阅读说明：本技术 一种显示面板、显示装置及显示面板制备方法 (Display panel, display device and display panel preparation method ) 是由 白思航 于 2019-08-29 设计创作，主要内容包括：本发明揭露一种显示面板、显示装置及显示面板制备方法。所述显示面板包括：至少一个功能附加区、围绕所述功能附加区设置的辅助区、以及围绕所述辅助区设置的正常显示区；在所述功能附加区,仅设置柔性基板以及封装层中的无机封装层,所述辅助区中设置有围绕所述功能附加区的所述薄膜晶体管层的金属走线；本发明有效提高了所述功能附加区的透光性。(The invention discloses a display panel, a display device and a display panel preparation method. The display panel includes: at least one function attachment area, an auxiliary area disposed around the function attachment area, and a normal display area disposed around the auxiliary area; only a flexible substrate and an inorganic packaging layer in the packaging layer are arranged in the functional additional area, and metal wiring surrounding the thin film transistor layer of the functional additional area is arranged in the auxiliary area; the invention effectively improves the light transmission of the function additional area.)

1. A display panel, comprising: at least one function attachment area, an auxiliary area disposed around the function attachment area, and a normal display area disposed around the auxiliary area;

the display panel includes:

a flexible substrate;

the thin film transistor layer is arranged on one side of the flexible substrate and corresponds to the normal display area and the auxiliary area, and metal wiring of the thin film transistor layer surrounding the function additional area is arranged in the auxiliary area;

the organic light-emitting layer is arranged on one side of the thin film transistor layer, which is far away from the flexible substrate, and corresponds to the normal display area and the auxiliary area; and

and the packaging layer is arranged on one side of the organic light-emitting layer, which is far away from the thin film transistor layer, and corresponds to the normal display area, the auxiliary area and the function additional area.

2. The display panel of claim 1, wherein at least one retaining wall structure is disposed on the thin-film transistor layer corresponding to the auxiliary region and surrounding the functional addition region.

3. The display panel according to claim 2, wherein the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, which are sequentially stacked, the first inorganic encapsulation layer covers the normal display area and the auxiliary area and covers the retaining wall structure, the organic encapsulation layer covers the normal display area and extends to the retaining wall structure, and the second inorganic encapsulation layer covers the normal display area, the auxiliary area, and the function addition area.

4. The display panel according to claim 3, wherein the second inorganic encapsulation layer is directly formed on the flexible substrate in the function attachment region.

5. The display panel according to claim 2, wherein the material of the retaining wall structure is a black light absorbing material.

6. The display panel according to claim 1, wherein in the function addition region, a material of the flexible substrate is transparent polyimide.

7. A display device, characterized in that the display device comprises:

a display panel employing the display panel of claim 1; and

at least one optical sensor, the optical sensor is set up in the function additional zone of the said display panel corresponds to the position.

8. A preparation method of a display panel is characterized by comprising the following steps:

providing a flexible substrate, wherein the flexible substrate comprises at least one function additional area, an auxiliary area arranged around the function additional area, and a normal display area arranged around the auxiliary area;

preparing a thin film transistor layer on one side of the flexible substrate, wherein the thin film transistor layer corresponds to the normal display area and the auxiliary area, and a metal wire of the thin film transistor layer surrounding the function additional area is arranged in the auxiliary area; and

preparing an organic light-emitting layer on one side of the thin-film transistor layer far away from the flexible substrate, and preparing a packaging layer on one side of the organic light-emitting layer far away from the thin-film transistor layer, wherein the organic light-emitting layer corresponds to the normal display area and the auxiliary area, and the packaging layer corresponds to the normal display area, the auxiliary area and the function additional area.

9. The method of claim 8, wherein the step of providing a flexible substrate further comprises: and etching the area of the flexible substrate corresponding to the function additional area, and filling the etched area with transparent polyimide.

