阅读说明：本技术 电路基板、电路板和显示屏组件 (Circuit substrate, circuit board and display screen assembly ) 是由 贾玉虎 于 2019-10-12 设计创作，主要内容包括：本申请公开了一种电路基板,电路基板上适于设置电路元件,电路基板的厚度两侧分别为第一侧和第二侧,电路基板上至少具有自第一侧凹向第二侧的至少一个第一盲孔,电路基板包括n层走线层,n层走线层层叠设置,相邻两层走线层之间设有绝缘层以将相邻两侧走线层间隔开设置,沿第一侧朝向第二侧的方向,多层走线层的第一层为第一走线层,多层走线层的最后一层为第n走线层,第一盲孔至少贯穿第一走线层,且贯穿至第(1+m)走线层,安装于第一盲孔的电路元件与第(1+m)走线层连接,其中,m为正整数,n为大于1的正整数,且m＜n。根据本申请的电路基板,结构简单,有利于减薄电路板的厚度,实现电路板的薄化设计。(The application discloses a circuit substrate, be suitable for setting up circuit element on the circuit substrate, circuit substrate's thickness both sides are first side and second side respectively, at least, have at least one first blind hole from the first side concavity to the second side on the circuit substrate, circuit substrate includes n layers of routing layer, n layers of routing layer range upon range of setting, be equipped with the insulating layer between the adjacent two-layer routing layer in order to separate adjacent both sides routing layer and set up, along the direction of first side towards the second side, the first layer of multilayer routing layer is first routing layer, the last layer of multilayer routing layer is nth routing layer, first blind hole runs through first routing layer at least, and run through to (1+ m) routing layer, the circuit element who installs in first blind hole is connected with (1+ m) routing layer, wherein, m is positive integer, n is for being greater than 1 positive integer, and m < n. According to the circuit substrate, the structure is simple, the thickness of the circuit board is reduced, and the circuit board is thinned.)

1. A circuit substrate adapted to have a circuit component thereon, wherein the circuit substrate has a first side and a second side on two sides of a thickness thereof, and at least one first blind hole recessed from the first side to the second side, the circuit substrate comprising:

n layers of routing layers, n layers the stacking arrangement of routing layers, it is adjacent two-layer be equipped with the insulating layer between the routing layers in order to be adjacent two-layer the routing layers are spaced apart to be set up, follow first side orientation the direction of second side, multilayer the first layer on routing layer is first routing layer, multilayer the last layer on routing layer is the nth routing layer, first blind hole runs through at least first routing layer, and runs through to (1+ m) th routing layer, install in first blind hole circuit element be suitable for with the (1+ m) th routing layer is connected, wherein, m is positive integer, n is for being greater than 1 positive integer, and m < n.

2. The circuit substrate according to claim 1, wherein m and n satisfy: and m is n-1.

3. The circuit substrate of claim 2, wherein the first blind via extends through the first, second, and third routing layers and through to a fourth routing layer, the circuit component mounted in the first blind via being adapted to be electrically connected to the fourth routing layer, wherein n is 4.

4. The circuit substrate of claim 1, wherein the circuit components mounted in the first blind via are adapted to be soldered to the (1+ m) th routing layer.

5. The circuit substrate according to claim 4, wherein solder resist layers are provided on both sides of the thickness of the circuit substrate.

6. A circuit substrate according to any one of claims 1-5, wherein the circuit component mounted in the first blind hole is adapted to protrude through the first blind hole, and the length of the circuit component protruding outside the first blind hole is less than 0.9 mm.

7. The circuit substrate of claim 6, wherein the routing layer comprises:

a metal substrate;

a metal foil disposed on a surface of the metal base material, the metal base material having a thickness less than a thickness of the metal foil.

8. The circuit substrate of claim 7, wherein the metal base material corresponding to the routing layer is adapted to be electrically connected to the circuit element.

9. The circuit substrate of claim 6, wherein at least one of the insulating layers comprises:

an insulating base material;

the reinforcing layer is arranged on the surface of the insulating base material, and the thickness of the reinforcing layer is larger than that of the insulating base material and larger than that of the routing layer.

