阅读说明：本技术 一种一体式散热器及一体式led模组的加工工艺 (Integrated radiator and processing technology of integrated LED module ) 是由 陈凯 黄建明 于 2019-11-27 设计创作，主要内容包括：本发明涉及一种一体式散热器及一体式LED模组的加工工艺,其中,散热器的加工工艺包括：S1、将散热器型材挤出成型：所述散热器型材包括散热板,所述散热板的正面设有若干光源安装面,所述散热板的背面设有若干散热鳍片；S2、对散热器型材进行机加工：在所述散热板的背面进行若干用于电线穿入的过线孔加工,每一所述过线孔分别贯穿一所述光源安装面；S3、加工好的散热器型材经过表面处理后,得到散热器；S4、在散热板的背面设置填胶区,若干所述过线孔均位于所述填胶区内。本发明将散热板设计为可容置多个光源部的一体化板,在生产前可以根据需求设计模组的数量,方便快捷,不仅可以提高生产效率,也能节约成本。(The invention relates to an integrated radiator and a processing technology of an integrated LED module, wherein the processing technology of the radiator comprises the following steps: s1, extruding and molding the radiator profile: the radiator section comprises a radiating plate, the front surface of the radiating plate is provided with a plurality of light source mounting surfaces, and the back surface of the radiating plate is provided with a plurality of radiating fins; s2, machining the radiator section: processing a plurality of wire passing holes for passing wires through on the back surface of the heat dissipation plate, wherein each wire passing hole respectively penetrates through one light source installation surface; s3, performing surface treatment on the processed radiator section to obtain a radiator; and S4, arranging a glue filling area on the back surface of the heat dissipation plate, wherein the wire passing holes are all located in the glue filling area. The heat dissipation plate is designed into an integrated plate capable of accommodating a plurality of light source parts, the number of the modules can be designed according to requirements before production, convenience and rapidness are achieved, production efficiency can be improved, and cost can be saved.)

1. The processing technology of the integrated radiator is characterized by comprising the following steps of:

s1, extruding and molding the radiator section

The radiator section comprises a radiating plate, the front surface of the radiating plate is provided with a plurality of light source mounting surfaces, and the back surface of the radiating plate is provided with a plurality of radiating fins;

s2, machining the radiator section

Processing a plurality of wire passing holes for passing wires through on the back surface of the heat dissipation plate, wherein each wire passing hole respectively penetrates through one light source installation surface;

s3, performing surface treatment on the processed radiator section to obtain a radiator;

and S4, arranging a glue filling area on the back surface of the heat dissipation plate, wherein the wire passing holes are all located in the glue filling area.

2. The process of manufacturing an integral heat sink of claim 1, wherein in step S1, said light source mounting surface is flat.

3. The process of manufacturing an integral heat sink as claimed in claim 1, wherein in step S2, the process further comprises: and processing heat dissipation notches on the heat dissipation fins.

4. The process of manufacturing an integral heat sink as claimed in claim 1, wherein in step S2, the process further comprises: and processing a plurality of lens positioning holes, PCB fixing holes and lens group mounting holes or mounting clamping grooves on each light source mounting surface.

5. The process of manufacturing an integral heat sink as claimed in claim 1, wherein in step S2, the process further comprises: and a heat dissipation through hole is processed between the two adjacent light source mounting surfaces.

6. The process of claim 1, wherein in step S2, the arrangement direction of the plurality of wire holes is parallel to the arrangement direction of the heat dissipation fins, and the arrangement direction of the heat dissipation fins is the same as the profile extrusion direction.

7. The process of claim 1, wherein in step S4, two ends of the heat dissipation plate are respectively provided with a rib, and the glue filling region is a groove surrounded by the two ribs, the back surface of the heat dissipation plate and the two heat dissipation fins on two sides of the heat dissipation plate.

8. The process for manufacturing an integral heat sink as claimed in claim 7, wherein the rib is a baffle or a sealing plug.

9. The process of claim 1, wherein in step S1, the heat dissipation plate is further provided with fixing portions at two sides thereof.

10. A process for manufacturing an integrated LED module, wherein a plurality of light source units are mounted on the heat sink of any one of claims 1 to 9, the light source units include a PCB and a lens assembly, the process comprising the following steps:

t1, mounting PCB board and wire

Fixing each PCB on each light source mounting surface respectively, and enabling a plurality of wires to pass through a plurality of wire passing holes respectively, wherein the installation of the PCB and the wires is not in sequence;

t2, soldering the wires to the PCB so that several PCBs are connected in series or in parallel

T3 mounting lens group

Respectively mounting a plurality of mounting lens groups on a plurality of light source mounting surfaces;

t4 filled sealing colloid

And filling the sealant in the sealant filling area.

