be disposed on the first pad area PA1 and connected to the other ends of the signal lines, respectively. The display array DA may be driven by receiving an electrical signal supplied from a power source (e.g., a power source external to the electronic device EA-1) through a pad disposed on the first pad area PA 1. To this end, each of the pixels may include at least one thin film transistor and a display element. The display element may include various elements capable of controlling the amount of light transmission or generating light according to an electrical signal. For example, the display element may include a liquid crystal capacitor, an electrophoretic element, an organic emission element, an electrowetting element, or the like.

The encapsulation layer TFE may be disposed on the display layer DSL to cover the display layer DSL. The encapsulation layer TFE may include a plurality of organic films and/or inorganic films. The encapsulation layer TFE may protect the display layer DSL from external contamination or moisture.

The touch array TA detects a touch signal applied from the outside. The first detection layer TL1, the interlayer insulating layer ILD, and the second detection layer TL2 may be sequentially stacked in the third direction DR 3. The touch array TA is disposed on the display array DA. According to one or more exemplary embodiments, the first detection layer TL1 may be disposed directly on the encapsulation layer TFE. In this manner, the electronic device EA-1 may have a thin thickness and include the touch array TA and the display array DA. A detailed description about the touch array TA will be described later.

The dam member DM may be disposed between the display array DA and the touch array TA. The dam member DM is disposed adjacent to the display layer DSL. The dam member DM may have a line shape extending in a direction such as the second direction DR 2. The dam member DM may include an insulating material. For example, the dam member DM may include an organic material or a mixed material of an organic material and an inorganic material.

The dam member DM may be covered by an encapsulation layer TFE. At least a portion of the encapsulation layer TFE may extend to overlap the dam member DM. For example, the encapsulation layer TFE may include at least one of an inorganic layer and at least one of an organic layer. One of the inorganic layers may overlap the dam member DM, but one of the organic layers may not extend over the dam member DM. The dam member DM may prevent the organic layer from overflowing into the pad areas PA1 and PA 2.

According to one or more exemplary embodiments, at least one of the display array DA and the touch array TA may include a protrusion pattern PP (see, e.g., fig. 1A) and at least one of the conductive patterns CP, CP1, or CP2 (see, e.g., fig. 1A and 7B) and an insulating layer IL (see, e.g., fig. 1A). For example, one of the signal lines disposed on the non-flat surface or one of the electrodes disposed on the non-flat surface of the display array DA may correspond to the aforementioned conductive pattern CP (see, e.g., fig. 1A) or the aforementioned second conductive pattern CP2 (see, e.g., fig. 7A). As another example, one of the driving lines defined on the non-flat surface or one of the sensing patterns defined on the non-flat surface of the touch array TA may correspond to the aforementioned conductive pattern CP or the aforementioned second conductive pattern CP 2. However, it is noted that the exemplary embodiments are not limited to or by the position of the conductive pattern (e.g., the conductive pattern CP). For example, when the conductive pattern (e.g., the conductive pattern CP) overlaps the protrusion pattern PP and the opening IL-OP to reduce the protrusion degree of the conductive pattern (e.g., the conductive pattern CP), the conductive pattern (e.g., the conductive pattern CP) may be applied on various positions.

The electronic device EA-1 according to one or more exemplary embodiments may reduce the protrusion degree of the protrusion pattern PP, provided that a conductive pattern (e.g., a conductive pattern CP) may be disposed on the insulating layer IL in which the opening IL-OP may be defined. In this manner, the electronic device EA-1 may include a conductive pattern (e.g., the conductive pattern CP) having improved reliability. Additional details regarding this will be provided later herein.

Fig. 9A, 9B, and 9C are plan views of various layers of the touch array TA according to one or more exemplary embodiments. That is, fig. 9A is a plan view of a portion of the first detection layer TL1 of fig. 8, fig. 9B is a plan view of a portion of the interlayer insulating layer ILD of fig. 8, and fig. 9C is a plan view of a portion of the second detection layer TL2 of fig. 8. Note that some components and/or features may be similar to those described previously in connection with fig. 1-8. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

Referring to fig. 9A, the first detection layer TL1 includes a plurality of first sensing patterns SP1A, a plurality of first auxiliary patterns SP2A, a plurality of first lines TW1A, a plurality of first auxiliary lines TW2A, and a plurality of touch pads PD. The first sensing pattern SP1A and the first auxiliary pattern SP2A may be disposed on a certain area (e.g., an effective area) for detecting an external touch, and the first line TW1A, the first auxiliary line TW2A, and the touch pad PD may be disposed on a peripheral area (e.g., a non-effective area) adjacent to (or outside) the certain area.

