阅读说明：本技术 一种吸塑方法 (Plastic suction method ) 是由 朱晖 杨熙黎 于 2019-09-09 设计创作，主要内容包括：本发明提供了一种吸塑方法,所述方法包括：对位于基材表面的上胶区域上胶,其中,所述基材的表面包括相邻设置的上胶区域和非上胶区域；在所述基材的非上胶区域处安装成型模具；将吸塑膜吸塑于所述基材的表面,使得所述吸塑膜分别与所述上胶区域和成型模具的表面贴合；将所述成型模具与所述基材分离。本发明所提供的一种吸塑方法,可以简化加工具有特色外观的生活用品的工序、提高生产效率。(The invention provides a plastic suction method, which comprises the following steps: sizing a sized region on the surface of the substrate, wherein the surface of the substrate comprises a sized region and a non-sized region which are adjacently arranged; installing a forming die at the non-gluing area of the substrate; carrying out plastic suction on the surface of the base material to enable the plastic suction film to be respectively attached to the surface of the gluing area and the surface of the forming mold; separating the molding die from the substrate. The plastic suction method provided by the invention can simplify the process of processing the living goods with special appearance and improve the production efficiency.)

1. A method of blister molding, comprising:

sizing a sized region on the surface of the substrate, wherein the surface of the substrate comprises a sized region and a non-sized region which are adjacently arranged;

installing a forming die at the non-gluing area of the substrate;

carrying out plastic suction on the surface of the base material to enable the plastic suction film to be respectively attached to the surface of the gluing area and the surface of the forming mold;

separating the molding die from the substrate.

2. The method according to claim 1, wherein the gumming region comprises at least two spaced gumming sub-regions, and the non-gumming region is formed between any two adjacent gumming regions;

the installing a forming mold at the non-gluing area of the substrate comprises:

and the forming die is arranged between two adjacent upper glue subareas.

3. The method of claim 2, wherein said sizing a sized region on the surface of the substrate comprises:

installing a gluing mold on the surface of the base material, wherein the gluing mold comprises a plurality of baffles which are arranged at intervals respectively, and the baffles are attached to the surface of the base material respectively;

forming the gluing area on the area of the surface of the substrate which is not covered by the gluing mold, and spraying and sucking plastic on the gluing area;

separating the gumming mold from the substrate.

4. The method of claim 2, wherein the sizing is applied to a size area on the surface of the substrate, wherein the size area comprises at least two spaced apart size sub-areas, and wherein the method further comprises:

and polishing the surface of the substrate to be flat and smooth, and removing dust on the surface of the substrate.

5. The method of claim 2, wherein after the blister film is applied to the surface of the substrate such that the blister film is attached to the surface of the sizing region and the surface of the forming mold, the method further comprises:

and cooling and forming the plastic uptake film.

6. The method of claim 2, wherein after separating the forming mold from the substrate, the method further comprises:

and cutting off the part of the edge of the plastic uptake film which is not bonded with the gumming area.

7. The method of claim 2, wherein the sizing is applied to a size area on the surface of the substrate, wherein the size area comprises at least two spaced apart size sub-areas, and wherein the method further comprises:

mounting the substrate on a fixed structure;

after separating the forming mold from the substrate, the method further comprises:

separating the substrate from the fixed structure.

8. The method according to claim 2, wherein the substrate is in the shape of an arc plate or a rectangular plate, the upper glue area is in the shape of a strip, two ends of the upper glue area respectively extend to the edge of the substrate, and at least two upper glue areas are respectively arranged at equal intervals;

the forming die is in a strip plate shape, the forming die is arranged in parallel with the upper glue area, and two ends of the forming die respectively extend to the edge of the base material;

one forming die is arranged between any two adjacent upper glue sub-regions;

the separating the molding die from the substrate includes:

and drawing the forming die outwards along the length direction of the upper glue sub-area.

9. The method according to claim 2, wherein a mounting hole for mounting a forming die is arranged between two adjacent upper glue sub-regions, and the forming die is mounted in the mounting hole;

one forming die is arranged between any two adjacent upper glue sub-regions;

the separating the molding die from the substrate includes:

and drawing the molding die away from the mounting hole along the mounting hole in the direction of deviating from one side of the plastic film.