11. The process of claim 10, wherein after step T1 and before step T2, wires are fastened by a fastener and connected to an electrical connector on the back of the heat spreader plate; or the like, or, alternatively,

after the step T2 and before the step T3, the wires are fastened by a fastener and then connected to an electrical connector on the back surface of the heat dissipation plate.

12. The process of claim 11, wherein a sealing plug is inserted into each trace hole, the positive connecting wire and the negative connecting wire are inserted into the first sealing plug and the last sealing plug, the two ends of each intermediate connecting wire are inserted into the two adjacent sealing plugs, the ends of the two connecting wires inserted into each sealing plug are welded to the positive and negative electrodes of the corresponding PCB, and the ends of the positive connecting wire and the negative connecting wire that are not inserted into the sealing plugs are fastened by the fastening members.

13. The process for manufacturing an integrated LED module according to claim 11, wherein each sealing plug is inserted into a corresponding wire hole, a positive connecting wire and a negative connecting wire are inserted into a same sealing plug, ends of the negative connecting wire and the positive connecting wire inserted into the same sealing plug are welded to positive and negative electrodes of a corresponding PCB, and the positive connecting wires and the negative connecting wires not inserted into the sealing plugs are fastened by the fastening members.

14. The processing technology of the integrated LED module as claimed in claim 11, wherein the fastening member is disposed in a staggered manner with respect to the wire through hole.

15. The process of claim 11, wherein the sealing plug is provided with two through holes for two wires to be inserted into.

Technical Field

The invention relates to the technical field of illumination, in particular to an integrated radiator and a processing technology of an integrated LED module.

Background

The led (lighting emitting diode) lighting is a light emitting diode lighting, which is a semiconductor solid state light emitting device. The solid semiconductor chip is used as a luminescent material, and the carriers are compounded in the semiconductor to release excess energy to cause photon emission, so that red, yellow, blue and green light is directly emitted. An illumination device manufactured by using an LED as a light source is an LED lamp. In the LED lighting lamp, the LED lighting lamp with the reflection function can be completely qualified in any occasions.

The existing LED module generally comprises a radiator and a light source component, the radiators are mutually independent, the radiators are required to be fixed on a lamp shell one by one during installation, or the radiators are connected firstly through screws and the like and then installed, and time and labor are wasted during assembly.

Disclosure of Invention

The invention aims to provide an integrated radiator and a processing technology of an integrated LED module so as to realize integration of a plurality of modules.

In order to solve the problems, the invention provides a processing technology of an integrated radiator, which comprises the following steps:

s1, extruding and molding the radiator section

The radiator section comprises a radiating plate, the front surface of the radiating plate is provided with a plurality of light source mounting surfaces, and the back surface of the radiating plate is provided with a plurality of radiating fins;

s2, machining the radiator section

Processing a plurality of wire passing holes for passing wires through on the back surface of the heat dissipation plate, wherein each wire passing hole respectively penetrates through one light source installation surface;

s3, performing surface treatment on the processed radiator section to obtain a radiator;

and S4, arranging a glue filling area on the back surface of the heat dissipation plate, wherein the wire passing holes are all located in the glue filling area.

Preferably, in step S1, the light source mounting surface is flat.

Preferably, in step S2, the method further includes: and processing heat dissipation notches on the heat dissipation fins.

Preferably, in step S2, the method further includes: and processing a plurality of lens positioning holes, PCB fixing holes and lens group mounting holes or mounting clamping grooves on each light source mounting surface.

Preferably, in step S2, the method further includes: and a heat dissipation through hole is processed between the two adjacent light source mounting surfaces.

Preferably, in the step S2, the arrangement direction of the plurality of wire holes is parallel to the arrangement direction of the heat dissipation fins, and the arrangement direction of the heat dissipation fins is the same as the profile extrusion direction.

Preferably, in the step S4, two ends of the heat dissipation plate are respectively provided with a rib, and the glue filling area is a groove surrounded by the two ribs, the back of the heat dissipation plate and the two heat dissipation fins on the two sides of the heat dissipation plate.