The first sensing pattern SP1A and the first auxiliary pattern SP2A may be arranged and the first sensing pattern SP1A and the first auxiliary pattern SP2A may be spaced apart from each other. The first sensing patterns SP1A may be disposed in the first direction DR1 and connected to each other, and the connected first sensing patterns SP1A may be disposed in the second direction DR2 and spaced apart from each other in the second direction DR 2. The first auxiliary patterns SP2A and the first sensing patterns SP1A may be alternately arranged with each other. The first auxiliary pattern SP2A may be electrically insulated from the dummy pattern and the first sensing pattern SP1A adjacent to the first auxiliary pattern SP2A in the first detection layer TL 1. The first auxiliary patterns SP2A may be electrically floated. It is contemplated that the first auxiliary patterns SP2A may be connected to the second sensing patterns SP2B through contact holes (not shown) formed in the interlayer insulating layer ILD (refer to fig. 9C).

The first line TW1A is connected to the first sensing pattern SP 1A. The first line TW1A connects a portion of the first sensing pattern SP1A to a portion of the touch pad PD. The first auxiliary line TW2A is connected to a portion of the first auxiliary pattern SP 2A. The first auxiliary line TW2A connects a portion of the first auxiliary pattern SP2A connected thereto to another portion of the touch pad PD. The touch pads PD are connected to the first line TW1A and the first auxiliary line TW2A, respectively. The touch array TA (refer to fig. 8) may receive an electrical signal supplied from a power source (e.g., an external power source) or supply a resulting electrical signal to the power source or another component through the touch pad PD.

Although not shown, the touch pad PD may be disposed on the second pad area PA2 in fig. 8. In this manner, the electronic device EA-1 (refer to fig. 8) according to one or more exemplary embodiments may dispose the pads of the display array DA and the touch pads PD on the same layer. However, it is contemplated that the exemplary embodiments are not limited to or by the positions of the pads of the display array DA and the touch pads PD. For example, the pads of the display array DA and the touch pads PD may be disposed on different layers.

According to one or more exemplary embodiments, the first line TW1A and at least a portion of the first auxiliary line TW2A may overlap the dam member DM, which is shown as a dotted line in fig. 9A. Referring to fig. 8, the first line TW1A and the first auxiliary line TW2A may be directly disposed on the dam member DM.

Referring to fig. 9B, an interlayer insulating layer ILD is disposed on the first detection layer TL 1. An opening ILD-OP having a certain size and shape is defined in the interlayer insulating layer ILD. For example, the opening ILD-OP may be defined in a region overlapping the dam member DM. According to one or more exemplary embodiments, the opening ILD-OP may have a shape corresponding to that of the dam member DM. However, the exemplary embodiments are not limited to or by the shape of the open ILD-OP. For example, the opening ILD-OP may have any suitable shape that overlaps (or surrounds) at least a portion of the dam member DM.

In one or more exemplary embodiments, the interlayer insulating layer ILD may have substantially the same shape as the base substrate BS in fig. 8. Accordingly, the interlayer insulating layer ILD may further include a plurality of pad openings (e.g., first and second pad openings OP-PA1 and OP-PA2) exposing the first and second pad areas PA1 and PA 2. The exemplary embodiments are not limited to the shape of the interlayer insulating layer ILD. For example, the interlayer insulating layer ILD may have a shape smaller than that of the base substrate BS so as not to overlap the first and second pad regions PA1 and PA 2. In this manner, the plurality of pad openings OP-PA1 and OP-PA2 may be omitted.

As previously described, a plurality of contact holes (not shown) may be defined in the interlayer insulating layer ILD. The contact holes may be arranged to overlap the first auxiliary pattern SP2A and the first sensing pattern SP1A to electrically connect the first detection layer TL1 to the second detection layer TL2, respectively. However, the exemplary embodiments are not limited to or by the shape of the interlayer insulating layer ILD. For example, the interlayer insulating layer ILD may have any suitable shape.

As shown in fig. 9C, the second detection layer TL2 includes a plurality of second auxiliary patterns SP1B, a plurality of second sensing patterns SP2B, a plurality of first lines TW1B, and a plurality of second lines TW 2B. The second auxiliary pattern SP1B and the second sensing pattern SP2B may be disposed on a certain area (e.g., an active area) for detecting an external touch, and the first line TW1B and the second line TW2B may be disposed on a peripheral area (e.g., a non-active area) adjacent to (or outside) the certain area.

The second sensing pattern SP2B and the second auxiliary pattern SP1B may be arranged and the second sensing pattern SP2B and the second auxiliary pattern SP1B may be spaced apart from each other. The second sensing patterns SP2B may be disposed in the second direction DR2 and connected to each other in the second direction DR2, and the connected second sensing patterns SP2B may be disposed in the first direction DR1 and spaced apart from each other in the first direction DR 1. The second auxiliary patterns SP1B and the second sensing patterns SP2B may be alternately arranged with each other. The second auxiliary pattern SP1B may be electrically insulated from the dummy pattern and the second sensing pattern SP2B adjacent to the second auxiliary pattern SP1B in the second detection layer TL 2. The second sensing patterns SP2B and the second auxiliary patterns SP1B may overlap the first sensing patterns SP1A and the first auxiliary patterns SP2A, respectively. For example, the second sensing pattern SP2B may overlap the first auxiliary pattern SP2A in a plan view, and the second auxiliary pattern SP1B may overlap the first sensing pattern SP1A in a plan view. The second auxiliary pattern SP1B may be electrically floated. It is also contemplated that the second auxiliary patterns SP1B may be connected to the first sensing patterns SP1A via the aforementioned contact holes in the interlayer insulating layer ILD.

