阅读说明：本技术 半导体装置 (Semiconductor device with a plurality of semiconductor chips ) 是由 中川让 中野佑纪 明田正俊 上野真弥 森诚悟 山本兼司 于 2018-05-17 设计创作，主要内容包括：本发明的半导体装置包括：第1导电型的半导体层,其具有一侧的第1主面以及另一侧的第2主面；沟槽栅极构造,其包括形成于上述半导体层的上述第1主面的栅极沟槽、以及经由栅极绝缘层而埋入于上述栅极沟槽的栅极电极；沟槽源极构造,其包括在上述半导体层的上述第1主面从上述栅极沟槽空出间隔地形成为比上述栅极沟槽更深的源极沟槽、埋入于上述源极沟槽的源极电极、以及形成于上述半导体层中沿上述源极沟槽的区域的第2导电型的阱区域,并且,上述沟槽源极构造的深度相对于上述沟槽栅极构造的深度的比为1.5以上且4.0以下；第2导电型的主体区域,其在上述半导体层的上述第1主面的表层部中形成于上述栅极沟槽以及上述源极沟槽之间的区域；第1导电型的源极区域,其形成于上述主体区域的表层部；以及漏电极,其与上述半导体层的上述第2主面连接。(The semiconductor device of the present invention includes: a semiconductor layer of a1 st conductivity type having a1 st main surface on one side and a 2 nd main surface on the other side; a trench gate structure including a gate trench formed in the 1 st main surface of the semiconductor layer, and a gate electrode embedded in the gate trench through a gate insulating layer; a trench source structure including a source trench formed deeper than the gate trench at an interval from the gate trench on the 1 st main surface of the semiconductor layer, a source electrode buried in the source trench, and a 2 nd conductivity type well region formed in a region of the semiconductor layer along the source trench, wherein a ratio of a depth of the trench source structure to a depth of the trench gate structure is 1.5 or more and 4.0 or less; a body region of the 2 nd conductivity type formed in a region between the gate trench and the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer; a source region of the 1 st conductivity type formed in a surface layer portion of the body region; and a drain electrode connected to the 2 nd main surface of the semiconductor layer.)

1. A semiconductor device, comprising:

a semiconductor layer of a1 st conductivity type having a1 st main surface on one side and a2 nd main surface on the other side;

a trench gate structure including a gate trench formed in the 1 st main surface of the semiconductor layer, and a gate electrode embedded in the gate trench through a gate insulating layer;

a trench source structure including a source trench formed deeper than the gate trench at an interval from the gate trench on the 1 st main surface of the semiconductor layer, a source electrode buried in the source trench, and a2 nd conductivity type well region formed in a region of the semiconductor layer along the source trench, wherein a ratio of a depth of the trench source structure to a depth of the trench gate structure is 1.5 or more and 4.0 or less;

a body region of the 2 nd conductivity type formed in a region between the gate trench and the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer;

a source region of the 1 st conductivity type formed in a surface layer portion of the body region; and

and a drain electrode connected to the 2 nd main surface of the semiconductor layer.

2. The semiconductor device according to claim 1,

the aspect ratio of the trench source structure is greater than the aspect ratio of the trench gate structure.

3. The semiconductor device according to claim 1 or 2,

the aspect ratio of the trench source structure is 0.5 or more and 18.0 or less.

4. The semiconductor device according to any one of claims 1 to 3,

in the semiconductor layer, the depletion layer spreads from a boundary region between the semiconductor layer and the well region to a region on the 2 nd main surface side of the bottom wall of the gate trench.

5. The semiconductor device according to claim 4,

the depletion layer overlaps a bottom wall of the gate trench.

6. The semiconductor device according to any one of claims 1 to 5,

the well region is formed in a region of the semiconductor layer along a sidewall of the source trench.

7. The semiconductor device according to any one of claims 1 to 5,

the well region is formed in a region of the semiconductor layer along a bottom wall of the source trench.

8. The semiconductor device according to any one of claims 1 to 5,

the well region is formed continuously in the semiconductor layer along a sidewall and a bottom wall of the source trench, and a corner portion connecting the sidewall and the bottom wall.

9. The semiconductor device according to any one of claims 1 to 8,

the well region is connected to the body region.

10. The semiconductor device according to any one of claims 1 to 9,

the trench source structure includes a barrier formation layer interposed in a region between the source trench and the source electrode, and having a potential barrier higher than a potential barrier between the well region and the source electrode.

11. The semiconductor device according to claim 10,

the barrier formation layer includes an insulating barrier formation layer made of an insulating material.

12. The semiconductor device according to claim 10,

the barrier formation layer includes a conductive barrier formation layer formed of a conductive material different from a conductive material of the source electrode.

13. The semiconductor device according to claim 10,

the barrier formation layer includes: an insulating barrier formation layer formed of an insulating material; and a conductive barrier formation layer formed of a conductive material different from the conductive material of the source electrode.

14. The semiconductor device according to any one of claims 10 to 13,

the barrier formation layer is formed along a sidewall and a bottom wall of the source trench, and a corner portion connecting the sidewall and the bottom wall.

15. The semiconductor device according to any one of claims 1 to 14,

and a2 nd conductivity type contact region formed in a region of the semiconductor layer along a sidewall of the source trench, the 2 nd conductivity type contact region having a2 nd conductivity type impurity concentration higher than the 2 nd conductivity type impurity concentration of the body region.

16. The semiconductor device according to any one of claims 1 to 14,

and a2 nd conductivity type contact region formed in a region of the semiconductor layer along a bottom wall of the source trench, the 2 nd conductivity type contact region having a2 nd conductivity type impurity concentration higher than the 2 nd conductivity type impurity concentration of the body region.

17. A semiconductor device, comprising:

a semiconductor layer of a1 st conductivity type having a1 st main surface on one side and a2 nd main surface on the other side;

a trench gate structure including a gate trench having a1 st sidewall and a1 st bottom wall and formed on the 1 st main surface of the semiconductor layer, and a gate electrode embedded in the gate trench through a gate insulating layer;

a trench source structure including a source trench having a2 nd sidewall and a2 nd bottom wall and formed on the 1 st main surface of the semiconductor layer with a space from the gate trench, a source electrode embedded in the source trench, and a2 nd conductivity type well region formed in a region of the semiconductor layer along the source trench;

a body region of the 2 nd conductivity type formed in a region between the gate trench and the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer;

a source region of the 1 st conductivity type formed in a surface layer portion of the body region; and

a drain electrode connected to the 2 nd main surface of the semiconductor layer,

the 2 nd sidewall of the source trench includes a1 st wall portion located on the 1 st main surface side of the semiconductor layer with respect to the 1 st bottom wall of the gate trench and a2 nd wall portion located on the 2 nd main surface side of the semiconductor layer with respect to the 1 st bottom wall of the gate trench,

the well region includes a1 st region formed along the 1 st wall portion of the 2 nd sidewall of the source trench and a2 nd region formed along the 2 nd wall portion of the 2 nd sidewall of the source trench and having a length greater than a length of the 1 st region in a thickness direction of the semiconductor layer.

Technical Field

The present invention relates to a semiconductor device.

Background

Patent document 1 discloses a semiconductor device including a gate trench and a source trench. The gate trench and the source trench are formed on the surface of the n-type semiconductor layer to substantially equal depths. A p-type body region is formed in a surface layer portion of the surface of the semiconductor layer in a region between the gate trench and the source trench.

An n + -type source region is formed in a surface layer portion of the p-type body region. A p-type withstand voltage holding region (deep well region) is formed in the semiconductor layer along a region of the source trench.

In the gate trench, a gate electrode is buried via a gate insulating layer. A source electrode is buried in the source trench. The drain electrode is connected to the back surface of the semiconductor layer.

Disclosure of Invention

Problems to be solved by the invention

As electrical characteristics of a semiconductor device having a MISFET structure including a gate, a source, and a drain, short-circuit tolerance and feedback capacitance are known. The short-circuit tolerance is a time period in which the short-circuit current can be tolerated. The short-circuit current is a current that flows between the source and the drain when the on state is switched to the off state. The feedback capacitance is the electrostatic capacitance between the gate and the drain.

The higher the short-circuit tolerance, the higher the reliability of the semiconductor device. In addition, the smaller the feedback capacitance, the higher the switching speed of the semiconductor device. Therefore, by realizing excellent short-circuit resistance and excellent feedback capacitance, a semiconductor device that can be used in various cases can be provided.

However, in a semiconductor device having a structure in which the gate trench and the source trench are formed to have substantially the same depth, a p-type deep well region can be formed only in a relatively shallow region in the n-type semiconductor layer.

In such a structure, the depletion layer cannot be sufficiently expanded from the boundary region between the semiconductor layer and the deep well region. Therefore, the current path of the short-circuit current is not sufficiently narrow due to the depletion layer, and the short-circuit tolerance cannot be appropriately improved. In addition, the width of the depletion layer is also small, and thus the feedback capacitance cannot be appropriately reduced.

One embodiment of the present invention provides a semiconductor device capable of improving short-circuit tolerance and reducing feedback capacitance.

Means for solving the problems

One embodiment of the present invention provides a semiconductor device, including: a semiconductor layer of a1 st conductivity type having a1 st main surface on one side and a 2 nd main surface on the other side; a trench gate structure including a gate trench formed in the 1 st main surface of the semiconductor layer, and a gate electrode embedded in the gate trench through a gate insulating layer; a trench source structure including a source trench formed deeper than the gate trench at an interval from the gate trench on the 1 st main surface of the semiconductor layer, a source electrode buried in the source trench, and a 2 nd conductivity type well region formed in a region of the semiconductor layer along the source trench, wherein a ratio of a depth of the trench source structure to a depth of the trench gate structure is 1.5 or more and 4.0 or less; a body region of the 2 nd conductivity type formed in a region between the gate trench and the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer; a source region of the 1 st conductivity type formed in a surface layer portion of the body region; and a drain electrode connected to the 2 nd main surface of the semiconductor layer.

According to the semiconductor device, the ratio of the depth of the trench source structure to the depth of the trench gate structure is 1.5 or more and 4.0 or less. This makes it possible to expand the depletion layer from the boundary region between the semiconductor layer and the well region toward the region on the 2 nd main surface side from the bottom wall of the gate trench.

As a result, the current path of the short-circuit current flowing between the source electrode and the drain electrode can be narrowed. Further, the feedback capacitance can be reduced in inverse proportion by the depletion layer extending from the boundary region between the semiconductor layer and the well region. Therefore, a semiconductor device capable of improving short-circuit tolerance and reducing feedback capacitance can be provided.

One embodiment of the present invention provides a semiconductor device including: a semiconductor layer of a1 st conductivity type having a1 st main surface on one side and a 2 nd main surface on the other side; a trench gate structure including a gate trench having a1 st sidewall and a1 st bottom wall and formed on the 1 st main surface of the semiconductor layer, and a gate electrode embedded in the gate trench through a gate insulating layer; a trench source structure including a source trench having a 2 nd sidewall and a 2 nd bottom wall and formed on the 1 st main surface of the semiconductor layer with a space from the gate trench, a source electrode embedded in the source trench, and a 2 nd conductivity type well region formed in a region of the semiconductor layer along the source trench; a body region of the 2 nd conductivity type formed in a region between the gate trench and the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer; a source region of the 1 st conductivity type formed in a surface layer portion of the body region; and a drain electrode connected to the 2 nd main surface of the semiconductor layer, wherein the 2 nd sidewall of the source trench includes a1 st wall portion located on the 1 st main surface side of the semiconductor layer with respect to the 1 st bottom wall of the gate trench and a 2 nd wall portion located on the 2 nd main surface side of the semiconductor layer with respect to the 1 st bottom wall of the gate trench, and the well region includes a1 st region formed along the 1 st wall portion of the 2 nd sidewall of the source trench and a 2 nd region formed along the 2 nd wall portion of the 2 nd sidewall of the source trench and having a length greater than a length of the 1 st region in a thickness direction of the semiconductor layer.

According to the semiconductor device, the well region includes the 1 st region formed along the 1 st wall portion of the 2 nd sidewall of the source trench and the 2 nd region formed along the 2 nd wall portion of the 2 nd sidewall of the source trench.

The length of the 2 nd region of the well region is larger than the length of the 1 st region of the well region in the thickness direction of the semiconductor layer. Thereby, the depletion layer can be expanded from the boundary region between the semiconductor layer and the well region toward the 2 nd main surface side region from the 1 st bottom wall of the gate trench.

As a result, the current path of the short-circuit current flowing between the source electrode and the drain electrode can be narrowed. Further, the feedback capacitance can be reduced in inverse proportion by the depletion layer extending from the boundary region between the semiconductor layer and the well region. Therefore, a semiconductor device capable of improving short-circuit tolerance and reducing feedback capacitance can be provided.

The above and other objects, features and effects of the present invention will become more apparent from the following description of the embodiments with reference to the accompanying drawings.

Drawings

Fig. 1 is a plan view showing a semiconductor device according to embodiment 1 of the present invention.

Fig. 2 is a sectional view taken along line II-II of fig. 1.

Fig. 3 is a cross-sectional view for explaining an operation of the semiconductor device of fig. 1.

Fig. 4 is a graph showing current-voltage characteristics of the semiconductor device of fig. 1.

Fig. 5 is a graph showing capacitance-voltage characteristics of the semiconductor device of fig. 1.

Fig. 6 is a cross-sectional view showing a semiconductor device according to embodiment 2 of the present invention.

Fig. 7 is a cross-sectional view showing a semiconductor device according to embodiment 3 of the present invention.

Fig. 8 is a cross-sectional view showing a semiconductor device according to embodiment 4 of the present invention.

Fig. 9 is a cross-sectional view showing a semiconductor device according to embodiment 5 of the present invention.

Fig. 10 is a plan view showing a semiconductor device according to embodiment 6 of the present invention.

Fig. 11 is a plan view showing a semiconductor device according to embodiment 7 of the present invention.

Fig. 12 is an enlarged view of a region XII shown in fig. 11, and is a view for explaining the structure of the 1 st main surface of the SiC semiconductor layer.

Fig. 13 is a sectional view taken along line XIII-XIII shown in fig. 12.

Fig. 14 is a sectional view taken along the line XIV-XIV shown in fig. 12.

Fig. 15 is a graph showing the relationship between the resistivity and the formation temperature of polycrystals.

Fig. 16 is a graph for explaining sheet resistance.

Fig. 17A is a cross-sectional view showing an example of the method for manufacturing the semiconductor device shown in fig. 11.

Fig. 17B is a sectional view showing the steps subsequent to fig. 17A.

Fig. 17C is a sectional view showing a step subsequent to fig. 17B.

Fig. 17D is a sectional view showing a step subsequent to fig. 17C.

Fig. 17E is a sectional view showing a step subsequent to fig. 17D.

Fig. 17F is a sectional view showing a step subsequent to fig. 17E.

Fig. 17G is a sectional view showing a step subsequent to fig. 17F.

Fig. 17H is a sectional view showing a step subsequent to fig. 17G.

Fig. 17I is a sectional view showing a step subsequent to fig. 17H.

Fig. 17J is a sectional view showing a step subsequent to fig. 17I.

Fig. 17K is a sectional view showing a step subsequent to fig. 17J.

Fig. 17L is a sectional view showing a step subsequent to fig. 17K.

Fig. 18 is a sectional view of a region corresponding to fig. 13, and is a sectional view showing a semiconductor device according to embodiment 8 of the present invention.

Fig. 19 is a sectional view of a region corresponding to fig. 13, and is a sectional view of a semiconductor device according to embodiment 9 of the present invention.

Fig. 20A is a cross-sectional view showing an example of the method for manufacturing the semiconductor device shown in fig. 19.

Fig. 20B is a sectional view showing a step subsequent to fig. 20A.

Fig. 20C is a sectional view showing a step subsequent to fig. 20B.

Fig. 21 is an enlarged view of a region corresponding to fig. 12, and is an enlarged view showing a semiconductor device according to embodiment 10 of the present invention.

Fig. 22 is a sectional view taken along line XXII-XXII shown in fig. 21.

Fig. 23 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 11 of the present invention.

Fig. 24 is an enlarged view of a region corresponding to fig. 12, and is an enlarged view for explaining the structure of the semiconductor device according to embodiment 12 of the present invention.

Fig. 25 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 13 of the present invention.

Fig. 26 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 14 of the present invention.

Fig. 27 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 15 of the present invention.

Fig. 28 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 16 of the present invention.

Fig. 29 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 17 of the present invention.

Fig. 30 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 18 of the present invention.

Fig. 31 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 19 of the present invention.

Fig. 32 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 20 of the present invention.

Fig. 33 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device according to embodiment 21 of the present invention.

Fig. 34 is a plan view showing a semiconductor device according to embodiment 22 of the present invention.

Fig. 35 is a bottom view of the semiconductor device shown in fig. 34, and is a bottom view of example 1 of the bump group.

Fig. 36A is a diagram showing an example of the 2 nd embodiment of the bump group.

Fig. 36B is a diagram showing an example of the 3 rd embodiment of the bump group.

Fig. 36C is a diagram showing an example of the 4 th embodiment of the bump group.

Fig. 36D is a diagram showing an example of the 5 th embodiment of the ridge group.

Fig. 37 is an enlarged view of the region XXXVII shown in fig. 34, in which a structure above the 1 st main surface of the SiC semiconductor layer is removed.

Fig. 38 is a cross-sectional view taken along line XXXVIII-XXXVIII of fig. 37.

Fig. 39 is a cross-sectional view taken along line XXXIX-XXXIX of fig. 37.

Fig. 40 is an enlarged view of the region XL shown in fig. 39.

Fig. 41A is a plan view of a semiconductor wafer used in the manufacture of the semiconductor device shown in fig. 34.

Fig. 41B is a bottom view of the semiconductor wafer shown in fig. 41A, showing a state in which the polishing step and the annealing treatment have been performed.

Fig. 42 is a flowchart for explaining an example of the semiconductor device shown in fig. 34.

Fig. 43A is a sectional view for explaining the manufacturing method shown in fig. 42.

Fig. 43B is a sectional view for explaining a step subsequent to fig. 43A.

Fig. 43C is a sectional view for explaining a step subsequent to fig. 43B.

Fig. 43D is a sectional view for explaining a step subsequent to fig. 43C.

Fig. 43E is a sectional view for explaining a step subsequent to fig. 43D.

Fig. 43F is a sectional view for explaining a step subsequent to fig. 43E.

Fig. 43G is a sectional view for explaining a step subsequent to fig. 43F.

Fig. 43H is a sectional view for explaining a step subsequent to fig. 43G.

Fig. 43I is a sectional view for explaining a step subsequent to fig. 43H.

Fig. 44 is a bottom view corresponding to fig. 35, and is a bottom view showing a semiconductor device according to embodiment 23 of the present invention.

Fig. 45 is a cross-sectional view corresponding to fig. 39, and is a cross-sectional view showing a semiconductor device according to embodiment 24 of the present invention.

FIG. 46 is an enlarged view showing a region XLVI shown in FIG. 45.

Fig. 47 is a cross-sectional view corresponding to fig. 39, and is a cross-sectional view showing a semiconductor device according to embodiment 25 of the present invention.

FIG. 48 is an enlarged view of region XLVIII shown in FIG. 47.

Fig. 49 is a plan view showing a semiconductor device according to embodiment 26 of the present invention.

Fig. 50 is a plan view showing the semiconductor device shown in fig. 49, from which the resin layer is removed.

Fig. 51 is an enlarged view of the region LI shown in fig. 50, and is a view for explaining the structure of the 1 st main surface of the SiC semiconductor layer.

Fig. 52 is a cross-sectional view taken along the LII-LII line shown in fig. 51, and shows a1 st embodiment of the gate trench and a1 st embodiment of the source trench.

Fig. 53 is a sectional view taken along the LIII-LIII line shown in fig. 51, and shows an example of the 1 st embodiment of the gate wiring layer.

Fig. 54 is an enlarged view of the region LIV shown in fig. 52.

Fig. 55 is a cross-sectional view taken along the LV-LV line shown in fig. 50, and shows an example of the 1 st aspect of the active sidewall, an example of the 1 st aspect of the outer main surface, an example of the 1 st aspect of the lateral wall (サ イ ド ウ ォ ー ル), an example of the 1 st aspect of the diode region, an example of the 1 st aspect of the outer deep well region, an example of the 1 st aspect of the field limiting structure, and an example of the 1 st aspect of the anchor hole.

Fig. 56 is an enlarged view of the region LVI shown in fig. 55, and is an enlarged view showing a1 st embodiment of the active sidewall and a1 st embodiment of the outer main surface.

Fig. 57A is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 2 nd embodiment of the gate trench.

Fig. 57B is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 3 rd embodiment of the gate trench.

Fig. 57C is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 4 th embodiment of the gate trench.

Fig. 57D is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 5 th embodiment of the gate trench.

Fig. 57E is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of the 6 th embodiment of the gate trench.

Fig. 58A is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 2 nd embodiment of the source trench.

Fig. 58B is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 3 rd embodiment of the source trench.

Fig. 58C is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 4 th embodiment of the source trench.

Fig. 58D is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 5 th embodiment of the source trench.

Fig. 58E is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of the source trench according to embodiment 6.

Fig. 58F is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 7 th embodiment of the source trench.

Fig. 58G is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of an 8 th embodiment of the source trench.

Fig. 58H is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 9 th embodiment of the source trench.

Fig. 58I is a cross-sectional view of a region corresponding to fig. 54, and shows a 10 th embodiment of the source trench.

Fig. 58J is a cross-sectional view of a region corresponding to fig. 54, and shows an 11 th embodiment of the source trench.

Fig. 58K is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of the source trench according to example 12.

Fig. 58L is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 13 th embodiment of the source trench.

Fig. 58M is a cross-sectional view of a region corresponding to fig. 54, and shows an example of 14 th mode for forming a source trench.

Fig. 58N is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 15 th embodiment of the source trench.

Fig. 58O is a cross-sectional view of a region corresponding to fig. 54, and shows a 16 th embodiment of the source trench.

Fig. 58P is a cross-sectional view of a region corresponding to fig. 54, and shows a 17 th embodiment of the source trench.

Fig. 58Q is a cross-sectional view of a region corresponding to fig. 54, and shows an 18 th embodiment of the source trench.

Fig. 59A is an enlarged view of a region corresponding to fig. 56, and shows an active sidewall in accordance with embodiment 2.

Fig. 59B is an enlarged view of a region corresponding to fig. 56, and shows an active sidewall according to embodiment 3.

Fig. 59C is an enlarged view of a region corresponding to fig. 56, and shows an active sidewall according to embodiment 4.

Fig. 60A is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing an example of the 2 nd embodiment of the outer main surface.

Fig. 60B is an enlarged view of a region corresponding to fig. 56, and shows an outer main surface in accordance with example 3.

Fig. 60C is an enlarged view of a region corresponding to fig. 56, and shows an outer main surface in accordance with example 4.

Fig. 61A is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 2 nd embodiment of the side wall.

Fig. 61B is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 3 rd embodiment of the side wall.

Fig. 61C is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 4 th embodiment of the side wall.

Fig. 61D is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing an example of the 5 th aspect of the side wall.

Fig. 61E is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing an example of the 6 th aspect of the side wall.

Fig. 61F is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 7 th embodiment of the side wall.

Fig. 62A is a cross-sectional view of a region corresponding to fig. 55, and is an enlarged view showing an example of embodiment 2 of the outer deep well region.

Fig. 62B is a cross-sectional view of a region corresponding to fig. 55, and is an enlarged view showing an example of embodiment 3 of the outer deep well region.

Fig. 62C is a cross-sectional view of a region corresponding to fig. 55, and is an enlarged view showing an example of the 4 th embodiment of the outer deep well region.

Fig. 63A is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 2 nd embodiment of the field limiting structure.

Fig. 63B is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 3 rd embodiment of the field limiting structure.

Fig. 63C is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 4 th mode of the field limiting structure.

Fig. 63D is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 5 th aspect of the field limiting structure.

Fig. 64A is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 2 nd mode of the anchor hole.

Fig. 64B is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 3 rd mode of the anchor hole.

Fig. 64C is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing an anchor hole according to embodiment 4.

Fig. 64D is a plan view corresponding to fig. 50, showing an anchor hole of the 5 th embodiment.

Fig. 65A is an enlarged view of a region corresponding to fig. 54, and is an enlarged view showing an example of the method for manufacturing the semiconductor device shown in fig. 49.

Fig. 65B is an enlarged view showing a step subsequent to fig. 65A.

Fig. 65C is an enlarged view showing a step subsequent to fig. 65B.

Fig. 65D is an enlarged view showing a step subsequent to fig. 65C.

Fig. 65E is an enlarged view showing a step subsequent to fig. 65D.

Fig. 65F is an enlarged view showing a step subsequent to fig. 65E.

Fig. 65G is an enlarged view showing a step subsequent to fig. 65F.

Fig. 65H is an enlarged view showing a step subsequent to fig. 65G.

Fig. 65I is an enlarged view showing the steps subsequent to fig. 65H.

Fig. 65J is an enlarged view showing a step subsequent to fig. 65I.

Fig. 65K is an enlarged view showing a step subsequent to fig. 65J.

Fig. 65L is an enlarged view showing a step subsequent to fig. 65K.

Fig. 65M is an enlarged view showing a step subsequent to fig. 65L.

Fig. 65N is an enlarged view showing a step subsequent to fig. 65M.

Fig. 65O is an enlarged view showing steps subsequent to fig. 65N.

Fig. 65P is an enlarged view showing a step subsequent to fig. 65O.

Fig. 65Q is an enlarged view showing a step subsequent to fig. 65P.

Fig. 65R is an enlarged view showing a step subsequent to fig. 65Q.

Fig. 65S is an enlarged view showing a step subsequent to fig. 65R.

Fig. 65T is an enlarged view showing a step subsequent to fig. 65S.

Fig. 65U is an enlarged view showing a step subsequent to fig. 65T.

Fig. 65V is an enlarged view showing a step subsequent to fig. 65U.

Fig. 65W is an enlarged view showing a step subsequent to fig. 65V.

Fig. 65X is an enlarged view showing a step subsequent to fig. 65W.

Fig. 65Y is an enlarged view showing a step subsequent to fig. 65X.

Fig. 65Z is an enlarged view showing a step subsequent to fig. 65Y.

Fig. 66A is a cross-sectional view of a region corresponding to fig. 55, which is a cross-sectional view showing an example of a method for manufacturing the semiconductor device shown in fig. 49.

Fig. 66B is a sectional view showing a step subsequent to fig. 66A.

Fig. 66C is a sectional view showing a step subsequent to fig. 66B.

Fig. 66D is a sectional view showing a step subsequent to that of fig. 66C.

Fig. 66E is a sectional view showing a step subsequent to fig. 66D.

Fig. 66F is a sectional view showing a step subsequent to fig. 66E.

Fig. 66G is a sectional view showing a step subsequent to that of fig. 66F.

Fig. 66H is a sectional view showing a step subsequent to fig. 66G.

Fig. 66I is a sectional view showing a step subsequent to that of fig. 66H.

Fig. 66J is a sectional view showing a step subsequent to fig. 66I.

Fig. 66K is a sectional view showing a step subsequent to fig. 66J.

Fig. 66L is a sectional view showing a step subsequent to fig. 66K.

Fig. 66M is a sectional view showing a step subsequent to that of fig. 66L.

Fig. 66N is a sectional view showing a step subsequent to fig. 66M.

Fig. 66O is a cross-sectional view showing a step subsequent to that of fig. 66N.

Fig. 66P is a sectional view showing a step subsequent to that of fig. 66O.

Fig. 66Q is a sectional view showing a step subsequent to fig. 66P.

Fig. 66R is a sectional view showing a step subsequent to fig. 66Q.

Fig. 66S is a sectional view showing a step subsequent to that of fig. 66R.

Fig. 66T is a sectional view showing a step subsequent to fig. 66S.

Fig. 66U is a sectional view showing a step subsequent to fig. 66T.

Fig. 66V is a sectional view showing a step subsequent to that of fig. 66U.

Fig. 66W is a sectional view showing a step subsequent to fig. 66V.

Fig. 66X is a sectional view showing a step subsequent to fig. 66W.

Fig. 66Y is a sectional view showing a step subsequent to fig. 66X.

Fig. 66Z is a sectional view showing a step subsequent to fig. 66Y.

Fig. 67 is an enlarged view of a region corresponding to fig. 51, and is an enlarged view showing a semiconductor device according to embodiment 27 of the present invention.

FIG. 68 is a sectional view taken along line LXVIII-LXVIII shown in FIG. 67.

FIG. 69 is a sectional view taken along line LXIX-LXIX shown in FIG. 67.

FIG. 70 is an enlarged view of the region LXX-LXX shown in FIG. 68.

Fig. 71 is a graph showing leakage current characteristics in the case of using NiSi as the low-resistance electrode layer.

FIG. 72 shows the use of CoSi₂A graph of leakage current characteristics in the case of the low-resistance electrode layer.

FIG. 73 shows the use of TiSi₂A graph of leakage current characteristics in the case of the low-resistance electrode layer.

Fig. 74A is an enlarged view of a region corresponding to fig. 70, and is an enlarged view for explaining an example of the method for manufacturing the semiconductor device shown in fig. 67.

Fig. 74B is an enlarged view showing a step subsequent to fig. 74A.

Fig. 74C is an enlarged view showing a step subsequent to fig. 74B.

Fig. 74D is an enlarged view showing a step subsequent to fig. 74C.

Fig. 74E is an enlarged view showing a step subsequent to fig. 74D.

Fig. 74F is an enlarged view showing a step subsequent to fig. 74E.

Fig. 74G is an enlarged view showing a step subsequent to fig. 74F.

Fig. 75 is an enlarged view of a region corresponding to fig. 70, and is an enlarged view of the semiconductor device according to embodiment 28 of the present invention.

Fig. 76A is an enlarged view of a region corresponding to fig. 75, and is an enlarged view for explaining an example of the method for manufacturing the semiconductor device shown in fig. 75.

Fig. 76B is an enlarged view showing a step subsequent to fig. 76A.

Fig. 76C is an enlarged view showing a step subsequent to fig. 76B.

Fig. 76D is an enlarged view showing the steps subsequent to fig. 76C.

Fig. 76E is an enlarged view showing a step subsequent to fig. 76D.

Fig. 76F is an enlarged view showing the steps subsequent to fig. 76E.

Fig. 76G is an enlarged view showing a step subsequent to fig. 76F.

Fig. 77 is an enlarged view of a region corresponding to fig. 70, and is an enlarged view of the semiconductor device according to embodiment 29 of the present invention.

Fig. 78A is an enlarged view of a region corresponding to fig. 77, and is an enlarged view for explaining an example of the method for manufacturing the semiconductor device shown in fig. 77.

Fig. 78B is an enlarged view showing a step subsequent to fig. 78A.

Fig. 78C is an enlarged view showing a step subsequent to fig. 78B.

Fig. 78D is an enlarged view showing a step subsequent to fig. 78C.

Fig. 78E is an enlarged view showing a step subsequent to fig. 78D.

Fig. 78F is an enlarged view showing a step subsequent to fig. 78E.

Fig. 79 is an enlarged view of a region corresponding to fig. 70, and is an enlarged view of the semiconductor device according to embodiment 30 of the present invention.

Fig. 80 is a sectional view of a region corresponding to fig. 69, and is a sectional view showing the semiconductor device shown in fig. 79.

Fig. 81 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing the semiconductor device shown in fig. 79.

Fig. 82A is an enlarged view of a region corresponding to fig. 79, and is an enlarged view for explaining an example of the method for manufacturing the semiconductor device shown in fig. 79.

Fig. 82B is an enlarged view showing a step subsequent to fig. 82A.

Fig. 82C is an enlarged view showing a step subsequent to fig. 82B.

Fig. 83 is a bottom view of the semiconductor device according to embodiment 31 of the present invention, and is a bottom view of embodiment 1 showing a bump group.

Fig. 84A is a diagram showing an example of the 2 nd embodiment of the bump group.

Fig. 84B is a diagram showing an example of the 3 rd embodiment of the bump group.

Fig. 84C is a diagram showing an example of the 4 th embodiment of the ridge group.

Fig. 84D is a diagram showing an example of the 5 th embodiment of the ridge group.

Fig. 85 is a sectional view of a region corresponding to fig. 68, and is a sectional view showing the semiconductor device shown in fig. 83.

Fig. 86 is a sectional view of a region corresponding to fig. 69, and is a sectional view showing the semiconductor device shown in fig. 83.

FIG. 87 is an enlarged view showing a region LXXXVII shown in FIG. 86.

Fig. 88 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing the semiconductor device shown in fig. 83.

Fig. 89 is a bottom view corresponding to fig. 83, and is a bottom view showing a semiconductor device according to embodiment 32 of the present invention.

Fig. 90 is a sectional view corresponding to fig. 86, and is a sectional view showing a semiconductor device according to embodiment 33 of the present invention.

Fig. 91 is an enlarged view of the region XCI shown in fig. 90.

Fig. 92 is a sectional view corresponding to fig. 86, and is a sectional view showing a semiconductor device according to embodiment 34 of the present invention.

Fig. 93 is an enlarged view showing the region XCIII shown in fig. 92.

Fig. 94 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 35 of the present invention.

Fig. 95 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 36 of the present invention.

Fig. 96 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 37 of the present invention.

Fig. 97 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 38 of the present invention.

Fig. 98 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 39 of the present invention.

Fig. 99 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 40 of the present invention.

Fig. 100 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 41 of the present invention.

Fig. 101 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device according to embodiment 42 of the present invention.

Fig. 102 is an enlarged view of a region corresponding to fig. 51, and is an enlarged view showing a semiconductor device according to embodiment 43 of the present invention.

FIG. 103 is a sectional view taken along the CIII-CIII line shown in FIG. 102.

Fig. 104 is an enlarged view of a region corresponding to fig. 51, and is an enlarged view showing a semiconductor device according to embodiment 44 of the present invention.

Fig. 105 is an enlarged view of a region corresponding to fig. 54, and is an enlarged view showing a semiconductor device according to embodiment 45 of the present invention.

Fig. 106 is a perspective view showing a semiconductor package in which any one of the semiconductor devices according to embodiments 1 to 45 described above can be assembled through a sealing body.

FIG. 107 is a view showing a unit cell of a 4H-SiC single crystal to which an embodiment of the present invention is applied.

FIG. 108 is a plan view showing a silicon surface of a unit cell of the 4H-SiC single crystal shown in FIG. 107.

Detailed Description

Fig. 1 is a plan view showing a semiconductor device 1 according to embodiment 1 of the present invention. Fig. 2 is a sectional view taken along line II-II of fig. 1.

The Semiconductor device 1 is a switching device including a vertical misfet (metal Insulator Semiconductor Field Effect transistor). Referring to fig. 1 and 2, a semiconductor device 1 includes an n-type SiC semiconductor layer 2 including SiC (silicon carbide) single crystal.

The SiC semiconductor layer 2 includes a first 1 st main surface 3 and a second 2 nd main surface 4. In this embodiment, the SiC semiconductor layer 2 has a laminated structure of a SiC semiconductor substrate 5 including SiC single crystal and an n-type SiC epitaxial layer 6 including SiC single crystal. The 2 nd main surface 4 of the SiC semiconductor layer 2 is formed by the SiC semiconductor substrate 5. The first main surface 1 of the SiC semiconductor layer 2 is formed by the SiC epitaxial layer 6.

The drain electrode 7 is connected to the 2 nd main surface 4 of the SiC semiconductor layer 2. The SiC semiconductor substrate 5 is formed as an n + -type drain region. The SiC epitaxial layer 6 is formed as an n-type drain drift region.

The n-type impurity concentration of the SiC semiconductor substrate 5 is preferably 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following. The n-type impurity concentration of the SiC epitaxial layer 6 is preferably 1.0X 10¹⁵cm^－3Above and 1.0X 10¹⁷cm^－3The following. Hereinafter, in the present specification, the "impurity concentration" refers to a peak value of the impurity concentration.

Referring to fig. 1 and 2, a plurality of trench gate structures 10 and a plurality of trench source structures 11 are formed on the 1 st main surface 3 of SiC semiconductor layer 2. The trench gate structures 10 and the trench source structures 11 are alternately formed with an interval therebetween in the arbitrary 1 st direction X.

The trench gate structure 10 and the trench source structure 11 are formed in stripe shapes extending in the 2 nd direction Y orthogonal to the 1 st direction X. Preferably, the 1 st direction X is a [ 11-20 ] direction and the 2 nd direction Y is a [ 1-100 ] direction.

A stripe structure including a plurality of trench gate structures 10 and a plurality of trench source structures 11 is formed on the 1 st main surface 3 of the SiC semiconductor layer 2. Preferably, the distance between trench gate structure 10 and trench source structure 11 is 0.3 μm or more and 1.0 μm or less in the 1 st direction X.

Each trench gate structure 10 includes a gate trench 12, a gate insulating layer 13, and a gate electrode layer 14. In fig. 1, the gate electrode layer 14 is shown with hatching for the sake of clarity.

The gate trench 12 is formed by digging the 1 st main surface 3 of the SiC semiconductor layer 2 toward the 2 nd main surface 4 side. The gate trench 12 includes a1 st sidewall 15 and a1 st bottom wall 16.

The gate insulating layer 13 is formed in a film shape along the 1 st sidewall 15, the 1 st bottom wall 16, and the corner 17 connecting the 1 st sidewall 15 and the 1 st bottom wall 16 of the gate trench 12. The gate insulating layer 13 divides a concave space in the gate trench 12.

The gate insulating layer 13 may also contain silicon oxide. The gate insulating layer 13 may contain at least one of silicon, silicon nitride, aluminum oxide, aluminum nitride, and aluminum oxynitride, which are added without impurities, in addition to silicon oxide.

The gate electrode layer 14 is buried in the gate trench 12 with the gate insulating layer 13 interposed therebetween. More specifically, the gate electrode layer 14 is embedded in a concave space divided by the gate insulating layer 13.

Gate electrode layer 14 may also comprise conductive polysilicon. The gate electrode layer 14 may contain at least one of titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten in addition to the conductive polysilicon.

Each trench source structure 11 includes a source trench 18, a barrier formation layer 19, a source electrode layer 20, and a p-type deep well region 21. In fig. 1, the source electrode layer 20 is shown by hatching for the sake of clarity. The deep well region 21 is also referred to as a withstand voltage holding region.

Source trench 18 is formed by digging first main surface 3 of SiC semiconductor layer 2 toward second main surface 4 side. The source trench 18 includes a 2 nd sidewall 22 and a 2 nd bottom wall 23.

The 2 nd sidewall 22 of the source trench 18 includes a1 st wall portion 24 and a 2 nd wall portion 25. The 1 st wall portion 24 of the source trench 18 is located on the 1 st main surface 3 side of the SiC semiconductor layer 2 with respect to the 1 st bottom wall 16 of the gate trench 12. That is, the 1 st wall portion 24 is a portion overlapping with the gate trench 12 in a lateral direction parallel to the 1 st main surface 3 of the SiC semiconductor layer 2.

The 2 nd wall portion 25 of the source trench 18 is located on the 2 nd main surface 4 side of the SiC semiconductor layer 2 with respect to the 2 nd bottom wall 23 of the gate trench 12. That is, the 2 nd wall portion 25 is a portion of the region of the source trench 18 located on the 2 nd main surface 4 side of the SiC semiconductor layer 2 with respect to the 2 nd bottom wall 23 of the gate trench 12.

The length of the 2 nd wall portion 25 of the source trench 18 is larger than the length of the 1 st wall portion 24 of the source trench 18 in the thickness direction of the SiC semiconductor layer 2. The 2 nd bottom wall 23 of the source trench 18 is located in a region between the 1 st bottom wall 16 of the gate trench 12 and the 2 nd main surface 4 of the SiC semiconductor layer 2 in the thickness direction of the SiC semiconductor layer 2.

In this manner, the 2 nd bottom wall 23 of the source trench 18 is located on the SiC epitaxial layer 6. The 2 nd bottom wall 23 of the source trench 18 may also be located on the SiC semiconductor substrate 5.

The barrier-forming layer 19 is formed in a film shape along the 2 nd side wall 22, the 2 nd bottom wall 23, and the corner 26 connecting the 2 nd side wall 22 and the 2 nd bottom wall 23 of the source trench 18. The barrier formation layer 19 defines a concave space in the source trench 18.

The barrier formation layer 19 is made of a material different from the conductive material of the source electrode layer 20. The barrier formation layer 19 has a potential barrier higher than that between the source electrode layer 20 and the deep well region 21.

A conductive barrier formation layer may be used as the barrier formation layer 19. The conductive barrier formation layer may also contain at least one of conductive polysilicon, tungsten, platinum, nickel, cobalt, or molybdenum.

An insulating barrier formation layer may be used as the barrier formation layer 19. The insulating barrier formation layer may contain at least one of impurity-free added silicon, silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, and aluminum oxynitride. Fig. 2 shows an example in which the insulating barrier formation layer is formed as the barrier formation layer 19.

More specifically, the barrier-forming layer 19 is silicon oxide. The barrier formation layer 19 and the gate insulating layer 13 are preferably formed of the same material. In this case, the thickness of the barrier formation layer 19 and the thickness of the gate insulating layer 13 are preferably the same. When the barrier-forming layer 19 and the gate insulating layer 13 are formed of silicon oxide, the barrier-forming layer 19 and the gate insulating layer 13 can be formed simultaneously by a thermal oxidation treatment method.

The source electrode layer 20 is buried in the concave space of the source trench 18 through the barrier formation layer 19. The source electrode layer 20 may also comprise conductive polysilicon. The source electrode layer 20 may be n-type polycrystalline silicon to which an n-type impurity is added or p-type polycrystalline silicon to which a p-type impurity is added.

The source electrode layer 20 may contain at least one of titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten in addition to the conductive polysilicon.

The source electrode layer 20 is formed of the same conductive material as the gate electrode layer 14. In this case, the gate electrode layer 14 and the source electrode layer 20 can be formed at the same time. Of course, the source electrode layer 20 may be formed of a conductive material different from that of the gate electrode layer 14.

Deep well regions 21 are formed in the SiC semiconductor layer 2 in regions along the source trenches 18. The p-type impurity concentration of deep well region 21 may be 1.0 × 10¹⁷cm^－3Above and 1.0X 10¹⁹cm^－3The following.

Deep well regions 21 are formed in the SiC semiconductor layer 2 in regions along the 2 nd side walls 22 of the source trenches 18. The deep well region 21 is formed in the SiC semiconductor layer 2 in a region along the 2 nd bottom wall 23 of the source trench 18.

In this embodiment, the deep well region 21 is formed continuously in the SiC semiconductor layer 2 in a region along the 2 nd side wall 22, the corner 26, and the 2 nd bottom wall 23 of the source trench 18. The deep well region 21 includes a1 st region 27 and a 2 nd region 28 at a portion along the 2 nd sidewall 22 of the source trench 18.

The 1 st region 27 of the deep well region 21 is formed along the 1 st wall portion 24 of the 2 nd sidewall 22 of the source trench 18. The 2 nd region 28 of the deep well region 21 is formed along the 2 nd wall portion 25 of the 2 nd sidewall 22 of the source trench 18. The length of the 2 nd region 28 of the deep well region 21 is larger than the length of the 1 st region 27 of the deep well region 21 in the thickness direction of the SiC semiconductor layer 2.

The thickness of the portion along the 2 nd bottom wall 23 of the source trench 18 in the deep well region 21 may be equal to or greater than the thickness of the portion along the 2 nd sidewall 22 of the source trench 18 in the deep well region 21.

The portion along the 2 nd bottom wall 23 of the source trench 18 in the deep well region 21 may also cross the boundary region of the SiC semiconductor substrate 5 and the SiC epitaxial layer 6 and be located within the SiC semiconductor substrate 5.

In the portion of the SiC semiconductor layer 2 along the 2 nd bottom wall 23 of the source trench 18, a p-type impurity is implanted in the direction of the normal to the 1 st main surface 3 of the SiC semiconductor layer 2. On the other hand, in the SiC semiconductor layer 2 along the 2 nd side wall 22 of the source trench 18, a p-type impurity is implanted in a state of being inclined with respect to the 1 st main surface 3 of the SiC semiconductor layer 2.

Therefore, the p-type impurity is implanted into the SiC semiconductor layer 2 at a position deeper along the 2 nd bottom wall 23 of the source trench 18 than along the 2 nd side wall 22 of the source trench 18. As a result, in the deep well region 21, a difference in thickness is generated between a portion along the 2 nd bottom wall 23 of the source trench 18 and a portion along the 2 nd sidewall 22 of the source trench 18.

A p-type body region 30 is formed in a surface layer portion of the first main surface 3 of the SiC semiconductor layer 2. A body region 30 is formed in the region between the gate trench 12 and the source trench 18. The main body region 30 is formed in a band shape extending in the 2 nd direction Y in a plan view.

The body region 30 is exposed from the 1 st sidewall 15 of the gate trench 12 and the 2 nd sidewall 22 of the source trench 18. The body region 30 is connected to the 1 st region 27 of the deep well region 21.

The p-type impurity concentration of the body region 30 may be 1.0 × 10¹⁶cm^－3Above and 1.0X 10¹⁹cm^－3The following. The p-type impurity concentration of the body region 30 may be substantially equal to the p-type impurity concentration of the deep well region 21. The p-type impurity concentration of the body region 30 may be higher than that of the deep well region 21.

An n + -type source region 31 is formed in a surface layer portion of the body region 30. The source region 31 is formed in the surface layer portion of the body region 30 in a region along the 1 st sidewall 15 of the gate trench 12. The source region 31 is exposed from the 1 st sidewall 15 of the gate trench 12.

The source region 31 may be formed in a stripe shape extending in the 2 nd direction Y in a plan view. Although not shown, the source region 31 may include a portion exposed from the No. 2 sidewall 22 of the source trench 18.

The width WS of the source region 31 may be 0.2 μm or more and 0.6 μm or less (e.g., about 0.4 μm). In this manner, the width WS is a width in the 1 st direction X in the source region 31. The n-type impurity concentration of the source region 31 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following.

A p + -type contact region 32 is formed in a surface layer portion of the body region 30. A contact region 32 is formed in the surface portion of the body region 30 in a region along the No. 2 sidewall 22 of the source trench 18. The contact region 32 is exposed from the No. 2 sidewall 22 of the source trench 18.

The contact region 32 may also be connected to the source region 31. The contact region 32 may be formed in a stripe shape extending in the 2 nd direction Y in a plan view. The contact region 32 may also include a portion exposed from the 1 st sidewall 15 of the adjacent gate trench 12.

The width WC of the contact region 32 may be 0.1 μm or more and 0.4 μm or less (e.g., about 0.2 μm). In this manner, the width WC is the width in the 1 st direction X in the contact region 32. The p-type impurity concentration of the contact region 32 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following.

An insulating layer 40 is formed on the 1 st main surface 3 of the SiC semiconductor layer 2. The insulating layer 40 collectively covers the plurality of trench gate structures 10. The insulating layer 40 has a contact hole 41. The contact hole 41 selectively exposes the trench source structure 11, the source region 31, and the contact region 32.

A main surface source electrode 42 is formed on the insulating layer 40. The main surface source electrode 42 enters the contact hole 41 from above the insulating layer 40. The main surface source electrode 42 is electrically connected to the source electrode layer 20, the source region 31, and the contact region 32 in the contact hole 41.

The main surface source electrode 42 may be formed of the same conductive material as the source electrode layer 20. The main surface source electrode 42 may be formed of a different conductive material from the source electrode layer 20.

In this embodiment, the source electrode layer 20 contains n-type polycrystalline silicon or p-type polycrystalline silicon, and the main-surface source electrode 42 contains aluminum or a metal material containing aluminum as a main component. The main-surface source electrode 42 may include at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten.

The main surface source electrode 42 may be formed of an electrode layer formed integrally with the source electrode layer 20. In this case, the source electrode layer 20 and the main surface source electrode 42 are formed through a common process.

The dimensions of trench gate structure 10 and trench source structure 11 will be specifically described below.

The trench gate structure 10 has an aspect ratio D1/W1. The aspect ratio D1/W1 of the trench gate construction 10 is defined by the ratio of the depth D1 of the trench gate construction 10 relative to the width W1 of the trench gate construction 10.

In this manner, the width W1 is a width in the 1 st direction X in the trench gate structure 10. The aspect ratio D1/W1 of the trench gate structure 10 may also be the aspect ratio of the gate trench 12.

The aspect ratio D1/W1 of the trench gate structure 10 may be 0.25 to 15.0. The width W1 of the trench gate structure 10 may be 0.2 μm or more and 2.0 μm or less (e.g., about 0.4 μm). The depth D1 of the trench gate structure 10 may be 0.5 μm or more and 3.0 μm or less (e.g., about 1.0 μm).

The trench source structure 11 has an aspect ratio D2/W2. The aspect ratio D2/W2 of the trench source structure 11 is the ratio of the depth D2 of the trench source structure 11 to the width W2 of the trench source structure 11.

The width W2 of the trench source structure 11 is the sum of the width WST of the source trench 18, the 1 st width W α of the deep well region 21, and the 2 nd width W β of the deep well region 21 (W2 ═ WST + W α + W β).

In this manner, the width WST is a width in the 1 st direction X in the source trench 18. In this mode 1, the width W α is a width in the 1 st direction X of a portion of the deep well region 21 along the 2 nd sidewall 22 on one side of the source trench 18. In this manner, the 2 nd width W β is a width in the 1 st direction X of the portion of the deep well region 21 along the 2 nd sidewall 22 on the other side of the source trench 18.

The aspect ratio D2/W2 of the trench source structure 11 is greater than the aspect ratio D1/W1 of the trench gate structure 10. The aspect ratio D2/W2 of the trench source structure 11 may be 0.5 or more and 18.0 or less.

The ratio D2/D1 of the depth D2 of the trench source structure 11 to the depth D1 of the trench gate structure 10 may be 1.5 or more and 4.0 or less. By increasing the depth D2 of the trench source structure 11, the withstand voltage holding effect of the sj (super junction) structure can also be improved.

The width W2 of the trench source structure 11 may be 0.6 μm or more and 2.4 μm or less (e.g., about 0.8 μm). The depth D2 of the trench source structure 11 may be 1.5 μm or more and 11 μm or less (e.g., about 2.5 μm). The width W2 of the trench source structure 11 may also be equal to the width W1 of the trench gate structure 10. The width W2 of the trench source structure 11 may also be different from the width W1 of the trench gate structure 10.

In the trench source construction 11, the source trench 18 has an aspect ratio DST/WST. The aspect ratio DST/WST of the source trench 18 is a ratio of the depth DST of the source trench 18 with respect to the width WST of the source trench 18.

The aspect ratio DST/WST of the source trench 18 is greater than the aspect ratio D1/W1 of the trench gate structure 10. The aspect ratio DST/WST of the source trench 18 may be 0.5 or more and 18.0 or less.

The width WST of the source trench 18 may be 0.2 μm or more and 2.0 μm or less (e.g., about 0.4 μm). The width WST of the source trench 18 may be equal to the width W1 of the gate trench 12 (WST — W1).

In the case where the width WST of the source trench 18 or the width W1 of the gate trench 12 differs in the depth direction, the width WST and the width W1 are defined as the width of the opening portion. The depth DST of the source trench 18 may be 1.0 μm or more and 10 μm or less (e.g., about 2.0 μm).

The ratio of the depth DST of the source trench 18 to the depth D1 of the trench gate structure 10 (gate trench 12) is preferably 2 or more. The ratio DST/D1 of the depth DST of the source trench 18 relative to the depth D1 of the trench gate construction 10 may also exceed 4.0. In this case, it is necessary to take care of the durability of the resist mask used when forming the source trench 18 by the etching method.

For example, in the case where the depth D1 of the trench gate structure 10 is about 3.0 μm and exceeds DST/D1 by more than 4, it is assumed that the resist mask is close to the endurance limit due to etching or exceeds the endurance limit. If the resist mask exceeds the endurance limit, undesirable etching of SiC semiconductor layer 2 is caused.

Therefore, the ratio DST/D1 of the depth DST of the source trench 18 to the depth D1 of the trench gate structure 10 is preferably greater than 1.0 and 4.0 or less. If the ratio DST/D1 is within this range, the source trench 18 can be formed appropriately.

Fig. 3 is a cross-sectional view for explaining an operation of the semiconductor device 1 of fig. 1. In fig. 3, the same reference numerals are given to the same structures as those in fig. 2.

In the semiconductor device 1, a pn junction 45 is formed in a boundary region between the SiC semiconductor layer 2 and the deep well region 21. When the semiconductor device 1 is switched from the on state to the off state, the depletion layer 46 spreads from the pn junction 45 toward the SiC semiconductor layer 2. In fig. 3, the depletion layer 46 is shown by a two-dot chain line.

The deep well region 21 includes a1 st region 27 and a 2 nd region 28. The 1 st region 27 is formed along the 1 st wall portion 24 of the 2 nd sidewall 22 of the source trench 18. A 2 nd region 28 is formed along the 2 nd wall 25 of the 2 nd sidewall 22 of the source trench 18.

The depletion layer 46 from the pn junction 45 spreads in the SiC semiconductor layer 2 to the 1 st main surface 3 side of the 1 st bottom wall 16 of the gate trench 12. The depletion layer 46 from the pn junction 45 spreads in the SiC semiconductor layer 2 to the 2 nd main surface 4 side of the 1 st bottom wall 16 of the gate trench 12.

When the semiconductor device 1 is switched from the on state to the off state, the current path of the short-circuit current flowing from the drain electrode 7 to the source electrode layer 20 is narrowed by the depletion layer 46. This can delay the time until the semiconductor device 1 is destroyed.

In particular, according to the semiconductor device 1, the aspect ratio D2/W2 of the trench source structure 11 is larger than the aspect ratio D1/W1 of the trench gate structure 10. The aspect ratio D2/W2 of the trench source structure 11 is 0.5 to 18.0.

Further, a ratio D2/D1 of the depth D2 of the trench source structure 11 to the depth D1 of the trench gate structure 10 is 1.5 or more and 4.0 or less. The length of the 2 nd region 28 of the deep well region 21 is larger than the length of the 1 st region 27 of the deep well region 21 in the thickness direction of the SiC semiconductor layer 2.

Therefore, in the SiC semiconductor layer 2, the ratio of the region occupied by the depletion layer 46 expanding in the region on the 2 nd main surface 4 side can be reliably increased compared to the ratio of the region occupied by the depletion layer 46 expanding in the region on the 1 st main surface 3 side. This can reliably narrow the current path of the short-circuit current in the region on the drain electrode 7 side.

The depletion layer 46 from the pn junction 45 may overlap the 1 st bottom wall 16 of the gate trench 12. The depletion layer 46 on the 2 nd region 28 side of the deep well region 21 may also overlap the 1 st bottom wall 16 of the gate trench 12.

In this structure, the current path of the short-circuit current can be reliably narrowed in the region on the drain electrode 7 side. Of course, the depletion layer 46 on the 1 st region 27 side of the deep well region 21 may overlap the 1 st bottom wall 16 of the gate trench 12.

Further, according to semiconductor device 1, since the region occupied by depletion layer 46 in SiC semiconductor layer 2 can be increased, feedback capacitance Crss can be reduced in inverse proportion. The feedback capacitance Crss is a capacitance between the gate electrode layer 14 and the drain electrode 7.

As described above, according to the semiconductor device 1, the short-circuit tolerance is improved, and the feedback capacitance Crss can be reduced.

In addition, according to the semiconductor device 1, the barrier formation layer 19 is formed in the source trench 18. The barrier formation layer 19 has a potential barrier higher than that between the deep well region 21 and the source electrode layer 20.

Therefore, even if depletion layer 46 spreading from pn junction 45 between SiC semiconductor layer 2 and deep well region 21 contacts the inner wall surface of source trench 18, punch-through can be suppressed from occurring. This can suppress a leak current caused by punch-through.

In the absence of the barrier-forming layer 19, there is a tendency that punch-through can be clearly observed at the corner 26 of the source trench 18. This is because the depletion layer 46 spreads from the 2 nd sidewall 22 of the source trench 18 further along the 2 nd bottom wall 23 of the source trench 18.

Here, in the semiconductor device 1, the inner wall surface of the source trench 18 including the corner portion 26 is covered with the barrier formation layer 19. This can effectively suppress the occurrence of punch-through in the source trench 18.

In the semiconductor device 1, the depletion layer 46 is formed in a relatively wide region in the SiC semiconductor layer 2 from the viewpoint of the short-circuit tolerance and the design of the feedback capacitance Crss, but the barrier formation layer 19 can appropriately suppress the leakage current due to the depletion layer 46.

Fig. 4 is a graph showing drain current-drain voltage characteristics of the semiconductor device 1 of fig. 1. In FIG. 4, the vertical axis represents the drain current ID [ A/cm ]²]The horizontal axis represents the drain voltage VD V]. The drain current ID is a current (short-circuit current) flowing between the drain electrode 7 and the source electrode layer 20.

Curves L1 and L2 are shown in fig. 4. Both the curve L1 and the curve L2 were obtained by simulation. The curves L1 and L2 show changes in the drain current ID when the drain voltage VD in a predetermined range is applied to the drain electrode 7. The drain voltage VD ranges between 0V and 1000V.

A curve L1 shows the drain current-drain voltage characteristic of the semiconductor device of the reference example. The curve L2 represents the drain current-drain voltage characteristic of the semiconductor device 1. The semiconductor device of the reference example has the same structure as the semiconductor device 1 except that the depth D2 of the source trench 18 is equal to the depth D1 of the gate trench 12.

Referring to a curve L1, in the semiconductor device of the reference example, if the drain voltage VD exceeds 200V, the drain current ID exceeds 15000A/cm². On the other hand, referring to the curve L2, in the semiconductor device 1, the drain voltage VD is in the range between 0V and 1000VThe drain current ID is less than 15000A/cm²。

In the semiconductor device 1, the drain voltage VD is in the range of 400V to 1000V, and the drain current ID is 10000A/cm²Above and less than 15000A/cm²The range of (1).

When the drain voltage VD is observed to be 600V, the drain current ID of the semiconductor device 1 is reduced by about 45% from the drain current ID of the semiconductor device of the reference example.

From the simulation results, it was confirmed that the short-circuit tolerance can be significantly improved by forming deep well region 21 along source trench 18 deeper than gate trench 12.

Fig. 5 is a graph showing feedback capacitance-drain voltage characteristics of the semiconductor device 1 of fig. 1. In FIG. 5, the vertical axis represents the feedback capacitance Crss [ F/cm ]²]The horizontal axis represents the drain voltage VD V]。

In fig. 5, a curve L3 and a curve L4 are shown. Both the curve L3 and the curve L4 were obtained by simulation. The curves L3 and L4 show changes in the feedback capacitance Crss when the drain voltage VD is applied to the drain electrode 7 in a predetermined range. The drain voltage VD varies in a range between 0V and 1000V.

A curve L3 shows the feedback capacitance-drain voltage characteristic of the semiconductor device of the reference example. The curve L4 represents the feedback capacitance-drain voltage characteristic of the semiconductor device 1. The semiconductor device of the reference example has the same structure as the semiconductor device 1 except that the depth D2 of the source trench 18 is equal to the depth D1 of the gate trench 12.

Referring to a curve L3, in the semiconductor device of the reference example, the feedback capacitance Crss gradually decreases in the range of the drain voltage VD of 1V to 10V. In the semiconductor device of the reference example, the reduction rate of the feedback capacitance Crss is about 25% in the range of the drain voltage VD of 1V to 10V.

On the other hand, in the semiconductor device 1, the feedback capacitance Crss sharply decreases in the range of the drain voltage VD from 1V to 10V. When the drain voltage VD was observed to be 10V, the feedback capacitance Crss of the semiconductor device 1 was reduced by about 95% from that of the semiconductor device of the reference example. In the semiconductor device 1, the reduction rate of the feedback capacitance Crss is 95% or more and 99% or less in the range of the drain voltage VD of 1V to 10V.

From the simulation results, it was confirmed that the feedback capacitance Crss can be remarkably reduced by forming the deep well region 21 along the source trench 18 deeper than the gate trench 12. That is, it was confirmed that the switching speed can be remarkably improved by the decrease of the feedback capacitance Crss.

Fig. 6 is a cross-sectional view showing a semiconductor device 51 according to embodiment 2 of the present invention. Hereinafter, the structures corresponding to the structures of the semiconductor device 1 will be denoted by the same reference numerals and their description will be omitted.

Referring to fig. 6, the source region 31 is exposed from the 1 st sidewall 15 of the gate trench 12 and the 2 nd sidewall 22 of the source trench 18. Contact regions 32 are formed in the deep well region 21 at regions along the 2 nd bottom wall 23 of the source trench 18. The contact region 32 is exposed from the 2 nd bottom wall 23 of the source trench 18.

The contact region 32 may also cover the entire 2 nd bottom wall 23 of the source trench. The p-type impurity concentration of the contact region 32 is larger than that of the deep well region 21.

Fig. 6 shows an example in which the barrier formation layer 19 is formed of a conductive barrier formation layer. The barrier formation layer 19 is formed along the inner wall surface of the source trench 18, and selectively exposes the contact region 32 from the No. 2 bottom wall 23 of the source trench 18.

More specifically, the barrier-forming layer 19 includes a1 st portion 52 and a 2 nd portion 53. The No. 1 portion 52 of the barrier-forming layer 19 wraps around the No. 2 sidewalls 22 of the source trench 18. The 2 nd portion 53 of the barrier-forming layer 19 partially wraps the 2 nd bottom wall 23 of the source trench 18.

The 2 nd portion 53 of the barrier-forming layer 19 is connected to the 1 st portion 52 of the barrier-forming layer 19. The 2 nd portion 53 of the barrier-forming layer 19 extends from the corner 26 of the source trench 18 along the 2 nd bottom wall 23.

The 2 nd portion 53 of the barrier-forming layer 19 exposes the central portion of the 2 nd bottom wall 23 of the source trench 18. The 2 nd portion 53 of the barrier-forming layer 19 may be formed in an unbroken dot shape (ring shape) in a plan view.

As described above, the semiconductor device 51 can achieve the same effects as those described for the semiconductor device 1. In addition, according to the semiconductor device 51, even if the depletion layer 46 spreads from the corner 26 of the source trench 18 along the No. 2 bottom wall 23, the distance from the depletion layer 46 to the source electrode layer 20 can be obtained by the barrier formation layer 19. This can suppress the occurrence of punch-through in the vicinity of corner 26 of source trench 18.

Fig. 7 is a cross-sectional view showing a semiconductor device 61 according to embodiment 3 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 51 will be referred to by the same reference numeral and the description thereof will be omitted.

An exposed portion 62 that selectively exposes the 2 nd bottom wall 23 of the source trench 18 is formed in the deep well region 21. More specifically, the 2 nd region 28 of the deep well region 21 is formed along the corner 26 of the source trench 18 so as to expose the central portion of the 2 nd bottom wall 23 of the source trench 18. The 2 nd region 28 of the deep well region 21 may be formed in an unbroken dot shape (ring shape) in a plan view.

In this manner, the contact region 32 is not formed. The contact region 32 may be formed in a region along the 2 nd sidewall 22 of the source trench 18 at a surface layer portion of the body region 30.

The source electrode layer 20 forms a heterojunction with the SiC semiconductor layer 2 at the exposed portion 62 of the deep well region 21. Thereby, a heterojunction diode 63 is formed with the source electrode layer 20 as an anode and the SiC semiconductor layer 2 as a cathode.

The source electrode layer 20 may also comprise conductive polysilicon. Of course, the source electrode layer 20 may contain a conductive material other than conductive polysilicon as long as the heterojunction diode 63 can be formed.

