阅读说明：本技术 一种导热绝缘胶带及其制备方法 (Heat-conducting insulating adhesive tape and preparation method thereof ) 是由 任文 冯先强 于 2019-09-12 设计创作，主要内容包括：本发明涉及一种导热绝缘胶带及其制备方法；所述导热绝缘胶带包括由下往上依次设置的基材层、导热胶粘层和离型膜层；所述基材层为无纺布基材或复合纤维布基材,所述导热胶粘层中包括胶粘剂、纳米导热填料、热稳定剂、抗氧化剂、塑化剂、偶联剂和溶剂。本发明通过优选无纺布或复合纤维布作为基材层材料,结合导热胶粘剂层中选用的纳米导热填料,综合实现了胶带的高绝缘性和高导热性能；使用本发明制备的导热绝缘胶带替换传统绝缘胶带既可保证绝缘性亦可以解决器件的温升问题,提高产品运行的稳定性和使用寿命；同时其制备方法工艺简单,工序流程短,使用设备常见,原材料价格低廉,适用于批量化生产和使用。(The invention relates to a heat-conducting insulating adhesive tape and a preparation method thereof; the heat-conducting insulating adhesive tape comprises a base material layer, a heat-conducting adhesive layer and a release film layer which are sequentially arranged from bottom to top; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent. According to the invention, the non-woven fabric or the composite fiber cloth is preferably selected as the material of the base material layer, and the nano heat-conducting filler selected in the heat-conducting adhesive layer is combined, so that the high insulativity and the high heat-conducting property of the adhesive tape are comprehensively realized; the heat-conducting insulating adhesive tape prepared by the invention is used for replacing the traditional insulating adhesive tape, so that the insulativity can be ensured, the problem of temperature rise of devices can be solved, the running stability of products is improved, and the service life of the products is prolonged; meanwhile, the preparation method has the advantages of simple process, short process flow, common used equipment and low price of raw materials, and is suitable for batch production and use.)

1. A heat-conductive insulating tape characterized in that: comprises a substrate layer, a heat-conducting adhesive layer and a release film layer which are arranged from bottom to top in sequence; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent.

2. The thermally conductive and insulating tape according to claim 1, wherein: the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 80-120 parts of an adhesive, 100-200 parts of a nano heat-conducting filler, 1.5-5 parts of a heat stabilizer, 2-6 parts of an antioxidant, 1-10 parts of a plasticizer, 0.5-3 parts of a coupling agent and 10-50 parts of a solvent.

3. The thermally conductive and insulating tape according to claim 1, wherein: the adhesive is one or a mixture of organic silicon, polyurethane and acrylic adhesive.

4. The thermally conductive and insulating tape according to claim 1, wherein: the nano heat-conducting filler is one or a mixture of nano ceramic particles, whiskers and fibers.

5. The thermally conductive and insulating tape according to claim 4, wherein: the mixing ratio of the nano-scale ceramic particles, the whiskers and the fibers in the nano heat-conducting filler is 1: 1: 1-1: 5: 9.

6. the thermally conductive and insulating tape according to claim 1, wherein: the coupling agent is silane or titanate coupling agent.

7. The thermally conductive and insulating tape according to claim 1, wherein: the plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy, citric acid esters and polyesters.

8. The thermally conductive and insulating tape according to claim 1, wherein: the solvent is one or a mixture of toluene, xylene, alcohols, ethers or ketone solvents.

9. A preparation method of a heat-conducting insulating adhesive tape is characterized by comprising the following steps: the method comprises the following specific steps:

a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;

b. adding a heat stabilizer, an antioxidant and a plasticizer into a solvent, and uniformly mixing to obtain a mixed diluent;

c. mixing the nanometer heat-conducting filler with the mixed diluent obtained in the previous step to obtain a suspension I;

d. adding a coupling agent into the suspension I, and uniformly mixing to obtain a suspension II;

e. mixing an adhesive with the suspension II to obtain a heat-conducting adhesive;

f. carrying out surface treatment on the base material to increase the surface adhesion;

g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;

h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step to a release film;

i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.