10. The method of claim 2, wherein an edge of the glue area is aligned with an edge of the substrate.

Technical Field

The invention relates to the field of plastic uptake processes, in particular to a plastic uptake method.

Background

The existing plastic suction process is to brush glue on the surface of a base material and adsorb a layer of film, and the process can only adsorb the film on the surface of the base material, namely, a layer of film is pasted on the surface of the base material, so that the effect of changing the texture of the surface of the base material is realized.

With the improvement of living standards of people, people pursue beauty of living goods more and more, and in order to process living goods with special appearance, the living goods are generally processed and manufactured by using special dies through the working procedures of stripping, opening the die, molding, demoulding and the like.

Disclosure of Invention

The embodiment of the invention provides a plastic suction method which can simplify the process of processing articles for daily use with special appearance and improve the production efficiency.

In order to solve the technical problem, an embodiment of the present invention provides a blister method, including:

sizing a sized region on the surface of the substrate, wherein the surface of the substrate comprises a sized region and a non-sized region which are adjacently arranged;

installing a forming die at the non-gluing area of the substrate;

carrying out plastic suction on the surface of the base material to enable the plastic suction film to be respectively attached to the surface of the gluing area and the surface of the forming mold;

separating the molding die from the substrate.

Optionally, the gluing area comprises at least two gluing sub-areas arranged at intervals, and the non-gluing area is formed between any two adjacent gluing areas;

the installing a forming mold at the non-gluing area of the substrate comprises:

and the forming die is arranged between two adjacent upper glue subareas.

Optionally, said sizing a sized region located on the surface of the substrate, comprising:

installing a gluing mold on the surface of the base material, wherein the gluing mold comprises a plurality of baffles which are arranged at intervals respectively, and the baffles are attached to the surface of the base material respectively;

forming the gluing area on the area of the surface of the substrate which is not covered by the gluing mold, and spraying and sucking plastic on the gluing area;

separating the gumming mold from the substrate.

Optionally, before the sizing region on the surface of the substrate is sized, the method further comprises:

and polishing the surface of the substrate to be flat and smooth, and removing dust on the surface of the substrate.

Optionally, after the plastic film is blister-molded on the surface of the substrate, so that the plastic film is respectively attached to the gluing area and the surface of the forming mold, the method further includes:

and cooling and forming the plastic uptake film.

Optionally, after separating the forming mold from the substrate, the method further comprises:

and cutting off the part of the edge of the plastic uptake film which is not bonded with the gumming area.

Optionally, before the sizing region on the surface of the substrate is sized, the method further comprises:

mounting the substrate on a fixed structure;

after separating the forming mold from the substrate, the method further comprises:

separating the substrate from the fixed structure.

Optionally, the substrate is in an arc plate shape or a rectangular plate shape, the upper glue sub-region is in a strip shape, two ends of the upper glue sub-region respectively extend to the edge of the substrate, and at least two upper glue sub-regions are respectively arranged at equal intervals;

the forming die is in a strip plate shape, the forming die is arranged in parallel with the upper glue area, and two ends of the forming die respectively extend to the edge of the base material;

one forming die is arranged between any two adjacent upper glue sub-regions;

the separating the molding die from the substrate includes:

and drawing the forming die outwards along the length direction of the upper glue sub-area.

Optionally, an installation hole for installing a forming die is formed between two adjacent upper glue sub-regions, and the forming die is installed in the installation hole;

one forming die is arranged between any two adjacent upper glue sub-regions;

the separating the molding die from the substrate includes:

and drawing the molding die away from the mounting hole along the mounting hole in the direction of deviating from one side of the plastic film.

Optionally, an edge of the glue area is aligned with an edge of the substrate.