10. The method of claim 8, wherein the step of forming an organic light-emitting layer on a side of the thin-film transistor layer away from the flexible substrate and forming an encapsulation layer on a side of the organic light-emitting layer away from the thin-film transistor layer further comprises:

preparing an organic light-emitting layer and at least one retaining wall structure on one side of the thin film transistor layer far away from the flexible substrate, and forming a first inorganic packaging layer on one side of the organic light-emitting layer far away from the thin film transistor layer, wherein the retaining wall structure corresponds to the auxiliary area and surrounds the function additional area, and the first inorganic packaging layer covers the normal display area and the auxiliary area and covers the retaining wall structure;

cutting and removing the first inorganic packaging layer and the organic light-emitting layer of the function additional area; and

an organic encapsulation layer and a second inorganic encapsulation layer are sequentially formed on the first inorganic encapsulation layer, wherein the organic encapsulation layer covers the normal display area and extends to the position of the retaining wall structure of the auxiliary area, and the second inorganic encapsulation layer covers the normal display area, the auxiliary area and the function addition area.

Technical Field

The invention relates to the technical field of display, in particular to a display panel capable of improving imaging of an under-screen camera, a display device and a display panel preparation method.

Background

With the continuous development of display technology, display panels with high screen ratio are more and more widely used. In order to achieve a larger screen ratio, a narrow bezel design of a mobile phone is implemented, and generally an attempt is made to reduce a bezel (border) area. Through the bending (pad bonding) technology, a part of fan-out (Fanout) wiring area of the screen, a drive IC (Flexible Printed Circuit), which is called FPC for short, are bent to the back of the screen together for bonding, so that the length of a lower frame area of the screen can be effectively reduced. The upper frame area is generally provided with a front camera, a photosensitive device and other camera components, in order to avoid the camera components from occupying space in the upper frame area, the area 101 corresponding to the camera components is generally provided with a 'bang screen' (shown in fig. 1A) or a 'water drop screen' (shown in fig. 1B) and other special-shaped screens, so that the reduction of the upper frame area is realized, and the screen occupation ratio is further improved. However, the technical difficulty of the special-shaped screen design is that special-shaped cutting is adopted, and the position of a special-shaped area is relatively fixed and can only be arranged at the edge of the screen.

In order to avoid the camera assembly occupying space in the upper frame area and further improve the screen occupation ratio, an O-CUT technology is developed. The O-CUT technology does not limit the specific position of the opening, the opening can be carried out at any position of the display area, and the non-area limitation of the camera assembly is realized. However, with this arrangement, light emitted by the light emitting device in the display panel may obliquely enter the opening region, resulting in light leakage and affecting the imaging quality. In addition, in the opening area corresponding to the camera assembly, the metal film layer in the flexible substrate and the thin film transistor layer, the cathode (cathode) film layer in the organic light emitting layer, the Polarizer (POL) and the like all have influence on the transmittance of ambient light, so that the light transmittance of the opening area is reduced, and the imaging quality is further influenced.

Therefore, how to block the influence of the light emitted by the light-emitting device on the camera assembly, effectively improve the transmittance of the ambient light above the camera assembly and improve the imaging quality is a technical problem which needs to be solved urgently in the current comprehensive screen technology development.

Disclosure of Invention

The present invention is directed to solve the problems of the prior art, and an object of the present invention is to provide a display panel, a display device, and a method for manufacturing the display panel, which can block the influence of light emitted by an organic light emitting layer on a camera assembly, effectively improve the transmittance of ambient light above the camera assembly, and improve the imaging quality.

To achieve the above object, the present invention provides a display panel including: at least one function attachment area, an auxiliary area disposed around the function attachment area, and a normal display area disposed around the auxiliary area; the display panel includes: a flexible substrate; the thin film transistor layer is arranged on one side of the flexible substrate and corresponds to the normal display area and the auxiliary area, and metal wiring of the thin film transistor layer surrounding the function additional area is arranged in the auxiliary area; the organic light-emitting layer is arranged on one side of the thin film transistor layer, which is far away from the flexible substrate, and corresponds to the normal display area and the auxiliary area; and the packaging layer is arranged on one side of the organic light-emitting layer, which is far away from the thin film transistor layer, and corresponds to the normal display area, the auxiliary area and the function additional area.

