阅读说明：本技术 薄晶片分离方法及其装置 (Thin wafer separation method and apparatus ) 是由 石敦智 黄良印 于 2019-08-30 设计创作，主要内容包括：一种薄晶片分离装置,其具有：一座体单元；一负压单元,耦接座体单元；以及一刮刀单元,设于座体单元的顶端；其中,刮刀单元相对于座体单元升降,并且刮刀单元由座体单元的两侧端朝向座体单元的中央往复运动。薄晶片分离装置将贴附于膜体的薄晶片的两端予以撑高,再将位于薄晶片底端的膜体予以去除,以此使得薄晶片与膜体二者相互分离时,薄晶片能够保持其完整性,进而避免薄晶片产生毁损或断裂。一种薄晶片分离方法亦被同时揭露。(A thin wafer separating apparatus, comprising: a base unit; a negative pressure unit coupled to the seat unit; the scraper unit is arranged at the top end of the seat body unit; the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two side ends of the base unit to the center of the base unit. The thin wafer separating device is used for supporting two ends of the thin wafer attached to the film body, and then removing the film body positioned at the bottom end of the thin wafer, so that the thin wafer can keep the integrity when the thin wafer and the film body are separated from each other, and further the thin wafer is prevented from being damaged or broken. A thin wafer separation method is also disclosed.)

1. A thin wafer separation method is characterized in that: the method comprises the following steps:

a film body, attached with at least one thin wafer, the position of the film body relative to the two ends of the thin wafer is supported by a lifting scraper unit; and

the scraper unit moves from the two ends of the thin wafer to the center of the thin wafer to scrape the film body from the bottom end of the thin wafer, so that the thin wafer and the film body are separated from each other.

2. The method of claim 1, wherein: the film body attached with the thin wafer is positioned above a supporting seat, the supporting seat is arranged at the top end of a cover body, and a negative pressure unit provides negative pressure gas to the top end of the cover body so as to adsorb the film body on the top end of the cover body.

3. The method of claim 2, wherein: the scraper unit moves from the two ends of the supporting seat to the center of the supporting seat so as to scrape the film body from the bottom end of the thin wafer; if the thin wafer and the film body are separated from each other, the scraper unit returns to an initial position from the center of the support base, and after returning to the initial position, the scraper unit descends.

4. The method of claim 2, wherein: the scraper unit is provided with two scrapers which move from two ends of the supporting seat to the center of the supporting seat, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.

5. A thin wafer separating apparatus, characterized in that: it comprises the following components:

a base unit;

the negative pressure unit is coupled with the seat body unit; and

the scraper unit is arranged at the top end of the seat body unit;

the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two sides of the base unit towards the center of the base unit.

6. The apparatus of claim 5, wherein: the base unit is provided with a lower base, an upper base and a supporting base, the lower base is arranged between the negative pressure units, the upper base is arranged at the top end of the lower base, the supporting base is arranged at the top end of the upper base, and the scraper unit is arranged at two ends of the supporting base.

7. The apparatus of claim 6, wherein: further has a connecting rod, one end of the connecting rod is coupled with a driving unit; the seat body unit is further provided with a connecting rod seat which is coupled with the negative pressure unit and is provided with a connecting rod hole for the other end of the connecting rod to penetrate through; the thin wafer separating device further comprises a cover body, the cover body covers the connecting rod seat, the negative pressure unit, the lower seat, the upper seat, the supporting seat and the scraper unit, and the top end of the cover body is used for accommodating the supporting seat.

8. The apparatus of claim 7, wherein: the driving unit is a cam assembly, a motor unit, a gear box assembly, an oil hydraulic cylinder assembly or a pneumatic cylinder assembly.

9. The apparatus of claim 7, wherein: the seat body unit is further provided with a negative pressure seat which is arranged between the negative pressure units and is coupled with the other end of the connecting rod; the lower seat is coupled with the top end of the negative pressure seat.

10. The apparatus of claim 9, wherein: the negative pressure unit is two negative pressure pipes which are coupled with a negative pressure device; two ends of the negative pressure seat are respectively provided with a groove for accommodating the two negative pressure tubes; the lower seat is provided with two lower holes, and one end of each negative pressure pipe penetrates through each lower hole; the upper seat is further provided with two upper holes, and one end of each negative pressure pipe penetrates through each upper hole; the top end of the cover body is provided with a plurality of communicated negative pressure grooves which are coupled with one end of a negative pressure pipe.