Compared with the prior art, the plastic suction method provided by the embodiment of the invention at least has the following beneficial effects:

when the living goods with the special appearance are required to be processed, the forming die with the corresponding shape is arranged in the non-gluing area of the base material, then the plastic suction film is sucked on the surface of the base material, the plastic suction film is bonded with the gluing area on the surface of the base material, the plastic suction film covered on the surface of the forming die forms the appearance same as that of the forming die, and then the forming die is separated from the base material, so that the living goods with the special appearance can be processed. The forming mold is arranged in the non-gluing area of the base material, so that the forming mold cannot be adhered to the base material, and the forming mold is separated from the base material after the plastic suction process is finished. By adopting the processing mode, the processing procedure of processing the living goods with special appearance is simplified, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a flow chart of a blister method according to an embodiment of the present invention;

FIG. 2 is a flow chart of a sizing method according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram illustrating a process of installing a gluing mold when a bookshelf separator is manufactured by the method of the present invention;

FIG. 4 is a partially enlarged view of a gluing mold when the bookshelf partition is processed by the method provided by the invention;

FIG. 5 is a schematic structural diagram illustrating a process of installing a first forming mold when the bookshelf separator is manufactured by the method of the present invention;

FIG. 6 is an enlarged view of a portion of the first substrate after glue is applied when the method of the present invention is used to manufacture a bookshelf separator;

FIG. 7 is a schematic structural diagram of a plastic uptake process when the bookshelf partition is processed by the method provided by the invention;

FIG. 8 is a partially enlarged view of a junction between a first forming mold and a first base material after a first mold is installed when the bookshelf partition is manufactured by the method of the present invention;

FIG. 9 is a schematic structural view illustrating a process of removing the first forming mold when the bookshelf separator is manufactured by the method of the present invention;

FIG. 10 is a schematic structural diagram of a bookshelf separator after the bookshelf separator is processed by the method of the invention;

FIG. 11 is a schematic structural view illustrating a process of installing a second molding die when the gas mold lamp cover is manufactured by the method of the present invention;

FIG. 12 is a schematic structural view of a blister process when the gas-molded lampshade is processed by the method of the invention;

fig. 13 is a schematic structural view of a process of removing the second molding die when the gas mold lamp cover is processed by the method of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The plastic suction method provided by the invention can be applied to processing various articles for daily use, household consumables, experimental appliances and the like, such as lamps, bookshelf separators, various vessels and the like.

Referring to fig. 1, a blister method provided in the embodiment of the present invention includes the following steps:

101, sizing a sizing area on the surface of a substrate, wherein the surface of the substrate comprises a sizing area and a non-sizing area which are adjacently arranged;

the base material may be a fiber material, a plastic material, a wood material, etc., and the shape of the base material may be a plate shape, an arc plate shape, a plate shape with a through hole in the middle, a cylinder shape, etc., wherein the material and the shape of the base material may be determined according to the specific object to be processed, which is not limited. In addition, the gumming area can be formed by one gumming area, and can also be formed by a plurality of strip-shaped gumming sub-areas which are arranged at equal intervals, when the gumming area is formed by a plurality of strip-shaped gumming sub-areas which are arranged at equal intervals, the non-gumming area is formed by the area between any two adjacent gumming sub-areas; the gluing area can also be in a rectangular ring shape, wherein a rectangular space inside the rectangular ring shape forms the non-gluing area; the glue area can also be formed by two strip-shaped glue sub-areas arranged in parallel, and the specific shape of the glue area can be determined according to the specific article to be processed, and is not limited to this. The gluing mode can adopt a glue brush to brush the gluing area, or adopt a spraying mode and the like. The glue used in the gluing step can be common suction plastic, vacuum suction plastic and the like.

102, mounting a forming mold at a non-gluing area of the base material;

wherein, the forming die can be a rectangular plate body, a wedge-shaped plate body or a hemisphere and the like. The specific installation mode of installing the forming die in the non-gluing area can be that the forming die is directly placed on the surface of the base material and is positioned at the non-gluing area; or embedded in the mounting hole on the surface of the substrate and located at the non-gluing area, which is not limited.