According to one or more exemplary embodiments, the second wire TW2B is connected to the second sensing pattern SP 2B. The first line TW1B is connected to a portion of the second auxiliary pattern SP 1B. Second line TW2B and at least a portion of first line TW1B overlap dam member DM (not shown). In addition, at least portions of the second line TW2B and the first line TW1B may overlap the opening ILD-OP (not shown).

In one or more exemplary embodiments, the second line TW2B and the first line TW1B may be connected to the first auxiliary line TW2A and the first line TW1A, respectively, through an opening ILD-OP. Accordingly, although the second sensing pattern SP2B and the second wire TW2B are disposed on a different layer from the touch pad PD, the second sensing pattern SP2B and the second wire TW2B may easily transceive electrical signals to and from the touch pad PD.

The electronic device EA-1 according to one or more exemplary embodiments may include at least one of components respectively corresponding to the protrusion pattern PP, the insulating layer IL, and the conductive pattern CP of fig. 1A. For example, the base substrate BS may correspond to the substrate SB in fig. 1A, the dam member DM may correspond to the protrusion pattern PP in fig. 1A, the interlayer insulating layer ILD may correspond to the insulating layer IL in fig. 1A, and the second detection layer TL2 may correspond to the conductive pattern CP in fig. 1A. However, the exemplary embodiments are not limited to the configuration of the electronic device EA-1 or to the configuration of the electronic device EA-1. For example, at least one of the display array DA and the touch array TA may include a conductive pattern CP, a protrusion pattern PP, and an insulating layer IL. It is also noted that the electronic device EA-1 may include any conductive layer having a protruding member defining a non-planar surface on an upper surface thereof, an insulating layer defining an opening therein overlying the protruding member, and a recess disposed on the insulating layer and defined along the opening. The exemplary embodiments are not limited to or by the configuration of the conductive layer.

Fig. 10A is a plan view of area AA in fig. 9A-9C according to one or more exemplary embodiments. Fig. 10B is a cross-sectional view taken along section line V-V of fig. 10A in accordance with one or more exemplary embodiments. Fig. 10C is a cross-sectional view taken along section line VI-VI' of fig. 10A according to one or more exemplary embodiments. For ease of description and illustration, a portion of the encapsulation layer TFE overlying the dam member DM is shown as partial layer TFE-P. Note that fig. 10A to 10C are illustrated with reference to the touch array TA in which the components of fig. 9A to 9C are assembled. Some of the components and/or features of fig. 10A-10C may be similar to those previously described in connection with fig. 1-9C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

Referring to fig. 10A, the dam member DM may have a line shape extending in the first direction DR 1. The second driving wire TW2 may extend in a direction crossing the dam member DM. According to one or more exemplary embodiments, the second driving line TW2 extends in the second direction DR 2. In one or more exemplary embodiments, the opening ILD-OP of the interlayer insulating layer ILD may extend along the dam member DM. Accordingly, the opening ILD-OP may have a line shape extending in the first direction DR1 and a width extending in the second direction DR 2.

As shown in fig. 10B, a second driving wire TW2 is disposed on the dam member DM. In a cross-sectional view defined in conjunction with the first direction DR1 and the third direction DR3, the second driving lines TW2 may be disposed in a plurality of pieces such that adjacent second driving lines TW2 are spaced apart from each other in the first direction DR 1. The second driving line TW2 may include a first auxiliary line TW2A and a second line TW 2B. Since the second driving line TW2 is disposed in the opening ILD-OP, the first auxiliary line TW2A may contact the second line TW 2B.

Referring to fig. 10C, in a sectional view defined in combination of the second direction DR2 and the third direction DR3, the first auxiliary line TW2A and the second line TW2B extend in the second direction DR 2. An opening ILD-OP is defined to overlap the dam member DM. The second line TW2B may partially overlap the interlayer insulating layer ILD and the dam member DM in the second direction DR 2. A portion of the second line TW2B overlapping the dam member DM is recessed along the opening ILD-OP to define a recessed portion TW2B-R having a certain size and shape.

According to one or more exemplary embodiments, the second wire TW2B may be connected to the first auxiliary wire TW2A through the recess TW 2B-R. A portion of the recess TW2B-R overlapping the dam member DM may include a convex upper surface protruding upward along the shape of the dam member DM. Assuming that the electronic device EA-1 according to one or more exemplary embodiments further includes the interlayer insulating layer ILD having the opening ILD-OP defined therein to overlap the dam member DM, the second line TW2B may have a concave shape in a region where the second line TW2B overlaps the dam member DM. Accordingly, the protrusion degree of the second line TW2B may be mitigated by the opening ILD-OP. Note also that the first auxiliary line TW2A may reduce the degree of protrusion of the second line TW 2B.

