阅读说明：本技术 一种半导体干燥机用打磨膏输送机构 (Polishing paste conveying mechanism for semiconductor drying machine ) 是由 高定桃 于 2021-09-26 设计创作，主要内容包括：本发明涉及打磨技术领域,尤其涉及一种半导体干燥机用打磨膏输送机构,包括,储液部,所述储液部适于提供打磨膏；打磨部,所述打磨部包括位于所述储液部底部的打磨筒、位于所述打磨筒底部的锥形筒、设置在所述锥形筒底部的作业位和设置在所述锥形筒侧壁上的出口,所述作业位由挡板围合而成,所述挡板与所述锥形筒侧壁形成溢料槽,所述溢料槽与所述出口连通；输送部,所述输送部位于所述作业位底部。本发明为一种半导体干燥机用打磨膏输送机构,通过设置锥形筒和挡板,使得将打磨膏和零件分开,零件掉入输送部,打磨膏则从出口流出进行回收处理。(The invention relates to the technical field of polishing, in particular to a polishing paste conveying mechanism for a semiconductor dryer, which comprises a liquid storage part, a polishing paste feeding part and a polishing paste discharging part, wherein the liquid storage part is suitable for providing polishing paste; the polishing part comprises a polishing barrel positioned at the bottom of the liquid storage part, a conical barrel positioned at the bottom of the polishing barrel, an operation position arranged at the bottom of the conical barrel and an outlet arranged on the side wall of the conical barrel, wherein the operation position is formed by enclosing a baffle plate, the baffle plate and the side wall of the conical barrel form a flash tank, and the flash tank is communicated with the outlet; the conveying part is positioned at the bottom of the operation position. The invention relates to a polishing paste conveying mechanism for a semiconductor dryer, which separates polishing paste from parts by arranging a conical barrel and a baffle plate, wherein the parts fall into a conveying part, and the polishing paste flows out from an outlet for recovery treatment.)

1. A polishing paste conveying mechanism for a semiconductor dryer is characterized by comprising,

a liquid storage portion adapted to provide a polishing paste;

the polishing part comprises a polishing barrel positioned at the bottom of the liquid storage part, a conical barrel positioned at the bottom of the polishing barrel, an operation position arranged at the bottom of the conical barrel and an outlet arranged on the side wall of the conical barrel, wherein the operation position is formed by enclosing a baffle plate, the baffle plate and the side wall of the conical barrel form a flash tank, and the flash tank is communicated with the outlet;

a conveying part located at the bottom of the working position; wherein the content of the first and second substances,

the liquid storage part presses polishing paste into the polishing barrel, the polishing barrel sprays the polishing paste onto a part on the operation position, and the used polishing paste flows into the flash tank and flows out of the outlet; and the part after polishing falls into the conveying part and is conveyed to the next station.

2. A paste feed mechanism for a semiconductor dryer according to claim 1,

the liquid storage part and the polishing part are fixed on a first bracket, a second bracket is arranged below the first bracket, wherein,

and a damping part is arranged between the first bracket and the second bracket.

3. A paste feed mechanism for a semiconductor dryer according to claim 2,

the shock absorption part is a rubber shock absorption pad.

4. A paste feed mechanism for a semiconductor dryer according to claim 3,

the shock pad is arranged at a corner of the second bracket.

5. A paste feed mechanism for a semiconductor dryer according to claim 1,

the conveying part comprises a third bracket, a transmission shaft and a conveying belt, wherein the transmission shaft is rotatably arranged at the two ends of the third bracket, the conveying belt is rotatably arranged on the transmission shaft,

the transmission shaft is in transmission connection with the motor.

6. A paste feed mechanism for a semiconductor dryer according to claim 1,

the bottom of the grinding cylinder is provided with a nozzle, wherein,

the position of the nozzle corresponds to the position of the operation position.

7. A paste feed mechanism for a semiconductor dryer according to claim 1,

the outlet is rotatably provided with a door body, wherein,

the lowest position of the door body is positioned below the highest position of the baffle.

8. A paste feed mechanism for a semiconductor dryer according to claim 1,

a fixed plate is rotated on the operation position, wherein,

an operation gap is reserved between the fixing plate and the operation position.