10. The method for preparing a heat-conductive insulating tape according to claim 9, wherein: in the step c, the mixing condition is that the mixture is mixed for 10 to 20 minutes by an ultrasonic dispersion machine at the temperature of 45 to 65 ℃; in the step d, mixing is carried out for 5-10 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; and e, dispersing for 3-6 hours at room temperature by using a high-speed stirrer under the mixing condition.

Technical Field

The invention relates to the technical field of insulating tapes, in particular to a heat-conducting insulating tape and a preparation method thereof.

Background

With the development of electronic technology, electronic devices tend to be miniaturized and light and thin, and meanwhile, the performance and power of electronic components are continuously improved, and the heat flux density is rapidly increased, so that how to effectively solve the problem of heat dissipation becomes a bottleneck of further development of electronic technology.

Printed Circuit Board (PCB) cards have a lot of heat sources, wherein the problem of temperature rise of chips and mos (metal Oxide semiconductor) tubes and other heating devices can be effectively solved by means of heat sinks or heat sinks, but no effective solution is available in the industry for electronic and magnetic devices, such as transformers and inductors, which are composed of magnetic cores and coils.

At present, insulating tapes are used between windings and at outsourcing positions of magnetic devices such as transformers to play insulating, fixing and protecting roles, and due to the fact that the heat conductivity coefficient of the insulating tapes is extremely low, heat generated during working of the transformers is sealed inside the devices and cannot form convective heat transfer with external cold air, and therefore the problem that temperature rise of the transformers exceeds the standard is caused.

The heat-conducting adhesive tape popular in the market is roughly divided into a substrate type and a substrate-free type, and both sides of the substrate-free type heat-conducting adhesive tape usually have viscosity, so that the winding construction between magnetic device windings and at an outer package position is inconvenient, and the heat-conducting adhesive tape is suitable for being used as a heat-conducting interface material to connect a radiator and a heat source; the heat-conducting adhesive tape with a base material is generally a sheet material such as a PET (polyethylene terephthalate) film, so that the heat resistance is high, the sealing performance is high, the integral heat transfer capacity of the heat-conducting adhesive tape is reduced, and the problem of poor insulating performance is also caused.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides a heat-conducting insulating adhesive tape which comprehensively realizes high insulativity and high heat conductivity of the adhesive tape so as to solve the technical problems of poor heat dissipation performance of a film material adhesive tape and poor insulating performance of a cloth-based adhesive tape in the prior heat-conducting adhesive tape.

The technical purpose is achieved through the following technical scheme:

a heat-conducting insulating adhesive tape comprises a substrate layer, a heat-conducting adhesive layer and a release film layer which are sequentially arranged from bottom to top; the substrate layer is a non-woven fabric substrate or a composite fiber cloth substrate, and the heat-conducting adhesive layer comprises an adhesive, a nanometer heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent.

Compared with the prior art, the invention preferably selects the non-woven fabric or the composite fiber cloth as the material of the base material layer, and combines the selected nanometer heat-conducting filler in the heat-conducting adhesive layer, thereby solving the technical problems of poor heat dissipation performance of the film material adhesive tape and poor insulating performance of the cloth-based adhesive tape in the existing insulating adhesive tape, and comprehensively realizing high insulativity and high heat-conducting performance of the adhesive tape. The heat-conducting insulating adhesive tape has higher heat conductivity coefficient and basic fixing and protecting performance on the premise of meeting basic insulation and even enhancing the insulation performance, and the heat-conducting insulating adhesive tape prepared by the invention can ensure the insulation performance, solve the temperature rise problem of devices, improve the running stability of products and prolong the service life of the products by replacing the traditional insulating adhesive tape.