Fig. 11A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments. Fig. 11B is a cross-sectional view taken along section line V-V of fig. 11A in accordance with one or more exemplary embodiments. FIG. 11C is a cross-sectional view taken along section line VI-VI' of FIG. 11A in accordance with one or more exemplary embodiments. For convenience of description and explanation, it is noted that fig. 11A shows an area corresponding to the area AA of fig. 10A. Some of the components and/or features of fig. 11A-11C may be similar to those previously described in connection with fig. 1-10C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

The electronic device in fig. 11A to 11C may include an interlayer insulating layer ILD-1, the interlayer insulating layer ILD-1 including an opening ILD-OP1 having a shape different from that of the opening ILD-OP (refer to fig. 10A) of the electronic device in fig. 10A. As shown in fig. 11A, the opening ILD-OP1 of the interlayer insulating layer ILD-1 may extend along the second driving line TW 2-1. Accordingly, the opening ILD-OP1 may have a line shape extending in the second direction DR 2.

Referring to fig. 11B, a plurality of second driving wires TW2-1 are disposed on the dam member DM and spaced apart from each other in the first direction DR 1. The second line TW2B-1 is connected to the first auxiliary line TW2A-1 through openings ILD-OP1 respectively overlapping the second line TW 2B-1. A recess TW2B-R1 of a determined size and shape is defined in each of the second lines TW 2B-1. Each of the recessed portions TW2B-R1 has a shape corresponding to each of the openings ILD-OP 1.

Referring to fig. 11C, in a cross-sectional view defined in conjunction with the second direction DR2 and the third direction DR3, the additional interlayer insulating layer ILD-1 may not be shown, and the second line TW2B-1 and the first auxiliary line TW2A-1 may extend in the second direction DR 2.

Fig. 12A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments. Fig. 12B is a cross-sectional view taken along section line V-V of fig. 12A according to one or more exemplary embodiments. Fig. 12C is a cross-sectional view taken along section line VI-VI' of fig. 12A according to one or more exemplary embodiments. For convenience of description and explanation, it is noted that fig. 12A shows an area corresponding to the area AA of fig. 10A. Some of the components and/or features of fig. 12A-12C may be similar to those previously described in connection with fig. 1-11C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

According to one or more exemplary embodiments, the electronic device in fig. 12A to 12C includes an interlayer insulating layer ILD-2, the interlayer insulating layer ILD-2 including an opening ILD-OP2 having a shape different from that of the opening ILD-OP of the electronic device in fig. 10A to 10C (refer to fig. 10A) and the opening ILD-OP1 of the electronic device in fig. 11A to 11C (refer to fig. 11A).

As shown in fig. 12A, an opening ILD-OP2 of the interlayer insulating layer ILD-2 may be selectively defined in a region where the second driving line TW2-2 overlaps the dam member DM. The opening ILD-OP2 may have a length in the second direction DR2 that is greater than the width of the dam member DM and a width in the first direction DR1 that is less than the width of the second driving line TW2-2 in a plan view.

Referring to fig. 12B, a plurality of second driving wires TW2-2 are disposed on the dam member DM and spaced apart from each other in the first direction DR 1. The recessed portions TW2B-R2 are defined in the second line TW2B-2 and are connected to the first auxiliary line TW2A-2 through openings ILD-OP2 respectively overlapping the second line TW 2B-2. The layer structure in fig. 12B may correspond to the layer structure in fig. 11B.

Referring to fig. 12C, in a cross-sectional view defined in conjunction with the second direction DR2 and the third direction DR3, an opening ILD-OP2 is defined to overlap the dam member DM, and the first auxiliary line TW2A-2 and the second line TW2B-2 extend in the second direction DR 2. The second line TW2B-2 may partially overlap the interlayer insulating layer ILD-2 and the dam member DM in the second direction DR2, and may be recessed along the opening ILD-OP2 to define a recessed portion TW2B-R2 having a certain size and shape. The layer structure in fig. 12C may correspond to the layer structure in fig. 10C.

Fig. 13A is a plan view of a partial area of an electronic device according to one or more exemplary embodiments. Fig. 13B is a cross-sectional view taken along section line V-V of fig. 13A in accordance with one or more exemplary embodiments. Fig. 13C is a cross-sectional view taken along section line VI-VI' of fig. 13A according to one or more exemplary embodiments. For convenience of description and explanation, it is noted that fig. 13A shows an area corresponding to the area AA of fig. 10A. Some of the components and/or features of fig. 13A-13C may be similar to those previously described in connection with fig. 1-12C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

According to one or more exemplary embodiments, the electronic device in fig. 13A to 13C includes an interlayer insulating layer ILD-3, the interlayer insulating layer ILD-3 including an opening ILD-OP3 having a shape different from that of the opening ILD-OP of the electronic device in fig. 10A to 10C (refer to fig. 10A), the opening ILD-OP1 of the electronic device in fig. 11A to 11C (refer to fig. 11A), and the opening ILD-OP2 of the electronic device in fig. 12A to 12C (refer to fig. 12A).