To achieve the above object, the present invention also provides a display device including: the display panel adopts the display panel provided by the invention; and at least one optical sensor, the optical sensor is set up in the function of the said display panel adds the area to correspond to the position.

In order to achieve the above object, the present invention further provides a method for manufacturing a display panel, including the steps of: providing a flexible substrate, wherein the flexible substrate comprises at least one function additional area, an auxiliary area arranged around the function additional area, and a normal display area arranged around the auxiliary area; preparing a thin film transistor layer on one side of the flexible substrate, wherein the thin film transistor layer corresponds to the normal display area and the auxiliary area, and a metal wire of the thin film transistor layer surrounding the function additional area is arranged in the auxiliary area; and preparing an organic light emitting layer on one side of the thin film transistor layer far away from the flexible substrate, and preparing a packaging layer on one side of the organic light emitting layer far away from the thin film transistor layer, wherein the organic light emitting layer corresponds to the normal display area and the auxiliary area, and the packaging layer corresponds to the normal display area, the auxiliary area and the function additional area.

The invention has the advantages that: the invention improves each component at the function additional area, improves the transmittance of the environment light at the function additional area, realizes good packaging property, prevents the function additional area from light leakage, improves the imaging quality of the camera component arranged at the function additional area, realizes the opening of any position of the display area to place the optical sensor, realizes the non-area limitation of the optical sensor, simplifies the manufacturing process and is beneficial to the mass production.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIGS. 1A-1B are schematic diagrams of a prior art full-screen configuration;

FIG. 2 is a schematic diagram of a layered structure of a display region of a display panel in the prior art;

FIG. 3 is a schematic diagram of a layer structure of a display region of a display panel according to an embodiment of the present invention;

FIG. 4 is a schematic plan view of a metal routing wire of the thin film transistor layer at the functional attachment area according to the present invention;

FIG. 5 is a cross-sectional view of a display device of the present invention;

FIG. 6 is a flow chart of a method for manufacturing a display panel according to the present invention;

fig. 7A-7F are process flow diagrams of an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The directional phrases used in this disclosure include, for example: up, down, left, right, front, rear, inner, outer, lateral, etc., are simply directions with reference to the drawings. The embodiments described below by referring to the drawings and directional terms used are exemplary only, are used for explaining the present invention, and are not construed as limiting the present invention.

Referring to fig. 2, a schematic diagram of a layered structure of a display area of a display panel in the prior art is shown. The display panel is an OLED touch display panel, and the film structure thereof includes a flexible substrate 21, and a thin film transistor layer 22, an organic light Emitting Layer (EL)23, an encapsulation layer (TFE)24, a touch layer (DOT)25 and an upper substrate (MOD)26 sequentially stacked on the flexible substrate 21.

In the display region, the flexible substrate 21 may include: a first flexible organic substrate (PI1)211, an inorganic substrate 212 disposed on the first flexible organic substrate 211, a second flexible organic substrate (PI2)213 disposed on the inorganic substrate 212; namely, a composite layer structure of a stacked structure is adopted. Further, the flexible substrate 21 further includes a water-oxygen barrier layer (M/B)214 and a Buffer layer (Buffer)215 sequentially disposed on the second flexible organic substrate 213.

In the display area, the thin-film transistor layer 22 includes: an active layer 221 disposed on the buffer layer 215 of the flexible substrate 21, a first gate insulating layer (GI1)222 disposed on the active layer 221, a first gate layer (GE1)223 disposed on the first gate insulating layer 222, a second gate insulating layer (GI2)224 disposed on the first gate layer 223 and the first gate insulating layer 222, a second gate layer (GE2)225 disposed on the second gate insulating layer 224, a dielectric Insulating Layer (ILD)226 disposed on the second gate layer 225 and the second gate insulating layer 224, a source/drain (S/D) layer 227 disposed on the dielectric insulating layer 226, and a Planarization Layer (PLN)228 disposed on the source/drain layer 227 and the dielectric insulating layer 226.