Further, the heat-conducting adhesive layer comprises the following raw materials in parts by weight: 80-120 parts of an adhesive, 100-200 parts of a nano heat-conducting filler, 1.5-5 parts of a heat stabilizer, 2-6 parts of an antioxidant, 1-10 parts of a plasticizer, 0.5-3 parts of a coupling agent and 10-50 parts of a solvent. The formula is optimized by optimizing the proportion of each processing aid of the heat-conducting adhesive layer material.

Further, the adhesive is one or a mixture of more of organic silicon, polyurethane and acrylic adhesive.

Further, the nano heat conducting filler is one or a mixture of nano ceramic particles, whiskers and fibers.

Further, the mixing ratio of the nano-scale ceramic particles, the whiskers and the fibers in the nano heat-conducting filler is 1: 1: 1-1: 5: 9. by optimizing the mixing proportion of the three components, the added ceramic whiskers or fibers can play a role of a heat conduction chain, break through the existence mode of an island form of ceramic particles in a matrix, connect the ceramic particles to form a criss-cross heat conduction network, and greatly improve the heat conductivity coefficient of the composite material.

Further, the coupling agent is a silane or titanate coupling agent. The addition of the coupling agent can improve the dispersibility of the heat-conducting filler and improve the overall performance of the heat-conducting adhesive tape.

The plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy compounds, citric acid esters and polyesters. The plasticizer is one or more of aliphatic dibasic acid esters, phthalic acid esters, benzene polyacid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy, citric acid esters and polyesters.

Further, one or more of toluene, xylene, alcohols, ethers or ketones are mixed.

In addition, the invention also provides a preparation method of the heat-conducting insulating adhesive tape, which comprises the following specific steps:

a. firstly, weighing an adhesive, a nano heat-conducting filler, a heat stabilizer, an antioxidant, a plasticizer, a coupling agent and a solvent according to the weight parts in the formula for later use;

b. adding a heat stabilizer, an antioxidant and a plasticizer into a solvent, and uniformly mixing to obtain a mixed diluent;

c. mixing the nanometer heat-conducting filler with the mixed diluent obtained in the previous step to obtain a suspension I;

d. adding a coupling agent into the suspension I, and uniformly mixing to obtain a suspension II;

e. mixing an adhesive with the suspension II to obtain a heat-conducting adhesive;

f. carrying out surface treatment on the base material to increase the surface adhesion;

g. uniformly compounding the heat-conducting adhesive obtained in the step e on the substrate subjected to surface treatment in the step f through a single-side gluing process, and drying to obtain a heat-conducting adhesive/substrate composite film;

h. bonding the adhesive layer of the heat-conducting adhesive/substrate composite film obtained in the previous step with a release film to obtain a heat-conducting insulating adhesive tape;

i. and d, cutting and winding the heat-conducting insulating adhesive tape prepared in the step h.

Further, in the step c, the mixing condition is that the mixture is mixed for 10-20 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; in the step d, mixing is carried out for 5-10 minutes by an ultrasonic dispersion machine at the temperature of 45-65 ℃; and e, dispersing for 3-6 hours at room temperature by using a high-speed stirrer under the mixing condition.

Compared with the prior art, the non-woven fabric or composite fiber cloth is preferably selected as the material of the base material layer, the nano heat-conducting filler selected in the heat-conducting adhesive layer is combined, the type selection and the proportion of the processing aid of the material of the heat-conducting adhesive layer are further optimized, the base material layer and the heat-conducting adhesive layer are matched with each other, the technical problems that a film adhesive tape in the existing insulating adhesive tape is poor in heat dissipation performance and the insulating performance of a cloth-based adhesive tape is poor are solved, and the high insulation performance and the high heat-conducting performance of the adhesive tape are comprehensively realized. In addition, the preparation method of the heat-conducting insulating adhesive tape provided by the invention has the advantages of low price of raw materials, simple process, short process flow, use of common equipment and suitability for batch production and use.

Detailed Description