阅读说明：本技术 电子板 (Electronic board ) 是由 矢野久晃 拉马达·伊斯梅尔 于 2019-06-25 设计创作，主要内容包括：本发明提供一种电子板。电子板具备：传感器片,所述传感器片包含X并联电极线和Y并联电极线；底盘,所述底盘粘贴传感器片,在传感器片的下端部连接有传感器基板,在传感器片的右端部连接有传感器基板,传感器片的下端部的附近以覆盖底盘的下端部的方式被弯曲,从而传感器基板被配置于底盘的背面。(The invention provides an electronic board. The electronic board is provided with: the sensor sheet comprises an X parallel electrode wire and a Y parallel electrode wire; and a chassis to which the sensor sheet is attached, the sensor substrate being connected to a lower end portion of the sensor sheet, the sensor substrate being connected to a right end portion of the sensor sheet, and the sensor substrate being disposed on a back surface of the chassis by bending a vicinity of the lower end portion of the sensor sheet so as to cover the lower end portion of the chassis.)

1. An electronic board capable of detecting a contact position on a writing board, comprising:

a sensor sheet including a plurality of first electrode lines extending in a first direction and a plurality of second electrode lines extending in a second direction that is a direction intersecting the first direction;

a chassis to which the sensor sheet is fixed,

a first sensor substrate connected to the plurality of first electrode lines is connected to an end portion of the sensor sheet on the first direction side, a second sensor substrate connected to the plurality of second electrode lines is connected to an end portion of the sensor sheet on the second direction side,

the vicinity of the end of the sensor sheet is bent so as to cover the end of the chassis, and at least one of the first sensor substrate and the second sensor substrate is disposed on the back surface of the chassis.

2. The electronic board according to claim 1,

the first sensor substrate is disposed on the back surface of the chassis by bending the vicinity of the first direction side end of the sensor sheet so as to cover the first direction side end of the chassis,

the vicinity of the second-direction-side end of the sensor sheet is bent at the second-direction-side end of the chassis, so that the second sensor substrate is arranged on the side of the chassis.

3. The electronic board according to claim 2, further comprising:

a support member disposed on a back side of the chassis and supporting the chassis;

a frame constituting an outer frame of the electronic board,

the support member includes an upper surface portion, a side surface portion that extends from the upper surface portion to a back surface side of the chassis and is fixed to the frame by screws, and a chassis pressing portion that contacts a back surface of the chassis,

the first sensor substrate is also in contact with a buffer member disposed in a gap formed between the upper surface portion of the support member and the back surface of the chassis, and is supported to be movable relative to the chassis.

4. The electronic board according to claim 3,

the second sensor substrate is also in contact with a buffer member disposed in a gap formed between a side surface of the chassis and a side surface of the bezel, and is supported to be movable relative to the chassis.

5. The electronic board according to claim 3 or 4, further comprising:

a back cover covering a back of the electronic board;

a mounting part for mounting the back cover to the electronic board,

the mounting member includes a lower surface portion that is inserted into an opening portion formed in the back cover and is fixed to the upper surface portion of the support member by a screw, and a back cover pressing portion that supports the back cover,

the back cover is sandwiched between the upper surface portion of the support member and the back cover pressing portion.

6. The electronic board according to any one of claims 1 to 5, further comprising:

the writing board can leave recognizable handwriting when a pen point part of a pen as a writing tool is contacted;

a position detection section that detects the contact position on the writing board where the nib portion contacts;

a pen recognition part that detects a recognition signal output from the pen.

Technical Field

The present invention relates to an electronic board capable of leaving a handwriting of a character or the like by a writing tool.

Background

Currently, an electronic board using a display with a touch panel (display type electronic board) has been proposed. In the display-type electronic board, an image corresponding to text data, image data, or the like is displayed on a display screen, and written information handwritten on the display screen by an electronic pen or the like is displayed as an image on the display screen. In addition, the display-type electronic board can store or print an image of a display screen to which writing information is added (for example, see patent document 1).

Patent document

Patent document 1: japanese patent laid-open publication No. 2004-188736

Disclosure of Invention

However, since the conventional electronic board uses a display for displaying an image based on image data, written information, and the like, the structure of the electronic board becomes complicated and the cost increases.

The invention aims to provide an electronic board which can realize low cost through a simple structure.

An aspect of the present invention provides an electronic board capable of detecting a contact position on a writing board, including: a sensor sheet including a plurality of first electrode lines extending in a first direction and a plurality of second electrode lines extending in a second direction that is a direction intersecting the first direction; and a chassis to which the sensor sheet is fixed, to which a first sensor substrate connected to the plurality of first electrode lines is connected at an end portion of the sensor sheet on the first direction side, and to which a second sensor substrate connected to the plurality of second electrode lines is connected at an end portion of the sensor sheet on the second direction side, wherein the vicinity of the end portion of the sensor sheet is bent so as to cover the end portion of the chassis, and at least one of the first sensor substrate and the second sensor substrate is disposed on a back surface of the chassis.

According to the present invention, it is possible to provide an electronic board capable of achieving cost reduction with a simple configuration.

Drawings

Fig. 1 is an explanatory diagram showing a configuration example of a writing input system according to an embodiment of the present invention.

Fig. 2 is an explanatory diagram of an example of a mode of using the writing input system according to the embodiment of the present invention.

Fig. 3 is an explanatory diagram showing the arrangement of the X parallel electrode lines and the Y parallel electrode lines of the electronic board according to the embodiment of the present invention.

Fig. 4 is an explanatory diagram showing a function of the loop switching circuit of the electronic board according to the embodiment of the present invention.

Fig. 5 is an explanatory diagram schematically showing a vertical cross-sectional structure of the electronic board according to the embodiment of the present invention.

Fig. 6 is an explanatory diagram showing an example of definition of association between the resonance frequency and the pen attribute in the writing input system according to the embodiment of the present invention.

Fig. 7 is a rear view of the electronic board of the embodiment of the present invention as viewed from the back side.

Fig. 8 is a view showing a part (right end) of the section a-a in fig. 7.

Fig. 9 is a view showing a part (upper end portion, lower end portion) of the B-B section of fig. 7.

Fig. 10 is a view showing a part (lower end) of the B-B cross section of fig. 7.

Fig. 11 is a view showing a part (upper end) of the B-B section of fig. 7.

Fig. 12 is a perspective view showing a part (upper end) of the section a-a in fig. 7.

Fig. 13 is a perspective view showing a part (upper end) of the C-C section of fig. 7.

Fig. 14 is a perspective view of the electronic board according to the embodiment of the present invention as viewed from the back side.

Fig. 15 is an exploded perspective view of the electronic board according to the embodiment of the present invention as viewed from the back side.

Fig. 16 is an exploded perspective view showing a method of fixing an electronic board at an upper corner of the electronic board according to the embodiment of the present invention.

Fig. 17 is a perspective view showing the structure of the corner reinforcing plate of the electronic board according to the embodiment of the present invention.

Fig. 18 is a perspective view showing a structure of an electronic board mounting board of the electronic board according to the embodiment of the present invention.

Fig. 19A is a perspective view showing a state in which the corner reinforcing plate and the electronic board mounting plate are fixed by screws at the upper right corner of the electronic board according to the embodiment of the present invention.

Fig. 19B is a perspective view showing a state in which the corner reinforcing plate and the electronic board mounting plate are fixed by screws at the upper left corner portion of the electronic board according to the embodiment of the present invention.

Fig. 19C is a perspective view showing a state in which the corner reinforcing plate and the electronic board mounting plate are fixed by screws at the right lower corner portion of the electronic board according to the embodiment of the present invention.

Fig. 19D is a perspective view showing a state in which the corner reinforcing plate and the electronic board mounting plate are fixed by screws at the lower left corner portion of the electronic board according to the embodiment of the present invention.