A body diode 64 is formed at the pn junction between the SiC semiconductor layer 2 and the body region 30. The junction barrier of the heterojunction diode 63 is smaller than the diffusion potential of the body diode 64. The junction barrier of the heterojunction diode 63 may be 1.0eV or more and 1.5eV or less. The diffusion potential of the body diode 64 may be 2.8eV or more and 3.2eV or less.

As described above, according to the semiconductor device 61, the same effects as those described for the semiconductor device 51 can be obtained. In the semiconductor device 61, when a reverse bias voltage is applied, a current can preferentially flow into the heterojunction diode 63. This can suppress the expansion of the SiC crystal defects in the SiC semiconductor layer 2. As a result, the increase in the on-resistance can be suppressed while improving the short-circuit tolerance and reducing the feedback capacitance Crss.

Fig. 8 is a cross-sectional view showing a semiconductor device 71 according to embodiment 4 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 51 will be referred to by the same reference numeral and the description thereof will be omitted.

The barrier-forming layer 19 has a stacked structure including a plurality of barrier-forming layers formed along the inner wall of the source trench 18. In this embodiment, the barrier-forming layer 19 has a laminated structure including an insulating barrier-forming layer 72 and a conductive barrier-forming layer 73 which are laminated in this order from the inner wall of the source trench 18.

The insulating barrier formation layer 72 is formed in a film shape along the inner wall surface of the source trench 18. The insulating barrier formation layer 72 selectively exposes the contact region 32 from the No. 2 bottom wall 23 of the source trench 18.

More specifically, the insulating barrier formation layer 72 includes a1 st portion 74 and a 2 nd portion 75. The 1 st portion 74 wraps around the 2 nd sidewall 22 of the source trench 18. The 2 nd portion 75 selectively covers the 2 nd bottom wall 23 of the source trench 18.

The 2 nd portion 75 is connected to the 1 st portion 74. The 2 nd portion 75 extends from the corner 26 of the source trench 18 along the 2 nd bottom wall 23 so as to expose the central portion of the 2 nd bottom wall 23 of the source trench 18.

The insulating barrier formation layer 72 may contain at least one of impurity-free added silicon, silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, and aluminum oxynitride.

The conductive barrier formation layer 73 is formed in a film shape along the insulating barrier formation layer 72 so that the contact region 32 is selectively exposed from the No. 2 bottom wall 23 of the source trench 18. The conductive barrier formation layer 73 contains a conductive material different from that of the source electrode layer 20.

The conductive barrier formation layer 73 may be formed of the same conductive material as that of the gate electrode layer 14. The conductive barrier formation layer 73 may also contain at least one of conductive polysilicon, tungsten, platinum, nickel, cobalt, or molybdenum.

As described above, the semiconductor device 71 can achieve the same effects as those described for the semiconductor device 51. In the semiconductor device 71, the barrier-forming layer 19 has a laminated structure including an insulating barrier-forming layer 72 and a conductive barrier-forming layer 73. This can suppress the occurrence of punch-through by the two layers of the insulating barrier-forming layer 72 and the conductive barrier-forming layer 73.

If the conductive material of the conductive barrier formation layer 73 is the same as the conductive material of the gate electrode layer 14, the gate electrode layer 14 and the conductive barrier formation layer 73 can be formed by the same step. Therefore, the increase in man-hours can be suppressed.

Fig. 9 is a cross-sectional view showing a semiconductor device 81 according to embodiment 5 of the present invention. Hereinafter, the structures corresponding to the structures of the semiconductor device 1 will be denoted by the same reference numerals and their description will be omitted.

The barrier-forming layer 19 includes a1 st portion 82 and a 2 nd portion 83. The No. 1 portion 82 of the barrier-forming layer 19 wraps around the No. 2 sidewalls 22 of the source trench 18. The 2 nd portion 83 of the barrier-forming layer 19 wraps the 2 nd bottom wall 23 of the source trench 18.

The 1 st portion 82 of the barrier-forming layer 19 selectively has a sidewall contact hole 84 exposing the SiC semiconductor layer 2 from the 2 nd sidewall 22 of the source trench 18. Portion 182 covers first wall portion 24 of source trench 18 and exposes second wall portion 25.

Portion 182 may also be formed to cross the boundary region between SiC semiconductor layer 2 and body region 30. In the 1 st portion 82, the end portion on the 2 nd main surface 4 side may be formed in a region deeper than the bottom portion of the body region 30.

In the 1 st portion 82, the end portion on the 2 nd main surface 4 side may be formed in a region shallower than the bottom portion of the body region 30. In the 1 st portion 82, the end portion on the 2 nd main surface 4 side may be formed in a region between the bottom of the body region 30 and the bottom of the contact region 32. In the above case, the source electrode layer 20 is connected to at least the body region 30 in the source trench 18.

In the 1 st portion 82, the end portion on the 2 nd main surface 4 side may be formed in a region between the 1 st main surface 3 of the SiC semiconductor layer 2 and the bottom portion of the contact region 32. The barrier-forming layer 19 may have no part 182 but only part 2 83. In the above case, the source electrode layer 20 is connected to the body region 30 and the contact region 32 in the source trench 18.

The 2 nd part 83 of the barrier-forming layer 19 is formed at an interval from the 1 st part 82 of the barrier-forming layer 19. The 2 nd portion 83 is separated from the 1 st portion 82. Portion 283 may also wrap around corners 26 of source trenches 18.

Portion 283 may also expose corners 26 of source trenches 18. Portion 283 may also wrap around corner 26 of source trench 18 and may also wrap around a portion of sidewall 222 of source trench 18.

The source electrode layer 20 forms a schottky junction within the source trench 18 and between the SiC semiconductor layers 2. As a result, a schottky barrier diode 85 having the source electrode layer 20 as an anode and the SiC semiconductor layer 2 as a cathode is formed.

The source electrode layer 20 may be formed of the same conductive material as the main-surface source electrode 42. The source electrode layer 20 and the main-surface source electrode 42 may be formed of aluminum or a metal material containing aluminum as a main component.

The source electrode layer 20 and the main-surface source electrode 42 may include at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten. In this case, the gate electrode layer 14 is preferably formed of polysilicon (n-type polysilicon or p-type polysilicon).

A p-type deep well region 21 is formed in the SiC semiconductor layer 2 in a region along the 2 nd bottom wall 23 of the source trench 18. Deep well region 21 may be formed continuously in SiC semiconductor layer 2 in a region along 2 nd sidewall 22 and corner 26 of source trench 18 so that source electrode layer 20 is exposed from 2 nd sidewall 22 of source trench 18.

That is, the deep well region 21 covers the 2 nd bottom wall 23 of the source trench 18. In addition, the deep well region 21 covers a corner 26 of the source trench 18 connecting the 2 nd side wall 22 and the 2 nd bottom wall 23. The deep well region 21 may expose substantially the entire 2 nd side wall 22 of the source trench 18 in the SiC semiconductor layer 2.

The deep well region 21 is drawn from the 2 nd bottom wall 23 of the source trench 18 in the lateral direction parallel to the 1 st main surface 3 of the SiC semiconductor layer 2. Thus, the deep well region 21 faces the body region 30 across a partial region of the SiC semiconductor layer 2 in the normal direction of the first main surface 3 of the SiC semiconductor layer 2.

More specifically, the source electrode layer 20 is located at a depth position between the body region 30 and the deep well region 21 in a normal direction of the 1 st main surface 3 of the SiC semiconductor layer 2, and forms a schottky junction with the SiC semiconductor layer 2.

More specifically, in the normal direction of the 1 st main surface 3 of the SiC semiconductor layer 2, the source electrode layer 20 forms schottky junction with the SiC semiconductor layer 2 in the region sandwiched by the body region 30 and the deep well region 21 in the SiC semiconductor layer 2.

The width W2 of the trench source structure 11 may also coincide with the width WST of the source trench 18. That is, both the 1 st width W α and the 2 nd width W β of the deep well region 21 may be zero.

As described above, the semiconductor device 81 can achieve the same effects as those described for the semiconductor device 1. In addition, in the semiconductor device 81, when a reverse bias voltage is applied, a current can preferentially flow like the schottky barrier diode 85. This can suppress the propagation of SiC crystal defects in the SiC semiconductor layer 2. As a result, the short-circuit tolerance can be improved, the feedback capacitance Crss can be reduced, and the increase in the on-resistance can be suppressed.

In this embodiment, an example in which the source electrode layer 20 forms a schottky junction with the SiC semiconductor layer 2 in the sidewall contact hole 84 of the barrier formation layer 19 is described. However, the barrier formation layer 19 (the 1 st portion 82 and the 2 nd portion 83) may not be formed.

Fig. 10 is a plan view of a semiconductor device 91 according to embodiment 6 of the present invention. Hereinafter, the structures corresponding to the structures of the semiconductor device 1 will be denoted by the same reference numerals and their description will be omitted.

Referring to fig. 10, in this embodiment, trench gate structure 10 is formed in a lattice shape in a plan view. Trench source structure 11 may also be formed in the region surrounded by trench gate structure 10.

Source regions 31 may also be formed along the periphery of trench gate structure 10. Contact region 32 may also be formed along the periphery of trench source structure 11.

As described above, the semiconductor device 91 can also exhibit the same effects as those described for the semiconductor device 1. Further, according to the semiconductor device 91, the density of the current flowing through the SiC semiconductor layer 2 can be increased.

The structure of the semiconductor device 91 can be applied to the above embodiments. That is, the structure in which trench gate structure 10 is formed in a lattice shape in a plan view and trench source structure 11 is formed in a region surrounded by trench gate structure 10 can be applied to each of the above-described embodiments.

Although embodiments 1 to 6 of the present invention have been described, embodiments 1 to 6 of the present invention can be implemented in other ways.

In embodiments 1 to 6 described above, the barrier-forming layer 19 may selectively expose the SiC semiconductor layer 2 from the 2 nd side wall 22 of the source trench 18. For example, the barrier formation layer 19 may expose at least one of the contact region 32, the source region 31, and the body region 30 in the source trench 18.

In embodiments 1 to 6, the barrier formation layer 19 may be omitted.

In embodiments 1 to 6 described above, the gate trench 12 may be formed in a tapered shape in which the area of the 1 st bottom wall 16 is smaller than the opening area in cross section.

In embodiments 1 to 6 described above, the 1 st bottom wall 16 of the gate trench 12 may be formed parallel to the 1 st main surface 3 of the SiC semiconductor layer 2. The 1 st bottom wall 16 of the gate trench 12 may be formed in a convex curved shape from the 1 st side wall 15 toward the 2 nd main surface 4 of the SiC semiconductor layer 2.

In embodiments 1 to 6 described above, the source trench 18 may be formed in a tapered shape in which the area of the 2 nd bottom wall 23 is smaller than the opening area in cross section.

In embodiments 1 to 6 described above, the 2 nd bottom wall 23 of the source trench 18 may be formed parallel to the 1 st main surface 3 of the SiC semiconductor layer 2. The 2 nd bottom wall 23 of the source trench 18 may be formed in a convex curved shape extending outward from the 2 nd side wall 22.

In embodiments 1 to 6 described above, instead of SiC semiconductor layer 2 made of SiC single crystal, Si semiconductor layer 2 made of Si (silicon) may be used. That is, the Si semiconductor layer (2) may have a laminated structure including a Si semiconductor substrate (5) made of Si and a Si epitaxial layer (6) made of Si.

In the above-described embodiments 1 to 6, a structure in which the conductivity type of each semiconductor portion is inverted may be employed. That is, the p-type portion may be formed as an n-type, the n-type portion may be formed as a p-type.

In embodiments 1 to 6 described above, a p + -type SiC semiconductor substrate (5) may be used instead of the n + -type SiC semiconductor substrate 5. According to this configuration, an igbt (insulated Gate Bipolar transistor) can be provided instead of the MISFET.

In this case, the "source" of the MISFET is replaced with the "emitter" of the IGBT. In addition, the "drain" of the MISFET is replaced with the "collector" of the IGBT. Even when the MISFET is replaced with the IGBT, the same effects as those described in the above embodiments can be obtained.

Fig. 11 is a plan view showing a semiconductor device 101 according to embodiment 7 of the present invention.

Referring to fig. 11, semiconductor device 101 includes SiC semiconductor layer 102 including SiC (silicon carbide) single crystal. The SiC semiconductor layer 102 may also include 4H — SiC single crystal.

The 4H-SiC single crystal has an off-angle inclined from the (0001) plane at an angle of 10 DEG or less with respect to the [ 11-20 ] direction. The deflection angle may be 0 ° or more and 4 ° or less. The declination angle may also be greater than 0 ° and less than 4 °. Typically, the off-angle is set to 2 ° or 4 °, more specifically, to a range of 2 ° ± 0.2 ° or a range of 4 ° ± 0.4 °.

In this embodiment, the SiC semiconductor layer 102 is formed in a rectangular parallelepiped sheet shape. The SiC semiconductor layer 102 has a1 st main surface 103 on one side, a 2 nd main surface 104 on the other side, and side surfaces 105A, 105B, 105C, and 105D connecting the 1 st main surface 103 and the 2 nd main surface 104.

The 1 st main surface 103 and the 2 nd main surface 104 are formed in a quadrangular shape in a plan view (hereinafter simply referred to as "plan view") viewed from the normal direction described above. Side surface 105A is opposite to side surface 105C. Side surface 105B is opposite to side surface 105D.

The side surfaces 105A to 105D extend in a plane in the normal direction of the 1 st main surface 103 and the 2 nd main surface 104, respectively. The lengths of the side surfaces 105A to 105D may be 1mm or more and 10mm or less (for example, 2mm or more and 5mm or less), respectively.

An active region 106 and an outer region 107 are provided in the SiC semiconductor layer 102. The active region 106 is a region in which a vertical misfet (metal Insulator Semiconductor Field effect transistor) is formed. The outer region 107 is a region outside the active region 106.

Active region 106 is set in the central portion of SiC semiconductor layer 102 with an interval from side surfaces 105A to 105D of SiC semiconductor layer 102 toward the inner region of SiC semiconductor layer 102 in a plan view. Active region 106 is formed in a quadrilateral shape having four sides parallel to four side surfaces 105A to 105D of SiC semiconductor layer 102 in a plan view.

Outer region 107 is set in a region between side surfaces 105A to 105D of SiC semiconductor layer 102 and the periphery of active region 106. Outer region 107 is set to be a dot-like shape (a rectangular ring shape) surrounding active region 106 in a plan view.

On the 1 st main surface 103 of the SiC semiconductor layer 102, a gate pad 108, a gate finger 109, and a source pad 110 are formed as 1 st main surface electrodes. In fig. 11, the gate pad 108, the gate finger 109, and the source pad 110 are shown by hatching for clarity. Gate pad 108, gate finger 109, and source pad 110 may also comprise aluminum or copper.

Gate pad 108 is formed along side surface 105A of SiC semiconductor layer 102 in a plan view. Gate pad 108 is formed along a central region of side surface 105A of SiC semiconductor layer 102 in a plan view. Gate pad 108 may be formed along two corner portions connecting any of four side surfaces 105A to 105D of SiC semiconductor layer 102 in a plan view.

The gate pad 108 is formed in a quadrangular shape in a plan view. Gate pad 108 is drawn from outer region 107 into active region 106 so as to cross the boundary region between outer region 107 and active region 106 in a plan view.

Gate fingers 109 are formed in the outer regions 107. The gate finger 109 is led out from the gate pad 108 and extends in a stripe shape in the outer region 107. In this manner, the gate finger 109 is formed along the three side surfaces 105A, 105B, and 105D of the SiC semiconductor layer 102 so as to divide the active region 106 from three directions.

Source pad 110 is formed in active region 106 at an interval from gate pad 108 and gate finger 109. The source pad 110 is formed in a concave shape in a plan view so as to cover a concave region defined by the gate pad 108 and the gate finger 109.

A gate voltage is applied to the gate pad 108 and the gate finger 109. The gate voltage may be 10V or more and 50V or less (for example, about 30V). A source voltage is applied to the source pad 110. The source voltage may also be a reference voltage (e.g., GND voltage).

Fig. 12 is an enlarged view of a region XII shown in fig. 11, and is an enlarged view for explaining the structure of the 1 st main surface 103 of the SiC semiconductor layer 102. Fig. 13 is a sectional view taken along line XIII-XIII shown in fig. 12. Fig. 14 is a sectional view taken along the line XIV-XIV shown in fig. 12.

Referring to fig. 12 to 14, in this embodiment, SiC semiconductor layer 102 has a stacked structure including n + -type SiC semiconductor substrate 111 and n-type SiC epitaxial layer 112. The 2 nd main surface 104 of the SiC semiconductor layer 102 is formed by the SiC semiconductor substrate 111.

The 1 st main surface 103 of the SiC semiconductor layer 102 is formed by the SiC epitaxial layer 112. The 2 nd main surface 104 of the SiC semiconductor layer 102 may be a polished surface. The 2 nd main surface 104 of the SiC semiconductor layer 102 may have polishing marks.

The thickness of the SiC semiconductor substrate 111 may be 1 μm or more and less than 1000 μm. The thickness of the SiC semiconductor substrate 111 may be 5 μm or more. The thickness of the SiC semiconductor substrate 111 may be 25 μm or more. The thickness of the SiC semiconductor substrate 111 may be 50 μm or more. The thickness of the SiC semiconductor substrate 111 may be 100 μm or more.

The thickness of the SiC semiconductor substrate 111 may be 700 μm or less. The thickness of the SiC semiconductor substrate 111 may be 500 μm or less. The thickness of the SiC semiconductor substrate 111 may be 400 μm or more. The thickness of the SiC semiconductor substrate 111 may be 300 μm or less.

The thickness of the SiC semiconductor substrate 111 may be 250 μm or less. The thickness of the SiC semiconductor substrate 111 may be 200 μm or less. The thickness of the SiC semiconductor substrate 111 may be 150 μm or less. The thickness of the SiC semiconductor substrate 111 may be 100 μm or less.

The thickness of the SiC semiconductor substrate 111 is preferably 150 μm or less. By reducing the thickness of the SiC semiconductor substrate 111, the resistance value can be reduced by shortening the current path.

The thickness of the SiC epitaxial layer 112 may be 1 μm or more and 100 μm or less. The thickness of the SiC epitaxial layer 112 may be 5 μm or more. The thickness of the SiC epitaxial layer 112 may be 10 μm or more.

The thickness of the SiC epitaxial layer 112 may be 50 μm or less. The thickness of the SiC epitaxial layer 112 may be 40 μm or less. The thickness of the SiC epitaxial layer 112 may be 30 μm or less.

The thickness of the SiC epitaxial layer 112 may be 20 μm or less. The thickness of the SiC epitaxial layer 112 is preferably 15 μm or less. The thickness of the SiC epitaxial layer 112 is preferably 10 μm or less.

The n-type impurity concentration of the SiC epitaxial layer 112 is equal to or less than the n-type impurity concentration of the SiC semiconductor substrate 111. More specifically, the n-type impurity concentration of the SiC epitaxial layer 112 is smaller than the n-type impurity concentration of the SiC semiconductor substrate 111.

The n-type impurity concentration of the SiC semiconductor substrate 111 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following. The n-type impurity concentration of the SiC epitaxial layer 112 may also be 1.0 × 10¹⁵cm^－3Above and 1.0X 10¹⁸cm^－3The following. In this embodiment, the SiC epitaxial layer 112 has a plurality of regions having different n-type impurity concentrations in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

More specifically, the SiC epitaxial layer 112 includes high concentration regions 112a in which the n-type impurity concentration is relatively high, and low concentration regions 112b in which the n-type impurity concentration is low with respect to the high concentration regions 112 a. The high concentration region 112a is formed in the region on the 1 st main surface 103 side. The low concentration regions 112b are formed in regions on the SiC semiconductor substrate 111 side with respect to the high concentration regions 112 a.

The n-type impurity concentration of the high concentration region 112a may be 1 × 10¹⁶cm^－3Above and 1 × 10¹⁸cm^－3The following. The n-type impurity concentration of the low concentration region 112b may be 1 × 10¹⁵cm^－3Above and 1 × 10¹⁶cm + or less. The thickness of the high concentration region 112a is equal to or less than the thickness of the low concentration region 112 b. More specifically, the thickness of the high concentration region 112a is smaller than that of the low concentration region 112 b.

A drain pad 113 as a 2 nd main surface electrode is connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. The maximum voltage that can be applied between the source pad 110 and the drain pad 113 during the off state may be 1000V or more and 10000V or less.

The SiC semiconductor substrate 111 is formed as a drain region 114 of the MISFET. The SiC epitaxial layer 112 is formed as a drift region 115 of the MISFET.

In the active region 106, a p-type body region 116 is formed in a surface layer portion of the 1 st main surface 103 of the SiC semiconductor layer 102. The p-type impurity concentration of the body region 116 may be 1 × 10¹⁷cm^－3Above and 1 × 10²⁰cm^－3The following. The active region 106 is delimited by a body region 116.

In the active region 106, a plurality of gate trenches 121 are formed in the surface layer portion of the 1 st main surface 103 of the SiC semiconductor layer 102. The plurality of gate trenches 121 are formed at intervals in an arbitrary 1 st direction X. The plurality of gate trenches 121 are formed in a stripe shape extending in the 2 nd direction Y intersecting the 1 st direction X.

More specifically, the 1 st direction X is a direction along the side surfaces 105B and 105D of the SiC semiconductor layer 102. The 2 nd direction Y is a direction orthogonal to the 1 st direction X. The 2 nd direction Y is also a direction along the side surfaces 105A, 105C of the SiC semiconductor layer 102.

The plurality of gate trenches 121 are formed in a stripe shape in a plan view. In this embodiment, each gate trench 121 extends in a stripe shape from the peripheral edge portion of one side (the side surface 105B side) toward the peripheral edge portion of the other side (the side surface 105D side) on the 1 st main surface 103 of the SiC semiconductor layer 102 in a plan view.

Each gate trench 121 extends across an intermediate portion between a peripheral edge portion on one side of the 1 st main surface 103 and a peripheral edge portion on the other side of the 1 st main surface 103 in a plan view. One end of each gate trench 121 is located at a peripheral edge portion of the SiC semiconductor layer 102 on the 1 st main surface 103 side. The other end of each gate trench 121 is located at the peripheral edge portion of the 1 st main surface 103 of the SiC semiconductor layer 102 on the other side.

The 1 st direction X may also be set to the [ 11-20 ] direction ([ -1-120 ] direction). In this case, each gate trench 121 may extend in the [ 11-20 ] direction. The 1 st direction X may be set to the direction [ -1100 ] ([ 1-100 ] direction) orthogonal to the [ 11-20 ] direction. In this case, each gate trench 121 may extend in the [ -1100 ] direction ([ 1-100 ] direction).

Each gate trench 121 has a length on the order of millimeters (a length of 1mm or more). In the cross section shown in fig. 14, the length of the gate trench 121 is from the end on the side of the connection portion of the gate trench 121 and the gate finger 109 to the end on the opposite side.

The length of each gate trench 121 may be 0.5mm or more. In this embodiment, the length of each gate trench 121 is 1mm or more and 10mm or less (for example, 2mm or more and 5mm or less). The total extension of the one or more gate trenches 121 per unit area may also be 0.5 μm/μm²Above and 0.75 μm/μm²The following.

Each gate trench 121 integrally includes an active trench portion 121a and a contact trench portion 121 b. The active trench portion 121a is a portion where the gate trench 121 is formed in the active region 106. The contact groove 121b is a portion of the gate trench 121 drawn out from the active groove 121a to the outer region 107.

Each gate trench 121 penetrates through the body region 116 up to the SiC epitaxial layer 112. The bottom wall of each gate trench 121 is located within the SiC epitaxial layer 112. More specifically, the bottom wall of each gate trench 121 is located in the high concentration region 112a of the SiC epitaxial layer 112.

The depth of the gate trench 121 may be 0.5 μm or more and 3 μm or less (e.g., about 1 μm) in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102. The depth of the gate trench 121 is preferably 0.5 μm or more and 1.0 μm or less.

The width of the gate trench 121 in the 1 st direction may be 0.1 μm or more and 2 μm or less (e.g., about 0.5 μm). The 1 st direction width of the gate trench 121 is preferably 0.1 μm or more and 0.5 μm or less.

Referring to fig. 13 and 14, the opening edge 124 of each gate trench 121 includes a bent portion 125 bent inward of the gate trench 121. The opening edge 124 of the gate trench 121 is a corner portion connecting the 1 st main surface 103 of the SiC semiconductor layer 102 and the sidewall of the gate trench 121.

The electric field of the gate trench 121 with respect to the opening edge portion 124 is dispersed along the bent portion 125. This can alleviate electric field concentration in the gate trench 121 with respect to the opening edge portion 124.

An n + -type source region 126 is formed in a surface layer portion of the body region 116 in a region along the sidewall of the gate trench 121. The n-type impurity concentration of the source region 126 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following.

A plurality of source regions 126 are formed along the sidewall of one side and the sidewall of the other side of the gate trench 121 in the 1 st direction X. The plurality of source regions 126 are formed in stripe shapes extending in the 2 nd direction Y, respectively. The plurality of source regions 126 are formed in a stripe shape in a plan view.

In each gate trench 121, a gate insulating layer 131 and a gate electrode layer 132 are formed. For clarity, in fig. 12, the gate insulating layer 131 and the gate electrode layer 132 are shown by hatching.

The gate insulating layer 131 may also include silicon oxide. The gate insulating layer 131 may also include another insulating film such as silicon nitride. The gate insulating layer 131 is formed in a film shape along the inner wall surface of the gate trench 121 so as to define a concave space in the gate trench 121.

The gate insulating layer 131 includes a1 st region 131a, a 2 nd region 131b, and a 3 rd region 131 c. The 1 st region 131a is formed along sidewalls of the gate trench 121. The 2 nd region 131b is formed along the bottom wall of the gate trench 121. The 3 rd region 131c is formed along the 1 st main surface 103 of the SiC semiconductor layer 102.

The thickness T1 of the 1 st region 131a is smaller than the thickness T2 of the 2 nd region 131b and the thickness T3 of the 3 rd region 131 c. The ratio T2/T1 of the thickness T2 of the 2 nd region 131b to the thickness T1 of the 1 st region 131a may be 2 or more and 5 or less. The ratio T3/T1 of the thickness T3 of the 3 rd region 131c to the thickness T1 of the 1 st region 131a may be 2 or more and 5 or less.

The thickness T1 of the 1 st region 131a may be 0.01 μm or more and 0.2 μm or less. The thickness T2 of the 2 nd region 131b may be 0.05 μm or more and 0.5 μm or less. The thickness T3 of the 3 rd region 131c may be 0.05 μm or more and 0.5 μm or less.

By forming the 1 st region 131a of the gate insulating layer 131 to be thin, increase of carriers induced in the region near the side wall of the gate trench 121 in the body region 116 can be suppressed. This can suppress an increase in channel resistance. By forming the 2 nd region 131b of the gate insulating layer 131 to be thick, the electric field concentration of the gate trench 121 with respect to the bottom wall can be relaxed.

By forming the 3 rd region 131c of the gate insulating layer 131 to be thick, the withstand voltage of the gate insulating layer 131 in the vicinity of the opening edge 124 of the gate trench 121 can be improved. Further, by forming the 3 rd region 131c to be thick, the 3 rd region 131c can be prevented from being lost by the etching method.

This can prevent the 1 st region 131a from being removed by etching due to the disappearance of the 3 rd region 131 c. As a result, gate electrode layer 132 can be appropriately opposed to SiC semiconductor layer 102 with gate insulating layer 131 interposed therebetween.

The gate electrode layer 132 is buried in the gate trench 121 with the gate insulating layer 131 interposed therebetween. More specifically, the gate electrode layer 132 is buried in the gate trench 121 so as to fill the concave space defined by the gate insulating layer 131. The gate electrode layer 132 is controlled by a gate voltage.

Referring to fig. 13 and 14, gate electrode layer 132 is formed in a wall shape that is orthogonal to the direction in which gate trench 121 extends and that extends in the direction normal to first main surface 103 of SiC semiconductor layer 102 in cross section.

The gate electrode layer 132 has an upper end portion located on the opening side of the gate trench 121. The upper end portion of the gate electrode layer 132 is formed in a curved shape recessed toward the bottom wall of the gate trench 121.

The cross-sectional area of gate electrode layer 132 (cross-sectional area perpendicular to the direction in which gate trench 121 extends) may be 0.05 μm²Above and 0.5 μm²The following. The cross-sectional area of gate electrode layer 132 is defined by the product of the depth of gate electrode layer 132 and the width of gate electrode layer 132.

The depth of the gate electrode layer 132 is a distance from the upper end to the lower end of the gate electrode layer 132. The width of the gate electrode layer 132 is the width of the trench at an intermediate position between the upper end portion and the lower end portion of the gate electrode layer 132. When the upper end portion is a curved surface (in this embodiment, a curved shape recessed toward the lower side), the position of the upper end portion of the gate electrode layer 132 becomes the middle position in the depth direction of the upper surface of the gate electrode layer 132.

The gate electrode layer 132 includes p-type polysilicon to which p-type impurities are added. The p-type impurity may contain at least one of boron (B), aluminum (Al), indium (In), and gallium (Ga).

The p-type impurity concentration of gate electrode layer 132 is equal to or higher than the p-type impurity concentration of body region 116. More specifically, the p-type impurity concentration of the gate electrode layer 132 is greater than the p-type impurity concentration of the body region 116.

The p-type impurity concentration of the gate electrode layer 132 may be 1 × 10¹⁸cm^－3Above and 1 × 10²²cm^－3The following. The sheet resistance of the gate electrode layer 132 may be 10 Ω/□ or more and 500 Ω/□ or less (200 Ω/□ or less in this embodiment).

Referring to fig. 14, a gate wiring layer 133 is formed in the outer region 107. The gate wiring layer 133 is electrically connected to the gate pad 108 and the gate finger 109.

The gate wiring layer 133 is formed on the 1 st main surface 103 of the SiC semiconductor layer 102. More specifically, the gate wiring layer 133 is formed on the 3 rd region 131c of the gate insulating layer 131.

In this manner, the gate wiring layer 133 is formed along the gate fingers 109. The gate wiring layer 133 is formed along the three side surfaces 105A, 105B, and 105D of the SiC semiconductor layer 102 so as to divide the active region 106 from three directions.

The gate wiring layer 133 is connected to the gate electrode layer 132 exposed from the contact groove portion 121b of each gate groove 121. In this embodiment, the gate wiring layer 133 is formed of a lead portion led from the gate electrode layer 132 onto the 1 st main surface 103 of the SiC semiconductor layer 102. The upper end of the gate wiring layer 133 is connected to the upper end of the gate electrode layer 132.

Referring to fig. 13, a low-resistance electrode layer 134 is formed over the gate electrode layer 132. The low-resistance electrode layer 134 covers the upper end portion of the gate electrode layer 132 within the gate trench 121.

The low-resistance electrode layer 134 contains a conductive material having a sheet resistance smaller than that of the gate electrode layer 132. The sheet resistance of the low-resistance electrode layer 134 may be 0.01 Ω/□ or more and 10 Ω/□ or less.

The current supplied into the gate trench 121 flows through the low-resistance electrode layer 134 having a relatively low sheet resistance, and is transferred to the entire gate electrode layer 132. This makes it possible to quickly shift the entire gate electrode layer 132 (the entire active region 106) from the off state to the on state, and thus to suppress a delay in switching response.

In particular, in the case of the gate trench 121 having a length on the order of millimeters, time is required for the passage of current, but delay in switching response can be appropriately suppressed according to the low-resistance electrode layer 134. That is, the low-resistance electrode layer 134 is formed as a current diffusion electrode layer that diffuses current in the gate trench 121.

Further, as the cell structure is miniaturized, the width, depth, cross-sectional area, and the like of the gate electrode layer 132 are reduced, and therefore, there is a concern that the switching response is delayed due to an increase in resistance in the gate trench 121.

However, since the low-resistance electrode layer 134 can quickly shift the entire gate electrode layer 132 from the off state to the on state, delay in switching response due to miniaturization can be appropriately suppressed.

The low-resistance electrode layer 134 is formed in a film shape. The low-resistance electrode layer 134 has a connection portion 134a in contact with the upper end portion of the gate electrode layer 132 and an opposite non-connection portion 134 b. The connection portion 134a and the non-connection portion 134b of the low-resistance electrode layer 134 may be formed in a curved shape in conformity with the upper end portion of the gate electrode layer 132. The connection portion 134a and the non-connection portion 134b of the low-resistance electrode layer 134 can be formed in various manners.

The entire connecting portion 134a of the low-resistance electrode layer 134 may be located above the 1 st main surface 103 of the SiC semiconductor layer 102. The entire connection portion 134a of the low-resistance electrode layer 134 may be located below the 1 st main surface 103 of the SiC semiconductor layer 102.

The connection portion 134a of the low-resistance electrode layer 134 may include a portion located above the 1 st main surface 103 of the SiC semiconductor layer 102. The connection portion 134a of the low-resistance electrode layer 134 may include a portion located below the 1 st main surface 103 of the SiC semiconductor layer 102.

For example, the central portion of the connection portion 134a of the low-resistance electrode layer 134 may be located below the 1 st main surface 103 of the SiC semiconductor layer 102, and the peripheral portion of the connection portion 134a of the low-resistance electrode layer 134 may be located above the 1 st main surface 103 of the SiC semiconductor layer 102.

The entire non-connecting portion 134b of the low-resistance electrode layer 134 may be located above the 1 st main surface 103 of the SiC semiconductor layer 102. The entire non-connecting portion 134b of the low-resistance electrode layer 134 may be located below the 1 st main surface 103 of the SiC semiconductor layer 102.

The non-connecting portion 134b of the low-resistance electrode layer 134 may include a portion located above the 1 st main surface 103 of the SiC semiconductor layer 102. The non-connecting portion 134b of the low-resistance electrode layer 134 may include a portion located below the 1 st main surface 103 of the SiC semiconductor layer 102.

For example, the central portion of the non-connecting portion 134b of the low-resistance electrode layer 134 may be located below the 1 st main surface 103 of the SiC semiconductor layer 102, and the peripheral portion of the non-connecting portion 134b of the low-resistance electrode layer 134 may be located above the 1 st main surface 103 of the SiC semiconductor layer 102.

The low-resistance electrode layer 134 has an edge portion 134c in contact with the gate insulating layer 131. The edge 134c of the low-resistance electrode layer 134 is in contact with the corner connecting the 1 st region 131a and the 2 nd region 131b in the gate insulating layer 131.

An edge portion 134c of the low-resistance electrode layer 134 is formed in a region on the 1 st main surface 103 side of the SiC semiconductor layer 102 with respect to the bottom portion of the source region 126. That is, the edge 134c of the low-resistance electrode layer 134 is formed in a region closer to the 1 st main surface 103 side of the SiC semiconductor layer 102 than a boundary region between the body region 116 and the source region 126.

Therefore, the edge 134c of the low-resistance electrode layer 134 faces the source region 126 through the gate insulating layer 131. The edge 134c of the low-resistance electrode layer 134 does not face the body region 116 with the gate insulating layer 131 interposed therebetween.

This can suppress the formation of a current path in the region between the low-resistance electrode layer 134 of the gate insulating layer 131 and the body region 116. The current path can be formed by unwanted diffusion of the low-resistance electrode layer 134 with respect to the electrode material of the gate insulating layer 131.

In particular, the design of connecting the edge 134c of the low-resistance electrode layer 134 to the 3 rd region 131c of the relatively thick gate insulating layer 131 (the corner of the gate insulating layer 131) is effective in reducing the risk of forming a current path.

In the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102, the thickness TR of the low-resistance electrode layer 134 is equal to or less than the thickness TG of the gate electrode layer 132 (TR ≦ TG). The thickness TR of the low-resistance electrode layer 134 is preferably smaller than the thickness TG of the gate electrode layer 132 (TR < TG). More specifically, the thickness TR of the low-resistance electrode layer 134 is preferably not more than half the thickness TG of the gate electrode layer 132 (TR. ltoreq. TG/2).

A ratio TR/TG of a thickness TR of the low-resistance electrode layer 134 to a thickness TG of the gate electrode layer 132 is 0.01 or more and 1 or less. The thickness TG of the gate electrode layer 132 may be 0.5 μm or more and 3 μm or less. The thickness TR of the low-resistance electrode layer 134 may be 0.01 μm or more and 3 μm or less.

Referring to fig. 14, in this embodiment, the low-resistance electrode layer 134 also covers the upper end portion of the gate wiring layer 133. A portion of low-resistance electrode layer 134 covering the upper end portion of gate wiring layer 133 is formed integrally with a portion of low-resistance electrode layer 134 covering the upper end portion of gate electrode layer 132. Thus, low-resistance electrode layer 134 covers the entire region of gate electrode layer 132 and the entire region of gate wiring layer 133.

Therefore, the current supplied from the gate pad 108 and the gate finger 109 to the gate wiring layer 133 flows through the low-resistance electrode layer 134 having a relatively low sheet resistance, and is transmitted to the entire gate electrode layer 132 and the gate wiring layer 133.

This makes it possible to quickly shift the entire gate electrode layer 132 (the entire region of the active region 106) from the off state to the on state via the gate wiring layer 133, and thus to suppress a delay in switching response.

In particular, in the case of the gate trench 121 having a length on the order of millimeters, the delay of the switching response can be appropriately suppressed by the low-resistance electrode layer 134 covering the upper end portion of the gate wiring layer 133.

The low-resistance electrode layer 134 includes a polycrystalline layer. The polycrystalline layer is formed by silicidizing a portion of the surface layer portion of the gate electrode layer 132 with a metal material. More specifically, the polycrystalline layer is composed of a p-type polycrystalline layer containing a p-type impurity added to the gate electrode layer 132 (p-type polycrystalline silicon).

In this embodiment, the polycrystalline layer has a resistivity of 10 μ Ω · cm or more and 110 μ Ω · cm or less. More specifically, the polycrystalline layer comprises TiSi, TiSi₂、NiSi、CoSi、CoSi₂、MoSi₂Or WSi₂At least one of (1).

When the low-resistance electrode layer 134 is formed over the p-type polysilicon, the sheet resistance in the gate trench 121 is equal to or lower than the sheet resistance of the gate electrode layer 132 (p-type polysilicon) alone. The sheet resistance in the gate trench 121 is preferably equal to or lower than the sheet resistance of n-type polycrystalline silicon to which n-type impurities are added.

The sheet resistance in the gate trench 121 is similar to that of the low-resistance electrode layer 134. That is, the sheet resistance in the gate trench 121 may be 0.01 Ω/□ or more and 10 Ω/□ or less. The sheet resistance in the gate trench 121 is preferably less than 10 Ω/□.

Fig. 15 shows the results of examining the resistivity of the polycrystalline layer. Fig. 15 is a graph showing the relationship between the resistivity and the formation temperature of polycrystals. In fig. 15, the vertical axis represents the resistivity [ μ Ω · cm ], and the horizontal axis represents the polycrystal formation temperature [ ° c ].

Referring to FIG. 15, resistivity is in terms of MoSi₂、WSi₂、NiSi、CoSi₂、TiSi₂The order of (a) becomes smaller. Therefore, the material used as the polycrystalline layer has a priority in terms of MoSi₂、WSi₂、NiSi、CoSi₂、TiSi₂The order of (a) becomes higher.

Particularly, NiSi and CoSi among the above₂And TiSi₂Since the resistivity value and the temperature dependency are relatively small, the polycrystalline layer is suitable for forming the low-resistance electrode layer 134.

Further, according to the verification results of the inventors, when TiSi2 was used as the material of the low-resistance electrode layer 134, the leakage current between the gate and the source was observed to increase when a low electric field was applied. In contrast, CoSi is used₂In the case of (3), no increase in the gate-source leakage current was observed when a low electric field was applied. If NiSi and CoSi are considered₂As a result, CoSi is most preferable in that the heat resistance is comparatively problematic₂As a polycrystalline layer for forming the low-resistance electrode layer 134.

Referring to fig. 12 and 13, in active region 106, a plurality of source trenches 141 are formed in first main surface 103 of SiC semiconductor layer 102. Each source trench 141 is formed in a region between two gate trenches 121 adjacent to each other.

The plurality of source trenches 141 are each formed in a stripe shape extending in the 2 nd direction Y. The plurality of source trenches 141 are formed in a stripe shape in a plan view. In the 1 st direction X, the pitch between the center portions of source trenches 141 adjacent to each other may be 1.5 μm or more and 3 μm or less.

Each source trench 141 penetrates through the body region 116 up to the SiC epitaxial layer 112. The bottom wall of each source trench 141 is located within the SiC epitaxial layer 112. More specifically, the bottom wall of each source trench 141 is located in the high concentration region 112a of the SiC epitaxial layer 112.

The depth of the source trench 141 is substantially equal to the depth of the gate trench 121. The depth of source trench 141 may be equal to or greater than the depth of gate trench 121. The depth of source trench 141 in the normal direction of first main surface 103 of SiC semiconductor layer 102 may be 0.5 μm or more and 10 μm or less (e.g., about 1 μm).

The 1 st direction width of the source trench 141 may be substantially equal to the 1 st direction width of the gate trench 121. The 1 st direction width of source trench 141 may be equal to or greater than the 1 st direction width of gate trench 121. The 1 st direction width of source trench 141 may be 0.1 μm or more and 2 μm or less (e.g., about 0.5 μm).

The opening edge portion 142 of each source trench 141 includes a bent portion 143 bent inward of the source trench 141. The opening edge 142 of the source trench 141 is a corner connecting the 1 st main surface 103 of the SiC semiconductor layer 102 and the sidewall of the source trench 141.

The electric field with respect to the opening edge portion 142 of the source trench 141 is dispersed along the bent portion 143. This can alleviate electric field concentration on opening edge 142 of source trench 141.

In SiC semiconductor layer 102, p + -type contact region 144 is formed in a region along the sidewall of source trench 141. The p-type impurity concentration of the contact region 144 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following. A plurality of contact regions 144 are formed on one side surface and the other side surface of one source trench 141.

The plurality of contact regions 144 are formed at intervals in the 2 nd direction Y. A plurality of contact regions 144 are formed from the gate trench 121 with an interval in the 1 st direction X.

In SiC semiconductor layer 102, p-type deep well region 145 is formed in a region along the inner wall of source trench 141. The deep well region 145 is also referred to as a withstand voltage holding region. The deep well region 145 is formed in a stripe shape extending along the source trench 141. The deep well region 145 extends along the inner wall of the source trench 141.

Referring to fig. 12 and 14, more specifically, the deep well region 145 extends along the sidewall of the source trench 141, passes through the edge portion, and covers the bottom wall of the source trench 141. Deep well region 145 connects to body region 116 at the sidewalls of source trench 141.

The deep well region 145 has a bottom located on the 2 nd main surface 104 side of the SiC semiconductor layer 102 with respect to the bottom wall of the gate trench 121. The deep well region 145 is formed in the high concentration region 112a of the SiC epitaxial layer 112.

The p-type impurity concentration of the deep well region 145 may be substantially equal to the p-type impurity concentration of the body region 116. The p-type impurity concentration of the deep well region 145 may also exceed the p-type impurity concentration of the body region 116. The p-type impurity concentration of the deep well region 145 may also be less than the p-type impurity concentration of the body region 116.

The p-type impurity concentration of the deep well region 145 may be equal to or less than the p-type impurity concentration of the contact region 144. The p-type impurity concentration of the deep well region 145 may also be less than the p-type impurity concentration of the contact region 144. The p-type impurity concentration of deep well region 21 may be 1.0 × 10¹⁷cm^－3Above and 1.0X 10¹⁹cm^－3The following.

Referring to fig. 12 and 14, a p-type peripheral deep well region 148 is formed in the outer region 107. The peripheral deep well region 148 is electrically connected to the deep well region 145.

The peripheral deep well region 148 is configured to have the same potential as the deep well region 145. In this manner, the peripheral deep well region 148 is formed integrally with the deep well region 145.

More specifically, the peripheral deep well region 148 extends in a band-like manner along the periphery of the active region 106 at the outer region 107. More specifically, the peripheral deep well region 148 is formed in an unbroken dot shape (a quadrangular ring shape in this embodiment) surrounding the active region 106.

The peripheral deep well region 148 is formed in the outer region 107 in a region along the surface layer portion of the 1 st main surface 103 of the SiC semiconductor layer 102 and the inner wall of the contact trench portion 121b of the gate trench 121. The peripheral deep well region 148 extends along the side wall of the contact groove portion 121b, passes through the edge portion, and covers the bottom wall of the contact groove portion 121 b.

The peripheral deep well region 148 overlaps the gate wiring layer 133 in a plan view. That is, the peripheral deep well region 148 faces the gate wiring layer 133 with the gate insulating layer 131 (the 3 rd region 131c) therebetween.

The peripheral deep well region 148 has a bottom portion located on the 2 nd main surface 104 side of the SiC semiconductor layer 102 with respect to the bottom wall of the contact groove portion 121b of the gate trench 121. The peripheral deep well region 148 is formed in the high concentration region 112a of the SiC epitaxial layer 112.

The peripheral deep well region 148 includes a lead portion 148a which is led from the outer region 107 to the peripheral edge portion of the active region 106 in a plan view. The lead portion 148a of the peripheral deep well region 148 covers the end portion of the source trench 141 on the outer region 107 side in plan view.

The lead portion 148a of the peripheral deep well region 148 covers the inner wall of the active trench 121a at the peripheral portion of the active region 106. The lead-out portion 148a of the peripheral deep well region 148 extends along the side wall of the active groove portion 121a, passes through the edge portion, and covers the bottom wall of the active groove portion 121 a. The lead-out portion 148a of the peripheral deep well region 148 is connected to the deep well region 145 in the active region 106.

The lead-out portion 148a of the peripheral deep well region 148 has a bottom portion located on the 2 nd main surface 104 side of the SiC semiconductor layer 102 with respect to the bottom wall of the active trench portion 121a of the gate trench 121. The lead-out portion 148a of the peripheral deep well region 148 is formed in the high concentration region 112a of the SiC epitaxial layer 112.

The p-type impurity concentration of the peripheral deep well region 148 may be substantially equal to the p-type impurity concentration of the body region 116. The p-type impurity concentration of the peripheral deep well region 148 may also exceed the p-type impurity concentration of the body region 116. The p-type impurity concentration of the peripheral deep well region 148 may also be less than the p-type impurity concentration of the body region 116.

The p-type impurity concentration of the peripheral deep well region 148 may be substantially equal to the p-type impurity concentration of the deep well region 145. The p-type impurity concentration of the peripheral deep well region 148 may also exceed the p-type impurity concentration of the deep well region 145. The p-type impurity concentration of the peripheral deep well region 148 may also be less than the p-type impurity concentration of the deep well region 145.

The p-type impurity concentration of the peripheral deep well region 148 may be equal to or less than the p-type impurity concentration of the contact region 144. The p-type impurity concentration of peripheral deep well region 148 may also be less than the p-type impurity concentration of contact region 144. The p-type impurity concentration of the peripheral deep well region 148 may be 1.0 × 10¹⁷cm^－3Above and 1.0X 10¹⁹cm^－3The following.

A source insulating layer 146 and a source electrode layer 147 are formed in each source trench 141. For clarity, in fig. 12, the source insulating layer 146 and the source electrode layer 147 are shown by hatching.

The source insulating layer 146 may also include silicon oxide. The source insulating layer 146 is formed in a film shape along the inner wall surface of the source trench 141 so as to define a concave space in the source trench 141.

The source insulating layer 146 includes a1 st region 146a and a 2 nd region 146 b. The 1 st region 146a is formed along the sidewall of the source trench 141. The 2 nd region 146b is formed along the bottom wall of the source trench 141. The thickness T11 of the 1 st region 146a is less than the thickness T12 of the 2 nd region 146 b.

The ratio T12/T11 of the thickness T12 of the 2 nd region 146b to the thickness T11 of the 1 st region 146a may be 2 or more and 5 or less. The thickness T11 of the 1 st region 146a may be 0.01 μm or more and 0.2 μm or less. The thickness T12 of the 2 nd region 146b may be 0.05 μm or more and 0.5 μm or less.

The thickness T11 of the 1 st region 146a may also be substantially equal to the thickness T1 of the 1 st region 131a of the gate insulating layer 131. The thickness T12 of the 2 nd region 146b may also be substantially equal to the thickness T2 of the 2 nd region 131b of the gate insulating layer 131.

The source insulating layer 146 exposes the opening edge portion 142 of the source trench 141. More specifically, the source insulating layer 146 exposes the source region 126 and the contact region 144 from the opening edge portion 142 of the source trench 141.

More specifically, the 1 st region 146a of the source insulating layer 146 has an upper end portion located on the opening side of the source trench 141. The upper end portion of the 1 st region 146a is formed below the 1 st main surface 103 of the SiC semiconductor layer 102.

The upper end of the 1 st region 146a exposes the sidewall of the source trench 141 on the opening side of the source trench 141. In this way, the 1 st region 146a exposes the source region 126 and the contact region 144 from the opening edge 142 of the source trench 141.

The source electrode layer 147 is buried in the source trench 141 with the source insulating layer 146 interposed therebetween. More specifically, the source electrode layer 147 is buried in the source trench 141 so as to fill the concave space defined by the source insulating layer 146. The source electrode layer 147 is controlled by a source voltage.

The source electrode layer 147 has an upper end portion located on the opening side of the source trench 141. The upper end portion of the source electrode layer 147 is formed below the 1 st main surface 103 of the SiC semiconductor layer 102. The upper end portion of the source electrode layer 147 may be formed on the same surface as the upper end portion of the source insulating layer 146.

The upper end portion of the source electrode layer 147 may protrude upward from the upper end portion of the source insulating layer 146. The upper end portion of the source electrode layer 147 may be located below the upper end portion of the source insulating layer 146. The thickness of the source electrode layer 147 may be 0.5 μm or more and 10 μm or less (for example, about 1 μm).

The source electrode layer 147 preferably contains polysilicon having a property close to SiC in material. This can reduce stress generated in the SiC semiconductor layer 102. The source electrode layer 147 preferably includes p-type polycrystalline silicon to which a p-type impurity is added. In this case, the source electrode layer 147 can be formed simultaneously with the gate electrode layer 132.

The p-type impurity concentration of the source electrode layer 147 is equal to or higher than the p-type impurity concentration of the body region 116. More specifically, the p-type impurity concentration of the source electrode layer 147 is larger than the p-type impurity concentration of the body region 116. The p-type impurity of the source electrode layer 147 may include at least one of boron (B), aluminum (Al), indium (In), and gallium (Ga).

The p-type impurity concentration of the source electrode layer 147 may be 1 × 10¹⁸cm^－3Above and 1 × 10²²cm^－3The following. The sheet resistance of the source electrode layer 147 may be 10 Ω/□ or more and 500 Ω/□ or less (200 Ω/□ or less in this embodiment).

The p-type impurity concentration of source electrode layer 147 may be substantially equal to the p-type impurity concentration of gate electrode layer 132. The sheet resistance of the source electrode layer 147 may be substantially equal to the sheet resistance of the gate electrode layer 132.

The source electrode layer 147 may also include n-type polysilicon instead of p-type polysilicon. The source electrode layer 147 may also include at least one of tungsten, aluminum, copper, an aluminum alloy, or a copper alloy instead of the p-type polycrystalline silicon.

Thus, the semiconductor device 101 has a trench gate structure 151 and a trench source structure 152. The trench gate structure 151 includes a gate trench 121, a gate insulating layer 131, a gate electrode layer 132, and a low-resistance electrode layer 134. The trench source structure 152 includes a source trench 141, a source insulating layer 146, and a source electrode layer 147.

Referring to fig. 13 and 14, an interlayer insulating layer 153 is formed on the 1 st main surface 103 of the SiC semiconductor layer 102. The interlayer insulating layer 153 covers the trench gate structure 151 of the source region 106 and the gate wiring layer 133 of the outer region 107.

The interlayer insulating layer 153 may also contain silicon oxide or silicon nitride. A gate contact hole 154 and a source contact hole 155 are formed in the interlayer insulating layer 153.

The gate contact hole 154 exposes the gate wiring layer 133 (low-resistance electrode layer 134) in the outer region 107. Source contact hole 155 exposes source region 126, contact region 144, and trench source structure 152 in active region 106. A gate pad 108, a gate finger 109, and a source pad 110 are formed on the interlayer insulating layer 153.

The gate finger 109 enters the gate contact hole 154 from above the interlayer insulating layer 153. The gate finger 109 is electrically connected to the low-resistance electrode layer 134 within the gate contact hole 154. Thereby, an electric signal from the gate pad 108 is transmitted to the gate electrode layer 132 via the low-resistance electrode layer 134 having a relatively low resistance value.

The source pad 110 enters the source contact hole 155 from above the interlayer insulating layer 153. The source pad 110 is electrically connected to the source region 126, the contact region 144, and the source electrode layer 147 in the source contact hole 155. The source electrode layer 147 may be formed using a partial region of the source pad 110.

Fig. 16 is a graph for explaining sheet resistance. In fig. 16, the vertical axis represents the sheet resistance [ Ω/□ ], and the horizontal axis represents the item. In fig. 16, the 1 st, 2 nd and 3 rd histograms L1, L2 and L3 are shown.

Bar 1L 1 represents the sheet resistance of n-type polysilicon. Bar graph L2, 2, represents sheet resistance for p-type polysilicon. The 3 rd histogram L3 shows the sheet resistance in the case where the low-resistance electrode layer 134 is formed over the p-type polycrystalline silicon. The low-resistance electrode layer 134 contains TiSi₂(p-type titanium silicide).

Referring to the 1 st histogram L1, the sheet resistance of n-type polysilicon is 10 Ω/□. Referring to the 2 nd histogram L2, the sheet resistance of p-type polysilicon is 200 Ω/□. Referring to fig. 3, a 3 rd column chart L3, the sheet resistance in the case where the low-resistance electrode layer 134 is formed over the p-type polycrystalline silicon is 2 Ω/□.

p-type polysilicon has a different work function from n-type polysilicon, and the gate threshold voltage Vth can be increased by about 1V by merely burying p-type polysilicon in the gate trench 121.

However, p-type polysilicon has a sheet resistance that is tens of times (here, 20 times) higher than that of n-type polysilicon. Therefore, when p-type polysilicon is used as a material of the gate electrode layer 132, energy loss significantly increases with an increase in parasitic resistance (hereinafter, simply referred to as "gate resistance") in the gate trench 121.

In contrast, in the structure having the low-resistance electrode layer 134 over p-type polycrystalline silicon, the sheet resistance can be reduced by 1/100 or less as compared with the case where the low-resistance electrode layer 134 is not formed. In the structure having the low-resistance electrode layer 134, the sheet resistance can be reduced by 1/5 or less as compared with the gate electrode layer 132 including n-type polycrystalline silicon.

As described above, according to the semiconductor device 101, the trench gate structure 151 in which the gate electrode layer 132 is buried with the gate insulating layer 131 interposed therebetween is formed in the gate trench 121. In the trench gate structure 151, the gate electrode layer 132 is covered with the low-resistance electrode layer 134 in a limited space called a gate trench 121.

The gate electrode layer 132 comprises p-type polysilicon. This can increase the gate threshold voltage Vth. The low-resistance electrode layer 134 contains a conductive material having a sheet resistance smaller than that of p-type polysilicon.

This can reduce the gate resistance. As a result, current can be effectively diffused along trench gate structure 151, and thus switching delay can be reduced.

In particular, according to the structure in which gate electrode layer 132 is covered with low-resistance electrode layer 134, the p-type impurity concentration of body region 116 does not need to be increased. Therefore, the gate threshold voltage Vth can be increased while preventing an increase in the channel resistance.

In addition, according to the semiconductor device 101, the gate wiring layer 133 is covered with the low-resistance electrode layer 134 in the outer region 107. This also reduces the gate resistance of the gate wiring layer 133.

In particular, in the structure in which gate electrode layer 132 and gate wiring layer 133 are covered with low-resistance electrode layer 134, current can be efficiently diffused along trench gate structure 151. Thus, shortening of the switching delay can be appropriately achieved.

Fig. 17A to 17L are cross-sectional views showing an example of a method for manufacturing the semiconductor device 101 shown in fig. 11. Fig. 17A to 17L are sectional views of portions corresponding to fig. 12.

Referring to fig. 17A, first, an n + -type SiC semiconductor substrate 111 is prepared. Next, an SiC epitaxial layer 112 is formed on the main surface of the SiC semiconductor substrate 111. The SiC epitaxial layer 112 is formed by growing SiC from above the main surface of the SiC semiconductor substrate 111 by an epitaxial growth method.

In this embodiment, the SiC epitaxial layer 112 having the high concentration regions 112a and the low concentration regions 112b is formed. Thereby, the SiC semiconductor layer 102 including the SiC semiconductor substrate 111 and the SiC epitaxial layer 112 is formed.

Next, a p-type body region 116 is formed in the surface layer portion of the 1 st main surface 103 of the SiC semiconductor layer 102. The body region 116 is formed by introducing a p-type impurity into the 1 st main surface 103 of the SiC semiconductor layer 102.

The body region 116 may be formed on the surface layer portion of the 1 st main surface 103 of the SiC semiconductor layer 102 by an ion implantation method through an ion implantation mask (not shown). The active region 106 is defined by the body region 116.

Next, referring to fig. 17B, an n + -type source region 126 is formed in a surface layer portion of the body region 116. The source region 126 is formed by introducing n-type impurities into the surface layer portion of the body region 116. The source region 126 may be formed in the surface layer portion of the body region 116 by an ion implantation method through the ion implantation mask 161.

Next, referring to fig. 17C, a p + -type contact region 144 is formed in the surface layer portion of the body region 116. The contact region 144 is formed by introducing a p-type impurity into the surface layer portion of the body region 116. The contact region 144 may be formed on the surface portion of the body region 116 by an ion implantation method through the ion implantation mask 162.

Next, referring to fig. 17D, a mask 163 having a predetermined pattern is formed on the 1 st main surface 103 of the SiC semiconductor layer 102. The mask 163 has a plurality of openings 164 exposing regions where the gate trenches 121 and the source trenches 141 are to be formed.

Next, unnecessary portions of the SiC semiconductor layer 102 are removed. Unnecessary portions of the SiC semiconductor layer 102 may be removed by an etching method (e.g., a wet etching method) through the mask 163. Thereby, gate trench 121 and source trench 141 are formed. Then, the mask 163 is removed.

Next, a deep well region 145 is formed in the SiC semiconductor layer 102 at a region along the inner wall of the source trench 141. The deep well region 145 may be formed in the SiC semiconductor layer 102 by an ion implantation method using an ion implantation mask not shown.

In outer region 107, peripheral deep well region 148 is formed in a region along the surface layer portion of first main surface 103 of SiC semiconductor layer 102 and the inner wall of contact trench 121b of gate trench 121. In this step, a peripheral deep well region 148 including a lead-out portion 148a led out from the outer region 107 to the peripheral edge portion of the active region 106 is formed.

The peripheral deep well region 148 may be formed in the SiC semiconductor layer 102 by an ion implantation method through an ion implantation mask not shown. A part or all of the peripheral deep well region 148 may be formed simultaneously with the deep well region 145 in the deep well region 145 forming step. A part of the peripheral deep well region 148 may be formed simultaneously with the body region 116 in the body region 116 formation step.

Next, referring to fig. 17E, an annealing process is performed on SiC semiconductor layer 102. The annealing treatment may also be a high temperature hydrogen annealing treatment. The annealing temperature may be 1400 ℃ or higher.

Thus, the bent portion 125 is formed at the opening edge portion 124 of the gate trench 121. In addition, a bent portion 143 is formed at the opening edge portion 142 of the source trench 141.

Next, referring to fig. 17F, an insulating base layer 165 which is a base of the gate insulating layer 131 and the source insulating layer 146 is formed so as to cover the 1 st main surface 103 of the SiC semiconductor layer 102. The base insulating layer 165 can also be formed by a cvd (chemical vapor deposition) method. The base insulating layer 165 may also contain silicon oxide.

In this step, in the base insulating layer 165, a portion covering the sidewall of the gate trench 121 and a portion covering the sidewall of the source trench 141 are formed to be thinner than the other portions.

The insulating base layer 165 of this embodiment is formed by adjusting predetermined conditions such as a gas flow rate, a gas type, a gas ratio, and a gas supply time by a CVD method. The base insulating layer 165 may be formed by an oxidation treatment instead of the CVD method. The oxidation treatment process may be a thermal oxidation treatment process or a wet oxidation treatment process.

Next, referring to fig. 17G, base conductor layer 166 serving as a base for gate electrode layer 132, gate wiring layer 133, and source electrode layer 147 is formed on first main surface 103 of SiC semiconductor layer 102.

The base conductor layer 166 may also comprise p-type polysilicon with p-type impurities added. The base conductor layer 166 may be formed by CVD. The CVD method may be LP-CVD (Low Pressure-CVD).

Next, referring to fig. 17H, unnecessary portions of the base conductor layer 166 are removed. Unnecessary portions of the base conductor layer 166 are removed by an etching method (e.g., a wet etching method) through a mask (not shown) having a predetermined pattern.

The mask (not shown) covers a region where the gate wiring layer 133 is to be formed. Unnecessary portions of the base conductor layer 166 are exposed on the base insulating layer 165 at least up to the 1 st main surface 103 of the SiC semiconductor layer 102. Thereby, gate electrode layer 132, gate wiring layer 133, and source electrode layer 147 are formed.

When the source electrode layer 147 is made of an electrode material different from that of the gate electrode layer 132, the source electrode layer 147 may be formed by performing the same steps as those in fig. 17G to 17H separately for the electrode material of the source electrode layer 147. In the case where the source electrode layer 147 is formed using a part of the source pad 110, the source electrode layer 147 is formed when the source pad 110 is formed.

Next, referring to fig. 17I, a metal material layer 167 is formed on the gate electrode layer 132. In this embodiment, the metal material layer 167 is formed on the 1 st main surface 103 of the SiC semiconductor layer 102 so as to collectively cover the gate electrode layer 132 and the source electrode layer 147.

The metallic material layer 167 includes a metallic material capable of being polycrystallized between p-type polysilicon. The metallic material layer 167 may also include at least one of Mo, W, Ni, Co, or Ti.

Next, a p-type polycrystalline layer is formed on the surface layer portion of the gate electrode layer 132 and the surface layer portion of the gate wiring layer 133. In this embodiment, a p-type polycrystalline layer is also formed in the surface layer portion of the source electrode layer 147.

The p-type polycrystalline layer is formed by polycrystallizing a surface portion of the gate electrode layer 132, a surface portion of the gate wiring layer 133, and a surface portion of the source electrode layer 147 by heat treatment of the metal material layer 167. The heat treatment for the metal material layer 167 may be an rta (rapid Thermal annealing) method.

Thereby, the film containing TiSi and TiSi is formed in accordance with the metal material of the metal material layer 167₂、NiSi、CoSi、CoSi₂、MoSi₂Or WSi₂A p-type polycrystal of at least one of them. The low-resistance electrode layer 134 is formed from the p-type polycrystalline layer.

Next, referring to fig. 17J, an unreacted portion of the metal material layer 167 not bonded to the p-type polysilicon is removed. The unreacted portion of the metal material layer 167 may also be removed by an etching method (e.g., a wet etching method).

When the low-resistance electrode layer 134 (p-type polycrystal) contains at least one of TiSi and CoSi, the low-resistance electrode layer 134 may be heat-treated as necessary after removing an unreacted portion of the metal material layer 167.

The heat treatment for the low-resistance electrode layer 134 may be an RTA method. Thus, the TiSi is modified into TiSi₂Modification of CoSi to CoSi₂Therefore, the resistance can be reduced.