9. A paste feed mechanism for a semiconductor dryer according to claim 1,

the liquid storage part comprises

The grinding paste storage device comprises a storage cavity, a grinding device and a grinding device, wherein the storage cavity is internally provided with a stirring blade, a pressure plate arranged on the stirring blade in a sliding manner, a crushing part fixed on the stirring blade and a driving part for driving the stirring blade and the pressure plate to move, and the driving part drives the stirring blade to rotate so as to uniformly mix grinding paste in the storage cavity; wherein the content of the first and second substances,

when the driving part drives the pressure plate to slide and separate from the stirring blade, the storage cavity is communicated with the polishing part; when the driving part drives the pressing disc to slide on the stirring blade, the storage cavity is disconnected with the grinding cylinder;

work as the drive division drive the pressure disk is in slide on the stirring leaf, and paste tightly during crushing portion, stirring leaf, crushing portion, pressure disk and store the intracavity wall and form broken cavity, the drive division drive stirring leaf, pressure disk and broken portion rotate, with right the granule of polishing in the broken cavity grinds.

Technical Field

The invention relates to the field of drying machine equipment, in particular to a polishing paste conveying mechanism for a semiconductor drying machine.

Background

In the traditional technology, a grinding wheel is generally adopted for grinding or polishing a workpiece, but the grinding and polishing quality obtained in the mode is difficult to guarantee, and particularly for some workpieces which are fine, complex in shape or irregular in shape; later, fluid grinding methods have been developed, in which a workpiece is continuously moved in a fluid grinding paste to grind or polish the surface of the workpiece by continuously rubbing against the fluid grinding paste;

in the prior art, although the workpiece can be polished or polished with high quality, there are some disadvantages, such as: the polishing paste is formed by mixing polishing liquid and polishing particles, the polishing particles are uneven in size, the polishing liquid and the polishing particles are uneven in mixing, and the polishing precision is affected.

Meanwhile, after the parts are polished, the parts need to be manually recycled, and polishing paste also needs to be manually processed by an operator, so that time and labor are wasted.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: in order to overcome one of the technical problems in the prior art, the invention provides a polishing paste conveying mechanism for a semiconductor dryer, which comprises,

a liquid storage portion adapted to provide a polishing paste;

the polishing part comprises a polishing barrel positioned at the bottom of the liquid storage part, a conical barrel positioned at the bottom of the polishing barrel, an operation position arranged at the bottom of the conical barrel and an outlet arranged on the side wall of the conical barrel, wherein the operation position is formed by enclosing a baffle plate, the baffle plate and the side wall of the conical barrel form a flash tank, and the flash tank is communicated with the outlet;

a conveying part located at the bottom of the working position; wherein the content of the first and second substances,

the liquid storage part presses polishing paste into the polishing barrel, the polishing barrel sprays the polishing paste onto a part on the operation position, and the used polishing paste flows into the flash tank and flows out of the outlet; and the part after polishing falls into the conveying part and is conveyed to the next station.

Further, the liquid storage part and the polishing part are fixed on a first bracket, a second bracket is arranged below the first bracket, wherein,

and a damping part is arranged between the first bracket and the second bracket.

Further, the shock absorption part is a rubber shock absorption pad.

Further, the shock-absorbing pad is arranged at a corner of the second bracket.

Further, the conveying part comprises a third bracket, a transmission shaft rotatably arranged at two ends of the third bracket and a conveying belt rotatably arranged on the transmission shaft, wherein,

the transmission shaft is in transmission connection with the motor.

Further, the bottom of the grinding cylinder is provided with a nozzle, wherein,

the position of the nozzle corresponds to the position of the operation position.

Further, the outlet is rotatably provided with a door body, wherein,

the lowest position of the door body is positioned below the highest position of the baffle.

Further, a fixing plate is rotated on the operation position, wherein,

an operation gap is reserved between the fixing plate and the operation position.