10. The circuit substrate according to claim 1, wherein the circuit substrate has a central plane in a thickness direction, and the routing layer and the insulating layer are each arranged symmetrically with respect to the central plane.

11. The circuit substrate of claim 1, further comprising a second blind via recessed from the second side toward the first side, the second blind via extending through at least the nth routing layer and through to the (n-m) th routing layer, the circuit component mounted in the second blind via being adapted to be electrically connected to the (n-m) th routing layer.

12. A circuit board, comprising:

a circuit element;

a circuit substrate according to any one of claims 1 to 11, the circuit element being mounted on the circuit substrate.

13. A display screen assembly comprising a display screen and a circuit board according to claim 12, the circuit board being provided on a back side of the display screen.

Technical Field

The application relates to the technical field of display, in particular to a circuit substrate, a circuit board and a display screen assembly.

Background

Disclosure of Invention

The present application is directed to solving at least one of the problems in the prior art. Therefore, the circuit substrate is simple in structure, the thickness of the circuit board is reduced beneficially, and the circuit board is thinned.

According to the circuit substrate of the first aspect of the present application, the circuit substrate is suitable for disposing a circuit element thereon, the two sides of the thickness of the circuit substrate are respectively a first side and a second side, the circuit substrate is provided with at least one first blind hole recessed from the first side to the second side, the circuit substrate includes: n layers of routing layers, n layers the stacking arrangement of routing layers, it is adjacent two-layer be equipped with the insulating layer between the routing layers in order to be adjacent two-layer the routing layers are spaced apart to be set up, follow first side orientation the direction of second side, multilayer the first layer on routing layer is first routing layer, multilayer the last layer on routing layer is the nth routing layer, first blind hole runs through at least first routing layer, and runs through to (1+ m) th routing layer, install in first blind hole circuit element be suitable for with the (1+ m) th routing layer is connected, wherein, m is positive integer, n is for being greater than 1 positive integer, and m < n.

According to the circuit substrate of the embodiment of the application, through setting up the first blind hole, install in the circuit component of first blind hole can stretch into in the first blind hole in order to be connected with the (1+ m) th wiring layer, can effectively reduce the circuit component who installs in first blind hole and stretch out the outer length of first blind hole to effectively reduce the thickness of circuit board, be favorable to realizing the thin design of display screen subassembly, promote user experience effect.

A circuit board according to a second aspect of the present application, comprising: a circuit element; a circuit board according to the first aspect of the present application, wherein the circuit element is mounted on the circuit board.

According to the circuit board of the embodiment of the application, the thickness of the circuit board is effectively reduced by adopting the circuit substrate.

A display screen assembly according to a third aspect of the present application comprises a display screen and a circuit board according to the above second aspect of the present application, the circuit board being provided on a back side of the display screen.

According to the display screen assembly, by adopting the circuit board, the thinning design of the display screen assembly is facilitated, and the user experience is improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of a circuit substrate according to one embodiment of the present application;

FIG. 2 is a schematic view of a circuit substrate according to another embodiment of the present application;

FIG. 3 is a schematic diagram of a circuit board according to one embodiment of the present application;

FIG. 4 is a schematic view of a display screen assembly according to one embodiment of the present application.

Reference numerals:

a display screen assembly 300, a display screen 201,

A circuit board 200, a circuit element 101,

A circuit board 100,

A first side 100a, a second side 100b,

A first blind hole 100c, a second blind hole 100d, a central plane 100e,

A wiring layer 1,

First wiring layer 11, second wiring layer 12, third wiring layer 13, fourth wiring layer 14,

An n-th wiring layer 16,

A metal base material 10a, a metal foil 10b,

An insulating layer 2, an insulating base material 21, a reinforcing layer 22,

A solder resist layer 3,

A cover film layer 4, an insulating sub-layer 41, and an adhesive layer 42.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

A circuit substrate 100 according to an embodiment of the present application is described below with reference to fig. 1 to 3.