11. The apparatus of claim 6, wherein: the bottom end of the lower seat is provided with a containing groove, the top end of the lower seat is provided with a power groove, the bottom end of the power groove is provided with a power hole, and the power hole enables the power groove to be communicated with the containing groove; the accommodating groove is internally provided with a power unit, and one end of the power unit extends to the power groove from the power hole; the power groove is internally provided with a linkage unit which is respectively coupled with the scraper unit and one end of the power groove, which extends to the power groove.

12. The apparatus of claim 10, wherein: the power unit is a motor; the scraper unit is provided with two scrapers; the linkage unit is two racks which are meshed with each other, and each rack is coupled with the corresponding scraper and is coupled with the power unit to extend to one end of the power groove.

13. The apparatus of claim 6, wherein: the supporting seat is provided with at least one guide hole, and one end of the scraper unit extends to the lower seat from the guide hole; the top end of the cover body is provided with a seat hole for the support seat to extend into, and the top end of the cover body is further provided with a plurality of communicated negative pressure grooves which are coupled with the negative pressure units.

14. The apparatus of claim 12, wherein: the support base is provided with a film body with a thin wafer, the film body is supported by the scraper units which are lifted relative to the positions of the two ends of the thin wafer, the scrapers move from the two ends of the support base towards the center of the support base, one scraper maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.

Technical Field

The present invention relates to a method and an apparatus for separating a thin wafer, and more particularly, to a method and an apparatus for separating a thin wafer and a film from each other.

Background

Under the demand of light weight and diversification of various electronic products such as mobile phones, digital cameras or chip cards, manufacturers continuously develop multifunctional substrate circuits and large-capacity memories. However, the volume of the multi-functional substrate circuit or the large-capacity memory is also developed to be light, thin, small and small in response to the current trend.

This trend or demand has made the packaging technology of the substrate circuit very challenging, and for this reason, the thinning of the chip has become a trend of the manufacturers. The thinned wafer is also referred to as a thin wafer.

However, in the conventional wafer processing method, a plurality of wafers are attached to a film body, and the wafers are moved to the next process. If the wafer and the film are to be separated from each other, a thimble is pushed out from the bottom of the film, and the wafer and the film are separated from each other by an upward pushing force.

The above processing method is applied to a wafer with a certain thickness, and the pin ejecting method cannot be applied to the thin wafer, and the thin wafer cannot be damaged or broken due to the fact that the pin ejecting method cannot bear the upward pushing force of the pin, so that various manufacturers do not consider how to damage or break the thin wafer when the thin wafer and the film body are separated from each other.

Therefore, how to solve the above-mentioned deficiencies of the prior art is a problem to be solved by the present invention.

Disclosure of Invention

The invention aims to provide a thin wafer separation method and a thin wafer separation device.

In order to achieve the purpose, the invention adopts the technical scheme that:

a thin wafer separation method comprises the following steps:

a film body, attached with at least one thin wafer, the position of the film body relative to the two ends of the thin wafer is supported by a lifting scraper unit; and

the scraper unit moves from the two ends of the thin wafer to the center of the thin wafer to scrape the film body from the bottom end of the thin wafer, so that the thin wafer and the film body are separated from each other.

The relevant content in the above technical solution is explained as follows:

1. in the above scheme, the film body attached with the thin wafer is located above a supporting seat, the supporting seat is arranged at the top end of a cover body, and a negative pressure unit provides negative pressure gas to the top end of the cover body so as to adsorb the film body on the top end of the cover body.

2. In the above scheme, the scraper unit moves from the two ends of the support seat towards the center of the support seat so as to scrape the film body from the bottom end of the thin wafer; if the thin wafer and the film body are separated from each other, the scraper unit returns to an initial position from the center of the support base, and after returning to the initial position, the scraper unit descends.

3. In the above solution, the scraper unit has two scrapers, which move from two ends of the support base towards the center of the support base, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.

In order to achieve the purpose, the invention adopts the technical scheme that:

a thin wafer separating apparatus, comprising:

a base unit;

the negative pressure unit is coupled with the seat body unit; and

the scraper unit is arranged at the top end of the seat body unit;

the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two sides of the base unit towards the center of the base unit.

The relevant content in the above technical solution is explained as follows:

1. in the above scheme, the base unit has a lower base, an upper base and a supporting base, the lower base is arranged between the negative pressure units, the upper base is arranged at the top end of the lower base, the supporting base is arranged at the top end of the upper base, and the scraper units are arranged at two ends of the supporting base.

2. In the above solution, there is a connecting rod, one end of the connecting rod is coupled to a driving unit; the seat body unit is further provided with a connecting rod seat which is coupled with the negative pressure unit and is provided with a connecting rod hole for the other end of the connecting rod to penetrate through; the thin wafer separating device further comprises a cover body, the cover body covers the connecting rod seat, the negative pressure unit, the lower seat, the upper seat, the supporting seat and the scraper unit, and the top end of the cover body is used for accommodating the supporting seat.