Preferably, the rib is a baffle or a sealing plug.

Preferably, in step S1, fixing portions are further provided on both sides of the heat dissipation plate.

The invention also provides a processing technology of the integrated LED module, wherein a plurality of light source parts are arranged on the radiator in the embodiment, each light source part comprises a PCB and a lens group, and the processing technology comprises the following steps:

t1, mounting PCB board and wire

Fixing each PCB on each light source mounting surface respectively, and enabling a plurality of wires to pass through a plurality of wire passing holes respectively, wherein the installation of the PCB and the wires is not in sequence;

t2, soldering the wires to the PCB so that several PCBs are connected in series or in parallel

T3 mounting lens group

Respectively mounting a plurality of mounting lens groups on a plurality of light source mounting surfaces;

t4 filled sealing colloid

And filling the sealant in the sealant filling area.

Preferably, after the step T1 and before the step T2, the plurality of wires are fastened by a fastener and then connected to an electrical connector on the back surface of the heat dissipation plate; or the like, or, alternatively,

after the step T2 and before the step T3, the wires are fastened by a fastener and then connected to an electrical connector on the back surface of the heat dissipation plate.

Preferably, a sealing plug is respectively plugged into each routing hole, the positive connecting wire and the negative connecting wire are respectively inserted into the first sealing plug and the last sealing plug, two ends of each intermediate connecting wire are respectively inserted into two adjacent sealing plugs, the ends of the two connecting wires inserted into each sealing plug are respectively welded with the positive electrode and the negative electrode of the corresponding PCB, and the ends of the positive connecting wire and the negative connecting wire which are not inserted into the sealing plugs are fastened through the fastening piece.

Preferably, each sealing plug is respectively plugged into a corresponding wire routing hole, a positive connecting wire and a negative connecting wire are respectively inserted into the same sealing plug, the ends of the negative connecting wire and the positive connecting wire inserted into the same sealing plug are respectively welded with the positive electrode and the negative electrode of a corresponding PCB, and each positive connecting wire and each negative connecting wire which are not inserted into the sealing plug are fastened through the fastening piece.

Preferably, the fastener and the wire passing hole are arranged in a staggered mode.

Preferably, the sealing plug is provided with two through holes for inserting two wires respectively.

Compared with the prior art, the invention has the following technical effects:

1. according to the integrated radiator provided by the invention, the radiating plate is designed into the integrated plate capable of accommodating the plurality of light source parts, the number of the modules can be designed according to requirements before production, convenience and rapidness are realized, the production efficiency can be improved, and the cost can be saved;

2. the invention can radiate the whole body through the radiating plate and the radiating fins, thereby realizing the integration of a plurality of modules, having simple and convenient installation process and good radiating effect;

3. according to the integrated radiator provided by the invention, the two ends of the two radiating fins are respectively provided with the flanges to form the glue filling area, namely glue is uniformly filled in the area where the plurality of wire passing holes are located, so that glue leakage is not easy to cause, and the glue filling efficiency is improved;

4. when the integrated radiator is provided with the electric wire, the wiring can be carried out according to the series-parallel connection condition of the PCBs, and no matter whether the PCBs are in parallel connection or in series connection, the leading-out end of the electric wire is connected with the power supply through only one waterproof wire, so that the using number of the waterproof wires is reduced, and the cost is saved;

5. the leading-out terminal of the electric wire is fastened through a fastener, so that the electric wire is prevented from being loosened due to pulling of external force.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. In the drawings:

fig. 1 is a schematic front structural view of an integrated heat sink provided in a preferred embodiment of the present invention;

fig. 2 is a schematic back structure view of an integrated heat sink provided in the preferred embodiment of the present invention;

fig. 3 is a schematic structural diagram of an integrated LED module according to a preferred embodiment of the present invention;

fig. 4 is a schematic view of a back-side split structure of the integrated LED module according to the preferred embodiment of the present invention;

fig. 5 is a schematic back structure view of an integrated LED module according to a preferred embodiment of the present invention;

fig. 6 is a schematic rear perspective view (without a threaded pipe) of the integrated LED module according to the preferred embodiment of the present invention;

fig. 7 is a schematic rear perspective view (with a threaded tube) of the integrated LED module according to the preferred embodiment of the present invention.

Detailed Description

The integrated heat sink and the integrated LED module provided by the present invention will be described in detail with reference to fig. 1 to 7, and this embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments, and those skilled in the art can modify and color the integrated heat sink and the integrated LED module without changing the spirit and content of the present invention.