In the display region, the organic light emitting layer 23 includes: an anode 231 disposed on the planarization layer 228, a Pixel Defining Layer (PDL)232 disposed on the anode 231 and exposing the anode 231, a photoresist layer (PS) 233 disposed on the pixel defining layer 232, an Emitting Material Layer (EML)234 prepared in a region defined by the pixel defining layer 232 and corresponding to the anode 231, and a Cathode layer (Cathode)235 disposed on the emitting material layer 234. The organic light emitting Layer 23 further includes a Hole Transport Layer (HTL) covering the photoresist Layer 233 and the pixel defining Layer 232, an Electron Transport Layer (ETL) disposed on the light emitting material Layer 234, a Capping Layer (CPL) covering the cathode Layer 235, and a blocking Layer (LiF).

In the display region, the encapsulation layer 24 includes, sequentially stacked on the barrier layer 239: a first inorganic encapsulation layer 241, an organic encapsulation layer 242, and a second inorganic encapsulation layer 243. The first inorganic film 241 and the second inorganic encapsulation 243 may be prepared by using a Chemical Vapor Deposition (CVD) process for blocking water and oxygen. The organic film 242 may be prepared by an Inkjet Printing (IJP) process, and is used for buffering stress of the device during bending and folding.

In the display area, the touch layer 25 includes: a first insulating layer (insulator1)251 formed on the second inorganic encapsulation layer 243, a first touch Metal layer (Metal1)252 disposed on the first insulating layer 251, a second insulating layer (insulator2)253 disposed on the first touch Metal layer 252 and the first insulating layer 251, a second touch Metal layer (Metal2)254 disposed on the second insulating layer 253, and a third insulating layer (PAS)255 disposed on the second touch Metal layer 254 and the second insulating layer 253.

In the display region, the upper substrate 26 includes: a Polarizer (POL)261 and a cover plate (CG)263, wherein the polarizer 261 and the cover plate 263 are adhered by an optical adhesive (OCA)262 and then cover the touch layer 25, and the cover plate 263 is disposed on the outermost layer of the display panel.

As shown in fig. 2, in the display area, in an area (not shown) corresponding to an optical sensor (e.g., a camera module), the flexible substrate 21, each metal film layer (a gate layer, a source/drain layer, etc.) in the thin-film transistor layer 22, a cathode film layer in the organic light-emitting layer 23, a Polarizer (POL), etc. all have an influence on the transmittance of ambient light, and thus, the imaging quality is affected.

In the display panel provided by the invention, the components in the area corresponding to the optical sensor are improved, and the transmittance of ambient light is improved by digging a hole in the flexible substrate in the area and filling the hole with the transparent PI; the metal wiring of the thin film transistor layer in the area is wound, so that no metal film layer exists in the area, and the transmittance of ambient light is improved; the cathode film layer in the organic light-emitting layer in the area is removed (or removed together with the light-emitting material layer), the first inorganic packaging layer in the corresponding area is removed, and the second inorganic packaging layer is reserved, so that the transmittance of ambient light is improved, and meanwhile, the good packaging characteristic can be realized; furthermore, the polaroid in the area can be removed, and the transmittance of ambient light is further improved. Furthermore, the edge of the cutting channel in the area is made into a retaining wall structure by adopting a black light absorption material with light blocking property, so that light leakage in the area can be prevented. Through the improvement, the transmittance of the ambient light in the region corresponding to the optical sensor can be improved in all aspects, the light leakage of the region can be avoided, the imaging quality is improved, and therefore the opening is formed in any place of the display region to place the optical sensor, the non-regional limitation of the optical sensor is realized, the manufacturing process is simplified, and the mass production is facilitated.

Referring to fig. 3-4, fig. 3 is a schematic diagram of a layer structure of a display area of a display panel according to an embodiment of the invention, and fig. 4 is a schematic plan view of routing wires of a thin-film transistor layer at a functional additional area according to the invention.