Next, referring to fig. 17K, an interlayer insulating layer 153 is formed on the 1 st main surface 103 of the SiC semiconductor layer 102. The interlayer insulating layer 153 is formed on the 1 st main surface 103 of the SiC semiconductor layer 102 so as to cover the trench gate structure 151 and the gate wiring layer 133. The interlayer insulating layer 153 includes silicon oxide or silicon nitride. The interlayer insulating layer 153 may be formed by a CVD method.

Next, a mask 168 having a predetermined pattern is formed over the interlayer insulating layer 153. The mask 168 has a plurality of openings 169 that expose regions where the gate contact holes 154 and the source contact holes 155 need to be formed.

Next, unnecessary portions of the interlayer insulating layer 153 are removed. The unnecessary portions of the interlayer insulating layer 153 may be removed by etching (for example, dry etching) through the mask 168. Thereby, the gate contact hole 154 and the source contact hole 155 are formed.

Next, referring to fig. 17L, a gate pad 108, a gate finger 109, and a source pad 110 are formed on the interlayer insulating layer 153. The gate pad 108, the gate finger 109, and the source pad 110 are formed using a mask (not shown) having a predetermined pattern. In addition, the drain pad 113 is formed on the 2 nd main surface 104 of the SiC semiconductor layer 102. The semiconductor device 101 is manufactured through the steps including the above steps.

Fig. 18 is a sectional view of a region corresponding to fig. 13, and is a sectional view showing a semiconductor device 171 according to embodiment 8 of the present invention. Hereinafter, structures corresponding to the structures described in the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 18, in the semiconductor device 171, the gate insulating layer 131 includes a bulging portion 172 bulging toward the inside of the gate trench 121 at the opening edge portion 124 of the gate trench 121. The bulge 172 is formed at a corner of the gate insulating layer 131 connecting the 1 st region 131a and the 3 rd region 131 c.

The bulge 172 extends in a curved shape inward of the gate trench 121. The bulge 172 narrows the opening of the gate trench 121 at the opening edge 124 of the gate trench 121.

The upper end portion of the gate electrode layer 132 has a constricted portion recessed along the bulging portion 172 of the gate insulating layer 131. The low-resistance electrode layer 134 covers the constricted portion (upper end portion) of the gate electrode layer 132. In this embodiment, the edge 134c of the low-resistance electrode layer 134 is in contact with the protruding portion 172 of the gate insulating layer 131.

In the step of fig. 17F, the projection 172 of the gate insulating layer 131 is formed by setting predetermined conditions (gas flow rate, gas type, gas ratio, gas supply time, and the like) of the CVD method in consideration of the shape of the projection 172 of the gate insulating layer 131.

As described above, according to the semiconductor device 171, the edge portion 134c of the low-resistance electrode layer 134 is in contact with the protruding portion 172 of the gate insulating layer 131. This can appropriately suppress the formation of a current path in the region between the low-resistance electrode layer 134 and the SiC semiconductor layer 102.

In addition, according to the semiconductor device 171, the opening edge 124 of the gate trench 121 has the bent portion 125, and in addition, the opening edge 124 of the gate trench 121 is formed with the bulge portion 172. This can further improve the dielectric strength of the gate insulating layer 131 at the opening edge 124 of the gate trench 121.

Fig. 19 is a sectional view of a region corresponding to fig. 13, and is a sectional view showing a semiconductor device 181 according to embodiment 9 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 19, in the semiconductor device 181, the opening edge portion 124 of the gate trench 121 has an inclined portion 182 inclined downward from the 1 st main surface 103 of the SiC semiconductor layer 102 toward the sidewall of the gate trench 121.

Since the electric field can be dispersed along the inclined portion 182 by the inclined portion 182 of the gate trench 121, the concentration of the electric field with respect to the opening edge portion 124 of the gate trench 121 can be alleviated.

The gate insulating layer 131 includes a bulging portion 183 bulging toward the inside of the gate trench 121 at the inclined portion 182 of the gate trench 121. The bulge 183 is formed at a corner of the gate insulating layer 131 connecting the 1 st region 131a and the 3 rd region 131 c.

The bulge 183 extends in a curved shape inward of the gate trench 121. The bulge 183 narrows the opening of the gate trench 121 at the opening edge 124 of the gate trench 121.

The upper end portion of the gate electrode layer 132 has a constricted portion recessed along the expanded portion 183 of the gate insulating layer 131. The low-resistance electrode layer 134 covers the constricted portion (upper end portion) of the gate electrode layer 132. In this embodiment, the edge 134c of the low-resistance electrode layer 134 is in contact with the protruding portion 183 of the gate insulating layer 131.

The opening edge portion 142 of the source trench 141 has an inclined portion 184 inclined downward from the 1 st main surface 103 of the SiC semiconductor layer 102 toward the sidewall of the source trench 141. Since the inclined portion 184 of the source trench 141 can disperse the electric field along the inclined portion 184, the electric field is concentrated on the opening edge portion 142 of the source trench 141.

Fig. 20A to 20C are cross-sectional views showing an example of a method for manufacturing the semiconductor device 181 shown in fig. 19.

First, referring to fig. 20A, a SiC semiconductor layer 102 in which the gate trenches 121 and the source trenches 141 are formed in the 1 st main surface 103 through the steps of fig. 17A to 17D is prepared.

Next, referring to fig. 20B, thermal oxidation treatment is performed on the 1 st main surface 103 of the SiC semiconductor layer 102, and a sacrificial oxide film 185 is formed. In this step, oxidation starts uniformly from both the 1 st main surface 103 of the SiC semiconductor layer 102 and the sidewalls of the gate trench 121.

The oxide film running from the 1 st main surface 103 of the SiC semiconductor layer 102 and the oxide film running from the side wall of the gate trench 121 are integrated at the opening edge 124 of the gate trench 121.

The integration of these oxide films accelerates the oxidation of the opening edge 124 of the gate trench 121. An inclined portion 182 is formed below the oxide film integrated with the opening edge portion 124 of the gate trench 121.

The oxide film which advances from the 1 st main surface 103 of the SiC semiconductor layer 102 and the oxide film which advances from the sidewall of the source trench 141 are integrated at the opening edge portion 142 of the source trench 141.

The integration of these oxide films accelerates the oxidation of the opening edge 142 of the source trench 141. Inclined portion 184 is formed below the oxide film integrated with opening edge portion 142 of source trench 141.

Next, referring to fig. 20C, the sacrificial oxide film 185 is removed. The sacrificial oxide film 185 may be removed by an etching method (e.g., wet etching). Then, the steps of fig. 17F to 17L are sequentially executed.

In the step of fig. 17F, the projection 183 of the gate insulating layer 131 is formed by setting predetermined conditions (gas flow rate, gas type, gas ratio, gas supply time, and the like) of the CVD method in consideration of the shape of the projection 183 of the gate insulating layer 131. Through the steps including the above steps, the semiconductor device 181 is manufactured.

As described above, according to the semiconductor device 181, the edge portion 134c of the low-resistance electrode layer 134 is in contact with the protruding portion 183 of the gate insulating layer 131. This can appropriately suppress the formation of a current path in the region between the low-resistance electrode layer 134 and the SiC semiconductor layer 102.

In addition, according to the semiconductor device 181, the opening edge portion 124 of the gate trench 121 has the inclined portion 182, and in addition, the opening edge portion 124 of the gate trench 121 is formed with the bulging portion 183. This can further improve the dielectric strength of the gate insulating layer 131 at the opening edge 124 of the gate trench 121.

In this embodiment, an example of a mode in which the gate insulating layer 131 having the protruding portion 183 is formed in the semiconductor device 181 is described. However, the gate insulating layer 131 without the protruding portion 183 may be formed in the semiconductor device 181.

Fig. 21 is an enlarged view of a region corresponding to fig. 12, and is an enlarged view of a semiconductor device 191 according to embodiment 10 of the present invention. Fig. 22 is a sectional view taken along line XXII-XXII shown in fig. 21. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 21 and 22, in semiconductor device 191, outer gate trench 192 is formed in outer region 107 and first main surface 103 of SiC semiconductor layer 102. The outer gate trench 192 extends in a band shape in the outer region 107.

The outer gate trench 192 is formed in a region directly below the gate finger 109 on the 1 st main surface 103 of the SiC semiconductor layer 102. Outer gate trenches 192 extend along gate fingers 109.

More specifically, outer gate trench 192 is formed along three side surfaces 105A, 105B, and 105D of SiC semiconductor layer 102 so as to divide active region 106 from three directions. Outer gate trenches 192 may also be formed as unbroken dots (e.g., quadrilateral rings) surrounding active region 106.

The outer gate trench 192 communicates with the contact trench portion 121b of each gate trench 121. Thus, the outer gate trench 192 and the gate trench 121 are formed of one trench.

The gate wiring layer 133 is buried in the outer gate trench 192. The gate wiring layer 133 is connected to the gate electrode layer 132 at the communication portions of the outer gate trenches 192 and the contact trench portions 121 b.

In this embodiment, the low-resistance electrode layer 134 covers the upper end portion of the gate wiring layer 133 in the outer gate trench 192. Therefore, the low-resistance electrode layer 134 covering the gate electrode layer 132 and the low-resistance electrode layer 134 covering the gate wiring layer 133 are both located in one trench.

In this manner, the peripheral deep well region 148 covers the inner wall of the outer gate trench 192 in the outer region 107. The peripheral deep well region 148 extends along the sidewalls of the outer gate trench 192 and past the rim portion to form a bottom wall of the outer gate trench 192.

That is, the peripheral deep well region 148 is a portion along the inner wall of the outer gate trench 192, and faces the gate wiring layer 133 with the gate insulating layer 131 interposed therebetween. In addition, the peripheral deep well region 148 faces the gate electrode layer 132 via the gate insulating layer 131 at a portion along the inner wall of the gate trench 121.

As described above, the semiconductor device 191 can also achieve the same effects as those described for the semiconductor device 101. In addition, according to the semiconductor device 191, it is not necessary to draw out the gate wiring layer 133 onto the 1 st main surface 103 of the SiC semiconductor layer 102.

This can prevent the gate wiring layer 133 from facing the SiC semiconductor layer 102 through the gate insulating layer 131 at the opening edge portions of the gate trenches 121 and the outer gate trenches 192. As a result, the electric field concentration at the opening edge of the gate trench 121 can be suppressed.

Fig. 23 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 201 according to embodiment 11 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 23, in the semiconductor device 201, each source trench 141 is formed deeper than the gate trench 121. Therefore, the bottom wall of each source trench 141 is located on the 2 nd main surface 104 side of the SiC semiconductor layer 102 with respect to the bottom of the gate trench 121. More specifically, the bottom wall of each source trench 141 is located in the high concentration region 112a of the SiC epitaxial layer 112.

The ratio of the depth of source trench 141 to the depth of gate trench 121 may be 1.5 or more. The ratio of the depth of source trench 141 to the depth of gate trench 121 is preferably 2 or more.

The depth of the gate trench 121 may be 0.5 μm or more and 3 μm or less (for example, about 1 μm). The depth of source trench 141 may be 0.75 μm or more and 10 μm or less (for example, about 2 μm).

As in the case of the semiconductor device 101, the deep well region 145 extends along the inner wall of the source trench 141, and has a bottom portion located on the 2 nd main surface 104 side of the SiC semiconductor layer 102 with respect to the bottom wall of the gate trench 121. The deep well region 145 is formed in the high concentration region 112a of the SiC epitaxial layer 112.

As described above, according to the semiconductor device 201, the same effects as those described for the semiconductor device 101 can be obtained.

Fig. 24 is a plan view of a region corresponding to fig. 12, and is a plan view for explaining the structure of a semiconductor device 211 according to embodiment 12 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 24, in this embodiment, the gate trenches 121 are formed in a lattice shape integrally including a plurality of gate trenches 121 extending in the 1 st direction X and a plurality of gate trenches 121 extending in the 2 nd direction Y in a plan view.

A plurality of cell regions 212 are defined in matrix by the gate trenches 121 on the 1 st main surface 103 of the SiC semiconductor layer 102. Each cell region 212 is formed in a quadrangular shape in a plan view. The source trenches 141 are formed in the plurality of cell regions 212, respectively. Source trench 141 may be formed in a quadrangular shape in a plan view.

The cross-sectional view taken along line XIII-XIII in fig. 24 is substantially the same as the cross-sectional view shown in fig. 13. The sectional view taken along the line XIV-XIV of FIG. 24 is substantially the same as the sectional view shown in FIG. 14.

As described above, the semiconductor device 211 can also exhibit the same effects as those described for the semiconductor device 101. Instead of the stripe shape, the gate trench 121 having a structure formed in a lattice shape can be applied in another form.

Fig. 25 is a cross-sectional view of a region corresponding to fig. 13, and is a plan view for explaining the structure of a semiconductor device 221 according to embodiment 13 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 25, in the semiconductor device 221, the SiC semiconductor layer 102 includes a p + -type SiC semiconductor substrate 222 instead of the n + -type SiC semiconductor substrate 111. The p + -type SiC semiconductor substrate 222 is formed as a collector region of an igbt (insulated gate bipolar transistor).

In the description of the semiconductor device 101, the "source" of the MISFET is replaced with the "emitter" of the IGBT, and the "drain" of the MISFET is replaced with the "collector" of the IGBT, which are applied to the description of the semiconductor device 221.

That is, source pad 110 and source region 126 are replaced with emitter pad (110) and emitter region (126), respectively. Further, the drain pad 113 and the drain region 114 are replaced with a collector electrode layer (113) and a collector region (114), respectively.

As described above, the semiconductor device 221 can also achieve the same effects as those described for the semiconductor device 101.

Fig. 26 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 231 according to embodiment 14 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 26, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141.

The source insulating layer 146 is formed along the inner wall surface of the source trench 141 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

More specifically, the source insulating layer 146 includes a1 st portion 232 and a 2 nd portion 233. The 1 st portion 232 wraps the sidewalls of the source trench 141. The 2 nd portion 233 partially covers the bottom wall of the source trench 141.

The 2 nd part 233 is connected to the 1 st part 232. The 2 nd portion 233 extends from a corner of the source trench 141 along the bottom wall so as to expose a central portion of the bottom wall of the source trench 141. The 2 nd portion 233 may be formed in a dot shape (ring shape) in a plan view.

As described above, the semiconductor device 231 can exhibit the same effects as those described for the semiconductor device 101. In addition, according to the semiconductor device 231, a pn junction is formed in the boundary region between the SiC semiconductor layer 102 and the deep well region 145.

Even if the depletion layer spreads from the pn junction along the bottom wall from the corner of the source trench 141, the distance from the depletion layer to the source electrode layer 147 can be obtained by the source insulating layer 146. This can suppress the occurrence of punch-through in the vicinity of the corner of source trench 141.

Fig. 27 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 241 according to embodiment 15 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 27, exposed portions 242 selectively exposing the bottom walls of source trenches 141 are formed in deep well region 145. The exposed portion 242 exposes a central portion of the bottom wall of the source trench 141.

In this manner, the source insulating layer 146 includes the 1 st portion 243 and the 2 nd portion 244. The 1 st portion 243 wraps sidewalls of the source trench 141. The 2 nd portion 244 partially wraps the bottom wall of the source trench 141.

The 2 nd part 244 is connected to the 1 st part 243. The 2 nd portion 244 extends from a corner of the source trench 141 along the bottom wall so as to expose a central portion of the bottom wall of the source trench 141. The 2 nd portion 244 may be formed in a dot shape (ring shape) in a plan view.

The source electrode layer 147 forms a heterojunction with the SiC semiconductor layer 102 at the exposed portion 242 of the deep well region 145. Thus, a heterojunction diode 245 having the source electrode layer 147 as an anode and the SiC semiconductor layer 102 as a cathode is formed. The source electrode layer 147 may contain a conductive material other than polysilicon as long as the heterojunction diode 245 can be formed.

A body diode 246 is formed at the pn junction between the SiC semiconductor layer 102 and the body region 116. The junction barrier of the heterojunction diode 245 is smaller than the diffusion potential of the body diode 246.

The junction barrier of the heterojunction diode 245 may be 1.0eV or more and 1.5eV or less. The diffusion potential of the body diode 246 may be 2.8eV or more and 3.2eV or less.

As described above, the semiconductor device 241 can achieve the same effects as those described for the semiconductor device 101. In addition, in the semiconductor device 241, when a reverse bias voltage is applied, a current can preferentially flow into the mass junction diode 245.

This can suppress the propagation of crystal defects of SiC in the SiC semiconductor layer 102. As a result, the increase in the on-resistance can be suppressed while improving the short-circuit tolerance and reducing the feedback capacitance Crss.

Fig. 28 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 251 according to embodiment 16 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 28, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141.

The source insulating layer 146 has a stacked structure including a plurality of barrier formation layers formed along the inner wall of the source trench 141. In this embodiment, the source insulating layer 146 has a stacked structure including an insulating barrier formation layer 252 and a conductive barrier formation layer 253 which are stacked in this order from the inner wall of the source trench 141.

The insulating barrier formation layer 252 may contain at least one of silicon, silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, and aluminum oxynitride without impurity addition.

The insulating barrier formation layer 252 is formed in a film shape along the inner wall surface of the source trench 141 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

More specifically, the insulating barrier formation layer 252 includes a1 st portion 254 and a 2 nd portion 255. Portion 1 254 wraps the sidewalls of source trench 141. The 2 nd portion 255 selectively covers the bottom wall of the source trench 141.

The 2 nd portion 255 is connected to the 1 st portion 254. The 2 nd portion 255 extends from a corner of the source trench 141 along the bottom wall so that a central portion of the bottom wall of the source trench 141 is exposed.

The conductive barrier formation layer 253 may also include at least one of conductive polysilicon, tungsten, platinum, nickel, cobalt, or molybdenum. The conductive barrier formation layer 253 contains a conductive material different from that of the source electrode layer 147.

The conductive barrier formation layer 253 is formed in a film shape along the insulating barrier formation layer 252 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

The source insulating layer 146 may include an insulating barrier formation layer made of an insulating material different from that of the insulating barrier formation layer 252 instead of the conductive barrier formation layer 253. The source insulating layer 146 may include an insulating barrier formation layer made of the same insulating material as the insulating barrier formation layer 252, instead of the conductive barrier formation layer 253.

As described above, the semiconductor device 251 can achieve the same effects as those described for the semiconductor device 101. In the semiconductor device 251, the source insulating layer 146 has a stacked structure including an insulating barrier formation layer 252 and a conductive barrier formation layer 253. Thus, the occurrence of punch-through can be suppressed by the two layers of the insulating barrier formation layer 252 and the conductive barrier formation layer 253.

Fig. 29 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 261 according to embodiment 17 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 101 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 29, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141.

The source insulating layer 146 includes a1 st portion 262 and a 2 nd portion 263. The 1 st portion 262 covers sidewalls of the source trench 141. The 2 nd portion 263 wraps the bottom wall of the source trench 141.

The 1 st portion 262 selectively has a sidewall contact hole 264 exposing the SiC semiconductor layer 102 from the sidewall of the source trench 141. Portion 1 262 may also be formed to cross the boundary region between SiC semiconductor layer 102 and body region 116.

The end of the lower side of the 1 st portion 262 (the end on the bottom wall side of the source trench 141) may also be located on the bottom wall side of the source trench 141 with respect to the bottom of the body region 116. In this case, the source electrode layer 147 is electrically connected to the drift region 115 in the source trench 141.

The end of the 1 st portion 262 on the lower side may be located on the 1 st main surface 103 side with respect to the bottom of the body region 116. The end of the underside of the 1 st portion 262 may also be formed in the region between the bottom of the body region 116 and the bottom of the source region 126. In the above case, the source electrode layer 147 is connected to at least the body region 116 in the source trench 141.

The lower end of the 1 st portion 262 may be formed in a region between the 1 st main surface 103 of the SiC semiconductor layer 102 and the bottom of the source region 126. The source insulating layer 146 may have no part 1 and only a part 2 263. In the above case, the source electrode layer 147 is connected to the body region 116 and the contact region 144 in the source trench 141.

The 2 nd portion 263 of the source insulating layer 146 is formed with a space from the 1 st portion 262 of the source insulating layer 146. That is, the 2 nd portion 263 is separated from the 1 st portion 262. The 2 nd portion 263 may also wrap the corner of the source trench 141.

The 2 nd portion 263 may also expose a corner of the source trench 141. The 2 nd portion 263 may cover a corner of the source trench 141 and also cover a portion of a sidewall of the source trench 141.

The source electrode layer 147 forms a schottky junction with the SiC semiconductor layer 102 (drift region 115) in the source trench 141. Thus, a schottky barrier diode 265 having the source electrode layer 147 as an anode and the SiC semiconductor layer 102 as a cathode is formed.

A p-type deep well region 145 is formed in the SiC semiconductor layer 102 in a region along the bottom wall of the source trench 141. In this embodiment, the deep well region 145 is formed in the high concentration region 112a of the SiC epitaxial layer 112. The entire region of the deep well region 145 is formed in the high concentration region 112 a.

Deep well region 145 may be formed continuously in SiC semiconductor layer 102 in a region along the sidewall and corner of source trench 141 so that source electrode layer 147 is exposed from the sidewall of source trench 141.

The deep well region 145 wraps the bottom wall of the source trench 141. The deep well region 145 wraps around the corner of the connecting sidewall and bottom wall of the source trench 141. Deep well region 145 may expose substantially the entire region of the sidewall of source trench 141 in SiC semiconductor layer 102.

The deep well region 145 is drawn from the bottom wall of the source trench 141 in the lateral direction parallel to the 1 st main surface 103 of the SiC semiconductor layer 102. Thus, the deep well region 145 faces the body region 116 through a partial region of the SiC semiconductor layer 102 (drift region 115) in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

More specifically, the source electrode layer 147 forms a schottky junction with the SiC semiconductor layer 102 (drift region 115) at a depth position between the body region 116 and the deep well region 145 in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

More specifically, the source electrode layer 147 forms schottky junctions with the SiC semiconductor layer 102 (drift region 115) in the region sandwiched between the body region 116 and the deep well region 145 in the SiC semiconductor layer 102 in the direction of the normal to the 1 st main surface 103 of the SiC semiconductor layer 102.

The source electrode layer 147 may have a stacked structure including a plurality of electrode layers. The source electrode layer 147 may include a1 st electrode layer and a 2 nd electrode layer stacked in this order from the SiC semiconductor layer 102 side.

The 1 st electrode layer may be a barrier electrode layer including a Ti (titanium) film and/or a TiN (titanium nitride) film. The 1 st electrode layer may have a laminated structure in which a Ti (titanium) film and a TiN (titanium nitride) film are laminated in this order from the SiC semiconductor layer 102 side. The 1 st electrode layer may have a single-layer structure formed of a Ti (titanium) film or a TiN (titanium nitride) film. The 2 nd electrode layer may also contain aluminum or tungsten.

As described above, according to the semiconductor device 261, the same effects as those described for the semiconductor device 101 can be obtained. In addition, in the semiconductor device 261, when a reverse bias voltage is applied, a current can be preferentially flown into the schottky barrier diode 265.

This can suppress the propagation of crystal defects of SiC in the SiC semiconductor layer 102. As a result, the short-circuit tolerance can be improved, the feedback capacitance Crss can be reduced, and the increase in the on-resistance can be suppressed.

In this embodiment, an example in which the source electrode layer 147 forms schottky junction with the SiC semiconductor layer 102 in the sidewall contact hole 264 of the source insulating layer 146 is described. However, the source insulating layer 146 (the 1 st portion 262 and the 2 nd portion 263) may not be formed.

Fig. 30 is a cross-sectional view of a region corresponding to fig. 13, and is a cross-sectional view for explaining the structure of a semiconductor device 271 according to embodiment 18 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 201 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 30, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141. The source insulating layer 146 is formed along the inner wall surface of the source trench 141 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

More specifically, the source insulating layer 146 includes a1 st portion 272 and a 2 nd portion 273. The 1 st portion 272 wraps the sidewalls of the source trench 141. The 2 nd portion 273 partially wraps the bottom wall of the source trench 141.

The 2 nd portion 273 is connected to the 1 st portion 272. The 2 nd portion 273 extends from the corner portion of the source trench 141 along the bottom wall so that the central portion of the bottom wall of the source trench 141 is exposed. The 2 nd portion 273 may be formed in a dot shape (ring shape) in a plan view.

As described above, the semiconductor device 271 can provide the same effects as those described for the semiconductor device 201. In addition, according to the semiconductor device 271, a pn junction is formed in the boundary region between the SiC semiconductor layer 102 and the deep well region 145.

Even if the depletion layer spreads from the pn junction along the bottom wall from the corner of the source trench 141, the distance to which the depletion layer reaches the source electrode layer 147 can be obtained by the source insulating layer 146. This can suppress the occurrence of punch-through in the vicinity of the corner of source trench 141.

Fig. 31 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of a semiconductor device 281 according to embodiment 19 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 201 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 31, an exposed portion 282 that selectively exposes the bottom wall of the source trench 141 is formed in the deep well region 145. The exposed portion 282 exposes a central portion of the bottom wall of the source trench 141.

In this manner, the source insulating layer 146 includes a1 st portion 283 and a 2 nd portion 284. The 1 st portion 283 wraps the sidewalls of the source trench 141. The 2 nd portion 284 partially wraps the bottom wall of the source trench 141.

The 2 nd portion 284 is connected to the 1 st portion 283. The 2 nd portion 284 extends from a corner of the source trench 141 along the bottom wall so as to expose a central portion of the bottom wall of the source trench 141. The 2 nd portion 284 may be formed in a dot shape (ring shape) in a plan view.

The source electrode layer 147 forms a heterojunction with the SiC semiconductor layer 102 at the exposed portion 282 of the deep well region 145. Thus, a heterojunction diode 285 having the source electrode layer 147 as an anode and the SiC semiconductor layer 102 as a cathode is formed. The source electrode layer 147 may contain a conductive material other than polysilicon as long as the heterojunction diode 285 can be formed.

A body diode 286 is formed at the pn junction between the SiC semiconductor layer 102 and the body region 116. The junction barrier of the heterojunction diode 285 is smaller than the diffusion potential of the body diode 286.

The junction barrier of the heterojunction diode 285 may be 1.0eV or more and 1.5eV or less. The diffusion potential of the body diode 286 may be 2.8eV or more and 3.2eV or less.

As described above, the semiconductor device 281 can exhibit the same effects as those described for the semiconductor device 201. In addition, in the semiconductor device 281, when a reverse bias voltage is applied, a current can preferentially flow into the heterojunction diode 285.

This can suppress the propagation of crystal defects of SiC in the SiC semiconductor layer 102. As a result, the increase in the on-resistance can be suppressed while improving the short-circuit tolerance and reducing the feedback capacitance Crss.

Fig. 32 is a sectional view of a region corresponding to fig. 13, and is a sectional view suitable for explaining the structure of the semiconductor device 291 according to embodiment 20 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 201 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 32, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141.

The source insulating layer 146 has a stacked structure including a plurality of barrier formation layers formed along the inner wall of the source trench 141. In this embodiment, the source insulating layer 146 has a stacked structure including an insulating barrier formation layer 292 and a conductive barrier formation layer 293 stacked in this order from the inner wall of the source trench 141.

The insulating barrier formation layer 292 may include at least one of silicon, silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, and aluminum oxynitride added without impurities.

The insulating barrier formation layer 292 is formed in a film shape along the inner wall surface of the source trench 141 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

More specifically, the insulating barrier formation layer 292 includes a1 st portion 294 and a 2 nd portion 295 with the 1 st portion 294 covering the sidewalls of the source trench 141. The 2 nd portion 295 selectively covers the bottom wall of the source trench 141.

The 2 nd portion 295 is connected to the 1 st portion 294. The 2 nd portion 295 extends from a corner portion of the source trench 141 along the bottom wall so as to expose a central portion of the bottom wall of the source trench 141.

The conductive barrier formation layer 293 may also include at least one of conductive polysilicon, tungsten, platinum, nickel, cobalt, or molybdenum. The conductive barrier formation layer 293 contains a conductive material different from that of the source electrode layer 147.

The conductive barrier formation layer 293 is formed in a film shape along the insulating barrier formation layer 292 so that the contact region 144 is selectively exposed from the bottom wall of the source trench 141.

As described above, the semiconductor device 291 can provide the same effects as those described for the semiconductor device 201. In the semiconductor device 291, the source insulating layer 146 has a stacked structure including the insulating barrier formation layer 292 and the conductive barrier formation layer 293. This makes it possible to suppress the occurrence of punch-through by the two layers of the insulating barrier formation layer 292 and the conductive barrier formation layer 293.

Fig. 33 is a sectional view of a region corresponding to fig. 13, and is a sectional view for explaining the structure of the semiconductor device 301 according to embodiment 21 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 201 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 33, a contact region 144 is formed in a region along the bottom wall of the source trench 141 in the deep well region 145. The contact region 144 is exposed from the bottom wall of the source trench 141.

The source insulating layer 146 includes a1 st portion 302 and a 2 nd portion 303. Portion 1 302 wraps the sidewalls of source trench 141. Portion 2 wraps around the bottom wall of source trench 141.

The 1 st portion 302 selectively has a sidewall contact hole 304 exposing the SiC semiconductor layer 102 from the sidewall of the source trench 141. Portion 1 302 may also be formed to cross the boundary region between SiC semiconductor layer 102 and body region 116.

The end of the lower side of the 1 st portion 302 (the end on the source trench 141 side) may be located on the bottom wall side of the source trench 141 with respect to the bottom of the body region 116. In this case, the source electrode layer 147 is electrically connected to the drift region 115 in the source trench 141.

The end of the lower side of the 1 st portion 302 may be located on the 1 st main surface 103 side with respect to the bottom of the body region 116. The end of the underside of portion 1 302 may also be formed in the region between the bottom of the body region 116 and the bottom of the source region 126. In the above case, the source electrode layer 147 is connected to at least the body region 116 in the source trench 141.

The lower end of the 1 st portion 302 may be formed in a region between the 1 st main surface 103 of the SiC semiconductor layer 102 and the bottom of the source region 126. The source insulating layer 146 may have no portion 1 302 but only a portion 2 303. In the above case, the source electrode layer 147 is connected to the body region 116 and the contact region 144 in the source trench 141.

The 2 nd portion 303 of the source insulating layer 146 is formed with a space from the 1 st portion 302 of the source insulating layer 146. That is, the 2 nd part 303 is separated from the 1 st part 302. Portion 2 303 may also wrap around the corners of source trenches 141.

Portion 2 303 may also expose the corners of source trenches 141. Portion 2 303 may also cover the corners of source trench 141 and may also cover a portion of the sidewalls of source trench 141.

The source electrode layer 147 forms a schottky junction with the SiC semiconductor layer 102 (drift region 115) within the source trench 141. Thus, a schottky barrier diode 305 having the source electrode layer 147 as an anode and the SiC semiconductor layer 102 as a cathode is formed.

A p-type deep well region 145 is formed in the SiC semiconductor layer 102 in a region along the bottom wall of the source trench 141. In this embodiment, the deep well region 145 is formed in the high concentration region 112a of the SiC epitaxial layer 112. The entire region of the deep well region 145 is formed in the high concentration region 112 a.

Deep well region 145 may be formed continuously in SiC semiconductor layer 102 in a region along the sidewall and corner of source trench 141 so that source electrode layer 147 is exposed from the sidewall of source trench 141.

The deep well region 145 wraps the bottom wall of the source trench 141. The deep well region 145 wraps around the corner of the connecting sidewall and bottom wall of the source trench 141. Deep well region 145 may expose substantially the entire region of the sidewall of source trench 141 in SiC semiconductor layer 102.

The deep well region 145 is drawn from the bottom wall of the source trench 141 in the lateral direction parallel to the 1 st main surface 103 of the SiC semiconductor layer 102. Thus, the deep well region 145 faces the body region 116 through a partial region of the SiC semiconductor layer 102 (drift region 115) in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

The deep well region 145 is drawn from the bottom wall of the source trench 141 in the lateral direction parallel to the 1 st main surface 103 of the SiC semiconductor layer 102. Thus, the deep well region 145 faces the body region 116 through a partial region of the SiC semiconductor layer 102 (drift region 115) in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

More specifically, the source electrode layer 147 forms a schottky junction with the SiC semiconductor layer 102 (drift region 115) at a depth position between the body region 116 and the deep well region 145 in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

More specifically, the source electrode layer 147 forms schottky junctions with the SiC semiconductor layer 102 (drift region 115) in regions where the SiC semiconductor layer 102 is sandwiched between the body region 116 and the deep well region 145 in the normal direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

The source electrode layer 147 may have a stacked structure including a plurality of electrode layers. The source electrode layer 147 may include a1 st electrode layer and a 2 nd electrode layer stacked in this order from the SiC semiconductor layer 102 side.

The 1 st electrode layer may be a barrier electrode layer including a Ti (titanium) film and/or a TiN (titanium nitride) film. The 1 st electrode layer may have a laminated structure in which a Ti (titanium) film and a TiN (titanium nitride) film are laminated in this order from the SiC semiconductor layer 102 side. The 1 st electrode layer may have a single-layer structure formed of a Ti (titanium) film or a TiN (titanium nitride) film. The 2 nd electrode layer may also contain aluminum or tungsten.

As described above, according to the semiconductor device 301, the same effects as those described for the semiconductor device 201 can be obtained. In addition, in the semiconductor device 301, when a reverse bias voltage is applied, a current can preferentially flow into the schottky barrier diode 305.

This can suppress the propagation of crystal defects of SiC in the SiC semiconductor layer 102. As a result, the short-circuit tolerance can be improved, the feedback capacitance Crss can be reduced, and the increase in the on-resistance can be suppressed.

In this embodiment, an example in which the source electrode layer 147 forms schottky junction with the SiC semiconductor layer 102 in the sidewall contact hole 264 of the source insulating layer 146 is described. However, the source insulating layer 146 (the 1 st portion 302 and the 2 nd portion 303) may not be formed.

While embodiments 7 to 21 of the present invention have been described, embodiments 7 to 21 of the present invention can be implemented in other ways.

In the above-described embodiments 7 to 21, examples of forming the SiC epitaxial layer 112 having the high concentration regions 112a and the low concentration regions 112b by the epitaxial growth method are described. However, the SiC epitaxial layer 112 may be formed by the following steps.

First, the SiC epitaxial layer 112 having a relatively low n-type impurity concentration is formed by an epitaxial growth method. Next, an n-type impurity is introduced into the surface layer portion of the SiC epitaxial layer 112 by ion implantation. Thereby, the SiC epitaxial layer 112 having the high concentration regions 112a and the low concentration regions 112b is formed.

In the above-described embodiments 7 to 21, an example in which the SiC semiconductor layer 102 has a laminated structure including the SiC semiconductor substrate 111 and the SiC epitaxial layer 112 is described. However, the SiC semiconductor layer 102 may have a single-layer structure formed of the SiC semiconductor substrate 111. The SiC semiconductor layer 102 may have a single-layer structure formed of the SiC epitaxial layer 112.

In the above-described embodiments 7 to 21, a structure in which the conductivity type of each semiconductor portion is inverted may be employed. That is, the p-type portion may be n-type, and the n-type portion may be p-type.

In the above-described embodiments 7 to 21, examples of forming the gate electrode layer 132 and the gate wiring layer 133 including p-type polysilicon to which p-type impurities are added have been described. However, when importance is not attached to increase of the gate threshold voltage Vth, the gate electrode layer 132 and the gate wiring layer 133 may include n-type polysilicon to which n-type impurities are added instead of p-type polysilicon.

The low-resistance electrode layer 134 may be formed by silicidizing a portion of the gate electrode layer 132 (n-type polysilicon) where the surface layer portion is formed, with a metal material. That is, the low-resistance electrode layer 134 may include an n-type polycrystal. With this configuration, the gate resistance can be reduced.

In the above-described embodiments 7 to 21, the structure of the semiconductor device 221 may be adopted. That is, in the above-described embodiments 7 to 21, the p + -type SiC semiconductor substrate 222 may be used instead of the n + -type SiC semiconductor substrate 111. In this case, in the description of embodiments 7 to 13, the "source" is replaced with the "emitter" and the "drain" is replaced with the "collector".

Fig. 34 is a plan view showing a semiconductor device 311 according to embodiment 22 of the present invention. Fig. 35 is a bottom view of the semiconductor device 311 shown in fig. 34. Hereinafter, a structure corresponding to the structure described for the semiconductor device 101 will be described with the same reference numerals.

Referring to fig. 34, a semiconductor device 311 includes a SiC semiconductor layer 102 including SiC (silicon carbide) single crystal. The SiC semiconductor layer 102 may also include 4H — SiC single crystal.

The 4H-SiC single crystal has an off-angle inclined from the [0001] plane at an angle of 10 DEG or less with respect to the [ 11-20 ] direction. The deflection angle may be 0 ° or more and 4 ° or less. The declination angle may also be greater than 0 ° and less than 4 °. Typically, the off angle is set to a range of 2 ° or 4 °, more specifically, to a range of 2 ° ± 0.2 ° or a range of 4 ° ± 0.4 °.

In this embodiment, the SiC semiconductor layer 102 is formed in a rectangular parallelepiped sheet shape. The SiC semiconductor layer 102 has a1 st main surface 103 on one side, a 2 nd main surface 104 on the other side, and side surfaces 105A, 105B, 105C, and 105D connecting the 1 st main surface 103 and the 2 nd main surface 104. The 1 st main surface 103 and the 2 nd main surface 104 are formed in a rectangular shape (rectangular shape in this embodiment) in a plan view (hereinafter simply referred to as "plan view") viewed from the normal direction described above.

Side surface 105A is opposite to side surface 105C. Side surface 105B is opposite to side surface 105D. The four side surfaces 105A to 105D extend in a plane in the normal direction of the 1 st main surface 103 and the 2 nd main surface 104, respectively. The side surfaces 105A to 105D may have a length of 1mm or more and 10mm or less (for example, 2mm or more and 5mm or less).

An active region 106 and an outer region 107 are defined in the SiC semiconductor layer 102. The active region 106 is a region where a vertical MISFET is formed. The outer region 107 is a region outside the active region 106.

Active region 106 is set in the central portion of SiC semiconductor layer 102 with an interval from side surfaces 105A to 105D of SiC semiconductor layer 102 toward the inner region in a plan view. Active region 106 is formed in a rectangular shape (rectangular shape in this embodiment) having four sides parallel to four side surfaces 105A to 105D of SiC semiconductor layer 102 in a plan view.

Outer region 107 is set in a region between side surfaces 105A to 105D of SiC semiconductor layer 102 and the periphery of active region 106. Outer region 107 is set to be a dot-like shape (a rectangular ring shape) surrounding active region 106 in a plan view.

On the 1 st main surface 103 of the SiC semiconductor layer 102, a gate pad 108, a gate finger 109, and a source pad 110 are formed. Gate pad 108, gate finger 109, and source pad 110 may also comprise aluminum and/or copper.

Gate pad 108 is formed along side surface 105A of SiC semiconductor layer 102 in a plan view. Gate pad 108 is formed along a central region of side surface 105A of SiC semiconductor layer 102 in a plan view. Gate pad 108 may be formed along a corner portion connecting two of four side surfaces 105A to 105D of SiC semiconductor layer 102 in a plan view.

The gate pad 108 is formed in a quadrangular shape in a plan view. Gate pad 108 is drawn from outer region 107 into active region 106 so as to cross the boundary region between outer region 107 and active region 106 in a plan view.

The gate fingers 109 include outer gate fingers 109A and inner gate fingers 109B. The outer gate finger 109A is drawn from the gate pad 108 to the outer region 107. The outer gate fingers 109A extend in a band shape in the outer region 107.

In this embodiment, the outer gate finger 109A may be formed along the three side surfaces 105A, 105B, and 105D of the SiC semiconductor layer 102 so as to divide the active region 106 from three directions.

The inner gate finger 109B is drawn from the gate pad 108 toward the active region 106. The inner gate fingers 109B extend in a band in the active region 106. The inner gate finger 109B extends from the side of the side 105A toward the side of the side 105C.

Source pad 110 is formed in active region 106 at an interval from gate pad 108 and gate finger 109. The source pad 110 is formed in a C shape (inverted C shape in fig. 34) in a plan view so as to cover a C-shaped region (inverted C shape in fig. 34) defined by the gate pad 108 and the gate finger 109.

A gate voltage is applied to the gate pad 108 and the gate finger 109. The gate voltage may be 10V or more and 50V or less (for example, about 30V). An active voltage is applied to the source pad 110. The source voltage may also be a reference voltage (e.g., GND voltage).

On the 1 st main surface 103 of the SiC semiconductor layer 102 (more specifically, on the interlayer insulating layer 153), a resin layer 312 is formed. In fig. 34, the resin layer 312 is shown by hatching for the sake of clarity. Resin layer 312 encapsulates gate pad 108, gate finger 109, and source pad 110.

The resin layer 312 may contain a negative or positive photosensitive resin. In this embodiment, the resin layer 312 contains polybenzoxazole which is an example of a positive photosensitive resin. The resin layer 312 may contain polyimide, which is an example of a negative photosensitive resin.

The peripheral edge of resin layer 312 is formed at an interval inward from side surfaces 105A to 105D of SiC semiconductor layer 102. Thereby, the peripheral edge portion of the resin layer 312 exposes the 1 st main surface 103 of the SiC semiconductor layer 102. More specifically, the peripheral edge of the resin layer 312 exposes the interlayer insulating layer 153.

A gate pad opening 313 and a source pad opening 314 are formed in the resin layer 312. Gate pad opening 313 exposes gate pad 108. Source pad opening 314 exposes source pad 110.

Referring to fig. 35 and the enlarged view of fig. 35, a ridge group 316 including a plurality of ridges 315 is formed on the 2 nd main surface 104 of the SiC semiconductor layer 102. The plurality of raised portions 315 are portions raised in the direction of the normal to the 2 nd main surface 104 of the SiC semiconductor layer 102 on the 2 nd main surface 104 of the SiC semiconductor layer 102.

The plurality of protrusions 315 are formed at intervals in any of the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 1 st direction X is one direction of the plane direction of the 1 st main surface 103 of the SiC semiconductor layer 102.

In this embodiment, the 1 st direction X is set to be parallel to the side surfaces 105B and 105D of the SiC semiconductor layer 102. More specifically, the 2 nd direction Y is a direction orthogonal to the 1 st direction X. That is, in this embodiment, the 2 nd direction Y is set to be parallel to the side surfaces 105A and 105C of the SiC semiconductor layer 102.

The bump group 316 has a1 st portion 317 where several bumps 315 of the plurality of bumps 315 overlap in the 1 st direction X when viewed from the 1 st direction X.

In addition, the ridge portion group 316 has a 2 nd portion 318 which is formed apart from the 1 st portion 317 from several ridge portions 315 among the plurality of ridge portions 315 and overlaps in the 1 st direction X when viewed in the 1 st direction.

The plurality of ridges 315 are continuously formed in the 1 st direction X. More specifically, the plurality of protrusions 315 have a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of bumps 315 maintain the distribution pattern and are continuously formed in the 1 st direction X. In this embodiment, a plurality of ridge portions 315 are formed from the peripheral edge on one side surface 105A side to the peripheral edge on the other side surface 105C side of SiC semiconductor layer 102 in a plan view.

In the ridge portion group 316, the plurality of ridge portions 315 formed at intervals in the 1 st direction X may have different distances from each other. The distance between the plurality of ridges 315 formed at intervals in the 2 nd direction Y in the ridge group 316 may be different from each other.

The plurality of ridges 315 are formed in uneven shapes, sizes, and thicknesses, respectively. The thickness of the ridge portion 315 is a distance from the base to the top (tip) of the ridge portion 315 in the normal direction of the 2 nd main surface 104 of the SiC semiconductor layer 102.

Each of the plurality of bumps 315 may have a size larger than 0 μm and 10 μm or less. Each bump 315 may have a thickness of 500nm or less (for example, 1nm to 250 nm).

The ridge group 316 is formed in the 2 nd main surface 104 of the SiC semiconductor layer 102 in a range narrower than the width of the side surfaces 105A to 105D (in this embodiment, the side surfaces 105A and 105C) of the SiC semiconductor layer 102.

The ridge group 316 is formed, for example, in a range of 1 to 1 of 1000 minutes and 1 to 1 of 5 minutes of the width of the side surfaces 105A to 105D (in this embodiment, the side surfaces 105A and 105C) of the SiC semiconductor layer 102.

The ridge group 316 may be formed in a range of 200 minutes to 1 minute and 10 minutes to 1 minute of the width of the side surfaces 105A to 105D (in this embodiment, the side surfaces 105A and 105C) of the SiC semiconductor layer 102.

The bump group 316 may be formed in the range of 10 μm to 200 μm in the 2 nd direction Y. The bump group 316 may be formed in a range of 50 μm or more and 150 μm or less in the 2 nd direction Y. The bump group 316 may be formed in a range of 80 μm or more and 120 μm or less in the 2 nd direction Y.

The bump group 316 has a layout in which a plurality of bumps 315 are overlapped in the 1 st direction X when viewed from the 1 st direction X. Thus, the ridge group 316 forms a ridge group region 319 extending in a band-like manner in the 1 st direction X by an aggregate pattern of a plurality of ridges 315 continuously distributed in the 1 st direction X.

In other words, the ridge group region 319 includes a plurality of ridges 315 (ridge group 316) formed in a band-shaped region extending in the 1 st direction X on the 2 nd main surface 104 of the SiC semiconductor layer 102.

A plurality of ridge group 316 (ridge group regions 319) having such a form are formed on the 2 nd main surface 104 of the SiC semiconductor layer 102 at intervals in the 2 nd direction Y.

That is, the distribution pattern of the plurality of ridges 315 is intermittently formed when viewed from the 2 nd direction as viewed from the 2 nd direction Y. The distance between the plurality of protrusion groups 316 may have a value of 1% or more and 25% or less of the range in which the protrusion groups 316 are formed.

The distance between the plurality of protrusion groups 316 adjacent to each other in the 2 nd direction Y may be 100 μm or less. The distance between the plurality of bump groups 316 may be 5 μm or more and 50 μm or less. The distance between the plurality of ridge portions 316 may be 20 μm or less.

The 1 st direction X may be set to the [ 11-20 ] direction, and the 2 nd direction Y may be set to the [ 1-100 ] direction. That is, the ridge group 316 may be formed in a band-like ridge group region 319 extending substantially parallel or parallel to the [ 11-20 ] direction and a plurality of ridge group regions may be formed at intervals in the [ 1-100 ] direction.

The 1 st direction X may be set to the [ 1-100 ] direction, and the 2 nd direction Y may be set to the [ 11-20 ] direction. That is, the ridge group 316 may be formed in a band-like ridge group region 319 extending substantially parallel or parallel to the [ 1-100 ] direction and a plurality of ridge group regions may be formed at intervals in the [ 11-20 ] direction.

In a region between the 2 nd main surface 104 of the SiC semiconductor layer 102 and the ridge group 316 adjacent to each other in the 2 nd direction Y, a space 320 without a distribution pattern formed by the plurality of ridges 315 is defined.

The space 320 is divided into a belt shape extending parallel to the 1 st direction X by the ridge group 316 (ridge group region 319) adjacent to each other. As a result, a stripe pattern in which the ridge group 316 and the spaces 320 are alternately formed in the 2 nd direction Y is formed on the 2 nd main surface 104 of the SiC semiconductor layer 102.

A plurality of grooves 321 are formed in the 2 nd main surface 104 of the SiC semiconductor layer 102. In fig. 35 and the enlarged view of fig. 35, the groove 321 is indicated by a line. Grooves 321 are formed in the ridge group 316 and the spaces 320.

The grooves 321 include polishing marks generated by polishing a 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 described later. Therefore, the direction in which the groove 321 extends differs depending on the position at which the SiC semiconductor layer 102 is cut out from the SiC semiconductor wafer 331.

The groove 321 may also extend substantially parallel or parallel to each ridge group 316. Groove 321 may also include portions that intersect set of ridges 316. The groove 321 may extend in a direction intersecting or orthogonal to each ridge group 316. The groove 321 may extend linearly or in an arc shape.

Several of the plurality of ridges 315 included in each ridge group 316 are formed at intervals along the groove 321. That is, each ridge group 316 includes the 3 rd portions 322 in which several ridges 315 among the plurality of ridges 315 are formed at intervals along the groove 321 in a plan view.

Each ridge group 316 is formed by, for example, an annealing treatment. The plurality of ridges 315 may be laser-processed marks formed by a laser annealing process.

The plurality of protrusions 315 (the 3 rd portions 322 of the protrusion group 316) along the groove 321 may be formed by an annealing treatment on the irregularities defined by the groove 321 on the 2 nd main surface 104 of the SiC semiconductor layer 102 (the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331).

As shown in fig. 36A to 36D, each of the ridge group 316 can be formed in various ways by adjusting the annealing conditions (here, laser annealing conditions).

Fig. 36A is a diagram showing an example of the 2 nd embodiment of each protrusion group 316.

As shown in fig. 36A, the ridge group 316 may include a convex-curved ridge 315 extending in the 1 st direction X in a plan view and protruding in the 2 nd direction Y (the side surface 105B side in fig. 36A). The ridge portion 315 may be formed by a plurality of ridge portions 315 overlapping each other.

The distance between the 2 dots at the farthest distance in the ridge portion 315 may be 1 μm or more and 200 μm or less (about 50 μm in this embodiment example). The distance between the plurality of ridges 315 adjacent to each other in the 1 st direction X is set to a value of 10% or more of the size of the ridge 315. The plurality of protrusions 315 are formed by shifting the laser irradiation positions adjacent to each other in the 1 st direction X.

Fig. 36B is a diagram showing an example of the 3 rd embodiment of the bump group 316.

As shown in fig. 36B, the ridge portion group 316 may include a concave-curved ridge portion 315 extending in the 2 nd direction Y and recessed in the 1 st direction X in a plan view. The ridge portion 315 may be formed by a plurality of ridge portions 315 overlapping each other.

The distance between the 2 dots at the farthest distance in each bump 315 may be 1 μm or more and 200 μm or less (about 50 μm in this embodiment example). The plurality of ridges 315 are formed by overlapping laser irradiation positions adjacent to each other in a range of 50% to 70%.

Fig. 36C is a diagram showing an example of the 4 th mode for the bump group 316.

As shown in fig. 36C, the ridge portion group 316 may include linear ridge portions 315 extending in the 2 nd direction Y and recessed in the 1 st direction X in a plan view. The bump 315 may have a protrusion protruding in the 1 st direction X. The ridge portion 315 may be formed by a plurality of ridge portions 315 overlapping each other.

The distance between the 2 dots at the farthest distance in the ridge portion 315 may be 1 μm or more and 200 μm or less (50 μm or so in this embodiment example). The plurality of ridges 315 are formed by overlapping laser irradiation positions adjacent to each other in a range of 70% to 90%.

Fig. 36D is a diagram showing an example of the 5 th embodiment of the bulge group 316.

As shown in fig. 36D, the bump group 316 may have a layout in which a bump row including a plurality of bumps 315 arranged at intervals in the 2 nd direction Y is formed at intervals in the 1 st direction X.

The distance between the 2 dots at the farthest distance in the ridge portion 315 may be 1 μm or more and 200 μm or less (about 5 μm in this embodiment example). The plurality of ridges 315 are formed by overlapping laser irradiation positions adjacent to each other in a range of 90% or more and less than 100%.

Fig. 37 is an enlarged view of a region XXXVII shown in fig. 34, in which a structure above the 1 st main surface 103 of the SiC semiconductor layer 102 is removed. Fig. 38 is a cross-sectional view taken along line XXXVIII-XXXVIII of fig. 37. Fig. 39 is a cross-sectional view taken along line XXXIX-XXXIX of fig. 37. Fig. 40 is an enlarged view of the region XL shown in fig. 39.

Referring to fig. 37 to 39, the semiconductor device 311 has the same planar structure and cross-sectional structure as the semiconductor device 101, except that the ridge group 316 is formed on the 2 nd main surface 104 of the SiC semiconductor layer 102.

Referring to fig. 40, a ridge group 316 (a plurality of ridges 315) and a groove 321 are formed in the SiC semiconductor substrate 111. A modified layer 323 in which a part of SiC of the SiC semiconductor layer 102(SiC semiconductor substrate 111) is modified to another property is formed on the surface layer portion of the 2 nd main surface 104 of the SiC semiconductor layer 102. The modified layer 323 is formed by an annealing treatment method for the 2 nd main surface 104 of the SiC semiconductor layer 102.

The modified layer 323 contains Si atoms and C atoms. More specifically, the modified layer 323 has a carbon density lower than that of the region outside the modified layer 323 in the SiC semiconductor layer 102(SiC semiconductor substrate 111).

In addition, the modified layer 323 has a higher silicon density than carbon density. That is, the modified layer 323 includes a Si modified layer of the SiC semiconductor layer 102(SiC semiconductor substrate 111) in which SiC is modified to Si. The Si modification layer may also be a Si amorphous layer.

The modified layer 323 may also contain lattice defects caused by modification of SiC. That is, the modified layer 323 may include lattice defect regions having defect levels introduced by modification of SiC.

In this embodiment, the modified layer 323 is formed in a region along the ridge group 316 in the surface layer portion of the 2 nd main surface 104 of the SiC semiconductor layer 102. Thus, in each ridge group 316, the plurality of ridges 315 are formed of the modified layer 323.

In this manner, modified layer 323 extends further from set of ridges 316 toward space 320. That is, the annealing treatment for the 2 nd main surface 104 of the SiC semiconductor layer 102 spreads to the space 320.

The thickness of the portion of modified layer 323 along ridge group 316 is equal to or greater than the thickness of the portion of modified layer 323 along space 320 due to the presence of ridge 315. More specifically, the thickness of the portion along ridge group 316 in modified layer 323 is greater than the thickness of the portion along space 320 in modified layer 323.

The thickness of the modified layer 323 may be 1nm or more and 1000nm or less. The thickness Ta of the region of the modified layer 323 where the ridge portion 315 is formed may be 50nm or more and 1000nm or less. The thickness Tb of the modified layer 323 in the region outside the ridge portion 315 may be 1nm or more and 300nm or less.

The thickness Ta may be 50nm or more and 100nm or less. The thickness Ta may be 100nm or more and 150nm or less. The thickness Ta may be 150nm or more and 200nm or less. The thickness Ta may be 200nm or more and 250nm or less.

The thickness Ta may be 250nm or more and 300nm or less. The thickness Ta may be 300nm or more and 350nm or less. The thickness Ta may be 350nm or more and 400nm or less. The thickness Ta may be 400nm or more and 450nm or less. The thickness Ta may be 450nm or more and 500nm or less.

The thickness Ta may be 500nm or more and 600nm or less. The thickness Ta may be 600nm or more and 700nm or less. The thickness Ta may be 700nm to 800 nm. The thickness Ta may be 800nm or more and 900nm or less. The thickness Ta may be 900nm or more and 1000nm or less.

The thickness Tb may be 1nm to 10 nm. The thickness Tb may be 10nm to 50 nm. The thickness Tb may be 50nm or more and 100nm or less.

The thickness Tb may be 100nm to 150 nm. The thickness Tb may be 150nm to 200 nm. The thickness Tb may be 200nm to 250 nm. The thickness Tb may be 250nm to 300 nm.

The thickness Tb may be 1/2 or less, 1/3 or less, 1/4 or less, 1/5 or less, 1/6 or less, 1/7 or less, 1/8 or less, 1/9 or less, 1/10 or less, 1/11 or less, 1/12 or less, 1/13 or less, 1/14 or less, 1/15 or less, 1/16 or less, 1/17 or less, 1/18 or less, 1/19 or less, or 1/20 or less of the thickness Ta.

The resistance value of the 2 nd main surface 104 in the case where the ridge group 316 is not present on the 2 nd main surface 104 of the SiC semiconductor layer 102 is larger than the resistance value of the 2 nd main surface 104 in the case where the ridge group 316 is present on the 2 nd main surface 104 of the SiC semiconductor layer 102.

That is, as the electrical characteristics, the plurality of ridge portions 316 have a resistance value equal to or less than the resistance value of the SiC single crystal. More specifically, the plurality of bump groups 316 have a resistance value smaller than that of the SiC single crystal.

The plurality of bump groups 316 have a resistance value equal to or lower than the resistance value of the space 320. More specifically, the plurality of bump groups 316 have a resistance value smaller than that of the space 320.

The resistance value of the bump group 316 is reduced by the modified layer 323. That is, the resistance value of the ridge portion group 316 is equal to or lower than the resistance value of the SiC single crystal due to the modified layer 323 modified by the properties of SiC. In addition, the resistance value of the space 320 is also reduced by the modified layer 323.

In this embodiment, the drain pad 113 is directly connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. The drain pad 113 covers the ridge group 316 on the 2 nd main surface 104 of the SiC semiconductor layer 102. The drain pad 113 collectively covers the plurality of bump groups 316.

The drain pad 113 is formed in a film shape so as to follow the outer surface of the bump group 316 (the outer surface of the plurality of bumps 315) and the inner surface of the groove 321. Thus, the portion of the outer surface of the drain pad 113 covering the bump group 316 (the plurality of bumps 315) is formed with a bump 113a that bumps in a direction away from the 2 nd main surface 104. In addition, a recessed portion 113b recessed toward the 2 nd main surface 104 is formed in a portion of the outer surface of the drain pad 113 covering the groove 321.

The drain pad 113 forms ohmic contact with the 2 nd main surface 104 of the SiC semiconductor layer 102. More specifically, the drain pad 113 forms an ohmic contact with the bump group 316.

More specifically, the drain pad 113 forms ohmic contact with the plurality of bump groups 316. In this embodiment, the drain pad 113 also forms an ohmic contact with the space 320.

The drain pad 113 has a laminated structure including a plurality of electrode layers laminated on the 2 nd main surface 104 of the SiC semiconductor layer 102. In this embodiment, the drain pad 113 has a four-layer structure including a Ti layer 324, a Ni layer 325, an Au layer 326, and an Ag layer 327 stacked in this order from the 2 nd main surface 104 of the SiC semiconductor layer 102.

The Ti layer 324, the Ni layer 325, the Au layer 326, and the Ag layer 327 are formed in a film shape in conformity with the outer surface of the bump group 316 (the outer surface of the plurality of bumps 315) and the inner surface of the groove 321. The raised portion 113a and the recessed portion 113b of the drain pad 113 are formed on the outer surface of the Ag layer 327.

The Ti layer 324 is directly connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. The Ti layer 324 collectively covers the plurality of ridge portions 316, and forms ohmic contact with the 2 nd main surface 104 of the SiC semiconductor layer 102. In this manner, the Ti layer 324 also forms an ohmic contact with the space 320.

The Ni layer 325 coats substantially the entire region or the entire region of the Ti layer 324. The Au layer 326 coats substantially the entire region or the entire region of the Ni layer 325. The Ag layer 327 covers substantially the entire area or the entire area of the Au layer 326.

The thickness of the Ti layer 324 may be 0.01 μm or more and 5 μm or less (e.g., about 0.07 μm). The thickness of the Ni layer 325 may be 0.1 μm or more and 40 μm or less (e.g., about 1.2 μm).

The thickness of the Au layer 326 may be 0.1 μm or more and 40 μm or less (e.g., about 0.07 μm). The thickness of the Ag layer 327 may be 0.1 μm or more and 40 μm or less (e.g., about 0.3 μm). Of course, the drain pad 113 may have a single-layer structure including the Ti layer 324, the Ni layer 325, the Au layer 326, or the Ag layer 327.

The drain pad 113 forms ohmic contact with the 2 nd main surface 104 of the SiC semiconductor layer 102 not via a silicide layer whose main component contains silicide. The drain pad 113 forms ohmic contact with each bump group 316 not via the silicide layer containing silicide as a main component.

The drain pad 113 forms ohmic contact with the 2 nd main surface 104 of the SiC semiconductor layer 102 not via a carbon layer containing carbon as a main component. The drain pad 113 forms ohmic contact with each bump group 316 not via a carbon layer containing carbon as a main component.

The drain pad 113 does not include a region where the main component silicide-containing material is formed in a layered shape. In addition, the drain pad 113 does not include a region in which a material whose main component contains carbon is formed in a layered shape.

Fig. 41A is a plan view showing a SiC semiconductor wafer 331 used for manufacturing the semiconductor device 311 shown in fig. 34. Fig. 41B is a bottom view of the SiC semiconductor wafer 331 shown in fig. 41A, and shows a state in which the polishing step and the annealing treatment are performed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331.

Referring to fig. 41A and 41B, the SiC semiconductor wafer 331 is made of a plate-like SiC single crystal formed into a disk shape. The SiC semiconductor wafer 331 serves as a base of the SiC semiconductor substrate 111.

The SiC semiconductor wafer 331 has a1 st wafer main surface 332 on one side, a 2 nd wafer main surface 333 on the other side, and a wafer side surface 334 connecting the 1 st wafer main surface 332 and the 2 nd wafer main surface 333.

The SiC semiconductor wafer 331 may also include 4H — SiC single crystal. The 1 st wafer main surface 332 of the SiC semiconductor wafer 331 has an off-angle inclined at an angle of 10 ° or less with respect to the [ 11-20 ] direction from the (0001) plane.

The deflection angle may be 0 ° or more and 4 ° or less. The declination angle may also be greater than 0 ° and less than 4 °. Typically, the deflection angle is set in the range of 2 ° or 4 °, more specifically, in the range of 2 ° ± 0.2 ° or in the range of 4 ° ± 0.4 °.

One or more (one in this embodiment) orientation flat(s) 335 representing the crystal orientation are formed on the wafer side surface 334 of the SiC semiconductor wafer 331. The orientation flat 335 is a cutout portion formed in the peripheral edge of the SiC semiconductor wafer 331. In this manner, the orientation flat 335 extends linearly along the 11-20 direction.

The 1 st wafer main surface 332 is an element formation surface on which MISFETs are formed. A plurality of device formation regions 336 corresponding to the semiconductor devices 311 are set on the 1 st wafer main surface 332.

In this manner, the plurality of device formation regions 336 are arranged in rows and columns along the [ 11-20 ] direction ([ -1-120 ] direction) and the [ -1100 ] direction ([ 1-100 ] direction).

A lattice-shaped region that divides the plurality of device formation regions 336 is a cut line 337. The semiconductor device 311 is cut by cutting the SiC semiconductor wafer 331 along the peripheral edge (dicing line 337) of the plurality of device formation regions 336.

Referring to fig. 41B, after the polishing step and the annealing treatment for the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331, a plurality of ridge groups 316 and a plurality of polishing scratches 338 are formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331.

The plurality of bump groups 316 are formed in a stripe shape substantially parallel or parallel to the orientation flat 335. The plurality of bump groups 316 may also be formed in a stripe shape intersecting or orthogonal to the orientation flat 335.

Each of the plurality of polishing scratches 338 extends in an arc shape from the central portion toward the peripheral portion of the SiC semiconductor wafer 331. The plurality of grinding scratches 338 generally include grinding scratches 338 that intersect the [ 11-20 ] direction and the [ 1-100 ] direction.

In addition, the plurality of grinding scratches 338 include grinding scratches 338 extending substantially in parallel or parallel to the [ 11-20 ] direction or the [ 1-100 ] direction in a portion along the [ 11-20 ] direction or the [ 1-100 ] direction at a tangent of the circular arc. The groove 321 formed in the 2 nd main surface 104 of the SiC semiconductor layer 102 may be formed by a part of the grinding mark 338.

Fig. 42 is a flowchart for explaining an example of the method for manufacturing the semiconductor device 311 shown in fig. 34.

Fig. 43A to 43I are cross-sectional views for explaining a method of manufacturing the semiconductor device 311 shown in fig. 34.

In the method of manufacturing the semiconductor device 311, the process of processing the 2 nd wafer main surface 333 is performed before the step of forming the drain pad 113 (see fig. 17L) in the method of manufacturing the semiconductor device 101. The process of processing the 2 nd wafer main surface 333 may be performed after the process of forming the gate pad 108, the gate finger 109, and the source pad 110.