Referring to fig. 1 and 2, a process for manufacturing an integrated heat sink includes the following steps:

s1, extruding and molding the radiator section

The heat sink profile extruded in this step includes a heat sink 11, the front surface of the heat sink 11 is provided with a plurality of light source mounting surfaces 111 for mounting the light source part 2, the back surface of the heat sink 11 is provided with a plurality of heat sink fins 13, and both sides of the heat sink 11 are respectively provided with fixing parts 14 (in this embodiment, the side in the extrusion direction is taken as a side, and the side perpendicular to the extrusion direction is taken as an end, so that the two fixing parts 14 are arranged along the extrusion direction);

in this step, a plurality of heat dissipation fins 13 are arranged in parallel at intervals, and the arrangement direction of the heat dissipation fins is consistent with the profile extrusion direction.

The light source mounting surface 111 is flat.

The extruded length can be machined and cut as required.

According to the invention, the heat dissipation plate 11 is designed to be an integrated plate capable of accommodating a plurality of light source parts 2, the number of modules can be designed according to requirements before production, and the heat dissipation plate is convenient and quick. The heat dissipation plate 11 and the heat dissipation fins 13 dissipate heat of the whole body, so that the integration of a plurality of modules is realized, the installation process is simple and convenient, and the heat dissipation effect is good.

S2, machining the radiator section

A heat dissipation through hole 12 is processed between two adjacent light source mounting surfaces 111: as an example, the heat dissipating through-hole 12 may be a long strip, which is disposed parallel to the long sides of the two light source mounting surfaces 111; as another embodiment, a plurality of heat dissipating through holes 12 are included, and the plurality of heat dissipating through holes 12 are arranged in parallel to the long sides of the two light source mounting surfaces 111. The heat dissipation through holes 12 are provided to weaken heat transfer between the adjacent light source mounting surfaces 111, and accelerate air convection circulation and heat dissipation.

A plurality of wire passing holes 15 for passing wires are processed on the back surface of the heat dissipation plate 11, and each wire passing hole 15 penetrates through one light source installation surface 111.

The arrangement direction of the plurality of wire passing holes 15 is parallel to the arrangement direction of the heat dissipation fins 13, the arrangement direction of the heat dissipation fins 13 is consistent with the profile extrusion direction, the plurality of light source installation surfaces 111 are arranged side by side along the profile extrusion direction, and each light source installation surface 111 corresponds to one wire passing hole 15.

In the present embodiment, each light source mounting surface 111 is used for mounting the light source unit 2, and the light source unit 2 includes a PCB and a lens assembly, so that a plurality of fixing holes for mounting the PCB need to be processed on each light source mounting surface 111. The PCB can be a bare board, and electronic components are welded on the surface of the PCB; or the PCBA directly integrates electronic components on the PCB.

The lens group comprises a lens part and a lens pressing frame, the lens part needs to be positioned on a corresponding light source mounting surface 111 first, a plurality of positioning columns are arranged on the lens part, correspondingly, a plurality of positioning holes matched with the positioning columns are formed in each light source mounting surface 111, and when the lens group is mounted, each positioning column is inserted into the corresponding positioning hole respectively, so that the lens part can be positioned.

The lens part is covered on the PCB board through the lens pressing frame, and the embodiment can process a matched mounting hole or clamping groove on the light source mounting surface 111 according to the specific structure of the lens pressing frame, namely if the lens pressing frame is fixed on the light source mounting surface 111 through a threaded fastener, the light source mounting surface 111 needs to be processed with a mounting hole; if the lens pressing frame is clamped on the light source mounting surface 111, a clamping groove needs to be processed on the light source mounting surface 111.

A plurality of mounting holes for mounting are processed on the fixing portion 14, and the heat dissipation plate 11 can be connected with the exterior lamp housing through the fixing portion 14, so that the heat dissipation plate 11 and the exterior lamp housing can be mounted.

The heat dissipation notches are formed in the heat dissipation fins 13, and the heat dissipation notches can accelerate the convection circulation of air and further improve the heat dissipation effect.

The present invention does not limit the sequence of the above machining.

S3, performing surface treatment on the processed radiator section to obtain a radiator 1;

in this step, the processed heat sink 1 is subjected to burr polishing, sand blasting, and oxidation treatment.