Step 103, carrying out vacuum forming on the surface of the base material to enable the vacuum forming film to be respectively attached to the surface of the gluing area and the surface of the forming mold;

wherein, the shape of plastic uptake membrane can be the same with the surface shape of substrate, and the area of plastic uptake membrane can be greater than the area on the surface of substrate, so, can make things convenient for the plastic uptake membrane can cover completely on the surface of substrate, improves the aesthetic property of the product after the plastic uptake. The specific plastic uptake mode of plastic uptake of the plastic uptake film on the surface of the substrate can be as follows: and (4) carrying out vacuum forming on the surface of the base material by adopting a vacuum forming machine through a hot-pressing vacuum forming mode. Specifically, in the plastic suction process, the plastic suction machine heats the plastic suction film firstly to soften the plastic suction film, then applies pressure to the surface of the softened plastic suction film to enable the plastic suction film to be respectively attached to the surface of the gluing area and the surface of the forming mold, and when the plastic suction film is attached to the gluing area, the plastic suction film and the forming mold are bonded together in the gluing area, so that the base material and the plastic suction film are relatively and fixedly bonded, and a product required to be processed is formed together.

And 104, separating the forming mold from the base material.

The specific way of separating the forming mold from the substrate corresponds to the way of mounting the forming mold on the surface of the substrate, for example, the forming mold is inserted between two upper glue areas arranged at intervals on the surface of the substrate from the side of the substrate, and when separating, the forming mold only needs to be pulled away towards the outer side of the substrate along the length direction of the upper glue areas. For another example, the forming mold extends into the space between two upper glue sub-regions arranged at intervals along the hole site on the surface of the substrate, so that during separation, the forming mold is only required to be pulled away from the hole site along the direction of the hole site and the side departing from the plastic-absorbing film. In the present embodiment, the specific manner of separating the molding die from the base material is not limited.

In the embodiment of the invention, when the living goods with the special appearance are required to be processed, the forming mold with the corresponding shape is only required to be arranged in the non-gluing area of the base material, then the plastic suction film is sucked on the surface of the base material, the plastic suction film is bonded with the gluing area on the surface of the base material, the plastic suction film covered on the surface of the forming mold forms the appearance same as that of the forming mold, and then the forming mold is separated from the base material, so that the living goods with the special appearance can be processed. The forming mold is arranged in the non-gluing area of the base material, so that the forming mold cannot be adhered to the base material, and the forming mold is separated from the base material after the plastic suction process is finished. By adopting the processing mode, the processing procedure of processing the living goods with special appearance is simplified, and the production efficiency is improved.

Preferably, in this embodiment, the glue area includes at least two glue sub-areas arranged at intervals, and the non-glue area is formed between any two adjacent glue sub-areas; the installing a forming mold at the non-gluing area of the substrate comprises: and the forming die is arranged between two adjacent upper glue subareas.

Wherein, two adjacent rubberizing subregions refer to: any two adjacent glue areas in the glue area are not adjacent to each other, but the two glue areas are in contact with each other, and the two glue areas are limited to have the smallest distance, and no other glue areas exist between the two glue areas. The specific installation mode that the forming die is installed between two adjacent upper glue subareas can be that the forming die is directly placed on the surface of the base material and is positioned between two adjacent upper glue subareas; or embedded in the mounting hole site on the surface of the substrate and located between two adjacent upper glue sub-regions, which is not limited.

Alternatively, referring to fig. 2, the step of applying glue to the glue area on the surface of the substrate may comprise the following steps:

step 1011, mounting a gluing mold on the surface of the substrate, wherein the gluing mold comprises a plurality of baffles which are arranged at intervals respectively, and the baffles are respectively attached to the surface of the substrate;

in order to facilitate understanding, the structure of the gluing mold is explained by taking the substrate in a rectangular plate shape as an example, in this case, the gluing mold can be set in a rectangular frame shape, the shape and size of the outer frame of the gluing mold can be the same as the shape of the substrate, a plurality of baffles which are respectively arranged at intervals can be arranged in the rectangular frame at equal intervals, and two ends of each baffle can be respectively inserted into the inner walls of two opposite frames of the rectangular frame, so that the connection of the outer frames of the baffles can be realized. When the sizing die is specifically installed, the sizing die can be directly placed on one surface of the substrate, and the outer frames of the sizing die are respectively aligned with the edges of the substrate. It should be understood that the illustration is only for convenience of understanding the specific structure of the sizing die, and in practical applications, the specific shape of the sizing die and the specific lengths of the plurality of baffles may be set according to the shape of the substrate, for example, the cross section of the substrate is circular, the shape of the outer frame of the sizing die may be set to be circular, and baffles with different lengths may be embedded in the sizing die, which is not limited in this respect.

