阅读说明：本技术 一种pcb电路板电镀用电镀液添加喷射装置 (Electroplating solution adding and spraying device for electroplating PCB ) 是由 祝文贵 杨明 赵敏 陈新建 朱兵 张勇军 何平 许淑珍 樊丽娟 魏世龙 于 2019-11-22 设计创作，主要内容包括：本发明公开一种PCB电路板电镀用电镀液添加喷射装置,包括电镀装置、清洗装置、沥干轨道、固料装置、打磨装置以及送料传送带,打磨装置上固定设置有物料转移装置,物料转移装置设置在固料装置与沥干轨道之间的上方,所述清洗装置用于对电镀后的基板进行清洗,所述物料转移装置将沥干后的物料转移至固料装置,固料装置用于对基板进行固定并将固定的基板传输至打磨装置下方,所述打磨装置用于对基板进行打磨；本发明在整个电镀过程中,输料绳连续运动,整个电镀过程为连续进行,提升了生产高效率,所述固料装置即起到固定基板的效果,又起到转移物料的效果,避免大跨度的转移装置出现,减少了工艺中使用的转移装置的数量,降低生产线的复杂性。(The invention discloses a plating solution adding and spraying device for electroplating a PCB (printed circuit board), which comprises an electroplating device, a cleaning device, a draining track, a material fixing device, a polishing device and a feeding and conveying belt, wherein the polishing device is fixedly provided with a material transfer device, the material transfer device is arranged above a position between the material fixing device and the draining track, the cleaning device is used for cleaning a substrate after electroplating, the material transfer device transfers the drained material to the material fixing device, the material fixing device is used for fixing the substrate and transmitting the fixed substrate to the lower part of the polishing device, and the polishing device is used for polishing the substrate; in the whole electroplating process, the conveying rope moves continuously, the whole electroplating process is carried out continuously, the production efficiency is improved, the material fixing device has the effect of fixing the base plate and the effect of transferring materials, the occurrence of a large-span transfer device is avoided, the number of the transfer devices used in the process is reduced, and the complexity of a production line is reduced.)

1. A plating solution adding and spraying device for electroplating a PCB (printed Circuit Board) is characterized by comprising an electroplating device (1), a cleaning device (2), a draining track (3), a material fixing device (4), a polishing device (6) and a feeding conveyor belt (7), wherein the polishing device (6) is fixedly provided with a material transfer device (5), the material transfer device (5) is arranged above the position between the material fixing device (4) and the draining track (3), the cleaning device (2) is used for cleaning an electroplated substrate, the draining track (3) is used for draining the cleaned substrate, the material transfer device (5) is used for transferring the drained material to the material fixing device (5), the material fixing device (5) is used for fixing the substrate and transmitting the fixed substrate to the lower part of the polishing device (6), and the polishing device (6) is used for polishing the fixed substrate on the material fixing device (5), the feeding conveyor belt (7) is used for transferring the polished substrate;

the electroplating device (1) comprises an electroplating bath (11) and a liquid collecting tank (12), wherein a roll shaft (110) is rotatably arranged in the liquid collecting tank (12), the roll shaft (110) is driven to rotate by a motor, a wheel disc (111) is arranged on the roll shaft (110), the wheel disc (111) drives a material conveying rope (13) to move, the material conveying rope (13) inputs a substrate into the electroplating bath (11), a plurality of bulges (14) are equidistantly arranged on the material conveying rope (13), when the substrate enters the electroplating bath (11), the substrate is positioned below the liquid level of electroplating liquid in the electroplating bath (11), and when the substrate leaves the electroplating bath (11), the substrate is positioned above the liquid level of the electroplating liquid;

a feed inlet (15) and two rope return holes (16) are formed in one side, connected with the plating bath (11) and the liquid collecting tank (12), of the plating bath (11), two pieces of unconnected sponge are arranged in the feed inlet (15) and the rope return holes (16) and are in contact with each other, the feed inlet (15) and the rope return holes (16) are completely covered, a water pump is arranged in the liquid collecting tank (12), and the plating solution in the liquid collecting tank (12) is transferred into the plating bath (11);

the electroplating bath is characterized in that two liquid spraying pipes (18) are arranged in the electroplating bath (11), the liquid spraying pipes (18) are connected with a water pump through liquid conveying pipes (17), the water pump is arranged in the electroplating bath (11), a row of spray heads (19) are equidistantly arranged on the liquid spraying pipes (18), one end of a liquid outlet of each spray head (19) is arranged below the liquid level of electroplating liquid, the spray heads (19) on the two liquid spraying pipes (18) are arranged in a staggered mode, and the liquid outlets of the spray heads (19) are triangular.