As shown in fig. 3, the display panel 30 of the present embodiment includes: at least one function addition area 301, an auxiliary area 302 surrounding the function addition area 301, and a normal display area 303 surrounding the auxiliary area 302. Specifically, the display panel 30 includes: a flexible substrate 31, a thin film transistor layer 32, an organic light Emitting Layer (EL)33, and an encapsulation layer (TFE) 34.

Specifically, the thin-film transistor layer 32 is disposed on one side of the flexible substrate 31, and corresponds to the normal display area 303 and the auxiliary area 302; the auxiliary region 302 is provided with a metal trace surrounding the thin-film transistor layer 32 of the function addition region 301, that is, the function addition region 301 has no metal film layer, so that the transmittance of ambient light is improved. The organic light emitting layer 33 is disposed on a side of the thin-film transistor layer 32 away from the flexible substrate 31, and corresponds to the normal display area 303 and the auxiliary area 302; that is, the organic light emitting layer 33 is not disposed in the function addition region 301. The encapsulation layer 34 is disposed on a side of the organic light emitting layer 33 away from the thin-film transistor layer 32, and corresponds to the normal display area 303, the auxiliary area 302, and the function addition area 301; that is, the function addition region 301 is provided with the encapsulation layer 34. By removing the organic light emitting layer 33 in the function addition region 301 and retaining the encapsulation layer 34, the transmittance of ambient light is improved, and good encapsulation characteristics can be realized.

In a further embodiment, the flexible substrate 31 is a polyimide substrate 311 made of Polyimide (PI), and in the function addition region 301, the flexible substrate 31 is made of transparent polyimide. Specifically, the flexible substrate 31 may be entirely made of transparent polyimide; in the auxiliary area 302 and the normal display area 303, the material of the flexible substrate 31 may be yellow polyimide. Specifically, the flexible substrate 31 is prepared by using yellowish polyimide, etching is performed on a region of the flexible substrate 31 corresponding to the function addition region 301, a yellow polyimide film layer is removed, and the etched region is filled with transparent polyimide, so that the flexible substrate 31 is in a transparent state in the function addition region 301, and thus the transmittance of ambient light in the function addition region 301 is improved. The flexible substrate 31 may be a single-layer polyimide substrate 311, or a composite layer structure formed by stacking organic/inorganic/organic substrates, which is not limited in the present invention, as long as the flexible substrate 31 is made of transparent polyimide in the function adding region 301.

In a further embodiment, the flexible substrate 31 further includes a water-oxygen barrier (M/B)312 and a Buffer layer (Buffer)313 sequentially disposed on the polyimide substrate 311. The water-oxygen barrier layer 312 may be made of silicon oxide (SiOx) or silicon nitride (SiNx), and is used to block water and oxygen, so as to prevent water and oxygen from invading and damaging panel display components (such as circuits of thin film transistor layers and light-emitting materials of organic light-emitting layers) prepared on the flexible substrate 31, and improve the reliability of the display panel. The buffer layer 313 may be a silicon oxide (SiOx) layer or a silicon nitride (SiNx) layer, or a composite layer formed by stacking a silicon oxide layer and a silicon nitride layer.

In this embodiment, in the normal display region 303, the thin-film transistor layer 32 includes: an active layer 3201 disposed on the flexible substrate 31, a first gate insulating layer (GI1)3202 disposed on the active layer 3201, a first gate layer (GE1)3203 disposed on the first gate insulating layer 3202, a second gate insulating layer (GI2)3204 disposed on the first gate layer 3203 and the first gate insulating layer 3202, a second gate layer (GE2)3205 disposed on the second gate insulating layer 3204, a dielectric Insulating Layer (ILD)3206 disposed on the second gate layer 3205 and the second gate insulating layer 3204, a first source/drain layer (S/D1)3207 disposed on the dielectric insulating layer 3206, a polyolefin film (PV)3208 disposed on the first source/drain layer 3207 and the dielectric insulating layer 3206, a first planar layer (PLN1)3209 disposed on the polyolefin film 3208, a second source/drain layer (S32125) 590) disposed on the first planar layer 3209, a second planarization layer (PLN2)3211 disposed on the second source/drain layer 3210 and the first planarization layer 3209. At the auxiliary region 302, the metal traces of the thin-film transistor layer 32 bypass the function addition region 301 (as shown in fig. 4) in a winding manner, so as to improve the light transmittance of the function addition region 301. It should be noted that the metal traces of the thin-film transistor layer 32 may include data lines (data), power lines (VDD) or scan lines (Gate), etc. By designing the metal traces originally disposed through the functional addition region 301 to bypass the functional addition region 301 in the auxiliary region 302 in a winding manner (as shown in fig. 4), the functional addition region 301 has no metal film layer, and the transmittance of ambient light is improved.