Further, the liquid storage part comprises a storage cavity, a stirring blade, a pressure plate, a crushing part and a driving part are arranged in the storage cavity, the pressure plate is arranged on the stirring blade in a sliding mode, the crushing part is fixed on the stirring blade, the driving part drives the stirring blade to rotate, and therefore polishing paste in the storage cavity is uniformly mixed; wherein the content of the first and second substances,

when the driving part drives the pressure plate to slide and separate from the stirring blade, the storage cavity is communicated with the polishing part; when the driving part drives the pressing disc to slide on the stirring blade, the storage cavity is disconnected with the grinding cylinder;

work as the drive division drive the pressure disk is in slide on the stirring leaf, and paste tightly during crushing portion, stirring leaf, crushing portion, pressure disk and store the intracavity wall and form broken cavity, the drive division drive stirring leaf, pressure disk and broken portion rotate, with right the granule of polishing in the broken cavity grinds.

Has the advantages that: 1. the invention relates to a polishing paste conveying mechanism for a semiconductor dryer, which separates polishing paste from parts by arranging a conical barrel and a baffle plate, wherein the parts fall into a conveying part, and the polishing paste flows out from an outlet for recovery treatment.

2. The polishing paste is extruded into the polishing part by the pressure plate; the grinding paste can be mixed more uniformly by adopting the stirring blade, and the stirring blade and the pressure plate are matched to control the connection and disconnection of the grinding part and the storage cavity; adopt crushing portion, if need add the granule of polishing in the cream of polishing, can adopt crushing portion to grind the granule of polishing earlier for the granule of polishing is more even.

3. The pressing plate can slide on the stirring blade, and when the stirring blade rotates, polishing paste on the pressing plate can be scraped and then extruded out of the sliding groove.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of a polishing portion according to the present invention;

FIG. 3 is a schematic view of the internal structure of the cone-shaped cylinder of the present invention;

FIG. 4 is a schematic view of the internal structure of the liquid storage part according to the present invention;

in the figure:

100. the device comprises a liquid storage part, 110, a storage cavity, 111, a feeding hole, 112, a discharging hole, 113, a vertical groove, 114, a ring groove, 120, a stirring blade, 121, a connecting plate, 130, a pressure plate, 131, a positioning block, 140, a crushing part, 141, a fixing ring, 142, crushing teeth, 150, a driving part, 151, a lifting cylinder, 152, a bearing, 153, a straight pushing cylinder, 154, a rotating cylinder, 160 and a crushing cavity;

200. a grinding part 210, a grinding cylinder 220, a conical cylinder 221, a working position 222, a baffle 223, an outlet 224, a flash tank 225, an operating gap 230, a first bracket 240, a second bracket 250, a damping part 251, a damping pad 260, a door body 270 and a fixing plate;

300. conveying part 310, third support 320, transmission shaft 330 and conveying belt.

Detailed Description

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. In the description of the present invention, it is to be understood that the terms "upper", "top", "bottom", and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, which is for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be taken as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein.

Example one

A polishing paste conveying mechanism for a semiconductor dryer comprises:

a liquid storage portion 100, the liquid storage portion 100 being adapted to provide a sanding paste;

the polishing part 200 comprises a polishing barrel 210 positioned at the bottom of the liquid storage part 100, a conical barrel 220 positioned at the bottom of the polishing barrel 210, a working position 221 arranged at the bottom of the conical barrel 220 and an outlet 223 arranged on the side wall of the conical barrel 220, wherein the working position 221 is enclosed by a baffle 222, a flash groove 224 is formed by the baffle 222 and the side wall of the conical barrel 220, and the flash groove 224 is communicated with the outlet 223;

a conveying part 300, wherein the conveying part 300 is positioned at the bottom of the working position 221; wherein the content of the first and second substances,

the liquid storage part 100 presses the polishing paste into the polishing barrel 210, the polishing barrel 210 sprays the polishing paste onto the part on the operation position 221, and the used polishing paste flows into the flash groove 224 and flows out from the outlet 223; the parts after polishing fall into the conveying part 300 and are transported to the next station.

Liquid storage part 100

The reservoir 100 is adapted to provide a sanding paste.