Fig. 20 is a perspective view showing a state in which the corner reinforcing plate and the electronic board are fixed to each other by screws at the lower corner of the electronic board according to the embodiment of the present invention.

Fig. 21A is a perspective view showing a state in which a chassis fixing plate and a back cover pressing plate are fixed by screws at an upper center portion of an electronic board according to an embodiment of the present invention.

Fig. 21B is a perspective view showing a state in which the chassis fixing plate and the back cover pressing plate are fixed by screws in the lower center portion of the electronic board according to the embodiment of the present invention.

Fig. 22 is a perspective view of the electronic board according to the embodiment of the present invention as viewed from the back side.

Fig. 23 is a perspective view showing a state where the electronic board according to the embodiment of the present invention is mounted on a frame of a cradle.

Fig. 24 is a perspective view showing a configuration of a pen receiving portion including a power supply and a connection terminal of an electronic board according to an embodiment of the present invention.

Fig. 25 is a sectional perspective view showing an internal structure of a pen receiving portion including a power supply and a connection terminal of the electronic board according to the embodiment of the present invention.

Fig. 26 is a perspective view of a portion including the power supply and the connection terminal of the electronic board according to the embodiment of the present invention, as viewed from the back side.

Fig. 27A is a circuit diagram of a general series resistor, and fig. 27B is a circuit diagram of a touch sensor circuit.

Fig. 28 is a diagram showing a structure of a sensor substrate of an electronic board according to the embodiment of the present invention.

Fig. 29 is a diagram showing a structure of a sensor substrate of an electronic board according to the embodiment of the present invention.

Description of the reference numerals

10: electronic board

10 a: writing board

10 b: sensor unit

11: coordinate detecting unit

12: pen recognition unit

13 x: x parallel electrode wire

13 y: y parallel electrode wire

19: pen receiving part

20: control unit

21: display device

30: pen with writing-in function

100: writing input system

110: rims

110 a: lower side frame

110 b: upper side frame

110 c: right side frame

110 d: left side frame

110 e: angle connecting plate

120: chassis

130: back cover

150: sensor sheet

150 a: sensor substrate

150 b: sensor substrate

150 c: sensor substrate

152: sensor wiring

152 x: sensor wiring

152 y: sensor wiring

157 x: shielding layer

157 y: shielding layer

160 a: buffer piece

160 b: buffer piece

161 a: buffer piece

161 b: buffer piece

161 c: buffer piece

171: interface connecting plate

172: controller substrate

173: interface substrate

191: power supply button

192：LED

193: connecting terminal

194: circuit substrate

210 a: angle reinforcing plate

210 b: chassis fixing plate

220: back cover pressing plate

220 a: electronic board setting board

220 b: back cover pressing plate

343: holding member

Detailed Description

The present invention will be described in further detail below with reference to the accompanying drawings. In the following description, all aspects are exemplary and should not be construed as limiting the present invention.

Fig. 1 is an explanatory diagram showing a configuration example of a writing input system 100 according to an embodiment of the present invention. Fig. 2 is an explanatory diagram illustrating an example of a mode of using the writing input system 100 shown in fig. 1. Fig. 3 is an explanatory diagram showing a structure of an electronic board according to the embodiment of the present invention, particularly, an arrangement of X parallel electrode lines and Y parallel electrode lines. Fig. 4 is an explanatory diagram showing a function of the loop switching circuit in the electronic board shown in fig. 1. Fig. 5 is an explanatory diagram schematically showing an outline of a vertical cross-sectional structure of the electronic board shown in fig. 1.

The writing input system 100 shown in fig. 1 is generally composed of a pen 30 and an electronic board 10. The pen 30 is a writing instrument having a pen body 31, a cap 32, a nib portion 33, an identifier 34, and an ink supply portion 36. In fig. 1, a pen 30 is schematically shown in a form capable of grasping a shape. The identifier 34 has an identification circuit not shown in fig. 1. The specific structure of the identifier 34 will be described later.

The cap 32 is detachable from the pen body 31, and covers the nib portion 33 so as not to be exposed in a state of being attached to the pen body 31.

The nib portion 33 is made of, for example, a felt material impregnated with ink. The nib portion 33 may be generally configured as a marker for a Whiteboard (Whiteboard) which is well known. When the cap 32 is removed to expose the nib portion 33 and the front end thereof is brought into contact with the writing board 10a as a writing area of the electronic board 10, ink adheres to the position and visible handwriting 40 (see fig. 2) is left on the electronic board 10.

The other end of the nib portion 33 is in contact with an ink supply portion 36 storing ink, and the ink is supplied from the ink supply portion 36 to the nib portion 33 by capillary action.

An identifier 34 is attached to the outer periphery of the pen body 31 near the portion where the cap 32 is fitted. The identifier 34 has an identification circuit not shown in fig. 1. The identification circuit is formed, for example, by an LC resonant circuit including an inductance component L and a capacitance component C.

The writing board 10a is made of a material that leaves handwriting when written with the pen 30. In addition, the writing board 10a is preferably made of a material from which handwriting can be erased. The writing board 10a may be disposable if it can be formed inexpensively, but is preferably formed of a material that can be erased and written many times. For example, the writing board 10a is made of a resin material. When the pen 30 is a marker pen, the writing board 10a has a surface like a marker board.

As shown in fig. 5, the electronic board 10 surrounds its periphery with a frame 110 serving as a frame member to secure its strength. The surface side of the electronic board 10 surrounded by the frame 110 is a writing board 10a of a writing area. A pen receiving portion 19 (pen tray) is disposed at the lower end of the electronic board 10. As described later, the pen receiving portion 19 may be formed integrally with a part of the bezel 110 (a lower bezel 110a described later).

As shown in fig. 1, the electronic board 10 is functionally roughly divided into a coordinate detecting unit 11 and a pen recognizing unit 12.

The coordinate detecting unit 11 (an example of a position detecting unit of the present invention) detects coordinates of a position where the nib portion 33 of the pen 30 contacts the electronic board 10 (writing board 10 a). The pen recognition section 12 detects a recognition signal from the identifier 34 attached to the pen 30.

As an example of a configuration for realizing these functions, the coordinate detecting unit 11 of the present embodiment operates as a capacitance type touch panel. The pen recognition unit 12 operates as an electromagnetic induction circuit and detects a recognition signal from the identifier 34.

The coordinate detecting unit 11 includes a Y parallel electrode line 13Y, a Y detecting circuit 15Y, an X parallel electrode line 13X, an X detecting drive circuit 14X, and a loop switching circuit 16. The coordinate detecting unit 11 shares the X parallel electrode lines 13X and the X detection driving circuit 14X as hardware with the pen recognizing unit 12. The loop switching circuit 16 is a circuit for switching between a case where the shared hardware is used for the coordinate detecting unit 11 and a case where the shared hardware is used for the pen recognizing unit 12.

The pen recognition unit 12 includes an X parallel electrode line 13X shared with the coordinate detection unit 11, an X detection drive circuit 14X, a loop switching circuit 16, and an X detection circuit 15X.

The X parallel electrode lines 13X (an example of the first electrode lines of the present invention) are a plurality of electrode lines embedded in the vicinity of the surface of the electronic board 10 (writing board 10a) written by the pen 30. The X parallel electrode lines 13X are arranged in a row in the X direction (transverse direction) (an example of the second direction of the present invention) and extend in the Y direction (longitudinal direction) (an example of the first direction of the present invention) (see fig. 3).