Specifically, as shown in fig. 4, at the auxiliary region 302 (i.e., at a position where the normal display region 303 is close to the function addition region 301), all gate layer metal traces 421 (including scan lines) of the thin-film transistor layer 32 bypass the function addition region 301 in a routing manner, and all source/drain layer metal traces 422 (including data lines or power lines) of the thin-film transistor layer 32 bypass the function addition region 301 in a routing manner. For example, all the gate layer metal traces 421 are shown as extending from the left side of the auxiliary region 302 around the auxiliary region 302 to the lower side, and another portion extends from the right side of the auxiliary region 302 around the auxiliary region 302 to the lower side; all the metal traces 422 of the source/drain layer on the left side of the figure have a portion extending from the upper side of the auxiliary area 302 to the right of the auxiliary area 302 and extending to the right of the figure, and another portion extending from the upper side of the auxiliary area 302 to the right of the auxiliary area 302 and extending to the right of the figure.

In a further embodiment, the functional add-on zone 301 comprises a slit (slit)403 disposed adjacent to the auxiliary zone 302. A cutting position is reserved in the function addition region 301, and the notch 403 is provided, so that a crack (crack) can be prevented from extending to the auxiliary region 302 or the inside of the function addition region 301 during a cutting process.

Referring to fig. 3 again, in the present embodiment, in the normal display area 303, the organic light emitting layer 33 includes: an anode 331 disposed on the thin film transistor layer 32, a Pixel Defining Layer (PDL)332 disposed on the anode 331 and exposing the anode 331, a photoresist layer (PS) 333 disposed on the pixel defining layer 332, an Emitting Material Layer (EML)334 prepared in the region defined by the pixel defining layer 332 and corresponding to the anode 331, and a Cathode layer (Cathode)335 covering the photoresist layer 333, the pixel defining layer 332 and the emitting material layer 334. At the auxiliary region 302, the cathode layer 335 is disposed on the thin-film-transistor layer 32. At least the cathode layer 335 is removed in the functional addition region 301 to improve the light transmittance of the functional addition region 301. It should be noted that the display panel may be an OLED display panel, and accordingly, the light emitting material layer 334 is an OLED light emitting material, and the organic light emitting layer 33 further includes other components required for light emission, such as: the Hole Transport Layer (HTL), the Electron Transport Layer (ETL), the capping layer (CPL), and the blocking layer are not described herein again. The display panel may also be a quantum dot display panel, and the corresponding luminescent material layer 334 is made of a quantum dot luminescent material. Since the film layer of the organic light emitting layer 33 that affects light transmittance is mainly a metal film layer such as a cathode, the metal film layer of the organic light emitting layer 33 including the cathode layer 235 in the function addition region 301 may be removed by laser (laser) cutting, thereby improving light transmittance of the function addition region 301.