As shown in fig. 1 to 3, according to the circuit substrate 100 of the embodiment of the present disclosure, the circuit substrate 100 is suitable for disposing the circuit element 101, and the circuit element 101 is suitable for being electrically connected to the circuit substrate 100, two sides of the thickness of the circuit substrate 100 are respectively the first side 100a and the second side 100b, at least one first blind via 100c is disposed on the circuit substrate 100 and is recessed from the first side 100a to the second side 100b, the first blind via 100c may be one or more, the first blind via 100c may be formed by recessing a portion of the surface of the circuit substrate 100 corresponding to the first side 100a toward the second side 100b, and the first blind via 100c does not penetrate through the circuit substrate 100 in the thickness direction (e.g., the AA' direction in fig. 1 to 3) of the circuit substrate 100. In the description of the present application, "a plurality" means two or more.

As shown in fig. 1 to fig. 3, the circuit substrate 100 includes n routing layers 1, n is a positive integer greater than 1, the n routing layers 1 are stacked, for example, the n routing layers 1 may be stacked in a thickness direction of the circuit substrate 100, an insulating layer 2 is disposed between two adjacent routing layers 1 to space the two adjacent routing layers 1, the first routing layer 11 is a first routing layer of the multiple routing layers 1, and the last routing layer 16 is an nth routing layer of the multiple routing layers 1 in a direction from the first side 100a to the second side 100 b.

Wherein the first blind via 100c penetrates at least the first routing layer 1, and the first blind via 100c penetrates to the (1+ m) -th routing layer, then the first blind via 100c penetrates the first routing layer 1 to form an opening on the first routing layer 1, the first blind via 100c extends toward the second side 100b, the first blind via 100c can penetrate the m-th routing layer to form an opening on the m-th routing layer, the first blind via 100c does not penetrate the (1+ m) -th routing layer, at least a portion of the circuit element 101 mounted to the first blind via 100c can be disposed in the first blind via 100c, and the circuit element 101 mounted to the first blind via 100c is adapted to be connected to the (1+ m) -th routing layer, for example, the circuit element 101 mounted to the first blind via 100c can be electrically connected to the (1+ m) -th routing layer, then the circuit element 101 mounted to the first blind via 100c can extend into the first blind via 100c to be connected to the (1+ m) -th routing layer, for example, circuit element 101 mounted in first blind via 100c can be lowered to (1+ m) th trace layer 1 to connect with the (1+ m) th trace layer; when circuit substrate 100 is applied to circuit board 200, can effectively reduce the length that circuit element 101 installed in first blind hole 100c stretches out outside first blind hole 100c, thereby the height that circuit element 101 on circuit substrate 100 stretches out circuit substrate 100 in circuit substrate 100 thickness direction has been reduced, be convenient for circuit element 101 to stretch out the management and control of height, reduce circuit element 101 limit for height size, and then effectively reduced circuit board 200's thickness, display screen subassembly 300's thickness has been reduced, be favorable to realizing the thin design of display screen subassembly 300, promote user experience effect. Wherein m is a positive integer and m is less than n.

For example, m may be 1, where n is greater than or equal to 2, the first blind via 100c may penetrate through the first routing layer 11 to form a first opening on the first routing layer 11, and the first blind via 100c may penetrate through the second routing layer 12, so that the second blind via 100d does not penetrate through the second routing layer 12, and the circuit component 101 mounted on the first blind via 100c is suitable for being connected to the second routing layer 12. For another example, m may be 2, where n is greater than or equal to 3, first blind via 100c may penetrate first routing layer 11 and second routing layer 12 to form an opening on first routing layer 11 and second routing layer 12, respectively, first blind via 100c may not penetrate third routing layer 13, and circuit element 101 mounted to first blind via 100c may be adapted to be connected to third routing layer 13. For another example, m may be 3, where n is greater than or equal to 4, the first blind via 100c may penetrate through the first routing layer 11, the second routing layer 12 and the third routing layer 13 to form an opening on the first routing layer 11, the second routing layer 12 and the third routing layer 13, respectively, the first blind via 100c does not penetrate through the fourth routing layer 14, and the circuit component 101 mounted on the first blind via 100c is adapted to be connected to the fourth routing layer 14. Of course, the values of m and n are not limited to this, and it is only necessary to ensure that m is a positive integer, n is a positive integer greater than 1, and m is less than n.