2. The electroplating solution adding and spraying device for electroplating the PCB as claimed in claim 1, wherein the cleaning device (2) has a rectangular groove structure, one end of the cleaning device (2) opposite to the electroplating device (1) is connected with a water inlet pipeline, one end of the cleaning device (2) close to the electroplating device (1) is connected with a water outlet pipeline, and the water inlet pipeline is used for inputting deionized water into the cleaning device (2).

3. The electroplating solution adding and spraying device for electroplating the PCB as claimed in claim 1, wherein the material transfer device (5) comprises a connecting plate (51), the whole material transfer device is fixedly connected with the grinding device (6) through the connecting plate (51), one end of the connecting plate (51) is fixedly connected with a vertical fixing plate (52), a sliding block (53) is arranged on the vertical direction of the vertical fixing plate (52) in a sliding way through a sliding rail, the sliding block (53) is fixedly connected with a sliding connecting plate (54), one end of the sliding connecting plate (54) is connected with a cylinder shaft of a vertical driving cylinder (56), the other end of the sliding connecting plate (54) is connected with a transverse guide plate (55), the transverse guide plate (55) is arranged vertical to the sliding connecting plate (54), a vacuum suction cup (57) is connected on the bottom surface of the sliding connecting plate (55) in a sliding way, the vertical driving cylinder (56) drives the transverse guide plate (55), the vacuum chuck (57) reciprocates in the horizontal direction.

4. The electroplating solution adding and spraying device for electroplating the PCB according to claim 1, wherein the material fixing device (4) comprises a bottom plate (41), the material fixing device (4) is fixedly installed on the processing platform through the bottom plate (41), a sliding rail (42) is fixedly arranged on the bottom plate (41), a translation plate (43) is slidably arranged on the sliding rail (42), a translation cylinder (47) is fixedly arranged on the bottom plate (41), a cylinder shaft of the translation cylinder (47) is connected with the translation plate (43), the translation plate (43) is driven to reciprocate along the sliding rail through the translation cylinder (47), a stepping motor (44) is fixedly arranged at the center of the upper surface of the translation plate (43), positioning cylinders (46) are fixedly arranged at two ends of the upper surface of the translation plate (43), and a material fixing plate (45) is fixedly connected with a shaft extension end of the stepping motor (44), the material fixing plate (45) is driven by the stepping motor (44) to rotate.

5. The electroplating solution adding and spraying device for electroplating the PCB as claimed in claim 4, wherein both ends of one surface of the material fixing plate (45) facing the stepping motor (44) are provided with positioning holes (451), the bottom of each positioning hole (451) is provided with a buffer layer, the buffer layer is of a rubber layer or a spring structure, and one surface of the material fixing plate (45) opposite to the stepping motor (44) is provided with a vacuum chuck.

6. The electroplating solution adding and spraying device for electroplating the PCB circuit board according to claim 1, wherein the polishing device (6) comprises a polishing frame (61), a mounting slider (62) is slidably arranged on the polishing frame (61), a mounting plate (64) is fixedly connected to one surface of the mounting slider (62), a plurality of roll shafts (65) are rotatably arranged on the mounting plate (64), the roll shafts (65) drive the polishing belt (65) to move, a polishing motor (63) is fixedly arranged on the other surface of the mounting slider (62), the polishing motor (63) drives the roll shafts (65) to rotate, a cylinder shaft of a polishing cylinder (69) is fixedly connected to the mounting plate (64), the polishing cylinder (69) is driven to reciprocate in the vertical direction, one end of a limiting slide rod (610) is fixedly connected to the mounting plate (64), and the limiting slide rod (610) is slidably connected with the polishing frame (61), two rows of air ducts (67) are fixedly arranged on the grinding rack (61), a row of air injection nozzles (68) are equidistantly arranged on the air ducts (67), and high-pressure air is sprayed out of the air injection nozzles (68).