As shown in fig. 13A, a plurality of openings ILD-OP3 may be defined in the interlayer insulating layer ILD-3 with respect to the second driving line TW 2-3. The region where the opening ILD-OP3 overlaps the second driving line TW2-3 and the dam member DM is partially and separately overlapped.

Referring to fig. 13B, the first auxiliary line TW2A-3 and the second line TW2B-3 may be spaced apart from each other in a region of the second driving line TW2-3 overlapping the dam member DM without overlapping the opening ILD-OP3 and with the interlayer insulating layer ILD-3 disposed between the first auxiliary line TW2A-3 and the second line TW 2B-3. In this way, the first auxiliary line TW2A-3 and the second line TW2B-3 may not partially contact each other, but may overlap the dam member DM.

Referring to fig. 13C, assuming that a plurality of openings ILD-OP3 are defined in the interlayer insulating layer ILD-3 in the second direction DR2, the second line TW2B-3 may include a plurality of recesses TW2B-R3 spaced apart from each other in the second direction DR 2. A plurality of recesses TW2B-R3 may be defined in the boundary area of the dam member DM. The boundary region of the dam member DM may be a region in which the degree of protrusion rapidly increases from the flat surface. The electronic device according to one or more exemplary embodiments may selectively dispose the recess TW2B-R3 on an area having a relatively large protrusion degree to effectively reduce the protrusion degree of the second wire TW 2B-3. In this way, the electronic device may include the second driving line TW2-3 stably disposed even on the protruding surface.

14A, 14B, and 14C are plan views of various layers of a touch array in accordance with one or more exemplary embodiments. Fig. 15A is a cross-sectional view of region BB in fig. 14A-14C according to one or more exemplary embodiments. Fig. 15B is a cross-sectional view of region CC in fig. 14A-14C according to one or more example embodiments. Note that some components and/or features may be similar to those described previously in connection with fig. 1-13C. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

Fig. 14A to 14C respectively illustrate the first detection layer TL1-1, the interlayer insulating layer ILD-4, and the second detection layer TL2-1 which together form the respective layers of the touch array, as described in conjunction with fig. 9A to 9C. Fig. 15A is illustrated with reference to a sectional view defined in conjunction with the second direction DR2 and the third direction DR3, and fig. 15B is illustrated with reference to a sectional view defined in conjunction with the first direction DR1 and the third direction DR 3.

Referring to fig. 14A, the first sensing layer TL1-1 may include a plurality of bridge patterns BP, a plurality of first lines TW1A-1, a plurality of first auxiliary lines TW2A-1, and a plurality of touch pads PD. Each of the bridge patterns BP may have a shape extending in the first direction DR 1. The bridge patterns BP may be arranged in the first and second directions DR1 and DR2 and may be spaced apart from each other in the first and second directions DR1 and DR 2. The bridge pattern BP may be disposed between the first sensing patterns SP1, which will be described later in connection with fig. 14C. In this manner, the bridge pattern BP may have end portions disposed to overlap with two adjacent first sensing patterns SP1, respectively.

In one or more exemplary embodiments, the first line TW1A-1 and the first auxiliary line TW2A-1 may be arranged and the first line TW1A-1 and the first auxiliary line TW2A-1 may be spaced apart from each other. The first line TW1A-1 and the first auxiliary line TW2A-1 may be disposed on the peripheral area. The first line TW1A-1 and the first auxiliary line TW2A-1 may correspond to the first line TW1A and the first auxiliary line TW2A in fig. 9A, respectively.

An electronic device according to one or more exemplary embodiments may include a first dam member (or component) DM-a and a second dam member (or component) DM-b. In this manner, each of the first line TW1A-1 and the first auxiliary line TW2A-1 may partially overlap each of the first dam member DM-a and the second dam member DM-b. According to one or more exemplary embodiments, each of the first and second dam members DM-a and DM-b disposed below the first detection layer TL1-1 may be represented by a dotted line. The touch pads PD may be connected to the first line TW1A-1 and the first auxiliary line TW2A-1, respectively. The touch pads PD may correspond to the touch pads PD in fig. 9A, respectively.

As shown in fig. 14B, an interlayer insulating layer ILD-4 is disposed on the first detection layer TL 1-1. A first opening ILD-OPa, a second opening ILD-OPb, a first pad opening OP-PA1, a second pad opening OP-PA2, and a plurality of contact holes CH may be defined in the interlayer insulating layer ILD-4. Referring to fig. 14B, 15A and 15B, the first opening ILD-OPa, the second opening ILD-OPb, the first pad opening OP-PA1, the second pad opening OP-PA2 and the plurality of contact holes CH may expose portions of the first sensing layer TL1-1, respectively.