The liquid storage part 100 comprises a storage cavity 110, wherein a stirring blade 120, a pressing plate 130 slidably arranged on the stirring blade 120, a crushing part 140 fixed on the stirring blade 120 and a driving part 150 for driving the stirring blade 120 and the pressing plate 130 to move are arranged in the storage cavity 110, and the driving part 150 drives the stirring blade 120 to rotate so as to uniformly mix polishing paste in the storage cavity 110; wherein, when the driving part 150 drives the platen 130 to slide and separate from the stirring blade 120, the storage chamber 110 is communicated with the grinding part 200; when the driving part 150 drives the platen 130 to slide on the stirring blade 120, the storage chamber 110 and the grinding cylinder 210 are disconnected; when the driving part 150 drives the pressing plate 130 to slide on the stirring blade 120 and tightly attach to the crushing part 140, the stirring blade 120, the crushing part 140, the pressing plate 130 and the inner wall of the storage cavity 110 form a crushing cavity 160, and the driving part 150 drives the stirring blade 120, the pressing plate 130 and the crushing part 140 to rotate so as to grind the grinding particles in the crushing cavity 160.

The mixing blades 120 are disposed in the storage chamber 110, wherein the number of the mixing blades 120 is four, and the mixing blades are disposed in the storage chamber 110 in a mirror image manner. The stirring blade 120 is driven by the driving part 150 to rotate, and the stirring blade 120 rotates in the storage cavity 110 to stir and mix, i.e. to mix the polishing particles and the polishing solution into the polishing paste.

The crushing part 140 includes a fixing ring 141 and crushing teeth 142 provided on an outer wall of the fixing ring 141, wherein a bottom of the fixing ring 141 is fixed to an upper end of the agitating blade 120. When grinding particles thrown into the crushing cavity 160 need to be crushed, the driving part 150 drives the pressure plate 130 to move upwards to be attached to the fixing ring 141, so that the stirring blade 120, the crushing part 140, the pressure plate 130 and the storage cavity 110 form the crushing cavity 160, the driving part 150 drives the stirring blade 120, the crushing part 140 and the pressure plate 130 to rotate, the grinding particles in the crushing cavity 160 are ground by the crushing teeth 142, and the grinding particles are more uniform.

A chute matched with the stirring blade 120 is formed in the pressure plate 130; the platen 130 has a size corresponding to the size of the inner wall of the storage chamber 110. The platen 130 is slidable within the reservoir 110, and the platen 130 is sized to conform to the dimensions of the interior walls of the reservoir 110 so as to press the polishing paste into the polishing cartridge 210. When the platen 130 is disengaged from the paddle 120, i.e., the platen 130 does not slide on the paddle 120, the polishing paste may flow downward from the chute into the polishing drum 210.

The driving part 150 comprises a lifting cylinder 151, a bearing 152, a straight pushing cylinder 153 and a rotating cylinder 154, wherein the lifting cylinder 151 is fixed on an inner ring of the bearing 152, and a piston of the lifting cylinder 151 is fixedly connected with the pressure plate 130; the direct-pushing cylinder 153 is fixed on the liquid storage part 100, and a piston of the direct-pushing cylinder 153 is fixedly connected with an outer ring of the bearing 152; the piston of the rotary cylinder 154 is in transmission connection with the direct-pushing cylinder 153, and the rotary cylinder 154 is fixed on the liquid storage part 100. The piston of the lifting cylinder 151 is fixedly connected with the center of the pressure plate 130, the lifting cylinder 151 only drives the pressure plate 130 to move up and down, the direct pushing cylinder 153 drives the bearing 152 to move up and down, so that the stirring blade 120 and the fixing ring 141 move up and down together, the rotating cylinder 154 can drive the direct pushing cylinder 153 to rotate, and the stirring blade 120, the fixing ring 141 and the direct pushing cylinder 153 are enabled to move rotationally together. The inner ring of the bearing 152 is only fixedly connected with the lifting cylinder 151, so that the lifting cylinder 151 can independently drive the pressure plate 130 to move up and down. The outer ring of the bearing 152 is fixedly connected with the stirring blade 120 and the direct pushing cylinder 153, and the fixing ring 141 is fixed on the stirring blade 120. In order to fixedly connect the stirring vane 120 to the bearing 152, the stirring vane 120 is fixed to the outer ring of the bearing 152 by a connecting plate 121.