7. The method for processing the PCB substrate by the electroplating solution adding and spraying device as claimed in claim 1, which is characterized by comprising the following steps:

placing a PCB substrate to be treated on a conveying rope (13), transferring the substrate into an electroplating box (11) by the conveying rope (13), inputting electroplating solution into a liquid spraying pipe (18) through a liquid conveying pipe (17), and spraying the electroplating solution out of a spray head (19) to impact the upper surface of the substrate;

the substrate which is electroplated is transferred to a cleaning device (2), deionized water is input into a water inlet pipeline of the cleaning device (2), electroplating liquid entering the surface of the substrate of the cleaning device (2) is washed and removed, the substrate which is washed is transferred to a draining track (3) through a mechanical arm, and partial water on the surface of the substrate is drained and removed;

the translation cylinder (47) drives the solid material plate (45) to be transferred to a position close to the draining track (3), the vacuum chuck (57) is driven to reach the upper part of the draining track (3), then the vacuum chuck is driven to be in close contact with the substrate on the draining track (3) through the vertical driving cylinder (56), and then the substrate is sucked through the vacuum chuck and transferred to one end of the solid material plate (45);

after the material transfer device transfers the substrate to the surface of the solid material plate (45), the translation cylinder (47) drives the solid material plate (45) to be transferred to a position close to the polishing device (6), at the moment, the cylinder shaft of the positioning cylinder (46) is contracted out of the positioning hole (451), the solid material plate (45) losing the positioning effect is driven by the stepping motor (44) to rotate 180 degrees, one end fixed with the substrate is transferred to the position under the polishing device (6), and then the cylinder shaft of the positioning cylinder (46) extends to the positioning hole (451), so that the solid material plate (45) is positioned;

the jet nozzles (68) eject high-pressure gas to remove water stains on the surface of the substrate, then the polishing cylinder (69) drives the polishing belt (65) to move downwards, the surface of the substrate is polished through the polishing belt (65), the jet nozzles (68) eject high-pressure gas to clean the polished surface after polishing is completed, and then the substrate is transferred to the feeding conveyor belt (7) through the manipulator to be transferred.

Technical Field

The invention belongs to the technical field of printed circuit board processing, and particularly relates to a plating solution adding and spraying device for electroplating a PCB.

Background

The printed circuit board is an electrical structure which forms an electroplated layer on the surface of a substrate and then forms a circuit pattern on the electroplated layer by etching, and the high-density circuit structure of the printed circuit board is mainly applied to the interior of small and light electronic products.

In the prior art, when the printed circuit board is prepared, a substrate of the circuit board is mainly added into electroplating solution for soaking, then the substrate is taken as a cathode for electrifying electroplating, forming an electroplating layer on the surface of the substrate, specifically, in the soaking process, spraying the electroplating solution to the electroplating surface of the PCB substrate at a high speed through a spray head, in the prior art, a PCB substrate is hoisted and transferred to the upper part of an electroplating box, then the substrate is descended into the electroplating box for soaking treatment, however, the method can not form continuous production, greatly reduces the production efficiency, does not accord with the production economic benefit, and in addition, in the electroplating production process, as the number of the working procedures is large, a large number of transfer devices are used for transferring the substrate among the working procedures, the production cost is increased, the complexity of the production line is increased, and the following technical scheme is provided for solving the problems.

Disclosure of Invention

The invention aims to provide a plating solution adding and spraying device for electroplating a PCB (printed circuit board)

The technical problems to be solved by the invention are as follows:

1. in the electroplating process in the prior art, the PCB substrate is hoisted and transferred to the upper part of the electroplating box, and then the substrate is lowered into the electroplating box for soaking treatment, so that the method cannot form continuous production, greatly reduces the production efficiency and does not accord with the production economic benefit.

2. In the electroplating production process, because the processes are more, a large amount of transfer equipment is used for transferring the substrate among the processes, the complexity of a production line is improved, and the production cost is improved.

