Electronic device and method for manufacturing the same
阅读说明:本技术 电子装置及其制造方法 (Electronic device and method for manufacturing the same ) 是由 李晋棠 于 2019-03-05 设计创作,主要内容包括:本发明公开一种电子装置及其制造方法。所述制造方法包括:提供基板;在基板上形成薄膜电路,薄膜电路包含至少一个薄膜晶体管与至少一个导电线路;在基板上形成至少一个第一连接垫,第一连接垫通过导电线路与薄膜晶体管电性连接;将基板设置于驱动电路板上,驱动电路板包含至少一个第二连接垫,其中第二连接垫邻近第一连接垫,且与第一连接垫对应设置;以及,形成覆盖在至少部分的第二连接垫与第一连接垫上的导电件,其中第二连接垫通过导电件与第一连接垫电性连接。(The invention discloses an electronic device and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a substrate; forming a thin film circuit on a substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive circuit; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through a conductive circuit; arranging the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connecting pad, and the second connecting pad is adjacent to the first connecting pad and is arranged corresponding to the first connecting pad; and forming a conductive member covering at least part of the second connecting pad and the first connecting pad, wherein the second connecting pad is electrically connected with the first connecting pad through the conductive member.)
1. A method of manufacturing an electronic device, comprising:
providing a substrate, wherein the substrate is provided with a first surface and a second surface which are opposite;
forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive line;
forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace;
arranging the substrate on a driving circuit board through the second surface, wherein the driving circuit board comprises at least one second connecting pad, and the second connecting pad is adjacent to the first connecting pad and is arranged corresponding to the first connecting pad; and
and forming a conductive member covering at least part of the second connecting pad and the first connecting pad, wherein the second connecting pad is electrically connected with the first connecting pad through the conductive member.
2. The manufacturing method according to claim 1, wherein the substrate is a hard board or a soft board formed on a rigid carrier board.
3. The manufacturing method according to claim 2, wherein before the step of disposing the substrate on a drive circuit board, further comprising:
removing the rigid carrier plate.
4. The manufacturing method according to claim 1, wherein the conductive member is coated on at least a portion of the second connection pad and the first connection pad by means of spray printing or coating.
5. The manufacturing method of claim 1, wherein the material of the conductive member comprises solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.
6. The manufacturing method according to claim 1, wherein after the step of forming a thin film circuit on the substrate, further comprising:
forming a protective layer covering the thin film circuit.
7. The manufacturing method according to claim 1, further comprising:
and the surface mounting element is arranged on the driving circuit board, wherein the driving circuit board further comprises at least one third connecting pad, and the surface mounting element is electrically connected with the thin film transistor through the second connecting pad and is electrically connected with a circuit of the driving circuit board through the third connecting pad.
8. The manufacturing method according to claim 1, further comprising:
forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected with the thin film transistor through the conductive circuit; and
and arranging a surface mounting element on the first surface of the substrate, wherein the surface mounting element is electrically connected with the thin film transistor through the fourth connecting pad.
9. The manufacturing method according to claim 1, further comprising:
forming at least one fourth connection pad on the first surface of the substrate, wherein the fourth connection pad is electrically connected with the thin film transistor through the conductive circuit; and
and arranging at least one functional wafer on the first surface of the substrate, wherein the functional wafer is electrically connected with the thin film transistor through the fourth connecting pad.
10. The manufacturing method according to claim 9, further comprising:
and forming a protective layer covering the thin film circuit and the functional wafer.
11. The manufacturing method according to claim 7 or 8, wherein the surface mount component comprises at least one light emitting diode or micro light emitting diode.
12. The method of manufacturing according to claim 9, wherein the functional wafer comprises at least one light emitting diode wafer or micro light emitting diode wafer.
13. The manufacturing method according to claim 1, further comprising:
arranging a plurality of substrate arrays on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the number of the conductive pieces is multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive pieces; and
the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the second connecting pads corresponding to the two first connecting pads and the two conductive pieces.