Referring to fig. 43A, first, the steps of fig. 17A to 17L are performed to prepare a SiC semiconductor wafer 331 in which MISFETs are formed on the 1 st wafer main surface 332. The 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is in an unprocessed state.

Next, referring to fig. 43B, the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is polished (step S1 of fig. 42). In this step, the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is polished with abrasive grains having a grain size of 500 # or more.

The abrasive grains preferably have a grain size of 1000 # or more and 5000 # or less. As a result, a plurality of polishing traces 338 are formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 (see also fig. 41B). In addition, in this way, the SiC semiconductor wafer 331 becomes thinner while the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is flattened.

Next, referring to fig. 43C, a metal layer 341 is formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 (step S2 of fig. 42). In this embodiment, the metal layer 341 is formed of an Ni layer. The Ni layer may be formed by a sputtering method. The thickness of the Ni layer may be set toAbove andthe following.

Next, referring to fig. 43D, the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is subjected to an annealing treatment (step S3 of fig. 42). In this step, a laser annealing treatment method is performed as an example of the annealing treatment method.

In the laser annealing treatment method, a laser beam having a diameter of 50 μm or more and 200 μm (for example, about 100 μm) is usedThe pulsed laser of (1). The pulsed laser is a UV laser having a wavelength in the ultraviolet region. The energy of the pulsed laser may be 1.0J/cm²Above and 4.0J/cm²The following (e.g., 3.0J/cm)²Left and right).

The pulsed laser light enters the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 via the metal layer 341. In this embodiment, the pulsed laser light enters the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 while moving the irradiation position along the orientation flat 335.

One or more ridge portions 315 are formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 in a region where the pulse laser light enters, in the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331.

Further, a modified layer 323 in which SiC of the SiC semiconductor wafer 331 is modified to another property is formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 in a region into which the pulse laser light enters. More specifically, SiC of the SiC semiconductor wafer 331 is modified into Si by heating to cause C atoms to be desorbed from SiC and/or sublimated.

Thereby, the modified layer 323 including the Si modified layer was formed. The modification layer 323 may also contain a silicon amorphous layer. The modification layer 323 may also contain a C atom. The one or more ridge portions 315 formed on the 2 nd wafer main surface 333 may be formed of the modified layer 323.

Also, the pulsed laser light enters continuously in a direction along the orientation flat 335, forming a plurality of ridges 315 along the orientation flat 335. Thus, one protrusion group 316 including the plurality of protrusions 315 and extending in the [ 11-20 ] direction is formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331.

When one ridge group 316 is formed, the irradiation position of the pulse laser is moved in the [ 1-100 ] direction. Then, the pulsed laser light enters the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 while moving the irradiation position along the orientation flat 335 again.

Thus, another ridge group 316 extending substantially parallel or parallel to the first ridge group 316 is formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331.

In the laser annealing method, such steps are repeated until a plurality of protrusion groups 316 are formed over substantially the entire region or the entire region of the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 (also see fig. 41B).

In this embodiment, the metal layer 341 subjected to the laser annealing treatment has a laminated structure including a carbon layer 342, an NiSi (nickel silicide) layer 343, and an Ni layer 344 laminated in this order from the 2 nd wafer main surface 333 side of the SiC semiconductor wafer 331.

That is, the laser annealing treatment method includes a step of reacting the metal layer 341 with the SiC semiconductor wafer 331 to perform silicidation. More specifically, the laser annealing treatment method includes a step of forming the NiSi layer 343.

In the laser annealing treatment method, in addition to the NiSi layer 343, a carbon layer 342 containing C atoms is formed as a by-product in the metal layer 341. The carbon layer 342 is formed by precipitation of C atoms constituting SiC.

In the metal layer 341, the carbon layer 342 and the NiSi layer 343 can serve as peeling starting points. That is, although metal layer 341 can be used as it is as drain pad 113, metal layer 341 has a problem of poor connection and an increase in resistance value due to the poor connection. Therefore, a metal layer different from the preferable metal layer 341 is preferably formed as the drain pad 113.

The temperature given to metal layer 341 with the formation of NiSi layer 343 is not less than the melting point of gate pad 108, gate finger 109, and source pad 110 (e.g., not less than 1000 °).

According to the laser annealing method, the temperature of the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 can be locally increased, and therefore the gate pad 108, the gate finger 109, and the source pad 110 do not need to be heated. Therefore, melting of the gate pad 108, the gate finger 109, and the source pad 110 can be appropriately suppressed.

Next, referring to fig. 43E, a step of removing the metal layer 341 is performed. The metal layer 341 is removed until the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is exposed.

In this step, first, NiSi layer 343 and Ni layer 344 in metal layer 341 are removed (step S4 in fig. 42). The NiSi layer 343 and the Ni layer 344 can be removed by wet etching.

Next, referring to fig. 43F, the carbon layer 342 in the metal layer 341 is removed (step S5 in fig. 42). The carbon layer 342 may also be removed by dry etching.

Next, referring to fig. 43G, the NiSi layer 343 and the Ni layer 344 adhering to the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 are removed (step S6 in fig. 42). The NiSi layer 343 and the Ni layer 344 can be removed by wet etching.

Next, referring to fig. 43H, the carbon layer 342 residue adhering to the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 is removed (step S7 of fig. 42). The carbon layer 342 may also be removed by dry etching.

Next, the natural oxide film is removed from the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 (step S8 in fig. 42). The native oxide film may be removed by wet etching.

Thus, in this embodiment, the step of removing the layer containing Ni (NiSi layer 343 and Ni layer 344) and the step of removing the layer containing carbon (carbon layer 342) are repeated twice.

This enables the metal layer 341 to be removed appropriately. After the step of removing the metal layer 341, the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 of which the resistance value is reduced by the laser annealing treatment is appropriately exposed.

Next, referring to fig. 43I, the drain pad 113 is formed on the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331 (step S9 of fig. 42).

This step includes a step of forming a Ti layer 324, a Ni layer 325, an Au layer 326, and an Ag layer 327 in this order from above the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331. The Ti layer 324, the Ni layer 325, the Au layer 326, and the Ag layer 327 may be formed by a sputtering method.

In the drain pad 113, the Ti layer 324 is directly connected to the 2 nd wafer main surface 333 of the SiC semiconductor wafer 331. The Ti layer 324 collectively covers the plurality of bump groups 316, and ohmic contacts are formed between the plurality of bump groups 316 and between the plurality of spaces 320.

Subsequently, the SiC semiconductor wafer 331 is cut along the peripheral edge (dicing line 337) of the plurality of device forming regions 336. Thereby, a plurality of semiconductor devices 311 are cut out from the SiC semiconductor wafer 331. Through the steps including the above steps, the semiconductor device 311 is manufactured.

As described above, according to the semiconductor device 311, the same effects as those described for the semiconductor device 101 can be obtained. In the semiconductor device 311, the connection area of the drain pad 113 to the 2 nd main surface 104 of the SiC semiconductor layer 102 can be increased by the ridge group 316. This can improve the electrical characteristics.

More specifically, the drain pad 113 forms an ohmic contact with the bump group 316. This can provide favorable ohmic characteristics between the SiC semiconductor layer 102 and the drain pad 113, and thus can improve electrical characteristics.

In addition, according to the semiconductor device 311, the drain pad 113 is directly connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. More specifically, the drain pad 113 forms ohmic contact with the bump group 316 without passing through the carbon layer. In addition, the drain pad 113 forms ohmic contact with the bump group 316 without via the silicide layer.

The carbon layer and the silicide layer are likely to be peeling starting points. Therefore, due to the structure in which the drain pad 113 is directly connected to the 2 nd main surface 104 of the SiC semiconductor layer 102, an increase in the resistance value due to a connection failure or a connection failure can be appropriately suppressed.

Fig. 44 is a bottom view corresponding to fig. 35, and is a bottom view showing a semiconductor device 351 according to embodiment 23 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 311 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 44, semiconductor device 351 includes a plurality of bump groups 316 including a1 st bump group 316A and a 2 nd bump group 316B.

The 1 st bump group 316A includes a plurality of 1 st bumps 315A formed on the 2 nd main surface 104 of the SiC semiconductor layer 102. The plurality of 1 st raised portions 315A are portions raised in the direction of the normal to the 2 nd main surface 104 of the SiC semiconductor layer 102 on the 2 nd main surface 104 of the SiC semiconductor layer 102.

The plurality of 1 st bumps 315A are formed at intervals from each other in the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 1 st bump 315A has a1 st portion 317A, and the 1 st portion 317A is a portion where several 1 st bumps 315A of the plurality of 1 st bumps 315A overlap in the 1 st direction X when viewed from the 1 st direction X.

The 1 st ridge 315A has a 2 nd portion 318A, and the 2 nd portion 318A is a portion where several 1 st ridges 315A of the plurality of 1 st ridges 315A are formed apart from the 1 st portion 317A and overlap in the 1 st direction X when viewed in the 1 st direction.

The plurality of 1 st bumps 315A are continuously formed in the 1 st direction X. More specifically, the 1 st raised portions 315A have a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of 1 st bumps 315A maintain the distribution pattern and are continuously formed in the 1 st direction X. In this embodiment, the distribution pattern of the plurality of 1 st raised portions 315A is formed from the peripheral edge on one side surface 105A side to the peripheral edge on the other side surface 105C side of SiC semiconductor layer 102 in a plan view.

The 1 st bump group 316A has a layout in which a plurality of bumps 315 are overlapped in the 1 st direction X when viewed from the 1 st direction X. Thus, the 1 st group of ridges 316A forms a1 st group of ridges 319A extending in a band-like manner in the 1 st direction X from the collective pattern of the plurality of ridges 315 continuously distributed in the 1 st direction X.

In other words, the 1 st ridge group region 319A includes a plurality of 1 st ridges 315A (1 st ridge group 316A) formed in a stripe-shaped region extending in the 1 st direction X on the 2 nd main surface 104 of the SiC semiconductor layer 102.

The 2 nd bump group 316B includes a plurality of 2 nd bumps 315B formed on the 2 nd main surface 104 of the SiC semiconductor layer 102. The plurality of 2 nd raised parts 315B are portions raised in the direction of the normal to the 2 nd main surface 104 of the SiC semiconductor layer 102 on the 2 nd main surface 104 of the SiC semiconductor layer 102.

The plurality of 2 nd protrusions 315B are formed at intervals from each other in the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 2 nd bump group 316B has a1 st portion 317B, and the 1 st portion 317B is a portion where several 2 nd bump portions 315B of the plurality of 2 nd bump portions 315B overlap in the 2 nd direction Y when viewed from the 2 nd direction Y.

In addition, the 2 nd bump group 316B has the 2 nd portion 318B, and the 2 nd portion 318B is a portion where several 2 nd bumps 315B among the plurality of 2 nd bumps 315B are formed separately from the 1 st portion 317B and overlap in the 2 nd direction Y as viewed in the 2 nd direction.

The plurality of 2 nd bump portions 315B are continuously formed in the 2 nd direction Y. More specifically, the plurality of 2 nd protrusions 315B have a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of 2 nd bump portions 315B maintain the distribution pattern and are continuously formed in the 2 nd direction Y. In this embodiment, the distribution pattern of the plurality of 2 nd ridge portions 315B is formed from the peripheral edge on one side surface 105B side to the peripheral edge on the other side surface 105D side of the SiC semiconductor layer 102 in a plan view.

The 2 nd bump group 316B has a layout in which a plurality of 2 nd bumps 315B overlap in the 2 nd direction Y when viewed from the 2 nd direction Y. Thus, the 2 nd ridge group 316B forms a 2 nd ridge group region 319B extending in a band-like manner in the 2 nd direction Y from the collective pattern of the plurality of 2 nd ridges 315B distributed continuously in the 2 nd direction Y.

In other words, the 2 nd ridge group region 319B includes a plurality of 2 nd ridges 315B (the 2 nd ridge group 316B) formed in a stripe-shaped region extending in the 2 nd direction Y on the 2 nd main surface 104 of the SiC semiconductor layer 102.

The 2 nd protrusion group 316B (the 2 nd protrusion group region 319B) traverses the 1 st protrusion group 316A (the 1 st protrusion group region 319A). Thus, intersection region 352 where 1 st bump group 316A (1 st bump group region 319A) and 2 nd bump group 316B (2 nd bump group region 319B) intersect with each other is formed on 2 nd main surface 104 of SiC semiconductor layer 102.

In this embodiment, a plurality of the 1 st bump groups 316A are formed on the 2 nd main surface 104 of the SiC semiconductor layer 102 with a space therebetween in the 2 nd direction Y. That is, the distribution pattern of the plurality of 1 st bump portions 315A is intermittently formed with respect to the 2 nd direction Y.

In this embodiment, a plurality of the 2 nd ridge group 316B are formed at intervals in the 1 st direction X on the 2 nd main surface 104 of the SiC semiconductor layer 102. That is, the distribution pattern of the plurality of 2 nd protrusions 315B is intermittently formed with respect to the 1 st direction X.

Therefore, in this embodiment, the intersection regions 352 are formed in a row-and-column arrangement with a space therebetween in the 1 st direction X and the 2 nd direction Y. The 1 st protruding part group 316A and the 2 nd protruding part group 316B define a space 320. The spaces 320 are formed in a row-and-column arrangement with spaces therebetween in the 1 st direction X and the 2 nd direction Y.

In intersection region 352, plurality of 1 st ridges 315A and plurality of 2 nd ridges 315B may overlap each other. The thickness of the plurality of 1 st ridges 315A and the plurality of 2 nd ridges 315B formed in intersection area 352 may be greater than the thickness of the 1 st ridges 315A and the 2 nd ridges 315B formed in areas other than intersection area 352.

The number of the plurality of 1 st ridges 315A and the plurality of 2 nd ridges 315B formed in the intersection region 352 may be larger than the number of the 1 st ridges 315A and the 2 nd ridges 315B formed in the region other than the intersection region 352.

The 1 st direction X may be set to the [ 11-20 ] direction, and the 2 nd direction Y may be set to the [ 1-100 ] direction. That is, group 1 of protrusions 316A (group 1 protrusion area 319A) may be formed substantially parallel or parallel to the [ 11-20 ] direction, and group 2 of protrusions 316B (group 2 protrusion area 319B) may be formed substantially parallel or parallel to the [ 1-100 ] direction.

The 1 st direction X may be set to the [ 1-100 ] direction, and the 2 nd direction Y may be set to the [ 11-20 ] direction. That is, group 1 of ridges 316A (group 1 ridges area 319A) is formed substantially parallel or parallel to the [ 1-100 ] direction, and group 2 of ridges 316B (group 2 ridges area 319B) is formed substantially parallel or parallel to the [ 11-20 ] direction.

The 1 st raised part 315A and the 1 st raised part group 316A correspond to the raised parts 315 and the raised part group 316 of embodiment 22. The explanation of the ridge portion 315 and the ridge portion group 316 in embodiment 22 is applied to the explanation of the 1 st ridge portion 315A and the 1 st ridge portion 316A, and other specific explanations of the 1 st ridge portion 315A and the 1 st ridge portion group 316A are omitted.

The 2 nd raised part 315B and the 2 nd raised part group 316B correspond to the raised parts 315 and the raised part group 316 of the 22 nd embodiment. The explanation of the ridge portion 315 and the ridge portion group 316 in embodiment 22 is applied to other explanations of the 2 nd ridge portion 315B and the 2 nd ridge portion group 316B, and other specific explanations of the 2 nd ridge portion 315B and the 2 nd ridge portion group 316B are omitted.

In this embodiment, drain pad 113 covers first group of protrusions 316A and second group of protrusions 316B on second main surface 104 of SiC semiconductor layer 102. In this embodiment, the drain pad 113 covers the plurality of 1 st bump groups 316A and the plurality of 2 nd bump groups 316B together.

Drain pad 113 is formed in a film shape in conformity with the outer surface of 1 st bump group 316A (the outer surface of 1 st bump 315A), the outer surface of 2 nd bump group 316B (the outer surface of 2 nd bump 315B), and the inner surface of groove 321.

Thus, although not shown, the bump 113a is formed in a portion of the outer surface of the drain pad 113 that covers the 1 st bump group 316A (1 st bump 315A) and the 2 nd bump group 316B (2 nd bump 315B). In addition, a recess 113b is formed in a portion of the outer surface of the drain pad 113 covering the groove 321.

The drain pad 113 forms ohmic contact with the 2 nd main surface 104 of the SiC semiconductor layer 102. More specifically, the drain pad 113 forms ohmic contact with the 1 st bump group 316A and the 2 nd bump group 316B.

More specifically, the drain pad 113 forms ohmic contacts between the plurality of 1 st bump groups 316A and the plurality of 2 nd bump groups 316B. In this embodiment, the drain pad 113 also forms an ohmic contact with the space 320.

The portion of drain pad 113 covering first bump group 316A and second bump group 316B is engaged with a concave-convex portion defined by a plurality of first bump groups 316A, a plurality of second bump groups 316B, and a plurality of grooves 321.

That is, the contact area of the drain pad 113 with respect to the 2 nd main surface 104 of the SiC semiconductor layer 102 is increased by the plurality of 1 st bump groups 316A, the plurality of 2 nd bump groups 316B, and the plurality of grooves 321. This improves the adhesion of the drain pad 113 to the 2 nd main surface 104 of the SiC semiconductor layer 102.

The semiconductor device 351 having such a structure is manufactured by performing the following steps in the above-described laser annealing step (step S3 in fig. 42).

First, a plurality of 1 st bump groups 316A are formed in a direction substantially parallel or parallel to the orientation flat 335 by a laser annealing treatment method. Next, a plurality of 2 nd bump groups 316B are formed in a direction intersecting (orthogonal to) the orientation flat 335 by a laser annealing treatment method.

In this step, a plurality of 1 st bump groups 316A are formed in a direction intersecting (orthogonal to) the orientation flat 335, and a plurality of 2 nd bump groups 316B may be formed in a direction substantially parallel or parallel to the orientation flat 335. Then, the semiconductor device 351 is manufactured through the steps from step S4 to step S9 in fig. 42.

The 1 st protrusion group 316A and the 2 nd protrusion group 316B may be formed in an arbitrary order. Therefore, the plurality of 1 st bump groups 316A may also be formed after the plurality of 2 nd bump groups 316B are formed. In addition, the plurality of 1 st ridge groups 316A and the plurality of 2 nd ridge groups 316B may be alternately formed.

As described above, the semiconductor device 351 can achieve the same effects as those described for the semiconductor device 311.

Fig. 45 is a cross-sectional view corresponding to fig. 39, and is a cross-sectional view showing a semiconductor device 361 according to embodiment 24 of the present invention. Figure 46 is an enlarged view of region XLVI shown in figure 45. Hereinafter, structures corresponding to the structures described for the semiconductor device 311 are denoted by the same reference numerals, and description thereof is omitted.

In the semiconductor device 361, the drain pad 113 has a three-layer structure including a Ni layer 325, an Au layer 326, and an Ag layer 327 stacked in this order from the 2 nd main surface 104 of the SiC semiconductor layer 102. That is, the drain pad 113 is formed by omitting the formation process of the Ti layer 324 in step S9 of fig. 42.

The Ni layer 325 is directly connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. The Ni layer 325 collectively covers the plurality of bump groups 316.

The Ni layer 325 forms ohmic contacts with the bump group 316 and with the space 320. The Au layer 326 coats substantially the entire region or the entire region of the Ni layer 325. The Ag layer 327 covers substantially the entire area or the entire area of the Au layer 326.

As described above, the semiconductor device 361 can achieve the same effects as those described for the semiconductor device 311. In the semiconductor device 361, the drain pad 113 may have a single-layer structure including the Ni layer 325.

Fig. 47 is a cross-sectional view corresponding to fig. 39, and is a cross-sectional view showing a semiconductor device 371 according to embodiment 25 of the present invention. FIG. 48 is an enlarged view of region XLVIII shown in FIG. 47. Hereinafter, structures corresponding to the structures described for the semiconductor device 311 are denoted by the same reference numerals, and description thereof is omitted.

In the semiconductor device 371, the drain pad 113 includes a metal layer 341, an Au layer 326, and an Ag layer 327. In this embodiment, the metal layer 341 has a laminated structure including a carbon layer 342, an NiSi layer 343, and an Ni layer 344 laminated in this order from the 2 nd main surface 104 side of the SiC semiconductor layer 102.

The metal layer 341 is connected to the 2 nd main surface 104 of the SiC semiconductor layer 102. The metal layer 341 collectively covers the plurality of bump groups 316.

The metal layer 341 forms ohmic contacts with the set of ridges 316 and with the space 320. The Au layer 326 covers substantially the entire area or the entire area of the metal layer 341. The Ag layer 327 covers substantially the entire area or the entire area of the Au layer 326.

The semiconductor device 371 is formed by omitting the step of removing the metal layer 341 (see steps S4 to S8 shown in fig. 42) in fig. 42. In the semiconductor device 371, in step S9 of fig. 42 described above, an Au layer 326 and an Ag layer 327 are formed on the metal layer 341.

As described above, according to the semiconductor device 371, the drain pad 113 includes the carbon layer 342 and the NiSi layer 343. According to the semiconductor device 371, the connection strength of the drain pad 113 cannot be improved as in the case of the semiconductor device 311, but the effects substantially equal to those described for the semiconductor device 311 can be obtained. In the semiconductor device 371, the drain pad 113 may be formed only of the metal layer 341.

While the 22 nd to 25 th embodiments of the present invention have been described above, the 22 nd to 25 th embodiments of the present invention can be implemented in other forms.

In the above-described 22 th to 25 th embodiments, an example in which the SiC semiconductor layer 102 has a laminated structure including the SiC semiconductor substrate 111 and the SiC epitaxial layer 112 is described.

However, the SiC semiconductor layer 102 may have a single-layer structure formed of the SiC semiconductor substrate 111. The SiC semiconductor layer 102 may have a single-layer structure formed of the SiC epitaxial layer 112.

In the above-described 22 nd to 25 th embodiments, an example of forming the SiC epitaxial layer 112 having the high concentration regions 112a and the low concentration regions 112b by the epitaxial growth method is described. However, the SiC epitaxial layer 112 can also be formed by the following steps.

First, the SiC epitaxial layer 112 having a relatively low n-type impurity concentration is formed by an epitaxial growth method. Next, an n-type impurity is introduced into the surface layer portion of the SiC epitaxial layer 112 by ion implantation. Thereby, the SiC epitaxial layer 112 having the high concentration regions 112a and the low concentration regions 112b is formed.

In the above-described embodiments 22 to 25, examples of forming the gate electrode layer 132 and the gate wiring layer 133 including p-type polysilicon to which p-type impurities are added have been described. However, when importance is not attached to increase of the gate threshold voltage Vth, the gate electrode layer 132 and the gate wiring layer 133 may include n-type polysilicon to which n-type impurities are added instead of p-type polysilicon.

That is, the low-resistance electrode layer 134 may also include n-type polysilicon. The low-resistance electrode layer 134 may be formed by silicidizing a portion of the gate electrode layer 132 (n-type polysilicon) where a surface layer portion is formed, with a metal material. In this case, the gate resistance can be reduced.

In the above-described 22 nd to 25 th embodiments, a structure in which the conductivity type of each semiconductor portion is inverted may be employed. That is, the p-type portion may be n-type, and the n-type portion may be p-type.

In the above-described embodiments 22 to 25, a p + -type SiC semiconductor substrate (111) may be used instead of the n + -type SiC semiconductor substrate 111. In this case, in the description of embodiments 22 to 25, the "source" is replaced with the "emitter" and the "drain" is replaced with the "collector".

Fig. 49 is a plan view showing a semiconductor device 401 according to embodiment 26 of the present invention. Fig. 50 is a plan view showing the semiconductor device 401 shown in fig. 49, in which the resin layer 416 is removed.

Referring to fig. 49 and 50, a semiconductor device 401 includes a SiC semiconductor layer 402 including SiC (silicon carbide) single crystal. The SiC semiconductor layer 402 may also contain 4H — SiC single crystal.

The 4H-SiC single crystal has an off-angle inclined from the [0001] plane at an angle of 10 DEG or less with respect to the [ 11-20 ] direction. The deflection angle may be 0 ° or more and 4 ° or less. The declination angle may also be greater than 0 ° and less than 4 °. Typically, the off angle is set to a range of 2 ° or 4 °, more specifically, to a range of 2 ° ± 0.2 ° or a range of 4 ° ± 0.4 °.

In this embodiment, the SiC semiconductor layer 402 is formed in a rectangular parallelepiped sheet shape. The SiC semiconductor layer 402 has a first main surface 1 403 on one side, a second main surface 2 404 on the other side, and side surfaces 405A, 405B, 405C, and 405D connecting the first main surface 403 and the second main surface 404. The 1 st main surface 403 and the 2 nd main surface 404 are formed in a rectangular shape (rectangular shape in this embodiment) in a plan view (hereinafter simply referred to as "plan view") viewed from the normal direction thereof.

Side 405A is opposite side 405C. Side 405B is opposite side 405D. The side surfaces 405A to 405D extend in a plane in the normal direction of the 1 st main surface 403 and the 2 nd main surface 404, respectively. The lengths of the side surfaces 405A to 405D may be 1mm or more and 10mm or less (for example, 2mm or more and 5mm or less), respectively.

An active region 406 and an outer region 407 are set in the SiC semiconductor layer 402. The active region 406 is a region where a vertical MISFET is formed. The outer region 407 is a region outside the active region 406.

Active region 406 is set in the central portion of SiC semiconductor layer 402 with an interval from side surfaces 405A to 405D of SiC semiconductor layer 402 toward the inner region in a plan view. Active region 406 is formed in a rectangular shape (rectangular shape in this embodiment) having four sides parallel to side surfaces 405A to 405D of SiC semiconductor layer 402 in a plan view.

Outer region 407 is set in a region between side surfaces 405A to 405D of SiC semiconductor layer 402 and the periphery of active region 406. Outer region 407 is set to be a dot-like shape (a rectangular ring shape) surrounding active region 406 in a plan view.

A main surface gate electrode 408 and a main surface source electrode 409 are formed on the 1 st main surface 403 of the SiC semiconductor layer 402.

Main-face gate electrode 408 includes gate pad 410 and gate finger 411. In this manner, the gate pad 410 and the gate finger 411 are disposed in the active region 406.

The gate pad 410 is formed along the side surface 405A of the SiC semiconductor layer 402 in a plan view. Gate pad 410 is formed along a central region of side surface 405A of SiC semiconductor layer 402 in a plan view.

Gate pad 410 may be formed along a corner portion connecting two of side surfaces 405A to 405D of SiC semiconductor layer 402 in a plan view. The gate pad 410 is formed in a quadrangular shape in a plan view.

Gate fingers 411 include outer gate fingers 411A and inner gate fingers 411B.

Outer gate fingers 411A lead from gate pad 410 and extend in a band along the periphery of active area 406. In this manner, outer gate fingers 411A are formed along three side surfaces 405A, 405B, and 405D of SiC semiconductor layer 402 so as to divide the inner region of active region 406 from three directions.

Outer gate finger 411A has a pair of open ends 412A, 412B. A pair of open end portions 412A, 412B of outer gate finger 411A are formed in a region facing gate pad 410 with an inner region of active region 406 interposed therebetween. In this manner, a pair of open end portions 412A, 412B of the outer gate finger 411A are formed along the side face 405C of the SiC semiconductor layer 402.

Inner gate finger 411B is drawn from gate pad 410 to an inner region of active region 406. Inner gate fingers 411B extend in a band shape in an inner region of active region 406. Inner gate finger 411B extends from the side of side 405A toward the side of side 405C.

In this embodiment, the main surface source electrode 409 includes a source pad 413, a source pull-back wiring 414, and a source connection portion 415.

A source pad 413 is formed in the active region 406 at an interval from the gate pad 410 and the gate finger 411. The source pad 413 is formed in a C shape (an inverted C shape in fig. 49 and 50) in a plan view so as to cover a region of the C shape (an inverted C shape in fig. 49 and 50) defined by the gate pad 410 and the gate finger 411.

The source pull-back wiring 414 is formed in the outer region 407. The source pull-back wire 414 extends in a stripe along the active region 406. In this embodiment, the source pull-back wiring 414 is formed in a dot shape (a rectangular ring shape) surrounding the active region 406 in a plan view. The source pull-back wiring 414 is electrically connected to the SiC semiconductor layer 402 in the outer region 407.

The source connection portion 415 connects the source pad 413 and the source pull-back wiring 414. The source connection portion 415 is provided in a region between the pair of open end portions 412A, 412B of the outer gate finger 411A. The source connection portion 415 extends from the source pad 413 across a boundary region between the active region 406 and the outer region 407, and is connected to the source pull-back wiring 414.

The MISFET formed in the active region 406 includes an npn-type parasitic bipolar transistor in its configuration. When an avalanche current generated in the outer region 407 flows into the active region 406, the parasitic bipolar transistor is turned on. In this case, for example, the MISFET may be unstably controlled due to the latch-up.

Here, in the semiconductor device 401, an avalanche current absorption structure for absorbing an avalanche current generated in a region outside the active region 406 is formed by the structure of the main-surface source electrodes 409.

More specifically, the avalanche current generated in the outer region 407 is absorbed by the source pull-back wiring 414. Thereby, the avalanche current reaches the source pad 413 through the source connection portion 415. When a lead wire for external connection (e.g., a bonding wire) is connected to the source pad 413, an avalanche current is output through the lead wire.

This can prevent the parasitic bipolar transistor from being turned on by an undesired current generated in outer region 407. Therefore, since the latch-up can be suppressed, the stability of the control of the MISFET can be improved.

A gate voltage is applied to the gate pad 410 and the gate finger 411. The gate voltage may be 10V or more and 50V or less (for example, about 30V). An active voltage is applied to the source pad 413. The source voltage may also be a reference voltage (e.g., GND voltage).

A resin layer 416 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402 (more specifically, on an interlayer insulating layer 491 described later). In fig. 49, the resin layer 416 is shown by hatching for clarity. The resin layer 416 encapsulates the gate pad 410, the gate finger 411, and the source pad 413.

The resin layer 416 may also contain a negative or positive photosensitive resin. In this embodiment, the resin layer 416 contains polybenzoxazole which is an example of a positive photosensitive resin. The resin layer 416 may contain polyimide, which is an example of a negative photosensitive resin.

A gate pad opening 417 and a source pad opening 418 are formed in the resin layer 416. Gate pad opening 417 exposes gate pad 410. The source pad opening 418 exposes the source pad 413.

A peripheral edge 419 of the resin layer 416 is formed at an interval from the side surfaces 405A to 405D of the SiC semiconductor layer 402 toward the inner region. Thereby, the resin layer 416 exposes the peripheral edge portion of the SiC semiconductor layer 402 (more specifically, an interlayer insulating layer 491 described later).

The peripheral portion 419 of the resin layer 416 is a portion where a dicing street is formed when the semiconductor device 401 is cut out from one SiC semiconductor wafer. By exposing the peripheral edge portion of the SiC semiconductor layer 402 from the resin layer 416, it is not necessary to physically cut the resin layer 416.

Therefore, the semiconductor device 401 can be cut smoothly from one SiC semiconductor wafer. The side surfaces 405A to 405D of the SiC semiconductor layer 402 may be cut surfaces (polished surfaces). The side surfaces 405A to 405D of the SiC semiconductor layer 402 may have polishing marks.

Fig. 51 is an enlarged view of the region LI shown in fig. 50, and is a view for explaining the structure of the 1 st main surface 403 of the SiC semiconductor layer 402. Fig. 52 is a cross-sectional view taken along the LII-LII line shown in fig. 51, and shows a 1 st embodiment of the gate trench 431 and a 1 st embodiment of the source trench 441. Fig. 53 is a sectional view taken along the LIII-LIII line shown in fig. 51, and shows an example of the 1 st embodiment of the gate wiring layer 436. Fig. 54 is an enlarged view of the region LIV shown in fig. 52.

Fig. 55 is a cross-sectional view taken along the LV-LV line shown in fig. 50, and shows an example of mode 1 of active side wall 464, an example of mode 1 of outer main surface 462, an example of mode 1 of side wall 482, an example of mode 1 of diode region 471, an example of mode 1 of outer deep well region 472, an example of mode 1 of field confining structure 473, and an example of mode 1 of anchor hole 495. Fig. 56 is an enlarged view of the region LVI shown in fig. 55, and shows an example of the 1 st aspect of the active side wall 464 and an example of the 1 st aspect of the outer main surface 462.

Referring to fig. 51 to 55, in this embodiment, SiC semiconductor layer 402 has a stacked structure including n + -type SiC semiconductor substrate 421 and n-type SiC epitaxial layer 422. The 2 nd main surface 404 of the SiC semiconductor layer 402 is formed by the SiC semiconductor substrate 421.

The 1 st main surface 403 of the SiC semiconductor layer 402 is formed by the SiC epitaxial layer 422. The 2 nd main surface 404 of the SiC semiconductor layer 402 may be a polished surface. The 2 nd main surface 404 of the SiC semiconductor layer 402 may have polishing marks.

The thickness of the SiC semiconductor substrate 421 may be 1 μm or more and less than 1000 μm. The thickness of the SiC semiconductor substrate 421 may be 5 μm or more. The thickness of the SiC semiconductor substrate 421 may be 25 μm or more. The thickness of the SiC semiconductor substrate 421 may be 50 μm or more. The thickness of the SiC semiconductor substrate 421 may be 100 μm or more.

The thickness of the SiC semiconductor substrate 421 may be 700 μm or less. The thickness of the SiC semiconductor substrate 421 may be 500 μm or less. The thickness of the SiC semiconductor substrate 421 may be 400 μm or less. The thickness of the SiC semiconductor substrate 421 may be 300 μm or less.

The thickness of the SiC semiconductor substrate 421 may be 250 μm or less. The thickness of the SiC semiconductor substrate 421 may be 200 μm or less. The thickness of the SiC semiconductor substrate 421 may be 150 μm or less. The thickness of the SiC semiconductor substrate 421 may be 100 μm or less.

The thickness of the SiC semiconductor substrate 421 is preferably 150 μm or less. By reducing the thickness of the SiC semiconductor substrate 421, the resistance value can be reduced by shortening the current path.

The thickness of the SiC epitaxial layer 422 may be 1 μm or more and 100 μm or less. The thickness of the SiC epitaxial layer 422 may be 5 μm or more. The thickness of the SiC epitaxial layer 422 may be 10 μm or more.

The thickness of the SiC epitaxial layer 422 may be 50 μm or less. The thickness of the SiC epitaxial layer 422 may be 40 μm or less. The thickness of the SiC epitaxial layer 422 may be 30 μm or less.

The thickness of the SiC epitaxial layer 422 may be 20 μm or less. The thickness of the SiC epitaxial layer 422 is preferably 15 μm or less. The thickness of the SiC epitaxial layer 422 is preferably 10 μm or less.

The n-type impurity concentration of the SiC epitaxial layer 422 is equal to or less than the n-type impurity concentration of the SiC semiconductor substrate 421. The n-type impurity concentration of the SiC epitaxial layer 6 may be 1.0X 10¹⁵cm^－3Above 1.0 × 10¹⁸cm^－3The following.

In this embodiment, the SiC epitaxial layer 422 has a plurality of regions having different n-type impurity concentrations in the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402. More specifically, the SiC epitaxial layer 422 includes high concentration regions 422a in which the n-type impurity concentration is relatively high, and low concentration regions 422b in which the n-type impurity concentration is lower than that of the high concentration regions 422 a.

The high concentration region 422a is formed in the region on the 1 st main surface 403 side. The low concentration region 422b is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the high concentration region 422 a.

The n-type impurity concentration of the high concentration region 422a may be 1 × 10¹⁶cm^－3Above and 1 × 10¹⁸cm^－3The following. The n-type impurity concentration of the low concentration region 422b may be 1 × 10¹⁵cm^－3Above and 1 × 10¹⁶cm^－3The following.

The thickness of the high concentration region 422a is equal to or less than the thickness of the low concentration region 422 b. More specifically, the thickness of the high concentration region 422a is smaller than that of the low concentration region 422 b. That is, the thickness of the high concentration region 422a is less than half of the total thickness of the SiC epitaxial layer 422.

A drain pad 423 as a2 nd main surface electrode is connected to the 2 nd main surface 404 of the SiC semiconductor layer 402. The maximum voltage that can be applied between the source pad 413 and the drain pad 423 at the time of disconnection may be 1000V or more and 10000V or less.

The drain pad 423 may also include at least one of a Ti layer, a Ni layer, an Au layer, or an Ag layer. The drain pad 423 has a four-layer structure including a Ti layer, a Ni layer, an Au layer, and an Ag layer stacked in this order from the 2 nd main surface 404 of the SiC semiconductor layer 402.

The SiC semiconductor substrate 421 is formed as a drain region 424 of the MISFET. The SiC epitaxial layer 422 is formed as a drift region 425 of the MISFET.

In the active region 406, a p-type body region 426 is formed in a surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The body region 426 delimits the active region 406.

That is, in this embodiment, the body region 426 is formed in the 1 st main surface 403 of the SiC semiconductor layer 402 over the entire region of the region where the active region 406 is formed. The p-type impurity concentration of the body region 426 may be 1 × 10¹⁷cm^－3Above and 1 × 10²⁰cm^－3The following.

In the active region 406, a plurality of gate trenches 431 are formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The plurality of gate trenches 431 are formed at intervals in the 1 st direction X. The plurality of gate trenches 431 are formed in a stripe shape extending in the 2 nd direction Y intersecting the 1 st direction X.

More specifically, the 1 st direction X is a direction along the side surfaces 405B and 405D of the SiC semiconductor layer 402. The 2 nd direction Y is a direction orthogonal to the 1 st direction X. The 2 nd direction Y is also a direction along the side surfaces 405A, 405C of the SiC semiconductor layer 402.

The plurality of gate trenches 431 are formed in a stripe shape in a plan view. In this embodiment, each gate trench 431 extends in a stripe shape from the peripheral edge of one side (side surface 405B side) toward the peripheral edge of the other side (side surface 405D side) in the active region 406.

Each gate trench 431 extends across the active region 406 in a middle portion between one peripheral edge portion and the other peripheral edge portion. One end of each gate trench 431 is located at one peripheral edge of the active region 406. The other end of each gate trench 431 is located at the peripheral edge of the other side of the active region 406.

The 1 st direction X may also be set to the [ 11-20 ] direction ([ -1-120 ] direction). In this case, each gate trench 431 may extend in the [ 11-20 ] direction. The 1 st direction X may be set to the direction [ -1100 ] ([ 1-100 ] direction) orthogonal to the [ 11-20 ] direction. In this case, each gate trench 431 may extend in the [ -1100 ] direction ([ 1-100 ] direction).

Each gate trench 431 has a length on the order of millimeters. That is, in the cross section shown in fig. 53, the length of the gate trench 431 is from the end on the side of the connection portion of the gate trench 431 and the gate finger 411 to the end on the opposite side.

The length of each gate trench 431 may be 0.5mm or more. In this embodiment, the length of each gate trench 431 is 1mm or more and 10mm or less (for example, 2mm or more and 5mm or less). The total extension of the one or more gate trenches 431 per unit area may also be 0.5 μm/μm²Above and 0.75 μm/μm²The following.

Each gate trench 431 integrally includes an active trench portion 431a and a contact trench portion 431 b. The active trench portion 431a is a portion along the channel region of the MISFET in the active region 406.

The contact trench portion 431b is a portion of the gate trench 431 intended to be in contact with the gate finger 411. The contact groove 431b is drawn from the active groove 431a to the peripheral edge of the active region 406. A contact trench portion 431b is formed in a region directly below the gate finger 411. The amount of extraction of the contact groove 431b is arbitrary.

Each gate trench 431 extends through body region 426 to SiC epitaxial layer 422. The bottom wall of each gate trench 431 is located within the SiC epitaxial layer 422.

More specifically, the bottom wall of each gate trench 431 is located in the high concentration region 422a of the SiC epitaxial layer 422. The bottom wall of the gate trench 431 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The sidewall of the gate trench 431 may extend in the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402. That is, the sidewall of the gate trench 431 may be formed substantially perpendicular to the 1 st main surface 403 of the SiC semiconductor layer 402.

The depth of the gate trench 431 may be 0.5 μm or more and 3 μm or less (for example, about 1 μm) in the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402. The depth of the gate trench 431 is preferably 0.5 μm or more and 1.0 μm or less.

The width of gate trench 431 in the 1 st direction may be 0.1 μm or more and 2 μm or less (e.g., about 0.5 μm). The 1 st direction width of the gate trench 431 is preferably 0.1 μm or more and 0.5 μm or less.

Referring to fig. 54, the opening edge portion 432 of each gate trench 431 includes a slope portion 433 that is inclined downward from the 1 st main surface 403 of the SiC semiconductor layer 402 toward the inside of the gate trench 431. An opening edge 432 of the gate trench 431 is a corner connecting the 1 st main surface 403 of the SiC semiconductor layer 402 and the sidewall of the gate trench 431.

In this embodiment, the inclined portion 433 is formed in a concave curved shape toward the inside of the SiC semiconductor layer 402. The inclined portion 433 may be formed in a convex curved shape toward the inside of the gate trench 431.

An electric field with respect to the opening edge portion 432 of the gate trench 431 is dispersed along the inclined portion 433. This can alleviate the electric field concentration at the opening edge 432 of the gate trench 431.

A gate insulating layer 434 and a gate electrode layer 435 are formed in each gate trench 431. For clarity, the gate insulating layer 434 and the gate electrode layer 435 are shown by hatching in fig. 51.

The gate insulating layer 434 includes silicon oxide. The gate insulating layer 434 may also include other insulating films such as silicon nitride. The gate insulating layer 434 is formed in a film shape along the inner wall surface of the gate trench 431 so as to define a concave space in the gate trench 431.

The gate insulating layer 434 includes a 1 st region 434a, a2 nd region 434b, and a 3 rd region 434 c. The 1 st region 434a is formed along the sidewall of the gate trench 431. The 2 nd region 434b is formed along the bottom wall of the gate trench 431. The 3 rd region 434c is formed along the 1 st main surface 403 of the SiC semiconductor layer 402.

The thickness T1 of the 1 st region 434a is less than the thickness T2 of the 2 nd region 434b and the thickness T3 of the 3 rd region 434 c. The ratio T2/T1 of the thickness T2 of the 2 nd region 434b to the thickness T1 of the 1 st region 434a may be 2 or more and 5 or less. The ratio T3/T1 of the thickness T3 of the 3 rd region 434c to the thickness T1 of the 1 st region 434a may be 2 or more and 5 or less.

The thickness T1 of the 1 st region 434a may be 0.01 μm or more and 0.2 μm or less. The thickness T2 of the 2 nd region 434b may be 0.05 μm or more and 0.5 μm or less. The thickness T3 of the 3 rd region 434c may be 0.05 μm or more and 0.5 μm or less.

By forming the 1 st region 434a of the gate insulating layer 434 to be thin, an increase in carriers induced in the region near the side wall of the gate trench 431 in the body region 426 can be suppressed. This can suppress an increase in channel resistance. By forming the 2 nd region 434b of the gate insulating layer 434 to be thick, the electric field concentration with respect to the bottom wall of the gate trench 431 can be relaxed.

By forming the 3 rd region 434c of the gate insulating layer 434 to be thick, the withstand voltage of the gate insulating layer 434 in the vicinity of the opening edge 432 of the gate trench 431 can be increased. Further, by forming the 3 rd region 434c to be thick, the 3 rd region 434c can be prevented from being lost by the etching method.

This can prevent the 1 st region 434a from being removed by etching due to the disappearance of the 3 rd region 434 c. As a result, the gate electrode layer 435 can be appropriately opposed to the SiC semiconductor layer 402 (body region 426) via the gate insulating layer 434.

The gate insulating layer 434 further includes a bulging portion 434d bulging toward the inside of the gate trench 431 at an opening edge portion 432 of the gate trench 431. The bulge 434d is formed at a corner of the gate insulating layer 434 connecting the 1 st region 434a and the 3 rd region 434 c.

The bulge 434d extends in a curved shape inward of the gate trench 431. The bulge 434d narrows the opening of the gate trench 431 at the opening edge 432 of the gate trench 431.

The bulge portion 434d can improve the dielectric strength of the gate insulating layer 434 in the opening edge portion 432. Of course, the gate insulating layer 434 may be formed without the bulge portion 434 d. The gate insulating layer 434 may also be formed to have a uniform thickness.

The gate electrode layer 435 is buried in the gate trench 431 with the gate insulating layer 434 interposed therebetween. More specifically, the gate electrode layer 435 is embedded in the gate trench 431 so as to fill the concave space defined by the gate insulating layer 434. Gate electrode layer 435 is controlled by a gate voltage.

Gate electrode layer 435 is formed in a wall shape that extends in the direction normal to 1 st main surface 403 of SiC semiconductor layer 402 in cross section, orthogonal to the direction in which gate trench 431 extends. Gate electrode layer 435 has an upper end portion located on the opening side of gate trench 431.

An upper end portion of gate electrode layer 435 is formed in a curved shape recessed toward the bottom wall of gate trench 431. The upper end portion of the gate electrode layer 435 has a constricted portion constricted along the bulging portion 434d of the gate insulating layer 434.

The cross-sectional area of gate electrode layer 435 (cross-sectional area perpendicular to the direction in which gate trench 431 extends) may be 0.05 μm²Above and 0.5 μm²The following. The cross-sectional area of gate electrode layer 435 is defined by the product of the depth of gate electrode layer 435 and the width of gate electrode layer 435.

The depth of gate electrode layer 435 is the distance from the upper end to the lower end of gate electrode layer 435. The width of the gate electrode layer 435 is the width of the trench at an intermediate position between the upper end portion and the lower end portion of the gate electrode layer 435. When the upper end portion is a curved surface (in this embodiment, a curved shape recessed toward the lower side), the position of the upper end portion of the gate electrode layer 435 is an intermediate position in the depth direction of the upper surface of the gate electrode layer 435.

Gate electrode layer 435 may also comprise conductive polysilicon. The gate electrode layer 435 may include n-type polysilicon or p-type polysilicon as an example of conductive polysilicon. The gate electrode layer 435 may also include at least one of tungsten, aluminum, copper, an aluminum alloy, or a copper alloy instead of polysilicon.

Referring to fig. 51 and 53, a gate wiring layer 436 is formed in the active region 406. The gate wiring layer 436 is electrically connected to the gate pad 410 and the gate finger 411. In fig. 53, the gate wiring layer 436 is shown by hatching for the sake of clarity.

The gate wiring layer 436 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. More specifically, the gate wiring layer 436 is formed on the 3 rd region 434c of the gate insulating layer 434.

In this manner, the gate wiring layer 436 is formed along the gate finger 411. More specifically, the gate wiring layer 436 is formed along the three side surfaces 405A, 405B, and 405D of the SiC semiconductor layer 402 so as to divide the inner region of the active region 406 in three directions.

Gate wiring layer 436 is connected to gate electrode layer 435 exposed from contact groove portion 431b of each gate groove 431. In this embodiment, the gate wiring layer 436 is formed of a lead portion led from the gate electrode layer 435 onto the 1 st main surface 403 of the SiC semiconductor layer 402. The upper end of gate wiring layer 436 is connected to the upper end of gate electrode layer 435.

Referring to fig. 51, 52, and 54, in the active region 406, a plurality of source trenches 441 are formed in the 1 st main surface 403 of the SiC semiconductor layer 402. Each source trench 441 is formed in a region between two gate trenches 431 adjacent to each other.

The plurality of source trenches 441 are respectively formed in a stripe shape extending in the 2 nd direction Y. The source trenches 441 are formed in a stripe shape in a plan view. The pitch between the center portions of the source trenches 441 adjacent to each other in the 1 st direction X may be 1.5 μm or more and 3 μm or less.

Each source trench 441 extends through body region 426 to SiC epitaxial layer 422. The bottom wall of each source trench 441 is located within the SiC epitaxial layer 422. More specifically, the bottom wall of each source trench 441 is located in the high concentration region 422 a.

In this embodiment, the depth of the source trench 441 is equal to or greater than the depth of the gate trench 431. More specifically, the depth of source trench 441 is greater than the depth of gate trench 431. The bottom wall of the source trench 441 is located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

The bottom wall of the source trench 441 is located in a region between the bottom wall of the gate trench 431 and the low concentration region 422 b. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The sidewall of the source trench 441 may extend in the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402. That is, the sidewall of the source trench 441 may be formed substantially perpendicular to the 1 st main surface 403 of the SiC semiconductor layer 402.

The depth of the source trench 441 may be 0.5 μm or more and 10 μm or less (for example, about 2 μm) in the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402. The ratio of the depth of source trench 441 to the depth of gate trench 431 may be 1.5 or more. The ratio of the depth of source trench 441 to the depth of gate trench 431 is preferably 2 or more.

The 1 st direction width of the source trench 441 may be substantially equal to the 1 st direction width of the gate trench 431. The 1 st direction width of source trench 441 may be equal to or greater than the 1 st direction width of gate trench 431. The 1 st direction width of the source trench 441 may be 0.1 μm or more and 2 μm or less (e.g., about 0.5 μm).

A source insulating layer 442 and a source electrode layer 443 are formed in each source trench 441. In fig. 51, the source insulating layer 442 and the source electrode layer 443 are shown by hatching for clarity.

The source insulating layer 442 may also include silicon oxide. The source insulating layer 442 is formed in a film shape along the inner wall surface of the source trench 441 so as to define a concave space in the source trench 441.

The source insulating layer 442 includes a 1 st region 442a and a2 nd region 442 b. The 1 st region 442a is formed along the sidewall of the source trench 441. The 2 nd region 442b is formed along the bottom wall of the source trench 441. The thickness T11 of the 1 st region 442a is less than the thickness T12 of the 2 nd region 442 b.

The ratio T12/T11 of the thickness T12 of the 2 nd region 442b to the thickness T11 of the 1 st region 442a may be 2 or more and 5 or less. The thickness T11 of the 1 st region 442a may be 0.01 μm or more and 0.2 μm or less. The thickness T12 of the 2 nd region 442b may be 0.05 μm or more and 0.5 μm or less.

The thickness T11 of the 1 st region 442a may also be substantially equal to the thickness T1 of the 1 st region 434a of the gate insulating layer 434. The thickness T12 of the 2 nd region 442b may also be substantially equal to the thickness T2 of the 2 nd region 434b of the gate insulating layer 434. Of course, the source insulating layer 442 may be formed to have a uniform thickness.

The source electrode layer 443 is buried in the source trench 441 with the source insulating layer 442 interposed therebetween. More specifically, the source electrode layer 443 is buried in the source trench 441 so as to fill the concave space defined by the source insulating layer 442. The source electrode layer 443 is controlled by a source voltage.

Source electrode layer 443 has an upper end portion located on the opening side of source trench 441. The upper end portion of the source electrode layer 443 is formed below the 1 st main surface 403 of the SiC semiconductor layer 402. The upper end portion of the source electrode layer 443 may be located above the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the source electrode layer 443 is formed in a curved shape recessed toward the bottom wall of the source trench 441. The upper end portion of the source electrode layer 443 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the source electrode layer 443 may protrude upward from the upper end portion of the source insulating layer 442. The upper end portion of the source electrode layer 443 may be located below the upper end portion of the source insulating layer 442. The thickness of the source electrode layer 443 may be 0.5 μm or more and 10 μm or less (for example, about 1 μm).

The source electrode layer 443 preferably includes polycrystalline silicon having properties close to those of SiC. This can reduce stress generated in the SiC semiconductor layer 402. The source electrode layer 443 may also include the same kind of conductive material as the gate electrode layer 435.

The source electrode layer 443 may also include conductive polysilicon. The source electrode layer 443 may include n-type polysilicon or p-type polysilicon as an example of conductive polysilicon. Instead of the conductive polysilicon, the source electrode layer 443 may include at least one of tungsten, aluminum, copper, an aluminum alloy, and a copper alloy.

Thus, the semiconductor device 401 has a trench gate structure 451 and a trench source structure 452. Trench gate structure 451 includes a gate trench 431, a gate insulating layer 434, and a gate electrode layer 435. The trench source structure 452 includes a source trench 441, a source insulating layer 442, and a source electrode layer 443.

An n + -type source region 453 is formed in a region along the sidewall of the gate trench 431 in the surface layer portion of the body region 426. The n-type impurity concentration of the source region 453 may be 1.0 × 10¹⁸cm^－3Above 1.0 × 10²¹cm^－3The following. A plurality of source regions 453 are formed along one sidewall and the other sidewall of the gate trench 431 in the 1 st direction X.

The plurality of source regions 453 are each formed in a stripe shape extending in the 2 nd direction Y. The plurality of source regions 453 are formed in a stripe shape in a plan view. Each source region 453 is exposed from a sidewall of the gate trench 431 and a sidewall of the source trench 441.

A plurality of p + -type contact regions 454 are formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. A plurality of p + -type contact regions 454 are formed along sidewalls of the respective source trenches 441.

The p-type impurity concentration of contact region 454 is greater than the p-type impurity concentration of body region 426. The p-type impurity concentration of contact region 454 may also be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following.

The plurality of contact regions 454 are formed at intervals in the 2 nd direction Y. A plurality of contact regions 454 are formed at intervals in the 1 st direction X from the gate trench 431.

Each contact region 454 covers the sidewalls and bottom wall of the source trench 441. The bottom of each contact region 454 may also be formed parallel to the bottom wall of the source trench 441. More specifically, each contact region 454 integrally includes a 1 st surface layer region 454a, a2 nd surface layer region 454b, and an inner wall region 454 c.

The 1 st surface layer region 454a is formed along the sidewall of the source trench 441 in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The 1 st surface layer region 454a extends from a sidewall of one side of the source trench 441 toward the adjacent gate trench 431. Surface layer 1 region 454a may also extend to an intermediate region between source trench 441 and gate trench 431.

The 2 nd surface layer region 454b is formed along the other side wall of the source trench 441 in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The 2 nd surface layer region 454b extends from the side of the other side of the source trench 441 toward the adjacent gate trench 431. Surface layer 2 region 454b may also extend to an intermediate region between source trench 441 and gate trench 431.

The inner wall region 454c is formed in a region of the SiC semiconductor layer 402 along the inner wall of the source trench 441. The inner wall region 454c is formed along the sidewall of the source trench 441.

The inner wall region 454c covers the corner of the connecting sidewall and bottom wall of the source trench 441. The inner wall region 454c covers the bottom wall of the source trench 441 from the sidewall of the source trench 441 through the corner portion. The bottom of each contact region 454 is formed by an inner wall region 454 c.

A plurality of p-type deep well regions 455 are formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The deep well region 455 is also referred to as a voltage resistance adjustment region (voltage resistance holding region) for adjusting the voltage resistance of the SiC semiconductor layer 402 in the active region 406.

Each deep well region 455 is formed along the inner wall of each source trench 441 in such a manner as to wrap the contact region 454. The deep well region 455 is formed in a stripe shape extending along the source trench 441. The deep well region 455 is formed by the sidewalls of the source trench 441.

The deep well region 455 wraps around the corner connecting the sidewalls and bottom wall of the source trench 441. The deep well region 455 wraps the bottom wall of the source trench 441 from the sidewall of the source trench 441 through the corner portion. The deep well region 455 is connected to the body region 426 at the sidewalls of the source trench 441.

The deep well region 455 has a bottom located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The deep well region 455 is formed in the high concentration region 422a of the SiC epitaxial layer 422. The bottom of the deep well region 455 may also be formed parallel to the bottom wall of the source trench 441.

The p-type impurity concentration of the deep well region 455 may be substantially equal to the p-type impurity concentration of the body region 426. The p-type impurity concentration of the deep well region 455 may also be greater than the p-type impurity concentration of the body region 426. The p-type impurity concentration of the deep well region 455 may also be less than the p-type impurity concentration of the body region 426.

The p-type impurity concentration of the deep well region 455 may be equal to or less than the p-type impurity concentration of the contact region 454. The p-type impurity concentration of the deep well region 455 may also be less than the p-type impurity concentration of the contact region 454. The p-type impurity concentration of the deep well region 455 may be 1.0 × 10¹⁷cm^－3Above and 1.0X 10¹⁹cm^－3The following.

The deep well region 455 forms a pn junction with the SiC semiconductor layer 402 (the high concentration region 422a of the SiC epitaxial layer 422). A depletion layer is expanded from the pn junction toward a region between the plurality of gate trenches 431 adjacent to each other. The depletion layer expands toward a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

The depletion layer expanding from the deep well region 455 may also overlap the bottom wall of the gate trench 431. The depletion layer expanding from the bottom of the deep well region 455 may also overlap the bottom wall of the gate trench 431.

In a semiconductor device including only a pn junction diode, the problem of electric field concentration in the SiC semiconductor layer 402 is small in a structure including no trench. The deep well region 455 brings the trench gate type MISFET close to the structure of the pn junction diode.

Thus, in the trench gate MISFET, the electric field in the SiC semiconductor layer 402 can be relaxed. Therefore, narrowing the pitch between the plurality of deep well regions 455 adjacent to each other is effective in relaxing the electric field concentration.

Further, according to the deep well region 455 having the bottom on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431, the electric field concentration with respect to the gate trench 431 can be appropriately alleviated by the depletion layer.

The distance between the bottom of each deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402 is preferably substantially constant. This can suppress variation in the distance between the bottom of each deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402.

Therefore, the limitation of the withstand voltage (e.g., electrostatic breakdown resistance) of the SiC semiconductor layer 402 by the mode of the deep well region 455 can be suppressed, and therefore, the withstand voltage can be appropriately improved.

In this manner, the high concentration region 422a of the SiC epitaxial layer 422 is interposed between the plurality of deep well regions 455 adjacent to each other. Thereby, a jfet (junction field Effect transistor) resistance can be reduced in a region between the plurality of deep well regions 455 adjacent to each other.

In this embodiment, the bottom of the deep well region 455 is located in the high concentration region 422a of the SiC epitaxial layer 422. This allows the current path to extend from the bottom of the deep well region 455 to the lateral direction parallel to the 1 st major surface 403 of the SiC semiconductor layer 402. This can reduce the resistance to current spreading. In this configuration, the low concentration regions 422b of the SiC epitaxial layer 422 improve the withstand voltage of the SiC semiconductor layer 402.

By forming the source trench 441, the deep well region 455 can be formed conformally with respect to the inner wall of the source trench 441. This can appropriately suppress the occurrence of variations in the depth of each deep well region 455. Further, by using the inner wall of the source trench 441, each deep well region 455 can be appropriately formed in a relatively deep region of the SiC semiconductor layer 402.

Referring to fig. 51 and 53, a p-type peripheral deep well region 459 is formed in the peripheral edge of the active region 406. The peripheral deep well region 459 is electrically connected to the deep well region 455.

The peripheral deep well region 459 is formed to have the same potential as the deep well region 455. In this aspect, the peripheral deep well region 459 is formed integrally with the deep well region 455.

More specifically, the peripheral deep well region 459 is formed in a region along the inner wall of the contact trench portion 431b of the gate trench 431 at the peripheral edge portion of the active region 406.

The peripheral deep well region 459 extends along the sidewall of the contact groove 431b, passes through the edge portion, and covers the bottom wall of the contact groove 431 b. The peripheral deep well region 459 is connected to the body region 426 in a region on the opening side of the contact groove portion 431 b.

The peripheral deep well region 459 has a bottom located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the contact trench portion 431b of the gate trench 431. The peripheral deep well region 459 is formed in the high concentration region 422a of the SiC epitaxial layer 422.

The peripheral deep well region 459 overlaps the gate wiring layer 436 in a plan view. That is, the peripheral deep well region 459 faces the gate wiring layer 436 with the gate insulating layer 434 (the 3 rd region 434c) therebetween.

The peripheral deep well region 459 includes a lead-out portion 459a leading out from the contact trench portion 431b of the gate trench 431 to the active trench portion 431a of the gate trench 431.

The lead-out portion 459a of the peripheral deep well region 459 extends along the side wall of the active trench portion 431a, passes through the edge portion, and covers the bottom wall of the active trench portion 431 a. The extension portions 459a of the peripheral deep well region 459 are connected to the body region 426 in a region on the opening side of the active trench portion 431 a.

The lead-out portion 459a of the peripheral deep well region 459 is connected to the deep well region 455 through the body region 426. That is, the peripheral deep well region 459 is electrically connected to the deep well region 455 via the body region 426.

The extraction portion 459a of the peripheral deep well region 459 has a bottom portion located on the 2 nd main surface 104 side of the SiC semiconductor layer 402 with respect to the bottom wall of the active trench portion 431 a. The extraction portions 459a of the peripheral deep well region 459 are formed in the high concentration region 422a of the SiC epitaxial layer 422.

The p-type impurity concentration of the peripheral deep well region 459 may be substantially equal to the p-type impurity concentration of the body region 426. The p-type impurity concentration of the peripheral deep well region 459 may be greater than the p-type impurity concentration of the body region 426. The p-type impurity concentration of the peripheral deep well region 459 may be smaller than the p-type impurity concentration of the body region 426.

The p-type impurity concentration of the peripheral deep well region 459 may be substantially equal to the p-type impurity concentration of the deep well region 455. The p-type impurity concentration of the peripheral deep well region 459 may be greater than the p-type impurity concentration of the deep well region 455. The p-type impurity concentration of the peripheral deep well region 459 may be smaller than the p-type impurity concentration of the deep well region 455.

The p-type impurity concentration of the peripheral deep well region 459 may be equal to or less than the p-type impurity concentration of the contact region 454. The p-type impurity concentration of the peripheral deep well region 459 may be smaller than the p-type impurity concentration of the contact region 454. The p-type impurity concentration of the deep well peripheral region 459 may be 1.0 × 10¹⁷cm^－3And above 1.0 × 10¹⁹cm^－3The following.

Source sub-trench 456 communicating with source trench 441 is formed in the 1 st main surface 403 of SiC semiconductor layer 402 in a region along the upper end portion of source electrode layer 443. The source sub-trench 456 forms a portion of the sidewall of the source trench 441.

In this embodiment, the source sub-trench 456 is formed in a dotted shape (a quadrangular ring shape) surrounding the upper end portion of the source electrode layer 443 in a plan view. That is, the source sub-trench 456 borders an upper end portion of the source electrode layer 443.

The source sub-trench 456 is formed by digging a portion of the source insulating layer 442. More specifically, the source sub-trench 456 is formed by digging an upper end portion of the source insulating layer 442 and an upper end portion of the source electrode layer 443 from the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the source electrode layer 443 has a shape shrunk from the lower end portion of the source electrode layer 443. The lower end portion of source electrode layer 443 is a portion of source electrode layer 443 located on the bottom wall side of source trench 441. The 1 st direction width of the upper end portion of the source electrode layer 443 may be smaller than the 1 st direction width of the lower end portion of the source electrode layer 443.

The source sub-trench 456 is formed in a tapered shape having a smaller bottom area than an opening area in cross section. The bottom wall of the source sub-trench 456 may be formed in a convex curved shape toward the 2 nd main surface 404 of the SiC semiconductor layer 402.

The source region 453, the contact region 454, the source insulating layer 442, and the source electrode layer 443 are exposed from the inner wall of the source sub-trench 456. At least the 1 st region 442a of the source insulating layer 442 is exposed from the bottom wall of the source sub-trench 456. In the source insulating layer 442, the upper end portion of the 1 st region 442a is located below the 1 st main surface 403 of the SiC semiconductor layer 402.

An opening edge portion 457 of each source trench 441 includes an inclined portion 458 inclined downward from the 1 st main surface 403 of the SiC semiconductor layer 402 toward the inside of the source trench 441. An opening edge portion 457 of the source trench 441 is a corner portion connecting the 1 st main surface 403 of the SiC semiconductor layer 402 and the sidewall of the source trench 441. The inclined portion 458 of the source trench 441 is formed by the source sub-trench 456.