The purpose of the invention can be realized by the following technical scheme:

a plating solution adding and spraying device for electroplating a PCB comprises an electroplating device, a cleaning device, a draining track, a material fixing device, a polishing device and a feeding and conveying belt, wherein the polishing device is fixedly provided with a material transfer device, the material transfer device is arranged above a position between the material fixing device and the draining track, the cleaning device is used for cleaning an electroplated substrate, the draining track is used for draining the cleaned substrate, the material transfer device is used for transferring the drained material to the material fixing device, the material fixing device is used for fixing the substrate and conveying the fixed substrate to the lower part of the polishing device, the polishing device is used for polishing the substrate fixed on the material fixing device, and the feeding and conveying belt is used for transferring the polished substrate;

the electroplating device comprises an electroplating bath and a liquid collecting tank, wherein a roll shaft is rotationally arranged in the liquid collecting tank, the roll shaft is driven by a motor to rotate, a wheel disc is arranged on the roll shaft, the wheel disc drives a material conveying rope to move, the material conveying rope inputs a substrate into the electroplating bath, a plurality of bulges are equidistantly arranged on the material conveying rope, when the substrate enters the electroplating bath, the substrate is positioned below the liquid level of electroplating liquid in the electroplating bath, and when the substrate leaves the electroplating bath, the substrate is positioned above the liquid level of the electroplating liquid;

a feed inlet and two rope return holes are formed in one side, connected with the liquid collecting tank, of the plating tank, two pieces of unconnected sponges are arranged in the feed inlet and the rope return holes, the two pieces of unconnected sponges are in mutual contact, the feed inlet and the rope return holes are completely covered, a water pump is arranged in the liquid collecting tank, and electroplating liquid in the liquid collecting tank is transferred into the plating tank;

the electroplating bath is internally provided with two liquid spraying pipes which are connected with a water pump through a liquid conveying pipe, the water pump is arranged in the electroplating bath, a row of spray heads are arranged on the liquid spraying pipes at equal intervals, one end of each spray head is arranged below the liquid level of electroplating liquid, the spray heads on the two liquid spraying pipes are arranged in a staggered mode, and the liquid outlets of the spray heads are triangular.

As a further scheme of the invention, the cleaning device is of a rectangular groove structure, one end of the cleaning device, which is opposite to the electroplating device, is connected with a water inlet pipeline, one end of the cleaning device, which is close to the electroplating device, is connected with a water outlet pipeline, and the water inlet pipeline is used for inputting deionized water into the cleaning device.

According to a further scheme of the invention, the material transfer device comprises a connecting plate, the whole material transfer device is fixedly connected with the polishing device through the connecting plate, one end of the connecting plate is fixedly connected with a vertical fixing plate, a sliding block is arranged on the vertical direction of the vertical fixing plate in a sliding mode through a sliding rail, the sliding block is fixedly connected with a sliding connecting plate, one end of the sliding connecting plate is connected with a cylinder shaft of a vertical driving cylinder, the other end of the sliding connecting plate is connected with a transverse guide plate, the transverse guide plate is perpendicular to the sliding connecting plate, a vacuum chuck is connected to the bottom surface of the sliding connecting plate in a sliding mode, the vertical driving cylinder drives the transverse guide plate to reciprocate in the vertical direction.

As a further scheme of the invention, the material fixing device comprises a bottom plate, the material fixing device is fixedly installed on the processing platform through the bottom plate, a sliding track is fixedly arranged on the bottom plate, a translation plate is slidably arranged on the sliding track, a translation cylinder is fixedly arranged on the bottom plate, a cylinder shaft of the translation cylinder is connected with the translation plate, the translation plate is driven by the translation cylinder to reciprocate along the sliding track, a stepping motor is fixedly arranged at the center of the upper surface of the translation plate, positioning cylinders are fixedly arranged at two ends of the upper surface of the translation plate, a shaft extension end of the stepping motor is fixedly connected with a material fixing plate, and the material fixing plate is driven by the stepping motor to rotate.

As a further scheme of the invention, positioning holes are arranged at two ends of one surface of the material fixing plate facing the stepping motor, a buffer layer is arranged at the bottom of each positioning hole, the buffer layer is of a rubber layer or a spring structure, and a vacuum chuck is arranged on one surface of the material fixing plate opposite to the stepping motor.