The first and second openings ILD-OPa and ILD-OPb may expose portions corresponding to the first and second dam members DM-a and DM-b of the first detection layer TL 1-1. That is, the first and second opening ILD-OPa and ILD-OPb are overlapped with the first and second dam members DM-a and DM-b, respectively, in a plan view. According to one or more exemplary embodiments, the first and second opening ILD-OPa and ILD-OPb may overlap the entire surfaces of the first and second dam members DM-a and DM-b. The first and second pad openings OP-PA1 and OP-PA2 may expose portions corresponding to the first and second pad areas PA1 and PA2 of the first detection layer TL1-1, respectively. The first and second pad openings OP-PA1 and OP-PA2 may correspond to the first and second pad openings OP-PA1 and OP-PA2, respectively, in fig. 9B. Further, it is possible to arrange a plurality of contact holes CH in the touch detectable region such as the active region and to separate the plurality of contact holes CH from each other in the touch detectable region such as the active region. A plurality of contact holes CH are defined to correspond to the bridge pattern BP. In one or more exemplary embodiments, each of the plurality of contact holes CH may be defined to overlap each of the ends of the bridge pattern BP.

As shown in fig. 14C, a second detection layer TL2-1 is disposed on the interlayer insulating layer ILD-4. The second detection layer TL2 includes a plurality of first sensing patterns SP1, a plurality of second sensing patterns SP2, a plurality of second lines TW2B-1 and a plurality of second auxiliary lines TW 1B-1. The first sensing patterns SP1 are arranged in the first and second directions DR1 and DR2 and spaced apart from each other in the first and second directions DR1 and DR 2. The first sensing pattern SP1 is disposed and electrically insulates the first sensing pattern SP1 from an adjacent second sensing pattern SP2 of the second detection layer TL 2-1.

As shown in fig. 15B, the first sensing patterns SP1 are disposed to partially overlap the corresponding bridge patterns BP and the corresponding contact holes CH. Each of the first sensing patterns SP1 may be connected to a corresponding one of the bridge patterns BP through a corresponding one of the contact holes CH, and electrically connected to another first sensing pattern SP1 adjacent thereto. Accordingly, although the first sensing patterns SP1 are arranged to be spaced apart from each other, the first sensing patterns SP1 may be electrically connected to each other by the bridge patterns BP disposed on different layers, for example, the first detection layer TL 1-1.

Referring back to fig. 14C, the second sensing patterns SP2 are arranged and the second sensing patterns SP2 are spaced apart from the first sensing patterns SP 1. The second sensing patterns SP2 may be electrically connected to the adjacent second sensing patterns SP2 by the determined bridge. The second sensing pattern SP2 may be electrically insulated from the first sensing pattern SP 1. The second wires TW2B-1 may be respectively connected to the second sensing patterns SP2 disposed adjacent to the second wires TW2B-1 among the second sensing patterns SP 2. Each of the second lines TW2B-1 may have the same shape as the first auxiliary line TW2A-1 of the first detection layer TL 1-1. In this way, the second line TW2B-1 may overlap the entire surface of the first auxiliary line TW2A-1 in plan view. However, it is noted that the exemplary embodiment is not limited to the arrangement of the second wire TW2B-1 or to the arrangement of the second wire TW 2B-1. For example, the second line TW2B-1 may be disposed to partially overlap the first auxiliary line TW 2A-1.

According to one or more exemplary embodiments, the second auxiliary lines TW1B-1 may be respectively connected to the first sensing patterns SP1 disposed adjacent to the second auxiliary lines TW1B-1 among the first sensing patterns SP 1. Each of the second auxiliary lines TW1B-1 may have the same shape as the first line TW1A-1 of the first sensing layer TL 1-1. Accordingly, the second auxiliary line TW1B-1 may overlap the entire surface of the first line TW1A-1 in plan view. However, it is noted that the exemplary embodiment is not limited to the arrangement of the second auxiliary line TW1B-1 or to the arrangement of the second auxiliary line TW 1B-1. For example, the second auxiliary line TW1B-1 may be disposed to partially overlap the first line TW 1A-1.

The second line TW2B-1 and the second auxiliary line TW1B-1 may overlap the first dam member DM-a and the second dam member DM-b in a plan view. Further, the second line TW2B-1 and the second auxiliary line TW1B-1 may overlap the first opening ILD-OPa and the second opening ILD-OPb in a plan view. The second line TW2B-1 may be connected to the first auxiliary lines TW2A-1 through first openings ILD-OPa on the first dam member DM-a, respectively. Accordingly, the second sensing pattern SP2 connected to the second wire TW2B-1 may be electrically connected to the touch pad PD. The second auxiliary line TW1B-1 may be connected to the first line TW1A-1 through second openings ILD-OPb on the second dam member DM-b, respectively. Accordingly, the first sensing pattern SP1 connected to the second auxiliary line TW1B-1 may be electrically connected to the touch pad PD.

Referring to fig. 15A, the first and second dam members DM-a and DM-b may be disposed in the second direction DR2 and spaced apart from each other in the second direction DR 2. The first dam member DM-a may correspond to the dam member DM of fig. 8. The second dam member DM-b may include a first sub-dam member (or component) DM-b1 and a second sub-dam member DM-b 2. The first and second sub dam members DM-b1 and DM-b2 may be stacked (or otherwise stacked) in the third direction DR 3.