14. The manufacturing method according to claim 1, further comprising:
arranging a plurality of substrate arrays on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the number of the conductive pieces is multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive pieces; and
the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the second connecting pads corresponding to the two first connecting pads and the conductive member.
15. An electronic device, comprising:
the substrate is provided with a first surface and a second surface which are opposite;
a thin film circuit disposed on the first surface of the substrate, the thin film circuit including at least one thin film transistor and at least one conductive trace;
at least one first connection pad disposed on the first surface of the substrate, the first connection pad being electrically connected to the thin film transistor through the conductive trace;
the driving circuit board comprises at least one second connecting pad, wherein the substrate is arranged on the driving circuit board through the second surface, and the second connecting pad is arranged corresponding to the first connecting pad; and
and the conductive piece covers at least part of the second connecting pad and the first connecting pad, and the second connecting pad is electrically connected with the first connecting pad through the conductive piece.
16. The electronic device of claim 15, wherein the substrate is a rigid board or a flexible board.
17. The electronic device of claim 15, wherein the material of the conductive member comprises solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.
18. The electronic device of claim 15, further comprising:
and the protective layer covers the thin film circuit.
19. The electronic device of claim 15, further comprising:
the surface mounting element is arranged on the driving circuit board, the driving circuit board further comprises at least one third connecting pad, and the surface mounting element is electrically connected with the thin film transistor through the second connecting pad and is electrically connected with the circuit of the driving circuit board through the third connecting pad.
20. The electronic device of claim 15, further comprising:
at least one fourth connecting pad arranged on the first surface of the substrate, wherein the fourth connecting pad is electrically connected with the thin film transistor through the conducting circuit; and
and the surface mounting element is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the fourth connecting pad.
21. The electronic device of claim 15, further comprising:
at least one fourth connecting pad arranged on the first surface of the substrate, wherein the fourth connecting pad is electrically connected with the thin film transistor through the conducting circuit; and
and the functional wafer is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the fourth connecting pad.
22. The electronic device of claim 21, further comprising:
and the protective layer covers the thin film circuit and the functional wafer.
23. The electronic device of claim 19 or 20, wherein the surface mount component comprises at least one light emitting diode or micro-light emitting diode.
24. The electronic device of claim 21, wherein the functional die comprises at least one light emitting diode die or micro light emitting diode die.
25. The electronic device of claim 15, wherein a plurality of the substrate arrays are disposed on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the number of the conductive pieces is multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive pieces; the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the second connecting pads corresponding to the two first connecting pads and the two conductive pieces.
26. The electronic device of claim 15, wherein a plurality of the substrate arrays are disposed on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the number of the conductive pieces is multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive pieces; the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the second connecting pads corresponding to the two first connecting pads and the conductive piece.
Technical Field
The invention relates to an electronic device and a manufacturing method thereof.
Background
In the conventional manufacturing of the optoelectronic device, a plurality of thin film transistors are formed on a substrate to form a thin film transistor substrate, and then the thin film transistors are used to drive corresponding optoelectronic devices. Taking the oled display device as an example, in the method of driving the oled to emit light by the thin film transistor, if there are a plurality of different product sizes or functions, a corresponding thin film process must be designed for each product size or function of the oled device, and expensive thin film transistor processes/masks/substrates/materials are required, which is very disadvantageous to various product requirements and has very little flexibility in application.
Disclosure of Invention
The invention aims to provide an electronic device and a manufacturing method thereof. The invention does not need to design the process aiming at each product size and function, has simple process and lower cost, has application flexibility and can be suitable for various product requirements.