3. In the above solution, the driving unit is a cam assembly, a motor unit, a gear box assembly, an oil cylinder assembly, or a pneumatic cylinder assembly.

4. In the above scheme, the seat unit further has a negative pressure seat, the negative pressure seat is arranged between the negative pressure units, and the negative pressure seat is coupled with the other end of the connecting rod; the lower seat is coupled with the top end of the negative pressure seat.

5. In the above scheme, the negative pressure unit is two negative pressure pipes, and the two negative pressure pipes are coupled with a negative pressure device; two ends of the negative pressure seat are respectively provided with a groove for accommodating the two negative pressure tubes; the lower seat is provided with two lower holes, and one end of each negative pressure pipe penetrates through each lower hole; the upper seat is further provided with two upper holes, and one end of each negative pressure pipe penetrates through each upper hole; the top end of the cover body is provided with a plurality of communicated negative pressure grooves which are coupled with one end of a negative pressure pipe.

6. In the scheme, the bottom end of the lower seat is provided with a containing groove, the top end of the lower seat is provided with a power groove, the bottom end of the power groove is provided with a power hole, and the power hole enables the power groove to be communicated with the containing groove; the accommodating groove is internally provided with a power unit, and one end of the power unit extends to the power groove from the power hole; the power groove is internally provided with a linkage unit which is respectively coupled with the scraper unit and one end of the power groove, which extends to the power groove.

7. In the above scheme, the power unit is a motor; the scraper unit is provided with two scrapers; the linkage unit is two racks which are meshed with each other, and each rack is coupled with the corresponding scraper and is coupled with the power unit to extend to one end of the power groove.

8. In the above solution, the supporting seat has at least one guiding hole, and one end of the scraper unit extends from the guiding hole to the lower seat; the top end of the cover body is provided with a seat hole for the support seat to extend into, and the top end of the cover body is further provided with a plurality of communicated negative pressure grooves which are coupled with the negative pressure units.

9. In the above solution, the support base is provided with a film body having a thin wafer, the film body is supported by the raised scraper units relative to the positions of the two ends of the thin wafer, the scrapers move from the two ends of the support base towards the center of the support base, one of the scrapers maintains the original position, and the other scraper descends to a position, so that the thin wafer and the film body are separated from each other.

The working principle and the advantages of the invention are as follows:

the invention provides a thin wafer separating device, comprising: a base unit; a negative pressure unit coupled to the seat unit; the scraper unit is arranged at the top end of the seat body unit; the scraper unit is lifted relative to the base unit, and the scraper unit reciprocates from two side ends of the base unit to the center of the base unit. The thin wafer separating device is used for supporting two ends of the thin wafer attached to the film body, and then removing the film body positioned at the bottom end of the thin wafer, so that the thin wafer can keep the integrity when the thin wafer and the film body are separated from each other, and further the thin wafer is prevented from being damaged or broken. A thin wafer separation method is also disclosed.

Drawings

FIG. 1 is a perspective view of a thin wafer separating apparatus according to the present invention;

FIG. 2 is a schematic perspective exploded view of the thin wafer separating apparatus of the present invention;

FIG. 3 is another exploded perspective view of the thin wafer separator of the present invention;

FIG. 4 is a schematic view of a thin wafer separating apparatus and a driving unit according to the present invention;

FIG. 5 is a schematic diagram of the operation of the doctor blade unit of the present invention for supporting a film body having a thin wafer;

FIG. 6 is a schematic view illustrating the operation of the scraper unit of the present invention to scrape the film from the thin wafer;

FIG. 7 is another schematic diagram of the operation of the scraper unit of the present invention to scrape the film from the thin wafer.

In the above drawings: 10. a connecting rod; 11. a connecting rod seat; 110. a connecting rod hole; 12. a negative pressure unit; 120. a negative pressure tube; 13. a negative pressure seat; 14. a lower seat; 140. a containing groove; 141. a power tank; 142. a power aperture; 143. a lower hole; 15. a power unit; 16. an upper seat; 160. an upper hole; 17. a supporting seat; 170. a guide hole; 18. a scraper unit; 180. a scraper; 19. a linkage unit; 190. a rack; 20. a cover body; 200. a seat hole; 201. a negative pressure tank; 30. a drive unit; 40. a thin wafer; 41. a membrane body.

Detailed Description

The invention is further described with reference to the following figures and examples: