阅读说明：本技术 一种便于模切贴合的高性能吸波导热硅胶垫片及其制备方法 (High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof ) 是由 翟文斌 陈锋 方文 姜学广 于 2019-10-31 设计创作，主要内容包括：本发明涉及功能材料技术领域,尤其是一种便于模切贴合的高性能吸波导热硅胶垫片及其制备方法；其质量份组成如下：硅油：5%-30%；电磁吸波粉料：65.5%-95%；催化剂：0.1%-2%；交联剂：0.1%-2%；消泡剂：0.1%-1.5%；抗氧化剂：0.1%-1%；本发明中的便于模切贴合的高性能吸波导热硅胶垫片,将导热吸波材料涂布于聚酯离型材料层上,具有柔韧性好、便于个性化模切形状的优点,同时还具有导热系数高、散热快、高频磁导率高、吸波效果好、便于成型加工的优点；本发明中的便于模切贴合的高性能吸波导热硅胶垫片的制备方法,工艺简单,制备的高性能导热硅胶垫片具有柔韧性好、便于个性化模切形状的优点。(The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof; the composition comprises the following components in parts by mass: silicone oil: 5% -30%; electromagnetic wave-absorbing powder: 65.5% -95%; catalyst: 0.1% -2%; a crosslinking agent: 0.1% -2%; defoaming agent: 0.1% -1.5%; antioxidant: 0.1% -1%; the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience for individualized die cutting shape, high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity, good wave-absorbing effect and convenience for forming and processing by coating the heat-conducting wave-absorbing material on the polyester release material layer; the preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.)

1. The utility model provides a high performance is inhaled wave heat conduction silica gel gasket convenient to cross cutting laminating which characterized in that: the composition comprises the following components in parts by mass:

silicone oil: 5% -30%;

electromagnetic wave-absorbing powder: 65.5% -95%;

catalyst: 0.1% -2%;

a crosslinking agent: 0.1% -2%;

defoaming agent: 0.1% -1.5%;

antioxidant: 0.1% -1%;

the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.

2. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.

3. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the electromagnetic wave absorbing powder is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.

4. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.

5. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.

6. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the cross-linking agent is one or more of ethyl orthosilicate and dibenzoyl peroxide.

7. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.

8. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the antioxidant is one or more of multi-component hindered phenol antioxidant and phosphite antioxidant.

9. A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching is characterized by comprising the following steps of: the method comprises the following steps:

(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;

(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.

Technical Field

The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof.

Background

The heat-conducting wave-absorbing material is a bifunctional composite material integrating heat management and wave-absorbing functions. The material can be used between integrated circuits, heat sinks, other heat conducting elements and metal substrates, and the product can inhibit unnecessary electromagnetic energy coupling, resonance and surface current generated by electromagnetic interference besides solving the problem of heat conduction in the material. The material can be widely applied to electronic components and equipment such as communication equipment, network terminals, storage equipment, consumer electronics, power supply devices and the like.

With the rapid development of electronic communication technology, the heat dissipation requirements of light, thin and integrated electronic products are increasing, and meanwhile, the electromagnetic interference between electronic components can also interfere the signal receiving and processing of the electronic products. In the prior art, in order to meet the requirements of electromagnetic shielding and use, one scheme is to attach adhesives to two surfaces of a multilayer wave-absorbing material so as to achieve the purposes of wave absorption and attachment, and the method has low heat dissipation performance, and the finished product has a limited thickness adjustment range and heat dissipation; the other scheme is that the wave-absorbing alloy powder is added into silicone oil to prepare a paste material, the paste material is inconvenient to use, special equipment such as a dispenser and the like is required to be used, die cutting is inconvenient, the magnetic conductivity is low, and the heat dissipation performance is general.

Disclosure of Invention

The purpose of the invention is: the defects in the prior art are overcome, the high-performance wave-absorbing and heat-conducting silica gel gasket convenient for die cutting and attaching is provided, the silica gel gasket has the advantages of being good in flexibility and convenient for individualized die cutting shapes, and the wave-absorbing material is high in heat conductivity coefficient, fast in heat dissipation, high in high-frequency magnetic conductivity, good in wave-absorbing effect and convenient to mold and process.

Another object of the invention is: the preparation method has the advantages of simple process and high production efficiency, and the prepared wave-absorbing heat-conducting silica gel gasket has the advantages of good flexibility and convenience in individualized die cutting shape, and the wave-absorbing material has the advantages of high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity and good wave-absorbing effect.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

the utility model provides a high performance is inhaled ripples heat conduction silica gel gasket convenient to cross cutting laminating which the part by mass constitutes as follows:

silicone oil: 5% -30%;

electromagnetic wave-absorbing powder: 65.5% -95%;

catalyst: 0.1% -2%;

a crosslinking agent: 0.1% -2%;

defoaming agent: 0.1% -1.5%;

antioxidant: 0.1% -1%;

furthermore, the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.

Further, the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.

Furthermore, the electromagnetic wave-absorbing powder material is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.

Furthermore, the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.

Further, the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.

Further, the cross-linking agent is one or more of ethyl orthosilicate, an organic silicon compound and dicumyl peroxide.

Further, the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.

Further, the antioxidant is one or more of a multi-element hindered phenol antioxidant and a phosphite antioxidant.

A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and fitting comprises the following steps:

(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;

(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.

The technical scheme adopted by the invention has the beneficial effects that:

the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience in individualized die cutting shape, high heat conductivity coefficient, high heat dissipation speed, high-frequency magnetic conductivity, good wave-absorbing effect and convenience in forming and processing.

The preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.

Drawings

Fig. 1 is a performance test chart of the high-performance wave-absorbing heat-conducting silica gel gasket in embodiment 4 of the invention.

Detailed Description

The following examples are intended to provide those skilled in the art with a more complete understanding of the present invention, and are not intended to limit the scope of the present invention. Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.