In a further embodiment, referring to fig. 3, two retaining wall structures (Dam)3021 are disposed on the thin-film transistor layer 32 corresponding to the auxiliary region 302 and around the function addition region 301, wherein the material of the retaining wall structures 3021 is a black light-absorbing material. It should be noted that the number of the retaining wall structures 3021 may be one or more, and the invention is not limited thereto. In the normal display region 303, the encapsulation layer 34 includes: a first inorganic encapsulation layer 341, an organic encapsulation layer 342, and a second inorganic encapsulation layer 343; wherein the first inorganic encapsulation layer 341 covers the normal display region 303 and the auxiliary region 302, and covers the retaining wall structure 3021; the organic encapsulation layer 342 covers the normal display region 303 and extends to the retaining wall structure 3021; the second inorganic encapsulation layer 343 covers the normal display area 303, the auxiliary area 302, and the function addition area 301. Specifically, in the function addition region 301, the second inorganic encapsulation layer 343 is directly formed on the flexible substrate 31. That is, after the manufacturing process of the organic light emitting layer 33, before the last inorganic encapsulation layer of the encapsulation layer 34 is deposited, the metal film layer of the organic light emitting layer 33 and the film layers of the encapsulation layer 34 in the function addition region 301 may be removed by laser cutting, and then an inorganic encapsulation layer (the second inorganic encapsulation layer 343 in this embodiment) is deposited, so that the light transmittance of the function addition region 301 may be improved, the encapsulation effect of the encapsulation layer 34 may be ensured, the risk of moisture invading the organic light emitting layer 33 or the flexible substrate 31 may be reduced, and the device lifetime may be effectively prolonged. The blocking wall structure 3021 made of black light absorbing material is used to block the organic encapsulating material of the organic encapsulating layer 342 from overflowing to the function adding region 301, and also can block light.

Specifically, the first inorganic film layer 341 and the second inorganic encapsulation layer 343 may be prepared by using a Chemical Vapor Deposition (CVD) process for blocking water and oxygen. The organic film layer 342 may be prepared by an Inkjet Printing (IJP) process, and is used for buffering stress of the device during bending and folding. In other embodiments, the encapsulation layer 34 may also include a plurality of overlapping organic and inorganic encapsulation layers.

In a further embodiment, the display panel may be an OLED touch display panel, and may further include a touch layer and an upper substrate disposed on the encapsulation layer 34, and the disposition of the touch layer and the upper substrate may be as shown in fig. 2, and is not described herein again. In a further embodiment, the polarizer of the upper substrate at the functional addition region 301 may be removed, so as to further improve the transmittance of the ambient light at the functional addition region 301.

The display panel that this embodiment provided improves to each subassembly of function additional area department, has improved the transmittance of the ambient light of function additional area department can realize fine encapsulation characteristic again, can also prevent function additional area light leak has improved the setting and is in the formation of image quality of the camera subassembly of function additional area department to can realize holing in the display area anywhere in order to place the optical sensor including camera subassembly, realize optical sensor's non-regional limitation retrencies the processing procedure, helps the volume production.

Based on the same inventive concept, the invention also provides a display device. Referring to fig. 5, a cross-sectional view of a display device according to the present invention is shown. The display device includes: a display panel 30, wherein the display panel 30 adopts the display panel 30 of the present invention; and at least one optical sensor 51, wherein the optical sensor 51 is arranged at the position corresponding to the function adding area 301 of the display panel 30.

Specifically, the flexible substrate 31 of the display panel 30 is made of transparent polyimide in the function addition region 301; the thin-film transistor layer 32 of the display panel 30 has no metal film layer in the function addition region 301; the organic light emitting layer 33 of the display panel 30 has no film layer structure in the function addition region 301; the encapsulation layer 34 of the display panel 30 is provided with only an inorganic encapsulation layer in the function addition region 301. The specific structure of the display panel 30 and the advantageous effects thereof can be described with reference to fig. 3-4, and are not described herein again.

In this embodiment, a PET substrate 59 made of a polyethylene terephthalate (PET) is further disposed below the flexible substrate 31, and the optical sensor 51 is disposed below the PET substrate 59 and corresponds to the function addition region 301. The optical sensor 51 may be one or more of a camera, an optical fingerprint sensor.

Based on the same inventive concept, the invention also provides a preparation method of the display panel. Referring to fig. 6 and fig. 7A to 7F together, wherein fig. 6 is a flowchart illustrating a method for manufacturing a display panel according to the present invention, and fig. 7A to 7F are process flowcharts illustrating an embodiment of the present invention.