To achieve the above object, a method for manufacturing an electronic device according to the present invention includes: providing a substrate, wherein the substrate is provided with a first surface and a second surface which are opposite; forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive circuit; forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected with the thin film transistor through a conductive circuit; arranging the substrate on a driving circuit board through a second surface, wherein the driving circuit board comprises at least one second connecting pad, and the second connecting pad is adjacent to the first connecting pad and is arranged corresponding to the first connecting pad; and forming a conductive member covering at least part of the second connecting pad and the first connecting pad, wherein the second connecting pad is electrically connected with the first connecting pad through the conductive member.
In some embodiments, the substrate is a rigid or flexible board.
In some embodiments, before the step of disposing the substrate on the driving circuit board, the method further includes: the rigid carrier plate is removed.
In some embodiments, the conductive member covers at least a portion of the second connecting pad and the first connecting pad by spray printing or coating.
In some embodiments, the material of the conductive member comprises solder paste, silver paste, or anisotropic conductive paste, or a combination thereof.
In some embodiments, after the step of forming the thin film circuit on the substrate, further comprising: a protective layer is formed overlying the thin film circuit.
In some embodiments, the method of manufacturing further comprises: the surface mounting element is arranged on the driving circuit board, wherein the driving circuit board further comprises at least one third connecting pad, and the surface mounting element is electrically connected with the thin film transistor through the second connecting pad and is electrically connected with a circuit of the driving circuit board through the third connecting pad.
In some embodiments, the method of manufacturing further comprises: forming at least one fourth connecting pad on the first surface of the substrate, wherein the fourth connecting pad is electrically connected with the thin film transistor through a conductive circuit; and arranging a surface mounting element on the first surface of the substrate, wherein the surface mounting element is electrically connected with the thin film transistor through the fourth connecting pad.
In some embodiments, the method of manufacturing further comprises: forming at least one fourth connecting pad on the first surface of the substrate, wherein the fourth connecting pad is electrically connected with the thin film transistor through a conductive circuit; and at least one functional chip is arranged on the first surface of the substrate, wherein the functional chip is electrically connected with the thin film transistor through a fourth connecting pad.
In some embodiments, the method of manufacturing further comprises: a protective layer is formed to cover the thin film circuit and the functional wafer.
In some embodiments, the surface mount component comprises at least one light emitting diode or micro-light emitting diode.
In some embodiments, the functional wafer comprises at least one light emitting diode wafer or micro light emitting diode wafer.
In some embodiments, the method of manufacturing further comprises: arranging a plurality of substrate arrays on a driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the conductive parts are multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive parts; and electrically connecting the two thin film circuits respectively arranged on the two adjacent substrates with each other through the two first connecting pads and the corresponding second connecting pads thereof and the two conductive members.
In some embodiments, the method of manufacturing further comprises: arranging a plurality of substrate arrays on a driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the conductive parts are multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive parts; and electrically connecting the two thin film circuits respectively arranged on the two adjacent substrates with each other through the two first connecting pads and the corresponding second connecting pads thereof and a conductive member.
To achieve the above object, an electronic device according to the present invention includes a substrate, a thin film circuit, at least one first connection pad, a driving circuit board, and a conductive member. The substrate has a first surface and a second surface opposite to each other. The thin film circuit is arranged on the first surface of the substrate and comprises at least one thin film transistor and at least one conducting circuit. The first connecting pad is arranged on the first surface of the substrate and electrically connected with the thin film transistor through the conducting circuit. The driving circuit board comprises at least one second connecting pad, wherein the substrate is arranged on the driving circuit board through the second surface, and the second connecting pad is arranged corresponding to the first connecting pad. The conductive member covers at least part of the second connecting pad and the first connecting pad, and the second connecting pad is electrically connected with the first connecting pad through the conductive member.
In some embodiments, the electronic device further comprises a protective layer overlying the thin film circuit.
In some embodiments, the electronic device further includes a surface mount device disposed on the driving circuit board, the driving circuit board further includes at least one third connecting pad, and the surface mount device is electrically connected to the thin film transistor through the second connecting pad and is electrically connected to the circuit of the driving circuit board through the third connecting pad.