In this embodiment, the inclined portion 458 is formed in a concave curved shape toward the inside of the SiC semiconductor layer 402. The inclined portion 458 may be formed in a convex curved shape toward the inside of the source sub-trench 456.

The electric field with respect to the opening edge portion 457 of the source trench 441 is dispersed along the inclined portion 458. This can alleviate the electric field concentration at opening edge 457 of source trench 441.

Referring to fig. 55 and 56, active region 406 has an active main surface 461 forming a part of first main surface 403 of SiC semiconductor layer 402. Outer region 407 has an outer main surface 462 which forms a part of 1 st main surface 403 of SiC semiconductor layer 402. In this embodiment, outer main surface 462 is connected to side surfaces 405A to 405D of SiC semiconductor layer 402.

Outer main surface 462 is located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to active main surface 461. In this embodiment, the outer region 407 is formed by excavating the 1 st main surface 403 of the SiC semiconductor layer 402 toward the 2 nd main surface 404 side. Therefore, outer main surface 462 is formed in a region recessed toward second main surface 404 of SiC semiconductor layer 402 with respect to active main surface 461.

Outer main surface 462 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of gate trench 431. Outer main surface 462 may be formed at a depth substantially equal to the bottom wall of source trench 441. That is, outer major surface 462 may be located on substantially the same plane as the bottom wall of source trench 441.

The distance between outer main surface 462 and 2 nd main surface 404 of SiC semiconductor layer 402 may be substantially equal to the distance between the bottom wall of source trench 441 and 2 nd main surface 404 of SiC semiconductor layer 402.

Outer main surface 462 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of source trench 441. Outer main surface 462 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 within a range of 0 μm or more and 1 μm or less with respect to the bottom wall of source trench 441.

SiC epitaxial layer 422 is exposed from outer major surface 462. More specifically, high concentration region 422a of SiC epitaxial layer 422 is exposed from outer main surface 462 of outer region 407. Outer main surface 462 faces low concentration region 422b of SiC epitaxial layer 422 with high concentration region 422a of SiC epitaxial layer 422 interposed therebetween.

In this embodiment, the active region 406 is divided into mesa shapes by the outer region 407. That is, the active region 406 is formed as a mesa-shaped active mesa 463 protruding upward from the outer region 407.

Active mesa 463 includes active side walls 464 connecting active major face 461 and outer major face 462. The 1 st main surface 403 of the SiC semiconductor layer 402 is formed of an active main surface 461, an outer main surface 462, and an active sidewall 464.

In this embodiment, the active side wall 464 extends in a direction substantially perpendicular to the active main surface 461 (outer main surface 462). The active sidewall 464 divides a boundary region between the active region 406 and the outer region 407.

The SiC epitaxial layer 422 is exposed from the active sidewalls 464. More specifically, the high concentration regions 422a of the SiC epitaxial layer 422 are exposed from the active sidewalls 464.

At least the body region 426 is exposed from the active main surface 461 side region of the active side wall 464. Fig. 55 and 56 show an example of a mode in which the body region 426 and the source region 453 are exposed from the active sidewall 464.

In outer region 407, a p + -type diode region 471, a p-type outer deep well region 472, and a p-type field limiting structure 473 are formed in the surface layer portion of the 1 st main surface 403 (outer main surface 462) of SiC semiconductor layer 402.

Diode region 471 is formed in outer region 407 between active sidewall 464 and side surfaces 405A to 405D of SiC semiconductor layer 402. The diode region 471 is formed at an interval from the active sidewall 464 and the side surfaces 405A to 405D.

The diode region 471 is formed in a stripe shape along the active region 406 in a plan view. In this embodiment, the diode region 471 is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

The diode region 471 overlaps the source pull-back wiring 414 in a plan view. The diode region 471 is electrically connected to the source pull-back wiring 414. The diode region 471 forms a part of an avalanche current absorption structure.

The diode region 471 forms a pn junction with the SiC semiconductor layer 402. More specifically, diode region 471 is located within SiC epitaxial layer 422. Thus, the diode region 471 forms a pn junction with the SiC epitaxial layer 422.

More specifically, the diode region 471 is located within the high concentration region 422a of the SiC epitaxial layer 422. Therefore, the diode region 471 forms a pn junction with the high concentration region 422a of the SiC epitaxial layer 422. Thus, a pn junction diode 474 having the diode region 471 as an anode and the SiC semiconductor layer 402 as a cathode is formed.

The diode region 471 is entirely located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The bottom of the diode region 471 is located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the source trench 441.

The bottom of the diode region 471 may also be formed at a depth substantially equal to the bottom of the contact region 454. That is, the bottom of the diode region 471 may also be located on substantially the same plane as the bottom of the contact region 454.

The distance between the bottom of the diode region 471 and the 2 nd main surface 404 of the SiC semiconductor layer 402 may be substantially equal to the distance between the bottom of the contact region 454 and the 2 nd main surface 404 of the SiC semiconductor layer 402.

The bottom of the diode region 471 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the contact region 454. The bottom of the diode region 471 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 within a range of 0 μm to 1 μm with respect to the bottom of the contact region 454.

The p-type impurity concentration of the diode region 471 is substantially equal to the p-type impurity concentration of the contact region 454. The p-type impurity concentration of the diode region 471 is greater than the p-type impurity concentration of the body region 426. The p-type impurity concentration of the diode region 471 may be 1.0 × 10¹⁸cm^－3Above and 1.0X 10²¹cm^－3The following.

The outer deep well region 472 is formed in a region between the active sidewall 464 and the diode region 471 in a plan view. In this embodiment, the outer deep well region 472 is formed with a space from the active sidewall 464 toward the diode region 471. The outer deep well region 472 is also referred to as a voltage resistance adjustment region (voltage resistance holding region) for adjusting the voltage resistance of the SiC semiconductor layer 402 in the outer region 407.

The outer deep well region 472 is formed in a stripe shape along the active region 406 in a plan view. In this embodiment, outer deep well region 472 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view.

The bottom of the outer deep well region 472 is located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the diode region 471. In this embodiment, the outer peripheral edge of outer deep well region 472 covers diode region 471 from second main surface 404 side of SiC semiconductor layer 402. The outer deep well region 472 may overlap the source pull-back wiring 414 in a plan view.

The outer deep well region 472 is electrically connected to the source pull-back wiring 414 via the diode region 471. The outer deep well region 472 may also form part of a pn junction diode 474. The outer deep well region 472 may form a part of an avalanche current absorption structure.

The outer deep well region 472 is located entirely on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The bottom of outer deep well region 472 is located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of source trench 441.

The bottom of the outer deep well region 472 may be formed at a depth substantially equal to the bottom of the deep well region 455. That is, the bottom of the outer deep well region 472 may also be located on substantially the same plane as the bottom of the deep well region 455.

The distance between the bottom of the outer deep well region 472 and the outer main surface 462 may be substantially equal to the distance between the bottom of the deep well region 455 and the bottom wall of the source trench 441. The distance between the bottom of the outer deep well region 472 and the 2 nd main surface 404 of the SiC semiconductor layer 402 may be substantially equal to the distance between the bottom of the deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402.

This can suppress the occurrence of variations in the distance between the bottom of outer deep well region 472 and first main surface 2 404 of SiC semiconductor layer 402 and the distance between the bottom of deep well region 455 and first main surface 2 404 of SiC semiconductor layer 402.

Therefore, it is possible to suppress the limitation of the withstand voltage (for example, electrostatic breakdown resistance) of the SiC semiconductor layer 402 due to the form of the outer deep well region 472 and the form of the deep well region 455, and therefore it is possible to suitably improve the withstand voltage.

The bottom of the outer deep well region 472 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the deep well region 455. The bottom of the outer deep well region 472 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 in a range of 0 μm to 1 μm with respect to the bottom of the deep well region 455.

The p-type impurity concentration of the outer deep well region 472 may be equal to or less than the p-type impurity concentration of the diode region 471. The p-type impurity concentration of the outer deep well region 472 may be smaller than the p-type impurity concentration of the diode region 471.

The p-type impurity concentration of the outer deep well region 472 may be substantially equal to the p-type impurity concentration of the deep well region 455. The p-type impurity concentration of outer deep well region 472 may be substantially equal to the p-type impurity concentration of body region 426. The p-type impurity concentration of the outer deep well region 472 may be 1.0 × 10¹⁷cm^－3Above and 1.0X 10¹⁹cm^－3The following.

The p-type impurity concentration of the outer deep well region 472 may also be greater than the p-type impurity concentration of the body region 426. The p-type impurity concentration of the outer deep well region 472 may also be less than the p-type impurity concentration of the body region 426.

The p-type impurity concentration of outer deep well region 472 may be equal to or less than the p-type impurity concentration of contact region 454. The p-type impurity concentration of outer deep well region 472 may also be less than the p-type impurity concentration of contact region 454.

The field confining structure 473 is formed in a region between the diode region 471 and the side surfaces 405A to 405D of the SiC semiconductor layer 402 in a plan view. In this embodiment, the field confining structures 473 are formed at intervals from the side surfaces 405A to 405D toward the diode region 471.

The field confining structure 473 includes 1 or more (e.g., 2 or more and 20 or less) field confining regions. In this manner, field limiting structure 473 includes a field limiting region group having a plurality (5) of field limiting regions 475A, 475B, 475C, 475D, 475E.

The field limiting regions 475A to 475E are formed in this order with a space in a direction away from the diode region 471. The field limiting regions 475A to 475E extend in a band shape along the periphery of the active region 406 in a plan view.

More specifically, each of the field limiting regions 475A to 475E is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406 in a plan view. The field Limiting regions 475A to 475E are also referred to as flr (field Limiting ring) regions, respectively.

In this embodiment, the bottom portions of the field confining regions 475A to 475E are located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom portion of the diode region 471.

In this embodiment, the innermost field confining region 475A of the field confining regions 475A to 475E covers the diode region 471 from the 2 nd main surface 404 side of the SiC semiconductor layer 402. The field limiting region 475A may overlap the source pull-back wiring 414 in a plan view.

The field limiting region 475A is electrically connected to the source pull-back wiring 414 via the diode region 471. The field limiting region 475A may also form part of the pn-junction diode 474. The field confining region 475A may be a part of an avalanche current absorption structure.

The entire field confining regions 475A to 475E are located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. Bottoms of field limiting regions 475A to 475E are located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of source trench 441.

The field confining regions 475A to 475E may be formed at substantially the same depth as the deep well region 455 (outer deep well region 472). That is, the bottom of the field limiting regions 475A to 475E may be located on substantially the same plane as the bottom of the deep well region 455 (the outer deep well region 472).

The bottom portions of the field confining regions 475A to 475E may be located on the outer main surface 462 side with respect to the bottom portion of the deep well region 455 (outer deep well region 472). Bottom portions of the field confining regions 475A to 475E may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom portion of the deep well region 455 (outer deep well region 472).

The widths of the field limiting regions 475A to 475E adjacent to each other may also be different from each other. The width between the field limiting regions 475A to 475E adjacent to each other may also become larger in a direction away from the active region 406. The width between the field confining regions 475A 475E adjacent to each other may also become smaller in a direction away from the active region 406.

The depths of the field limiting regions 475A through 475E may also be different from one another. The depth of the field confining regions 475A through 475E may also become smaller in a direction away from the active region 406. The depth of the field confining regions 475A through 475E may also be increased in a direction away from the active region 406.

The p-type impurity concentration of the field limiting regions 475A to 475E may be equal to or less than the p-type impurity concentration of the diode region 471. The p-type impurity concentration of the field limiting regions 475A to 475E may be smaller than the p-type impurity concentration of the diode region 471.

The p-type impurity concentration of the field limiting regions 475A to 475E may be equal to or less than the p-type impurity concentration of the outer deep well region 472. The p-type impurity concentration of the field limiting regions 475A to 475E may be smaller than the p-type impurity concentration of the outer deep well region 472.

The p-type impurity concentration of the field limiting regions 475A to 475E may be equal to or higher than the p-type impurity concentration of the outer deep well region 472. The p-type impurity concentration of the field limiting regions 475A to 475E may be higher than the p-type impurity concentration of the outer deep well region 472.

The p-type impurity concentration of the field limiting regions 475A to 475E may be 1.0 × 10¹⁵cm^－3Above and 1.0X 10¹⁸cm^－3The following. It is preferable that the p-type impurity concentration of the diode region 471 > the p-type impurity concentration of the outer deep well region 472 > the p-type impurity concentrations of the field confining regions 475A to 475E.

The field confining structure 473 mitigates electric field concentration in the outer region 407. The number, width, depth, p-type impurity concentration, and the like of the field limiting regions take various values according to the electric field to be relaxed.

In the outer region 407, an outer insulating layer 481 is formed on the 1 st principal surface 403 of the SiC semiconductor layer 402. The outer insulating layer 481 selectively wraps the diode region 471, the outer deep well region 472, and the field confining structure 473 in the outer region 407.

The outer insulating layer 481 is formed in a film shape along the active sidewall 464 and the outer main surface 462. The outer insulating layer 481 is connected to the gate insulating layer 434 over the active main surface 461. More specifically, the outer insulating layer 481 is connected to the 3 rd region 434c of the gate insulating layer 434.

The outer insulating layer 481 may also contain silicon oxide. The outer insulating layer 481 may also include another insulating film such as silicon nitride. In this manner, the outer insulating layer 481 is formed of the same insulating material type as the gate insulating layer 434.

The outer insulating layer 481 includes a 1 st region 481a and a2 nd region 481 b. The 1 st region 481a of the outer insulating layer 481 covers the active sidewall 464. The 2 nd region 481b of the outer insulating layer 481 covers the outer principal surface 462.

The thickness of the 2 nd region 481b of the outer insulating layer 481 may be equal to or less than the thickness of the 1 st region 481a of the outer insulating layer 481. The thickness of the 2 nd region 481b of the outer insulating layer 481 may also be smaller than the thickness of the 1 st region 481a of the outer insulating layer 481.

The thickness of the 1 st region 481a of the outer insulating layer 481 may be substantially equal to the thickness of the 1 st region 434a of the gate insulating layer 434. The thickness of the 2 nd region 481b of the outer insulating layer 481 may be substantially equal to the thickness of the 3 rd region 434c of the gate insulating layer 434. Of course, the outer insulating layer 481 may also be formed to have a uniform thickness.

Referring to fig. 55 and 56, the semiconductor device 401 further includes side walls 482 covering the active side walls 464. Side wall 482 protects and reinforces active platform 463 from the lateral region 407 side.

The side wall 482 has a step reducing structure for reducing a step 483 formed between the active main surface 461 and the outer main surface 462. When an upper layer structure (cladding layer) that covers a boundary region between active region 406 and outer region 407 is formed, side wall 482 is covered by the upper layer structure. The side walls 482 improve the flatness of the superstructure.

The side wall 482 may also have an inclined portion 484 that is inclined downward from the active main surface 461 toward the outer main surface 462. Step 483 can be appropriately relaxed by slope 484. The inclined portion 484 of the side wall 482 may be formed in a concave curved shape toward the SiC semiconductor layer 402 side.

The side wall 482 is formed so as to be self-matching with the active main surface 461. More specifically, side walls 482 are formed along active side walls 464. In this embodiment, the side wall 482 is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

The side walls 482 may also comprise a conductive material. The side walls 482 may also comprise the same type of conductive material as the gate electrode layer 435. The side wall 482 may also include the same conductive material type as the source electrode layer 443.

The side walls 482 may also comprise an insulating material. In this case, the insulating property of the active region 406 with respect to the outer region 407 can be improved by the side wall 482. In this embodiment, the side walls 482 comprise polysilicon. The side walls 482 may also comprise n-type polysilicon or p-type polysilicon.

Referring to fig. 52 to 56, an interlayer insulating layer 491 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. Interlayer insulating layer 491 selectively covers source region 406 and outer region 407. The interlayer insulating layer 491 is formed in a film shape along the active main surface 461 and the outer main surface 462.

The interlayer insulating layer 491 selectively covers the trench gate structure 451, the gate wiring layer 436, and the trench source structure 452 in the active region 406. The interlayer insulating layer 491 selectively covers the diode region 471, the outer deep well region 472, and the field confining structure 473 in the outer region 407.

The interlayer insulating layer 491 is formed along the outer surface (inclined portion 484) of the side wall 482 in the boundary region between the active region 406 and the outer region 407. The interlayer insulating layer 491 forms a part of the upper layer structure covering the side wall 482. The peripheral edge of the interlayer insulating layer 491 may be flush with the side surfaces 405A to 405D of the SiC semiconductor layer 402.

The interlayer insulating layer 491 may also contain silicon oxide or silicon nitride. The interlayer insulating layer 491 may contain psg (Phosphor Silicate glass) and/or bpsg (boron Phosphor Silicate glass) as an example of silicon oxide.

A gate contact hole 492, a source contact hole 493, and a diode contact hole 494 are formed in the interlayer insulating layer 491. Further, an anchor hole 495 is formed in the interlayer insulating layer 491.

The gate contact hole 492 exposes the gate wiring layer 436 in the active region 406. The gate contact hole 492 may be formed in a stripe shape along the gate wiring layer 436. An opening edge portion of the gate contact hole 492 is formed in a convex curved shape facing the inside of the gate contact hole 492.

The source contact hole 493 exposes the source region 453, the contact region 454, and the trench source structure 452 in the active region 406. The source contact hole 493 may be formed in a stripe shape along the trench source structure 452, etc. The opening edge of the source contact hole 493 is formed in a convex curved shape toward the inside of the source contact hole 493.

The diode contact hole 494 exposes the diode region 471 in the outer region 407. The diode contact hole 494 may be formed in a stripe shape (more specifically, a dot shape) extending along the diode region 471.

The diode contact hole 494 may also expose the outer deep well region 472 and/or the field confining structure 473. An opening edge portion of the diode contact hole 494 is formed in a convex curved shape toward the inside of the diode contact hole 494.

The anchor hole 495 is formed by excavating an interlayer insulating layer 491 in the outer region 407. Anchor holes 495 are formed in regions between the diode region 471 and the side surfaces 405A to 405D of the SiC semiconductor layer 402 in a plan view. More specifically, anchor holes 495 are formed in the region between field limiting structure 473 and side surfaces 405A to 405D of SiC semiconductor layer 402 in a plan view.

The anchor holes 495 expose the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402. The opening edge portion of the anchor hole 495 is formed in a convex curved shape toward the inside of the anchor hole 495.

Referring to fig. 50, the anchor holes 495 are formed in a stripe shape along the active region 406 in a plan view. In this embodiment, the anchor hole 495 is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

On interlayer insulating layer 491, main surface gate electrode 408 and main surface source electrode 409 are formed. The main surface gate electrode 408 and the main surface source electrode 409 each have a laminated structure including a barrier electrode layer 501 and a main electrode layer 502 laminated in this order from the 1 st main surface 403 side of the SiC semiconductor layer 402.

The barrier electrode layer 501 may also have a single-layer configuration including a titanium layer or a titanium nitride layer. The barrier electrode layer 501 may have a laminated structure including a titanium layer and a titanium nitride layer laminated in this order from the 1 st main surface 403 side of the SiC semiconductor layer 402.

The thickness of the main electrode layer 502 is larger than that of the barrier electrode layer 501. The main electrode layer 502 contains a conductive material having a resistance value lower than that of the barrier electrode layer 501. The main electrode layer 502 may also include at least one of aluminum, copper, an aluminum alloy, or a copper alloy.

The main electrode layer 502 may also include at least one of an aluminum-silicon alloy, an aluminum-silicon-copper alloy, or an aluminum-copper alloy. In this manner, the main electrode layer 502 includes an aluminum-silicon-copper alloy.

The gate finger 411 in the main-surface gate electrode 408 enters the gate contact hole 492 from above the interlayer insulating layer 491. Gate finger 411 is electrically connected to gate wiring layer 436 within gate contact hole 492. Thereby, an electric signal from the gate pad 410 is transmitted to the gate electrode layer 435 via the gate finger 411.

The source pad 413 of the main surface source electrode 409 enters the source contact hole 493 and the source sub-trench 456 from above the interlayer insulating layer 491. The source pad 413 is electrically connected to the source region 453, the contact region 454, and the source electrode layer 443 in the source contact hole 493 and the source sub-trench 456.

The source electrode layer 443 may be formed by a region of a part of the source pad 413. That is, the source electrode layer 443 may be formed by a portion of the source pad 413 that enters the source trench 441.

The source pull-back wiring 414 in the main surface source electrode 409 enters the diode contact hole 494 from above the interlayer insulating layer 491. The source pull-back wiring 414 is electrically connected to the diode region 471 in the diode contact hole 494.

The source connection portion 415 of the main surface source electrode 409 is drawn from the active region 406 to the outer region 407 across the side wall 482. The source connection portion 415 forms a part of the upper layer structure covering the side wall 482.

A passivation layer 503 is formed over the interlayer insulating layer 491. The passivation layer 503 may also include silicon oxide and/or silicon nitride. In this mode, the passivation layer 503 has a single-layer structure including a silicon nitride layer.

The passivation layer 503 is formed in a film shape along the interlayer insulating layer 491. The passivation layer 503 selectively covers the source region 406 and the outer region 407 via the interlayer insulating layer 491.

The passivation layer 503 is drawn from the active region 406 to the outer region 407 across the side wall 482. The passivation layer 503 forms a portion of the superstructure that wraps around the side walls 482.

A gate sub-pad opening 504 and a source sub-pad opening 505 are formed in the passivation layer 503 (see also fig. 50). Gate sub-pad opening 504 exposes gate pad 410. The source sub-pad opening 505 exposes the source pad 413.

Referring to fig. 55, the passivation layer 503 enters the anchor hole 495 from above the interlayer insulating layer 491 in the outer region 407. The passivation layer 503 is connected to the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402 within the anchor holes 495. In the outer surface of the passivation layer 503 and in the region located above the anchor hole 495, a recess portion recessed in imitation of the anchor hole 495 is formed.

The peripheral edge of the passivation layer 503 may be flush with the side surfaces 405A to 405D of the SiC semiconductor layer 402. The peripheral edge of the passivation layer 503 may be formed at intervals from the side surfaces 405A to 405D of the SiC semiconductor layer 402 toward the inner region. That is, the interlayer insulating layer 491 may be exposed at the peripheral edge of the passivation layer 503.

The peripheral edge portion of the passivation layer 503 may form a part of a scribe line when the semiconductor device 401 is cut out from one SiC semiconductor wafer. By exposing the 1 st main surface 403 of the SiC semiconductor layer 402 from the peripheral edge portion of the passivation layer 503, it is not necessary to physically cut the passivation layer 503. Therefore, the semiconductor device 401 can be cut smoothly from one SiC semiconductor wafer.

The resin layer 416 is formed over the passivation layer 503. The resin layer 416 is formed in a film shape along the passivation layer 503. The resin layer 416 selectively covers the active region 406 and the outer region 407 through the passivation layer 503 and the interlayer insulating layer 491.

The resin layer 416 is drawn out from the active region 406 to the outer region 407 while crossing the side wall 482. The resin layer 416 forms a part of the upper layer structure that covers the side walls 482.

The gate pad opening 417 of the resin layer 416 communicates with the gate sub-pad opening 504 of the passivation layer 503. In this mode, the inner wall of the gate pad opening 417 of the resin layer 416 is positioned outside the inner wall of the gate sub-pad opening 504 of the passivation layer 503.

The inner wall of the gate pad opening 417 of the resin layer 416 may be formed to be flush with the inner wall of the gate sub-pad opening 504 of the passivation layer 503. The inner wall of the gate pad opening 417 of the resin layer 416 may also be located inside the inner wall of the gate sub-pad opening 504 of the passivation layer 503. That is, the resin layer 416 may also cover the inner wall of the gate sub-pad opening 504.

The source pad opening 418 of the resin layer 416 communicates with the source sub-pad opening 505 of the passivation layer 503. In this mode, the inner wall of the gate pad opening 417 of the resin layer 416 is positioned outside the inner wall of the gate sub-pad opening 504 of the passivation layer 503.

The inner wall of the source pad opening 418 of the resin layer 416 may be formed to be flush with the inner wall of the source sub-pad opening 505 of the passivation layer 503. The inner wall of source pad opening 418 of resin layer 416 may also be located inside the inner wall of source sub-pad opening 505 of passivation layer 503. That is, the resin layer 416 may also cover the inner wall of the source sub-pad opening 505.

Referring to fig. 55, the resin layer 416 has an anchor portion entering the recess of the passivation layer 503 in the outer region 407. In this way, an anchor structure for improving the connection strength of the resin layer 416 is formed in the outer region 407.

The anchor Structure includes an Uneven Structure (unnen Structure) formed on the 1 st main surface 403 of the SiC semiconductor layer 402 in the outer region 407. More specifically, the uneven structure (anchor structure) includes unevenness formed by the interlayer insulating layer 491 covering the outer main surface 462. More specifically, the concave-convex configuration (anchoring configuration) includes anchoring holes 495 formed in the interlayer insulating layer 491.

The resin layer 416 engages the anchor hole 495. In this manner, resin layer 416 engages anchor holes 495 via passivation layer 503. This can increase the bonding strength of the resin layer 416 to the 1 st main surface 403 of the SiC semiconductor layer 402, and therefore can suppress peeling of the resin layer 416.

Another mode of the gate trench 431 will be described below. As shown in fig. 57A to 57E, the gate trench 431 may take various forms. The mode shown in fig. 57A to 57E is obtained by adjusting the process conditions in the step of forming the gate trench 431.

Fig. 57A is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a2 nd embodiment of the gate trench 431. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 57A, the bottom wall of the gate trench 431 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

Fig. 57B is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 3 rd embodiment of the gate trench 431. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 57B, the gate trench 431 may have a protrusion 511 protruding toward the opening side on the bottom wall. A portion of the gate insulating layer 434 along the bottom wall of the gate trench 431 (i.e., the 2 nd region 434b) may also protrude toward the opening side along the protrusion 511 of the gate trench 431.

Fig. 57C is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 4 th embodiment of the gate trench 431. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 57C, the gate trench 431 may be formed in a tapered shape having a bottom area smaller than an opening area. The bottom wall of the gate trench 431 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

Fig. 57D is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 5 th embodiment of the gate trench 431. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 57D, the gate trench 431 may be formed in a tapered shape having a bottom area smaller than an opening area. The bottom wall of the gate trench 431 may be formed to be convexly curved toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

Fig. 57E is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 6 th embodiment of the gate trench 431. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 57E, the gate trench 431 may be formed in a tapered shape having a bottom area smaller than an opening area. The gate trench 431 may have a protrusion 511 protruding toward the opening side on the bottom wall.

A portion of the gate insulating layer 434 along the bottom wall of the gate trench 431 (i.e., the 2 nd region 434b) may also protrude toward the opening side along the protrusion 511 of the gate trench 431.

At least two or more of the gate trenches 431 (fig. 54, 57A to 57E) of the 1 st to 6 th embodiments may be formed simultaneously on the 1 st main surface 403 of the SiC semiconductor layer 402.

Another mode of the source trench 441 will be described below. As shown in fig. 58A to 58Q, the source trench 441 may take various forms. The embodiment shown in fig. 58A to 58Q is obtained by adjusting the process conditions in the step of forming the source trench 441.

Fig. 58A is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a2 nd embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58A, the bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The bottom of the deep well region 455 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

Fig. 58B is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 3 rd embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58B, the source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall. A portion of the source insulating layer 442 along the bottom wall of the source trench 441 (i.e., the 2 nd region 442b) may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402.

Fig. 58C is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 4 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58C, the source trench 441 may be formed in a tapered shape having a bottom area smaller than the opening area. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The bottom of the contact region 454 may also be formed parallel to the bottom wall of the source trench 441. A portion along the sidewall of the source trench 441 in the contact region 454 may be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the sidewall of the source trench 441.

The bottom of the deep well region 455 may also be formed parallel to the bottom wall of the source trench 441. The portion along the sidewall of the source trench 441 in the deep well region 455 may also be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the sidewall of the source trench 441.

Fig. 58D is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 5 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58D, the source trench 441 may be formed in a tapered shape having a bottom area smaller than the opening area. The bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 1 st main surface 403 side of the SiC semiconductor layer 402. A portion along the sidewall of the source trench 441 in the contact region 454 may be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the sidewall of the source trench 441.

The bottom of the deep well region 455 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the sidewall of the source trench 441.

Fig. 58E is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 6 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58E, the source trench 441 may be formed in a tapered shape having a bottom area smaller than the opening area. The source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall.

A portion (that is, the 2 nd region 442b) along the bottom wall of the source trench 441 in the source insulating layer 442 may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. A portion along the sidewall of the source trench 441 in the contact region 454 may be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the sidewall of the source trench 441.

The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also be inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the sidewall of the source trench 441.

Fig. 58F is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 7 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58F, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a halfway portion in the depth direction. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441. The 1 st portion 514 forms an opening portion of the source trench 441.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The bottom of the contact region 454 may also be formed parallel to the bottom wall of the source trench 441. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may also be formed parallel to the bottom wall of the source trench 441. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58G is a cross-sectional view of a region corresponding to fig. 54, and shows an 8 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58G, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a halfway portion in the depth direction. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441. The 1 st portion 514 forms an opening portion of the source trench 441.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441. The bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may be formed in a convex curved shape toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58H is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a source trench 441 according to example 9. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58H, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a halfway portion in the depth direction. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441. The 1 st portion 514 forms an opening portion of the source trench 441.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441. The source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall.

A portion (that is, the 2 nd region 442b) along the bottom wall of the source trench 441 in the source insulating layer 442 may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58I is a cross-sectional view of a region corresponding to fig. 54, and shows a 10 th exemplary embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58I, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a depth-direction middle portion. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441.

The 1 st portion 514 forms an opening portion of the source trench 441. The 1 st portion 514 may be formed in a tapered shape in which the opening width is narrowed from the opening side of the source trench 441 toward the step portion 513.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441.

The 2 nd portion 515 may be formed in a tapered shape in which an opening width is narrowed from the step portion 513 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The bottom of the contact region 454 may also be formed parallel to the bottom wall of the source trench 441. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 516 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. A2 nd region 517 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may also be formed in parallel with respect to the bottom wall of the source trench 441. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 519 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The 2 nd region 520 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58J is a cross-sectional view of a region corresponding to fig. 54, and shows an 11 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58J, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a depth-direction middle portion. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441.

The 1 st portion 514 forms an opening portion of the source trench 441. The 1 st portion 514 may be formed in a tapered shape in which the opening width is narrowed from the opening side of the source trench 441 toward the step portion 513.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441.

The 2 nd portion 515 may be formed in a tapered shape in which an opening width is narrowed from the step portion 513 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 516 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. A2 nd region 517 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 519 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The 2 nd region 520 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58K is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 12 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58K, the source trench 441 may have one or more stepped portions 513 protruding toward an inner region of the source trench 441 at a halfway portion in the depth direction. In this mode example, the source trench 441 has one stepped portion 513.

In this embodiment, the step portion 513 is located on substantially the same plane as the bottom wall of the gate trench 431. The stepped portion 513 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 513 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 514 and a2 nd portion 515 having different opening widths with respect to each other with the step portion 513 as a boundary. The 1 st portion 514 is formed in the region of the opening side of the source trench 441.

The 1 st portion 514 forms an opening portion of the source trench 441. The 1 st portion 514 is formed in a tapered shape in which an opening width becomes narrower from the opening side of the source trench 441 toward the step portion 513.

Portion 2 515 has an opening width that is less than the opening width of portion 1 514. The 2 nd portion 515 is formed in a region on the bottom wall side of the source trench 441. Portion 2 515 forms a bottom wall of source trench 441.

The 2 nd portion 515 may be formed in a tapered shape in which an opening width is narrowed from the step portion 513 of the source trench 441 toward the bottom wall. The source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall.

A portion (that is, the 2 nd region 442b) along the bottom wall of the source trench 441 in the source insulating layer 442 may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 516, a2 nd region 517, and a step region 518 in a manner similar to the sidewall of the source trench 441.

The 1 st region 516 of the contact region 454 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 516 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

Region 2 517 of contact region 454 wraps around portion 2 515 of source trench 441. A2 nd region 517 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515. The step portion region 518 of the contact region 454 connects the 1 st region 516 and the 2 nd region 517, and covers the step portion 513 of the source trench 441.

The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The deep well region 455 may have a 1 st region 519, a2 nd region 520, and a step region 521 along the sidewall of the source trench 441 in a manner similar to the sidewall of the source trench 441.

A 1 st region 519 of the deep well region 455 wraps around the 1 st portion 514 of the source trench 441. The 1 st region 519 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 514 of the source trench 441.

The 2 nd region 520 of the deep well region 455 wraps around the 2 nd portion 515 of the source trench 441. The 2 nd region 520 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 515 of the source trench 441. The stepped portion region 521 of the deep well region 455 connects the 1 st region 519 and the 2 nd region 520, and covers the stepped portion 513 of the source trench 441.

Fig. 58L is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 13 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58L, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary.

The 1 st portion 523 is formed in a region of the opening side of the source trench 441. The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment, the sidewall of the 1 st portion 523 is formed substantially perpendicular to the 1 st main surface 403 of the SiC semiconductor layer 402.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The bottom of the contact region 454 may also be formed parallel to the bottom wall of the source trench 441. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441.

The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may also be formed parallel to the bottom wall of the source trench 441. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have a 1 st region 528, a2 nd region 529, and a step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441.

The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58M is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 14 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58M, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary.

The 1 st portion 523 is formed in a region of the opening side of the source trench 441. The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment, the sidewall of the 1 st portion 523 is formed substantially perpendicular to the 1 st main surface 403 of the SiC semiconductor layer 402.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441.

The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have a 1 st region 528, a2 nd region 529, and a step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441.

The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58N is a cross-sectional view of a region corresponding to fig. 54, and shows a cross-sectional view of a 15 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58N, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary.

The 1 st portion 523 is formed in a region of the opening side of the source trench 441. The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment, the sidewall of the 1 st portion 523 is formed substantially perpendicular to the 1 st main surface 403 of the SiC semiconductor layer 402.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall.

The source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall. A portion (that is, the 2 nd region 442b) along the bottom wall of the source trench 441 in the source insulating layer 442 may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441.

The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have the 1 st region 528, the 2 nd region 529, and the step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441.

The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58O is a cross-sectional view of a region corresponding to fig. 54, and shows a 16 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58O, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary. The 1 st portion 523 is formed in a region of the opening side of the source trench 441.

The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment example, the 1 st portion 523 is formed in a tapered shape in which the opening width is narrowed from the opening side of the source trench 441 toward the step portion 522.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed parallel to the 1 st main surface 403 of the SiC semiconductor layer 402.

The bottom of the contact region 454 may also be formed parallel to the bottom wall of the source trench 441. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. The 1 st region 525 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the 1 st portion 523 of the source trench 441.

A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441. The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may also be formed parallel to the bottom wall of the source trench 441. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have the 1 st region 528, the 2 nd region 529, and the step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 1 st region 528 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 523 of the source trench 441.

The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441. The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58P is a cross-sectional view of a region corresponding to fig. 54, and shows a 17 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58P, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary. The 1 st portion 523 is formed in a region of the opening side of the source trench 441.

The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment example, the 1 st portion 523 is formed in a tapered shape in which the opening width is narrowed from the opening side of the source trench 441 toward the step portion 522.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall. The bottom wall of the source trench 441 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The bottom of the contact region 454 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. The 1 st region 525 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the 1 st portion 523 of the source trench 441.

A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441. The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may be formed in a convex curved shape toward the 2 nd main surface 404 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have the 1 st region 528, the 2 nd region 529, and the step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 1 st region 528 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 523 of the source trench 441.

The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441. The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58Q is a cross-sectional view of a region corresponding to fig. 54, and shows an 18 th embodiment of the source trench 441. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 58Q, the source trench 441 may have one or more step portions 522 extending outward of the source trench 441 at a middle portion in the depth direction. In this embodiment, the source trench 441 has one step portion 522.

In this embodiment, the step 522 is located on substantially the same plane as the bottom wall of the gate trench 431. The step portion 522 may be located on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431. The step portion 522 may be located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

More specifically, the source trench 441 includes a 1 st portion 523 and a2 nd portion 524 having different opening widths from each other with the step portion 522 as a boundary.

The 1 st portion 523 is formed in a region of the opening side of the source trench 441. The 1 st portion 523 forms an opening portion of the source trench 441. In this embodiment example, the 1 st portion 523 is formed in a tapered shape in which the opening width is narrowed from the opening side of the source trench 441 toward the step portion 522.

The 2 nd portion 524 is formed in a region on the bottom wall side of the source trench 441. The 2 nd portion 524 forms a bottom wall of the source trench 441. The 2 nd portion 524 bulges outward of the source trench 441 with respect to the 1 st portion 523.

The 2 nd part 524 includes a part having an opening width wider than that of the 1 st part 523. The 2 nd portion 524 is formed in a tapered shape whose opening width becomes narrower from the step portion 522 of the source trench 441 toward the bottom wall.

The source trench 441 may have a protrusion 512 protruding toward the opening side on the bottom wall. A portion (that is, the 2 nd region 442b) along the bottom wall of the source trench 441 in the source insulating layer 442 may also protrude toward the opening side along the protruding portion 512 of the source trench 441.

The bottom of the contact region 454 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion of the contact region 454 along the sidewall of the source trench 441 may have a 1 st region 525, a2 nd region 526, and a step region 527 in a manner similar to the sidewall of the source trench 441.

The 1 st region 525 of the contact region 454 wraps the 1 st portion 523 of the source trench 441. The 1 st region 525 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in conformity with the 1 st portion 523 of the source trench 441.

A2 nd region 526 of contact region 454 wraps around the 2 nd portion 524 of source trench 441. The 2 nd region 526 of the contact region 454 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. A step region 527 of the contact region 454 connects the 1 st region 525 and the 2 nd region 526, and covers the step portion 522 of the source trench 441.

The bottom of the deep well region 455 may be formed in a concave curved shape recessed toward the 1 st main surface 403 side of the SiC semiconductor layer 402. The portion along the sidewall of the source trench 441 in the deep well region 455 may also have the 1 st region 528, the 2 nd region 529, and the step region 530 in imitation of the sidewall of the source trench 441.

The 1 st region 528 of the deep well region 455 wraps around the 1 st portion 523 of the source trench 441. The 1 st region 528 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 1 st portion 523 of the source trench 441.

The 2 nd region 529 of the deep well region 455 wraps the 2 nd portion 524 of the source trench 441. The 2 nd region 529 of the deep well region 455 is inclined with respect to the 1 st main surface 403 of the SiC semiconductor layer 402 in imitation of the 2 nd portion 524 of the source trench 441. The step region 530 of the deep well region 455 connects the 1 st region 528 and the 2 nd region 529, and covers the step portion 522 of the source trench 441.

Fig. 58A to 58Q illustrate a combination of the source trench 441 and the gate trench 431 (see fig. 54) in the 2 nd to 18 th embodiments of the present invention.

However, any one or two or more of source trenches 441 (see fig. 54 and 58A to 58Q) in example 1 to 18 may be combined with gate trenches 431 (see fig. 57A) in example 2.

In addition, one or two or more of the source trenches 441 (see fig. 54, 58A to 58Q) of the 1 st to 18 th embodiments may be combined with the gate trench 431 (see fig. 57B) of the 3 rd embodiment.

In addition, one or two or more of the source trenches 441 (see fig. 54, 58A to 58Q) of the 1 st to 18 th embodiments may be combined with the gate trench 431 (see fig. 57C) of the 4 th embodiment.

In addition, one or two or more of the source trenches 441 (see fig. 54, 58A to 58Q) of the 1 st to 18 th embodiments may be combined with the gate trench 431 (see fig. 57D) of the 5 th embodiment.

In addition, one or two or more of the source trenches 441 (see fig. 54, 58A to 58Q) of the 1 st to 18 th embodiments may be combined with the gate trench 431 (see fig. 57E) of the 6 th embodiment.

At least two or more source trenches 441 (fig. 54, 57A to 57E) according to embodiments 1 to 18 may be simultaneously formed on the 1 st main surface 403 of the SiC semiconductor layer 402.

Hereinafter, another mode of the active side wall 464 will be described. As shown in fig. 59A-59C, the active sidewall 464 can take various forms. The embodiment shown in fig. 59A to 59C is obtained by adjusting the process conditions in the step of forming the active side wall 464.

Fig. 59A is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing an example of the 2 nd aspect of the active side wall 464. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 59A, the active sidewall 464 may also have an inclined surface that is inclined downward from the active main surface 461 toward the outer main surface 462. In this case, the inclination angle θ of the active side wall 464 may be larger than 90 ° and 135 ° or smaller. The inclination angle θ is an angle formed between active side wall 464 within SiC semiconductor layer 402 and active main surface 461.

The inclination angle θ may be greater than 90 ° and 120 ° or less. The inclination angle θ may be greater than 90 ° and 110 ° or less. The inclination angle θ may be greater than 90 ° and 110 ° or less. The inclination angle θ may be greater than 90 ° and 100 ° or less. The inclination angle θ may be greater than 90 ° and 95 ° or less.

Fig. 59B is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing an example of the 3 rd mode of the active side wall 464. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 59B, active sidewall 464 may also have extension 541 located on 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to outer main surface 462.

More specifically, a recessed portion 543 that is recessed toward the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the outer main surface 462 is formed in a corner portion 542 that connects the active side wall 464 and the outer main surface 462. The extension 541 of the active side wall 464 is formed by the inner wall of the recess 543.

The outer insulating layer 481 extends from above the outer main surface 462 to the recessed portion 543. The entire side wall 482 may be located above the outer main surface 462 of the outer region 407. The side wall 482 may have a portion located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the outer main surface 462 in the recessed portion 543.

Fig. 59C is an enlarged view of a region corresponding to fig. 56, and shows an example of the 4 th mode for the active side wall 464. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 59C, the active sidewall 464 may also have an inclined surface that is inclined downward from the active main surface 461 toward the outer main surface 462. In this case, the inclination angle θ of the active side wall 464 may be larger than 90 ° and 135 ° or smaller. The inclination angle θ is an angle formed between active side wall 464 within SiC semiconductor layer 402 and active main surface 461.

The inclination angle θ may be greater than 90 ° and 120 ° or less. The inclination angle θ may be greater than 90 ° and 110 ° or less. The inclination angle θ may be greater than 90 ° and 110 ° or less. The inclination angle θ may be greater than 90 ° and 100 ° or less. The inclination angle θ may be greater than 90 ° and 95 ° or less.

Further, active sidewall 464 may have extension 541 located on 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to outer main surface 462. More specifically, a recessed portion 543 that is recessed toward the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the outer main surface 462 is formed in a corner portion 542 that connects the active side wall 464 and the outer main surface 462. The extension 541 of the active side wall 464 is formed by the inner wall of the recess 543.

The outer insulating layer 481 extends from above the outer main surface 462 to the recessed portion 543. The entire side wall 482 may be located above the outer main surface 462. The side wall 482 may have a portion located on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the outer main surface 462 in the recessed portion 543.

Hereinafter, another mode of the outer main surface 462 will be described. As shown in fig. 60A to 60C, outer main surface 462 may be formed in various ways. The embodiment shown in fig. 60A to 60C is obtained by adjusting the process conditions in the outside region 407 formation step.

Fig. 60A is an enlarged view of an area corresponding to fig. 56, and is an enlarged view showing an example of embodiment 2 of outer main surface 462. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 60A, the outer main surface 462 of the outer region 407 includes one or more protrusions 544 protruding toward the active main surface 461 side at the corner 542 connecting the active side wall 464 and the outer main surface 462. Fig. 60A shows an example in which one projection 544 is formed.

In this embodiment, the outer insulating layer 481 covers the outer surface of the protrusion 544. The side wall 482 covers the outer surface of the protrusion 544 with the outer insulating layer 481 interposed therebetween. The side wall 482 can suppress a reduction in film forming property due to the projection 544.

Fig. 60B is an enlarged view of an area corresponding to fig. 56, and is an enlarged view showing an example of embodiment 3 of outer main surface 462. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 60B, outer main surface 462 includes a recessed portion 545 recessed toward second main surface 404 of SiC semiconductor layer 402 at corner portion 542 connecting active sidewall 464 and outer main surface 462.

In this mode example, the outer insulating layer 481 covers the inner wall of the recess 545. The side wall 482 fills the recess 545 with the outer insulating layer 481 interposed therebetween. The side wall 482 can suppress a reduction in film forming property due to the recess 545.

Fig. 60C is an enlarged view of an area corresponding to fig. 56, and is an enlarged view showing an example of embodiment 4 of outer main surface 462. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 60C, outer main surface 462 includes a recessed portion 545 recessed toward second main surface 404 of SiC semiconductor layer 402 at corner portion 542 connecting active sidewall 464 and outer main surface 462.

Outboard major face 462 also includes one or more protrusions 546 protruding upward from the bottom of recess 545. Fig. 60C shows an example in which one protrusion 546 is formed. In this embodiment, the protrusion 546 protrudes upward from the outer main surface 462.

In this embodiment, the outer insulating layer 481 covers the inner wall of the recess 545 and the outer surface of the protrusion 546. The side wall 482 covers the outer surface of the protrusion 546 with the outer insulating layer 481 interposed therebetween, and fills the recess 545. The side walls 482 can suppress a decrease in film formability due to the recessed portions 545 and the protrusions 546.

Any one of the active side walls 464 of the 1 st, 2 nd, 3 rd, or 4 th mode examples may be applied to the outer main surface 462 of the 1 st, 2 nd, 3 rd, or 4 th mode example.

That is, in fig. 60A, a description is given of a mode in which the active side wall 464 (see fig. 56) of the 1 st embodiment is combined with the outer main surface 462 of the 2 nd embodiment. However, the active side walls 464 according to the 2 nd to 4 th embodiments (see fig. 59A to 59C) may be combined with the outer main surface 462 according to the 2 nd embodiment.

Fig. 60B illustrates a combination of the active side wall 464 (see fig. 56) of embodiment 1 with the outer main surface 462 of embodiment 3. However, the active side walls 464 according to embodiments 2 to 4 (see fig. 59A to 59C) may be combined with the outer main surface 462 according to embodiment 3.

Fig. 60C illustrates a combination of the active side wall 464 (see fig. 56) according to embodiment 1 with the outer main surface 462 according to embodiment 4. However, the active side walls 464 according to the 2 nd to 4 th embodiments (see fig. 59A to 59C) may be combined with the outer main surface 462 according to the 4 th embodiment.

Other modes of the side wall 482 will be described below. As shown in fig. 61A to 61F, the side walls 482 may be variously formed. The embodiment shown in fig. 61A to 61F is obtained by adjusting the process conditions in the step of forming the side wall 482.

Fig. 61A is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a2 nd embodiment of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described. Fig. 61A shows an example in which the side wall 482 covers the active side wall 464 according to embodiment 1.

Referring to fig. 61A, the inclined portion 484 of the side wall 482 may extend in a planar manner from the active main surface 461 side toward the outer main surface 462 side. That is, the inclined portion 484 of the side wall 482 may linearly extend from the active main surface 461 side toward the outer main surface 462 side in the cross-section of fig. 61A.

Fig. 61B is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 3 rd embodiment of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described. Fig. 61B shows an example in which the side wall 482 covers the active side wall 464 according to embodiment 2.

Referring to fig. 61B, the inclined portion 484 of the side wall 482 may be formed in a convex curved shape facing the opposite side of the SiC semiconductor layer 402.

Fig. 61C is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 4 th mode example of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described. Fig. 61C shows an example in which the side wall 482 covers the active side wall 464 according to embodiment 3.

Referring to fig. 61C, the inclined portion 484 of the side wall 482 may have one or more stepped portions 484a recessed toward the outer main surface 462. The inclined portion 484 of the side wall 482 may be formed in a step shape that descends from the active main surface 461 toward the outer main surface 462. The surface area of the inclined portion 484 of the side wall 482 is increased by one or more stepped portions 484 a.

This increases the connecting area of the upper layer structure to the side wall 482. Therefore, the flatness of the upper layer structure can be improved, and the strength of connection of the upper layer structure to the side wall 482 can be improved.

Fig. 61D is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 5 th mode example of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described. Fig. 61D shows an example in which the side wall 482 covers the active side wall 464 according to the 4 th embodiment.

Referring to fig. 61D, the inclined portion 484 of the side wall 482 includes a plurality of raised portions 484b that rise toward the outside of the side wall 482. The surface area of the inclined portion 484 of the side wall 482 is increased by the plurality of raised portions 484 b.

This increases the connecting area of the upper layer structure to the side wall 482. Therefore, the flatness of the upper layer structure can be improved, and the strength of connection of the upper layer structure to the side wall 482 can be improved.

Fig. 61E is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 6 th mode example of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Fig. 61E shows an example in which the side wall 482 covers the outer main surface 462 according to embodiment 4. Referring to fig. 61E, the inclined portion 484 of the side wall 482 may be formed in a convex curved shape facing the opposite side of the SiC semiconductor layer 402.

A step 547 may be formed in a portion of the inclined portion 484 of the side wall 482 that is located above the protrusion portion 546. More specifically, the lateral side wall 482 includes a 1 st portion 548 that covers the active side wall 464, and a2 nd portion 549 that covers the protrusion 546. The step 547 of the side wall 482 connects the 1 st portion 548 and the 2 nd portion 549.

Fig. 61F is an enlarged view of a region corresponding to fig. 56, and is an enlarged view showing a 7 th mode example of the side wall 482. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described. In fig. 61F, an example of the active side wall 464 according to embodiment 4 is shown with the exception of a side wall 482.

Referring to fig. 61F, the inclined portion 484 of the side wall 482 includes a plurality of recesses 484c that are recessed toward the outside of the side wall 482. The surface area of the inclined portion 484 of the side wall 482 is increased by the plurality of recesses 484 c.

This increases the connecting area of the upper layer structure to the side wall 482. Therefore, the flatness of the upper layer structure can be improved, and the strength of connection of the upper layer structure to the side wall 482 can be improved.

Of course, any one of the side walls 482 of the 1 st, 2 nd, 3 rd, 4 th, 5 th, 6 th, and 7 th aspect examples may be applied to the outer main surface 462 of the 1 st, 2 nd, 3 rd, or 4 th aspect example.

In addition, any one of the side walls 482 of the 1 st, 2 nd, 3 rd, 4 th, 5 th, 6 th, and 7 th aspect examples may be applied to the active side wall 464 of the 1 st, 2 nd, 3 rd, or 4 th aspect example.

In addition, in the embodiment in which any one of the active side walls 464 according to any one of the 1 st to 4 th embodiments is combined with the outer main surface 462 according to any one of the 1 st to 4 th embodiments, any one of the side walls 482 according to any one of the 1 st to 7 th embodiments may be applied.

Hereinafter, another mode of the outer deep well region 472 will be described. As shown in fig. 62A to 62C, the outer deep well region 472 may take various forms. The embodiment shown in fig. 62A to 62C is obtained by adjusting the process conditions in the step of forming the outer deep well region 472.

Fig. 62A is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing embodiment 2 of the outer deep well region 472. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 62A, the inner periphery of outer deep well region 472 may extend to the vicinity of the boundary region between active region 406 and outer region 407. The outer deep well region 472 may also cross the boundary region between the active region 406 and the outer region 407. The inner periphery of the outer deep well region 472 may cover the corner 542 connecting the active sidewall 464 and the outer main surface 462.

Fig. 62B is a cross-sectional view of a region corresponding to fig. 55, and is an enlarged view showing embodiment 3 of the outer deep well region 472. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 62B, the inner periphery of outer deep well region 472 may extend to the vicinity of the boundary region between active region 406 and outer region 407. The outer deep well region 472 may also cross the boundary region between the active region 406 and the outer region 407.

The inner periphery of the outer deep well region 472 may cover the corner 542 connecting the active sidewall 464 and the outer main surface 462. The inner periphery of outer deep well region 472 may also further extend from corner 542 along active sidewall 464 to connect with body region 426.

Fig. 62C is a cross-sectional view of a region corresponding to fig. 55, and is an enlarged view showing an example of the 4 th embodiment of the outer deep well region. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 62C, the outer deep well region 472 may also wrap the entire region of the diode region 471. The outer periphery of the outer deep well region 472 may also be formed as part of the field confining structure 473.

Another mode of the field limiting structure 473 is explained below. As shown in fig. 63A-63D, field limiting structure 473 can take various forms. The embodiment shown in fig. 63A to 63D is obtained by adjusting the process conditions in the step of forming the field limiting structure 473.

Fig. 63A is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing a2 nd embodiment of the field limiting structure 473. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 63A, field confining structure 473 may also be formed by a field confining region 475. A field confining region 475 may also encapsulate the diode region 471. One field limiting region 475 may overlap the source pull-back wiring 414 in a plan view.

The outer periphery of one field limiting region 475 may be located on the side surfaces 405A to 405D of the SiC semiconductor layer 402 with respect to the source pull-back wiring 414 in a plan view. A field limiting region 475 may also be exposed from anchor hole 495. Of course, one field limiting region 475 may overlap the source pull-back wiring 414 in a plan view.

Fig. 63B is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing a 3 rd embodiment of the field limiting structure 473. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 63B, field confining structure 473 may also be formed by a field confining region 475. A field limiting region 475 may also be formed spaced apart from the diode region 471.

One field limiting region 475 may overlap the source pull-back wiring 414 in a plan view. The inner periphery of one field limiting region 475 may be located on the side surfaces 405A to 405D of the SiC semiconductor layer 402 with respect to the source pull-back wiring 414 in a plan view.

The outer periphery of one field limiting region 475 may be located on the side surfaces 405A to 405D of the SiC semiconductor layer 402 with respect to the source pull-back wiring 414 in a plan view. A field limiting region 475 may also be exposed from anchor hole 495. Of course, one field limiting region 475 may overlap the source pull-back wiring 414 in a plan view.

Fig. 63C is a cross-sectional view of the region corresponding to fig. 55, and is an enlarged view showing a 4 th mode example of the field limiting structure 473. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 63C, field confining structure 473 includes a plurality of (e.g., 2 or more and 20 or less) field confining regions. In this example, field limiting structure 473 includes a field limiting region group having a plurality of (5) field limiting regions 475A, 475B, 475C, 475D, 475E.

In this embodiment, the innermost field confining region 475A of the field confining regions 475A to 475E is formed at a distance from the diode region 471.

Fig. 63D is a cross-sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 5 th aspect of the field limiting structure 473. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 63D, field confining structure 473 includes a plurality of (e.g., 2 or more and 20 or less) field confining regions. Several of the plurality of field confining regions may also be exposed from anchor holes 495.

In this example, field limiting structure 473 includes a field limiting region group having a plurality of (8) field limiting regions 475A, 475B, 475C, 475D, 475E, 475F, 475G, 475H. In this embodiment, the field limiting regions 475F, 475G, and 475H of the field limiting regions 475A to 475H are exposed from the anchor holes 495.

In this embodiment, the innermost field confining region 475A of the field confining regions 475A to 475H is formed at a distance from the diode region 471. The innermost field confining region 475A may also be connected to the diode region 471.

Other modes of the anchor hole 495 will be described below. As shown in fig. 64A-64D, the anchor holes 495 may take various forms. The form shown in fig. 64A to 64D is obtained by adjusting the processing conditions in the step of forming the anchor holes 495.

Fig. 64A is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 2 nd mode of the anchor hole 495. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 64A, the anchor hole 495 may also include a plurality (2 or more) of anchor holes 495. In this manner example, the anchor holes 495 include a 1 st anchor hole 495A and a2 nd anchor hole 495B. The 1 st anchor hole 495A and the 2 nd anchor hole 495B are formed with a space in a direction away from the active region 406.

The 1 st anchor hole 495A exposes the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402. The 1 st anchor hole 495A extends in a stripe shape along the active region 406 in a plan view. In this embodiment example, the 1 st anchor hole 495A is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

The 2 nd anchor hole 495B is formed in a region on the side surfaces 405A to 405D side of the SiC semiconductor layer 402 with respect to the 1 st anchor hole 495A. The 2 nd anchor hole 495B exposes the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402.

The No. 2 anchor holes 495B extend in a stripe shape along the active region 406 in a plan view. In this embodiment example, the 2 nd anchor hole 495B is formed in an unbroken dot shape (a quadrangular ring shape) surrounding the 1 st anchor hole 495A in a plan view.

The passivation layer 503 enters the 1 st anchor hole 495A and the 2 nd anchor hole 495B from above the interlayer insulating layer 491. The passivation layer 503 is connected to the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402 in the 1 st anchor hole 495A and the 2 nd anchor hole 495B.

In the region of the outer surface of the passivation layer 503 above the 1 st anchor hole 495A and the 2 nd anchor hole 495B, a plurality of recesses are formed to be recessed in imitation of the 1 st anchor hole 495A and the 2 nd anchor hole 495B.

The resin layer 416 has a plurality of anchor portions entering the plurality of recesses of the passivation layer 503 in the outer region 407. With the plurality of anchor portions of the resin layer 416, the connection strength of the resin layer 416 with respect to the passivation layer 503 can be improved. This can suppress peeling of the resin layer 416.

Fig. 64B is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing a 3 rd mode example of the anchor hole 495. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 64B, anchor hole 495 includes an anchor recess portion 550 recessed toward the 2 nd main surface 404 side of SiC semiconductor layer 402 in the 1 st main surface 403 (outer main surface 462) of SiC semiconductor layer 402. That is, the anchor holes 495 are formed by digging the interlayer insulating layer 491, the outer insulating layer 481, and the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402.

The passivation layer 503 enters the anchor holes 495 from above the interlayer insulating layer 491. The passivation layer 503 meets the SiC semiconductor layer 402 within the anchor recess 550. In the region of the outer surface of the passivation layer 503 above the anchor hole 495, a recessed portion recessed in imitation of the anchor hole 495 is formed.

The resin layer 416 has an anchor portion into the recess of the passivation layer 503 in the outer region 407. By the anchor portion of the resin layer 416, the connection strength of the resin layer 416 with respect to the passivation layer 503 can be improved. This can suppress peeling of the resin layer 416.

Fig. 64C is a sectional view of an area corresponding to fig. 55, and is an enlarged view showing an example of the 4 th mode of the anchor hole 495. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 64C, in this mode example, the anchor holes 495 expose the outer insulating layer 481.

The passivation layer 503 enters the anchor holes 495 from above the interlayer insulating layer 491. The passivation layer 503 is connected to the outer insulating layer 481 in the anchor holes 495. In the region of the outer surface of the passivation layer 503 above the anchor hole 495, a recessed portion recessed in imitation of the anchor hole 495 is formed.

The resin layer 416 has an anchor portion into the recess of the passivation layer 503 in the outer region 407. By the anchor portion of the resin layer 416, the connection strength of the resin layer 416 with respect to the passivation layer 503 can be improved. This can suppress peeling of the resin layer 416.

Fig. 64D is a plan view corresponding to fig. 50, and is a plan view showing a 5 th modification example of the anchor hole 495. In the following, the structures already described are denoted by the same reference numerals, and description thereof is omitted, and only the new structures will be described.

Referring to fig. 64D, the anchor holes 495 include a 1 st anchor hole group 551 and a2 nd anchor hole group 552.

The 1 st anchor hole group 551 includes a plurality of 1 st anchor holes 495C. A plurality of 1 st anchor holes 495C are formed at intervals along the 1 st line 553 set in the lateral area 407.

The 1 st line 553 is set to an unbroken dot shape (a quadrangular ring shape) surrounding the active region 406. Therefore, a plurality of 1 st anchor holes 495C are formed with a space in a manner to surround the active region 406.

The 1 st anchoring holes 495C may be formed at intervals in a dot-like or stripe-like shape. The 1 st anchor holes 495C expose the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402.

The set of 2 nd anchor holes 552 includes a plurality of 2 nd anchor holes 495D. A plurality of 2 nd anchor holes 495D are formed in the outside area 407 with intervals along the 2 nd line 554 set in an area different from the 1 st line 553.

The 2 nd line 554 is set in a region on the side surfaces 405A to 405D of the SiC semiconductor layer 402 with respect to the 1 st line 553. The 2 nd line 554 is set to be an unbroken dot shape (a quadrangular ring shape) surrounding the 1 st line 553. Accordingly, a plurality of 2 nd anchor holes 495D are formed with a space in a manner of surrounding the active region 406.

The plurality of 2 nd anchor holes 495D may be formed at intervals in a dot-like or stripe-like shape. The plurality of 2 nd anchor holes 495D expose the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402.

The passivation layer 503 enters the 1 st anchor hole group 551 and the 2 nd anchor hole group 552 from above the interlayer insulating layer 491. The passivation layer 503 is connected to the 1 st main surface 403 (outer main surface 462) of the SiC semiconductor layer 402 in the 1 st anchor hole group 551 and the 2 nd anchor hole group 552.

In the region of the outer surface of the passivation layer 503 above the 1 st anchor hole group 551 and the 2 nd anchor hole group 552, a plurality of recesses are formed to be recessed in conformity with the 1 st anchor hole group 551 and the 2 nd anchor hole group 552.

The resin layer 416 has a plurality of anchor portions entering the plurality of recesses of the passivation layer 503 in the outer region 407. With the plurality of anchor portions of the resin layer 416, the connection strength of the resin layer 416 with respect to the passivation layer 503 can be improved. This can suppress peeling of the resin layer 416.

The anchor holes 495 of the 1 st to 5 th embodiments can be combined in any manner. An anchor hole 495 including at least two features of the anchor hole 495 according to the 1 st to 5 th embodiments may be formed.

Fig. 49 to 64D show various embodiments of various structures, and the embodiments shown in fig. 49 to 64D can be combined as appropriate. That is, the features shown in fig. 49 to 64D may be combined in any manner and in any form.

Fig. 65A to 65Z are enlarged views of a region corresponding to fig. 54, and are enlarged views showing an example of a method for manufacturing the semiconductor device 401 shown in fig. 49. Fig. 66A to 66Z are cross-sectional views of regions corresponding to fig. 55, and are cross-sectional views showing an example of a method for manufacturing the semiconductor device 401 shown in fig. 49.

First, referring to fig. 65A and 66A, an n + -type SiC semiconductor wafer 601 serving as a base of an n + -type SiC semiconductor substrate 421 is prepared. The SiC semiconductor wafer 601 has a 1 st wafer main surface 602 on one side and a2 nd wafer main surface 603 on the other side.

Next, referring to fig. 65B and 66B, a SiC epitaxial layer 422 is formed on the 1 st wafer main surface 602 of the SiC semiconductor wafer 601. The SiC epitaxial layer 422 is formed by growing SiC from the 1 st wafer main surface 602 of the SiC semiconductor wafer 601 by an epitaxial growth method.

In this step, the SiC epitaxial layer 422 having the high concentration regions 422a and the low concentration regions 422b is formed by adjusting the amount of n-type impurity added. Thereby, the SiC semiconductor layer 402 including the SiC semiconductor wafer 601 and the SiC epitaxial layer 422 is formed. The SiC semiconductor layer 402 includes a 1 st main surface 403 and a2 nd main surface 404. Hereinafter, the SiC semiconductor layer 402, the 1 st main surface 403, and the 2 nd main surface 404 will be described.

Next, referring to fig. 65C and 66C, a p-type body region 426 is formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. In this step, the bulk region 426 is formed over the entire surface portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The body region 426 is formed by introducing a p-type impurity into the 1 st main surface 403 of the SiC semiconductor layer 402.

Next, referring to fig. 65D and 66D, an n + -type source region 453 is formed in a surface layer portion of the body region 426. The source region 453 is formed by introducing an n-type impurity into a surface layer portion of the body region 426. In this step, the source region 453 is formed over the entire surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402.