Step 1012, forming a gluing area on the area of the surface of the base material which is not shielded by the gluing mold, and spraying and sucking plastic on the gluing area;

in the above steps, when the gluing mold is installed on the surface of the substrate, the plurality of baffles of the gluing mold will adhere to the surface of the substrate to shield a partial area of the surface of the substrate, and since the plurality of baffles are arranged at intervals, an area which is not shielded by the baffles is necessarily formed between two adjacent baffles, the substrate at the area which is not shielded is in an exposed state, and the area which is not shielded can be glued by a gluing tool (such as a glue brush). Because, the brush gluey mould includes the baffle that a plurality of interval set up respectively, consequently, the region that the surface of substrate is not sheltered from by the rubberizing mould is: at least two strip-shaped areas which are arranged at intervals. The gluing area is formed in the area, which is not covered by the gluing mold, of the surface of the substrate, so that the surface of the substrate can be conveniently glued, and because when plastic is sucked by spraying the gluing area, only the gluing area on the surface of the substrate is in a naked state, and other areas are covered by the gluing mold, the plastic is not sucked to be sprayed to the area, except the gluing area, of the surface of the substrate, so that the plastic sucking glue can be uniformly sprayed to the gluing area, and the gluing efficiency can be improved. Preferably, the suction plastic can be vacuum suction plastic.

Step 1013, separating the sizing die from the substrate.

The specific way of separating the sizing die from the substrate corresponds to the way of mounting the sizing die on the substrate, for example, the sizing die is directly placed on the surface of the substrate, and the sizing die is directly taken down when the sizing die is separated from the substrate; for another example, when the sizing die is bolted to the substrate, the bolts between the sizing die and the substrate are removed before the sizing die is removed. In this embodiment, the specific manner of separating the gumming mold from the substrate is not limited.

Specifically, in the embodiment, by providing the gluing mold, when the substrate is glued, the gluing mold shields the area not requiring gluing, and only exposes the gluing area to the outside, so that plastic suction and spraying to the area of the surface of the substrate except the gluing area can be avoided, and the gluing efficiency and the gluing uniformity can be improved.

Optionally, before the sizing region on the surface of the substrate is sized, wherein the sizing region comprises at least two spaced-apart sizing sub-regions, the method further comprises: and polishing the surface of the substrate to be flat and smooth, and removing dust on the surface of the substrate.

Specifically, before gluing, the surface of the base material is polished to be flat and smooth, and dust on the surface of the base material is removed, so that the plastic uptake glue can be stably bonded on the surface of the base material after gluing, and the bonding stability between the plastic uptake film and the base material can be ensured after the plastic uptake step is completed.

Optionally, after the plastic film is attached to the surface of the substrate so that the plastic film is attached to the gluing area and the surface of the forming mold, the method further includes: and cooling and forming the plastic uptake film.

Specifically, after the blister step is completed, the blister film may be cooled and formed by standing, or may be cooled and formed by air cooling, water cooling, or the like. After the plastic film is cooled and formed, the appearance of the object to be processed is basically formed, and the forming mold can be conveniently taken out after the plastic film is cooled and formed.

Optionally, after separating the forming mold from the substrate, the method further comprises: and cutting off the part of the edge of the plastic uptake film which is not bonded with the gumming area. Thus, the excess material of the object to be processed can be removed, and the integral aesthetic property of the processed object is improved.

Optionally, step 101, a sizing area on the surface of the substrate is sized, wherein before the sizing area includes at least two spaced sizing sub-areas, the method further includes:

mounting a substrate on a fixed structure;

after separating the forming mold from the substrate, the method further comprises:

separating the substrate from the fixed structure.

Specifically, fixed knot constructs can be for anchor clamps or the surface base that is equipped with the fixed position, through before the rubberizing (also before processing), is fixed in fixed knot with the substrate and constructs on, after forming die and substrate separation (also after processing is accomplished) with substrate and fixed knot, so, can guarantee whole plastic uptake process, all go on fixed knot constructs, prevent to take place to remove at plastic uptake in-process substrate to the effect of plastic uptake has been improved.

