阅读说明：本技术 一种手机背板制作方法 (method for manufacturing backboard of mobile phone ) 是由 王忠雷 魏雪 于 2019-09-17 设计创作，主要内容包括：本发明公开了一种手机背板制作方法,包括以下步骤,S1、在石墨膜的表面涂抹环氧树脂,再将处理后的石墨膜层叠,投入到热压机内,在压力和温度的作用下形成石墨膜/环氧树脂层状预制板；S2、对S1中的预制板进行打孔处理后浸泡到环氧树脂中,得到石墨膜/环氧树脂层状复合板；S3、通过电镀工艺对S2中的复合板的两侧面镀上铜层；S4、将S3中制得的复合板放置到模具内,通过注塑成型工艺制得手机背板的预制板；S5、对S4中的预制板进行切割、打磨和喷漆,得到成品收集背板。该方法,通过将基板与电镀处理后的墨膜/环氧树脂层状复合板进行结合,大大增强了手机背板的散热效果,增加了手机内部元件的使用寿命。(The invention discloses a manufacturing method of mobile phone back plates, which comprises the following steps of S1, coating epoxy resin on the surface of a graphite film, laminating the treated graphite film, putting the laminated graphite film into a hot press, and forming a graphite film/epoxy resin laminated prefabricated plate under the action of pressure and temperature, S2, punching the prefabricated plate in S1, soaking the prefabricated plate into epoxy resin to obtain a graphite film/epoxy resin laminated composite plate, S3, plating copper layers on two side surfaces of the composite plate in S2 through an electroplating process, S4, placing the composite plate prepared in S3 into a mold, and preparing the prefabricated plate of the mobile phone back plate through an injection molding process, S5, cutting, polishing and spraying paint on the prefabricated plate in S4 to obtain a finished product collecting back plate.)

1, kinds of mobile phone backboard manufacturing method, characterized by comprising the following steps,

s1, coating epoxy resin on the surface of the graphite film, laminating the treated graphite film, putting the laminated graphite film into a hot press, and forming a graphite film/epoxy resin laminated precast slab under the action of pressure and temperature;

s2, perforating the prefabricated plate in the S1, and then soaking the prefabricated plate in epoxy resin to obtain a graphite film/epoxy resin layered composite plate;

s3, plating copper layers on the two side faces of the composite board in the S2 through an electroplating process;

s4, placing the composite board prepared in the S3 into a mold, and preparing a prefabricated board of the mobile phone backboard through an injection molding process;

and S5, cutting, grinding and spraying paint to the prefabricated plate in the S4 to obtain the finished product collecting back plate.

2. The method for manufacturing kinds of cellular phone back boards as claimed in claim 1, wherein the thickness of the copper plating layer in S3 is 4-6 μm.

3. The method of manufacturing kinds of cellular phone back panels, as set forth in claim 1, wherein the graphite film/epoxy resin laminate pre-fabricated sheet in S1 is formed by laminating 4-5 graphite films.

4. The method for manufacturing the kinds of cellular phone back panels of claim 1, wherein the area of the holes punched in S2 is not less than sixty percent of the area of the prefabricated panel, and the diameter of the holes is 50-100 μm.

Technical Field

The invention belongs to the technical field of mobile phone back plates, and particularly relates to a manufacturing method of mobile phone back plates.

Background

Mobile devices such as mobile phones and PADs have become necessities in modern life, so the market of matched parts is more and more mature. In order to meet the requirements of users on personalized products, various shell parts with unique functions and different shapes are developed by trade companies in the industry, along with the rise of electronic products, corresponding part design and processing technology are greatly developed, the practicability is higher and higher, the mobile phone back plate manufactured by the existing mobile phone back plate manufacturing method is insufficient in heat dissipation, the heat dissipation requirement of the mobile phone with increasingly improved performance is difficult to meet, and therefore the mobile phone back plate needs to be improved in a targeted mode.

Disclosure of Invention

The invention aims to provide manufacturing methods of mobile phone back plates for use so as to solve the problems in the background technology.