On the other hand, the Y parallel electrode line 13Y (an example of a second electrode line of the present invention) is a plurality of electrode lines embedded in the vicinity of the surface of the electronic board 10 (writing board 10a) written by the pen 30. The Y parallel electrode lines 13Y are arranged in a row in the Y direction (vertical direction) and extend in the X direction (horizontal direction) (see fig. 3). Each of the Y parallel electrode lines 13Y is buried to a depth (layer) different from each of the X parallel electrode lines 13X. The respective electrode lines of the Y parallel electrode lines 13Y and the respective electrode lines of the X parallel electrode lines 13X intersect each other with an insulating film having a predetermined thickness therebetween, and do not contact each other (see fig. 5). The X parallel electrode lines 13X and the Y parallel electrode lines 13Y are made of copper wiring, for example.

Further, since the X parallel electrode lines 13X and the Y parallel electrode lines 13Y are disposed near the surface of the writing board 10a, the writing board 10a is not suitable for an aluminum plate for electrically shielding the X parallel electrode lines 13X and the Y parallel electrode lines 13Y, a steel plate for magnetically shielding the X parallel electrode lines 13X and the Y parallel electrode lines 13Y, and the like, and for example, a resin material such as an epoxy resin or a polycarbonate resin coated with a melamine resin is suitable.

As shown in fig. 3, the X detection drive circuit 14X is connected to one end side of the X parallel electrode lines 13X, and applies a predetermined voltage to each of the X parallel electrode lines 13X. The predetermined voltage may be different between the case where the predetermined voltage functions as the coordinate detecting unit 11 and the case where the predetermined voltage functions as the pen recognizing unit 12. The X detection drive circuit 14X sequentially applies a pulse voltage to the X parallel electrode lines 13X on the right end from the X parallel electrode lines 13X on the left end, for example.

The Y detection circuit 15Y detects the magnitude of the voltage or current induced in each Y parallel electrode line 13Y in accordance with the driving of the X detection drive circuit 14X. The magnitude of the coupling capacitance depends on the magnitude of the coupling capacitance between each X parallel electrode line 13X and each Y parallel electrode line 13Y, but the magnitude of the coupling capacitance differs between the case where the dielectric or the metal body is in contact with the electronic board 10 in the vicinity where the two intersect and the case where the dielectric or the metal body is not in contact with the electronic board 10 in the vicinity where the two intersect. For example, since the pen tip 33 impregnated with ink and a human finger are dielectrics, when they are brought into contact with the electronic board 10, the coupling capacitance increases. By detecting the change in the coupling capacitance, the position coordinates where the pen tip portion 33 or a human finger touches the electronic board 10 can be detected. This is known as an operation of a capacitive touch panel.

In addition, since the coupling capacitance between the human finger and the pen tip portion 33 is different in magnitude, it is possible to determine whether the human finger or the pen tip portion 33 is based on the difference in magnitude of the coupling capacitance, as well as to detect the position coordinates of the contact with the electronic board 10.

As shown in fig. 4, the loop switching circuit 16 includes a first changeover switch 16a that switches whether or not two X parallel electrode lines 13X separated by a prescribed distance from among the plurality of X parallel electrode lines 13X are connected on the other end side. When the pair of X parallel electrode lines 13X are connected at the other end side by the first changeover switch 16a, a U-shaped current path is thereby formed. This functions as an induction coil of the pen recognition portion 12. The second changeover switch 16b is disposed on one end side of the U-shaped current path.

The second changeover switch 16b operates in synchronization with the first changeover switch 16 a. The second changeover switch 16b connects the X parallel electrode lines 13X to the X detection drive circuit 14X in a state where the first changeover switch 16a disconnects the paired X parallel electrode lines 13X. The second changeover switch 16b connects the X parallel electrode lines 13X to the X detection circuit 15X in a state where the first changeover switch 16a connects the pairs of X parallel electrode lines 13X. Therefore, in a state where the paired X parallel electrode lines 13X are disconnected, each X parallel electrode line 13X is driven by the corresponding X detection drive circuit 14X.

On the other hand, in a state where the paired X parallel electrode lines 13X are connected to form a U-shaped current path as an induction coil, the second changeover switch 16b connects the X parallel electrode line 13X on one end side of the U-shaped current path to the X detection circuit 15X. The other end of the U-shaped current path is not provided with a changeover switch, and the other end is driven by the X detection driving circuit 14X.

In the present embodiment, there are a plurality of sets of U-shaped current paths forming the induction coil, and the current paths are arranged in the X direction (lateral direction).

When the loop switching circuit 16 uses the X parallel electrode line 13X as the pen recognition unit 12, for example, the induction coils are sequentially driven one by one from the left end induction coil to the right end induction coil. In fig. 4, the left-end induction coil 13c is shown by a thicker line than the other induction coils in order to show the induction coil that is driven only at the left end. The other end of the induction coil 13c, which is a U-shaped current path, is driven by the X detection driving circuit 14X while changing the driving frequency. The X detection circuit 15X on the one end side of the induction coil 13c detects the magnitude of the current flowing through the induction coil at the response frequency. Then, the same detection is performed for the right adjacent induction coil, and further, the detection is performed by sequentially moving the right adjacent induction coil.

The loop switching circuit 16 is a component necessary for the coordinate detecting unit 11 and the pen recognizing unit 12 to share the X parallel electrode line 13X.

When the identifier 34 is present in the vicinity of the driven induction coil and the induction coil is driven at a driving frequency corresponding to the resonance frequency that the identifier has, a large resonance current flows in the resonance circuit due to electromagnetic coupling with the induction coil. Correspondingly, a large current flows through the induction coil. By detecting the magnitude of the current by the X detection circuit 15X, it is possible to detect which resonant frequency identifier 34 exists in which region in the X direction.

In the present embodiment, the resonant frequency of the identifier 34 is predetermined corresponding to the properties of the pen 30.

Fig. 6 is an explanatory diagram showing an example of the definition relating the resonance frequency f0 to the properties of the pen 30 in the present embodiment. Fig. 6(a) shows a list of examples in which the resonance frequency f0 of the identifier 34 is made to correspond to the ink color (writing color) of the pen. The pens for the respective colors black, blue, green, yellow, orange, red define different resonance frequencies f 0. The user installs the identifier 34 of the resonance frequency f0 corresponding thereto according to the writing color of the pen.

The (b) list shown in fig. 6 shows an example in which not only the writing color of the pen 30 but also properties such as the thickness of the pen tip and the shape of the pen tip are defined corresponding to the resonance frequency f0 corresponding to their combination. As shown in the list (b), by assigning in advance a resonance frequency f0 uniquely corresponding to a combination of the attributes of the plurality of items, the attributes of the plurality of items corresponding to the detected resonance frequency f0 can be obtained. The resonance frequency f0 is not limited to the value shown in fig. 6, but is selected based on the size of the resonance coil 341 of the identifier 34 and the balance of the oscillation energy (intensity). For example, the resonant frequency f0 may be defined in the range of 400 to 700 kHz.

If the coordinate detecting part 11 detects the position coordinates of the nib part 33 in the area where the pen recognizing part 12 detects the presence of the identifier 34, handwriting data corresponding to the property of the pen corresponding to the position coordinates and the identification information can be generated.

For example, the handwriting data may be generated based on the detection contents of the coordinate detecting unit and the pen recognizing unit by causing the personal computer to execute a dedicated processing program. Alternatively, a microcomputer may be incorporated in the electronic board 10 so that the microcomputer executes not only the processing of the coordinate detecting unit 11 or the pen recognizing unit 12 but also the processing of generating handwriting data.

In fig. 1, a main body that processes generation of handwriting data is shown by a control section 20. The control unit 20 includes a CPU or a microcomputer as a center, and includes peripheral circuits such as a timer and an input/output circuit, a memory, and the like.

The control unit 20 may be a separate component from the electronic board 10, or may be integrated with the electronic board 10, that is, incorporated into the electronic board 10. In other words, the processing may be performed outside the writing input system 100 of the present embodiment, or may be included in the writing input system 100. In the former case, the writing input system 100 detects and provides information that becomes the basis for generating handwriting data. In the latter case, the writing input system 100 includes, among other things, the generation of handwriting data.