It is understood that when there are a plurality of first blind holes 100c, the depths of the plurality of first blind holes 100c may be the same or different. The wiring layer 1 may be a metal wiring layer, etc., and the circuit element 101 may be understood in a broad sense, for example, the circuit element 101 may include a resistor, a Transient Voltage Suppressor (TVS), etc.

According to the circuit substrate 100 of the embodiment of the application, through setting up the first blind hole 100c, install in the circuit component 101 of first blind hole 100c can stretch into in the first blind hole 100c with be connected with the (1+ m) th routing layer, for in the conventional art, circuit component directly places in first routing layer in order to be connected with first routing layer, this application can effectively reduce the circuit component 101 of installing in first blind hole 100c and stretch out the outer length of first blind hole 100c, thereby effectively reduced the thickness of circuit board 200, be favorable to realizing the thin design of display screen subassembly 300, promote user experience effect.

In some embodiments of the present application, m, n satisfy: m-n-1, that is, the first blind via 100c penetrates through the nth wiring layer 16, that is, the first blind via 100c penetrates through the first wiring layer 11, the second wiring layer 12, …, and the (n-1) th wiring layer, the first blind via 100c does not penetrate through the nth wiring layer 16, and the nth wiring layer 16 may participate in forming a wall surface of the first blind via 100 c. Therefore, on the premise of facilitating the installation of the circuit element 101 and realizing the reliable connection of the circuit element 101 and the circuit substrate 100, the depth of the first blind hole 100c is deepened, so that the length of the circuit element 101 installed in the first blind hole 100c extending out of the first blind hole 100c is further reduced, and the thickness of the circuit board 200 is further reduced.

For example, in the example of fig. 1-3, n is 4, that is, the circuit substrate 100 includes four wiring layers 1, the four wiring layers 1 are a first wiring layer 11, a second wiring layer 12, a third wiring layer 13 and a fourth wiring layer 14, respectively, the first blind via 100c may penetrate through the first wiring layer 11, the second wiring layer 12 and the third wiring layer 13 to form openings on the first wiring layer 11, the second wiring layer 12 and the third wiring layer 13, respectively, the first blind via 100c penetrates through the fourth wiring layer 14, then the first blind via 100c does not penetrate through the fourth wiring layer 14, the circuit component 101 mounted in the first blind via 100c is adapted to be electrically connected with the fourth wiring layer 14, for example, the circuit component 101 mounted in the first blind via 100c may penetrate into the first blind via 100c and sink to the fourth wiring layer 14 to be electrically connected with the fourth wiring layer 14.

In some embodiments of the present application, as shown in fig. 3, the circuit component 101 mounted in the first blind via 100c is adapted to be connected to the (1+ m) -th routing layer by soldering, so as to ensure the mounting reliability of the circuit component 101 mounted in the first blind via 100c and ensure the connection reliability of the circuit component 101 and the circuit substrate 100. Of course, the connection manner between the circuit element 101 mounted in the first blind via 100c and the (1+ m) -th wiring layer is not limited thereto.

For example, in the example of fig. 1 and 2, both sides of the thickness of the circuit substrate 100 may be provided with the Solder Resist layers 3, and the Solder Resist layers 3 may be formed as Solder Resist protective films (SR) on both sides of the thickness of the circuit substrate 100, respectively, which may prevent Solder from being deposited on the surface of the circuit substrate 100 at the time of subsequent soldering.

In some embodiments of the present application, as shown in fig. 3, the circuit component 101 mounted in the first blind hole 100c is adapted to extend out of the first blind hole 100c, and the length of the circuit component 101 extending out of the first blind hole 100c is less than 0.9mm, for example, the length of the circuit component 101 extending out of the first blind hole 100c can be 0.6mm, 0.7mm, or 0.8mm, etc., then the length of the portion of the circuit component 101 mounted in the first blind hole 100c extending out of the first blind hole 100c in the thickness direction of the circuit substrate 100 is less than 0.9mm, compared to the conventional technology in which the circuit substrate 100 does not have the first blind hole 100c, or the circuit substrate 100 has the first blind hole 100c and the first blind hole 100c does not extend through the first routing layer 11, in which case the circuit component 101 is directly connected to the first routing layer 11, so that the length of the circuit component 101 extending out of the first blind hole 100c is greater than or equal to 0.9mm, the thickness of circuit board 200 has effectively been reduced in this application, has made things convenient for the management and control of circuit element 101 protrusion height.