According to a further scheme of the invention, the polishing device comprises a polishing rack, an installation sliding block is slidably arranged on the polishing rack, a mounting plate is fixedly connected to one surface of the installation sliding block, a plurality of roller shafts are rotatably arranged on the mounting plate and drive a polishing belt to move, a polishing motor is fixedly arranged on the other surface of the installation sliding block and drives the roller shafts to rotate, a cylinder shaft of a polishing cylinder is fixedly connected to the mounting plate and driven by the polishing cylinder to reciprocate in the vertical direction, one end of a limiting sliding rod is fixedly connected to the mounting plate, the limiting sliding rod is slidably connected with the polishing rack, two rows of vent pipelines are fixedly arranged on the polishing rack, a row of air injection nozzles are equidistantly arranged on the vent pipelines, and high-pressure air is injected by.

The method for treating the PCB substrate by the electroplating solution adding and spraying device comprises the following steps:

placing a PCB substrate to be treated on a conveying rope, transferring the substrate into an electroplating box by the conveying rope, inputting electroplating solution into a liquid spraying pipe through a liquid conveying pipe, and spraying the electroplating solution out of a spray head to impact the upper surface of the substrate;

transferring the electroplated substrate to a cleaning device, inputting deionized water into a water inlet pipeline of the cleaning device, washing and removing the electroplating solution entering the surface of the substrate of the cleaning device, transferring the washed substrate to a draining track through a manipulator, and draining and removing part of water on the surface of the substrate;

the translation cylinder drives the solid material plate to be transferred to a position close to the draining track, the vacuum chuck is driven to reach the upper part of the draining track, then the vacuum chuck is driven to be in close contact with the substrate on the draining track through the vertical driving cylinder, and then the substrate is sucked through the vacuum chuck and transferred to one end of the solid material plate;

after the material transfer device transfers the substrate to the surface of the solid material plate, the translation cylinder drives the solid material plate to be transferred to a position close to the polishing device, at the moment, a cylinder shaft of the positioning cylinder is contracted out of the positioning hole, the solid material plate losing the positioning effect is driven by the stepping motor to rotate 180 degrees, one end fixed with the substrate is transferred to the position right below the polishing device, and then the cylinder shaft of the positioning cylinder is extended to the positioning hole, so that the solid material plate is positioned;

jet-propelled shower nozzle blowout high-pressure gas gets rid of the water stain on substrate surface, then the cylinder drive polishing area of polishing moves down, polishes through the surface of polishing area to the base plate, and the rethread jet-propelled shower nozzle blowout high-pressure gas cleans the face of polishing after polishing the completion, then the base plate shifts to the pay-off conveyer belt through the manipulator and shifts.

The invention has the beneficial effects that:

1. the electroplating device is used for continuously electroplating a substrate, and particularly comprises an electroplating bath and a liquid collecting tank, wherein two liquid spraying pipes are arranged in the electroplating bath and are connected with a water pump through liquid conveying pipes, the water pump is arranged in the electroplating bath, a row of spray heads are arranged on the liquid spraying pipes at equal intervals, one end of a liquid outlet of each spray head is arranged below the liquid level of electroplating liquid, so that on one hand, the content of oxygen introduced into the electroplating liquid is reduced, the effective service life of the electroplating liquid is prolonged, on the other hand, production noise can be reduced, and the spray heads on the two liquid spraying pipes are arranged in a staggered mode, so that the surface of the substrate passing through the electroplating bath is completely covered, and particularly, the liquid outlet of each; a roll shaft is rotationally arranged in the liquid collecting tank, the roll shaft is driven by a motor to rotate, a wheel disc is arranged on the roll shaft, the wheel disc drives a material conveying rope to move, a substrate is input into the electroplating tank through the material conveying rope, the substrate is positioned below the liquid level of electroplating liquid in the electroplating tank when entering the electroplating tank, and the substrate is positioned above the liquid level of the electroplating liquid when leaving the electroplating tank; the one side that plating bath and collecting tank link to each other is provided with feed inlet and two and returns the rope hole, and the feed inlet all is provided with two disconnected sponges with returning the rope downthehole, and two disconnected sponges contact each other, covers the feed inlet completely with returning the rope hole, and the sponge can play good shielding effect after absorbing the plating solution to reduce through the feed inlet with return the rope hole and get into the volume of the plating solution of collecting tank from the plating bath, be provided with the water pump in the collecting tank, can in time add the plating solution in the collecting tank and shift to the plating bath, consequently at whole electroplating process, defeated material rope continuous motion, whole electroplating process is for going on in succession, has promoted production high efficiency greatly.

