阅读说明：本技术 一种红外传感器的红外滤光片与管帽的封装方法 (Packaging method for infrared filter and tube cap of infrared sensor ) 是由 吴华民 刘财伟 于 2019-09-23 设计创作，主要内容包括：本发明公开了一种红外传感器的红外滤光片与管帽的封装方法,涉及红外传感器技术领域。该红外传感器的红外滤光片与管帽的封装方法,其特征在于：包括如下步骤：S1、生产加工管帽；S2、生产加工滤光片；S3、安装滤光片到管帽的窗口位置。该红外滤光片与管帽的封装方法,通过在滤光片与管帽接触中增加导电性能良好的电气连接介质,增加导电性能优良的导电通路,使得滤光片的半导体基材或镀膜层中的可导电膜层与金属管帽之间构成一个导电性能优良的电气连接路径,以提高滤光片(具体指滤光片的半导体基材或镀膜层中的可导电膜层)与金属管帽的电气连接导电性能以及电气连接导电性能的一致性。(The invention discloses a packaging method of an infrared filter and a tube cap of an infrared sensor, and relates to the technical field of infrared sensors. The packaging method of the infrared filter and the tube cap of the infrared sensor is characterized in that: the method comprises the following steps: s1, producing and processing a pipe cap; s2, producing and processing the optical filter; and S3, mounting the optical filter to the window position of the tube cap. According to the packaging method of the infrared filter and the tube cap, the electric connection medium with good conductivity is added in the contact of the filter and the tube cap, and the conductive path with excellent conductivity is added, so that an electric connection path with excellent conductivity is formed between the semiconductor substrate or the conductive film layer in the film coating layer of the filter and the metal tube cap, and the consistency of the electric connection conductivity and the electric connection conductivity of the filter (specifically the semiconductor substrate or the conductive film layer in the film coating layer of the filter) and the metal tube cap is improved.)

1. A packaging method of an infrared filter and a tube cap of an infrared sensor is characterized in that: the method comprises the following steps:

s1, producing and processing a pipe cap;

s2, producing and processing the optical filter;

s3, mounting the optical filter to the window position of the tube cap;

s4, connecting the optical filter and the tube cap by using an adhesive or conductive glue with conductive performance;

s5, fixing the filter and the cap by using potting adhesive.

2. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S1, a rough surface is formed at the portion of the cap where the cap contacts the filter when the cap is machined or selected.

3. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S1, a conductive layer with excellent conductivity is deposited on the cap portion where the cap contacts the filter by vacuum vapor deposition or chemical plating.

4. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S2, a metal conductive layer is formed on the filter in contact with the metal cap by vacuum pvd, and electrically connected to the semiconductor substrate of the filter or the conductive film in the optical coating of the filter, and then encapsulated with a common potting compound after being mounted in the window of the cap to enhance the mechanical properties and the hermeticity of the semi-finished product of the cap.

5. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S2, a metal conductive layer is formed on the filter substrate or the conductive film layer in the optical filter optical film layer where the filter contacts the metal cap by using a chemical vapor deposition method, and the conductive layer is electrically connected to the semiconductor substrate of the filter or the conductive film layer in the optical filter optical film layer, and then packaged in a common can sealant after being assembled in the cap window to enhance the mechanical properties and the air tightness of the cap semi-finished product.

6. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S2, a metal conductive layer is formed on the filter substrate or the conductive film layer in the optical filter optical coating layer where the optical filter contacts the metal cap by using a mechanical spraying or coating method, and the conductive layer is electrically connected to the semiconductor substrate of the optical filter or the conductive film layer in the optical filter optical coating layer, and then the semiconductor substrate or the conductive film layer is packaged in a common can after being assembled in the cap window to enhance the mechanical properties and the air tightness of the semi-finished product of the cap.

7. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S2, a rough surface is formed at the time of cutting the filter at the position of the filter in contact with the cap, and the semiconductor substrate is cut out to reduce the contact resistance between the filter and the cap.

8. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S4, before potting and fixing the optical filter and the metal cap, an adhesive with electrical conductivity is used to electrically connect the optical filter and the metal cap in a single-point, multi-point or one-circle manner, and then a common potting adhesive is used to encapsulate the optical filter and the metal cap to enhance the mechanical properties and the air tightness of the metal cap, specifically silver paste, carbon paste or conductive epoxy adhesive can be used as the conductive adhesive.

9. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S4, the filter and the metal cap are directly fixed by potting with a conductive adhesive.

10. The method for packaging an infrared filter and a cap of an infrared sensor as claimed in claim 1, wherein: in step S5, the filter and the cap are brought into close contact during the assembly curing process by an applied mechanical force method using vacuum suction or magnet suction.

Technical Field

The invention relates to the technical field of infrared sensors, in particular to a packaging method of an infrared filter and a tube cap of an infrared sensor.

Background

In the application of an infrared sensor, particularly for the application of a pyroelectric infrared sensor, on one hand, infrared rays in a required specific wave band range need to be transmitted to an induction chip in the sensor through an infrared filter; on the other hand, a metal shell is required to be used for packaging, so that the electromagnetic shielding effect is achieved; therefore, the infrared filter and the metal tube cap need to be packaged into a whole in the production process of the product, and the filter and the metal tube cap form certain mechanical strength.

In the prior art, an infrared sensor made of an infrared filter tube cap has the defects of low anti-interference performance and poor consistency of anti-interference performance in the aspects of anti-static electric field, medium and low frequency electromagnetic interference, anti-mobile phone Bluetooth, WIF and other high frequency electromagnetic interference, and brings inconvenience to users while reducing the working efficiency.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a packaging method of an infrared filter and a tube cap of an infrared sensor, which solves the problems that the infrared sensor made of the infrared filter tube cap in the prior art has the defects of low anti-interference performance and poor consistency of the anti-interference performance in the aspects of anti-static field, medium and low frequency electromagnetic interference, anti-mobile Bluetooth, WIF and other high frequency electromagnetic wave interference, reduces the working efficiency and brings inconvenience to users.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: a packaging method of an infrared filter and a tube cap of an infrared sensor comprises the following steps:

s1, producing and processing a pipe cap;

s2, producing and processing the optical filter;

s3, mounting the optical filter to the window position of the tube cap;

s4, connecting the optical filter and the tube cap by using an adhesive or conductive glue with conductive performance;

s5, fixing the filter and the cap by using potting adhesive.

Preferably, in step S1, a rough surface is formed at the portion of the cap where the cap contacts the filter when the cap is machined or selected.

Preferably, in step S1, a conductive layer with excellent conductivity is deposited on the cap portion where the cap contacts the filter by vacuum vapor deposition or chemical plating.

Preferably, in step S2, a metal conductive layer is formed at a position of the optical filter (specifically, the optical filter substrate or the conductive film layer in the optical filter optical coating layer) where the optical filter contacts the metal cap by using a vacuum physical vapor deposition method, and the conductive layer is electrically connected to the semiconductor substrate of the optical filter or the conductive film layer in the optical filter optical coating layer, and then the conductive layer is assembled in the window of the cap and encapsulated by a common potting compound to enhance mechanical properties and airtightness of the semi-finished product of the cap.

Preferably, in step S2, a metal conductive layer is formed on the filter substrate or the conductive film layer in the optical filter optical coating layer where the optical filter contacts the metal cap by using a chemical vapor deposition method, and the conductive layer is electrically connected to the semiconductor substrate of the optical filter or the conductive film layer in the optical filter optical coating layer, and then the semiconductor substrate or the conductive film layer is packaged in the cap window by using a common potting compound to enhance the mechanical properties and the hermeticity of the semi-finished product of the cap.