Next, referring to fig. 65E and 66E, a hard mask 604 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. The hard mask 604 may also not comprise silicon oxide.

The hard mask 604 may be formed by a cvd (chemical vapor deposition) method or a thermal oxidation method. In this step, the hard mask 604 is formed by a thermal oxidation treatment method.

Next, referring to fig. 65F and 66F, a resist mask 605 having a predetermined pattern is formed over the hard mask 604. The resist mask 605 selectively has a plurality of openings 606 that expose regions where the gate trenches 431, the source trenches 441, and the outer regions 407 are to be formed.

Next, unnecessary portions of the SiC semiconductor layer 402 are removed by an etching method (for example, a dry etching method) through the resist mask 605. In this step, unnecessary portions of the SiC epitaxial layer 422 are removed.

Thereby, the gate trench 431 and the source trench 441 are formed. In addition, in this way, an outer region 407 recessed toward the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the active region 406 is formed. In addition, the source 463 is formed thereby.

Next, referring to fig. 65G and 66G, the resist mask 605 is removed.

Next, referring to fig. 65H and 66H, a mask 607 is formed. The mask 607 fills the gate trench 431, the source trench 441, and the outer region 407 and covers the 1 st main surface 403 of the SiC semiconductor layer 402. The mask 607 has a laminated structure including a polysilicon layer 608 and an insulating layer 609. Insulating layer 609 includes silicon oxide.

Polysilicon layer 608 may also be formed by CVD. The insulating layer 609 can be formed by a CVD method or a thermal oxidation treatment method. In this process, an insulating layer 609 is formed by a thermal oxidation treatment method with respect to the polysilicon layer 608.

Next, referring to fig. 65I and 66I, a resist mask 610 having a predetermined pattern is formed over the mask 607. The resist mask 610 selectively has a plurality of openings 611 in the mask 607, which expose portions covering the source trenches 441 and portions covering the outer regions 407.

Next, unnecessary portions of the mask 607 are removed by an etching method (for example, a dry etching method) through the resist mask 610. Thereby, the source trench 441 and the outer region 407 are exposed from the resist mask 610 and the mask 607.

Next, referring to fig. 65J and 66J, the resist mask 610 is removed. Next, unnecessary portions of the SiC semiconductor layer 402 are removed by an etching method (for example, a dry etching method) through the mask 607. Thereby, source trench 441 and outer region 407 are further dug.

In this step, source trench 441 and outer region 407 are further dug using mask 607. However, the source trench 441 and the outer region 407 may be further dug by using only the resist mask 610 instead of the mask 607.

Next, referring to fig. 65K and 66K, a resist mask 612 having a predetermined pattern is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. The resist mask 612 has an opening 613 for selectively exposing the active region 406 and an opening 614 for selectively exposing the outer region 407.

More specifically, the opening 613 exposes the active region 406 in a region where the deep well region 455 and the peripheral deep well region 459 are to be formed. More specifically, the opening 614 exposes the region where the outer deep well region 472 is to be formed in the outer region 407.

Next, a deep well region 455, a peripheral deep well region 459, and an outer deep well region 472 are formed in a surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The deep well region 455, the peripheral deep well region 459, and the outer deep well region 472 are formed by introducing a p-type impurity into the 1 st main surface 403 of the SiC semiconductor layer 402. The p-type impurity is introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through the mask 607 and the resist mask 612.

Next, referring to fig. 65L and 66L, the mask 607 and the resist mask 612 are removed.

Next, referring to fig. 65M and 66M, a resist mask 615 having a predetermined pattern is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. The resist mask 615 optionally has a plurality of openings 616 that expose areas where field confining structures 473 are desired to be formed.

Next, a field confining structure 473 is formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The field confining structure 473 is formed by introducing a p-type impurity into the 1 st main surface 403 of the SiC semiconductor layer 402. The p-type impurity is introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through the resist mask 615. Next, the resist mask 615 is removed.

Next, referring to fig. 65N and 66N, a resist mask 617 having a predetermined pattern is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. The resist mask 617 selectively has a plurality of openings 618 exposing regions where contact regions 454 and diode regions 471 are desired to be formed.

Next, a contact region 454 and a diode region 471 are formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. The contact region 454 and the diode region 471 are formed by introducing a p-type impurity into the 1 st main surface 403 of the SiC semiconductor layer 402. The p-type impurity is introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through the resist mask 617. Next, the resist mask 617 is removed.

Next, referring to fig. 65O and 66O, the base insulating layer 619 to be a base of the gate insulating layer 434, the source insulating layer 442, and the outer insulating layer 481 is formed over the 1 st main surface 403 of the SiC semiconductor layer 402. The base insulating layer 619 may also contain silicon oxide.

The base insulating layer 619 may be formed by a CVD method or a thermal oxidation treatment method. In this step, in the base insulating layer 619, a portion covering the sidewall of the gate trench 431 and a portion covering the sidewall of the source trench 441 are formed to be thinner than other portions.

In this step, in the base insulating layer 619, a portion covering the opening edge portion 432 of the gate trench 431 and a portion covering the opening edge portion 457 of the source trench 441 are formed thicker than the other portions.

The base insulating layer 619 of this type is formed by adjusting the conditions of a CVD method and a thermal oxidation treatment method. For example, in the CVD method and the thermal oxidation treatment method, predetermined conditions such as a gas flow rate, a gas type, a gas ratio, a gas supply time, and an ambient temperature may be adjusted.

Next, referring to fig. 65P and 66P, base conductor layer 620 serving as a base for gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 is formed on first main surface 403 of SiC semiconductor layer 402. The base conductor layer 620 fills the gate trench 431, the source trench 441, and the outer region 407 and covers the 1 st main surface 403 of the SiC semiconductor layer 402.

The base conductor layer 620 may also comprise polysilicon. The base conductor layer 620 may be formed by CVD. The CVD method may be LP-CVD (Low Pressure-CVD).

Next, referring to fig. 65Q and 66Q, unnecessary portions of the base conductor layer 620 are removed. An unnecessary portion of the base conductive layer 620 is removed to expose the base insulating layer 619. The unnecessary portions of the base conductive layer 620 may be removed by etching using the base insulating layer 619 as an etching stopper.

The unnecessary portions of the base conductor layer 620 may be removed by an etching method (e.g., a wet etching method) through a mask (not shown) having a predetermined pattern. Thereby, gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 are formed.

In this step, a part of the base conductor layer 620 remains attached to the active sidewall 464 connecting the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407.

The side walls 482 are formed by the remaining portions of the base conductor layer 620. Side wall 482 is formed to be self-matching with active main face 461 of active region 406.

Next, referring to fig. 65R and 66R, an interlayer insulating layer 491 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. Interlayer insulating layer 491 covers both source region 406 and outer region 407. The interlayer insulating layer 491 may also contain silicon oxide or silicon nitride. The interlayer insulating layer 491 may be formed by CVD.

Next, referring to fig. 65S and 66S, a resist mask 621 having a predetermined pattern is formed over the interlayer insulating layer 491. The resist mask 621 selectively has a plurality of openings 622 exposing regions where the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 are desired to be formed.

Next, unnecessary portions of the interlayer insulating layer 491 were removed. The unnecessary portion of the interlayer insulating layer 491 may be removed by etching (for example, dry etching) through the resist mask 621.

Next, referring to fig. 65T and 66T, unnecessary portions of the base insulating layer 619 exposed from the interlayer insulating layer 491 are removed. An unnecessary portion of the base insulating layer 619 may be removed by an etching method (e.g., a dry etching method).

Thereby, the base insulating layer 619 is divided into the gate insulating layer 434, the source insulating layer 442, and the outer insulating layer 481. In addition, thereby, the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 are formed in the interlayer insulating layer 491.

In this step, source sub-trench 456 communicating with source trench 441 is formed in the 1 st main surface 403 of SiC semiconductor layer 402 in a region along the upper end portion of source electrode layer 443.

More specifically, the source sub-trench 456 is formed by digging an upper end portion of the source insulating layer 442 and an upper end portion of the source electrode layer 443 from the 1 st main surface 403 of the SiC semiconductor layer 402.

Then, opening edge portions of the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 may also be rounded in a convex curved shape by a heat treatment method.

Next, referring to fig. 65U and 66U, an underlying electrode layer 623 serving as a base for the main-surface gate electrode 408 and the main-surface source electrode 409 is formed on the interlayer insulating layer 491. In this step, a base electrode layer 623 having a stacked structure including the barrier electrode layer 501 and the main electrode layer 502 is formed.

In this step, first, a barrier electrode layer 501 is formed over the interlayer insulating layer 491. The barrier electrode layer 501 includes a step of forming a titanium layer and a titanium nitride layer in this order from above the interlayer insulating layer 491. The titanium layer and the titanium nitride layer may be formed by sputtering. The barrier electrode layer 501 having a single-layer structure including a titanium layer or a titanium nitride layer may be formed.

Next, a main electrode layer 502 is formed over the barrier electrode layer 501. The main electrode layer 502 may also include an aluminum-silicon-copper alloy. The main electrode layer 502 may be formed by sputtering.

Next, referring to fig. 65V and 66V, a resist mask 624 having a predetermined pattern is formed over the interlayer insulating layer 491. The resist mask 624 selectively covers the base electrode layer 623 in the region to be the main surface gate electrode 408 and the main surface source electrode 409.

Subsequently, unnecessary portions of the underlying electrode layer 623 are removed. Unnecessary portions of the underlying electrode layer 623 can also be removed by an etching method (e.g., wet etching method) through the resist mask 624. Thereby, the underlying electrode layer 623 is divided into the main surface gate electrode 408 and the main surface source electrode 409. Next, the resist mask 624 is removed.

Next, referring to fig. 65W and 66W, a passivation layer 503 is formed on the interlayer insulating layer 491. Passivation layer 503 also encapsulates source region 406 and outer region 407. The passivation layer 503 may also include silicon oxide or silicon nitride. The passivation layer 503 may be formed by a CVD method.

Next, unnecessary portions of the passivation layer 503 are removed by an etching method through a resist mask (not shown) having a predetermined pattern. Thereby, a gate sub-pad opening 504 and a source sub-pad opening 505 are formed in the passivation layer 503.

Next, referring to fig. 65X and 66X, a resin layer 416 is applied on the passivation layer 503. Resin layer 416 also encapsulates active region 406 and outer region 407. The resin layer 416 may contain polybenzoxazole as an example of a positive photosensitive resin.

Next, after selectively exposing the resin layer 416, development is performed. Thereby, a gate pad opening 417 and a source pad opening 418 are formed in the resin layer 416. In addition, this defines a dicing lane along the dicing line in the resin layer 416.

Next, referring to fig. 65Y and 66Y, the 2 nd main surface 404 of the SiC semiconductor layer 402 (the 2 nd wafer main surface 603 of the SiC semiconductor wafer 601) is polished. Thereby, the SiC semiconductor layer 402(SiC semiconductor wafer 601) becomes thin.

Next, referring to fig. 65Z and 66Z, drain pad 423 is formed on second main surface 404 of SiC semiconductor layer 402. This step may include a step of forming at least one of a Ti layer, a Ni layer, an Au layer, or an Ag layer as the drain pad 423. The Ti layer, Ni layer, Au layer, or Ag layer may be formed by sputtering.

The step of forming the drain pad 423 may include a step of forming a Ti layer, a Ni layer, an Au layer, and an Ag layer in this order from the 2 nd main surface 404 of the SiC semiconductor layer 402. The Ti layer, Ni layer, Au layer, and Ag layer may be formed by sputtering.

Then, the SiC semiconductor layer 402(SiC semiconductor wafer 601) is selectively cut along dicing lines (dicing streets). Thereby, a plurality of semiconductor devices 401 are cut out from one SiC semiconductor wafer 601. Through the steps including the above, the semiconductor device 401 is formed.

As described above, according to the semiconductor device 401, the depletion layer can be expanded from the boundary region (pn junction) between the SiC semiconductor layer 402 and the deep well region 455 toward the region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom wall of the gate trench 431.

As a result, the current path of the short-circuit current flowing between the source pad 413 and the drain pad 423 can be narrowed. Further, the feedback capacitance can be reduced in inverse proportion by the depletion layer spreading from the boundary region between the SiC semiconductor layer 402 and the deep well region 455. Thus, a semiconductor device capable of improving short-circuit tolerance and reducing feedback capacitance can be provided.

A depletion layer extending from a boundary region (pn junction) between the SiC semiconductor layer 402 and the deep well region 455 may overlap the bottom wall of the gate trench 431. In this case, the depletion layer expanding from the bottom of the deep well region 455 may overlap the bottom wall of the gate trench 431.

Further, according to the semiconductor device 401, since the region occupied by the depletion layer in the SiC semiconductor layer 402 can be increased, the feedback capacitance Crss can be reduced in inverse proportion. The feedback capacitance Crss is an electrostatic capacitance between the gate electrode layer 435 and the drain pad 423.

In addition, according to the semiconductor device 401, the distance between the bottom of each deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402 is substantially constant. This can suppress variation in the distance between the bottom of each deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402.

Therefore, since the withstand voltage (for example, electrostatic breakdown resistance) of the SiC semiconductor layer 402 can be suppressed from being limited by the manner of the deep well region 455, the withstand voltage can be appropriately improved.

In addition, according to the semiconductor device 401, the diode region 471 is formed in the outer region 407. The diode region 471 is electrically connected to the main surface source electrode 409. This allows an avalanche current generated in the outer region 407 to flow into the main-surface source electrode 409 through the diode region 471.

That is, the avalanche current generated in the outer region 407 can be absorbed by the diode region 471 and the primary surface source electrode 409. As a result, the operation stability of the MISFET can be improved.

In addition, according to the semiconductor device 401, the outer deep well region 472 is formed in the outer region 407. Thereby, the withstand voltage of the SiC semiconductor layer 402 can be adjusted in the outer region 407.

In particular, according to the semiconductor device 401, the outer deep well region 472 is formed at a depth substantially equal to that of the deep well region 455. More specifically, the bottom of the outer deep well region 472 is located on substantially the same plane as the bottom of the deep well region 455.

That is, the distance between the bottom of the outer deep well region 472 and the 2 nd main surface 404 of the SiC semiconductor layer 402 is substantially equal to the distance between the bottom of the deep well region 455 and the 2 nd main surface 404 of the SiC semiconductor layer 402.

This can suppress the occurrence of variations in the distance between the bottom of outer deep well region 472 and first main surface 2 404 of SiC semiconductor layer 402 and the distance between the bottom of deep well region 455 and first main surface 2 404 of SiC semiconductor layer 402.

Therefore, it is possible to suppress the limitation of the withstand voltage (for example, the electrostatic breakdown resistance) of the SiC semiconductor layer 402 by the form of the outer deep well region 472 and the form of the deep well region 455. As a result, the withstand voltage can be improved appropriately.

In particular, in the semiconductor device 401, the outer region 407 is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the active region 406. This allows the bottom of the outer deep well region 472 to be appropriately positioned closer to the bottom of the deep well region 455.

That is, when forming the outer deep well region 472, it is not necessary to introduce the p-type impurity into a relatively deep position of the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402. Therefore, it is possible to appropriately suppress a large positional shift of the bottom of the outer deep well region 472 with respect to the position of the bottom of the deep well region 455.

In the semiconductor device 401, the outer main surface 462 of the outer region 407 is located on substantially the same plane as the bottom wall of the source trench 441. Accordingly, when the p-type impurity is introduced into the bottom wall of the source trench 441 and the outer main surface 462 of the outer region 407 with the same energy, the deep well region 455 and the outer deep well region 472 can be formed at substantially the same depth position.

As a result, it is possible to more appropriately suppress a large positional shift of the bottom of the outer deep well region 472 with respect to the bottom of the deep well region 455.

In addition, according to the semiconductor device 401, the field confining structure 473 is formed in the outer region 407. Thereby, in outer region 407, an electric field relaxing effect by field limiting structure 473 can be obtained. Therefore, the electrostatic breakdown resistance of the SiC semiconductor layer 402 can be appropriately improved.

In addition, according to the semiconductor device 401, the active region 406 is formed as a mesa-shaped active mesa 463. Active mesa 463 includes active major surface 461 to which active region 406 is connected and active sidewalls 464 of outer major surface 462 of outer region 407.

A step reducing structure for reducing a step 483 between the active main surface 461 and the outer main surface 462 is formed in a region between the active main surface 461 and the outer main surface 462. The step alleviating structure includes a side wall 482.

This can appropriately alleviate the step 483 between the active main surface 461 and the outer main surface 462. Therefore, the flatness of the upper layer structure formed on the side wall 482 can be appropriately improved. In the semiconductor device 401, an interlayer insulating layer 491, a main surface source electrode 409, a passivation layer 503, and a resin layer 416 are formed as an example of an upper layer structure.

In addition, according to the semiconductor device 401, in the outer region 407, an anchor structure for improving the connection strength of the resin layer 416 is formed. The anchor Structure includes a concave-convex Structure (ineven Structure) formed on the 1 st main surface 403 of the SiC semiconductor layer 402 in the outer region 407.

More specifically, the uneven structure (anchor structure) includes unevenness formed by the interlayer insulating layer 491 formed on the 1 st main surface 403 of the SiC semiconductor layer 402 in the outer region 407. More specifically, the concave-convex configuration (anchoring configuration) includes anchoring holes 495 formed in the interlayer insulating layer 491.

The resin layer 416 engages the anchor hole 495. In this manner, resin layer 416 engages anchor holes 495 via passivation layer 503. This can increase the bonding strength of the resin layer 416 to the 1 st main surface 403 of the SiC semiconductor layer 402, and therefore peeling of the resin layer 416 can be appropriately suppressed.

The mode of the semiconductor device 401 is not limited to this embodiment. The embodiment of the semiconductor device 401 can be applied to all the embodiments disclosed in this specification.

Fig. 67 is an enlarged view of a region corresponding to fig. 51, and is an enlarged view showing a semiconductor device 631 according to embodiment 27 of the present invention. FIG. 68 is a sectional view taken along line LXVIII-LXVIII shown in FIG. 67. FIG. 69 is a sectional view taken along line LXIX-LXIX shown in FIG. 67. FIG. 70 is an enlarged view of the region LXX-LXX shown in FIG. 68.

Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 67 to 70, a semiconductor device 631 has an embodiment that adopts the technical idea of the semiconductor device 101 according to embodiment 7 (also see fig. 11 to 17L) with respect to the semiconductor device 401. More specifically, the semiconductor device 631 includes a low-resistance electrode layer 632 formed over the gate electrode layer 435.

The gate electrode layer 435 includes p-type polysilicon to which p-type impurities are added. The p-type impurity of the gate electrode layer 435 may contain at least one of boron (B), aluminum (Al), indium (In), or gallium (Ga).

The p-type impurity concentration of gate electrode layer 435 is equal to or higher than the p-type impurity concentration of body region 426. More specifically, the p-type impurity concentration of the gate electrode layer 435 is larger than the p-type impurity concentration of the body region 426.

The p-type impurity concentration of the gate electrode layer 435 may be 1 × 10¹⁸cm^－3Above and 1 × 10²²cm^－3The following. The sheet resistance of the gate electrode layer 435 may be 10 Ω/□ or more and 500 Ω/□ or less (200 Ω/□ or less in this embodiment).

The low-resistance electrode layer 632 covers the upper end portion of the gate electrode layer 435 within the gate trench 431. The low-resistance electrode layer 632 contains a conductive material having a sheet resistance smaller than that of the gate electrode layer 435. The sheet resistance of the low-resistance electrode layer 632 may be 0.01 Ω/□ or more and 10 Ω/□ or less.

The current supplied into the gate trench 431 flows through the low-resistance electrode layer 632 having a relatively low sheet resistance, and is transmitted to the entire gate electrode layer 435. This enables the entire gate electrode layer 435 (the entire active region 406) to be quickly switched from the off state to the on state, thereby suppressing delay in switching response.

In particular, in the case of the gate trench 431 having a length on the order of millimeters, although it takes time for current to pass, delay in switching response can be appropriately suppressed by the low-resistance electrode layer 632. That is, the low-resistance electrode layer 632 is formed as a current diffusion electrode layer for diffusing a current into the gate trench 431.

Further, as the cell structure is miniaturized, the width, depth, cross-sectional area, and the like of the gate electrode layer 435 are reduced, and therefore, there is a concern that the switching response is delayed due to an increase in resistance in the gate trench 431.

However, according to the low-resistance electrode layer 632, the entire gate electrode layer 132 can be quickly switched from the off state to the on state, and therefore, delay in switching response due to miniaturization can be appropriately suppressed.

The low-resistance electrode layer 632 is formed in a film shape. The low-resistance electrode layer 632 includes a connection portion 632a connected to the upper end of the gate electrode layer 435 and a non-connection portion 632b opposite to the connection portion. The connection portion 632a and the non-connection portion 632b of the low-resistance electrode layer 632 may be formed in a curved shape in conformity with the upper end portion of the gate electrode layer 435. The connection portion 632a and the non-connection portion 632b of the low-resistance electrode layer 632 can be formed in various ways.

The entire connection portion 632a of the low-resistance electrode layer 632 may be located above the 1 st main surface 403 of the SiC semiconductor layer 402. The entire connection portion 632a of the low-resistance electrode layer 632 may be located below the 1 st main surface 403 of the SiC semiconductor layer 402.

The connection portion 632a of the low-resistance electrode layer 632 may include a portion located above the 1 st main surface 403 of the SiC semiconductor layer 402. The connection portion 632a of the low-resistance electrode layer 632 may include a portion below the 1 st main surface 403 of the SiC semiconductor layer 402.

For example, the central portion of the connection portion 632a of the low-resistance electrode layer 632 may be located below the 1 st main surface 403 of the SiC semiconductor layer 402, and the peripheral portion of the connection portion 632a of the low-resistance electrode layer 632 may be located above the 1 st main surface 403 of the SiC semiconductor layer 402.

The entirety of the non-connection portion 632b of the low-resistance electrode layer 632 may be located above the 1 st main surface 403 of the SiC semiconductor layer 402. The entirety of the non-connection portion 632b of the low-resistance electrode layer 632 may be located below the 1 st main surface 403 of the SiC semiconductor layer 402.

The non-connection portion 632b of the low-resistance electrode layer 632 may include a portion located above the 1 st main surface 403 of the SiC semiconductor layer 402. The non-connection portion 632b of the low-resistance electrode layer 632 may include a portion located below the 1 st main surface 403 of the SiC semiconductor layer 402.

For example, the central portion of the non-connection portion 632b of the low-resistance electrode layer 632 may be located below the 1 st main surface 403 of the SiC semiconductor layer 402, and the peripheral portion of the non-connection portion 632b of the low-resistance electrode layer 632 may be located above the 1 st main surface 403 of the SiC semiconductor layer 402.

The low-resistance electrode layer 632 has an edge portion 632c in contact with the gate insulating layer 434. An edge portion 632c of the low-resistance electrode layer 632 is in contact with a corner portion (in this embodiment, a protruding portion 434d) connecting the 1 st region 434a and the 2 nd region 434b in the gate insulating layer 434.

An edge portion 632c of the low-resistance electrode layer 632 is formed in a region on the 1 st main surface 403 side of the SiC semiconductor layer 402 with respect to the bottom portion of the source region 453. That is, the edge portion 632c of the low-resistance electrode layer 632 is formed in a region on the 1 st main surface 403 side of the SiC semiconductor layer 402 from the boundary region between the body region 426 and the source region 453.

Therefore, the edge portion 632c of the low-resistance electrode layer 632 faces the source region 453 with the gate insulating layer 434 interposed therebetween. The edge portion 632c of the low-resistance electrode layer 632 faces the body region 426 with the gate insulating layer 434 interposed therebetween.

This can suppress formation of a leakage current path in the gate insulating layer 434 in the region between the low-resistance electrode layer 632 and the main region 426. The leakage current path may be formed by an undesired diffusion of the electrode material of the low-resistance electrode layer 632 with respect to the gate insulating layer 434.

In particular, the design of connecting the edge portion 632c of the low-resistance electrode layer 632 to the 3 rd region 434c of the relatively thick gate insulating layer 434 (the protruding portion 434d of the gate insulating layer 434) is effective in reducing the risk of forming a leakage current path.

In the normal direction of the 1 st main surface 403 of the SiC semiconductor layer 402, the thickness TR of the low-resistance electrode layer 632 is equal to or less than the thickness TG of the gate electrode layer 435 (TR ≦ TG). The thickness TR of the low-resistance electrode layer 632 is preferably smaller than the thickness TG of the gate electrode layer 435 (TR < TG). More specifically, the thickness TR of the low-resistance electrode layer 632 is preferably equal to or less than half the thickness TG of the gate electrode layer 435 (TR. ltoreq. TG/2).

The ratio TR/TG of the thickness TR of the low-resistance electrode layer 632 to the thickness TG of the gate electrode layer 435 is 0.01 or more and 1 or less. The thickness TG of the gate electrode layer 435 may be 0.5 μm or more and 3 μm or less. The thickness TR of the low-resistance electrode layer 632 may be 0.01 μm or more and 3 μm or less.

In this embodiment, the low-resistance electrode layer 632 also covers the upper end portion of the gate wiring layer 436. The portion where the low-resistance electrode layer 632 covers the upper end portion of the gate wiring layer 436 is integrally formed with the portion where the low-resistance electrode layer 632 covers the upper end portion of the gate electrode layer 435. Thus, the low-resistance electrode layer 632 covers the entire region of the gate electrode layer 435 and the entire region of the gate wiring layer 436.

Therefore, the current supplied from the gate pad 410 and the gate finger 411 to the gate wiring layer 436 flows through the low-resistance electrode layer 632 having a relatively low sheet resistance, and is transmitted to the entire gate electrode layer 435 and the gate wiring layer 436.

This makes it possible to quickly shift the entire gate electrode layer 435 (the entire active region 406) from the off state to the on state via the gate wiring layer 436, and therefore, delay in switching response can be suppressed.

In particular, in the case of the gate trench 431 having a length on the order of millimeters, the delay of the switching response can be appropriately suppressed by the low-resistance electrode layer 632 covering the upper end portion of the gate wiring layer 436.

The low-resistance electrode layer 632 includes a polycrystalline layer. The polycrystalline layer is formed by silicidizing part of p-type polycrystalline silicon, which forms a surface layer portion of the gate electrode layer 435.

The silicidation of the p-type polysilicon is performed by heat treatment. The heat treatment may be an RTA (Rapid Thermal annealing) method. More specifically, the polycrystalline layer is composed of a p-type polycrystalline layer containing a p-type impurity added to the gate electrode layer 435 (p-type polycrystalline silicon).

In this embodiment, the polycrystalline layer has a resistivity of 10 μ Ω · cm or more and 110 μ Ω · cm or less. More specifically, the polycrystalline layer comprises TiSi, TiSi₂、NiSi、CoSi、CoSi₂、MoSi₂Or WSi₂At least one of (1).

In particular, NiSi and CoSi in these species₂And TiSi₂Since the resistivity value and the temperature dependency are relatively small, the polycrystalline layer is suitable for forming the low-resistance electrode layer 632.

When the low-resistance electrode layer 632 is formed over the p-type polysilicon, the sheet resistance in the gate trench 431 is equal to or lower than the sheet resistance of the gate electrode layer 132 (p-type polysilicon) alone. The sheet resistance in the gate trench 431 is preferably equal to or lower than that of n-type polycrystalline silicon to which an n-type impurity is added.

The sheet resistance in the gate trench 431 is similar to that of the low-resistance electrode layer 632. That is, the sheet resistance in the gate trench 431 may be 0.01 Ω/□ or more and 10 Ω/□ or less. The sheet resistance within gate trench 431 may also be less than 10 Ω/□.

In this manner, the trench gate structure 451 includes the gate trench 431, the gate insulating layer 434, the gate electrode layer 435, and the low-resistance electrode layer 632.

In this manner, the gate finger 411 is electrically connected to the low-resistance electrode layer 632 in the gate contact hole 492. Thereby, an electric signal from the gate pad 410 is transmitted to the gate electrode layer 435 via the low-resistance electrode layer 632 having a relatively low resistance value.

The source electrode layer 443 preferably contains p-type polysilicon to which a p-type impurity is added. In this case, the source electrode layer 443 can be formed simultaneously with the gate electrode layer 435.

The p-type impurity concentration of source electrode layer 443 is equal to or higher than the p-type impurity concentration of body region 426. More specifically, the p-type impurity concentration of the source electrode layer 443 is greater than the p-type impurity concentration of the body region 426. The p-type impurity of source electrode layer 443 may include at least one of boron (B), aluminum (Al), indium (In), and gallium (Ga).

The p-type impurity concentration of the source electrode layer 443 may be 1 × 10¹⁸cm^－3Above and 1 × 10²²cm^－3The following. The sheet resistance of the source electrode layer 443 may be 10 Ω/□ or more and 500 Ω/□ or less (200 Ω/□ or less in this embodiment).

The p-type impurity concentration of source electrode layer 443 may be substantially equal to the p-type impurity concentration of gate electrode layer 435. The sheet resistance of the source electrode layer 443 may be substantially equal to the sheet resistance of the gate electrode layer 435.

The source electrode layer 443 may also include n-type polysilicon instead of p-type polysilicon. Instead of p-type polysilicon, the source electrode layer 443 may include at least one of tungsten, aluminum, copper, an aluminum alloy, or a copper alloy.

The side walls 482 (see also fig. 55 and 56) preferably include p-type polysilicon to which a p-type impurity is added. In this case, the side wall 482 can be formed simultaneously with the gate electrode layer 435 and the source electrode layer 443.

The p-type impurity concentration of side wall 482 is equal to or higher than the p-type impurity concentration of body region 426. More specifically, the p-type impurity concentration of side wall 482 is greater than the p-type impurity concentration of body region 426. The p-type impurity of the side wall 482 may include at least one of boron (B), aluminum (Al), indium (In), or gallium (Ga).

The p-type impurity concentration of the side wall 482 may be 1 × 10¹⁸cm^－3Above and 1 × 10²²cm^－3The following. The sheet resistance of the side wall 482 may be 10 Ω/□ or more and 500 Ω/□ or less (200 Ω/□ or less in this embodiment).

The p-type impurity concentration of side wall 482 may be substantially equal to the p-type impurity concentration of gate electrode layer 435. The sheet resistance of the side wall 482 may be substantially equal to the sheet resistance of the gate electrode layer 435.

The side walls 482 may also comprise n-type polysilicon instead of p-type polysilicon. The side walls 482 may also comprise at least one of tungsten, aluminum, copper, an aluminum alloy, or a copper alloy, instead of p-type polysilicon.

Fig. 71 is a graph showing leakage current characteristics in the case where NiSi is used for the low-resistance electrode layer 632. In FIG. 71, the vertical axis represents the current density [ A/cm ]²]The horizontal axis represents the electric field [ MV/cm ]]。

Referring to the graph of fig. 71, in the case of NiSi, the leakage current is suppressed to a relatively low value in the low electric field region of 0MV/cm or more and 7MV/cm or less, regardless of the processing temperature of the RTA method. Therefore, the polycrystalline layer is suitable for forming the low-resistance electrode layer 632.

FIG. 72 shows the use of CoSi₂A graph of leakage current characteristics in the case of the low-resistance electrode layer 632. In FIG. 72, the vertical axis represents the current density [ A/cm ]²]The horizontal axis represents the electric field [ MV/cm ]]。

Referring to the graph of FIG. 72, CoSi₂In the case of (2), as the treatment temperature of the RTA method becomes higher, the leakage current in the low electric field region of 0MV/cm or more and 7MV/cm or less increases. However, the leakage current is still suppressed to a relatively low value in the low electric field region. Therefore, the polycrystalline layer is suitable for forming the low-resistance electrode layer 632.

FIG. 73 shows the use of TiSi and/or TiSi₂A graph of leakage current characteristics in the case of the low-resistance electrode layer 632. In FIG. 73, the vertical axis represents the current density [ A/cm ]²]The horizontal axis represents the electric field [ MV/cm ]]。

Referring to the graph of FIG. 73, in TiSi and/or TiSi₂In the case of (2), as the treatment temperature of the RTA method becomes higher, the leakage current in the low electric field region of 0MV/cm or more and 7MV/cm or less increases.

Therefore, TiSi and/or TiSi is used as the polycrystalline layer for forming the low-resistance electrode layer 632₂Inferior to NiSi and CoSi₂. This is thought to be due to the constitution of TiSi and/or TiSi₂Is present in the gate insulating layer 434.

In the presence of TiSi and/or TiSi₂In the step of forming the low-resistance electrode layer 632, first, a Ti layer is formed so as to cover the gate electrode layer 435 and the gate insulating layer 434. Next, a heat treatment step for silicidation is performed.

In this heat treatment step, the low-resistance electrode layer 632 is formed, and Si constituting the gate insulating layer 434 (silicon oxide) diffuses into the Ti layer. Then, although the Ti layer is removed, a region in which Si is diffused remains as a part of the gate insulating layer 434 in the Ti layer.

Therefore, a leakage current path due to Ti is formed in a region between the gate electrode layer 435 and the source electrode layer 443. In particular, it is considered that a leakage current path is formed by Ti remaining in the 3 rd region 434c of the gate insulating layer 434.

That is, the use of TiSi and/or TiSi₂In the case of the low-resistance electrode layer 632, the gate insulating layer 434 (particularly, the 3 rd region 434c of the gate insulating layer 434) may contain Ti.

In contrast, the Ni layer and the Co layer used for silicidation of polycrystalline silicon have different properties from the Ti layer. More specifically, the Ni layer has a property that Si constituting the gate insulating layer 434 (silicon oxide) is hard to diffuse into the Ni layer.

Similarly, the Co layer has a property that Si constituting the gate insulating layer 434 (silicon oxide) is hard to diffuse into the Co layer. Therefore, when a Ni layer and a Co layer are used instead of a Ti layer, the problem of the Ti layer is difficult to be clarified.

Therefore, the low-resistance electrode layer 632 contains Ti (TiSi and/or TiSi)₂) In the case of (3), Si constituting the gate insulating layer 434 (silicon oxide) may be suppressed from diffusing into the Ti layer. This can suppress the formation of a leakage current path. This method will be described in the following embodiments.

Fig. 74A to 74G are enlarged views of a region corresponding to fig. 70, and are enlarged views for explaining an example of the method for manufacturing the semiconductor device shown in fig. 67. Hereinafter, a manufacturing process different from that of the semiconductor device 401 will be described.

First, referring to fig. 74A, SiC semiconductor layer 402 on which gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 are formed through the steps of fig. 65A to 65Q (fig. 66A to 66Q) is prepared. The gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443 each include p-type polysilicon.

Next, referring to fig. 74B, a metal material layer 641 is formed on the gate electrode layer 435. In this embodiment, the metal material layer 641 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402 so as to collectively cover the gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443.

The metal material layer 641 includes a metal material capable of being polycrystallized with p-type polysilicon. The metal material layer 641 may also include at least one of Mo, W, Ni, Co, or Ti.

Next, referring to fig. 74C, a p-type polycrystalline layer is formed on the surface layer of the gate electrode layer 435 and the surface layer of the gate wiring layer 436. In this embodiment, a p-type polycrystalline layer is also formed in the surface layer portion of the source electrode layer 443.

The p-type polycrystalline layer is formed by polycrystallizing a surface layer portion of the gate electrode layer 435, a surface layer portion of the gate wiring layer 436, and a surface layer portion of the source electrode layer 443 by heat treatment of the metal material layer 641. The heat treatment of the metal material layer 641 may be an RTA method.

Thus, TiSi and TiSi are formed according to the metal type of the metal material layer 641₂、NiSi、CoSi、CoSi₂、MoSi₂Or WSi₂A p-type polycrystal of at least one of them. The low-resistance electrode layer 632 is formed from the p-type polycrystalline layer.

Next, referring to fig. 74D, an unreacted portion of the metal material layer 641 not combined with the p-type polysilicon is removed. The unreacted portion of the metal material layer 641 may also be removed by an etching method (e.g., a wet etching method).

In the case where the low-resistance electrode layer 632 (p-type polycrystal) contains at least one of TiSi and CoSi, after removing an unreacted portion of the metal material layer 641, heat treatment may be performed on the low-resistance electrode layer 632 as necessary.

The heat treatment for the low-resistance electrode layer 632 may be an RTA method. Thus, the TiSi is modified into TiSi₂Modification of CoSi to CoSi₂Therefore, the resistance can be reduced.

Next, referring to fig. 74E, an interlayer insulating layer 491 is formed on the 1 st main surface 403 of the SiC semiconductor layer 402. Interlayer insulating layer 491 covers both source region 406 and outer region 407. The interlayer insulating layer 491 may also contain silicon oxide or silicon nitride. The interlayer insulating layer 491 may be formed by CVD.

Next, referring to fig. 74F, a resist mask 621 having a predetermined pattern is formed over the interlayer insulating layer 491. The resist mask 621 selectively has a plurality of openings 622 exposing regions where the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 should be formed.

Next, unnecessary portions of the interlayer insulating layer 491 were removed. The unnecessary portion of the interlayer insulating layer 491 may be removed by etching (for example, dry etching) through the resist mask 621.

Next, referring to fig. 74G, an unnecessary portion of the base insulating layer 619 exposed from the interlayer insulating layer 491 is removed. An unnecessary portion of the base insulating layer 619 may be removed by an etching method (e.g., a dry etching method).

Thereby, the base insulating layer 619 is divided into the gate insulating layer 434, the source insulating layer 442, and the outer insulating layer 481. In addition, in this way, the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 are formed in the interlayer insulating layer 491.

In this step, source sub-trench 456 communicating with source trench 441 is formed in a region along the upper end portion of source electrode layer 443 in first main surface 403 of SiC semiconductor layer 402.

More specifically, the source sub-trench 456 is formed by digging an upper end portion of the source insulating layer 442 and an upper end portion of the source electrode layer 443 from the 1 st main surface 403 of the SiC semiconductor layer 402. In this step, the low-resistance electrode layer 632 (p-type polycrystalline layer) formed in the surface layer portion of the source electrode layer 443 is also removed.

Then, opening edge portions of the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 may be rounded in a convex curved shape by a heat treatment.

Then, the steps in fig. 65U to 65Z (the steps in fig. 66U to 66Z) are sequentially performed to manufacture the semiconductor device 631.

As described above, the semiconductor device 631 can achieve the same effects as those described for the semiconductor device 401.

In addition, according to the semiconductor device 631, the trench gate structure 451 in which the gate electrode layer 435 is buried with the gate insulating layer 434 interposed therebetween can be formed in the gate trench 431. In the trench gate structure 451, the gate electrode layer 435 is covered with the low-resistance electrode layer 632 in a limited space called a gate trench 431.

Gate electrode layer 435 comprises p-type polysilicon. This can increase the gate threshold voltage Vth (for example, about 1V). In addition, the low-resistance electrode layer 632 contains a conductive material having a sheet resistance smaller than that of p-type polysilicon.

This can reduce the gate resistance. As a result, the current can be effectively diffused along the trench gate structure 451, and thus the switching delay can be shortened.

In particular, according to the structure in which the gate electrode layer 435 is covered with the low-resistance electrode layer 632, the p-type impurity concentration of the body region 426 does not need to be increased. Therefore, the gate threshold voltage Vth can be increased while preventing an increase in the channel resistance.

In the semiconductor device 631, the gate wiring layer 436 is covered with the low-resistance electrode layer 632 in the outer region 407. This also reduces the gate resistance of the gate wiring layer 436.

In particular, in the structure in which the low-resistance electrode layer 632 is covered with the gate electrode layer 435 and the gate wiring layer 436, current can be efficiently diffused along the trench gate structure 451. Thus, shortening of the switching delay can be appropriately achieved.

In this embodiment, an example in which the low-resistance electrode layer 632 (p-type polycrystalline layer) formed in the surface layer portion of the source electrode layer 443 is removed is described. However, the low-resistance electrode layer 632 (p-type polycrystalline layer) formed in the surface layer portion of the source electrode layer 443 may remain. Semiconductor device 631 may also include low-resistance electrode layer 632 in source trench 441, covering source electrode layer 443.

The mode of the semiconductor device 631 (i.e., the mode in which the low-resistance electrode layer 632 is formed) is not limited to this embodiment. The mode of the semiconductor device 631 can be applied to all the embodiments disclosed in this specification.

Fig. 75 is an enlarged view of an area corresponding to fig. 70, and is an enlarged view of a semiconductor device 651 according to embodiment 28 of the present invention. Hereinafter, the structure corresponding to the structure described for the semiconductor device 631 will be denoted by the same reference numeral, and description thereof will be omitted.

In this manner, the gate insulating layer 434 includes the silicon oxide layer 652, and the low-resistance electrode layer 632 includes Ti (more specifically, TiSi and/or TiSi)₂). Referring to fig. 75, a semiconductor device 651 includes a barrier insulating layer 653 interposed in a region between a gate insulating layer 434 and a low-resistance electrode layer 632.

The barrier insulating layer 653 is formed as a part of the gate insulating layer 434. That is, the gate insulating layer 434 has a laminated structure including a silicon oxide layer 652 and a barrier insulating layer 653 which are laminated in this order from the SiC semiconductor layer 402 side.

The barrier insulating layer 653 suppresses diffusion of Si in the gate insulating layer 434 (the silicon oxide layer 652) into the low-resistance electrode layer 632. More specifically, the barrier insulating layer 653 is a non-silicon-containing insulating layer containing no Si.

The barrier insulating layer 653 may also contain aluminum oxide (Al)₂O₃) Hafnium oxide (HfO)₂) Lanthanum oxide (La)₂O₃) Or cerium oxide (CeO)₂) At least one of (1).

The barrier insulating layer 653 is formed in a film shape along the outer surface of the silicon oxide layer 652 so as to define a concave space in the gate trench 431. The barrier insulating layer 653 covers the 1 st region 434a, the 2 nd region 434b, and the 3 rd region 434c of the gate insulating layer 434 (the silicon oxide layer 652).

The low-resistance electrode layer 632 is formed on the gate electrode layer 435 and the gate wiring layer 436 so as to be in contact with the barrier insulating layer 653. This can suppress diffusion of Si in the gate insulating layer 434 (the silicon oxide layer 652) into the low-resistance electrode layer 632.

In this embodiment mode, the barrier insulating layer 653 is also interposed in a region between the source insulating layer 442 and the source electrode layer 443. Although not shown, in this embodiment, the 3 rd region 434c of the gate insulating layer 434 is covered with the barrier insulating layer 653, and the outer surface of the outer insulating layer 481 is covered with the barrier insulating layer 653 in the same manner as this.

Fig. 76A to 76G are enlarged views of regions corresponding to fig. 75, and are enlarged views for explaining an example of the method for manufacturing the semiconductor device 651 shown in fig. 75.

First, referring to fig. 76A, through the steps of fig. 65A to 65N (fig. 66A to 66N), an SiC semiconductor layer 402 having a structure in which a contact region 454 is formed in a surface layer portion of the 1 st main surface 403 is prepared.

Next, referring to fig. 76B, a base insulating layer 619 to be a base of the gate insulating layer 434, the source insulating layer 442, and the outer insulating layer 481 is formed. The base insulating layer 619 includes a silicon oxide layer 652. The base insulating layer 619 may be formed by a CVD method or a thermal oxidation treatment method.

Next, a barrier insulating layer 653 is formed over the base insulating layer 619. The barrier insulating layer 653 is a non-silicon-containing insulating layer containing no Si. The barrier insulating layer 653 may also contain aluminum oxide (Al)₂O₃) Hafnium oxide (HfO)₂) Lanthanum oxide (La)₂O₃) Or cerium oxide (CeO)₂) At least one of (a). The barrier insulating layer 653 may be formed by CVD.

Next, referring to fig. 76C, base conductor layer 620 serving as a base for gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 is formed on first main surface 403 of SiC semiconductor layer 402. The base conductor layer 620 fills the gate trench 431, the source trench 441, and the outer region 407 and covers the barrier insulating layer 653.

The base conductor layer 620 comprises p-type polysilicon. The base conductor layer 620 may be formed by CVD. The CVD method may be LP-CVD (Low Pressure-CVD).

Next, referring to fig. 76D, unnecessary portions of the base conductor layer 620 are removed. An unnecessary portion of the base conductive layer 620 is removed to expose the base insulating layer 619. The unnecessary portions of the base conductive layer 620 may be removed by etching using the base insulating layer 619 as an etching stopper.

The unnecessary portions of the base conductor layer 620 may be removed by an etching method (e.g., a wet etching method) through a mask (not shown) having a predetermined pattern. Thereby, gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 are formed.

In this step, a portion of base conductor layer 620 (including p-type polysilicon) remains attached to active sidewall 464 connecting active main surface 461 of active region 406 and outer main surface 462 of outer region 407.

The side walls 482 are formed by the remaining portions (p-type polysilicon) of the base conductor layer 620. Side wall 482 is formed to be self-matching with active main face 461 of active region 406.

Next, referring to fig. 76E, a Ti layer is formed as the metal material layer 641 on the gate electrode layer 435. In this embodiment, the metal material layer 641 is formed on the barrier insulating layer 653 so as to collectively cover the gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443.

Next, referring to fig. 76F, a p-type polycrystalline layer is formed on the surface layer of the gate electrode layer 435 and the surface layer of the gate wiring layer 436. In this embodiment, a p-type polycrystalline layer is also formed in the surface layer portion of the source electrode layer 443.

The p-type polycrystalline layer is formed by polycrystallizing a surface layer portion of the gate electrode layer 435, a surface layer portion of the gate wiring layer 436, and a surface layer portion of the source electrode layer 443 by heat treatment of the metal material layer 641. The heat treatment of the metal material layer 641 may be an RTA method.

Thereby forming a film containing TiSi and/or TiSi₂P-type polycrystal of (1). The low-resistance electrode layer 632 is formed from the p-type polycrystalline layer. In this step, diffusion of Si in the base insulating layer 619 (the silicon oxide layer 652) into the low-resistance electrode layer 632 can be suppressed by the barrier insulating layer 653.

Next, referring to fig. 76G, the unreacted portion of the metal material layer 641 not combined with the p-type polysilicon is removed. The unreacted portion of the metal material layer 641 may also be removed by an etching method (e.g., a wet etching method).

In the case where the low-resistance electrode layer 632 (p-type polycrystalline) includes TiSi, after removing an unreacted portion of the metal material layer 641, heat treatment may be performed on the low-resistance electrode layer 632 as necessary.

The heat treatment for the low-resistance electrode layer 632 may be an RTA method. Thus, the TiSi is modified into TiSi₂Therefore, the resistance can be reduced. In this step, the diffusion of Si in the base insulating layer 619 (the silicon oxide layer 652) into the low-resistance electrode layer 632 can be suppressed by the barrier insulating layer 653.

Then, the steps in fig. 65R to 65Z (the steps in fig. 66R to 66Z) are sequentially performed to manufacture the semiconductor device 651.

As described above, according to the semiconductor device 651, the gate insulating layer 434 includes the silicon oxide layer 652, and the low-resistance electrode layer 632 includes Ti (more specifically, TiSi and/or TiSi)₂). The semiconductor device 651 includes a barrier insulating layer 653 interposed in a region between the gate insulating layer 434 and the low-resistance electrode layer 632.

The barrier insulating layer 653 suppresses diffusion of Si in the gate insulating layer 434 (the silicon oxide layer 652) into the low-resistance electrode layer 632. More specifically, the barrier insulating layer 653 is a non-silicon-containing insulating layer containing no Si.

Thus, the low-resistance electrode layer 632 contains Ti (more specifically, TiSi and/or TiSi)₂) In the above aspect, a leakage current path can be prevented from being formed in a region between the gate electrode layer 435 and the source electrode layer 443. As a result, it is possible to appropriately reduce the gate resistance of the low-resistance electrode layer 632 while suppressing the leakage current in the low electric field region (see the graph of fig. 73).

In addition, according to the semiconductor device 651, the 3 rd region 434c of the gate insulating layer 434 in close proximity to the source electrode layer 443 is covered with the barrier insulating layer 653. This can appropriately suppress leakage current.

In the embodiment of the semiconductor device 651, it goes without saying that the various embodiment examples described above can be applied to embodiments 26 to 27. The mode of the semiconductor device 651 is not limited to this embodiment. The embodiment of the semiconductor device 651 can be applied to all the embodiments disclosed in this specification.

Fig. 77 is an enlarged view of a region corresponding to fig. 70, and is an enlarged view of a semiconductor device 661 according to embodiment 29 of the present invention. Hereinafter, the structure corresponding to the structure described for the semiconductor device 631 will be denoted by the same reference numeral, and description thereof will be omitted.

In this embodiment, the gate insulating layer 434 includes a silicon oxide layer 662, and the low-resistance electrode layer 632 includes Ti (more specifically, TiSi and/or TiSi)₂). Referring to fig. 77, the semiconductor device 661 includes a barrier insulating layer 663 that covers the gate insulating layer 434. More specifically, the barrier insulating layer 663 covers the 3 rd region 434c of the gate insulating layer 434.

The barrier insulating layer 663 suppresses diffusion of Si in the gate insulating layer 434 (silicon oxide layer 662) into the low-resistance electrode layer 632. More specifically, the barrier insulating layer 663 is a non-silicon-containing insulating layer containing no Si.

The barrier insulating layer 663 may also contain aluminum oxide (Al)₂O₃) Hafnium oxide (HfO)₂) Lanthanum oxide (La)₂O₃) Or cerium oxide (CeO)₂) At least one of (1).

Although not shown, the 3 rd region 434c of the gate insulating layer 434 is covered with the barrier insulating layer 663, and the outer surface of the outer insulating layer 481 may be covered with the barrier insulating layer 663 in the same manner as described above.

Fig. 78A to 78F are enlarged views of regions corresponding to fig. 77, and are enlarged views for explaining an example of a method for manufacturing the semiconductor device 661 shown in fig. 77.

First, referring to fig. 78A, through the steps of fig. 65A to 65Q (fig. 66A to 66Q), SiC semiconductor layer 402 on which gate electrode layer 435, gate wiring layer 436, and source electrode layer 443 are formed is prepared. The gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443 each include p-type polysilicon.

Next, referring to fig. 78B, a barrier insulating layer 663 is formed over the base insulating layer 619. The barrier insulating layer 663 isA non-silicon containing insulating layer containing no Si. The barrier insulating layer 663 may also contain aluminum oxide (Al 2O)₃) Hafnium oxide (HfO)₂) Lanthanum oxide (La 2O)₃) Or cerium oxide (CeO)₂) At least one of (a). The barrier insulating layer 663 may be formed by CVD.

Next, referring to fig. 78C, a resist mask 664 having a predetermined pattern is formed over the barrier insulating layer 663. In this step, the resist mask 664 selectively has a plurality of openings 665 for exposing the gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443.

Subsequently, unnecessary portions of the barrier insulating layer 663 are removed. The unnecessary portions of the barrier insulating layer 663 may be removed by etching (for example, dry etching) through the resist mask 664. Thereby, the gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443 are exposed from the barrier insulating layer 663. Next, the resist mask 664 is removed.

Next, referring to fig. 78D, a Ti layer is formed as a metal material layer 641 on the gate electrode layer 435. In this embodiment, the metal material layer 641 is formed on the barrier insulating layer 663 so as to collectively cover the gate electrode layer 435, the gate wiring layer 436, and the source electrode layer 443.

Next, referring to fig. 74E, a p-type polycrystalline layer is formed on the surface layer of the gate electrode layer 435 and the surface layer of the gate wiring layer 436. In this embodiment, a p-type polycrystalline layer is also formed in the surface layer portion of the source electrode layer 443.

The p-type polycrystalline layer is formed by polycrystallizing a surface layer portion of the gate electrode layer 435, a surface layer portion of the gate wiring layer 436, and a surface layer portion of the source electrode layer 443 by heat treatment of the metal material layer 641. The heat treatment of the metal material layer 641 may be an RTA method.

Thereby forming a film containing TiSi and/or TiSi₂P-type polycrystal of (1). The low-resistance electrode layer 632 is formed from the p-type polycrystalline layer. In this step, the diffusion of Si in the base insulating layer 619 (silicon oxide layer 662) into the low-resistance electrode layer 632 can be suppressed by the barrier insulating layer 663.

Next, referring to fig. 78F, the unreacted portion of the metal material layer 641 not combined with the p-type polysilicon is removed. The unreacted portion of the metal material layer 641 may also be removed by an etching method (e.g., a wet etching method).

In the case where the low-resistance electrode layer 632 (p-type polycrystalline) includes TiSi, after the unreacted portion of the metal material layer 641 is removed, heat treatment may be performed on the low-resistance electrode layer 632 as needed. The heat treatment for the low-resistance electrode layer 632 may be an RTA method. Thus, the TiSi is modified into TiSi₂Therefore, the resistance can be reduced.

Then, the steps in fig. 65R to 65Z (the steps in fig. 66R to 66Z) are sequentially performed to manufacture a semiconductor device 661.

As described above, according to the semiconductor device 661, the gate insulating layer 434 includes the silicon oxide layer 662, and the low-resistance electrode layer 632 includes Ti (more specifically, TiSi and/or TiSi)₂). The semiconductor device 661 includes a barrier insulating layer 663 that covers the 3 rd region 434c of the gate insulating layer 434.

In the manufacturing process, the barrier insulating layer 663 suppresses diffusion of Si in the gate insulating layer 434 (silicon oxide layer 662) into the low-resistance electrode layer 632. More specifically, the barrier insulating layer 663 is a non-silicon-containing insulating layer containing no Si.

Thus, the low-resistance electrode layer 632 contains Ti (more specifically, TiSi and/or TiSi)₂) In the above aspect, formation of a leakage current path in a region between the gate electrode layer 435 and the source electrode layer 443 can be suppressed. As a result, it is possible to suppress the leakage current in the low electric field region (see also the graph of fig. 73), and it is possible to appropriately reduce the gate resistance of the low-resistance electrode layer 632.

In the semiconductor device 661, the 3 rd region 434c of the gate insulating layer 434 adjacent to the source electrode layer 443 is covered with the barrier insulating layer 663. This can appropriately suppress leakage current.

In this embodiment, an example in which the barrier insulating layer 663 covering the 3 rd region 434c of the gate insulating layer 434 is formed is described. However, the barrier insulating layer 663 may be removed after the step of removing the unreacted portion of the metal material layer 641 (see fig. 78F). In this case, although the barrier insulating layer 663 is not provided, the semiconductor device 661 in which a low resistance can be achieved while suppressing a leakage current and a gate resistance can be improved.

Of the embodiments of the semiconductor device 661, it goes without saying that the various embodiments described above can be applied to the 26 th to 28 th embodiments. The mode of the semiconductor device 661 is not limited to this embodiment. The embodiment of the semiconductor device 651 can be applied to all the embodiments disclosed in this specification.

Fig. 79 is an enlarged view of a region corresponding to fig. 70, and is an enlarged view showing a semiconductor device 671 according to embodiment 30 of the present invention. Fig. 80 is a sectional view of a region corresponding to fig. 69, and is a sectional view showing the semiconductor device 671 shown in fig. 79. Fig. 81 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing the semiconductor device 671 shown in fig. 79.

Hereinafter, the structure corresponding to the structure described for the semiconductor device 631 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 79, the semiconductor device 671 includes a low-resistance electrode layer 632. In this embodiment, the interlayer insulating layer 491 includes a gate contact hole 492, a source contact hole 493, a diode contact hole 494, and an anchor hole 495, which have different shapes from those of the above-described embodiments.

The interlayer insulating layer 491 may have a single-layer structure including a psg (Phosphor Silicate glass) layer or a bpsg (boron phosphate glass) layer. The interlayer insulating layer 491 may have a laminated structure including a PSG layer and a BPSG layer laminated in this order from the 1 st main surface 403 side of the SiC semiconductor layer 402. The interlayer insulating layer 491 may have a laminated structure including a BPSG layer and a PSG layer laminated in this order from the 1 st main surface 403 side of the SiC semiconductor layer 402.

Referring to fig. 80, the gate contact hole 492 includes: a wide width part 672 having a relatively wide opening width; and a narrow-width portion 673 having an opening width narrower than that of the wide-width portion 672.

The wide part 672 is formed in a region on the opening side of the gate contact hole 492. The narrow portion 673 is formed in the gate contact hole 492 in a region on the 1 st main surface 403 side of the SiC semiconductor layer 402. The wide portions 672 and the narrow portions 673 relax the step in the gate contact holes 492.

Referring to fig. 79, the source contact hole 493 includes: a wide part 674 having a relatively wide opening width; and a narrow width portion 675 having an opening width narrower than the opening width of the wide width portion 674.

The wide part 674 is formed in the region on the opening side of the source contact hole 493. The narrow width portion 675 is formed in the source contact hole 493 in a region on the 1 st main surface 403 side of the SiC semiconductor layer 402. The wide portions 674 and the narrow portions 675 alleviate the step in the source contact hole 493.

Referring to fig. 81, the diode contact hole 494 includes: a wide width portion 676 having a relatively wide opening width; and a narrow width portion 677 having an opening width narrower than that of the wide width portion 676.

The wide portion 676 is formed in the region of the opening side of the diode contact hole 494. The narrow portion 677 is formed in the diode contact hole 494 in the region on the 1 st main surface 403 side of the SiC semiconductor layer 402. Wide portions 676 and narrow portions 677 alleviate the steps in diode contact holes 494.

Referring to fig. 81, the anchor hole 495 includes: a wide portion 678 having a relatively wide opening width; and a narrow-width portion 679 having an opening width narrower than that of the wide-width portion 678.

The wide portion 678 is formed in the area on the opening side of the anchor hole 495. The narrow portion 679 is formed in the anchor hole 495 in a region on the 1 st main surface 403 side of the SiC semiconductor layer 402. The wide portions 678 and the narrow portions 679 alleviate the step in the anchor holes 495.

The main surface gate electrode 408 enters the gate contact hole 492 from above the interlayer insulating layer 491. The main surface gate electrode 408 is formed in the gate contact hole 492 in a manner imitating the wide portions 672 and the narrow portions 673. This improves the film formability of the main surface gate electrode 408 entering the gate contact hole 492.

The main surface source electrode 409 extends from above the interlayer insulating layer 491 into the source contact hole 493 and the diode contact hole 494. The main surface source electrode 409 is formed in the source contact hole 493 so as to follow the wide portion 674 and the narrow portion 675.

The main surface source electrode 409 is formed in the diode contact hole 494 so as to follow the wide width portion 676 and the narrow width portion 677. This improves the film formation property of the main surface source electrode 409 entering the source contact hole 493 and the diode contact hole 494.

The passivation layer 503 enters the anchor holes 495 from above the interlayer insulating layer 491. The passivation layer 503 is formed in the anchor holes 495 so as to mimic the wide-width portions 678 and the narrow-width portions 679. Thereby, the film formability of the passivation layer 503 into the anchor holes 495 is improved.

Fig. 82A to 82C are enlarged views of a region corresponding to fig. 79, and are enlarged views for explaining an example of the method for manufacturing the semiconductor device 671 shown in fig. 79.

First, referring to fig. 82A, through the steps of fig. 65A to 65R (fig. 66A to 66R), an SiC semiconductor layer 402 having a structure in which an interlayer insulating layer 491 is formed on the 1 st main surface 403 is prepared.

Next, referring to fig. 82B, a resist mask 681 having a predetermined pattern is formed over the interlayer insulating layer 491. The resist mask 681 selectively has a plurality of openings 682 that expose areas where the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 are desired to be formed.

Next, an unnecessary portion of the interlayer insulating layer 491 is removed by an isotropic etching method (for example, an isotropic dry etching method or an isotropic wet etching method) through the resist mask 681.

Thus, the wide parts 672 and 674 of the gate contact holes 492 and 493, the wide parts 676 and 678 of the diode contact holes 494 and the anchor holes 495 are formed, respectively.

Next, referring to fig. 82C, an unnecessary portion of the interlayer insulating layer 491 is removed by an anisotropic etching method (for example, an anisotropic dry etching method or an anisotropic wet etching method) through the resist mask 681.

Thereby, the narrow portion 673 of the gate contact hole 492, the narrow portion 675 of the source contact hole 493, the narrow portion 677 of the diode contact hole 494, and the narrow portion 679 of the anchor hole 495 are formed, respectively.

Then, the steps in fig. 65U to 65Z (the steps in fig. 66U to 66Z) are sequentially performed to manufacture the semiconductor device 671.

As described above, according to the semiconductor device 671, the gate contact hole 492 includes the wide portion 672 and the narrow portion 673. The wide portions 672 and the narrow portions 673 relax the step in the gate contact holes 492. This can improve the film formation property of the main surface gate electrode 408 entering the gate contact hole 492.

In addition, according to the semiconductor device 671, the source contact hole 493 includes a wide portion 674 and a narrow portion 675. The wide portions 674 and the narrow portions 675 alleviate the step in the source contact hole 493. This can improve the film forming property of the main surface source electrode 409 entering the source contact hole 493.

In addition, according to the semiconductor device 671, the diode contact hole 494 includes the wide width portion 676 and the narrow width portion 677. Wide portions 676 and narrow portions 677 alleviate the steps in diode contact holes 494. This can improve the film formation property of the main surface source electrode 409 entering the diode contact hole 494.

In addition, according to the semiconductor device 671, the anchor hole 495 includes a wide-width portion 678 and a narrow-width portion 679. The wide portions 678 and the narrow portions 679 alleviate the step in the anchor holes 495. This can improve the film forming property of the passivation layer 503 entering the anchor holes 495.

Further, according to the semiconductor device 671, the shapes of the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495 are finished by etching.

That is, according to the semiconductor device 671, in order to arrange the shapes of the gate contact hole 492, the source contact hole 493, the diode contact hole 494, and the anchor hole 495, heat treatment is not performed.

This can suppress the low-resistance electrode layer 632 (p-type polysilicon layer) from being heated after the low-resistance electrode layer 632 (p-type polysilicon layer) is formed. This can appropriately suppress an undesirable increase in gate resistance and an undesirable increase in leakage current.

Of the embodiments of the semiconductor device 671, it is needless to say that the various embodiments described above can be applied to the 26 th to 29 th embodiments. The mode of the semiconductor device 671 is not limited to this embodiment. The mode of the semiconductor device 671 can be applied to all the embodiments disclosed in this specification.

Fig. 83 is a bottom view of a semiconductor device 691 according to embodiment 31 of the present invention, showing a bump group 693 according to embodiment 1. Hereinafter, a structure corresponding to the structure of the semiconductor device 401 will be described with the same reference numerals.

Referring to fig. 83, a semiconductor device 691 is a semiconductor device 401 employing the technical idea of the semiconductor device 311 according to embodiment 22 (also see fig. 34 to 43I).

More specifically, the semiconductor device 691 has a ridge portion group 693 including a plurality of ridge portions 692 on the 2 nd main surface 404 of the SiC semiconductor layer 402. The plurality of raised portions 692 are portions raised in the direction of the normal to the 2 nd main surface 404 of the SiC semiconductor layer 402 in the 2 nd main surface 404 of the SiC semiconductor layer 402.

The plurality of protrusions 692 are formed at intervals in any of the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 1 st direction X is one of the plane directions of the 1 st main surface 403 of the SiC semiconductor layer 402.

In this embodiment, the 1 st direction X is set to be parallel to the side surfaces 405B and 405D of the SiC semiconductor layer 402. More specifically, the 2 nd direction Y is a direction orthogonal to the 1 st direction X. That is, in this embodiment, the 2 nd direction Y is set to be parallel to the side surfaces 405A and 405C of the SiC semiconductor layer 402.

The bump group 693 has a1 st portion 694, which is a portion 694 where several bump portions 692 of the plurality of bump portions 692 overlap in the 1 st direction X when viewed from the 1 st direction X, as viewed from the 1 st direction X.