In the case where the writing input system 100 of the embodiment of the present invention includes until handwriting data is generated, for example, as shown in fig. 2, a display device 21 may also be connected to the controller 20 to display the generated handwriting data in real time. Of course, even if there is no display of the display device 21, handwriting 40 written with the pen 30 is left in the writing board 10a of the electronic board 10.

The display device 21 is effective for confirming that the handwriting data generated by the control section 20 coincides with the handwriting 40 of the tablet 10 a.

The handwriting data reflects the properties of the pen 30. For example, according to the definition of fig. 6(a), the writing color of the handwriting data displayed on the display device 21 coincides with the writing color of the handwriting 40. In addition, according to the definition of fig. 6(b), the thickness and shape of the handwriting also reflect the thickness and shape of the nib portion 33 in the displayed handwriting data. When a hard copy of handwriting data is printed using a color printer, not shown, handwriting in which the writing color or the thickness and shape of the pen tip are also reflected can be obtained.

[ Structure of electronic Board ]

Next, a specific structure of the electronic board 10 according to the embodiment of the present invention will be described. For example, as shown in fig. 2, the electronic board 10 is used by being mounted on a stand 50 or on a wall surface. In addition, the electronic board 10 may also be removably arranged, for example, hung on the frame 51 of the stand 50.

Fig. 7 is a rear view of the electronic board 10 of the present embodiment as viewed from the back side. Fig. 8 is a view showing a part (right end) of the section a-a in fig. 7. Fig. 9 is a view showing a part (upper end portion, lower end portion) of the B-B cross section of fig. 7, fig. 10 is a view showing a part (lower end portion) of the B-B cross section of fig. 7, fig. 11 is a view showing a part (upper end portion) of the B-B cross section of fig. 7, and fig. 12 is a perspective view showing a part (upper portion) of the a-a cross section of fig. 7. Fig. 13 is a perspective view showing a part (upper part) of the section C-C of fig. 7.

The electronic board 10 includes: a writing board 10a made of a resin material which leaves handwriting 40 written with the pen 30; a sensor sheet 150 disposed on the back surface side of the writing board 10 a; a chassis 120 disposed on the back side of the sensor sheet 150 and to which the sensor sheet 150 is attached; a rear cover 130 disposed on the rear surface side of the chassis 120 and covering the rear surface of the electronic board 10; and a frame 110 surrounding the periphery of the electronic board 10 to constitute an outer frame.

The tablet 10a, the sensor sheet 150, and the chassis 120 are integrally bonded to each other by a double-sided tape, an adhesive, or the like (an example of an adhesive material according to the present invention). The integrated tablet 10a, sensor sheet 150, and chassis 120 constitute a sensor unit 10b (fig. 8 and the like). Note that the writing board 10a, the sensor sheet 150, and the chassis 120 may be integrally fixed to each other, and may be integrally formed by, for example, an adhesive or the like on the peripheral side surface or by other members (screws, frames, and the like).

As shown in fig. 14, the frame 110 is formed in a frame shape by coupling a lower frame 110a, an upper frame 110b, a right frame 110c, and a left frame 110d to each other. The lower frame 110a or the upper frame 110b is an example of a first frame of the present invention, and the right frame 110c or the left frame 110d is an example of a second frame of the present invention. The sensor unit 10b is disposed within the frame of the bezel 110, and a metal member (a corner reinforcing plate 210a and a chassis fixing plate 210b described later) that supports the sensor unit 10b from the back side is attached to the back side of the sensor unit 10b, and the back cover 130 is attached to the metal member.

As shown in fig. 9, the pen receiving portion 19 and spaces 110s and 19s for accommodating various wiring and the like are integrally formed in the lower side frame 110 a.

The sensor sheet 150 is formed by bonding and fixing the transparent film on which the X parallel electrode lines 13X are arranged, the transparent film on which the Y parallel electrode lines 13Y are arranged, and the insulating film disposed between these electrode lines to each other by a double-sided tape or the like. The sensor sheet 150 has flexibility in the form of a film as a whole. A sensor substrate 150a (an example of a first sensor substrate of the present invention) is connected to a lower end of the sensor chip 150, a sensor substrate 150b is connected to an upper end of the sensor chip 150, and a sensor substrate 150c (an example of a second sensor substrate of the present invention) is connected to a right end (or a left end) of the sensor chip 150. One end (lower end) of the X parallel electrode line 13X is connected to the sensor substrate 150a, the other end (upper end) of the X parallel electrode line 13X is connected to the sensor substrate 150b, and one end (right end) of the Y parallel electrode line 13Y is connected to the sensor substrate 150 c.

Sensor wires (sensor wires 152X and 152y in fig. 28 and 29) are arranged on the sensor substrate 150a, and one end of each sensor wire is electrically connected to one end of the X parallel electrode line 13X. The other end of the sensor wiring is electrically connected to a connector connection portion (connector connection portion 156 in fig. 28 and 29) mounted on the sensor substrate 150 a. A relay wiring (not shown) is connected to the connector connection portion, and the relay wiring is electrically connected to the X detection drive circuit 14X and the X detection circuit 15X.

A sensor wiring is arranged on the sensor substrate 150b, and one end of the sensor wiring is electrically connected to the other end of the X parallel electrode line 13X. The other end of the sensor wiring is electrically connected to a connector connection portion mounted on the sensor substrate 150 b. A relay wiring is connected to the connector connection portion, and the relay wiring is electrically connected to the loop switching circuit 16.

A sensor wiring is arranged on the sensor substrate 150c, and one end of the sensor wiring is electrically connected to the Y parallel electrode line 13Y. The other end of the sensor wiring is electrically connected to a connector connection portion mounted on the sensor substrate. A relay wiring is connected to the connector connection portion, and the relay wiring is electrically connected to the Y detection circuit 15Y. The relay wirings are disposed on the back surface side of the chassis 120 and connected to the controller board 172 (see fig. 14). Specific structures of the sensor substrates 150a, 150b, and 150c will be described later.

Further, the sensor substrate 150a may be connected to the right end of the sensor chip 150, the sensor substrate 150b may be connected to the left end of the sensor chip 150, and the sensor substrate 150c may be connected to the upper end (or lower end) of the sensor chip 150.

Fig. 14 is a perspective view of the electronic board 10 viewed from the back side. In fig. 14, the back cover 130 is omitted. On the back surface of the chassis 120, a reinforcing plate 111 is disposed in the vertical direction. The reinforcing plate 111 has a lower end screwed to the lower frame 110a and an upper end screwed to the upper frame 110b, and a central portion contacting the rear surface of the chassis 120. A board tray 170 is disposed between the reinforcing plate 111 and the right side frame 110c, and an interface connection plate 171, a controller board 172, and an interface board 173 are mounted on the board tray 170. The controller board 172 is mounted with the control unit 20, the X detection drive circuit 14X, the X detection circuit 15X, the loop switching circuit 16, the Y detection circuit 15Y, and the like. A cable (wiring) is connected to the interface board 173, and the cable is connected to an external device such as a Personal Computer (PC) or a projector. In the writing input system 100, for example, when an image output from a projector is projected onto the writing board 10a and a user writes information such as handwritten characters on the writing board 10a with reference to the projected image, the information (handwriting data) can be added to the image and stored in an overlaid manner. The data file and the like generated in the electronic board 10 are enabled to be saved in a storage medium such as USB (registered trademark).

The chassis 120 supports the rear surface by a corner reinforcing plate 210a disposed at a corner (four corners) and a chassis fixing plate 210b disposed at a portion other than the corner. The corner reinforcing plate 210a and the chassis fixing plate 210b are examples of the supporting member of the present invention. Four corner reinforcing plates 210a and five chassis securing plates 210b are shown in fig. 14. The number of the chassis fixing plates 210b is not limited. The corner reinforcing plate 210a is fixed to two adjacent (both sides) of the corner portion by screws, and the chassis fixing plate 210b is fixed to one (one side) of the frames 110 by screws.