2. When the material fixing device works, firstly, the translation cylinder drives the material fixing plate to be transferred to a position close to the draining track, then the substrate is sucked by the vacuum chuck and transferred to one end of the material fixing plate, after the material transferring device transfers the substrate to the surface of the material fixing plate, the translation cylinder drives the material fixing plate to be transferred to a position close to the polishing device, at the moment, the cylinder shaft of the positioning cylinder is contracted out of the positioning hole, the material fixing plate losing the positioning effect is driven by the stepping motor to rotate 180 degrees, one end fixed with the substrate is transferred to the position right below the polishing device, and then the cylinder shaft of the positioning cylinder extends to the positioning hole, so that the material fixing plate is positioned, therefore, in the whole process, the material fixing device not only has the effect of fixing the substrate, but also has the effect of transferring the material, the occurrence of a large-span transferring device is avoided, and the number of the transferring devices used in, the complexity of the production line is reduced, and the production cost is further reduced.

Drawings

The invention is described in further detail below with reference to the figures and specific embodiments.

FIG. 1 is a schematic view showing the structure of a plating liquid addition spray device;

FIG. 2 is a schematic structural view of an electroplating apparatus;

FIG. 3 is a schematic structural view of a material fixing device;

FIG. 4 is a schematic structural diagram of a solid material plate;

FIG. 5 is a schematic view of the polishing apparatus;

fig. 6 is a schematic structural diagram of the material transfer device.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A plating solution adding and spraying device for electroplating a PCB (printed Circuit Board), as shown in figure 1, comprises an electroplating device 1, a cleaning device 2, a draining track 3, a material fixing device 4, a polishing device 6 and a feeding conveyor belt 7, wherein the polishing device 6 is fixedly provided with a material transfer device 5 which is arranged above the position between the material fixing device 4 and the draining track 3, the cleaning device 2 is used for cleaning the electroplated substrate, the draining track 3 is used for draining the cleaned substrate, the material transfer device 5 is used for transferring the drained materials to the material fixing device 5, the material fixing device 5 is used for fixing the substrate and conveying the fixed substrate to the lower part of the polishing device 6, the polishing device 6 is used for polishing the substrate fixed on the material fixing device 5, and the feeding conveyor belt 7 is used for transferring the polished substrate;

as shown in fig. 2, the electroplating apparatus 1 includes an electroplating bath 11 and a liquid collecting tank 12, a roller 110 is rotatably disposed in the liquid collecting tank 12, the roller 110 is driven by a motor to rotate, a wheel disc 111 is disposed on the roller 110, the wheel disc 111 drives a material conveying rope 13 to move, a plurality of protrusions 14 are equidistantly disposed on the material conveying rope 13, a substrate disposed on the material conveying rope 13 is positioned by the protrusions 14, the substrate is a substrate for PCB production, and then the substrate is input into the electroplating bath 11 by the material conveying rope 13, when the substrate enters the electroplating bath 11, the substrate is below a liquid level of an electroplating solution in the electroplating bath 11, and when the substrate leaves the electroplating bath 11, the substrate is above the liquid level of the electroplating solution;

a feed inlet 15 and two rope return holes 16 are formed in one side, connected with the liquid collecting tank 12, of the electroplating tank 11, sponges are arranged in the feed inlet 15 and the rope return holes 16, specifically, two unconnected sponges are arranged in the feed inlet 15 and the rope return holes 16, the two unconnected sponges are in mutual contact, the feed inlet 15 and the rope return holes 16 are completely covered, and the sponges can play a good shielding role after absorbing electroplating liquid, so that the amount of the electroplating liquid entering the liquid collecting tank 12 from the electroplating tank 11 through the feed inlet 15 and the rope return holes 16 is reduced, a water pump is arranged in the liquid collecting tank, and the electroplating liquid in the liquid collecting tank 12 is transferred into the electroplating tank 11 or other places;