In order to achieve the above purpose, the invention provides the following technical scheme that the manufacturing method of the cell phone back boards comprises the following steps,

s1, coating epoxy resin on the surface of the graphite film, laminating the treated graphite film, putting the laminated graphite film into a hot press, and forming a graphite film/epoxy resin laminated precast slab under the action of pressure and temperature;

s2, perforating the prefabricated plate in the S1, and then soaking the prefabricated plate in epoxy resin to obtain a graphite film/epoxy resin layered composite plate;

s3, plating copper layers on the two side faces of the composite board in the S2 through an electroplating process;

s4, placing the composite board prepared in the S3 into a mould, and preparing a prefabricated board of the mobile phone back board through an injection molding process;

and S5, cutting, grinding and spraying paint to the prefabricated plate in the S4 to obtain the finished product collecting back plate.

Preferably, the thickness of the copper plating layer in S3 is 4 to 6 μm.

Preferably, the graphite film/epoxy resin laminate precast sheet in S1 is composed of a stack of 4 to 5 graphite films.

Preferably, the area of the holes punched in S2 is not less than sixty percent of the area of the prefabricated panel, and the diameter of the holes is 50-100 microns.

The invention has the technical effects and advantages that: according to the manufacturing method of the mobile phone backboard, the graphite film/epoxy resin layered composite board is manufactured firstly, the copper layer is covered on the graphite film/epoxy resin layered composite board through the copper electroplating technology, and finally the graphite film/epoxy resin layered composite board is integrated on the base plate of the mobile phone backboard, so that the heat dissipation effect of the back shell is greatly enhanced, the working environment of heating elements such as a mobile phone mainboard is ensured, and the service life of the heating elements of the mobile phone is further ensured.

Detailed Description

The embodiments described herein are merely some embodiments of the present invention , and not all embodiments based on the embodiments of the present invention, all other embodiments obtained by one of ordinary skill in the art without inventive faculty are within the scope of the present invention.

The invention provides a method for manufacturing mobile phone back boards, which comprises the following steps,

s1, coating epoxy resin on the surface of the graphite film, laminating the treated graphite film, putting the laminated graphite film into a hot press, and forming a graphite film/epoxy resin laminated precast slab under the action of pressure and temperature;

and S2, punching the prefabricated plate in the S1, soaking the prefabricated plate in epoxy resin to obtain the graphite film/epoxy resin laminated composite plate, ensuring that the molten epoxy resin can enter gaps among all graphite film layers, laminating a plurality of graphite films to , and curing the laminated composite plate into the graphite film/epoxy resin laminated composite plate through the treatment of a hot press.

S3, plating copper layers on the two side faces of the composite board in the S2 through an electroplating process, so that the electroplated copper fills the holes formed in the composite board to form a rivet structure, the mechanical toughness of the composite board is guaranteed, and the heat conducting performance is further enhanced in the step .

S4, placing the composite board prepared in the S3 into a mould, and preparing a prefabricated board of the mobile phone back board through an injection molding process;

and S5, cutting, grinding and spraying paint to the prefabricated plate in the S4 to obtain the finished product collecting back plate.

The thickness of the copper plating layer in the S3 is 4-6 microns, so that the tightness between the copper plating layer and the composite board is ensured, and the situation that the copper plating layer is heated and falls off is avoided.

The graphite film/epoxy resin laminated prefabricated plate in the S1 is formed by laminating 4-5 graphite films, so that the thickness of the graphite film/epoxy resin laminated composite plate manufactured by processing is ensured to be thinner, the thick bottom of the whole back plate is ensured to be thinner, and the practicability of the product is improved.

The area of the punched holes in the S2 is not less than sixty percent of the area of the prefabricated plate, the diameter of each hole is 50-100 microns, the holes can be completely filled with copper plating, a rivet structure is formed, and therefore each layer of graphite film is stably fixed, and the physical performance of the graphite film/epoxy resin laminated composite plate is guaranteed.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalent substitutions and modifications may be made to some features of the embodiments described above, and any modifications, equivalents, improvements, etc. within the spirit and principle of the present invention should be included in the scope of the present invention.