In some embodiments, the electronic device further comprises at least one fourth connecting pad and a surface mount component. The fourth connecting pad is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the conducting circuit. The surface mounting element is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the fourth connecting pad.
In some embodiments, the electronic device further comprises at least one fourth connection pad and at least one functional chip. The fourth connecting pad is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the conducting circuit. The functional chip is arranged on the first surface of the substrate and is electrically connected with the thin film transistor through the fourth connecting pad.
In some embodiments, the electronic device further comprises a protective layer covering the thin film circuit and the functional wafer.
In some embodiments, a plurality of substrate arrays are disposed on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the conductive parts are multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive parts; the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the corresponding second connecting pads thereof and the two conductive pieces.
In some embodiments, a plurality of substrate arrays are disposed on the driving circuit board; each substrate is provided with a plurality of thin film circuits and a plurality of first connecting pads, and each thin film circuit is electrically connected with the corresponding first connecting pads; the driving circuit board is provided with a plurality of second connecting pads; the conductive parts are multiple, and one of the first connecting pads corresponding to each thin film circuit is electrically connected with one of the second connecting pads of the driving circuit board through one of the conductive parts; the two thin film circuits respectively arranged on the two adjacent substrates are electrically connected with each other through the two first connecting pads, the corresponding second connecting pads and a conductive piece.
In view of the above, in the electronic device and the method for manufacturing the same of the present invention, the thin film circuit including at least one thin film transistor and at least one conductive trace and at least one first connection pad are formed on the substrate, and the conductive member covering at least a portion of the second connection pad of the driving circuit board and the first connection pad of the substrate is used to design the second connection pad to be electrically connected to the first connection pad through the conductive member, so that the present invention does not need to design the process for each product size and function, and thus the present invention has flexibility in application and can be adapted to various product requirements in addition to simple process and low cost.
Drawings
Fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the invention.
Fig. 2A, fig. 2C, and fig. 2D respectively show layout diagrams of a manufacturing process of an electronic device according to an embodiment of the invention.
Fig. 2B is a schematic cross-sectional view of a substrate according to an embodiment of the invention.
FIGS. 2E-2G are schematic cross-sectional views of the
Fig. 2H is a layout diagram of the driving circuit board according to the embodiment.
Fig. 2I is a layout diagram of the surface mount device according to the embodiment.
Fig. 2J is a layout diagram of an electronic device according to an embodiment of the invention.
FIG. 2K shows a circuit schematic of the embodiment of FIG. 2J.
Fig. 3A and 3B are schematic layout views of a thin film circuit substrate according to different embodiments of the invention.
Fig. 4A to 4C are schematic layout views of electronic devices according to different embodiments of the present invention.
Fig. 5 and fig. 6 are schematic layout views of an electronic device according to another embodiment of the invention.
Detailed Description
An electronic device and a method of manufacturing the same according to a preferred embodiment of the present invention will be described below with reference to the accompanying drawings, in which like elements are described with like reference numerals.
Fig. 1 is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the invention. As shown in fig. 1, the method of manufacturing an electronic device of the present invention may include: providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other (step S01); forming a thin film circuit on the first surface of the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace (step S02); forming at least one first connection pad on the first surface of the substrate, wherein the first connection pad is electrically connected to the thin film transistor through a conductive trace (step S03); disposing the substrate on a driving circuit board through the second surface, wherein the driving circuit board includes at least one second connecting pad adjacent to the first connecting pad and disposed corresponding to the first connecting pad (step S04); and forming a conductive member covering at least a portion of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected to the first connection pad through the conductive member (step S05).
In some embodiments, the substrate may be an insulating substrate, or a conductive substrate plus an insulating layer. In some embodiments, the substrate may be a rigid board or a flexible board. If the substrate is a flexible board, in order to allow the following components to be smoothly formed on the flexible board through the subsequent processes and to facilitate the handling of the flexible board, the flexible board is formed on the rigid carrier, and the rigid carrier is removed in the following steps. This process is not required if the substrate is a rigid plate.