Fig. 15 is an exploded perspective view of the electronic board 10 viewed from the back side. The lower frame 110a, the upper frame 110b, the right frame 110c, and the left frame 110d are connected to each other by corner connecting plates 110e (L-shaped metal members) arranged at corners (four corners), thereby forming a frame-shaped frame 110. The frame-shaped frame 110 may be integrally formed of a metal material, a resin material, or the like.

An electronic board installation plate 220a (an example of the mounting member of the present invention) is fixed to the rear surface of the corner reinforcing plate 210a with screws, and a rear cover pressing plate 220b is fixed to the rear surface of the chassis fixing plate 210b with screws. In the rear cover 130, an opening 130a is formed in a portion overlapping the corner reinforcing plate 210a and a portion overlapping the chassis fixing plate 210 b. The electronic board installation plate 220a is inserted into the opening 130a from the back surface side of the back cover 130, and is fixed to the corner reinforcing plate 210a by screws. The rear cover pressing plate 220b is inserted into the opening 130a from the rear surface side of the rear cover 130, and is fixed to the chassis fixing plate 210b by screws. The back cover 130 is fixed (sandwiched) between the corner reinforcing plate 210a and the electronic board installation plate 220a, and between the chassis fixing plate 210b and the back cover pressing plate 220 b.

Fig. 16 is an exploded perspective view showing a method of fixing the electronic board 10 at the corner. The upper side frame 110b and the right side frame 110c are connected to each other by a corner connecting plate 110e with screws or the like. The tablet 10a, the sensor sheet 150, and the base plate 120 are arranged in this order, and are integrally bonded to each other via an adhesive material (e.g., double-sided tape). The integrated sensor unit 10b is inserted into the frame 110 formed in a frame shape.

As shown in fig. 16, the corner reinforcing plate 210a is fixed to the upper side frame 110b and the right side frame 110c by screws while pressing the back surface of the chassis 120 of the sensor unit 10 b. Fig. 17 is a perspective view showing the structure of the corner reinforcing plate 210 a. As shown in fig. 17, the corner reinforcing plate 210a includes an upper surface portion 201a, a first side surface portion 201b (an example of a first side surface portion of the present invention), a second side surface portion 201c (an example of a second side surface portion of the present invention), a third side surface portion 201d, and a chassis pressing portion 201e (corresponding to a chassis pressing portion of the present invention). The upper surface portion 201a is a portion parallel to the back surface of the chassis 120, and has 4 screw holes for screw-fixing with the electronic board setting board 220 a. The first side surface portion 201b extends from an end of the upper surface portion 201a to the back surface side of the chassis 120, and has two screw holes for screw-fastening to the upper side frame 110b (see fig. 16). The second side surface portion 201c extends from the end of the upper surface portion 201a to the back surface side of the chassis 120, and has two screw holes for screw-fastening to the right side frame 110c (see fig. 16). The third side surface portion 201d extends from an end of the upper surface portion 201a to the back surface side of the chassis 120, and the chassis pressing portion 201e extends from an end of the third side surface portion 201d in a direction parallel to the back surface of the chassis 120. A space S2 is formed in a portion surrounded by the upper surface portion 201a, the first side surface portion 201b, the second side surface portion 201c, and the third side surface portion 201 d. When the first side surface portion 201b and the second side surface portion 201c of the corner reinforcing plate 210a are fixed to the upper side frame 110b and the right side frame 110c by screws, the chassis pressing portion 201e contacts the rear surface of the chassis 120, and supports the sensor unit 10b from the rear surface side. Further, a gap corresponding to the space S2 is formed between the upper surface portion 201a of the corner reinforcing plate 210a and the chassis 120 (see fig. 11).

As shown in fig. 16, the electronic board installation plate 220a is inserted into the opening 130a from the back surface side of the back cover 130 and is fixed to the corner reinforcing plate 210a by screws. Fig. 18 is a perspective view showing the structure of the electronic board installation board 220 a. As shown in fig. 18, the electronic board installation plate 220a includes a lower surface portion 202a, a first rear surface cover pressing portion 202b, a second rear surface cover pressing portion 202c, a third rear surface cover pressing portion 202d, a hook portion 202e, and an engagement portion 202 f. The lower surface portion 202a is a portion parallel to the back surface of the chassis 120, and has two screw holes for screw-fixing with the corner reinforcing plate 210 a. The first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d extend from the respective ends of the lower surface portion 202a by a height H1 in the rear surface direction of the electronic board 10, and extend in a direction parallel to the rear surface of the chassis 120. The first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d are examples of the rear cover pressing portion of the present invention.

The hook portion 202e extends from the lower end of the lower surface portion 202a by a height H2 in the direction of the back surface of the electronic board 10, and the locking portion 202f extends from the end of the hook portion 202e in the direction parallel to (downward of) the back surface of the chassis 120. The height H1 is set to be substantially the same as the thickness of the back cover 130. When the electronic board installation plate 220a is inserted into the opening 130a of the rear cover 130 and the lower surface portion 202a of the electronic board installation plate 220a is screwed to the upper surface portion 201a of the corner reinforcing plate 210a, the first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d are in contact with the rear surface of the rear cover 130, and support the rear cover 130 from the rear surface side. The hook portion 202e and the locking portion 202f are hooked on the frame 51 (see fig. 2). The hooking portion 202e may be provided at the upper end portion of the lower surface portion 202a or at the upper end portion of the first back surface cover pressing portion 202b, but is preferably provided at the lower end portion of the lower surface portion 202a from the viewpoint of the structure and the manufacturing simplicity.

Fig. 19A is a perspective view showing a state in which the corner reinforcing plate 210a and the electronic board installation plate 220a are screwed to the right upper corner of the electronic board 10. In fig. 19A, the back cover 130 is omitted. The corner reinforcing plate 210a is fixed to the upper side frame 110b and the right side frame 110c by screws, and the chassis pressing portion 201e presses and supports the chassis 120 from the back side. The lower surface portion 202a of the electronic board installation plate 220a is fixed to the upper surface portion 201a of the corner reinforcing plate 210a by screws, and the first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d support the rear cover 130 from the rear surface side (see fig. 15).

Here, as shown in fig. 19B, the electronic board installation plate 220a may be configured without the second rear surface cover pressing part 202c and the third rear surface cover pressing part 202 d. Fig. 19B is a perspective view showing a state where the corner reinforcing plate 210a and the electronic board installation plate 220a are screwed to the upper left corner of the electronic board 10. The lower surface portion 202a of the electronic board installation plate 220a is fixed to the upper surface portion 201a of the corner reinforcing plate 210a by screws, and the first rear cover pressing portion 202b supports the rear cover 130 from the rear surface side (see fig. 15).

The four corner reinforcing plates 210a attached to the respective corners (four corners) have a common structure. Fig. 19A shows a corner reinforcing plate 210a disposed at an upper right corner, fig. 19B shows a corner reinforcing plate 210a disposed at an upper left corner, fig. 19C shows a corner reinforcing plate 210a disposed at a lower right corner, and fig. 19D shows a corner reinforcing plate 210a disposed at a lower left corner. The corner reinforcing plates 210a disposed at the respective corners have a common structure, and are rotated and positioned so as to correspond to the respective corners, and are fixed by screws.

Fig. 20 is a perspective view showing a state in which the corner reinforcing plate 210a and the electronic board mounting plate 220a are screwed to the lower corner of the electronic board 10. Here, the back cover 130 is also omitted. The corner reinforcing plate 210a is fixed to the lower side frame 110a and the right side frame 110c by screws, and the chassis pressing portion 201e presses and supports the chassis 120 from the rear surface. The lower surface portion 202a of the electronic board installation plate 220a is fixed to the upper surface portion 201a of the corner reinforcing plate 210a by screws, and the first rear cover pressing portion 202b, the second rear cover pressing portion 202c, and the third rear cover pressing portion 202d support the rear cover 130 from the rear surface side (see fig. 15).