two liquid spraying pipes 18 are arranged in the electroplating bath 11, the liquid spraying pipes 18 are connected with a water pump through liquid conveying pipes 17, the water pump is arranged in the electroplating bath 11, a row of spray heads 19 are arranged on the liquid spraying pipes 18 at equal intervals, one end of liquid outlets of the spray heads 19 is arranged below the liquid level of electroplating liquid, on one hand, the oxygen content introduced into the electroplating liquid is reduced, the effective service life of the electroplating liquid is prolonged, on the other hand, the production noise can be reduced, the spray heads 19 on the two liquid spraying pipes 18 are arranged in a staggered mode, so that the full coverage of the surface of a substrate passing through the electroplating bath 11 is realized, specifically, the liquid outlets of the spray heads 19;

the cleaning device 2 is arranged at one discharging end of the conveying rope 13, the conveying rope 13 directly transfers the substrate into the cleaning device 2, the cleaning device 2 is of a rectangular groove structure, one end, opposite to the electroplating device 1, of the cleaning device 2 is connected with a water inlet pipeline, one end, close to the electroplating device 1, of the cleaning device 2 is connected with a water outlet pipeline, the water inlet pipeline is used for inputting deionized water into the cleaning device 2, electroplating liquid entering the surface of the substrate of the cleaning device 2 is washed and removed, the washed substrate is transferred onto the draining track 3 through a mechanical arm, and most of water on the surface of the substrate is drained and removed on the draining track 3;

as shown in fig. 6, the material transfer device 5 includes a connecting plate 51, the whole material transfer device is fixedly connected with the polishing device 6 through the connecting plate 51, one end of the connecting plate 51 is fixedly connected with a vertical fixing plate 52, a slide block 53 is vertically arranged on the vertical fixing plate 52 in a sliding manner through a slide rail, the slide block 53 is fixedly connected with a slide connecting plate 54, one end of the slide connecting plate 54 is connected with a cylinder shaft of a vertical driving cylinder 56, the other end of the slide connecting plate 54 is connected with a transverse guide plate 55, the transverse guide plate 55 is vertically arranged with the slide connecting plate 54, a vacuum chuck 57 is slidably connected to the bottom surface of the slide connecting plate 55, the vertical driving cylinder 56 drives the transverse guide plate 55 to reciprocate in the vertical direction, and the vacuum chuck 57 is driven to reciprocate in;

during work, the vacuum suction cup 57 is driven to reach the upper part of the draining track 3, then the vacuum suction cup is driven to be in close contact with the substrate on the draining track 3 through the vertical driving air cylinder 56, and then the substrate is sucked by the vacuum suction cup and transferred to the material fixing device 4;

as shown in fig. 3, the material fixing device 4 includes a bottom plate 41, the material fixing device 4 is fixedly mounted on the processing platform through the bottom plate 41, a sliding rail 42 is fixedly disposed on the bottom plate 41, a translation plate 43 is slidably disposed on the sliding rail 42, a translation cylinder 47 is fixedly disposed on the bottom plate 41, a cylinder shaft of the translation cylinder 47 is connected to the translation plate 43, the translation plate 43 can be driven to reciprocate along the sliding rail through the translation cylinder 47, a stepping motor 44 is fixedly disposed at the center of the upper surface of the translation plate 43, positioning cylinders 46 are fixedly disposed at two ends of the upper surface of the translation plate 43, a material fixing plate 45 is fixedly connected to an axial extension end of the stepping motor 44, and the material fixing plate 45 is driven by the stepping motor 44 to rotate;

as shown in fig. 4, two ends of one surface of the material fixing plate 45 facing the stepping motor 44 are provided with positioning holes 451, the bottom of each positioning hole 451 is provided with a buffer layer, each buffer layer is of a rubber layer or a spring structure, and one surface of the material fixing plate 45 opposite to the stepping motor 44 is provided with a vacuum chuck for adsorbing and fixing the substrate transferred onto the material fixing plate 45;