The ridge portion group 693 has a2 nd portion 695, and the 2 nd portion 695 is a portion in which some of the ridge portions 692 of the plurality of ridge portions 692 are formed apart from the 1 st portion 694 and overlap in the 1 st direction X when viewed in the 1 st direction.

The plurality of protrusions 692 are continuously formed in the 1 st direction X. More specifically, the plurality of protrusions 692 has a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of bumps 692 maintains the distribution pattern, and is continuously formed in the 1 st direction X. In this embodiment, a plurality of ridge portions 692 are formed from the peripheral edge on the side of one side surface 405A to the peripheral edge on the side of the other side surface 405C of the SiC semiconductor layer 402 in a plan view.

The distance between the plurality of raised portions 692 formed at intervals in the 1 st direction X in the raised portion group 693 may be different from each other. The distance between the plurality of raised portions 692 formed at intervals in the 2 nd direction Y in the raised portion group 693 may be different from each other.

The plurality of bumps 692 may be formed in uneven shapes, sizes, and thicknesses. The thickness of the ridge portion 692 is a distance from the base to the top (tip end) of the ridge portion 692 in the normal direction of the 2 nd main surface 404 of the SiC semiconductor layer 402.

Each of the plurality of projections 692 may have a size larger than 0 μm and 10 μm or less. Each of the bumps 692 may have a thickness of 500nm or less (e.g., 1nm or more and 250nm or less).

The ridge group 693 is formed in the second main surface 2 404 of the SiC semiconductor layer 402 in a range narrower than the width of the side surfaces 405A to 405D (side surfaces 405A and 405C in this embodiment) of the SiC semiconductor layer 402.

The ridge group 693 may be formed, for example, in a range of 1 to 1 of 1000 minutes and 1 to 5 minutes of the width of the side surfaces 405A to 405D (side surfaces 405A and 405C in this embodiment) of the SiC semiconductor layer 402.

The ridge group 693 may be formed in a range of 200 minutes to 1 minute and 10 minutes to 1 minute of the width of the side surfaces 405A to 405D (side surfaces 405A and 405C in this embodiment) of the SiC semiconductor layer 402.

The protrusion group 693 may be formed in the range of 10 μm to 200 μm in the 2 nd direction Y. The protrusion 693 may be formed in a range of 50 μm to 150 μm in the 2 nd direction Y. The protrusion group 693 may be formed in a range of 80 μm to 120 μm in the 2 nd direction Y.

The bump group 693 has a layout in which a plurality of bumps 692 overlap in the 1 st direction X when viewed from the 1 st direction X in the 1 st direction X. Thus, the ridge group 693 forms a ridge group region 696 extending in a band-like manner in the 1 st direction X by an aggregate pattern of a plurality of ridges 692 continuously distributed in the 1 st direction X.

In other words, the protrusion group region 696 includes a plurality of protrusions 692 (protrusion group 693) formed in a band-shaped region extending in the 1 st direction X in the 2 nd main surface 404 of the SiC semiconductor layer 402.

A plurality of protrusion group 693 (protrusion group regions 696) having such a configuration are formed on the 2 nd main surface 404 of the SiC semiconductor layer 402 at intervals in the 2 nd direction Y.

That is, the distribution pattern of the plurality of swelling portions 692 is intermittently formed when viewed from the 2 nd direction Y as viewed from the 2 nd direction Y. The distance between the plurality of protrusion groups 693 may have a value of 1% to 25% of the range in which the protrusion groups 693 are formed.

The distance between the plurality of protrusion groups 693 adjacent to each other in the 2 nd direction Y may be 100 μm or less. The distance between the plurality of protrusion groups 693 may be 5 μm or more and 50 μm or less. The distance between the plurality of protrusion groups 693 may be 20 μm or less.

The 1 st direction X may be set to the [ 11-20 ] direction, and the 2 nd direction Y may be set to the [ 1-100 ] direction. That is, the ridge group 693 may be formed in a band-like ridge group region 696 extending substantially parallel or parallel to the [ 11-20 ] direction, or may be formed in plural numbers spaced apart in the [ 1-100 ] direction.

The 1 st direction X may be set to the [ 1-100 ] direction, and the 2 nd direction Y may be set to the [ 11-20 ] direction. That is, the ridge group 693 may be formed in a band-like ridge group region 696 extending substantially parallel or parallel to the [ 1-100 ] direction, or may be formed in plural numbers spaced apart in the [ 11-20 ] direction.

In the region between the ridge portion groups 693 adjacent to each other in the 2 nd direction Y in the 2 nd main surface 404 of the SiC semiconductor layer 402, a space 697 without a distribution pattern formed by the plurality of ridge portions 692 is defined.

The space 697 is divided into bands extending parallel to the 1 st direction X by the ridge group 693 (ridge group region 696) adjacent to each other. As a result, stripe patterns in which the ridge groups 693 and the spaces 697 are alternately formed in the 2 nd direction Y are formed on the 2 nd main surface 404 of the SiC semiconductor layer 402.

A plurality of grooves 698 are formed in the 2 nd main surface 404 of the SiC semiconductor layer 402. In fig. 83 and the enlarged view of fig. 83, the groove 698 is shown by a line. Grooves 698 are formed in the sets of ridges 693 and spaces 697.

The grooves 698 include polishing marks generated by polishing of the 2 nd wafer main surface 603 of the SiC semiconductor wafer 601 (see also fig. 41A to 41B, 65A to 65Z, and 66A to 66Z). Therefore, the direction in which the grooves 698 extend differs depending on the position at which the SiC semiconductor layer 402 is cut out from the SiC semiconductor wafer 601.

The grooves 698 may also extend generally parallel or parallel to each ridge group 693. Groove 698 can also include portions that intersect set of ridges 693. Grooves 698 may also extend in a direction that intersects or is orthogonal to each set of ridges 693. The groove 698 may extend linearly or in an arc shape.

Several of the plurality of protuberances 692 included in each protuberance group 693 are formed at intervals along the groove 698. That is, each of the bump groups 693 includes 3 rd portions 699 formed at intervals along the groove 698 from several bumps 692 among the plurality of bumps 692 in a plan view.

Each of the ridge group 693 is formed by, for example, an annealing treatment. The plurality of bumps 692 may be laser-processed marks formed by a laser annealing treatment method.

The plurality of raised portions 692 along the groove 698 (the 3 rd portion 699 of the raised portion group 693) may also be formed by an annealing treatment process on the irregularities defined by the groove 698 in the 2 nd main surface 404 of the SiC semiconductor layer 402 (the 2 nd wafer main surface 603 of the SiC semiconductor wafer 601).

As shown in fig. 84A to 84D, each of the bump groups 693 can be subjected to various methods by adjusting the annealing conditions (here, laser annealing conditions).

Fig. 84A is a view showing an example of the 2 nd embodiment of each of the bump groups 693.

As shown in fig. 84A, the swelling portion group 693 may include a convexly curved swelling portion 692 extending in the 1 st direction X in a plan view and protruding in the 2 nd direction Y (the side surface 405B side in fig. 84A). The ridge portion 692 may be formed by a plurality of ridge portions 692 overlapping each other.

The distance between the 2 dots at the farthest distance in the bump 692 may be 1 μm or more and 200 μm or less (50 μm or so in this embodiment example). The distance between the plurality of swelling portions 692 adjacent to each other in the 1 st direction X is set to a value of 10% or more of the size of the swelling portion 692. The plurality of bumps 692 are formed by shifting laser irradiation positions adjacent to each other in the 1 st direction X.

Fig. 84B is a diagram showing an example of embodiment 3 of a bulge portion group 693.

As shown in fig. 84B, the ridge group 693 may include a concavely curved ridge 692 extending in the 2 nd direction Y and recessed in the 1 st direction X in a plan view. The ridge portion 692 may be formed by a plurality of ridge portions 692 overlapping each other.

The distance between the 2 dots at the farthest distance in each bump 692 may be 1 μm or more and 200 μm or less (about 50 μm in this embodiment example). The plurality of ridge portions 692 are formed by overlapping laser irradiation positions adjacent to each other in a range of 50% to 70%.

Fig. 84C is a diagram showing an example of the 4 th mode for the raised part group 693.

As shown in fig. 84C, the group 693 of raised portions may include linear raised portions 692 extending in the 2 nd direction Y and recessed in the 1 st direction X in a plan view. The bump 692 may also have a protruding portion protruding in the 1 st direction X. The ridge portion 692 may be formed by a plurality of ridge portions 692 overlapping each other.

The distance between the 2 dots at the farthest distance in the bump 692 may be 1 μm or more and 200 μm or less (50 μm or so in this embodiment example). The plurality of ridge portions 692 are formed by overlapping laser irradiation positions adjacent to each other in a range of 70% to 90%.

Fig. 84D is a diagram showing an example of the 5 th mode for the raised part group 693.

As shown in fig. 84D, the bump group 693 may have a layout in which a bump row including a plurality of bumps 692 arranged at intervals in the 2 nd direction Y is formed at intervals in the 1 st direction X.

The distance between the 2 dots at the farthest distance in the bump 692 may be 1 μm or more and 200 μm or less (about 5 μm in this embodiment example). The plurality of ridge portions 692 are formed by overlapping laser irradiation positions adjacent to each other in a range of 90% or more and less than 100%.

Fig. 85 is a cross-sectional view of a region corresponding to fig. 68, and is a cross-sectional view showing the semiconductor device 691 shown in fig. 83. Fig. 86 is a sectional view of a region corresponding to fig. 69, and is a sectional view showing the semiconductor device 691 shown in fig. 83.

FIG. 87 is an enlarged view of region LXXXVII shown in FIG. 86. Fig. 88 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing the semiconductor device 691 shown in fig. 83. Fig. 85 to 88 show an example of a method for forming the low-resistance electrode layer 632.

Referring to fig. 85 to 88, a group 693 of projections (a plurality of projections 692) and a groove 698 are formed in the SiC semiconductor substrate 421. A modified layer 700 in which a part of SiC of the SiC semiconductor layer 402(SiC semiconductor substrate 421) is modified to have other properties is formed on a surface layer portion of the 2 nd main surface 404 of the SiC semiconductor layer 402. The modified layer 700 is formed by an annealing treatment method for the 2 nd main surface 404 of the SiC semiconductor layer 402.

The modified layer 700 contains Si atoms and C atoms. More specifically, the modified layer 700 has a carbon density lower than that of the region outside the modified layer 700 in the SiC semiconductor layer 402(SiC semiconductor substrate 421).

In addition, the modified layer 700 has a higher silicon density than carbon density. That is, the modified layer 700 includes a Si modified layer in which SiC of the SiC semiconductor layer 402(SiC semiconductor substrate 421) is modified to Si. The Si modification layer may also be a Si amorphous layer.

The modified layer 700 may also contain lattice defects caused by modification of SiC. That is, the modified layer 700 may include lattice defect regions having defect levels introduced by modification of SiC.

In this embodiment, the modified layer 700 is formed in a region along the ridge group 693 in the surface layer portion of the 2 nd main surface 404 of the SiC semiconductor layer 402. Thus, in each of the ridge portion groups 693, the plurality of ridge portions 692 are formed by the modified layer 700.

In this manner, modified layer 700 further extends from set of protrusions 693 toward space 697. That is, the annealing treatment process with respect to the 2 nd main surface 404 of the SiC semiconductor layer 402 spreads to the space 697.

The thickness of the portion of the modified layer 700 along the ridge group 693 is equal to or greater than the thickness of the portion of the modified layer 700 along the space 697 due to the presence of the ridge 692. More specifically, the thickness of the portion along the group of ridges 693 in the modified layer 700 is greater than the thickness of the portion along the space 697 in the modified layer 700.

The thickness of the modified layer 700 may be 1nm or more and 1000nm or less. The thickness Ta of the region of the modified layer 700 where the ridge portion 692 is formed may be 50nm or more and 1000nm or less. The thickness Tb of the modified layer 700 in the region outside the ridge portion 692 may be 1nm or more and 300nm or less.

The thickness Ta may be 50nm or more and 100nm or less. The thickness Ta may be 100nm or more and 150nm or less. The thickness Ta may be 150nm or more and 200nm or less. The thickness Ta may be 200nm or more and 250nm or less.

The thickness Ta may be 250nm or more and 300nm or less. The thickness Ta may be 300nm or more and 350nm or less. The thickness Ta may be 350nm or more and 400nm or less. The thickness Ta may be 400nm or more and 450nm or less. The thickness Ta may be 450nm or more and 500nm or less.

The thickness Ta may be 500nm or more and 600nm or less. The thickness Ta may be 600nm or more and 700nm or less. The thickness Ta may be 700nm to 800 nm. The thickness Ta may be 800nm or more and 900nm or less. The thickness Ta may be 900nm or more and 1000nm or less.

The thickness Tb may be 1nm to 10 nm. The thickness Tb may be 10nm to 50 nm. The thickness Tb may be 50nm or more and 100nm or less.

The thickness Tb may be 100nm to 150 nm. The thickness Tb may be 150nm to 200 nm. The thickness Tb may be 200nm to 250 nm. The thickness Tb may be 250nm to 300 nm.

The thickness Tb may be 1/2 or less, 1/3 or less, 1/4 or less, 1/5 or less, 1/6 or less, 1/7 or less, 1/8 or less, 1/9 or less, 1/10 or less, 1/11 or less, 1/12 or less, 1/13 or less, 1/14 or less, 1/15 or less, 1/16 or less, 1/17 or less, 1/18 or less, 1/19 or less, or 1/20 or less of the thickness Ta.

The resistance value of the 2 nd main surface 404 in the case where the protrusion group 693 is not present on the 2 nd main surface 404 of the SiC semiconductor layer 402 is larger than the resistance value of the 2 nd main surface 404 in the case where the protrusion group 693 is present on the 2 nd main surface 404 of the SiC semiconductor layer 402.

That is, as the electrical characteristics, the plurality of ridge portion groups 693 have a resistance value equal to or less than the resistance value of the SiC single crystal alone. More specifically, the plurality of bump groups 693 have a resistance value smaller than that of the SiC single crystal.

The plurality of protrusion groups 693 have a resistance value equal to or lower than the resistance value of the space 697. More specifically, the plurality of bump groups 693 have a resistance value smaller than that of the space 697.

The resistance value of the ridge group 693 is reduced by the modified layer 700. That is, the resistance value of the ridge group 693 is equal to or lower than the resistance value of the SiC single crystal due to the modified layer 700 in which the properties of SiC are modified. In addition, the resistance value of the space 697 is also reduced by the modified layer 700.

In this embodiment, the drain pad 423 is directly connected to the 2 nd main surface 404 of the SiC semiconductor layer 402. The drain pad 423 covers the ridge group 693 on the 2 nd main surface 404 of the SiC semiconductor layer 402. Drain pad 423 collectively covers the plurality of bump groups 693.

The drain pad 423 is formed in a film shape in conformity with the outer surface of the bump group 693 (the outer surfaces of the plurality of bumps 692) and the inner surface of the groove 698. Thus, the portion of the outer surface of the drain pad 423 covering the group of raised portions 693 (the plurality of raised portions 692) is formed with a raised portion 423a raised in a direction away from the 2 nd main surface 404. In addition, a recessed portion 423b recessed toward the 2 nd main surface 404 is formed in a portion of the outer surface of the drain pad 423 covering the groove 698.

The drain pad 423 forms ohmic contact with the 2 nd main surface 404 of the SiC semiconductor layer 402. More specifically, the drain pad 423 forms ohmic contact with the bump group 693.

More specifically, the drain pad 423 forms ohmic contact with the plurality of bump groups 693. In this embodiment, the drain pad 423 also forms ohmic contact with the space 697.

The drain pad 423 has a laminated structure including a plurality of electrode layers laminated on the 2 nd main surface 404 of the SiC semiconductor layer 402. In this embodiment, the drain pad 423 has a four-layer structure including a Ti layer 701, a Ni layer 702, an Au layer 703, and an Ag layer 704 stacked in this order from the 2 nd main surface 404 of the SiC semiconductor layer 402.

The Ti layer 701, the Ni layer 702, the Au layer 703, and the Ag layer 704 are formed in film shapes in conformity with the outer surfaces of the bump group 693 (the outer surfaces of the plurality of bumps 692) and the inner surfaces of the grooves 698. The raised portion 423a and the recessed portion 423b of the drain pad 423 are formed on the outer surface of the Ag layer 704.

The Ti layer 701 is directly connected to the 2 nd main surface 404 of the SiC semiconductor layer 402. The Ti layer 701 collectively covers the plurality of ridge groups 693, and forms ohmic contact with the 2 nd main surface 404 of the SiC semiconductor layer 402. In this manner, the Ti layer 701 also forms an ohmic contact with the space 697.

The Ni layer 702 covers substantially the entire region or the entire region of the Ti layer 701. The Au layer 703 coats substantially the entire region or the entire region of the Ni layer 702. The Ag layer 704 covers substantially the entire area or the entire area of the Au layer 703.

The thickness of the Ti layer 701 may be 0.01 μm or more and 5 μm or less (for example, about 0.07 μm). The thickness of the Ni layer 702 may be 0.1 μm or more and 40 μm or less (for example, about 1.2 μm).

The thickness of the Au layer 703 may be 0.1 μm or more and 40 μm or less (e.g., about 0.07 μm). The thickness of the Ag layer 704 may be 0.1 μm or more and 40 μm or less (e.g., about 0.3 μm). Of course, the drain pad 423 may have a single-layer structure including the Ti layer 701, the Ni layer 702, the Au layer 703, or the Ag layer 704.

The drain pad 423 forms ohmic contact with the 2 nd main surface 404 of the SiC semiconductor layer 402 not via the silicide layer containing silicide as a main component. The drain pad 423 forms ohmic contact with each bump group 693 not via the silicide layer containing silicide as a main component.

The drain pad 423 forms ohmic contact with the 2 nd main surface 404 of the SiC semiconductor layer 402 not via a carbon layer containing carbon as a main component. The drain pad 423 forms ohmic contact with each bump group 693 without passing through a carbon layer containing carbon as a main component.

The drain pad 423 does not include a region where the main component silicide-containing material is formed in a layered shape. In addition, the drain pad 423 does not include a region in which a material whose main component contains carbon is formed in a layered shape.

The semiconductor device 691 is manufactured by adding the step of fig. 42 (fig. 43A to 43I) to the steps of fig. 65A to 65Z (fig. 66A to 66Z).

As described above, the semiconductor device 691 can provide the same effects as those described for the semiconductor device 401. In the semiconductor device 691, the connection area of the drain pad 423 with respect to the 2 nd main surface 404 of the SiC semiconductor layer 402 can be increased by the group of raised portions 693. This can improve the electrical characteristics.

More specifically, the drain pad 423 forms ohmic contact with the bump group 693. This can provide favorable ohmic characteristics between the SiC semiconductor layer 402 and the drain pad 423, and thus can improve electrical characteristics.

In addition, according to the semiconductor device 691, the drain pad 423 is directly connected to the 2 nd main surface 404 of the SiC semiconductor layer 402. More specifically, the drain pad 423 forms ohmic contact with the bump group 693 not via the carbon layer. In addition, the drain pad 423 forms ohmic contact with the bump group 693 not via a silicide layer.

The carbon layer and the silicide layer are likely to be peeling starting points. Therefore, due to the structure in which the drain pad 423 is directly connected to the 2 nd main surface 404 of the SiC semiconductor layer 402, an increase in the resistance value due to a connection failure or a connection failure can be appropriately suppressed.

In the embodiment of the semiconductor device 691, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 30 th embodiments. The mode of the semiconductor device 691 is not limited to this embodiment. The embodiment of the semiconductor device 691 can be applied to all the embodiments disclosed in this specification.

Fig. 89 is a bottom view corresponding to fig. 83, and is a bottom view showing a semiconductor device 705 according to embodiment 23 of the present invention. Hereinafter, structures corresponding to the structures described for the semiconductor device 691 are denoted by the same reference numerals, and description thereof is omitted.

Referring to fig. 89, semiconductor device 705 has a plurality of bump groups 693 including a1 st bump group 693A and a2 nd bump group 693B.

The 1 st bump group 693A includes a plurality of 1 st bumps 692A formed on the 2 nd main surface 404 of the SiC semiconductor layer 402. The plurality of 1 st raised portions 692A are portions raised in the 2 nd main surface 404 of the SiC semiconductor layer 402 in the direction of the normal to the 2 nd main surface 404 of the SiC semiconductor layer 402.

The plurality of 1 st bump portions 692A are formed at intervals from each other in the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 1 st bump portion 692A has a1 st portion 694A, and the 1 st portion 694A is a portion where several 1 st bump portions 692A of the plurality of 1 st bump portions 692A overlap in the 1 st direction X when viewed from the 1 st direction as viewed from the 1 st direction X.

The 1 st bump 692A has a2 nd portion 695A, and the 2 nd portion 695A is a portion in which several 1 st bump 692A of the plurality of 1 st bumps 692A are formed apart from the 1 st portion 694A and overlap in the 1 st direction X when viewed in the 1 st direction.

The plurality of 1 st bump portions 692A are continuously formed in the 1 st direction X. More specifically, the 1 st raised portions 692A have a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of 1 st bump portions 692A maintain the distribution pattern and are continuously formed in the 1 st direction X. In this embodiment, the distribution pattern of the plurality of 1 st bump portions 692A is formed from the peripheral edge on the side of one side surface 405A to the peripheral edge on the side of the other side surface 405C of the SiC semiconductor layer 402 in a plan view.

The 1 st bump group 693A has a layout in which a plurality of bumps 692 overlap in the 1 st direction X when viewed from the 1 st direction X. Thus, the 1 st protrusion group 693A forms the 1 st protrusion group region 696A extending in a band-like manner in the 1 st direction X by the collective pattern of the plurality of protrusions 692 continuously distributed in the 1 st direction X.

In other words, the 1 st ridge group region 696A includes a plurality of 1 st ridges 692A (1 st ridge group 693A) formed in a band-shaped region extending in the 1 st direction X in the 2 nd main surface 404 of the SiC semiconductor layer 402.

The 2 nd bump group 693B includes a plurality of 2 nd bump portions 692B formed on the 2 nd main surface 404 of the SiC semiconductor layer 402. The plurality of 2 nd raised portions 692B are portions raised in the 2 nd main surface 404 of the SiC semiconductor layer 402 in the direction of the normal to the 2 nd main surface 404 of the SiC semiconductor layer 402.

The plurality of 2 nd raised parts 692B are formed at intervals from each other in the 1 st direction X and the 2 nd direction Y intersecting the 1 st direction X. The 2 nd bump portion group 693B has a1 st portion 694B, and the 1 st portion 694B is a portion where the 2 nd bump portions 692B of several of the plurality of 2 nd bump portions 692B overlap in the 2 nd direction Y when viewed from the 2 nd direction Y.

The 2 nd bump group 693B has a2 nd portion 695B, and the 2 nd portion 695B is a portion in which several 2 nd bump portions 692B of the plurality of 2 nd bump portions 692B are formed apart from the 1 st portion 694B and overlap in the 2 nd direction Y when viewed in the 2 nd direction.

The plurality of 2 nd swelling portions 692B are continuously formed in the 2 nd direction Y. More specifically, the plurality of 2 nd bump portions 692B have a distribution pattern that is distributed at intervals in the 1 st direction X and the 2 nd direction Y.

The plurality of 2 nd bump portions 692B maintain the distribution pattern, and are continuously formed in the 2 nd direction Y. In this embodiment, the distribution pattern of the plurality of 2 nd ridge portions 692B is formed from the peripheral edge on the side of one side surface 405B to the peripheral edge on the side of the other side surface 405D of the SiC semiconductor layer 402 in a plan view.

The 2 nd bump group 693B has a layout in which a plurality of 2 nd bumps 692B overlap in the 2 nd direction Y when viewed from the 2 nd direction Y. Thus, the 2 nd ridge group 693B forms the 2 nd ridge group region 696B extending in a band-like manner in the 2 nd direction Y by the collective pattern of the plurality of 2 nd ridges 692B distributed continuously in the 2 nd direction Y.

In other words, the 2 nd protrusion group region 696B includes a plurality of 2 nd protrusions 692B (the 2 nd protrusion group 693B) formed in a band-shaped region extending in the 1 st direction X in the 2 nd main surface 404 of the SiC semiconductor layer 402.

Group 2 of protuberances 693B (group 2 protuberances region 696B) traverses group 1 of protuberances 693A (group 1 protuberances region 696A). Thus, intersection region 706 where 1 st protruding portion group 693A (1 st protruding portion group region 696A) and 2 nd protruding portion group 693B (2 nd protruding portion group region 696B) intersect with each other is formed on 2 nd main surface 404 of SiC semiconductor layer 402.

In this embodiment, a plurality of 1 st bump groups 693A are formed on the 2 nd main surface 404 of the SiC semiconductor layer 402 with a space in the 2 nd direction Y. That is, the distribution pattern of the plurality of 1 st bump portions 692A is intermittently formed with respect to the 2 nd direction Y.

In this embodiment, a plurality of the 2 nd protrusion group 693B are formed on the 2 nd main surface 404 of the SiC semiconductor layer 402 at intervals in the 1 st direction X. That is, the distribution pattern of the plurality of 2 nd swelling portions 692B is formed intermittently with respect to the 1 st direction X.

Therefore, in this embodiment, the intersection regions 706 are formed in a row-and-column arrangement with a space therebetween in the 1 st direction X and the 2 nd direction Y. A space 697 is defined by the 1 st raised part group 693A and the 2 nd raised part group 693B. The spaces 697 are formed in a row-and-column arrangement with a space therebetween in the 1 st direction X and the 2 nd direction Y.

In the intersection region 706, the plurality of 1 st rising portions 692A and the plurality of 2 nd rising portions 692B may overlap with each other. The thickness of the plurality of 1 st bump portions 692A and the plurality of 2 nd bump portions 692B formed in the intersection region 706 may be larger than the thickness of the 1 st bump portions 692A and the 2 nd bump portions 692B formed in regions other than the intersection region 706.

The number of the plurality of 1 st swelling portions 692A and the plurality of 2 nd swelling portions 692B formed in the intersection region 706 may be larger than the number of the 1 st swelling portions 692A and the 2 nd swelling portions 692B formed in the region other than the intersection region 706.

The 1 st direction X may be set to the [ 11-20 ] direction, and the 2 nd direction Y may be set to the [ 1-100 ] direction. That is, the 1 st bump group 693A (the 1 st bump group region 696A) may be formed substantially parallel or parallel to the [ 11-20 ] direction, and the 2 nd bump group 693B (the 2 nd bump group region 696B) may be formed substantially parallel or parallel to the [ 1-100 ] direction.

The 1 st direction X may be set to the [ 1-100 ] direction, and the 2 nd direction Y may be set to the [ 11-20 ] direction. That is, group 1 of protrusions 693A (group 1 of protrusions region 696A) may be formed substantially parallel or parallel to the [ 1-100 ] direction, and group 2 of protrusions 693B (group 2 of protrusions region 696B) may be formed substantially parallel or parallel to the [ 11-20 ] direction.

The 1 st raised part 692A and the 1 st raised part group 693A correspond to the raised parts 692 and the raised part group 693 of the 31 st embodiment. The explanation of the swelling portion 692 and the swelling portion group 693 according to embodiment 31 is applied to the explanation of the 1 st swelling portion 692A and the 1 st swelling portion group 693A, and other specific explanations of the 1 st swelling portion 692A and the 1 st swelling portion group 693A are omitted.

The 2 nd raised parts 692B and the 2 nd raised part group 693B correspond to the raised parts 692 and the raised part group 693 of the 31 nd embodiment. The explanation of the swelling portion 692 and the swelling portion group 693 according to embodiment 31 is applied to other explanations of the 2 nd swelling portion 692B and the 2 nd swelling portion group 693B, and other explanations of the 2 nd swelling portion 692B and the 2 nd swelling portion group 693B are omitted.

In this embodiment, the drain pad 423 covers the 1 st protrusion group 693A and the 2 nd protrusion group 693B on the 2 nd main surface 404 of the SiC semiconductor layer 402. In this embodiment, the drain pad 423 collectively covers the plurality of 1 st bump groups 693A and the plurality of 2 nd bump groups 693B.

Drain pad 423 is formed in a film shape in conformity with the outer surface of 1 st bump group 693A (the outer surface of 1 st bump 692A), the outer surface of 2 nd bump group 693B (the outer surface of 2 nd bump 692B), and the inner surface of groove 698.

Thus, although not shown, the raised portions 423A are formed in the outer surface of the drain pad 423 in the portion covering the 1 st raised portion group 693A (1 st raised portion 692A) and the 2 nd raised portion group 693B (2 nd raised portion 692B). In addition, a recess 423b is formed in a portion of the outer surface of the drain pad 423 covering the groove 698.

The drain pad 423 forms ohmic contact with the 2 nd main surface 404 of the SiC semiconductor layer 402. More specifically, drain pad 423 forms ohmic contact with group 1 bump 693A and group 2 bump 693B.

More specifically, the drain pad 423 forms ohmic contact with the plurality of 1 st bump groups 693A and the plurality of 2 nd bump groups 693B. In this embodiment, the drain pad 423 also forms ohmic contact with the space 697.

A portion of drain pad 423 covering first raised part group 693A and second raised part group 693B is engaged with a concave-convex portion defined by a plurality of first raised part groups 693A, a plurality of second raised part groups 693B, and a plurality of grooves 698.

That is, the contact area of the drain pad 423 with respect to the 2 nd main surface 404 of the SiC semiconductor layer 402 increases by the plurality of 1 st bump groups 693A, the plurality of 2 nd bump groups 693B, and the plurality of grooves 698. This improves the adhesion of the drain pad 423 to the 2 nd main surface 404 of the SiC semiconductor layer 402.

The semiconductor device 705 having such a structure is manufactured by performing the following steps in the above-described laser annealing step (step S3 in fig. 42).

First, a plurality of 1 st bump groups 693A are formed in a direction substantially parallel or parallel to the orientation flat 335 by a laser annealing treatment method. Next, a plurality of 2 nd bump groups 693B are formed in a direction intersecting (orthogonal to) the orientation flat 335 by a laser annealing treatment method.

In this step, a plurality of 1 st bump groups 693A may be formed in a direction intersecting with (orthogonal to) the orientation flat 335, or a plurality of 2 nd bump groups 693B may be formed in a direction substantially parallel or parallel to the orientation flat 335. Then, the semiconductor device 705 is manufactured through the steps from step S4 to step S9 in fig. 42.

Group 1 of protrusions 693A and group 2 of protrusions 693B may be formed in any order. Therefore, a plurality of 1 st bump groups 693A may also be formed after a plurality of 2 nd bump groups 693B are formed. In addition, the plurality of 1 st swelling part groups 693A and the plurality of 2 nd swelling part groups 693B may be alternately formed.

As described above, the semiconductor device 705 can also provide the same effects as those described for the semiconductor device 691.

Fig. 90 is a cross-sectional view corresponding to fig. 86, and is a cross-sectional view showing a semiconductor device 711 according to embodiment 33 of the present invention. Fig. 91 is an enlarged view of the region XCI shown in fig. 90. Hereinafter, structures corresponding to the structures described for the semiconductor device 691 are denoted by the same reference numerals, and description thereof is omitted.

In the semiconductor device 711, the drain pad 423 has a three-layer structure including a Ni layer 702, an Au layer 703, and an Ag layer 704 stacked in this order from the 2 nd main surface 404 of the SiC semiconductor layer 402. That is, the drain pad 423 is formed by omitting the formation process of the Ti layer 701 in step S9 of fig. 42.

Ni layer 702 is directly connected to 2 nd main surface 404 of SiC semiconductor layer 402. Ni layer 702 collectively covers a plurality of bump groups 693.

Ni layer 702 forms ohmic contacts with set of ridges 693 and with spaces 697. The Au layer 703 coats substantially the entire region or the entire region of the Ni layer 702. The Ag layer 704 covers substantially the entire area or the entire area of the Au layer 703.

As described above, the semiconductor device 711 can also provide the same effects as those described for the semiconductor device 691. In the semiconductor device 711, the drain pad 423 may have a single-layer structure formed of the Ni layer 702.

Of the semiconductor device 711, it goes without saying that the various embodiments described above can be applied to embodiments 26 to 31. The mode of the semiconductor device 711 is not limited to this embodiment. The mode of the semiconductor device 711 can be applied to all the embodiments disclosed in this specification.

Fig. 92 is a cross-sectional view corresponding to fig. 86, and is a cross-sectional view showing a semiconductor device 721 according to embodiment 34 of the present invention. Fig. 93 is an enlarged view of the region XCIII shown in fig. 92. Hereinafter, structures corresponding to the structures described for the semiconductor device 691 are denoted by the same reference numerals, and description thereof is omitted.

In the semiconductor device 721, the drain pad 423 includes a metal layer 341, an Au layer 703, and an Ag layer 704. In this embodiment, the metal layer 341 has a laminated structure including a carbon layer 342, an NiSi layer 343, and an Ni layer 344 laminated in this order from the 2 nd main surface 404 side of the SiC semiconductor layer 402.

The metal layer 341 is connected to the 2 nd main surface 404 of the SiC semiconductor layer 402. The metal layer 341 collectively covers the plurality of bump groups 693.

The metal layer 341 forms ohmic contacts with the set of ridges 693 and with the space 697. The Au layer 703 covers substantially the entire region or the entire region of the metal layer 341. The Ag layer 704 covers substantially the entire area or the entire area of the Au layer 703.

The semiconductor device 721 is formed by omitting the step of removing the metal layer 341 in steps S4 to S8 shown in fig. 42. In the semiconductor device 721, in step S9 in fig. 42, the Au layer 703 and the Ag layer 704 are formed on the metal layer 341.

As described above, according to the semiconductor device 721, the drain pad 423 includes the carbon layer 342 and the NiSi layer 343. According to the semiconductor device 721, the connection strength of the drain pad 423 cannot be improved as in the semiconductor device 691, but substantially the same effect as that described for the semiconductor device 691 can be obtained. In the semiconductor device 721, the drain pad 423 may be formed only of the metal layer 341.

In the embodiment of the semiconductor device 721, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 33 rd embodiments. The mode of the semiconductor device 721 is not limited to this embodiment. The mode of the semiconductor device 721 can be applied to all embodiments disclosed in this specification.

Fig. 94 is a sectional view of a region corresponding to fig. 55, and is a sectional view showing a semiconductor device 731 according to embodiment 35 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 94, in this embodiment, a groove 732 is formed along the active region 406 in the outer region 407 and on the 1 st main surface 403 of the SiC semiconductor layer 402. The groove 732 is formed by digging the 1 st main surface 403 of the SiC semiconductor layer 402 toward the 2 nd main surface 404.

The groove 732 is formed in a stripe shape extending along the active region 406 in a plan view. In this embodiment, groove 732 is formed in an unbroken dot shape (a quadrangular ring shape) surrounding active region 406 in a plan view.

The slot 732 includes an inner wall 733, an outer wall 734, and a bottom wall 735. The inner wall 733 of the groove 732 is located on the active region 406 side. Outer wall 734 of groove 732 is located on side surfaces 405A to 405D of SiC semiconductor layer 402. Connecting the inner wall 733 and the outer wall 734. An inner wall 733 of the slot 732 forms an active sidewall 464.

Bottom wall 735 of groove 732 corresponds to outer major surface 462. Bottom wall 735 of groove 732 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of gate trench 431. The groove 732 may be formed at a depth substantially equal to that of the source trench 441. That is, the bottom wall 735 of the groove 732 may also be located on substantially the same plane as the bottom wall of the source trench 441.

The distance between bottom wall 735 of groove 732 and 2 nd main surface 404 of SiC semiconductor layer 402 may be substantially equal to the distance between the bottom wall of source trench 441 and 2 nd main surface 404 of SiC semiconductor layer 402.

Bottom wall 735 of groove 732 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom wall of source trench 441. Bottom wall 735 of groove 732 may be located on the 2 nd main surface 404 side of SiC semiconductor layer 402 in a range of 0 μm to 1 μm with respect to the bottom wall of source trench 441.

SiC epitaxial layer 422 is exposed from bottom wall 735 of trench 732. More specifically, high concentration regions 422a of SiC epitaxial layer 422 are exposed from bottom wall 735 of trench 732. That is, bottom wall 735 of trench 732 faces low concentration region 422b of SiC epitaxial layer 422 through high concentration region 422a of SiC epitaxial layer 422.

Thus, the groove 732 divides the active land 463 from the outer region 407. An outer mesa 736 projecting upward from the bottom wall 735 of the groove 732 is defined at the peripheral edge of the outer region 407.

Outer mesa 736 is defined by groove 732 and side surfaces 405A to 405D of SiC semiconductor layer 402. In a manner that the groove 732 is formed in a dot-like shape (a rectangular ring shape), the outer mesa 736 is formed in a dot-like shape (a rectangular ring shape) surrounding the groove 732 in a plan view.

Outer mesa 736 includes mesa major surface 737. Mesa major surface 737 is located on substantially the same plane as active major surface 461 of active region 406. Mesa major surface 737 extends parallel to bottom wall 735 of groove 732.

In this embodiment, a p-type impurity region 738 is formed in a surface layer portion of the mesa main surface 737 of the outer mesa 736. The p-type impurity region 738 is electrically floating. The p-type impurity region 738 may have a p-type impurity concentration substantially equal to that of the body region 426.

In this embodiment, an n-type impurity region 739 is formed in a surface layer portion of the p-type impurity region 738 in the outer mesa 736. The n-type impurity region 739 is electrically floating. n-type impurity region 739 may have an n-type impurity concentration substantially equal to the n-type impurity concentration of source region 453.

The diode region 471, the outer deep well region 472, and the field confining structure 473 are formed along the bottom wall 735 of the groove 732, and are substantially the same as the structure of the semiconductor device 401 except for this point.

The outer insulating layer 481 is formed in a film shape along the inner wall of the groove 732 and the mesa main surface 737 of the outer mesa 736. In the groove 732, an outer-wall side wall 740 is formed in addition to the side wall 482.

The outer-wall side wall 740 has substantially the same structure as the side wall 482 except that it covers the outer wall 734 of the groove 732. The description or examples of the active side wall 464 and the description or examples of the side wall 482 are applied to the outer wall 734 and the outer wall side wall 740 of the groove 732.

In this embodiment, an anchor structure for improving the connection strength of the resin layer 416 is formed on the terrace main surface 737 of the outer terrace 736. The anchor structure includes a concave-convex structure formed in a portion of the interlayer insulating layer 491 which covers the mesa main surface 737 of the outer mesa 736. The concave-convex structure has anchor holes 495 formed in the interlayer insulating layer 491.

The resin layer 416 engages the anchor hole 495. In this manner, resin layer 416 engages anchor holes 495 via passivation layer 503. This can increase the bonding strength of the resin layer 416 to the 1 st main surface 403 of the SiC semiconductor layer 402, and therefore peeling of the resin layer 416 can be appropriately suppressed.

The passivation layer 503 is in contact with a mesa main surface 737 of the outer mesa 736 at the anchor holes 495. Of course, the anchoring structure of the resin layer 416 may be formed on the bottom wall 735 of the groove 732.

As described above, the semiconductor device 731 can also provide the same effects as those described for the semiconductor device 401.

Of the semiconductor device 731, it goes without saying that the above-described various embodiments can be applied to embodiments 26 to 34. The mode of the semiconductor device 731 is not limited to this embodiment. The mode of the semiconductor device 731 can be applied to all embodiments disclosed in this specification.

Fig. 95 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 751 according to embodiment 36 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 95, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

In this embodiment, the distance between outer main surface 462 and the bottom of diode region 471 is substantially equal to the distance between the bottom wall of source trench 441 and the bottom of contact region 454.

In this embodiment, the distance between the outer main surface 462 and the bottom of the outer deep well region 472 is substantially equal to the distance between the bottom wall of the source trench 441 and the bottom of the deep well region 455.

In this embodiment, the distance between outer main surface 462 and the bottom of field confining structure 473 is substantially equal to the distance between outer main surface 462 and the bottom of outer deep well region 472.

As described above, the semiconductor device 751 can also provide the same effects as those described for the semiconductor device 401.

Of the semiconductor device 751, it goes without saying that the various embodiments described above can be applied to the 26 th to 35 th embodiments. The mode of the semiconductor device 751 is not limited to this embodiment. The mode of the semiconductor device 751 can be applied to all embodiments disclosed in this specification.

Fig. 96 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 752 according to embodiment 37 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 96, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

In this embodiment, the distance between outer main surface 462 and the bottom of diode region 471 is substantially equal to the distance between the bottom wall of source trench 441 and the bottom of contact region 454.

In this embodiment, the distance between the outer main surface 462 and the bottom of the outer deep well region 472 is substantially equal to the distance between the bottom wall of the source trench 441 and the bottom of the deep well region 455.

In this embodiment, the outer deep well region 472 extends from the outer region 407 toward the active region 406 and is connected to the body region 426. In this embodiment, the bottom of outer deep well region 472 is formed in a region on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom of body region 426.

The bottom of outer deep well region 472 may also be at the same depth as the bottom of body region 426. In this case, the outer deep well region 472 may be formed integrally with the body region 426. A portion of the body region 426 may also be utilized to form the outer deep well region 472.

In this case, when gate trench 431 is located at the outermost periphery, the boundary between active region 406 and outer region 407 is a region between gate trench 431 and diode region 471 at the outermost periphery.

When source trench 441 is located at the outermost periphery, the boundary between active region 406 and outer region 407 is a region between outermost source trench 441 and diode region 471.

In this embodiment, the distance between outer main surface 462 and the bottom of field confining structure 473 is substantially equal to the distance between outer main surface 462 and the bottom of outer deep well region 472.

As described above, the semiconductor device 752 can also provide the same effects as those described for the semiconductor device 401.

Of the embodiments of the semiconductor device 752, it goes without saying that the various embodiments described above can be applied to the 26 th to 36 th embodiments. The mode of the semiconductor device 752 is not limited to this embodiment. The mode of the semiconductor device 752 can be applied to all the embodiments disclosed in this specification.

Fig. 97 is a cross-sectional view of an area corresponding to fig. 55, and is a cross-sectional view showing a semiconductor device 761 according to embodiment 38 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 97, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

The bottom of the diode region 471 may also be formed at a depth substantially equal to the bottom of the contact region 454. That is, the bottom of the diode region 471 may also be located on the same plane as the bottom of the contact region 454.

The bottom of the outer deep well region 472 may be formed at a depth substantially equal to the bottom of the deep well region 455. That is, the bottom of the outer deep well region 472 may also be located on the same plane as the bottom of the deep well region 455.

The bottom of the field confining structure 473 may also be formed at a depth substantially equal to the bottom of the outer deep well region 472. That is, the bottom of the field confining structure 473 may also lie in the same plane as the bottom of the outer deep well region 472.

As described above, according to the semiconductor device 761, the same effects as those described for the semiconductor device 401 can be obtained.

In the embodiment of the semiconductor device 761, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 37 th embodiments. In addition, the mode of the semiconductor device 761 is not limited to this embodiment. The mode of the semiconductor device 761 can be applied to all the embodiments disclosed in this specification.

Fig. 98 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 762 according to embodiment 39 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 98, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

The bottom of the diode region 471 may also be formed at a depth substantially equal to the bottom of the contact region 454. That is, the bottom of the diode region 471 may also be located on the same plane as the bottom of the contact region 454.

In this manner, the outer deep well region 472 is connected to the body region 426. More specifically, the outer deep well region 472 is formed to penetrate the body region 426.

The bottom of outer deep well region 472 is formed in a region on the 2 nd main surface 404 side of SiC semiconductor layer 402 with respect to the bottom of body region 426. In this embodiment, the boundary between the active region 406 and the outer region 407 is set to the boundary between the outer deep well region 472 and the body region 426.

The bottom of the outer deep well region 472 may be formed at a depth substantially equal to the bottom of the deep well region 455. That is, the bottom of the outer deep well region 472 may also be located on the same plane as the bottom of the deep well region 455.

The bottom of the field confining structure 473 may also be formed at a depth substantially equal to the bottom of the outer deep well region 472. That is, the bottom of the field confining structure 473 may also lie in the same plane as the bottom of the outer deep well region 472.

As described above, the semiconductor device 762 can also provide the same effects as those described for the semiconductor device 401.

Of the embodiments of the semiconductor device 762, it goes without saying that the various embodiments described above can be applied to embodiments 26 to 38. The mode of the semiconductor device 762 is not limited to this embodiment. The mode of the semiconductor device 762 can be applied to all the embodiments disclosed in this specification.

Fig. 99 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 771 according to embodiment 40 of the present invention. Hereinafter, the structure described for the semiconductor device 401 will be denoted by the same reference numerals and will not be described.

Referring to fig. 99, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

A trench diode structure 772 is formed in the outer region 407. Trench diode construction 772 includes diode trench 773, diode insulating layer 774, and diode electrode layer 775.

Diode trench 773 is formed in outer region 407 between active sidewall 464 and side surfaces 405A to 405D of SiC semiconductor layer 402. Diode trench 773 is formed spaced apart from active sidewall 464 and sides 405A-405D.

The diode trench 773 extends in a stripe shape along the active region 406 in a plan view. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view.

The bottom wall of diode trench 773 is located within SiC epitaxial layer 422. More specifically, the bottom wall of the diode trench 773 is located at the high concentration region 422 a.

The diode trench 773 is formed at a depth position substantially equal to that of the source trench 441. More specifically, the bottom wall of the diode trench 773 is located on substantially the same plane as the bottom wall of the source trench 441.

The diode insulating layer 774 and the diode electrode layer 775 are formed in the diode trench 773 in the same material type and the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. Diode insulating layer 774 is connected to outer insulating layer 481 outside diode trench 773 (outer major face 462).

A diode region 471 and an outer deep well region 472 are formed in a region of the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402 along the inner wall of the diode trench 773.

The diode region 471 extends in a band shape along the diode trench 773 in a plan view. In this embodiment, the diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding the active region 406 in a plan view. In this manner, diode region 471 is formed along diode trench 773 in the same manner as contact region 454.

The outer deep well region 472 extends in a stripe shape along the diode trench 773. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view. In this manner, the outer deep well region 472 is formed along the diode trench 773 in the same manner as the deep well region 455.

The trench diode structure 772, the diode region 471, and the outer deep well region 472 are formed through a common process with the trench source structure 452, the contact region 454, and the deep well region 455.

Instead of the field limiting structure 473, a trench field limiting structure 776 is formed in the outer region 407. The trench field confining structure 776 is formed in an area opposite the active area 406 with respect to the trench diode structure 772. That is, trench field confining structure 776 is formed in a region on the side of side surfaces 405A to 405D of SiC semiconductor layer 402 with respect to trench diode structure 772.

Trench field-confining structure 776 includes one or more (in this case 4) field-confining trenches 777 formed in outer major face 462. A plurality of field limiting trenches 777 are formed with a space in a direction away from the active region 406.

The plurality of field limiting trenches 777 extend in a stripe shape along the periphery of the active region 406 in a plan view. More specifically, each of the plurality of field limiting trenches 777 is formed in a dotted shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

Each field limiting trench 777 may also be formed at a depth position substantially equal to that of the source trench 441. That is, the bottom wall of each field limiting trench 777 may also be located on substantially the same plane as the bottom wall of the source trench 441.

A field limiting insulating layer 778 and a field limiting conductive layer 779 are buried in each field limiting trench 777. The field limiting insulating layer 778 and the field limiting conductive layer 779 are formed in the field limiting trench 777 by the same material type and the same method as those of the gate insulating layer 434 and the gate electrode layer 435, respectively. A field limiting insulating layer 778 is connected to outer insulating layer 481 outside field limiting trench 777 (outer major face 462).

Trench field confining structure 776 includes a plurality of field confining regions 780A, 780B, 780C, 780D formed in a surface layer portion of outer major surface 462. The plurality of field confining regions 780A-780D are formed in a one-to-one correspondence with the plurality of field confining trenches 777.

The field confining regions 780A-780D are formed along the sidewalls and bottom walls of the corresponding field confining trenches 777. The field confining regions 780A-780D may also be formed at substantially the same depth as the outer deep well region 472. That is, the bottom of the field confining regions 780A-780D may also be located on the same plane as the bottom of the outer deep well region 472.

A p-type impurity region 782 is formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402 and in each region between the mutually adjacent field confining regions 780A to 780D. The field confining regions 780A to 780D are electrically connected via the impurity region 782.

The bottom of the impurity region 782 is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the field confining regions 780A to 780D. The bottom of the impurity region 782 may also be at the same depth as the bottom of the body region 426. The impurity region 782 may have a p-type impurity concentration equal to that of the body region 426.

In a region of the 1 st main surface 403 of the SiC semiconductor layer 402 along the upper end portion of the diode electrode layer 775, a diode sub-trench 781 communicating with the diode trench 773 is formed. The diode sub-trench 781 forms a part of the sidewall of the diode trench 773.

In this embodiment, the diode sub-trench 781 is formed in a dot shape surrounding the upper end portion of the diode electrode layer 775 in a plan view. That is, the diode sub-trench 781 borders the upper end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed by digging a part of the diode insulating layer 774. More specifically, the diode sub-trench 781 is formed by digging an upper end portion of the diode insulating layer 774 and an upper end portion of the diode electrode layer 775 from the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the diode electrode layer 775 has a shape shrunk from the lower end portion of the diode electrode layer 775. The lower end portion of the diode electrode layer 775 is a portion of the diode electrode layer 775 located on the bottom wall side of the diode trench 773. The 1 st direction width of the upper end portion of the diode electrode layer 775 may be smaller than the 1 st direction width of the lower end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed in a tapered shape having a bottom area smaller than the opening area in cross section. The bottom wall of the diode sub-groove 781 may be formed to be convexly curved toward the 2 nd main surface 404 of the SiC semiconductor layer 402.

The diode region 471, the diode electrode layer 775, and the diode region 471 are exposed from the inner wall of the diode sub-trench 781. At least the diode insulating layer 774 is exposed from the bottom wall of the diode sub-trench 781. An upper end portion of the diode insulating layer 774 is located below the 1 st main surface 403 of the SiC semiconductor layer 402.

The opening edge portion of each diode sub-groove 781 includes an inclined portion inclined downward from the 1 st main surface 403 of the SiC semiconductor layer 402 toward the inside of the diode sub-groove 781. The opening edge portion of the diode sub-groove 781 is a corner portion connecting the 1 st main surface 403 of the SiC semiconductor layer 402 and the sidewall of the diode sub-groove 781. The inclined portion of the diode sub-trench 781 is formed by the diode sub-trench 781.

In this embodiment, the inclined portion of the diode sub-trench 781 is formed in a concave curved shape toward the inside of the SiC semiconductor layer 402. The inclined portion of the diode sub-groove 781 may be formed in a convex curved shape toward the inside of the diode sub-groove 781.

The diode contact hole 494 may also be formed in a stripe shape (more specifically, a dot-free shape) extending along the trench diode construction 772. The diode contact hole 494 exposes the diode electrode layer 775, the diode region 471, and the diode sub-trench 781. An opening edge portion of the diode contact hole 494 is formed in a convex curved shape toward the inside of the diode contact hole 494.

The source pull-back wiring 414 in the main surface source electrode 409 enters the diode contact hole 494 from above the interlayer insulating layer 491. The source pull-back wiring 414 is electrically connected to the diode electrode layer 775 and the diode region 471 in the diode contact hole 494 and the diode sub-trench 781.

As described above, the semiconductor device 771 can also provide the same effects as those described for the semiconductor device 401.

In the embodiment of the semiconductor device 771, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 39 th embodiments. The mode of the semiconductor device 771 is not limited to this embodiment. The embodiment of the semiconductor device 771 can be applied to all the embodiments disclosed in this specification.

Fig. 100 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 783 according to embodiment 41 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 100, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

A trench diode structure 772 is formed in the outer region 407. Trench diode construction 772 includes diode trench 773, diode insulating layer 774, and diode electrode layer 775.

Diode trench 773 is formed in outer region 407 between active sidewall 464 and side surfaces 405A to 405D of SiC semiconductor layer 402. Diode trench 773 is formed spaced apart from active sidewall 464 and sides 405A-405D.

The diode trench 773 extends in a stripe shape along the active region 406 in a plan view. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view.

The bottom wall of diode trench 773 is located within SiC epitaxial layer 422. More specifically, the bottom wall of the diode trench 773 is located at the high concentration region 422 a.

The diode trench 773 is formed at a depth position substantially equal to that of the source trench 441. More specifically, the bottom wall of the diode trench 773 is located on substantially the same plane as the bottom wall of the source trench 441.

The diode insulating layer 774 and the diode electrode layer 775 are formed in the diode trench 773 using the same material type and in the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. Diode insulating layer 774 is connected to outer insulating layer 481 outside diode trench 773 (outer major face 462).

A diode region 471 and an outer deep well region 472 are formed in a region of the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402 along the inner wall of the diode trench 773.

The diode region 471 extends in a band shape along the diode trench 773 in a plan view. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view. In this manner, diode region 471 is formed along diode trench 773 in the same manner as contact region 454.

The outer deep well region 472 extends in a stripe shape along the diode trench 773. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view. In this manner, the outer deep well region 472 is formed along the diode trench 773 in the same manner as the deep well region 455.

The trench diode structure 772, the diode region 471, and the outer deep well region 472 are formed through a common process with the trench source structure 452, the contact region 454, and the deep well region 455.

Instead of the field limiting structures 473, trench field limiting structures 784 are formed in the outer region 407. In this manner, the trench field confining structure 784 is formed in the region on the active region 406 side with respect to the trench diode structure 772. More specifically, trench field confining structures 784 are formed in the region between body region 426 and trench diode structures 772.

Trench field confining structure 784 includes one or more (4 in this embodiment) field confining trenches 785 formed in outer major surface 462.

A plurality of field limiting trenches 785 are formed at intervals in a direction away from the active region 406. The plurality of field limiting trenches 785 extend in stripes along the periphery of the active area 406 in a plan view. More specifically, each of the plurality of field limiting trenches 785 is formed in a dotted shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

Each field limiting trench 785 may also be formed at a depth substantially equal to that of the source trench 441. That is, the bottom wall of each field limiting trench 785 may also lie on substantially the same plane as the bottom wall of the source trench 441.

A field limiting insulating layer 786 and a field limiting conductor layer 787 are embedded in each field limiting trench 785. The field limiting insulating layer 786 and the field limiting conductive layer 787 are formed in the field limiting trench 785 of the same material type and in the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. The field limiting insulating layer 786 is connected to the outer insulating layer 481 outside the field limiting trench 785 (the outer principal face 462).

The trench field confining structure 784 includes a plurality of field confining regions 788A, 788B, 788C, 788D formed in the surface layer portion of the outer main surface 462. The plurality of field limiting regions 788A to 788D are formed in one-to-one correspondence with the plurality of field limiting trenches 785.

The field limiting regions 788A to 788D are formed along the sidewalls and bottom walls of the corresponding field limiting trenches 785. The field limiting regions 788A to 788D are formed at substantially the same depth as the outer deep well region 472. That is, the bottom of the field limiting regions 788A to 788D may also be located on the same plane as the bottom of the outer deep well region 472.

A p-type impurity region 789 is formed in the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402 in each region between the mutually adjacent field limiting regions 788A to 788D. The field limiting regions 788A to 788D are electrically connected via the impurity region 789.

The bottom of the impurity region 789 is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the field limiting regions 788A to 788D. The bottom of the impurity region 789 may also be located at the same depth as the bottom of the body region 426. The impurity region 789 may have a p-type impurity concentration equal to that of the body region 426.

In a region of the 1 st main surface 403 of the SiC semiconductor layer 402 along the upper end portion of the diode electrode layer 775, a diode sub-trench 781 communicating with the diode trench 773 is formed. The diode sub-trench 781 forms a part of the sidewall of the diode trench 773.

In this embodiment, the diode sub-trench 781 is formed in a dot shape surrounding the upper end portion of the diode electrode layer 775 in a plan view. That is, the diode sub-trench 781 borders the upper end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed by digging a part of the diode insulating layer 774. More specifically, the diode sub-trench 781 is formed by digging an upper end portion of the diode insulating layer 774 and an upper end portion of the diode electrode layer 775 from the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the diode electrode layer 775 has a shape shrunk from the lower end portion of the diode electrode layer 775. The lower end portion of the diode electrode layer 775 is a portion of the diode electrode layer 775 located on the bottom wall side of the diode trench 773. The 1 st direction width of the upper end portion of the diode electrode layer 775 may be smaller than the 1 st direction width of the lower end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed in a tapered shape having a bottom area smaller than the opening area in cross section. The bottom wall of the diode sub-groove 781 may be formed to be convexly curved toward the 2 nd main surface 404 of the SiC semiconductor layer 402.

The diode region 471, the diode electrode layer 775, and the diode region 471 are exposed from the inner wall of the diode sub-trench 781. At least the diode insulating layer 774 is exposed from the bottom wall of the diode sub-trench 781. An upper end portion of the diode insulating layer 774 is located below the 1 st main surface 403 of the SiC semiconductor layer 402.

The opening edge portion of each diode sub-groove 781 includes an inclined portion inclined downward from the 1 st main surface 403 of the SiC semiconductor layer 402 toward the inside of the diode sub-groove 781. The opening edge portion of the diode sub-groove 781 is a corner portion connecting the 1 st main surface 403 of the SiC semiconductor layer 402 and the sidewall of the diode sub-groove 781. The inclined portion of the diode sub-trench 781 is formed by the diode sub-trench 781.

In this embodiment, the inclined portion of the diode sub-trench 781 is formed in a concave curved shape toward the inside of the SiC semiconductor layer 402. The inclined portion of the diode sub-groove 781 may be formed in a convex curved shape toward the inside of the diode sub-groove 781.

The diode contact hole 494 may also be formed in a stripe shape (more specifically, a dot-free shape) extending along the trench diode construction 772. The diode contact hole 494 exposes the diode electrode layer 775, the diode region 471, and the diode sub-trench 781. An opening edge portion of the diode contact hole 494 is formed in a convex curved shape toward the inside of the diode contact hole 494.

The source pull-back wiring 414 in the main surface source electrode 409 enters the diode contact hole 494 from above the interlayer insulating layer 491. The source pull-back wiring 414 is electrically connected to the diode electrode layer 775 and the diode region 471 in the diode contact hole 494 and the diode sub-trench 781.

As described above, the semiconductor device 783 can also provide the same effects as those described for the semiconductor device 401.

Of the semiconductor device 783, it goes without saying that the various embodiments described above can be applied to embodiments 26 to 40. The mode of the semiconductor device 783 is not limited to this embodiment. The embodiment of the semiconductor device 783 can be applied to all the embodiments disclosed in this specification.

Fig. 101 is a sectional view of an area corresponding to fig. 55, and is a sectional view showing a semiconductor device 790 according to embodiment 42 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 101, in this embodiment, the active main surface 461 of the active region 406 and the outer main surface 462 of the outer region 407 are formed on the same plane. In this manner, the active region 406 is defined by a body region 426.

That is, the body region 426 is formed by introducing a p-type impurity only to the active region 406. The p-type impurity of the body region 426 may be introduced into the 1 st main surface 403 of the SiC semiconductor layer 402 through an ion implantation mask having an opening that selectively exposes the active region 406.

A trench diode structure 772 is formed in the outer region 407. Trench diode construction 772 includes diode trench 773, diode insulating layer 774, and diode electrode layer 775.

Diode trench 773 is formed in outer region 407 between active sidewall 464 and side surfaces 405A to 405D of SiC semiconductor layer 402. Diode trench 773 is formed spaced apart from active sidewall 464 and sides 405A-405D.

The diode trench 773 extends in a stripe shape along the active region 406 in a plan view. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view.

The bottom wall of diode trench 773 is located within SiC epitaxial layer 422. More specifically, the bottom wall of the diode trench 773 is located at the high concentration region 422 a.

The diode trench 773 is formed at a depth position substantially equal to that of the source trench 441. More specifically, the bottom wall of the diode trench 773 is located on substantially the same plane as the bottom wall of the source trench 441.

The diode insulating layer 774 and the diode electrode layer 775 are formed in the diode trench 773 using the same material type and in the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. Diode insulating layer 774 is connected to outer insulating layer 481 outside diode trench 773 (outer major face 462).

A diode region 471 and an outer deep well region 472 are formed in a region of the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402 along the inner wall of the diode trench 773.

The diode region 471 extends in a band shape along the diode trench 773 in a plan view. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view. In this manner, diode region 471 is formed along diode trench 773 in the same manner as contact region 454.

The outer deep well region 472 extends in a stripe shape along the diode trench 773. In this embodiment, diode trench 773 is formed in a dotted shape (a quadrangular ring shape) surrounding active region 406 in a plan view. In this manner, the outer deep well region 472 is formed along the diode trench 773 in the same manner as the deep well region 455.

The trench diode structure 772, the diode region 471, and the outer deep well region 472 are formed through a common process with the trench source structure 452, the contact region 454, and the deep well region 455.

Instead of the field limiting structure 473, a trench field limiting structure 776 and a trench field limiting structure 784 are formed in the outer region 407.

The trench field confining structure 776 is formed in an area opposite the active area 406 with respect to the trench diode structure 772. That is, trench field confining structure 776 is formed in a region on the side of side surfaces 405A to 405D of SiC semiconductor layer 402 with respect to trench diode structure 772.

Trench field-confining structure 776 includes one or more (in this case 4) field-confining trenches 777 formed in outer major face 462. A plurality of field limiting trenches 777 are formed with a space in a direction away from the active region 406.

The plurality of field limiting trenches 777 extend in a stripe shape along the periphery of the active region 406 in a plan view. More specifically, each of the plurality of field limiting trenches 777 is formed in a dotted shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

Each field limiting trench 777 may also be formed at a depth position substantially equal to that of the source trench 441. That is, the bottom wall of each field limiting trench 777 may also be located on substantially the same plane as the bottom wall of the source trench 441.

In each field limiting trench 777, a field limiting insulating layer 778 and a field limiting conductive layer 779 are buried. The field limiting insulating layer 778 and the field limiting conductive layer 779 are formed in the field limiting trench 777 by the same material type and in the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. A field limiting insulating layer 778 is connected to outer insulating layer 481 outside field limiting trench 777 (outer major face 462).

Trench field confining structure 776 includes a plurality of field confining regions 780A, 780B, 780C, 780D formed in a surface layer portion of outer major surface 462. The plurality of field confining regions 780A-780D are formed in a one-to-one correspondence with the plurality of field confining trenches 777.

The field confining regions 780A-780D are formed along the sidewalls and bottom wall of the corresponding field confining trench 777. The field confining regions 780A-780D may also be formed at substantially the same depth as the outer deep well region 472. That is, the bottom of the field confining regions 780A-780D may also be located on substantially the same plane as the bottom of the outer deep well region 472.

In the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402, p-type impurity regions 782 are formed in respective regions between the mutually adjacent field confining regions 780A to 780D. The field confining regions 780A to 780D are electrically connected via the impurity region 782.

The bottom of the impurity region 782 is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the field confining regions 780A to 780D. The bottom of the impurity region 782 may also be at the same depth as the bottom of the body region 426. The impurity region 782 may have a p-type impurity concentration equal to that of the body region 426.

The trench field confining structure 784 is formed in an area on the side of the active area 406 with respect to the trench diode structure 772. More specifically, trench field confining structures 784 are formed in the region between body region 426 and trench diode structures 772.

Trench field confining structure 784 includes one or more (4 in this embodiment) field confining trenches 785 formed in outer major surface 462.

A plurality of field limiting trenches 785 are formed at intervals in a direction away from the active region 406. The plurality of field limiting trenches 785 extend in stripes along the periphery of the active area 406 in a plan view. More specifically, each of the plurality of field limiting trenches 785 is formed in a dotted shape (a quadrangular ring shape) surrounding the active region 406 in a plan view.

Each field limiting trench 785 may also be formed at a depth substantially equal to that of the source trench 441. That is, the bottom wall of each field limiting trench 785 may also lie on substantially the same plane as the bottom wall of the source trench 441.