Fig. 21A is a perspective view showing a state in which the chassis fixing plate 210b and the back cover pressing plate 220b are fixed by screws in the upper center portion of the electronic board 10. Here, the back cover 130 is also omitted. The chassis fixing plate 210b is fixed to the upper frame 110b by screws, and the pressing portion 203e presses and supports the chassis 120 from the rear surface. The lower surface portion 204a of the rear cover pressing plate 220b is fixed to the upper surface portion 203a of the chassis fixing plate 210b by screws, and the first rear cover pressing portion 204b, the second rear cover pressing portion 204c, the third rear cover pressing portion 204d, and the fourth rear cover pressing portion 204e support the rear cover 130 from the rear side (see fig. 15).

Fig. 21B is a perspective view showing a state in which the chassis fixing plate 210B and the back cover pressing plate 220B are fixed by screws in the lower center portion of the electronic board 10. Here, the back cover 130 is also omitted. The chassis fixing plate 210b is fixed to the lower side frame 110a by screws, and the pressing portion 203e presses and supports the chassis 120 from the rear surface. The lower surface portion 204a of the rear cover pressing plate 220b is fixed to the upper surface portion 203a of the chassis fixing plate 210b by screws, and the first rear cover pressing portion 204b, the second rear cover pressing portion 204c, the third rear cover pressing portion 204d, and the fourth rear cover pressing portion 204e support the rear cover 130 from the rear side (see fig. 15).

The rear cover pressing plate 220b may be omitted. In this case, as shown in fig. 22, the back cover 130 is supported at the corners (four corners) by the electronic board installation plate 220a, and is fixed at the center to the chassis fixing plate 210b by screws or the like. In the case where the rear cover pressing plate 220b is omitted, the number of parts of the electronic board 10 can be reduced. In addition, the opening 130a of the back cover 130 does not need to be processed. The electronic board 10 is not limited to the structure shown in fig. 14, and may be the structure shown in fig. 22.

[ method 1 for fixing sensor substrate ]

A first fixing method of the sensor substrates 150a, 150b, and 150c will be described. The sensor substrates 150a and 150b disposed on the long sides (upper and lower sides) of the electronic board 10 are disposed on the back surface side of the chassis 120, and the sensor substrate 150c disposed on the short side (for example, right side) of the electronic board 10 is disposed on the side surface side of the chassis 120.

Specifically, as shown in fig. 9, the sensor sheet 150 is rotated 180 degrees so as to cover the lower end (lower side surface) of the chassis 120 at the lower end of the chassis 120, and the sensor substrate 150a is disposed on the rear surface of the chassis 120. A cushion member 160a is disposed between the sensor substrate 150a disposed on the rear surface of the chassis 120 and the corner reinforcing plate 210a supporting the rear surface of the chassis 120 (space S2 (see fig. 10)). Specifically, when the corner reinforcing plate 210a is screwed to the lower frame 110a and the right frame 110c, the cushion member 160a is disposed in the gap (space S2 in fig. 10) formed between the upper surface portion 201a of the corner reinforcing plate 210a and the rear surface of the chassis 120. The buffer member 160a contacts and presses the upper surface of the sensor substrate 150 a. The chassis pressing portion 201e of the corner reinforcing plate 210a presses the chassis 120 from the back surface side in a region where the sensor substrate 150a is not disposed on the back surface of the chassis 120. Thereby, the sensor substrate 150a is supported in a state of being pressed to the front surface side by the cushion member 160 a. In addition, the sensor unit 10b is sandwiched by the corner reinforcing plate 210a and the bezel 110.

As shown in fig. 9, at the upper end of the chassis 120, the sensor sheet 150 is rotated 180 degrees so as to cover the upper end (upper side) of the chassis 120, and the sensor substrate 150b is disposed on the back surface of the chassis 120, similarly to the sensor substrate 150 a. As shown in fig. 12, a cushion member 160b is disposed between the sensor substrate 150b disposed on the rear surface of the chassis 120 and the corner reinforcing plate 210a (space S2 (see fig. 11)) supporting the rear surface of the chassis 120. Specifically, when the corner reinforcing plate 210a is screwed to the upper frame 110b and the right frame 110c, the cushion member 160b is disposed in the gap (space S2 in fig. 11) formed between the upper surface portion 201a of the corner reinforcing plate 210a and the rear surface of the chassis 120. The buffer member 160b contacts and presses the upper surface of the sensor substrate 150 b. The chassis pressing portion 201e of the corner reinforcing plate 210a presses the chassis 120 from the back surface side in a region where the sensor substrate 150b is not disposed on the back surface of the chassis 120. Thereby, the sensor substrate 150b is supported in a state of being pressed to the front surface side by the buffer member 160 b. In addition, the sensor unit 10b is sandwiched by the corner reinforcing plate 210a and the bezel 110. The buffers 160a and 160b may be elastic members such as rubber, but are preferably conductive members having conductivity such as washers or grounding springs. By using the conductive members for the buffers 160a, 160b, it is possible to strengthen the grounding of the sensor substrates 150a, 150b and effectively cope with an Electro Magnetic Interference (EMI).

As shown in fig. 13, similarly, the cushion member 160b is in contact with and pressed against the upper surface of the sensor substrate 150b in a portion other than the corner portion (for example, the center portion). The pressing portion 203e of the chassis fixing plate 210b presses the chassis 120 from the back surface side in a region where the sensor substrate 150b is not disposed on the back surface of the chassis 120. Thereby, the sensor substrate 150b is supported in a state of being pressed to the front surface side by the buffer member 160 b. In addition, the sensor unit 10b is sandwiched by the chassis fixing plate 210b and the frame 110.

As shown in fig. 8, at the right end (right side surface) of the chassis 120, the sensor sheet 150 is bent and rotated by 90 degrees at the right end of the chassis 120, and the sensor substrate 150c is disposed at the side surface of the chassis 120. A cushion member 161c is disposed between the sensor substrate 150c disposed on the side surface of the chassis 120 and the right side frame 110 c. Thereby, the sensor substrate 150c is supported in a state of being pressed to the side surface side by the buffer member 161 c. The cushion member 161c may be an elastic member such as rubber, as in the cushion members 160a and 160b, but is preferably a conductive member having conductivity such as a washer or a grounding spring. By using the conductive member for the buffer member 161c, the grounding of the sensor substrate 150c can be strengthened and EMI can be effectively dealt with.

According to the above configuration, the sensor boards 150a and 150b are supported by the cushion members 160a and 160b on the rear surface of the chassis 120, and the cushion members 160a and 160b are disposed in the gaps formed between the chassis 120 and the corner reinforcing plate 210a and the chassis fixing plate 210b (space S2). The sensor substrate 150c is supported by a cushion member 161c on the side surface of the chassis 120, and the cushion member 161c is disposed in a gap formed between the chassis 120 and the frame 110. In this way, the sensor substrates 150a and 150b disposed on the long side of the electronic board 10 and the sensor substrate 150c disposed on the short side of the electronic board 10 are disposed at different positions (back surface and side surface) with respect to the chassis 120. The sensor boards 150a, 150b, and 150c are not fixed to the chassis 120 or other members by screws or the like, but are movably supported (held) by buffers 160a, 160b, and 161 c. Therefore, even when the sensor unit 10b is deformed such as strained due to, for example, environmental changes, it is difficult to affect the sensor substrates 150a, 150b, and 150c, and therefore, troubles such as damage and erroneous detection due to the deformation of the sensor substrates 150a, 150b, and 150c can be prevented.

