阅读说明：本技术 一种铜锡合金键合线生产工艺方法 (Production process method of copper-tin alloy bonding wire ) 是由 何孔田 唐文静 张军 何孔高 于 2019-09-06 设计创作，主要内容包括：本发明公开了一种铜锡合金键合线生产工艺方法,按照如下质量百分比的组分要求准备,铬0.8％～1.5％、锆0.06～0.09％、锰0.3％～0.5％、氮化钛粉体0.5％～1.5％、银0.003％～0.009％、镁0.005～0.07％、铝0.008～0.01％、铟0.006～0.007％、硅0.001％～0.005％,余量为铜,并采用科学的合金线制备方法,利用金属在熔融液态时由激烈运动的原子集团和空穴组成的特性,通过合理的铸造工艺使铬、锆、锰、氮化钛粉体、银、镁、铝、铟和硅元素均匀分布到铜基体中,从而改善铜基体的综合性能；此外,本发明还在铜合金线的外部镀有锡层,使得该铜锡合金键合线具有较好的抗氧化性、耐腐蚀性和屏蔽性(抗干扰性),也有利于降低合金线的电阻率,提高其导电性能。(The invention discloses a production process method of a copper-tin alloy bonding wire, which is prepared according to the following component requirements of, by mass, 0.8% -1.5% of chromium, 0.06% -0.09% of zirconium, 0.3% -0.5% of manganese, 0.5% -1.5% of titanium nitride powder, 0.003% -0.009% of silver, 0.005% -0.07% of magnesium, 0.008% -0.01% of aluminum, 0.006% -0.007% of indium, 0.001% -0.005% of silicon and the balance of copper, and adopts a scientific alloy wire preparation method, utilizes the characteristic that metal is composed of violent-moving atomic groups and cavities in molten liquid state, and uniformly distributes chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into a copper matrix through a reasonable casting process, thereby improving the comprehensive performance of the copper matrix; in addition, the tin layer is plated outside the copper alloy wire, so that the copper-tin alloy bonding wire has better oxidation resistance, corrosion resistance and shielding property (anti-interference property), and is also favorable for reducing the resistivity of the alloy wire and improving the conductivity of the alloy wire.)

1. A production process method of a copper-tin alloy bonding wire is characterized by comprising the following steps:

s1, batching: the alloy comprises, by mass, 0.8-1.5% of chromium, 0.06-0.09% of zirconium, 0.3-0.5% of manganese, 0.5-1.5% of titanium nitride powder, 0.003-0.009% of silver, 0.005-0.07% of magnesium, 0.008-0.01% of aluminum, 0.006-0.007% of indium, 0.001-0.005% of silicon, and the balance of copper;

s2, smelting: adding the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper in percentage by mass into a vacuum smelting furnace, heating to 1150-1250 ℃ to melt the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper, continuously refining for 20-35 min, stirring, keeping the temperature for 1-1.5 h, and then carrying out vacuum cooling to obtain a copper alloy ingot;

s3, continuous casting: vacuumizing the vacuum continuous casting furnace to 1.5 multiplied by 10Pa, stopping vacuumizing, filling inert gas into the vacuum melting furnace to 5 multiplied by 103 Pa, heating the vacuum continuous casting furnace to 1000-1200 ℃, adding the copper alloy ingot obtained in the step S2 to melt, refining for 30-40 min, starting continuous casting at the speed of 40-50 mm/min, and continuously casting to obtain a copper alloy rod;

s4, drawing: lubricating the copper alloy rod obtained in the step S3 with a grease lubricant, and then placing the copper alloy rod into a wire drawing die for cold drawing, wherein the wire drawing die is a wire drawing die lubricated with the grease lubricant, and the copper alloy rod is cooled, drawn and annealed on line to form a copper alloy wire with the diameter of 0.2-0.3 mm;