It is understood that the length of the circuit element 101 extending out of the first blind hole 100c may be understood in a broad sense, and may include the length of the circuit element 101 extending out of the first blind hole 100c, and may further include solder, encapsulating glue and insulating glue paper of the circuit element 101.

For example, in the example of fig. 3, the length h of the circuit element 101 mounted in the first blind hole 100c extending out of the first blind hole 100c may not exceed 0.62mm, for example, the length of the circuit element 101 mounted in the first blind hole 100c extending out of the first blind hole 100c may be 0.4mm, 0.54mm, 0.6mm, and the like, and then the height of the circuit element 101 mounted in the first blind hole 100c extending out of the first blind hole 100c in the thickness direction of the circuit substrate 100 may not exceed 0.62mm, which further reduces the thickness of the circuit board 200, and is beneficial to implementing a thinned design of the circuit board 200. Of course, the length of the circuit element 101 mounted in the first blind hole 100c extending out of the first blind hole 100c is not limited thereto

Of course, the circuit element 101 mounted in the first blind hole 100c may not extend out of the first blind hole 100c, and the circuit element 101 mounted in the first blind hole 100c may be completely disposed in the first blind hole 100 c.

As shown in fig. 1 and 2, routing layer 1 may include a metal substrate 10a and a metal foil 10b, where metal foil 10b is provided on a surface of metal substrate 10a, and then metal foil 10b may be provided on one surface of metal substrate 10a in a thickness direction, and a thickness of metal substrate 10a is smaller than a thickness of metal foil 10b, so as to facilitate arrangement of routing layer 1 while providing routing layer 1 with certain strength and flexibility. Wherein, the metal substrate 10a corresponding to the wiring layer 1 is suitable for being electrically connected with the circuit element 101, for example, the circuit element 101 mounted in the first blind via 100c is suitable for being electrically connected with the metal substrate 10a of the (1+ m) th wiring layer; of course, the circuit element 101 mounted on the first blind via 100c may be electrically connected to the metal foil 10b of the corresponding wiring layer 1.

Here, the relationship between the thickness of the metal base 10a and the thickness of the metal foil 10b is not limited thereto. In addition, the wiring layer 1 may be a copper wiring layer, which ensures good conductivity of the circuit substrate 100, and at this time, the wiring layer 1 may include a copper base material and a copper foil; but is not limited thereto.

In some embodiments of the present application, as shown in fig. 1 and fig. 2, at least one insulating layer 2 may include an insulating base material 21 and a reinforcing layer 22, the reinforcing layer 22 is disposed on a surface of the insulating base material 21, a thickness of the reinforcing layer 22 is greater than a thickness of the insulating base material 21, and a thickness of the reinforcing layer 22 is greater than a thickness of the routing layer 1, so as to ensure a structural strength of the circuit substrate 100, and facilitate improvement of reliability of the circuit substrate 100 in use. The insulating substrate 21 may be a Polyimide (PI) member, but is not limited thereto.

It is understood that when the insulating layer 2 is a plurality of layers, the structure of the plurality of insulating layers 2 may or may not be identical.