Please refer to fig. 1 in conjunction with fig. 2A to fig. 2K to describe the detailed technical content of each step. Fig. 2A, 2C, 2D, 2H, 2I and 2J respectively show layout diagrams of a manufacturing process of an electronic device according to an embodiment of the invention, fig. 2B shows a cross-sectional diagram of a substrate according to an embodiment, fig. 2E to 2G respectively show cross-sectional diagrams of the substrate along a 2E-2E cut line, a 2F-2F cut line and a 2G-2G cut line in fig. 2D, fig. 2H is a layout diagram of a driving circuit board according to an embodiment, fig. 2I is a layout diagram of a surface mount device according to an embodiment, and fig. 2K shows a circuit diagram of the embodiment of fig. 2J.
First, as shown in fig. 2A, step S01 is: a
In some embodiments, referring to fig. 2B, for example, a soft material (e.g., PI) may be formed on the
Next, referring to fig. 2A again, step S02 is performed: the
Next, as shown in fig. 2C, step S03 is performed: at least one
Referring to fig. 2D, after the step S02 of forming the
The
Then, step S04 is performed, as shown in fig. 2D and fig. 2H, the
Referring to fig. 2H, the driving circuit board 3 of the present embodiment further includes two
Subsequently, step S05 is performed: forming a
In addition, as shown in fig. 2I and fig. 2J, the method for manufacturing the electronic device 1 of the present embodiment further includes: a
Referring to fig. 2K, fig. 2K is a circuit schematic diagram of the electronic device 1 of fig. 2J, where fig. 2K takes the circuit architecture of 2T1C as an example, but in different embodiments, the circuit architecture may be other circuit architectures, such as 4T2C or 5T1C, and is not limited.
In fig. 2K, the
In the present embodiment, as shown in fig. 2J and 2K, the electronic device 1 includes a
In addition, the electronic device 1 may further include a
Fig. 3A and fig. 3B are schematic layout views of thin
As shown in fig. 3A, the thin-
As shown in fig. 3B, the thin-film circuit board 2B of the present embodiment is substantially the same as the thin-
In some embodiments, the surface mount device 12b may include three sub-pixels, each of which includes one
Fig. 4A to 4C are schematic layout views of
As shown in fig. 4A, the manufacturing process of the electronic device 1c of the present embodiment is substantially the same as that of the electronic device 1 of the previous embodiment, and the connection relationship between the element composition and each element. The difference is that the thin-
In some embodiments, the
As shown in fig. 4B, the
As shown in fig. 4C, the manufacturing process of the electronic device 1e of the present embodiment and the
In some embodiments, the three
Fig. 5 and fig. 6 are schematic layout views of
As shown in fig. 5, the manufacturing process of the
In some embodiments, a plurality of thin
As shown in fig. 6, the
It should be noted that the design concept of the
In view of the above, in the conventional method of driving the optoelectronic device with the tft, for example, when the tft on the tft substrate is used to drive the light emitting diode to emit light, the size or function of each product needs to be designed and expensive tft process, mask, substrate and material are used, which is very disadvantageous for various product requirements. However, the present invention does not need to design the size or function of each product and use expensive thin film transistor process, mask, substrate and material, so that the present invention has the advantages of simple process and low cost, and has flexibility in application and is suitable for various product requirements.
In summary, in the electronic device and the manufacturing method thereof of the present invention, the thin film circuit including at least one thin film transistor and at least one conductive trace and at least one first connection pad are formed on the substrate, and the conductive member covering at least a portion of the second connection pad of the driving circuit board and the first connection pad of the substrate is used to electrically connect the second connection pad with the first connection pad through the conductive member, so that the present invention does not need to design the process for each product size and function, and therefore, the present invention has flexibility in application and can be adapted to various product requirements besides having simple process and low cost.
The foregoing is by way of example only and is not intended as limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention are intended to be included within the scope of the appended claims.
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