Preferably, in step S2, a metal conductive layer is formed at the position of the conductive film layer in the optical filter substrate or optical filter coating layer where the optical filter contacts the metal cap by using a mechanical spraying or coating method, and the conductive layer is electrically connected to the semiconductor substrate of the optical filter or the conductive film layer in the optical filter coating layer, and then the conductive layer is packaged in the window of the cap by using a common can sealant to enhance the mechanical properties and the air tightness of the semi-finished product of the cap.

Preferably, in step S2, a rough surface is formed at the time of cutting the filter at a position of the filter where the filter contacts the cap, and the semiconductor substrate is cut out to reduce the contact resistance between the filter and the cap.

Preferably, in step S4, before potting and fixing the optical filter and the metal cap, an adhesive with electrical conductivity is used, the optical filter (specifically, the optical filter substrate or the conductive film layer in the optical filter optical coating layer) is electrically connected to the metal cap in a single-point, multi-point or one-circle manner, and then a common potting is used for potting to enhance the mechanical properties and the hermeticity of the metal cap, specifically, silver paste, carbon paste or conductive epoxy adhesive is used as the conductive adhesive.

Preferably, in step S4, the optical filter and the metal cap are directly fixed by potting using a conductive adhesive.

Preferably, in step S5, the optical filter and the cap are brought into close contact during the assembly and curing process by an external mechanical force method using vacuum suction or magnet suction.

(III) advantageous effects

The invention provides a method for packaging an infrared filter and a tube cap of an infrared sensor. The method has the following beneficial effects: according to the packaging method of the infrared filter and the tube cap of the infrared sensor, in the packaging process of the infrared filter and the tube cap of a product of the pyroelectric infrared sensor or the thermopile, an electrical connection medium with good conductivity is added in the contact between the filter and the tube cap, and a conductive path with good conductivity is added, so that an electrical connection path with good conductivity is formed between a conductive film layer in a semiconductor substrate or a film coating layer of the filter and the metal tube cap, the consistency of the electrical connection conductivity and the electrical connection conductivity of the filter (specifically the conductive film layer in the semiconductor substrate or the film coating layer of the filter) and the metal tube cap is improved, the working efficiency is improved, and meanwhile, the use of a user is facilitated.

Drawings

FIG. 1 is a schematic view of five positions of the conductive adhesive of the present invention;

FIG. 2 is a schematic view of a filter without a conductive layer formed thereon according to the present invention;

FIG. 3 is a schematic diagram of a filter with conductive layers formed on two short sides according to the present invention;

FIG. 4 is a schematic diagram of a filter with conductive layers formed on two long sides according to the present invention;

FIG. 5 is a schematic diagram of a filter with a conductive layer formed on a quadrilateral surface according to the present invention;

fig. 6 is a schematic view of the arrangement position of the conductive glue of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: a packaging method of an infrared filter and a tube cap of an infrared sensor comprises the following steps:

s1, producing and processing the pipe cap, wherein the processing operation is carried out in one of the following modes:

a1, forming a rough surface on the tube cap part where the tube cap contacts with the filter when the tube cap is processed or selected;

a2, plating a conductive layer with excellent conductivity on the part of the tube cap, which is in contact with the optical filter, by a vacuum gas phase or chemical method;

s2, manufacturing the processing optical filter, wherein the processing operation is carried out in one of the following modes:

b1, forming a metal conductive layer on the filter substrate or the conductive film layer in the film coating layer, which is in contact with the metal tube cap, by vacuum physical vapor deposition, electrically connecting the conductive layer with the semiconductor substrate or the conductive film layer in the film coating layer, and packaging with common pot sealing glue after assembling in the tube cap window to enhance mechanical properties and gas tightness of the tube cap semi-finished product;

b2, forming a metal conductive layer on the filter substrate or the conductive film layer in the film coating layer, which is contacted with the filter and the metal tube cap, by chemical vapor deposition, electrically connecting the conductive layer with the semiconductor substrate or the conductive film layer in the film coating layer, and packaging with common pot sealing glue after assembling in the tube cap window to enhance the mechanical property and the gas tightness of the tube cap semi-finished product;