s5, cleaning the copper alloy wire: after drawing, immediately carrying out three times of cleaning on the copper alloy wire prepared in S4, wherein the first time is carried out for 20-30S by using sulfuric acid with the volume fraction of 8-15%, the second time is carried out for 15-25S by using an ethanol-water mixed solution, the third time is carried out for 10-20S by using deionized water, and the copper alloy wire is dried in an environment at the temperature of 180-200 ℃ after being cleaned;

s6, plating: selecting a long tubular mold with a proper aperture according to the thickness of a tin coating, inserting the cleaned and dried copper alloy wire into the long tubular mold, then injecting a tin plating solution into the long tubular mold at a speed of 13-15 mu L/min by using a medical needle tube, drying the long tubular mold for 12-14 h at the temperature of 180-200 ℃ after filling, and drying and removing the mold to obtain a copper-tin alloy bonding wire;

s7, cleaning: and (3) after the tin plating is finished, washing the tin-plated steel by using clear water, then using a neutralization solution for neutralization treatment, then washing the tin-plated steel by using clear water, finally washing the tin-plated steel by using hot water, and then guiding the tin-plated steel into a temperature control pipeline for drying to obtain a finished product.

2. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the tin plating solution in step S6 is prepared from a mixed solution of tin methane sulfonate, methanesulfonic acid, and a composite additive.

3. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the neutralization solution of the step S7 is sodium phosphate solution.

4. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the ethanol-water mixed solution in the step S5 is prepared from absolute ethanol and deionized water according to the following ratio: deionized water is mixed according to the volume ratio of 1: 2.

5. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the inert gas in step S3 is helium.

6. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the number of cold drawing in the step S4 is 5-12, and the cold drawing speed is 120-150 mm/S.

7. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the voltage of the on-line annealing in the step S4 is 50-60V, the speed is 600-700m/min, the temperature is 400-420 ℃, and the annealing time is 1-3 minutes.

8. The production process method of the copper-tin alloy bonding wire according to claim 1, characterized by comprising the following steps: the copper is high-purity cathode copper which meets the GB/T467-1997 standard.

Technical Field

The invention relates to the technical field of metal bonding wires, in particular to a production process method of a copper-tin alloy bonding wire.

Background

The bonding wire is a packaging material commonly used in the field of microelectronics, and uses a thin metal wire to enable a metal lead wire to be tightly welded with a substrate bonding pad by utilizing heat, pressure and ultrasonic energy so as to realize electrical interconnection between chips and a substrate and information intercommunication between the chips. The early bonding wires are mostly made of pure gold, but the bonding wires are expensive and high in cost, and in order to reduce the cost, the bonding wires are gradually replaced by various bonding alloy wires, such as pure silver gold-plated bonding wires, various copper alloy bonding wires and the like. Copper wires have the advantages of low price, good conductivity, high hardness and the like, so that copper alloy bonding wires become the most widely applied bonding wires at present. However, most of the existing copper alloy bonding wires have the problems of easy surface oxidation, poor mechanical property, easy occurrence of wire drawing and breaking and the like. Therefore, it is important to develop a bonding copper wire that can satisfy various mechanical properties of the bonding material and provide better surface oxidation resistance.

Therefore, the invention provides a production process method of a copper-tin alloy bonding wire.

Disclosure of Invention

The invention aims to provide a production process method of a copper-tin alloy bonding wire, which aims to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a production process method of a copper-tin alloy bonding wire comprises the following steps:

s1, batching: the alloy comprises, by mass, 0.8-1.5% of chromium, 0.06-0.09% of zirconium, 0.3-0.5% of manganese, 0.5-1.5% of titanium nitride powder, 0.003-0.009% of silver, 0.005-0.07% of magnesium, 0.008-0.01% of aluminum, 0.006-0.007% of indium, 0.001-0.005% of silicon, and the balance of copper;

s2, smelting: adding the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper in percentage by mass into a vacuum smelting furnace, heating to 1150-1250 ℃ to melt the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium, silicon and copper, continuously refining for 20-35 min, stirring, keeping the temperature for 1-1.5 h, and then carrying out vacuum cooling to obtain a copper alloy ingot;