Optionally, the substrate is arc-shaped plate-shaped or rectangular plate-shaped, the upper glue sub-region is strip-shaped, two ends of the upper glue sub-region extend to the edge of the substrate respectively, and at least two upper glue sub-regions are arranged at equal intervals respectively;

the forming die is in a strip plate shape, the forming die is arranged in parallel with the upper glue area, and two ends of the forming die respectively extend to the edge of the base material;

a forming die is arranged between any two adjacent upper glue subareas;

separating the forming mold from the substrate, comprising:

and (4) outwards drawing the forming die along the length direction of the upper glue subarea.

Specifically, the upper glue area is arranged to be in a strip shape, the forming mold is arranged to be in a strip plate shape, the forming mold and the upper glue area are arranged in parallel, and two ends of the forming mold extend to the edge of the base material respectively, so that the forming mold can be conveniently pulled away from the outer side of the base material along the length direction of the upper glue area after the plastic suction is completed, and the processing efficiency is improved.

In order to facilitate understanding of the plastic suction method provided in the embodiment of the present invention, the following detailed description of the plastic suction method provided in the present invention is provided in a specific embodiment of the present invention.

Referring to fig. 3-10, a specific embodiment of processing a bookshelf separator with a distinctive appearance by using the plastic uptake method provided by the invention specifically includes the following steps:

referring to fig. 3, the first substrate 2 is fixedly mounted in the position corresponding to the upper surface of the fixing structure 3, wherein the position corresponding to the cross-sectional shape of the first substrate 2 is disposed on the upper surface of the fixing structure 3, so that the first substrate 2 is embedded in the position corresponding to the upper surface of the fixing structure 3, thereby preventing the first substrate 2 from moving during the plastic suction process, and further ensuring the plastic suction effect. The first substrate 2 is made of fiberboard, and the first plastic absorption film 5 is made of a PVC film. It should be understood that the first substrate 2, the first molding die 4, and the first suction film 5 mentioned in the present embodiment correspond to the substrate, the molding die, and the first suction film 5 mentioned above, respectively, and the first is merely for convenience of distinction and has no other special meaning. The method specifically comprises the following steps:

referring to fig. 3, a sizing die 1 is disposed on the upper surface of the first substrate 2, and each side of the sizing die 1 is aligned with each side of the first substrate 2, wherein the cross-sectional shape of the sizing die 1 is the same as the cross-sectional shape of the first substrate 2. The gluing mold 1 comprises a rectangular frame and a plurality of baffles arranged in the rectangular frame, the baffles arranged at intervals respectively are arranged in the rectangular frame at equal intervals, and the two ends of each baffle can be respectively inserted into the inner walls of two opposite frames of the rectangular frame, so that the connection of the outer frames of the baffles can be realized. Fig. 4 is a partially enlarged view of the sizing die 1.

Referring to fig. 5, a vacuum plastic is sprayed on the glued area of the first substrate 2, and referring to fig. 6, a partial enlarged view of the surface of the glued first substrate 2 is shown.

Referring to fig. 5, the first forming mold 4 is placed between two adjacent upper molding sub-regions, wherein in the present embodiment, since the first substrate 2 is arc-shaped and arched upward, the first forming mold 4 is set to be wedge-shaped plate-shaped, so as to facilitate the first forming mold 4 to be pulled away from the surface of the first substrate 2 after the plastic suction is completed, in this embodiment, two first forming molds 4 which are oppositely arranged are disposed between any two adjacent upper molding sub-regions, and the two first forming molds 4 which are oppositely arranged are opposite to each other at one end with a smaller cross section, so that the two first forming molds 4 which are oppositely arranged can be conveniently pulled away from two sides of the first substrate 2 respectively. In addition, in order to facilitate the plurality of first molding dies 4 on the same side to be synchronously pulled away from the surface of the first base material 2, the outer ends of the first molding dies 4 on the same side are connected through a plate, so that all the first molding dies 4 on the same side form an integrated structure, and the installation and pulling away efficiency of the first molding dies 4 is further improved. For convenience of description, all the first molding dies 4 located on the same side are defined as a molding die set hereinafter as a unitary structure.