Each of the first and second sub dam members DM-b1 and DM-b2 may include the same material or different materials. For example, each of the first and second sub dam members DM-b1 and DM-b2 may include an organic material. As another example, the first sub dam member DM-b1 may include an organic material and the second sub dam member DM-b2 may include an inorganic material. In addition, the first sub dam member DM-b1 may include an inorganic material, and the second sub dam member DM-b2 may include an organic material. The second dam member DM-b according to one or more exemplary embodiments may include various materials and have a structure in which a plurality of dam members are stacked. In one or more exemplary embodiments, the first and second dam members DM-a and DM-b may have different heights. For example, the second dam member DM-b has a height greater than that of the first dam member DM-a.

Although the electronic device according to one or more exemplary embodiments includes the plurality of dam members DM-a and DM-b, recesses TW2B-R4 corresponding to the openings ILD-OPa and ILD-OPb, respectively, may be defined in the second line TW2B-1, provided that an interlayer insulating layer ILD-4 having the respective openings ILD-OPa and ILD-OPb defined therein is provided. Accordingly, the protruding degree of the second wire TW2B-1 may be reduced. In this way, defects such as disconnection defects caused at least in part by the protrusion of the second wire TW2B-1 may be prevented or at least reduced.

Fig. 16A and 16B are plan views of a portion of an electronic device according to one or more example embodiments. Dam members (or components) DM-1, DM1, and DM2 having various shapes, respectively, are shown in fig. 16A and 16B, and the touch array TA is shown and described as assembled. Some components and/or features may be similar to those previously described in connection with fig. 1-15B. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

Referring to fig. 16A, a dam member (or component) DM-1 may have a frame shape. The dam member DM-1 may surround an area on which the first and second sensing patterns SP1 and SP2 are disposed. According to one or more exemplary embodiments, the first sensing patterns SP1 may correspond to the first sensing patterns SP1A (refer to fig. 9A) in fig. 9A, and the second sensing patterns SP2 may correspond to the second sensing patterns SP2B (refer to fig. 9C) in fig. 9C. It is also contemplated that the electronic device may include a plurality of dam members (or components) DM1 and DM2, as shown in fig. 16B. Each of the dam members DM1 and DM2 may have a frame shape. Dam members DM1 and DM2 may include a first dam member DM1 and a second dam member DM 2. The first dam member DM1 may surround the first and second sensing patterns SP1 and SP2, and the second dam member DM2 may surround the first dam member DM 1.

According to one or more exemplary embodiments, each of the first driving wire TW1 and the second driving wire TW2 may overlap each of the first dam member DM1 and the second dam member DM 2. In this way, a dummy line (not shown) and lines constituting each of the first driving line TW1 and the second driving line TW2 and disposed on layers different from each other may be connected to each other in each of the plurality of regions.

An electronic device according to one or more exemplary embodiments may include dam members each having various shapes. When the protrusion pattern PP (refer to fig. 1) in fig. 1 corresponds to the dam member, an opening of the interlayer insulating layer may be defined in a shape corresponding to the dam member or in a portion of the region of the first driving line TW1 and the second driving line TW2 overlapping the dam member. As described previously, although the interlayer insulating layer may be provided in various shapes, exemplary embodiments are not limited thereto or thereby.

Fig. 17A, 17B, 17C, 17D, 17E, 17F, and 17G are cross-sectional views of an electronic device at various stages of manufacture according to one or more exemplary embodiments. For convenience of description and explanation, fig. 17A to 17G show regions corresponding to those in fig. 10C. Hereinafter, an illustrative method for manufacturing an electronic device according to one or more exemplary embodiments will be described with reference to fig. 17A to 17G. Some components and/or features may be similar to those previously described in connection with fig. 1-16B. Thus, duplicate descriptions will be omitted to avoid obscuring the exemplary embodiments.

Referring to fig. 17A, a dam member DM is formed on a base substrate BS. The dam member DM protrudes in the third direction DR 3. The dam member DM protrudes from the adjacent upper surface of the base substrate BS to provide a non-flat surface to the upper surface of the base substrate BS. The dam member DM may correspond to the protrusion pattern PP in fig. 1 and 7B. In one or more exemplary embodiments, the dam member DM may be formed by patterning an insulating material. The dam member DM may be formed of, for example, an organic material layer applied on the base substrate BS which is then patterned, or may be formed by laminating a plurality of organic patterns and inorganic patterns.

As shown in fig. 17B, the first auxiliary line TW2A is formed on the base substrate BS. The first auxiliary line TW2A may correspond to the first conductive pattern CP1 in fig. 7B. Although not shown, the first auxiliary lines TW2A may be formed such that a conductive material layer covering the base substrate BS and the dam member DM is formed, and then the conductive material layer covering the base substrate BS and the dam member DM is patterned. Although the first auxiliary line TW2A is shown to have a layer structure in the cross-sectional view defined in conjunction with the second direction DR2 and the third direction DR3, the first auxiliary line TW2A may be a line-shaped pattern extending in the second direction DR2 as shown in fig. 10A. Further, the first auxiliary line TW2A may be formed to have a relatively small thickness compared to the thickness of the dam member DM. Accordingly, the upper surface of the first auxiliary line TW2A may form a protruding curved surface corresponding to the shape of the dam member DM.