s3, continuous casting: vacuumizing the vacuum continuous casting furnace to 1.5 multiplied by 10Pa, stopping vacuumizing, filling inert gas into the vacuum melting furnace to 5 multiplied by 103 Pa, heating the vacuum continuous casting furnace to 1000-1200 ℃, adding the copper alloy ingot obtained in the step S2 to melt, refining for 30-40 min, starting continuous casting at the speed of 40-50 mm/min, and continuously casting to obtain a copper alloy rod;

s4, drawing: lubricating the copper alloy rod obtained in the step S3 with a grease lubricant, and then placing the copper alloy rod into a wire drawing die for cold drawing, wherein the wire drawing die is a wire drawing die lubricated with the grease lubricant, and the copper alloy rod is cooled, drawn and annealed on line to form a copper alloy wire with the diameter of 0.2-0.3 mm;

s5, cleaning the copper alloy wire: after drawing, immediately carrying out three times of cleaning on the copper alloy wire prepared in S4, wherein the first time is carried out for 20-30S by using sulfuric acid with the volume fraction of 8-15%, the second time is carried out for 15-25S by using an ethanol-water mixed solution, the third time is carried out for 10-20S by using deionized water, and the copper alloy wire is dried in an environment at the temperature of 180-200 ℃ after being cleaned;

s6, plating: selecting a long tubular mold with a proper aperture according to the thickness of a tin coating, inserting the cleaned and dried copper alloy wire into the long tubular mold, then injecting a tin plating solution into the long tubular mold at a speed of 13-15 mu L/min by using a medical needle tube, drying the long tubular mold for 12-14 h at the temperature of 180-200 ℃ after filling, and drying and removing the mold to obtain a copper-tin alloy bonding wire;

s7, cleaning: and (3) after the tin plating is finished, washing the tin-plated steel by using clear water, then using a neutralization solution for neutralization treatment, then washing the tin-plated steel by using clear water, finally washing the tin-plated steel by using hot water, and then guiding the tin-plated steel into a temperature control pipeline for drying to obtain a finished product.

In a preferred embodiment of the present invention, the tin plating solution in step S6 is prepared from a mixed solution of tin methanesulfonate, methanesulfonic acid, and a complex additive.

In a preferred embodiment of the present invention, the neutralized solution in step S7 is a sodium phosphate solution.

As a preferred technical solution of the present invention, the ethanol-water mixed solution in step S5 is prepared from absolute ethanol and deionized water according to the following steps: deionized water is mixed according to the volume ratio of 1: 2.

In a preferred embodiment of the present invention, the inert gas in step S3 is helium.

In a preferred embodiment of the present invention, the number of cold drawing in step S4 is 5 to 12, and the cold drawing speed is 120 to 150 mm/S.

As a preferred technical scheme of the invention, the voltage of the on-line annealing in the step S4 is 50-60V, the speed is 600-700m/min, the temperature is 400-420 ℃, and the annealing time is 1-3 minutes.

As a preferred technical scheme of the invention, the copper is high-purity cathode copper which meets the GB/T467-1997 standard.

Compared with the prior art, the invention has the beneficial effects that: the invention provides a production process method of a copper-tin alloy bonding wire, which takes a copper element as a substrate, reasonably adds chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into the copper element, adopts a scientific preparation method of the alloy wire, and utilizes the characteristic that metal consists of fiercely moving atom groups and cavities when in a molten liquid state to uniformly distribute the chromium, zirconium, manganese, titanium nitride powder, silver, magnesium, aluminum, indium and silicon elements into the copper substrate through a reasonable casting process, thereby improving the comprehensive performance of the copper substrate;

in addition, the tin layer is plated outside the copper alloy wire, so that the copper-tin alloy bonding wire has better oxidation resistance, corrosion resistance and shielding property (anti-interference property), and is also favorable for reducing the resistivity of the alloy wire and improving the conductivity of the alloy wire.

Detailed Description

The following description of the preferred embodiments of the present invention is provided for the purpose of illustration and description, and is in no way intended to limit the invention.