during operation, the translation cylinder 47 drives the solid material plate 45 to be transferred to a position close to the draining rail 3, after the material transfer device transfers the substrate to the surface of the solid material plate 45, the translation cylinder 47 drives the solid material plate 45 to be transferred to a position close to the polishing device 6, at the moment, the cylinder shaft of the positioning cylinder 46 is contracted from the positioning hole 451, the solid material plate 45 losing the positioning effect is driven by the stepping motor 44 to rotate 180 degrees, one end fixed with the substrate is transferred to the position right below the polishing device 6, and then the cylinder shaft of the positioning cylinder 46 is extended to the positioning hole 451, so that the solid material plate 45 is positioned;

as shown in fig. 5, the polishing device 6 includes a polishing machine frame 61, a mounting slider 62 is slidably disposed on the polishing machine frame 61, a mounting plate 64 is fixedly connected to one surface of the mounting slider 62, a plurality of roller shafts 65 are rotatably disposed on the mounting plate 64, the roller shafts 65 drive a polishing belt 65 to move, a polishing motor 63 is fixedly disposed on the other surface of the mounting slider 62, the polishing motor drives the roller shafts 65 to rotate, the mounting plate 64 is fixedly connected to a cylinder shaft of a polishing cylinder 69 and is driven by the polishing cylinder 69 to reciprocate in the vertical direction, one end of a limit slide bar 610 is fixedly connected to the mounting plate 64, and the limit slide bar 610 is slidably connected to the polishing machine frame 61;

the fixed two rows of vent pipe 67 that are provided with on the frame 61 of polishing, vent pipe 67 equidistance is provided with one row of jet-propelled shower nozzle 68, jet-propelled shower nozzle 68 blowout high-pressure gas, clean the base plate of polishing device below, it is concrete, when the base plate shifts to the below of polishing device 6, at first blowout high-pressure gas, get rid of the water stain on base plate surface, then polish through polishing belt 65 to the surface of base plate, the realization is to the micro-roughening treatment of plating layer, form micro-rough surface, promote the bonding strength of follow-up other plating layers and this plating layer, the base plate that accomplishes to polish shifts to pay-off conveyer belt 7 and shifts.

The working method of the electroplating solution adding and spraying device comprises the following steps:

placing a PCB substrate to be treated on a conveying rope 13 through a manual or mechanical arm, transferring the substrate into an electroplating box 11 through the conveying rope 13, inputting electroplating solution into a liquid spraying pipe 18 through a liquid conveying pipe 17, and spraying the electroplating solution from a spray head 19 to impact the upper surface of the substrate;

the substrate which is subjected to electroplating is transferred to a cleaning device 2, deionized water is input into a water inlet pipeline of the cleaning device 2, electroplating liquid entering the surface of the substrate of the cleaning device 2 is washed and removed, the substrate which is subjected to washing is transferred to a draining track 3 through a mechanical arm, and partial water on the surface of the substrate is drained and removed;

the translation cylinder 47 drives the solid material plate 45 to be transferred to a position close to the draining rail 3, the vacuum chuck 57 is driven to reach the upper part of the draining rail 3, then the vacuum chuck is driven to be in close contact with the substrate on the draining rail 3 through the vertical driving cylinder 56, and then the substrate is sucked by the vacuum chuck and transferred to one end of the solid material plate 45;

after the material transferring device transfers the substrate to the surface of the material fixing plate 45, the translation cylinder 47 drives the material fixing plate 45 to be transferred to a position close to the polishing device 6, at the moment, the cylinder shaft of the positioning cylinder 46 is contracted out of the positioning hole 451, the material fixing plate 45 losing the positioning effect is driven by the stepping motor 44 to rotate 180 degrees, one end fixed with the substrate is transferred to the position right below the polishing device 6, and then the cylinder shaft of the positioning cylinder 46 extends to the positioning hole 451, so that the positioning of the material fixing plate 45 is realized;

jet-propelled shower nozzle 68 spouts high-pressure gas, gets rid of the water stain on substrate surface, then polishes cylinder 69 drive polishing belt 65 and moves down, polishes through polishing belt 65 to the surface of substrate, and the rethread jet-propelled shower nozzle 68 blowout high-pressure gas cleans the face of polishing after polishing the completion, and then the substrate shifts to pay-off conveyer belt 7 through the manipulator and shifts.

The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.