S4, arranging a glue filling area on the back of the heat dissipation plate 11, wherein the wire through holes 15 are all positioned in the glue filling area

Since the wire passing hole 15 is not easily sealed, the wire passing hole 15 to which the wire is attached needs to be sealed in order to prevent moisture, oil, and the like from affecting the LED element on the PCB after the light source unit 2 is mounted. If the wire through hole 15 is directly and independently sealed, the operation time is longer and the efficiency is low. If glue is uniformly filled in the area where the plurality of wire through holes 15 are located, glue leakage is easily caused. Therefore, it is necessary to provide a glue filling area without glue leakage on the back surface of the heat dissipation plate 11, and as an embodiment, the glue filling area may be a groove; as another embodiment, since the two sides of the area where the wire through hole 15 is located are respectively provided with the heat dissipation fins 13, the two heat dissipation fins 13 can be used to enclose the wire through hole 15, that is, two ends of the two heat dissipation fins 13 are respectively provided with the rib 16, and the two ribs 16 and the heat dissipation fins 13 on the two sides form the groove.

Because the profile of the heat sink is extruded, the profile has a uniform structure in the extrusion direction, and the groove cannot be formed in the area where the wire through hole 15 is located by the extrusion forming process. The process of forming the groove at the later stage is complicated, and it is preferable that the flanges 16 are formed at both ends of the back surface of the heat radiating plate 11. The concrete structure is as follows: two ends of the heat dissipation plate 11 are respectively provided with a rib 16, the rib 16 is located in a space area where the wire passing hole 15 is located, the bottom surface of the rib 16 is attached to the back surface of the heat dissipation plate 11, two sides of the rib 16 are attached to the two heat dissipation fins 13, that is, the glue filling area is a groove surrounded by the two ribs 16 and the back surface of the heat dissipation plate 11 and the two heat dissipation fins 13 on the two sides thereof. The structure of the rib 16 is not particularly limited, and as an embodiment, the rib 16 is a baffle, and two sides of the baffle are respectively clamped, welded or fastened and connected with the two heat dissipation fins 13 through threaded fasteners, or two sides and a bottom surface of the baffle are respectively welded or fastened and connected with the two heat dissipation fins 13 and the back surface of the heat dissipation plate 11 through threaded fasteners; in another embodiment, the rib 16 is a sealing plug, and the width of the sealing plug is larger than the gap between the two heat dissipation fins 13.

Referring to fig. 3 to 7, the present invention further provides a process for manufacturing an integrated LED module, wherein a plurality of light source units 2 are mounted on the manufactured heat sink 1, and the process comprises the following steps:

t1, mounting PCB board and wire

Mounting each PCB on the light source mounting surface 111 through the corresponding PCB fixing hole and the corresponding screw;

the invention does not specially limit the wire arrangement mode of the electric wire, and can carry out specific wiring according to the parallel connection or the serial connection of the PCBs.

In this step, the installation of the PCB and the wires is not in sequence.

T2, soldering the wires to the PCB so that several PCBs are connected in series or in parallel

In one embodiment, multiple PCB boards are connected in series. In this step, the electric wire 3 is inserted into the wire passage hole 15 through the sealing plug 4. Each sealing plug 4 is provided with a through hole for wiring, the number of the through holes arranged on the sealing plugs 4 is not limited, namely, a plurality of wires can share one through hole, and the plurality of wires can be respectively inserted by arranging the through holes with corresponding numbers. The sealing plug 4 of this embodiment is provided with two through holes.

If two light source parts 2 are installed on the radiator 1, two wire passing holes 15, two sealing plugs 4 and three electric wires are correspondingly arranged, the three electric wires are respectively a positive connecting wire, a middle connecting wire and a negative connecting wire, one end of the positive connecting wire and one end of the middle connecting wire are respectively inserted into the first sealing plug, one end of the negative connecting wire and the other end of the middle connecting wire are respectively inserted into the second sealing plug, and the two sealing plugs are respectively plugged into the two wire passing holes 15. And then the wires plugged into the sealing plug end are respectively welded with the anode and the cathode of the corresponding PCB.