Here, in the above-described configuration, when the sensor substrates 150a, 150b, and 150c are disposed on the rear surface or the side surface of the chassis 120, the sensor sheet 150 is partially bent. In particular, when the sensor substrates 150a and 150b are disposed on the rear surface of the chassis 120, the sensor sheet 150 is partially bent by 180 degrees. Therefore, damage may occur in the bent portion (bent portion) of the sensor sheet 150. Therefore, the present embodiment also has a structure for preventing damage to the sensor sheet 150.

Specifically, as shown in fig. 9, a gap is formed between the lower end (lower side surface) of the chassis 120 and the lower frame 110a, and a flexible portion 151a is formed in a bent portion of the sensor sheet 150 in the gap. Similarly, a gap is formed between the upper end (upper side surface) of the chassis 120 and the upper side frame 110b, and a flexure 151b is formed in the sensor sheet 150 at the gap. Thus, since the flexure can be provided at the bent portion of the sensor sheet 150, for example, when the sensor 10b is deformed, the amount of deformation corresponding to the deformation can be absorbed by the flexure 151 b. Therefore, the sensor sheet 150 can be prevented from being damaged. In order to prevent the bent portion of the sensor chip 150 from contacting the lower frame 110a and the upper frame 110b, it is preferable that buffering materials 161a and 161b (see fig. 9) be disposed between the bent portion of the sensor chip 150 and the lower frame 110a and the upper frame 110b at the lower end and the upper end of the chassis 120.

In addition, the sensor sheet 150 may be bent and rotated by 90 degrees at the lower end of the chassis 120, so that the sensor substrates 150a and 150b are disposed on the side surface of the chassis 120, and the sensor sheet 150 may be rotated by 180 degrees at the right end (right side surface) of the chassis 120 so as to cover the right end (right side surface) of the chassis 120, so that the sensor substrate 150c is disposed on the back surface of the chassis 120.

[ method for fixing sensor substrate 2]

A second fixing method of the sensor substrates 150a, 150b, and 150c will be described with reference to fig. 10 and 11. The configuration in which the sensor substrates 150a and 150b are disposed on the rear surface of the chassis 120 and supported by the cushion members 160a and 160b, and the configuration in which the sensor substrate 150c is disposed on the side surface of the chassis 120 and supported by the cushion member 161c are the same as the first fixing method.

As shown in fig. 10, the tablet 10a, the sensor sheet 150, and the chassis 120 constituting the sensor unit 10b are fixed to each other by being stuck so that the lower end of the chassis 120 is positioned above the lower end of the tablet 10 a. When the sensor unit 10b integrated in this manner is attached to the lower frame 110a, the lower end of the writing board 10a is placed on and supported by the placement portion 110h of the lower frame 110 a. That is, the sensor unit 10b is supported by placing the lower end of the tablet 10a on the placing portion 110h of the lower bezel 110 a. Therefore, the load (self-weight) of the sensor unit 10b is applied to the placement portion 110 h. Thereby, a gap S1 is formed between the lower end of the chassis 120 and the lower side frame 110 a. In addition, a flexure 151a corresponding to the gap S1 is formed at the bent portion of the sensor sheet 150. The flexible portion 151a is curved with a predetermined radius of curvature corresponding to the gap S1, for example.

The height of the placement portion 110h may be higher than the portion of the lower frame 110a facing the lower end of the chassis 120. In this case, the sensor unit 10b may also be adhesively fixed in such a manner that the lower end of the chassis 120 and the lower end of the writing board 10a have the same height (flush). In this structure, a gap S1 can be formed between the lower end of the chassis 120 and the lower side frame 110 a.

As shown in fig. 11, a gap (space S3) is formed between the upper end of chassis 120 and upper side frame 110 b. A bending portion 151b bent at a predetermined radius of curvature corresponding to the space S3 is formed at the bending portion of the sensor sheet 150. Further, the sizes of the spaces S1 and S3 are set to optimal values by appropriately adjusting the vertical length of the chassis 120.

According to the above-described fixing method 2, the curve of the curved portion of the sensor sheet 150 can be made gentle (the radius of curvature can be made large). Therefore, the damage of the sensor chip 150 can be reliably prevented.

[ Structure of Chassis ]

The sensor sheet 150 is formed in a film shape and has flexibility. In addition, in order to reduce the weight of the entire electronic board 10, the writing board 10a is made of a resin material having a thickness of several mm, and is likely to be bent. In order to suppress the deflection of the sensor sheet 150 and the writing board 10a, the sensor sheet 150 and the writing board 10a are attached to the chassis 120. By integrating the tablet 10a, the sensor sheet 150, and the chassis 120, the sensor unit 10b has a structure in which flexure is less likely to occur.

Further, the chassis 120 also has a function of preventing a decrease in the detection accuracy of the position coordinates due to the influence of noise. Specifically, the sensor chip 150 is made of copper wiring having low wiring resistance, and is susceptible to noise. In particular, when a metal material such as a metal member (the corner reinforcing plate 210a and the chassis fixing plate 210b) for fixing the sensor unit 10b approaches the sensor chip 150, noise from the metal material is easily received. Therefore, the thickness t1 (see fig. 11) of the chassis 120 is preferably set to a thickness that is less susceptible to noise, for example, about 15mm to 20 mm. In consideration of the reduction in thickness, the thickness t1 is preferably set to about 15 mm.

[ arrangement of Power supply and connection terminals ]

As shown in fig. 24, the electronic board 10 is further provided with a power button 191 for turning on or off the power of the electronic board 10; an LED192 (indicator) (an example of a notification portion of the present invention) that notifies (displays) the power state (on state or off state) of the electronic board 10 to the outside; and a connection terminal 193 (interface terminal) for connecting a storage medium storing a data file generated in the electronic board 10, input information input by a human finger or the pen 30, or the like. The power button 191 and the connection terminal 193 are examples of the operation unit of the present invention. The operation unit of the present invention may be an adjustment unit that adjusts the display state (brightness, luminance, and the like) of the electronic board 10, an input terminal that inputs an external signal, an output terminal that outputs an internal signal, and function buttons that execute various functions of software installed on the electronic board 10.

The power of the electronic board 10 is supplied via a power cable (not shown), for example. The user can put the electronic board 10 into the on state by pressing the power button 191. When the user presses the power button 191 while the electronic board 10 is in the on state, the electronic board 10 becomes the off state. The LED192 is turned on when the electronic board 10 is in an on state, and turned off when the electronic board 10 is in an off state, for example.

The storage medium is, for example, a USB memory, an SD memory card, a CD-ROM, a DVD-ROM, or the like. When the storage medium is a USB memory, the connection terminal 193 is a USB terminal, and when the storage medium is an SD memory card, the connection terminal 193 is an SD card slot. In addition, in the case where the storage medium is a CD-ROM or a DVD-ROM, the connection terminal 193 is constituted by, for example, a USB terminal, and is connected to an external drive of the CD-ROM or the DVD-ROM via a USB cable. Further, a connection terminal 193 in fig. 24 represents a USB terminal. The connection terminal 193 may be a terminal to which a device (wireless or wired communication device, communication cable, or the like) for transmitting the data file, the input information, or the like to an external device is connected.

The power button 191 and the connection terminal 193 are provided on the side surface portion 19a of the pen receiving portion 19, and the LED192 is provided on the front surface portion 19b of the pen receiving portion 19.

As shown in fig. 25, the components constituting the power button 191, the LED192, and the connection terminal 193 are housed in a space 19s inside the lower frame 110a, and the space 19s is an internal space below (on the back side) the pen receiving portion 19. The circuit board 194 on which the circuits for supplying various signals to the power button 191, the LED192, and the connection terminal 193 are mounted is disposed in the space 19s, and is attached to the attachment metal member 195 screwed to the frame of the pen receiving portion 19. The side surface portion 19a of the pen receiving portion 19 may be formed of a cap (cover), and the power button 191, the LED192, the connection terminal 193, the circuit board 194, and the attachment fitting 195 may be attached to the cap. In this case, the cap is fixed to the side surface of the pen receiving portion 19 so as to be fitted therein.