In some embodiments of the present application, as shown in fig. 1 and fig. 2, the circuit substrate 100 has a central plane 100e in the thickness direction, and the routing layers 1 and the insulating layers 2 are symmetrically arranged with respect to the central plane 100e, so that the routing layers 1 and the insulating layers 2 of the circuit substrate 100 are regularly arranged, which is convenient for simplifying the design of the circuit substrate 100 and reducing the design cost. The routing layers 1 can be odd layers or even layers, when the routing layers 1 are odd layers, one routing layer 1 can be symmetrical about a central plane 100e, the other routing layers 1 can be symmetrically arranged with respect to the central plane 100e in pairs, and when the routing layers 1 are even layers, the multiple routing layers 1 can be symmetrically arranged with respect to the central plane 100e in pairs; similarly, the insulating layers 2 may be odd-numbered layers or even-numbered layers, when the insulating layers 2 are odd-numbered layers, one of the insulating layers 2 may be symmetrical with respect to the central plane 100e, and the remaining insulating layers 2 may be arranged two by two symmetrically with respect to the central plane 100e, and when the insulating layers 2 are even-numbered layers, the insulating layers 2 may be arranged two by two symmetrically with respect to the central plane 100 e.

Of course, the laminated structure of the entire circuit substrate 100 may be arranged symmetrically with respect to the center plane 100 e; alternatively, the laminated structure of the entire circuit substrate 100 may be arranged asymmetrically with respect to the central plane 100 e.

In some embodiments of the present application, as shown in fig. 2, the circuit substrate 100 further has a second blind via 100d recessed from the second side 100b toward the first side 100a, the second blind via 100d penetrates at least the nth wiring layer 16, and the second blind via 100d penetrates to the (n-m) th wiring layer, such that the second blind via 100d penetrates the nth wiring layer 16 to form an opening on the nth wiring layer 16, the second blind via 100d extends toward the first side 100a, the second blind via 100d does not penetrate the (n-m) th wiring layer, and the circuit component 101 mounted in the second blind via 100d is adapted to be electrically connected to the (n-m) th wiring layer, for example, the circuit component 101 mounted in the second blind via 100d can extend into the second blind via 100d to be electrically connected to the (n-m) th wiring layer. Therefore, when the circuit elements 101 are multiple, the installation positions of the circuit elements 101 can be set according to actual requirements, and diversified design of the circuit board 200 is achieved, so that the differentiation requirements can be better met.

It is understood that the circuit substrate 100 may have only the first blind via 100c and no second blind via 100d, and the circuit elements 101 on the circuit substrate 100 may be mounted on the circuit substrate 100 from the first side 100a, so that the second side 100b of the circuit substrate 100 is relatively flat, which is convenient for positioning and mounting the circuit substrate 100 in the using process.

According to the circuit board 200 of the embodiment of the second aspect of the present application, for example, as shown in fig. 3, the circuit board 200 may include the circuit component 101 and the circuit substrate 100, the circuit component 101 is mounted on the circuit substrate 100, and then at least one circuit component 101 may be mounted on the first blind hole 100c on the circuit substrate 100. Wherein the circuit substrate 100 is the circuit substrate 100 according to the above-mentioned first aspect of the present application.

It is understood that the circuit elements 101 may be plural, the external dimensions of the plural circuit elements 101 may not be completely the same, for example, the heights of the plural circuit elements 101 in the thickness direction of the circuit substrate 100 may be different, and when at least two of the plural circuit elements 101 are mounted in the first blind holes 100c, if the depths of the plural first blind holes 100c on the circuit substrate 100 are different, the at least two circuit elements 101 may be mounted by selecting the corresponding first blind holes 100 c; but is not limited thereto.

According to the circuit board 200 of the embodiment of the application, by adopting the circuit substrate 100, the thickness of the circuit board 200 is effectively reduced.

According to the display screen assembly 300 of the third aspect of the present application, for example, as shown in fig. 4, the display screen assembly 300 may include a display screen 201 and a circuit board 200, the circuit board 200 is disposed on a back side of the display screen 201, and the display screen 201 may be connected to the circuit board 200. Wherein the circuit board 200 is a circuit board 200 according to the above-mentioned second aspect of the present application.

It should be noted that, when the user uses the display screen 201, a side of the display screen 201 facing the user may be understood as a front side of the display screen 201, and a side of the display screen 201 facing away from the user may be understood as a back side of the display screen 201.

According to the display screen assembly 300 of the embodiment of the application, by adopting the circuit board 200, the display screen assembly 300 is beneficial to realizing the thinning design, and the user experience is improved.

Other constructions and operations of the display screen assembly 300 according to embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.