If the plurality of power supply units 2 are mounted on the heat sink 1, the number of the wire through holes 15 is the same as that of the sealing plugs 4 corresponding to the plurality of wire through holes 15, the plurality of sealing plugs 4 and the plurality of wires, and the number of the wires is one more than that of the wire through holes 15. The plurality of wires are respectively a positive connecting wire 31, a plurality of intermediate connecting wires 33 and a negative connecting wire 32, the positive connecting wire 31 and the negative connecting wire 32 are respectively inserted into the first sealing plug 4 and the last sealing plug 4, two ends of each intermediate connecting wire 33 are respectively inserted into the two adjacent sealing plugs 4, and each sealing plug 4 is respectively plugged into the corresponding wiring hole 15. And then the wires plugged into the end of the sealing plug 4 are respectively welded with the anode and the cathode of the corresponding PCB.

Before or after welding, the ends of the positive connecting wire 31 and the negative connecting wire 32, which are not inserted into the sealing plug 4, are inserted into the fasteners (the invention does not limit the specific structure of the fasteners, and the fasteners may be threaded pipes, buckles, sealing plugs, etc., in this embodiment, the threaded pipes 5 are taken as an example) — the threaded pipes 5 are fastened through the threaded pipes 5, and the threaded pipes 5 serve to prevent the wires from being loosened due to pulling by external force. In this embodiment, one end of the positive connecting wire 31 and one end of the negative connecting wire 32 are soldered to the corresponding PCB, and the other end is fastened by the threaded pipe 5 and then connected to an electrical connector, which is adapted to the electrical connector b at the power line terminal, so that when the connector is installed, the two electrical connectors are connected together to achieve the connection with the power source. Further, in this embodiment, it is preferable that the first electrical connector is a waterproof wire 6, and the waterproof wire 6 is connected with the second electrical connector.

In another embodiment, multiple PCB boards are connected in parallel. In this step, each sealing plug 4 is respectively plugged into a corresponding wire routing hole 15, a positive connecting wire and a negative connecting wire are respectively inserted into the same sealing plug 4, the ends of the negative connecting wire and the positive connecting wire inserted into the same sealing plug 4 are respectively welded to the positive and negative electrodes of a corresponding PCB, the ends of the positive connecting wires not inserted into the sealing plug 4 are connected together, and the ends of the negative connecting wires not inserted into the sealing plug are connected together and then fastened by the fastening member (the invention does not limit the specific structure of the fastening member, and may be a threaded tube, a buckle, a sealing plug, etc., in this embodiment, the threaded tube 5 is taken as an example). In this embodiment, the ends of the positive connecting wires which are not inserted into the sealing plug 4 are directly connected together and then fastened to the negative connecting wires which are directly connected together by the fastening member, and the ends of the positive connecting wires which are not inserted into the sealing plug 4 and the ends of the negative connecting wires which are not inserted into the sealing plug 4 are respectively led out by a lead-out wire and then fastened by the fastening member. The electric wire fastened by the fastening piece is connected with a first electric connector, the first electric connector is matched with a second electric connector at the power line end, and when the electric wire is installed, the two electric connectors are connected together to realize the connection with the power supply. Further, in this embodiment, it is preferable that the first electrical connector is a waterproof wire 6, and the waterproof wire 6 is connected with the second electrical connector.

In the invention, the wires can be firstly fastened by the fastening piece and then connected with the electric connector, and then all the wires are welded with the PCB; or after welding each electric wire and the PCB, fastening the electric wire through a fastening piece and then connecting the electric wire with the first electric connector.

T3 mounting lens group

And covering each lens part on a PCB (printed circuit board), fixing the lens pressing frame on the corresponding light source mounting surface 111 through a buckle or a threaded fastener, and pressing the lens parts and the PCB tightly by the lens pressing frame. In order to prevent moisture, oil stain and the like from affecting the LED element, a sealing ring is further provided between the corresponding light source mounting surface 111 and the lens portion 11, so that the PCB board accommodating space formed by the light source mounting surface 111 and the lens is sealed.

T4 filled sealing colloid

And filling the sealant in the sealant filling area.

Since the fluidity of the glue is not good, the glue filling area cannot be filled by the self-flowing, and if the threaded pipe 5 is arranged perpendicular to the wire through hole 15 (on the same axis), the glue filling at the position of the sealing plug 4 is inconvenient, and a leak is left, so that the threaded pipe 5 and the wire through hole 15 need to be dislocated. In this embodiment, the threaded pipe 5 is preferably located at the end of the heat dissipating plate 11, and therefore, the threaded pipe 5 is located obliquely above the wire passing hole 15 at the end and outside the wire passing hole 15.

The disclosure above is only one specific embodiment of the present application, but the present application is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present application.