As shown in fig. 6, the preparation method includes the following steps:

step S61: providing a flexible substrate, wherein the flexible substrate comprises at least one function additional area, an auxiliary area arranged around the function additional area, and a normal display area arranged around the auxiliary area; the flexible substrate is formed as shown in fig. 3 and 4. In a further embodiment, an area of the flexible substrate corresponding to the function addition area may be etched, and the etched area may be filled with transparent polyimide. And a hole is dug in the flexible substrate corresponding to the function addition area and is filled with transparent polyimide, so that the transmittance of the function addition area to the ambient light at the flexible substrate is improved.

Step S62: preparing a thin film transistor layer on one side of the flexible substrate, wherein the thin film transistor layer corresponds to the normal display area and the auxiliary area, and a metal wire of the thin film transistor layer surrounding the function additional area is arranged in the auxiliary area; the resulting thin-film transistor layer is described above with reference to FIGS. 3 and 4. The metal wiring of the thin film transistor layer at the position of the original function additional area is wound, so that the function additional area has no metal film layer, and the transmittance of ambient light of the function additional area at the thin film transistor layer is improved.

And step S63: an organic light emitting layer is formed on one side of the thin film transistor layer away from the flexible substrate, and an encapsulation layer is formed on one side of the organic light emitting layer away from the thin film transistor layer, wherein the organic light emitting layer corresponds to the normal display area and the auxiliary area, the encapsulation layer corresponds to the normal display area, the auxiliary area, and the function addition area, and the formed organic light emitting layer and the encapsulation layer can be referred to as shown in fig. 3. Through function additional area department gets rid of organic luminescent layer, and remains the packaging layer to can improve in the light transmissivity in function additional area, guarantee the packaging effect of packaging layer reduces the steam invasion organic luminescent layer or flexible substrate's risk can effectively improve the device life-span.

In a further embodiment, step S63 further includes the steps of:

1) preparing an organic light-emitting layer and at least one retaining wall structure on one side of the thin film transistor layer far away from the flexible substrate, and forming a first inorganic packaging layer on one side of the organic light-emitting layer far away from the thin film transistor layer, wherein the retaining wall structure corresponds to the auxiliary area and surrounds the function additional area, and the first inorganic packaging layer covers the normal display area and the auxiliary area and covers the retaining wall structure; the resulting structure is shown in fig. 7A-7B (the retaining wall structure is not shown in the figures), where fig. 7A is a cross-sectional view of the resulting structure and fig. 7B is a top view of the resulting structure. In a top view, the organic light emitting layer 33 is shielded by the first inorganic encapsulation layer 341, and thus the red/green/blue emitting material layers 334R, 334G and 334B of the organic light emitting layer 33 are illustrated by dotted lines. The material of the retaining wall structure can be black light absorption material. The blocking wall structure is made of black light absorption materials with light blocking characteristics, which correspond to the auxiliary area and surround the function additional area, so that light leakage of the function additional area can be prevented, and organic packaging materials in a subsequently prepared organic packaging layer are prevented from overflowing to the function additional area.

2) And cutting and removing the first inorganic packaging layer and the organic light-emitting layer of the function additional area. Wherein the functional addition region may be cut using laser, as shown in fig. 7C; the cross-sectional view of the structure formed after cutting is shown in fig. 7D, and fig. 7E is a top view of the structure formed after cutting. And

3) sequentially forming an organic packaging layer and a second inorganic packaging layer on the first inorganic packaging layer, wherein the organic packaging layer covers the normal display area and extends to the position of the retaining wall structure of the auxiliary area, and the second inorganic packaging layer covers the normal display area, the auxiliary area and the function additional area; the cross-sectional view of the structure formed after encapsulation is shown in fig. 7F, wherein the organic encapsulation layer and the retaining wall structure are not shown in the figure.

The preparation method of the display panel is improved aiming at each component at the function additional area, improves the transmittance of ambient light at the function additional area, realizes good packaging characteristics, can prevent the function additional area from light leakage, improves the imaging quality of the camera component arranged at the function additional area, realizes the opening of any position of the display area to place the optical sensor comprising the camera component, realizes the non-area limitation of the optical sensor, simplifies the manufacturing process, and is beneficial to mass production.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.