An opening 19c (see fig. 25 and 26) is formed in the lower frame 110a, and as shown in fig. 26, a cable 196 connected to the circuit board 194 is introduced into the space 110s of the lower frame 110a through the opening 19 c. The cable 196 is introduced from the notch 19d formed in the partition wall 110f of the lower bezel 110a to the rear surface of the chassis 120, and is connected to the interface board 173 through the rear surface of the chassis 120.

In a conventional electronic board, a power supply, a connection terminal, and the like are provided on a front surface of the electronic board (for example, beside a writing board). In this prior art structure, the frame of the electronic board becomes large. In contrast, in the electronic board 10 of the present embodiment, the power button 191 and the connection terminal 193 are provided on the side surface portion 19a of the pen receiving portion 19. Therefore, the frame of the electronic board 10 can be narrowed. In addition, in the case of using a commercially available pen 30, foreign matter such as debris generated from the pen 30 may be accumulated on the pen receiving portion 19, but even in this case, since the power button 191 and the connection terminal 193 are provided on the side surface portion 19a of the pen receiving portion 19, it is possible to prevent debris from adhering to the power button 191 and the connection terminal 193.

In the electronic board 10 of the present embodiment, the partition wall 110f is disposed between the internal space (space 19s) of the circuit board 194 in which the power button 191, the LEDs 192, and the connection terminals 193 are disposed and the space in which various circuit boards for detecting the sensor chip 150 and the contact position are disposed (see fig. 25 and 26). Therefore, the influence of noise on the sensor sheet 150 and various circuit boards from the power button 191, the LED192, and the connection terminal 193 can be reduced. The power button 191, the LED192, and the circuit board 194 of the connection terminal 193 may be disposed in the space 19s or may be disposed in the space 110s (see fig. 26).

The power button 191 and the connection terminal 193 may be provided on the front surface portion 19b of the pen receiving portion 19, similarly to the LED192 (see fig. 24). In the case of a structure in which the pen receiving portion 19 is formed of aluminum and the side surface portion 19a is formed of resin and fitted into the pen receiving portion 19, it is preferable that the power button 191 and the connection terminal 193 are provided in the side surface portion 19a from the viewpoint of ease of assembly and safety.

[ Structure of sensor substrate ]

Copper wires (sensor wires 152) having low wire resistance are arranged on the sensor substrates 150a, 150b, and 150c, and are susceptible to noise.

Here, the influence of noise on the sensor wiring 152 is examined. Fig. 27A is a circuit diagram of a general series resistor. Fig. 27B is a diagram in which the circuit of the series resistor of fig. 27A is replaced with a touch sensor circuit. The X detection circuit and the Y detection circuit sequentially transmit and detect a touch detection signal, and form a closed circuit in operation.

The voltage across the resistor R2 is calculated from the resistor voltage dividing ratio. When the resistance R1 is replaced with the wiring resistance of the touch sensor up to the touch panel circuit and the resistance R2 is replaced with the resistance component of the touch sensor itself, it can be seen that the voltage contribution of the wiring resistance of the sensor wiring (copper wire) having a resistance value of about 1/100 is large (the voltage at both ends of the resistance R1 is high) compared to the conventional metal mesh sensor. When the power source V0 is replaced by a noise source, it means that the resistance R1, that is, the wiring resistance (wiring in the substrate, etc.) up to the touch sensor is greatly affected by noise. Therefore, it is important to deal with noise in the sensor wiring disposed on the sensor substrate.

The sensor boards 150a, 150b, and 150c according to the embodiment of the present invention have a structure that is not affected by noise. Since the sensor substrates 150a, 150b, and 150c have the same structure, the sensor substrate 150a will be described as an example.

Fig. 28 and 29 are diagrams showing the structure of the sensor substrate 150 a. The sensor substrate 150a has a four-layer structure. Fig. 28A shows the first layer. A terminal 155 and a connector connecting portion 156 for connecting electrode lines (X parallel electrode lines 13X) are formed on a base material 154, and a shielding layer 157X (an example of a first shielding layer in the present invention) made of a copper material is formed in a solid state on the entire surface (back surface; corresponding to a first surface in the present invention) of the base material 154.

Fig. 28B shows the second layer. A sensor wiring 152x (an example of a first sensor wiring of the present invention) is patterned and formed on the surface side (corresponding to the second surface of the present invention) of the substrate 154. The sensor wiring 152x is electrically connected to the odd-numbered terminal 155 x.

Fig. 29A shows a third layer. On the front surface side of the substrate 154, a sensor wiring 152y (an example of a second sensor wiring of the present invention) is patterned and formed above the sensor wiring 152x via an insulating film. The sensor wiring 152y is electrically connected to the even-numbered terminal 155 y.

Fig. 29B shows a fourth layer. A shield layer 157y (an example of a second shield layer according to the present invention) made of a copper material is formed in a solid state on the entire surface of the substrate 154 on the sensor wiring 152 y.

The sensor substrate 150a having the four-layer structure has its front and back surfaces covered with the shield layers 157x and 157 y. Therefore, the influence of noise on the sensor wires 152x and 152y of the sensor substrate 150a can be suppressed. Thus, noise in the electronic board 10 can be reduced by a simple configuration, and the cost for coping with the noise can be reduced. Therefore, the electronic board 10 capable of reducing the cost by a simple structure can be realized.

In the sensor substrate 150a, the adjacent sensor wires 152x and 152y are disposed in different layers (second layer and third layer), and thus, it is possible to prevent wiring defects due to contact between the adjacent sensor wires 152x and 152 y. Further, since the sensor wirings 152x and 152y are alternately and equally arranged, mutual capacitive coupling between the adjacent sensor wirings 152x and 152y (adjacent channels) can be made uniform. In the present embodiment, the sensor lines 152x and 152y are alternately (alternately) arranged on the second layer and the third layer, but the present invention is not limited thereto, and may be arranged every plural lines (for example, every two lines).

Here, the shield layers (157x, 157y) may be connected to a circuit ground, or may be connected to a reference potential (ground) of a driver circuit of the touch panel. In the case of adopting a structure in which the shield layers 157x and 157y are connected to the reference potential, there is a possibility that a problem of an increase in parasitic capacitance, that is, a problem of attenuation of a signal level due to capacitive coupling (formation of a dummy capacitance) between a signal line and a ground layer sandwiched between ground layers having a large area may occur. As a method for solving this problem, for example, it is conceivable to apply: a dummy signal (a reference signal having the same frequency and phase as the touch panel drive signal) is applied to the shield layer, and the potential difference with the signal line (the sensor wiring 152x, 152y) is canceled, thereby nullifying the generation of the parasitic capacitance while maintaining the shielding effect. In addition, the above method may not be adopted when the attenuation amount of the signal level does not affect the touch detection accuracy in actual use.

[ mounting method of electronic Board ]

When the electronic board 10 is used, as shown in fig. 23, the electronic board is attached to a frame 51 (an example of an attached member of the present invention) such as a cradle 50 (see fig. 2) via a hook portion 202e and a locking portion 202f of the electronic board installation plate 220 a. The electronic board installation plate 220a attached to the frame 51 is fixed to the corner reinforcing plate 210a by screws, and the corner reinforcing plate 210a is firmly fixed to the bezel 110 by screws. In this way, the electronic board 10 is supported by the electronic board installation plate 220a screwed to the corner reinforcing plate 210a disposed at the corner (four corners). Therefore, in the use state, the electronic board 10 can be reliably set on the holder 50, and thus deformation or the like due to the weight of the electronic board 10 is less likely to occur.