Fig. 7 is a schematic structural diagram of the first molding die 4 disposed on the surface of the first substrate 2, wherein fig. 8 is a partially enlarged view of a joint of the first molding die 4 and the first substrate 2. Referring to fig. 7, the first plastic-absorbing film 5 is placed on the upper surface of the first forming mold 4, and then the first plastic-absorbing film 5 is plastic-absorbed on the surface of the first substrate 2 by a plastic-absorbing machine in a hot-pressing plastic-absorbing manner, so that the first plastic-absorbing film 5 is respectively attached to the gluing area and the surface of the first forming mold 4. The plastic suction time is 2-5 minutes, the plastic suction time is relatively short, and compared with the existing processing mode, the processing efficiency of the daily necessities with specific appearances can be greatly improved.

Referring to fig. 9, after the plastic suction is completed, the two molding modules on the two sides of the substrate are respectively pulled away from the outer side of the substrate along the length direction of the upper glue area. Fig. 10 is a schematic structural view of a processed bookshelf separator, in which the lower end of the bookshelf separator has an arc shape, and the upper end of the bookshelf separator has a plurality of small partitions for dividing books.

Optionally, an installation hole for installing a forming die is formed between two adjacent upper glue subareas, and the forming die is installed in the installation hole;

a forming die is arranged between any two adjacent upper glue subareas;

separating the forming mold from the substrate, comprising:

and drawing the molding die away from the mounting hole along the mounting hole in the direction of one side departing from the plastic absorption film.

In particular, the surface of the base material is provided with the mounting hole, so that the cover-shaped living goods can be processed, and the mounting hole can be used for conveniently drawing the forming mold away from the base material after the plastic suction is finished.

In order to further facilitate the understanding of the embodiments of the present invention, the present invention describes the plastic uptake method provided by the present invention with another specific embodiment.

Referring to fig. 11-13, another embodiment of the present invention is shown for manufacturing a gas-molded lampshade by using the plastic suction method. It should be understood that the second substrate, the second forming mold and the second blister film mentioned in the present embodiment correspond to the substrate, the forming mold and the second blister film mentioned above, respectively, and the second is only for convenience of distinction and has no other special meaning. In this embodiment, the second plastic film is a PVC film. The method specifically comprises the following steps:

referring to fig. 11, the second molding die 7 is inserted into the mounting hole on the surface of the second substrate 6, wherein the cross-sectional shape of the mounting hole on the surface of the second substrate 6 is the same as the cross-sectional shape of the second molding die 7 at one end of the second molding die 7. The other end of the second forming mold 7 is arc-shaped and protruded out of the surface of the second substrate 6, specifically referring to fig. 12, and then the gluing area of the second substrate 6 is glued, wherein as shown in fig. 2, the gluing area of the surface of the second substrate 6 is the glued area, and the glue can be applied to the end surface of the second substrate 6 at one end of the second forming mold 7 by means of glue brush gluing, wherein the surface of the second forming mold 7 is not glued. Please further refer to fig. 12, wherein the shaded area is the glued area.

Referring to fig. 12, the second plastic film 8 is covered on the surface of the second substrate 6, wherein the second plastic film 8 completely covers the gluing area of the second substrate 6 and the convex portion of the second forming mold 7, and then the second plastic film 8 is formed on the surface of the second substrate 6 by a plastic suction machine in a hot-pressing plastic suction manner, so that the second plastic film 8 is respectively attached to the gluing area and the convex portion of the second forming mold 7. Please refer to fig. 13, which is a schematic structural diagram after the blister.

Referring further to fig. 13, after the plastic suction is completed, the second molding die 7 is drawn out from the mounting hole in a direction away from the second plastic suction film 8. Thereby obtain the gas mould lamp shade, splice through processing two the same gas mould lamp shades, can accomplish the processing of the lamp shade of gas mould lamp. With the lamp shade of adopting circular mould processing gas mode lamp among the prior art, adopt the method that this application embodiment provided, can improve the machining efficiency of the lamps and lanterns of gas mode lamp.

Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion.

The foregoing is a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should be considered as the protection scope of the present invention.