A positioning block 131 is fixed on the side wall of the pressure plate 130, a vertical groove 113 and a ring groove 114 are formed in the side wall of the liquid storage part 100, wherein the vertical groove 113 is communicated with the ring groove 114, and the positioning block 131 is matched with the vertical groove 113 and the ring groove 114 in size. When the pressing plate 130 is separated from the stirring blade 120, the positioning block 131 on the pressing plate 130 slides to the lowest end of the vertical groove 113, the pressing plate 130 is not in contact with the stirring blade 120, and when the stirring blade 120 rotates, the pressing plate 130 does not rotate along with the stirring blade 120, so that the stirring blade 120 can scrape off the polishing paste on the surface of the pressing plate 130 and extrude the polishing paste out of the sliding groove. When the pressure plate 130 slides to the ring groove 114, the pressure plate 130 can rotate along with the rotation of the stirring blade 120, that is, when the crushing is needed, the stirring blade 120, the crushing part 140 and the pressure plate 130 rotate to grind the grinding particles in the crushing cavity 160, so that the grinding particles are more uniform. When the platen 130 is located in the ring groove 114, the straight push cylinder 153 pushes the platen 130, the agitating blade 120, and the fixing ring 141 to move downward together, thereby pressing the sanding paste into the sanding cylinder 210.

Grinding part 200

The grinding part 200 is adapted to grind a part.

The grinding part 200 comprises a grinding cylinder 210 positioned at the bottom of the liquid storage part 100, a conical cylinder 220 positioned at the bottom of the grinding cylinder 210, a working position 221 arranged at the bottom of the conical cylinder 220 and an outlet 223 arranged on the side wall of the conical cylinder 220, wherein the working position 221 is enclosed by a baffle 222, the baffle 222 and the side wall of the conical cylinder 220 form a flash groove 224, and the flash groove 224 is communicated with the outlet 223; the bottom of the grinding cylinder 210 is provided with a nozzle, wherein the position of the nozzle corresponds to the position of the working position 221. The grinding barrel 210 communicates with the conical barrel 220 through a spout. The nozzle sprays the polishing paste provided by the liquid storage part 100 onto the part to perform polishing operation, the part is placed on the operation position 221, namely the baffle 222, and the polishing paste after polishing the part flows out from the periphery of the part, namely flows into the overflow trough 224. A fixing plate 270 is rotated on the working position 221, wherein an operating gap 225 is left between the fixing plate 270 and the working position 221. The operator can open the fixing plate 270 from the operation gap 225, when the parts are needed to be ground, the parts are put on the fixing plate 270 from the outlet 223, after the parts are ground, the fixing plate 270 rotates downwards, so that the operation position 221 is opened, and the parts fall into the conveying part 300 from the operation position 221.

The outlet 223 is rotatably provided with a door body 260, wherein the lowest position of the door body 260 is located below the highest position of the baffle 222. Parts can be put into the operation position 221 from the door body 260 for polishing; the polishing paste after polishing can be taken out from the door 260 for recycling.

The liquid storage part 100 and the polishing part 200 are fixed on a first bracket 230, a second bracket 240 is arranged below the first bracket 230, and a damping part 250 is arranged between the first bracket 230 and the second bracket 240. The shock absorbing part 250 is a rubber shock absorbing pad 251. The polishing paste in the liquid storage part 100 is pushed by the pressing plate 130 and the stirring blades 120 to extrude the polishing barrel 210, the generated vibration can be absorbed by the shock absorption pad 251, the polishing precision in the polishing process is improved, the noise generated by vibration is reduced, and the service life of the equipment is prolonged. In order to improve the shock-absorbing effect, the shock-absorbing pad 251 is disposed at a corner of the second bracket 240.

Conveying part 300

The conveying part 300 is adapted to convey the ground parts.

The conveying part 300 includes a third frame 310, a transmission shaft 320 rotatably disposed at both ends of the third frame 310, and a transmission belt 330 rotatably disposed on the transmission shaft 320, wherein the transmission shaft 320 is in transmission connection with a motor. The finished part falls off the baffle 222 onto the conveyor 330 and is transported to the next station.