The circuit substrate 100 according to an embodiment of the present application is described in detail in one specific embodiment with reference to fig. 1 and 3. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting. The circuit board 100 may be a flexible circuit board, a rigid-flex board, or the like, and the circuit board 200 may be a flexible circuit board, a rigid-flex board, or the like.

As shown in fig. 1 to fig. 3, a circuit component 101 is suitable to be disposed on the circuit substrate 100, both sides of the thickness of the circuit substrate 100 are provided with solder resists 3, both sides of the thickness of the circuit substrate 100 are a first side 100a and a second side 100b, respectively, the circuit substrate 100 is provided with at least a first blind via 100c recessed from the first side 100a to the second side 100b, and the circuit component 100 is suitable to extend into the first blind via 100c to be electrically connected to the circuit substrate 100. The circuit substrate 100 has a center plane 100e in the thickness direction, and the laminated structure of the circuit substrate 100 is symmetrically arranged about the center plane 100 e.

The circuit substrate 100 comprises four wiring layers 1, wherein one wiring layer 1 can extend outwards from the outer edge of the circuit substrate 100 to form a pin; the four routing layers 1 are stacked, an insulating layer 2 is arranged between every two adjacent routing layers 1 to space the two adjacent routing layers 1, and the four routing layers 1 are respectively a first routing layer 11, a second routing layer 12, a third routing layer 13 and a fourth routing layer 14 along the direction from the first side 100a to the second side 100 b; first blind hole 100c can run through first routing layer 11, second routing layer 12 and third routing layer 13, in order to form the opening on first routing layer 11, second routing layer 12 and third routing layer 13 respectively, first blind hole 100c runs through to fourth routing layer 14, then first blind hole 100c does not run through fourth routing layer 14, install in circuit element 101 of first blind hole 100c can sink to fourth routing layer 14 in first blind hole 100c, and be connected with fourth routing layer 14 electricity, then circuit element 101 can place on fourth routing layer 14, circuit element 101 can stretch out first blind hole 100c, circuit element 101 stretches out to the outer length h of first blind hole 100c and is no longer than 0.62 mm.

As shown in fig. 1, wiring layer 1 may include a metal substrate 10a and a metal foil 10b, wherein metal foil 10b is disposed on a surface of metal substrate 10a, a thickness of metal substrate 10a is smaller than a thickness of metal foil 10b, and circuit element 101 mounted in first blind via 100c is adapted to be electrically connected to metal substrate 10a of fourth wiring layer 14.

As shown in fig. 1, the insulating layers 2 are three layers, wherein one insulating layer 2 is symmetrically disposed about the central plane 100e, and the other two insulating layers 2 are symmetrically disposed about the central plane; the insulating layer 2 comprises an insulating base material 21, the other two insulating layers 2 comprise the insulating base material 21 and a reinforcing layer 22, the reinforcing layer 22 is arranged on the surface of the insulating base material 21, the thickness of the reinforcing layer 22 is larger than that of the insulating base material 21, and the thickness of the reinforcing layer 22 is larger than that of the wiring layer 1.

As shown in fig. 1, the circuit substrate 100 may further include a Cover film (CVL) layer 4, where the Cover film layer 4 may be two layers, and each Cover film layer 4 is disposed between the reinforcing layer 22 and the routing layer 1; each of the cover film layers 4 may include an insulating sub-layer 41 and an adhesive layer 42.

The thickness of the solder resist layer 3 may be 25 μm, the thickness of the metal base 10a may be 6 μm, the thickness of the metal foil 10b may be 12 μm, the thickness of the insulating base 21 may be 12.5 μm, the thickness of the reinforcing layer 22 may be 50 μm, the thickness of the insulating sublayer 41 may be 12.5 μm, and the thickness of the adhesive layer 42 may be 20 μm.

According to the circuit substrate 100 of the embodiment of the application, the structure is simple, the connection reliability of the circuit element 101 and the circuit substrate 100 is guaranteed, meanwhile, the thickness of the circuit board is favorably thinned, and the circuit board thinning design is realized.

In the description of the present application, it is to be understood that the terms "center", "lateral", "length", "thickness", "height", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.