b3, forming a metal conductive layer on the filter substrate or the conductive film layer in the film coating layer, which is contacted with the metal tube cap, by using a mechanical spraying or coating method, electrically connecting the conductive layer with the semiconductor substrate or the conductive film layer in the film coating layer, and sealing the conductive layer in the tube cap window by using a common pot to enhance the mechanical performance and the air tightness of the tube cap semi-finished product;

b4, forming a rough surface on the part of the filter contacted with the tube cap when cutting the filter, cutting the semiconductor substrate, and reducing the contact resistance between the filter and the tube cap;

s3, mounting the optical filter at the window position of the tube cap;

s4, connecting the filter and the tube cap by using an adhesive or conductive glue with conductive performance, wherein the processing operation is carried out in one of the following modes:

and C1, before the optical filter and the metal tube cap are sealed and fixed, firstly, using an adhesive with conductive performance, electrically connecting the optical filter (specifically, the optical filter substrate or the conductive film layer in the optical filter optical coating layer) and the metal tube cap by a single point, multiple points or a whole circle, and then, using common can sealing glue for packaging to enhance the mechanical performance and the air tightness of the tube cap. The conductivity of the silicon or germanium semi-electric body base material for the optical filter is relatively low, so that the conductivity of the conductive adhesive used in the method is also not high in requirement, and specifically, silver adhesive, carbon paste or conductive epoxy adhesive can be used as the conductive adhesive;

c2, directly using a conductive adhesive to encapsulate and fix the optical filter and the metal pipe cap;

s5, fixing the filter and the cap by using potting adhesive. Wherein the optical filter and the tube cap are closely contacted in the assembling and curing process by an external mechanical force method using vacuum suction force or magnet suction force.

The invention mainly introduces a method for packaging (electrically connecting) an infrared filter and a metal shielding pipe cap, and provides a method for improving the electromagnetic interference resistance of an infrared detection sensor. Theoretical analysis and practical verification show that the technology of the invention can obviously improve the performance and consistency of the product against electrostatic fields, medium and low frequency electromagnetic interference, and high frequency electromagnetic interference such as mobile phone Bluetooth and WIF, thereby improving the overall anti-interference performance of the product and the working stability.

The infrared filter tube cap packaged by the technology of the invention is obtained by theoretical analysis and actual test, the optical performance of the infrared filter tube cap is not affected, the electrostatic field resistance, the electromagnetic shielding performance and the consistency of the electromagnetic shielding performance are greatly improved, the infrared sensor manufactured by the technology of the invention is used in the environment with strong electrostatic interference, the environment with large power frequency interference and the occasions with large electromagnetic signal interference such as mobile phone Bluetooth WIFI and the like, the anti-interference performance is improved to different degrees, and the consistency of the electrostatic field resistance and the electromagnetic shielding performance of the sensor manufactured by the technology of the invention is greatly improved. For the infrared sensor manufactured by applying the technology of the invention, the anti-electrostatic field and electromagnetic anti-interference performance and consistency thereof are improved; for the whole application system, the sensor using the technology of the invention can reduce the requirements of the electrostatic field resistance and the electromagnetic interference resistance of other signal processing circuit parts of the system, simplify the circuit framework, reduce the cost, improve the reliability of the system and reduce the electrostatic field resistance and the electromagnetic interference resistance reject ratio of the whole system.

In summary, in the packaging process of the infrared filter and the tube cap of the pyroelectric infrared sensor or the thermopile product, the electrical connection medium with good conductivity is added in the contact between the filter and the tube cap, and the conductive path with good conductivity is added, so that an electrical connection path with good conductivity is formed between the conductive film layer in the semiconductor substrate or the film coating layer of the filter and the metal tube cap, thereby improving the consistency of the electrical connection conductivity and the electrical connection conductivity of the filter (specifically the conductive film layer in the semiconductor substrate or the film coating layer of the filter) and the metal tube cap, and improving the working efficiency and facilitating the use of a user.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.