The working process of the equipment is as follows:

when the liquid storage part 100 is thrown into to the cream of will polishing from feed inlet 111, start lifting cylinder 151, lifting cylinder 151 drives pressure disk 130 along the direction downstream of perpendicular groove 113, pressure disk 130 breaks away from stirring leaf 120, pressure disk 130 does not slide on stirring leaf 120 for the cream of polishing flows out to discharge gate 112 from the clearance between spout or pressure disk 130 and the stirring leaf 120, flows to the bottom of liquid storage part 100, can start revolving cylinder 154 at this in-process, so that stirring leaf 120 rotates, will polish liquid and the granule of polishing and mix better. Then the lifting cylinder 151 drives the pressing plate 130 to move upwards along the direction of the vertical groove 113, so that the pressing plate 130 is located in the ring groove 114, the positioning block 131 on the pressing plate 130 is aligned with the vertical groove 113, the straight pushing cylinder 153 pushes the pressing plate 130 and the stirring blade 120 to move downwards together, the size of the pressing plate 130 is consistent with the size of the inner wall of the liquid storage part 100, the sliding groove is blocked by the stirring blade 120, and the polishing paste is extruded into the polishing barrel 210.

The polishing paste after the polishing operation is completed is fed again from the feed port 111, and since the polishing particles in the polishing paste are greatly reduced by one polishing operation, the polishing particles need to be added again. And starting the lifting cylinder 151, wherein the lifting cylinder 151 drives the pressure plate 130 to move upwards along the direction of the vertical groove 113 until the pressure plate 130 props against the bottom of the fixing ring 141, and at the moment, the positioning block 131 of the pressure plate 130 is just positioned in the ring groove 114. The grinding particles are put into the crushing cavity 160, then the rotary cylinder 154 drives the stirring blade 120, the pressing plate 130 and the fixing ring 141 to rotate, because the positioning block 131 of the pressing plate 130 is located in the ring groove 114, the pressing plate 130 can rotate along with the stirring blade 120, and the grinding teeth 142 on the fixing ring 141 of the crushing part 140 grind the grinding particles in the crushing cavity 160. Then revolving cylinder 154 rotates to the position that locating piece 131 just in time was located perpendicular groove 113, lift cylinder 151 drives pressure disk 130 and moves down along the direction of perpendicular groove 113, until pressure disk 130 breaks away from stirring leaf 120, pressure disk 130 does not slide on stirring leaf 120 promptly, thereby make the cream of polishing flow out to discharge gate 112 from the spout or the clearance between pressure disk 130 and the stirring leaf 120, after pressure disk 130 breaks away from stirring leaf 120, stirring leaf 120 rotates, can strike off the cream of polishing on pressure disk 130 surface, thereby the cream of polishing is extruded to discharge gate 112 direction in the spout, stirring leaf 120 is when the pivoted simultaneously, can mix polishing liquid and the granule of polishing better, improve the efficiency of polishing. The pressing plate 130 may press the polishing paste downward under the action of the lifting cylinder 151, and also provides a certain pressing force, so that the polishing paste can be quickly pressed into the bottom of the liquid storage part 100.

When the grinding paste completely flows to the bottom of the liquid storage part 100, the lifting cylinder 151 drives the pressing plate 130 to move upwards along the direction of the vertical groove 113, so that the pressing plate 130 is located in the ring groove 114, the rotating cylinder 154 rotates to align the positioning block 131 on the pressing plate 130 with the vertical groove 113, and the straight pushing cylinder 153 pushes the pressing plate 130 and the stirring blade 120 to move downwards together, so that the grinding paste is extruded into the grinding cylinder 210.

After the grinding paste is squeezed into the grinding cylinder 210, the grinding paste is sprayed onto the part on the baffle 222 from the nozzle of the grinding cylinder 210, and the grinding paste flows out from the periphery of the part, namely into the overflow groove 224. When the grinding of the parts is completed, the fixing plate 270 is rotated downward to open the work station 221, and the parts fall from the work station 221 to the transfer part 300. Because the lowest position of the door body 260 is positioned below the highest position of the baffle 222, parts can be placed into the operation position 221 from the door body 260 for polishing, and polishing paste after polishing can rotate the door body 260 and be taken out and recycled from the door body 260. The conveying part 300 conveys the polished parts to the next process.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.