As shown in fig. 17C and 17D, an initial insulating layer ILD-P is formed on the first auxiliary line TW2A and then patterned to form an interlayer insulating layer ILD. The interlayer insulating layer ILD may correspond to the interlayer insulating layer IL40 in fig. 7B. The initial insulating layer ILD-P may be formed to have a relatively small thickness compared to the thickness of the dam member DM. Accordingly, the upper surface of the preliminary insulating layer ILD-P may form a protruded curved surface corresponding to the shape of the dam member DM. Thereafter, a portion of the preliminary insulating layer ILD-P overlapping the dam member DM is removed to form an opening ILD-OP having a certain size and shape. The protruding curved surfaces of the first auxiliary lines TW2A are exposed by the interlayer insulating layer ILD through the opening ILD-OP.

Referring to fig. 17E, a preliminary conductive layer TW2B-P is formed on the interlayer insulating layer ILD. The initial conductive layer TW2B-P may be formed by depositing or coating a conductive material on the interlayer insulating layer ILD. The initial conductive layer TW2B-P may be formed to have a relatively small thickness compared to the thickness of the dam member DM. Accordingly, the initial conductive layer TW2B-P may be formed as an upper surface reflecting the shape of the surface on which the initial conductive layer TW2B-P is disposed. For example, the initial conductive layer TW2B-P may provide a protruding upper surface corresponding to the shape of the dam member DM. In addition, a recess TW2B-R, which is recessed along the boundary of the opening ILD-OP and is defined in the upper surface of the initial conductive layer TW2B-P, may be formed.

As shown in fig. 17F and 17G, the initial conductive layer TW2B-P is patterned to form a second line TW 2B. The second wire TW2B may correspond to the conductive pattern CP in fig. 1A or the second conductive pattern CP2 in fig. 7B. As part of forming the second line TW2B, a sensitive film PRL may be formed on the initial conductive layer TW 2B-P. The sensitive film PRL covers a portion of the initial conductive layer TW2B-P and exposes a portion of the initial conductive layer TW 2B-P. The shape of the sensitive film PRL determines the shape of the second line TW 2B. In one or more exemplary embodiments, a portion of the initial conductive layer TW2B-P exposed by the sensitive film PRL is removed by an etching process to form the second line TW 2B. Although the sensitive film PRL and the second line TW2B have the same shape as that of the initial conductive layer TW2B-P in fig. 17F and 17G, the second line TW2B and the sensitive film PRL may be a line-shaped pattern extending in the second direction DR2, as shown in fig. 10A.

According to one or more exemplary embodiments, the sensing film PRL has a relatively large thickness compared to the thickness of the initial conductive layer TW 2B-P. In this way, the second thickness TH2 of the sensitive film PRL in the recessed portion TW2B-R may be greater than the first thickness TH1 of the sensitive film PRL from the virtual surface VL. The dummy surface VL is a dummy surface extended from a surface of the upper surface of the initial conductive layer TW2B-P adjacent to the recess TW 2B-R. When the opening ILD-OP is not defined, the dummy surface VL may correspond to an upper surface of the initial conductive layer TW 2B-P. When forming the opening ILD-OP, the electronic device according to one or more exemplary embodiments may form a recess TW2B-R on the initial conductive layer TW2B-P to ensure a certain thickness of the sensitive film PRL.

The sensitive film PRL serves as a mask for protecting the lower assembly from the etching solution and the etching gas in the etching process. Therefore, when the thickness of the sensitive film PRL is reduced, the lower components may be more easily damaged during the etching process, and the reliability of patterning may be reduced. According to one or more exemplary embodiments, the method for manufacturing an electronic device may further include a process of forming an opening ILD-OP in the interlayer insulating layer ILD to ensure a thickness of the sensitive film PRL equal to or greater than a certain thickness. In this way, the sensitive film PRL may protect the second line TW2B during the patterning process, and thus, the process reliability of the second line TW2B may be increased.

According to one or more exemplary embodiments, a method for manufacturing an electronic device may stably form a conductive pattern when forming the conductive pattern on a non-flat surface even if a separate non-flat film is not formed. According to one or more exemplary embodiments, although the conductive pattern is formed on the protrusion surface, defects such as disconnection defects of the conductive pattern caused at least in part by the protrusion shape may be prevented (or at least reduced). In this way, the process can be simplified and the process time can be reduced, which also reduces the manufacturing costs.

According to one or more exemplary embodiments, the conductive pattern disposed on the non-flat surface may have improved reliability. In this way, even if the conductive pattern is formed on the protruding surface, the electronic device including the stably formed conductive pattern can avoid (or reduce) defects such as disconnection defects. For this reason, the process can be simplified and the manufacturing cost can be reduced.

While certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from the description. The inventive concept is therefore not limited to such embodiments, but is to be defined by the appended claims along with their full scope of equivalents.