A field limiting insulating layer 786 and a field limiting conductor layer 787 are embedded in each field limiting trench 785. The field limiting insulating layer 786 and the field limiting conductive layer 787 are formed in the field limiting trench 785 of the same material type and in the same manner as the gate insulating layer 434 and the gate electrode layer 435, respectively. The field limiting insulating layer 786 is connected to the outer insulating layer 481 outside the field limiting trench 785 (the outer principal face 462).

The trench field confining structure 784 includes a plurality of field confining regions 788A, 788B, 788C, 788D formed in the surface layer portion of the outer main surface 462. The plurality of field limiting regions 788A to 788D are formed in one-to-one correspondence with the plurality of field limiting trenches 785.

The field limiting regions 788A to 788D are formed along the sidewalls and bottom walls of the corresponding field limiting trenches 785. The field limiting regions 788A to 788D may be formed at substantially the same depth as the outer deep well region 472. That is, the bottom of the field limiting regions 788A to 788D may also be located on the same plane as the bottom of the outer deep well region 472.

In the surface layer portion of the 1 st main surface 403 of the SiC semiconductor layer 402, p-type impurity regions 789 are formed in each region between the mutually adjacent field limiting regions 788A to 788D. The field limiting regions 788A to 788D are electrically connected via the impurity region 789.

The bottom of the impurity region 789 is formed in a region on the 2 nd main surface 404 side of the SiC semiconductor layer 402 with respect to the bottom of the field limiting regions 788A to 788D. The bottom of the impurity region 789 may also be located at the same depth as the bottom of the body region 426. The impurity region 789 may have a p-type impurity concentration equal to that of the body region 426.

In a region of the 1 st main surface 403 of the SiC semiconductor layer 402 along the upper end portion of the diode electrode layer 775, a diode sub-trench 781 communicating with the diode trench 773 is formed. The diode sub-trench 781 forms a part of the sidewall of the diode trench 773.

In this embodiment, the diode sub-trench 781 is formed in a dot shape surrounding the upper end portion of the diode electrode layer 775 in a plan view. That is, the diode sub-trench 781 borders the upper end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed by digging a part of the diode insulating layer 774. More specifically, the diode sub-trench 781 is formed by digging an upper end portion of the diode insulating layer 774 and an upper end portion of the diode electrode layer 775 from the 1 st main surface 403 of the SiC semiconductor layer 402.

The upper end portion of the diode electrode layer 775 has a shape shrunk from the lower end portion of the diode electrode layer 775. The lower end portion of the diode electrode layer 775 is a portion of the diode electrode layer 775 located on the bottom wall side of the diode trench 773. The 1 st direction width of the upper end portion of the diode electrode layer 775 may be smaller than the 1 st direction width of the lower end portion of the diode electrode layer 775.

The diode sub-trench 781 is formed in a tapered shape having a bottom area smaller than the opening area in cross section. The bottom wall of the diode sub-groove 781 may be formed to be convexly curved toward the 2 nd main surface 404 of the SiC semiconductor layer 402.

The diode region 471, the diode electrode layer 775, and the diode region 471 are exposed from the inner wall of the diode sub-trench 781. At least the diode insulating layer 774 is exposed from the bottom wall of the diode sub-trench 781. An upper end portion of the diode insulating layer 774 is located below the 1 st main surface 403 of the SiC semiconductor layer 402.

The opening edge portion of each diode sub-groove 781 includes an inclined portion inclined downward from the 1 st main surface 403 of the SiC semiconductor layer 402 toward the inside of the diode sub-groove 781. The opening edge portion of the diode sub-groove 781 is a corner portion connecting the 1 st main surface 403 of the SiC semiconductor layer 402 and the sidewall of the diode sub-groove 781. The inclined portion of the diode sub-trench 781 is formed by the diode sub-trench 781.

In this embodiment, the inclined portion of the diode sub-trench 781 is formed in a concave curved shape toward the inside of the SiC semiconductor layer 402. The inclined portion of the diode sub-groove 781 may be formed in a convex curved shape toward the inside of the diode sub-groove 781.

The diode contact hole 494 may also be formed in a stripe shape (more specifically, a dot-free shape) extending along the trench diode construction 772. The diode contact hole 494 exposes the diode electrode layer 775, the diode region 471, and the diode sub-trench 781. An opening edge portion of the diode contact hole 494 is formed in a convex curved shape toward the inside of the diode contact hole 494.

The source pull-back wiring 414 in the main surface source electrode 409 enters the diode contact hole 494 from above the interlayer insulating layer 491. The source pull-back wiring 414 is electrically connected to the diode electrode layer 775 and the diode region 471 in the diode contact hole 494 and the diode sub-trench 781.

As described above, the semiconductor device 790 can also provide the same effects as those described for the semiconductor device 401.

Of the embodiments of the semiconductor device 790, it goes without saying that the various embodiments described above can be applied to embodiments 26 to 41. The mode of the semiconductor device 790 is not limited to this embodiment. The mode of the semiconductor device 790 can be applied to all the embodiments disclosed in this specification.

Fig. 102 is an enlarged view of a region corresponding to fig. 51, and is an enlarged view of a semiconductor device 791 according to embodiment 43 of the present invention. FIG. 103 is a sectional view taken along the CIII-CIII line shown in FIG. 102. Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 102 and 103, a semiconductor device 791 includes an outer gate trench 792 formed in the active region 406 on the 1 st main surface 403 of the SiC semiconductor layer 402. Outer gate trenches 792 extend in a stripe shape along a peripheral portion of active region 406 (active sidewall 464). Outer gate trench 792 is formed in region directly below gate finger 411 (outer gate finger 411A) in the 1 st main surface 403 of SiC semiconductor layer 402. Outer gate trench 792 extends along gate finger 411 (outer gate finger 411A).

More specifically, outer gate trench 792 is formed along three side surfaces 405A, 405B, and 405D of SiC semiconductor layer 402 so as to divide the inner region of active region 406 from three directions. Outer gate trench 792 may also be formed as an unbroken dot (e.g., a quadrilateral ring) surrounding the inner region of active region 406.

Outer gate trench 792 communicates with contact trench portion 431b of each gate trench 431. Thus, outer gate trench 792 and gate trench 431 are formed of one trench.

The gate wiring layer 436 is buried in the outer gate trench 792. Gate wiring layer 436 is connected to gate electrode layer 435 at the communicating portions of gate trench 431 and outer gate trench 792.

The low-resistance electrode layer 632 covering the upper end of the gate wiring layer 436 may be formed in the outer gate trench 792 (see also fig. 68, etc.). In this case, the low-resistance electrode layer 632 covering the gate electrode layer 435 and the low-resistance electrode layer 632 covering the gate wiring layer 436 are located in one trench.

As described above, according to the semiconductor device 791, the same effects as those described for the semiconductor device 401 can be obtained. In addition, according to the semiconductor device 791, it is not necessary to draw out the gate wiring layer 436 above the 1 st main surface 403 of the SiC semiconductor layer 402.

Accordingly, at the opening edges of gate trench 431 and outer gate trench 792, gate wiring layer 436 can be prevented from facing SiC semiconductor layer 402 via gate insulating layer 434. As a result, concentration of an electric field at the opening edge of gate trench 431 can be suppressed.

In the embodiment of the semiconductor device 791, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 42 th embodiments. The mode of the semiconductor device 791 is not limited to this embodiment. The embodiment of the semiconductor device 791 can be applied to all embodiments disclosed in this specification.

Fig. 104 is an enlarged view of a region corresponding to fig. 53, and is an enlarged view showing a semiconductor device 801 according to embodiment 44 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 104, in this embodiment, gate trenches 431 are formed in a lattice shape integrally including a plurality of gate trenches 431 extending in the 1 st direction X and a plurality of gate trenches 431 extending in the 2 nd direction Y in a plan view.

A plurality of cell regions 802 are defined in a row-column pattern by gate trenches 431 in the 1 st main surface 403 of the SiC semiconductor layer 402. Each cell region 802 is formed in a quadrangular shape in a plan view. Source trenches 441 are formed in the plurality of cell regions 802, respectively. The source trench 441 may be formed in a quadrangular shape in a plan view.

A sectional view taken along the LII-LII line of fig. 104 corresponds to the sectional view shown in fig. 52. The sectional view taken along the LIII-LIII line of fig. 104 corresponds to the sectional view shown in fig. 53.

As described above, the semiconductor device 801 can also provide the same effects as those described for the semiconductor device 401.

In the embodiment of the semiconductor device 801, it is needless to say that the various embodiment examples described above can be applied to the 26 th to 43 th embodiments. The mode of the semiconductor device 801 is not limited to this embodiment. The embodiment of the semiconductor device 801 can be applied to all the embodiments disclosed in this specification.

Fig. 105 is an enlarged view of a region corresponding to fig. 54, and is an enlarged view showing a semiconductor device 811 according to embodiment 45 of the present invention. Hereinafter, the structure corresponding to the structure of the semiconductor device 401 will be denoted by the same reference numeral, and description thereof will be omitted.

Referring to fig. 105, in this embodiment, SiC epitaxial layer 422 includes high concentration regions 422a, low concentration regions 422b, and concentration gradient regions 422c interposed between high concentration regions 422a and low concentration regions 422 b.

Concentration gradient region 422c is formed in SiC epitaxial layer 422 as outer region 407 in addition to active region 406. The concentration gradient region 422c is formed over the entire region of the SiC epitaxial layer 422.

The concentration gradient region 422c has a concentration gradient in which the n-type impurity concentration gradually decreases from the high concentration region 422a toward the low concentration region 422 b. In other words, the concentration gradient region 422c has a concentration gradient in which the n-type impurity concentration increases from the low concentration region 422b toward the high concentration region 422 a. The concentration gradient region 422c suppresses a rapid variation in the n-type impurity concentration in a region between the high concentration region 422a and the low concentration region 422 b.

When the SiC epitaxial layer 422 includes the concentration gradient region 422c, the n-type impurity concentration of the high concentration region 422a is preferably 1.5 times or more and 5 times or less the n-type impurity concentration of the low concentration region 422 b. The n-type impurity concentration of the high-concentration region 422a may be 3 times or more and 5 times or less the n-type impurity concentration of the low-concentration region 422 b.

The thickness of the concentration gradient region 422c may be 0.5 μm or more and 2.0 μm or less. The thickness of the concentration gradient region 422c may be 0.5 μm or more and 1.0 μm or less. The thickness of the concentration gradient region 422c may be 1.0 μm or more and 1.5 μm or less. The thickness of the concentration gradient region 422c may be 1.5 μm or more and 2.0 μm or less.

Although not specifically described, the gate trench 431, the source trench 441, the deep well region 455, the outer deep well region 472, and the like are formed in the high concentration region 422 a.

That is, the gate trench 431, the source trench 441, the deep well region 455, the outer deep well region 472, and the like are formed in the region on the 1 st main surface 403 side with respect to the boundary region of the high concentration region 422a and the concentration gradient region 422c in the SiC semiconductor layer 402.

As described above, the semiconductor device 811 can also provide the same effects as those described for the semiconductor device 401.

Of the embodiments of the semiconductor device 811, it goes without saying that the various embodiments described above can be applied to the 26 th to 44 th embodiments. The mode of the semiconductor device 811 is not limited to this embodiment. The mode of the semiconductor device 811 can be applied to all the embodiments disclosed in this specification.

For example, when the concentration gradient region 422c of the semiconductor device 811 is incorporated in the above-described embodiments 7 to 25, the SiC epitaxial layer 112(SiC semiconductor layer 102) including the concentration gradient region (422c) between the high concentration region 112a and the low concentration region 112b is formed (see also fig. 11 to 48).

Fig. 106 is a perspective view showing a semiconductor package 1001 to which any of the semiconductor devices according to embodiments 1 to 45 described above can be assembled, through a sealing body 1007.

The semiconductor package 1001 includes a semiconductor chip 1002, a pad portion 1003, a heat spreader 1004, a plurality of (3 in this embodiment) terminals 1005, a plurality of (3 in this embodiment) leads 1006, and a sealing body 1007. Any of the semiconductor devices according to embodiments 1 to 45 described above can be used as the semiconductor chip 1002.

The pad portion 1003 includes a metal plate. The pad portion 1003 may also include aluminum, copper, or the like. The land portion 1003 is formed in a rectangular shape in a plan view. The pad portion 1003 has a planar area equal to or larger than that of the semiconductor chip 1002. Drain pad 113 of semiconductor chip 1002 is electrically connected to pad portion 1003 by die bonding.

The heat spreader 1004 is connected to one side of the pad portion 1003. In this embodiment, the pad portion 1003 and the heat spreader 1004 are formed from one metal plate. The heat sink 1004 has a through hole 1004 a. The through-hole 1004a is formed in a circular shape.

The plurality of terminals 1005 are arranged along a side opposite to the heat sink 1004 with respect to the pad portion 1003. Each of the plurality of terminals 1005 includes a metal plate extending in a band shape. The terminal 1005 may also include aluminum, copper, or the like. The plurality of terminals 1005 include a1 st terminal 1005A, a2 nd terminal 1005B, and a3 rd terminal 1005C.

The 1 st, 2 nd, and 3 rd terminals 1005A, 1005B, and 1005C are arranged with a space between them along the side opposite to the heat sink 1004 with respect to the pad portion 1003.

The 1 st, 2 nd, and 3 rd terminals 1005A, 1005B, and 1005C extend in a band shape in a direction orthogonal to the arrangement direction thereof. The 2 nd terminal 1005B and the 3 rd terminal 1005C sandwich the 1 st terminal 1005A from both sides.

The plurality of wires 1006 may be bonding wires or the like. In this manner, plurality of wires 1006 includes wire 1006A, wire 1006B, and wire 1006C.

Wire 1006A is electrically connected to gate pad 108 of semiconductor chip 1002 and to 1 st terminal 1005A. Wire 1006B is electrically connected to source pad 110 of semiconductor chip 1002 and to 2 nd terminal 1005B. The lead 1006C is electrically connected to the pad portion 1003 and the 3 rd terminal 1005C.

The sealing body 1007 seals the semiconductor chip 1002, the pad portion 1003, and the lead 1006 so that the heat sink 1004 and a part of the terminals 1005 are exposed. The sealing body 1007 includes a sealing resin. The sealing body 1007 is formed in a rectangular parallelepiped shape.

The manner of the semiconductor package 1001 is not limited to the manner shown in fig. 104. As the semiconductor package 1001, various semiconductor packages such as sop (Small Outline package), qfn (quad for no nleadpackage), dfp (dual Flat package), dip (dual Inline package), qfp (quad Flat package), sip (single Inline package), SOJ (Small Outline J-led package), and the like can be used.

The 26 th to 45 th embodiments of the present invention have been described, but the 26 th to 41 th embodiments of the present invention can be implemented in other forms.

In the above-described embodiments 27 to 30, examples of forming the gate electrode layer 435 and the gate wiring layer 436 including p-type polysilicon to which p-type impurities are added have been described.

However, when importance is not attached to increase of gate threshold voltage Vth, gate electrode layer 435 and gate wiring layer 436 may include n-type polysilicon to which n-type impurities are added instead of p-type polysilicon.

The low-resistance electrode layer 632 may be formed by silicidizing a portion of the gate electrode layer 435 (n-type polysilicon) where the surface portion is formed, with a metal material. That is, the low-resistance electrode layer 632 may include n-type polycrystal. With this structure, the gate resistance can be reduced.

In the above-described embodiments 26 to 45, an example in which the source insulating layer 442 (polysilicon) is embedded in the source trench 441 with the source insulating layer 442 interposed therebetween is described. However, the source insulating layer 442 (polysilicon) may be directly buried in the source trench 441 without passing through the source insulating layer 442.

In the above-described embodiments 26 to 45, an example in which the SiC semiconductor layer 402 has a laminated structure including the SiC semiconductor substrate 421 and the SiC epitaxial layer 422 is described. However, the SiC semiconductor layer 402 may have a single-layer structure formed of the SiC semiconductor substrate 421. The SiC semiconductor layer 402 may have a single-layer structure formed of the SiC epitaxial layer 422.

In the above-described embodiments 26 to 45, instead of the SiC semiconductor layer 402 made of 4H — SiC single crystal, an SiC semiconductor layer 402 made of 2H — SiC single crystal, 6H — SiC single crystal, or 3C — SiC single crystal may be used.

In the above-described embodiments 26 to 45, instead of the SiC semiconductor layer 402 made of 4H — SiC single crystal, an Si semiconductor layer 402 made of Si (silicon) may be used. The Si semiconductor layer (402) may have a laminated structure including a Si semiconductor substrate (421) made of Si and a Si epitaxial layer (422) made of Si.

In the above-described embodiments 26 to 45, an example of forming the SiC epitaxial layer 422 having the high concentration regions 422a and the low concentration regions 422b by the epitaxial growth method is described. However, the SiC epitaxial layer 422 can also be formed by the following steps.

First, the SiC epitaxial layer 422 having a relatively low n-type impurity concentration is formed by an epitaxial growth method. Next, an n-type impurity is introduced into the surface layer portion of the SiC epitaxial layer 422 by ion implantation. Thereby, the SiC epitaxial layer 112 having the high concentration regions 422a and the low concentration regions 422b is formed.

In the above-described 26 th to 45 th embodiments, a structure in which the conductivity type of each semiconductor portion is inverted may be employed. That is, the p-type portion may be formed as an n-type, the n-type portion may be formed as a p-type.

In the above-described embodiments 26 to 45, a p + -type SiC semiconductor substrate (421) may be used instead of the n + -type SiC semiconductor substrate 421. According to this configuration, an igbt (insulated Gate bipolar transistor) can be provided instead of the MISFET.

In this case, the "source" of the MISFET is replaced with the "emitter" of the IGBT. In addition, the "drain" of the MISFET is replaced with the "collector" of the IGBT. Even when the MISFET is replaced with the IGBT, the same effects as those described in embodiments 26 to 41 can be obtained.

In the above-described embodiments 26 to 45, examples in which the drain pad 423 includes the Ti layer (696), the Ni layer (697), the Au layer (698), and/or the Ag layer (699) have been described. However, the drain pad 423 may include an Al layer instead of or in addition to the Ti layer (696), the Ni layer (697), the Au layer (698), and/or the Ag layer (699).

The drain pad 423 may have a laminated structure in which at least two of the Ti layer (696), the Ni layer (697), the Au layer (698), the Ag layer (699), and the Al layer are optionally laminated. In addition, the drain pad 423 may have a single-layer structure including an Al layer.

In the above-described embodiments 1 to 45, a semiconductor device made of a material mainly composed of SiC is described. However, the above-described embodiments 1 to 45 can also be applied to semiconductor devices using semiconductor materials different from SiC.

For example, the above-described embodiments 1 to 45 can also be applied to a compound semiconductor device including a vertical MISFET using a compound semiconductor material instead of SiC. Examples of the compound semiconductor material that can be used in the compound semiconductor device include gallium nitride (GaN) and gallium oxide (Ga)₂O₃) Either one or both of them.

In the compound semiconductor device, a GaN semiconductor layer may be applied instead of the SiC semiconductor layers 2, 102, and 402. In this case, the gate insulating layers 13, 131, and 434 containing silicon oxide may be used.

As an insulating material of the gate insulating layers 13, 131, and 434, alumina (Al) may be used₂O₃) Zirconium oxide (ZrO)₂) Or tantalum oxide (Ta)₂O₃) Instead of or in addition to silicon oxide, aluminum oxide (Al) may be used₂O₃) Zirconium oxide (ZrO)₂) Or tantalum oxide (Ta)₂O₃) At least one of (1).

In addition, in the compound semiconductor MISFET, magnesium may be used as a p-type impurity (acceptor). As the n-type impurity (donor), germanium (Ge), acid (O), or silicon (Si) may be used. The other structures are the same as those described in embodiments 1 to 45.

The description is not limited to how the features shown in embodiments 1 to 45 are combined. The embodiments 1 to 45 can be combined in any form and any combination thereof.

That is, the features shown in embodiments 1 to 45 may be combined in any form and any combination. The features shown in fig. 1 to 106 may be combined in any form and any combination.

The crystal planes and crystal directions of the 4H-SiC single crystal and the 4H-SiC single crystal applied to embodiments 1 to 45 are supplemented below with reference to fig. 107 and 108. FIG. 107 is a view showing a unit cell of a 4H-SiC single crystal used in embodiments 1 to 45. Fig. 108 is a plan view showing a silicon surface of a unit cell (hereinafter simply referred to as "unit cell") of the 4H — SiC single crystal shown in fig. 107.

Referring to fig. 107 and 108, the unit cell includes a tetrahedral structure in which four C atoms are bonded to one Si atom in a tetrahedral arrangement (regular tetrahedral arrangement). The unit cell has an atomic arrangement in which tetrahedral configuration is stacked with a four-layer period. The unit cell has a hexagonal prism structure having a silicon face of a regular hexagon, a carbon face of a regular hexagon, and a hexagonal prism structure connecting six side faces of the silicon face and the carbon face.

The silicon surface is a terminal surface having a terminal formed by Si atoms. In the silicon surface, one Si atom is present at each of six vertices of a regular hexagon, and one Si atom is present at the center of the regular hexagon.

The carbon face is a terminal face terminated by C atoms. In the carbon plane, one C atom is present at each of six vertices of a regular hexagon, and one C atom is present at the center of the regular hexagon.

The crystal plane of the unit cell is defined by four coordinate axes (a1, a2, a3, c) including a1 axis, a2 axis, a3 axis, and c axis. The value of a3 in the four coordinate axes is set to the value of- (a1+ a 2). Hereinafter, the crystal plane of the 4H — SiC single crystal will be described with reference to a silicon plane as an example of the termination plane of the hexagonal crystal.

In a plan view of the silicon surface viewed from the c-axis, an a1 axis, an a2 axis, and an a3 axis are set in the arrangement direction of the closest Si atoms (hereinafter, simply referred to as "closest atom direction") with respect to the Si atom located at the center. The a1 axis, the a2 axis, and the a3 axis are set so as to be shifted by an angle of 120 ° in accordance with the arrangement of Si atoms.

The c-axis is set to the normal direction of the silicon surface with respect to the Si atom located at the center. The silicon surface is a (0001) surface. The carbon side is (000-1) side.

The side surfaces of the hexagonal prism include six crystal planes in the nearest atom contact direction in a plan view of the silicon surface viewed from the c-axis. More specifically, the sides of the hexagonal prism include six crystal faces formed by the closest Si atoms.

In a plan view of the silicon surface viewed from the c-axis, the side surfaces of the hexagonal prism include (10-10), (01-10), (1100), (1010), (0-110) and (1-100) planes clockwise around the tip of the a1 axis.

The diagonal corners of the hexagonal prism include six crystal faces in a crossing direction crossing the nearest atom contact direction (hereinafter simply referred to as "crossing direction of nearest atom contact direction") in a plan view of the silicon face as viewed from the c-axis. More specifically, the opposite corners of the hexagonal prism include six crystal planes formed by the least proximate Si atoms. When viewed with the Si atom positioned at the center as a reference, the intersecting direction of the nearest atomic junction direction is an orthogonal direction orthogonal to the nearest atomic junction direction.

The diagonal angles of the hexagonal prism include (11-20) (-2110) (-1-2-10) (-1-120) (-2-1-10) & (-12-10) planes in a plan view of the silicon plane as viewed from the c-axis.

The crystal direction of the unit cell is defined by the normal direction of the crystal plane. The normal direction of the (10-10) plane is the [ 10-10 ] direction. The normal direction of the (01-10) plane is the [ 01-10 ] direction. The normal direction of the (-1100) plane is the (-1100) direction. The normal direction of the (-1010) plane is the (-1010) direction. The normal direction of the (0-110) plane is the [ 0-110 ] direction. The normal direction of the (1-100) plane is the [ 1-100 ] direction.

The normal direction of the (11-20) plane is the [ 11-20 ] direction. The normal direction of the (-2110) plane is the direction of [ -2110 ]. The normal direction of the (1-2-10) plane is the [ 1-2-10 ] direction. The normal direction of the (-1-120) plane is the direction of [ -1-120 ]. The normal direction of the (2-1-10) plane is the [ 2-1-10 ] direction. The normal direction of the (-12-10) plane is the direction of [ -12-10 ].

Hexagonal is six-fold symmetric, with equivalent crystal planes and equivalent crystal orientations at every 60 °. For example, the (10-10) plane, (01-10) plane, (-1100) plane, (-1010) plane, (0-110) plane and (1-100) plane form equivalent crystal planes.

In addition, the [ 01-10 ] direction, [ -1100 ] direction, [ -1010 ] direction, [ -0-110 ] direction, [ 1-100 ] direction, and [ 10-10 ] direction form equivalent crystal directions. In addition, the [ 11-20 ] direction, [ -12-10 ] direction, [ -2110 ] direction, [ -1-120 ] direction, [ -1-210 ] direction, and [ 2-1-10 ] direction form equivalent crystal directions.

The c-axis is the [0001] direction ([ 000-1 ] direction). The a1 axis is in the [ 2-1-10 ] direction ([ -2110 ] direction). The a2 axis is the [ -12-10 ] direction ([ 1-210 ] direction). The a3 axis is the [ -1-120 ] direction ([ 11-20 ] direction).

[0001] The directions and [ 000-1 ] directions are sometimes referred to simply as the c-axis. (0001) The facets and (000-1) may be abbreviated as "c-plane". The [ 11-20 ] direction and the [ -1-120 ] direction are sometimes simply referred to as the a-axis. The [ 1-100 ] direction and the [ -1100 ] direction are sometimes simply referred to as the m-axis. The (1-100) plane and the (-1100) plane are sometimes simply referred to as the m-plane.

Hereinafter, an example of the features extracted from the description and the drawings will be described.

[A1] A semiconductor device, comprising: a SiC semiconductor layer having a1 st main surface and a2 nd main surface opposite to the 1 st main surface; a semiconductor element formed on the 1 st main surface of the SiC semiconductor layer; a bump group including a plurality of bumps formed at intervals on the 2 nd main surface of the SiC semiconductor layer, the bump group including a1 st portion where several of the bumps overlap with each other when viewed from a1 st direction which is one of the surface directions of the 2 nd main surface of the SiC semiconductor layer; and an electrode formed on the 2 nd main surface of the SiC semiconductor layer and connected to the group of protrusions.

According to this semiconductor device, the connection area of the electrodes to the 2 nd main surface can be increased by the bump group. This can improve the electrical characteristics.

[A2] The semiconductor device according to a1, wherein the bump group includes a2 nd portion, and the 2 nd portion is a portion in which some of the plurality of bumps are formed apart from the 1 st portion when viewed in the 1 st direction and overlap with each other when viewed in the 1 st direction.

[A3] The semiconductor device according to a1 or a2, wherein the group of protrusions is one in a plane direction of the 1 st main surface of the SiC semiconductor layer, and a plurality of the group of protrusions are formed at intervals in a2 nd direction intersecting the 1 st direction.

[A4] The semiconductor device according to a3, wherein a distance between the plurality of adjacent bump groups is 100 μm or less.

[A5] The semiconductor device according to A4, wherein the distance is 50 μm or less.

[A6] The semiconductor device according to A4 or A5, wherein the distance is 20 μm or less.

[A7] The semiconductor device according to any one of a1 to a6, wherein the ridge group is formed in a range of 10 μm or more and 200 μm or less in a direction orthogonal to the 1 st direction in the 2 nd main surface of the SiC semiconductor layer.

[A8] The semiconductor device according to A7, wherein the above range is 50 μm or more and 150 μm or less.

[A9] The semiconductor device according to A7 or A8, wherein the above range is 80 μm or more and 120 μm or less.

[A10] The semiconductor device according to any one of A1 to A9, wherein the SiC semiconductor layer contains 4H-SiC, and the 1 st direction is [ 11-20 ] direction of the 4H-SiC.

[A11] The semiconductor device according to any one of A1 to A9, wherein the SiC semiconductor layer contains 4H-SiC, and the 1 st direction is [ 1-100 ] direction of the 4H-SiC.

[A12] The semiconductor device according to A10 or A11, wherein the SiC semiconductor layer has an off-angle inclined at an angle of 10 ° or less from the (0001) plane of the 4H-SiC layer with respect to the [ 11-20 ] direction.

[A13] The semiconductor device according to a12, wherein the off angle is 0 ° or more and 4 ° or less.

[A14] The semiconductor device according to a12 or a13, wherein the off angle is greater than 0 ° and less than 4 °.

[A15] The semiconductor device according to any one of A1 to A14, wherein the electrode contains at least one of Ti, Ni, Au, and Ag.

[A16] The semiconductor device according to any one of A1 to A15, wherein the electrode includes a Ti layer in contact with the group of bumps.

[A17] The semiconductor device according to any one of A1 to A15, wherein the electrodes include a Ni layer in contact with the bump groups.

[A18] The semiconductor device according to any one of A1 to A17, further comprising a groove formed in the 2 nd main surface of the SiC semiconductor layer.

[A19] The semiconductor device according to a18, wherein the groove includes a portion intersecting the group of ridges.

[A20] The semiconductor device according to a18 or a19, wherein the bump group includes a portion in which some of the plurality of bumps are formed at intervals along the groove in a plan view seen from a normal direction of the 2 nd main surface of the SiC semiconductor layer.

[A21] The semiconductor device according to any one of A1 to A20, wherein the semiconductor element comprises a field effect transistor.

[B1] A semiconductor device, comprising: a SiC semiconductor layer having a1 st main surface and a2 nd main surface on the opposite side of the 1 st main surface; a semiconductor element formed on the 1 st main surface of the SiC semiconductor layer; a bump group including a plurality of bumps formed on the 2 nd main surface of the SiC semiconductor layer with a space therebetween; and an electrode directly connected to the group of protrusions on the 2 nd main surface of the SiC semiconductor layer.

According to this semiconductor device, the connection area of the electrodes to the 2 nd main surface can be increased by the bump group. This can improve the electrical characteristics. In addition, according to the semiconductor device, since the electrode is directly connected to the bump group, an increase in the resistance value due to a connection failure can be suppressed.

[B2] The semiconductor device according to B1, wherein the electrode is connected to the bump group without a silicide layer.

[B3] The semiconductor device according to B1 or B2, wherein the electrodes are connected to the bump groups without a carbon layer.

[B4] The semiconductor device according to any one of B1 to B3, wherein the electrode contains at least one of Ti, Ni, Au, and Ag.

[B5] The semiconductor device according to any one of B1 to B4, wherein the electrode includes a Ti layer in contact with the group of bumps.

[B6] The semiconductor device according to any one of B1 to B4, wherein the electrodes comprise a Ni layer in contact with the bump groups.

[B7] The semiconductor device according to any one of B1 to B6, wherein the bump group includes a1 st portion, and the 1 st portion is a portion where several of the bumps overlap with each other when viewed from a1 st direction which is one of the plane directions of the 2 nd main surface of the SiC semiconductor layer, as viewed from the 1 st direction.

[B8] The semiconductor device according to B7, wherein the bump group includes a2 nd portion, and the 2 nd portion is a portion in which some of the plurality of bumps are formed apart from the 1 st portion when viewed in the 1 st direction and overlap with each other when viewed in the 1 st direction.

[B9] The semiconductor device according to B7 or B8, wherein the group of protrusions is one in a plane direction of the 1 st main surface of the SiC semiconductor layer, and a plurality of the group of protrusions are formed at intervals in a2 nd direction intersecting the 1 st direction.

[B10] The semiconductor device according to B9, wherein a distance between the plurality of adjacent bump groups is 100 μm or less.

[B11] The semiconductor device according to B10, wherein the distance is 50 μm or less.

[B12] The semiconductor device according to B10 or B11, wherein the distance is 20 μm or less.

[B13] The semiconductor device according to any one of B7 to B12, wherein the SiC semiconductor layer contains 4H-SiC, and the 1 st direction is [ 11-20 ] direction of the 4H-SiC.

[B14] The semiconductor device according to any one of B7 to B12, wherein the SiC semiconductor layer contains 4H-SiC, and the 1 st direction is [ 1-100 ] direction of the 4H-SiC.

[B15] The semiconductor device according to B13 or B14, wherein the SiC semiconductor layer has an off-angle inclined at an angle of 10 ° or less from the (0001) plane of 4H-SiC with respect to the [ 11-20 ] direction.

[B16] The semiconductor device according to B15, wherein the off angle is 0 ° or more and 4 ° or less.

[B17] The semiconductor device according to B15 or B16, wherein the off-angle is greater than 0 ° and less than 4 °.

[B18] The semiconductor device according to any one of B7 to B17, wherein the ridge group is formed in a range of 10 μm or more and 200 μm or less in a direction orthogonal to the 1 st direction on the 2 nd main surface of the SiC semiconductor layer.

[B19] The semiconductor device according to B18, wherein the above range is 50 μm or more and 150 μm or less.

[B20] The semiconductor device according to B18 or B14, wherein the above range is 80 μm or more and 120 μm or less.

[B21] The semiconductor device according to any one of B1 to B20, further comprising a groove formed in the 2 nd main surface of the SiC semiconductor layer.

[B22] The semiconductor device according to B21, wherein the groove includes a portion intersecting the group of ridges.

[B23] The semiconductor device according to B21 or B22, wherein the bump group includes a portion in which some of the plurality of bumps are formed at intervals along the groove in a plan view seen from a normal direction of the 2 nd main surface of the SiC semiconductor layer.

[B24] The semiconductor device according to any one of B1 to B23, wherein the semiconductor element comprises a field effect transistor.

[C1] A SiC semiconductor device comprising: a SiC semiconductor layer having a main surface on which a gate trench is formed; a gate insulating layer formed along an inner wall of the gate trench; a gate electrode layer including p-type polycrystalline silicon to which a p-type impurity is added, the gate electrode layer being embedded in the gate trench with the gate insulating layer interposed therebetween; and a low-resistance electrode layer that includes a conductive material having a sheet resistance smaller than that of the gate electrode layer and covers the gate electrode layer.

In a SiC semiconductor device including SiC (silicon carbide), it is considered that a gate threshold voltage is increased as one method for suppressing a malfunction when a low voltage is applied. In a Si semiconductor device including Si (silicon), for example, the gate threshold voltage can be increased by increasing the p-type impurity concentration in a p-type body region formed in a semiconductor layer.

However, the SiC semiconductor device has a property of having a lower channel mobility (also referred to as carrier mobility) than the Si semiconductor device. Therefore, in the SiC semiconductor device, if the p-type impurity concentration of the p-type body region is increased, the channel resistance significantly increases.

On the other hand, in the SiC semiconductor device, if the p-type impurity concentration of the p-type body region is reduced, a violation such as a reduction in the gate threshold voltage occurs. Therefore, the method adopted in the Si semiconductor device cannot be applied to the SiC semiconductor device.

In a SiC semiconductor device having a trench gate electrode structure, it is considered to change the material of a gate electrode layer from n-type polycrystalline silicon to which an n-type impurity is added to p-type polycrystalline silicon to which a p-type impurity is added. p-type polysilicon has a different work function from n-type polysilicon, and the gate threshold voltage can be increased only by burying p-type polysilicon in the gate trench.

However, p-type polysilicon has a sheet resistance that is tens of times higher than that of n-type polysilicon. Therefore, when p-type polysilicon is used as a material of the gate electrode layer, the energy loss during switching significantly increases with an increase in parasitic resistance in the gate trench (hereinafter, simply referred to as "gate resistance").

In particular, in the trench gate electrode structure, since the gate electrode layer must be embedded in the gate trench, there is a limit to the selection of the electrode material for the gate electrode layer in addition to the requirement for manufacturing difficulty different from that of the planar gate structure. Therefore, in a limited design range called a trench gate electrode structure, there is no room for using p-type polysilicon as an electrode material of a gate electrode layer, and n-type polysilicon has to be selected.

There is also a problem that, in the method including the trench gate electrode structure including p-type polycrystalline silicon, there is a practical situation in which an attempt to achieve both an increase in the gate threshold voltage and a decrease in the gate resistance is not sufficiently made.

According to the SiC semiconductor device, a trench gate electrode structure is formed in which a gate electrode layer is embedded in a gate trench with a gate insulating layer interposed therebetween. In the trench gate electrode structure, the gate electrode layer is covered with the low-resistance electrode layer.

The gate electrode layer comprises p-type polysilicon. This can increase the gate threshold voltage. In addition, the low-resistance electrode layer contains a conductive material having a sheet resistance smaller than that of p-type polycrystalline silicon. This can reduce the gate resistance.

[C2] The SiC semiconductor device according to C1, wherein the low-resistance electrode layer includes a polycrystalline layer formed by silicidizing the p-type polycrystalline silicon with a metal material.

[C3]The SiC semiconductor device according to C2, wherein the polycrystalline layer comprises TiSi or TiSi₂、NiSi、CoSi、CoSi₂、MoSi₂Or WSi₂At least one of (1).

[C4] The SiC semiconductor device according to any one of C1 to C3, wherein the low-resistance electrode layer is formed in a film shape.

[C5] The SiC semiconductor device according to any one of C1 to C4, wherein a thickness of the low-resistance electrode layer is equal to or less than a thickness of the gate electrode layer.

[C6] The SiC semiconductor device according to any one of C1 to C5, wherein the gate insulating layer includes a1 st region formed along a sidewall of the gate trench and a2 nd region formed along a bottom wall of the gate trench, and a thickness of the 2 nd region of the gate insulating layer is equal to or greater than a thickness of the 1 st region of the gate insulating layer.

[C7] The SiC semiconductor device according to C6, wherein the gate insulating layer has a3 rd region that covers a main surface of the SiC semiconductor layer, and a thickness of the 3 rd region of the gate insulating layer is equal to or greater than a thickness of the 1 st region of the gate insulating layer.

[C8] The SiC semiconductor device according to any one of C1 to C7, wherein the gate trench has a bent portion that is bent inward of the gate trench at an opening edge portion that connects a main surface of the SiC semiconductor layer and a side wall of the gate trench.

[C9] The SiC semiconductor device according to any one of C1 to C7, wherein the gate trench has an inclined portion inclined downward from the main surface of the SiC semiconductor layer toward the side wall of the gate trench at an opening edge portion connecting the main surface of the SiC semiconductor layer and the side wall of the gate trench.

[C10] The SiC semiconductor device according to any one of C1 to C9, wherein the gate insulating layer includes a bulge portion bulging toward the inside of the gate trench at an opening edge portion of the gate trench,

the low-resistance electrode layer is in contact with the protruding portion of the gate insulating layer.

[C11] In the SiC semiconductor device described in C10, the expanded portion of the gate insulating layer is extended in a curved shape toward the inside of the gate trench.

[C12] The SiC semiconductor device according to any one of C1 to C11, further comprising a source region, a body region, and a drain region formed in this order from a main surface of the SiC semiconductor layer in a thickness direction so as to extend along a sidewall of the gate trench, wherein the low-resistance electrode layer faces the source region with the gate insulating layer interposed therebetween.

[C13] The SiC semiconductor device according to any one of C1 to C12, further comprising an emitter region, a body region, and a collector region formed in this order from a main surface of the SiC semiconductor layer in a thickness direction so as to extend along a sidewall of the gate trench, wherein the low-resistance electrode layer faces the emitter region with the gate insulating layer interposed therebetween.

[C14] A method for manufacturing a SiC semiconductor device, comprising: forming a gate trench on a main surface of the SiC semiconductor layer; forming a gate insulating layer along an inner wall of the gate trench; forming a gate electrode layer by embedding p-type polycrystalline silicon to which a p-type impurity is added into the gate trench with the gate insulating layer interposed therebetween; and forming a low-resistance electrode layer by coating the gate electrode layer with a conductive material having a sheet resistance lower than that of the gate electrode layer.

[C15] According to the method of manufacturing a SiC semiconductor device of C14, the step of forming the low-resistance electrode layer includes a step of forming a polycrystalline layer covering the gate electrode layer by silicidizing a surface layer portion of the gate electrode layer with a metal material.

[C16] The method of manufacturing a SiC semiconductor device according to C15, wherein the metal material contains at least one of Ti, Ni, Co, Mo, and W.

[C17] The method of manufacturing a SiC semiconductor device according to any one of C14 to C16, wherein the step of forming the low-resistance electrode layer includes a step of forming the low-resistance electrode layer having a thickness equal to or less than a thickness of the gate electrode layer.

[D1] A semiconductor device, comprising: a semiconductor layer having a main surface on which a gate trench is formed; a gate insulating layer formed along an inner wall of the gate trench; a gate electrode layer made of polysilicon and buried in the gate trench with the gate insulating layer interposed therebetween; and a low-resistance electrode layer that includes a conductive material having a sheet resistance smaller than that of the gate electrode layer and covers the gate electrode layer.

According to this semiconductor device, the sheet resistance in the gate trench can be reduced by the low-resistance electrode layer. That is, the current supplied into the gate trench flows through the low-resistance electrode layer having a relatively low sheet resistance, and is transmitted to the entire gate electrode layer. This makes it possible to quickly shift the entire gate electrode layer from the off state to the on state, and to suppress a delay in switching response.

As the cell structure is miniaturized, the width, depth, cross-sectional area, and the like of the gate electrode layer are reduced, and therefore, there is a concern that the switching response is delayed due to an increase in resistance in the gate trench. However, the low-resistance electrode layer can appropriately suppress an increase in resistance in the gate trench, and thus can appropriately suppress a delay in switching response due to a decrease in size.

[D2] The semiconductor device according to D1, wherein the low-resistance electrode layer covers the gate electrode layer in the gate trench.

[D3] The semiconductor device according to D1 or D2, wherein the gate trench has a length of 1mm or more and 10mm or less.

In the case of a gate trench having a length on the order of millimeters, the transfer of current takes time. However, according to this semiconductor device, a low-resistance electrode layer is formed. According to the low-resistance electrode layer, the entire gate electrode layer can be quickly switched from the off state to the on state, and therefore, delay in switching response can be suppressed.

[D4]The semiconductor device according to any one of D1 to D3, wherein the total extension of the gate trench per unit area in a plan view is 0.5 μm/μm²Above and 0.75 μm/μm²The following.

[D5]The semiconductor device according to any one of D1 to D4, comprising a plurality of the gate trenches formed at intervals in one direction, wherein the total of one or more of the gate trenches per unit area in a plan viewElongation of 0.5 μm/μm²Above and 0.75 μm/μm²The following.

[D6]According to the semiconductor device described in any one of D1 to D5, a cross-sectional area of the gate electrode layer is 0.05 μm in a cross-sectional view taken along a direction orthogonal to a direction in which the gate trench extends²Above and 0.5 μm²The following.

[D7] The semiconductor device according to any one of D1 to D6, wherein the thickness of the low-resistance electrode layer is equal to or less than the thickness of the gate electrode layer.

[D8] The semiconductor device according to any one of D1 to D7, wherein a thickness of the low-resistance electrode layer is smaller than a thickness of the gate electrode layer.

[D9] The semiconductor device according to any one of D1 to D8, wherein a ratio of a thickness of the low-resistance electrode layer to a thickness of the gate electrode layer is 0.01 or more and 1 or less.

[D10] The semiconductor device according to any one of D1 to D9, wherein the gate electrode layer has a thickness of 0.5 μm or more and 3 μm or less.

[D11] The semiconductor device according to any one of D1 to D10, wherein the low-resistance electrode layer has a thickness of 0.01 to 3 μm inclusive.

[D12] The semiconductor device according to any one of D1 to D11, wherein the gate electrode layer is formed of n-type polycrystalline silicon to which an n-type impurity is added or p-type polycrystalline silicon to which a p-type impurity is added.

[D13] The semiconductor device according to any one of D1 to D12, wherein the gate electrode layer is made of p-type polycrystalline silicon to which a p-type impurity is added.

[D14] The semiconductor device according to any one of D1 to D13, wherein the semiconductor layer contains SiC.

[E1] A semiconductor device, comprising: a semiconductor layer including a1 st main surface on one side and a2 nd main surface on the other side, the 1 st main surface having a gate trench and a source trench formed with an interval therebetween; a body region of the 1 st conductivity type formed on a surface layer portion of the 1 st main surface of the semiconductor layer, at a side of the gate trench; a source region of the 2 nd conductivity type formed on a surface layer portion of the body region at a side of the gate trench; a drift region of the 2 nd conductivity type formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the body region and exposed from an inner wall of the source trench; a gate electrode facing the body region, the source region, and the drift region with a gate insulating layer interposed therebetween; and a source electrode buried in the source trench and forming a schottky junction with the drift region.

According to this semiconductor device, a schottky barrier diode is formed between the drift region and the source electrode. In this semiconductor device, when a reverse bias voltage is applied, a current can preferentially flow into the schottky barrier diode. This can suppress the spread of crystal defects in the semiconductor layer due to the reverse bias voltage.

[E2] The semiconductor device according to E1, wherein the drift region is exposed from a sidewall of the source trench, and the source electrode forms a schottky junction with the drift region exposed from the sidewall of the source trench.

[E3] The semiconductor device according to E1 or E2, further comprising a well region of the 1 st conductivity type formed in a region of the semiconductor layer along a bottom wall of the source trench, wherein the source electrode forms a schottky junction with the drift region at a depth position between the body region and the well region in a normal direction of the 1 st main surface of the semiconductor layer.

[E4] The semiconductor device according to E3, wherein the well region covers a bottom wall of the source trench.

[E5] The semiconductor device according to E3 or E4, wherein the well region is drawn from a bottom wall of the source trench in a lateral direction parallel to the 1 st main surface of the semiconductor layer.

[E6] The semiconductor device according to any one of E3 to E5, wherein the well region faces the body region with a partial region of the drift region interposed therebetween in a normal direction of the 1 st main surface of the semiconductor layer.

[E7] The semiconductor device according to E6, wherein the source electrode forms a schottky junction with the drift region in a region of the semiconductor layer sandwiched between the body region and the well region in a direction normal to the 1 st main surface of the semiconductor layer.

[E8] The semiconductor device according to any one of E1 to E7, further comprising a source insulating layer partially covering the sidewall of the source trench so that the drift region is exposed from the sidewall of the source trench, wherein the source electrode forms a schottky junction with the drift region exposed from the source insulating layer.

[E9] The semiconductor device according to E8, wherein the body region is exposed from a sidewall of the source trench, and the source insulating layer covers the body region exposed from the sidewall of the source trench.

[E10] The semiconductor device according to E8 or E9, wherein the source region is exposed from a sidewall of the source trench, and the source insulating layer covers the source region exposed from the sidewall of the source trench.

[E11] The semiconductor device according to any one of E8 to E10, wherein the source insulating layer covers a bottom wall of the source trench.

[E12] The semiconductor device according to any one of E8 to E11, wherein the source insulating layer covers corners of a connecting sidewall and a bottom wall of the source trench.

[E13] The semiconductor device according to any one of E1 to E12, wherein the semiconductor layer includes a plurality of gate trenches formed at intervals, and the source trench is formed in a region between the plurality of gate trenches adjacent to each other.

[E14] The semiconductor device according to any one of E1 to E13, wherein the gate trench has a tapered shape whose opening width is narrower toward the 2 nd main surface side of the semiconductor layer, and the source trench has a tapered shape whose opening width is narrower toward the 2 nd main surface side of the semiconductor layer.

[E15] The semiconductor device according to any one of E1 to E14, wherein the gate electrode comprises conductive polysilicon, and the source electrode comprises at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten.

[E16] The semiconductor device according to any one of E1 to E15, further comprising a main surface source electrode formed on the 1 st main surface of the semiconductor layer and electrically connected to the source region and the source electrode.

[E17] The semiconductor device according to E16, wherein the main-surface source electrode comprises the same conductive material as the source electrode and is formed integrally with the source electrode.

[E18] The semiconductor device according to any one of E1 to E17, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region in a region of the semiconductor layer formed on the 2 nd main surface side with respect to the high concentration region, wherein the source electrode forms a schottky junction with the high concentration region of the drift region.

[E19] The semiconductor device according to any one of E1 to E17, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region in the semiconductor layer, the low concentration region being a region on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region.

[E20] The semiconductor device according to E19, wherein the gate trench is formed in the high concentration region of the drift region.

[E21] The semiconductor device according to any one of E1 to E17, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region in the semiconductor layer, the well region being formed in the high concentration region of the drift region, the low concentration region being formed in a region on the 2 nd main surface side with respect to the high concentration region.

[E22] The semiconductor device according to E21, wherein the source trench is formed in the high concentration region of the drift region.

[E23] The semiconductor device according to E21 or E22, wherein the gate trench is formed in the high concentration region of the drift region.

[E24] The semiconductor device according to any one of E1 to E23, wherein the semiconductor layer contains SiC.

[F1] A semiconductor device, comprising: a semiconductor layer including a1 st main surface on one side and a2 nd main surface on the other side; a field Effect transistor (fet) structure including a body region of the 1 st conductivity type formed on the 1 st main surface of the semiconductor layer, a source region of the 2 nd conductivity type formed on a surface layer portion of the body region, a drift region of the 2 nd conductivity type formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the body region, and a gate electrode facing the body region, the source region, and the drift region through a gate insulating layer; and a trench source structure including a source trench formed on the 1 st main surface of the semiconductor layer on a side of the FET structure with a space from the FET structure, and a source electrode buried in the source trench and forming a schottky junction with the drift region.

According to this semiconductor device, a schottky barrier diode is formed between the drift region and the source electrode. In this semiconductor device, when a reverse bias voltage is applied, a current can preferentially flow into the schottky barrier diode. This can suppress the spread of crystal defects in the semiconductor layer due to the reverse bias voltage.

[F2] The semiconductor device according to F1, further comprising a well region of the 1 st conductivity type formed in a region of the semiconductor layer along a bottom wall of the source trench, wherein the source electrode forms a schottky junction with the drift region at a depth position between the body region and the well region in a normal direction of the 1 st main surface of the semiconductor layer.

[F3] The semiconductor device according to F2, wherein the well region covers a bottom wall of the source trench.

[F4] The semiconductor device according to F2 or F3, wherein the well region is drawn from a bottom wall of the source trench in a lateral direction parallel to the 1 st main surface of the semiconductor layer.

[F5] In the semiconductor device according to any one of F2 to F4, the well region faces the body region with a partial region of the drift region therebetween in a normal direction of the 1 st main surface of the semiconductor layer.

[F6] In the semiconductor device according to F5, the source electrode forms a schottky junction with the drift region in a region of the semiconductor layer sandwiched between the body region and the well region in a direction normal to the 1 st main surface of the semiconductor layer.

[F7] The semiconductor device according to any one of F1 to F6, wherein the trench source structure includes a source insulating layer partially covering a sidewall of the source trench so that the semiconductor layer is exposed from the sidewall of the source trench, and the source electrode forms a schottky junction with the drift region exposed from the source insulating layer.

[F8] The semiconductor device according to F7, wherein the body region is exposed from a sidewall of the source trench, and the source insulating layer covers the body region exposed from the sidewall of the source trench.

[F9] The semiconductor device according to F7 or F8, wherein the source region is exposed from a sidewall of the source trench, and the source insulating layer covers the source region exposed from the sidewall of the source trench.

[F10] The semiconductor device according to any one of F7 to F9, wherein the source insulating layer covers a bottom wall of the source trench.

[F11] The semiconductor device according to any one of F7 to F10, wherein the source insulating layer covers corners of a connecting sidewall and a bottom wall of the source trench.

[F12] The semiconductor device according to any one of F1 to F11, wherein the FET structure includes a gate trench formed in the 1 st main surface of the semiconductor layer, the body region, the source region, and the drift region are exposed from an inner wall of the gate trench, and the gate electrode faces the body region, the source region, and the drift region in the gate trench with the gate insulating layer interposed therebetween.

[F13] The semiconductor device according to F12, comprising a plurality of the FET structures formed at intervals, wherein the trench source structure is formed in a region between a plurality of the FET structures adjacent to each other.

[F14] The semiconductor device according to F12 or F13, wherein the gate trench has a tapered shape whose opening width is narrower toward the 2 nd main surface side of the semiconductor layer, and the source trench has a tapered shape whose opening width is narrower toward the 2 nd main surface side of the semiconductor layer.

[F15] The semiconductor device according to any one of F1 to F14, wherein the gate electrode comprises conductive polysilicon, and the source electrode comprises at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, and tungsten.

[F16] The semiconductor device according to any one of F1 to F15, further comprising a main surface source electrode formed on the 1 st main surface of the semiconductor layer and electrically connected to the source region and the source electrode.

[F17] The semiconductor device according to F16, wherein the main-surface source electrode includes the same conductive material as the source electrode, and is formed integrally with the source electrode.

[F18] The semiconductor device according to any one of F1 to F17, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the source electrode forms a schottky junction with the high concentration region of the drift region.

[F19] The semiconductor device according to any one of F2 to F6, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the well region is formed in the high concentration region of the drift region.

[F20] The semiconductor device according to any one of F1 to F19, wherein the semiconductor layer contains SiC.

[G1] A semiconductor device, comprising: a semiconductor layer including a1 st main surface on one side and a2 nd main surface on the other side, the 1 st main surface having a source trench formed therein; a body region of the 1 st conductivity type formed on a surface layer portion of the 1 st main surface of the semiconductor layer, at a side of the source trench; a source region of the 2 nd conductivity type formed on a surface layer portion of the body region at a side of the source trench; a drift region of the 2 nd conductivity type formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the body region and exposed from an inner wall of the source trench; and a source electrode buried in the source trench and forming a schottky junction with the drift region.

According to this semiconductor device, a schottky barrier diode is formed between the drift region and the source electrode. In this semiconductor device, when a reverse bias voltage is applied, a current can preferentially flow into the schottky barrier diode. This can suppress the spread of crystal defects in the semiconductor layer due to the reverse bias voltage.

[G2] The semiconductor device according to G1, wherein the drift region is exposed from a sidewall of the source trench, and the source electrode forms a schottky junction with the drift region exposed from the sidewall of the source trench.

[G3] The semiconductor device according to G1 or G2, further comprising a well region of the 1 st conductivity type formed in a region of the semiconductor layer along a bottom wall of the source trench, wherein the source electrode forms a schottky junction with the drift region at a depth position between the body region and the well region in a normal direction of the 1 st main surface of the semiconductor layer.

[G4] The semiconductor device according to G3, wherein the well region covers a bottom wall of the source trench.

[G5] The semiconductor device according to G3 or G4, wherein the well region is drawn out from a bottom wall of the source trench in a lateral direction parallel to the 1 st main surface of the semiconductor layer.

[G6] In the semiconductor device according to any one of G3 to G5, the well region faces the body region with a partial region of the drift region therebetween in a normal direction of the 1 st main surface of the semiconductor layer.

[G7] The semiconductor device according to G6, wherein the source electrode forms a schottky junction with the drift region in a region of the semiconductor layer sandwiched between the body region and the well region in a direction normal to the 1 st main surface of the semiconductor layer.

[G8] The semiconductor device according to any one of G1 to G7, further comprising a source insulating layer partially covering a sidewall of the source trench so that the drift region is exposed from the sidewall of the source trench, wherein the source electrode forms a schottky junction with the drift region exposed from the source insulating layer.

[G9] The semiconductor device according to G8, wherein the body region is exposed from a sidewall of the source trench, and the source insulating layer covers the body region exposed from the sidewall of the source trench.

[G10] The semiconductor device according to G8 or G9, wherein the source region is exposed from a sidewall of the source trench, and the source insulating layer covers the source region exposed from the sidewall of the source trench.

[G11] The semiconductor device according to any one of G8 to G10, wherein the source insulating layer covers a bottom wall of the source trench.

[G12] The semiconductor device according to any one of G8 to G11, wherein the source insulating layer covers corners of a connecting sidewall and a bottom wall of the source trench.

[G13] The semiconductor device according to any one of G1 to G12, wherein the semiconductor layer includes a gate trench formed on the 1 st main surface at a distance from the source trench, and a gate electrode facing the body region and the source region with a gate insulating layer interposed therebetween is embedded in the gate trench.

[G14] The semiconductor device according to G13, wherein the gate trench has a tapered shape with a narrower opening width toward the 2 nd main surface side of the semiconductor layer, and the source trench has a tapered shape with a narrower opening width toward the 2 nd main surface side of the semiconductor layer.

[G15] The semiconductor device according to G13 or G14, wherein the gate electrode comprises conductive polysilicon, and the source electrode comprises at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, or tungsten.

[G16] The semiconductor device according to any one of G1 to G15, further comprising a main surface source electrode formed on the 1 st main surface of the semiconductor layer and electrically connected to the source region and the source electrode.

[G17] The semiconductor device according to G16, wherein the main surface source electrode comprises the same conductive material as the source electrode and is formed integrally with the source electrode.

[G18] The semiconductor device according to any one of G1 to G17, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the source electrode forms a schottky junction with the high concentration region of the drift region.

[G19] The semiconductor device according to any one of G3 to G7, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the well region is formed in the high concentration region of the drift region.

[G20] The semiconductor device according to any one of G1 to G19, wherein the semiconductor layer contains SiC.

[H1] A semiconductor device, comprising: a semiconductor layer including a1 st main surface on one side and a2 nd main surface on the other side, the 1 st main surface having a source trench formed therein; a body region of the 1 st conductivity type formed on a side of the source trench in a surface layer portion of the 1 st main surface of the semiconductor layer; a source region of the 2 nd conductivity type formed on a side of the source trench in a surface layer portion of the body region; a drift region of the 2 nd conductivity type formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the body region and exposed from a sidewall of the source trench; a source insulating layer covering the sidewall and the bottom wall of the source trench so that the sidewall of the source trench is partially exposed; and a source electrode buried in the source trench and forming a schottky junction with the drift region exposed from the source insulating layer.

According to this semiconductor device, a schottky barrier diode is formed between the drift region and the source electrode. In this semiconductor device, when a reverse bias voltage is applied, a current can preferentially flow into the schottky barrier diode. This can suppress the spread of crystal defects in the semiconductor layer due to the reverse bias voltage.

[H2] In the semiconductor device according to H1, the source insulating layer exposes a region of the semiconductor layer located on the 2 nd main surface side of the semiconductor layer with respect to the body region in a direction normal to the 1 st main surface of the semiconductor layer.

[H3] The semiconductor device according to H1 or H2, wherein the source insulating layer covers corners of the connecting sidewalls and the bottom wall of the source trench.

[H4] The semiconductor device according to any one of H1 to H3, wherein the body region is exposed from a sidewall of the source trench, and the source insulating layer covers the body region exposed from the sidewall of the source trench.

[H5] The semiconductor device according to any one of H1 to H4, wherein the source region is exposed from a sidewall of the source trench, and the source insulating layer covers the source region exposed from the sidewall of the source trench.

[H6] The semiconductor device according to any one of H1 to H5, further comprising a well region of the 1 st conductivity type formed in a region of the semiconductor layer along a bottom wall of the source trench, wherein the source electrode forms a schottky junction with the drift region at a depth position between the body region and the well region in a normal direction of the 1 st main surface of the semiconductor layer.

[H7] The semiconductor device according to H6, wherein the well region covers a bottom wall of the source trench.

[H8] The semiconductor device according to H6 or H7, wherein the well region is drawn from a bottom wall of the source trench in a lateral direction parallel to the 1 st main surface of the semiconductor layer.

[H9] In the semiconductor device according to any one of H6 to H8, the well region faces the body region with a partial region of the drift region therebetween in a normal direction of the 1 st main surface of the semiconductor layer.

[H10] In the semiconductor device according to H9, the source electrode forms a schottky junction with the drift region in a region of the semiconductor layer sandwiched between the body region and the well region in a direction normal to the 1 st main surface of the semiconductor layer.

[H11] The semiconductor device according to any one of H1 to H10, wherein the semiconductor layer includes a gate trench formed in the 1 st main surface so as to be spaced apart from the source trench, and a gate electrode facing the body region and the source region with a gate insulating layer interposed therebetween is embedded in the gate trench.

[H12] The semiconductor device according to H11, wherein the gate trench has a tapered shape with a narrower opening width toward the 2 nd main surface of the semiconductor layer, and the source trench has a tapered shape with a narrower opening width toward the 2 nd main surface of the semiconductor layer.

[H13] The semiconductor device according to H11 or H12, wherein the gate electrode comprises conductive polysilicon, and the source electrode comprises at least one of conductive polysilicon, titanium, nickel, copper, aluminum, silver, gold, titanium nitride, or tungsten.

[H14] The semiconductor device according to any one of H1 to H13, further comprising a main surface source electrode formed on the 1 st main surface of the semiconductor layer and electrically connected to the source region and the source electrode.

[H15] The semiconductor device according to H14, wherein the main-surface source electrode includes the same conductive material as the source electrode, and is formed integrally with the source electrode.

[H16] The semiconductor device according to any one of H1 to H15, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the source electrode forms a schottky junction with the high concentration region of the drift region.

[H17] The semiconductor device according to any one of H6 to H10, wherein the drift region includes: a high concentration region formed in a region of the semiconductor layer on the 1 st principal surface side; and a low concentration region formed in a region of the semiconductor layer on the 2 nd main surface side with respect to the high concentration region, wherein the source trench is formed in the high concentration region of the drift region, and the well region is formed in the high concentration region of the drift region.

[H18] The semiconductor device according to any one of H1 to H17, wherein the semiconductor layer contains SiC.

[I1] A semiconductor device, comprising: a semiconductor layer having a first main surface 1 and a second main surface 2, the first main surface defining a mesa-shaped active mesa having an active main surface and an active sidewall; a step relaxation structure for relaxing a step formed on the 1 st main surface of the semiconductor layer by the active mesa; and a covering layer covering the step relaxing structure and extending from above the active principal surface toward a region outside the active platform.

[I2] A semiconductor device, comprising: a semiconductor layer having a1 st main surface on one side and a2 nd main surface on the other side, and having a mesa-shaped active mesa having an active main surface and an active sidewall on the 1 st main surface, and an outer region formed in a region on the 2 nd main surface side with respect to the active main surface so as to partition the active mesa; a step alleviation structure formed in the outer region to alleviate a step formed between the active mesa and the outer region; and a covering layer covering the step relaxing structure and extending from the active mesa to the outer region.

[I3] I1 the semiconductor device according to item I2, wherein the step-relaxing structure has an inclined portion inclined downward from the active main surface toward the 2 nd main surface side of the semiconductor layer.

[I4] The semiconductor device according to any one of I1 to I3, wherein the step relaxing structure is formed by a side wall covering the active side wall.

[I5] The semiconductor device according to any one of I1 to I4, wherein a semiconductor element is formed on the active main surface of the active mesa.

[I6] In the Semiconductor device according to I5, the Semiconductor element is a misfet (metal Insulator Semiconductor Field Effect transistor).

[I7] A SiC semiconductor device comprising: a SiC semiconductor layer having a1 st main surface on one side and a2 nd main surface on the other side, and defining a mesa-shaped active mesa having an active main surface and an active sidewall on the 1 st main surface; a step relaxation structure for relaxing a step formed on the 1 st main surface of the semiconductor layer by the active mesa; and a covering layer covering the step relaxing structure and extending from above the active principal surface toward a region outside the active platform.

[I8] A SiC semiconductor device comprising: a SiC semiconductor layer having a1 st main surface on one side and a2 nd main surface on the other side, and having a mesa-shaped active mesa having an active main surface and an active sidewall on the 1 st main surface, and an outer region of a region formed on the 2 nd main surface side with respect to the active main surface so as to partition the active mesa; a step alleviation structure formed in the outer region to alleviate a step formed between the active mesa and the outer region; and a covering layer covering the step relaxing structure and extending from the active mesa to the outer region.

[I9] The SiC semiconductor device according to I7 or I8, wherein the step relaxing structure has an inclined portion that is inclined downward from the active main surface toward the 2 nd main surface side of the semiconductor layer.

[I10] The SiC semiconductor device according to any one of I7 to I9, wherein the step relaxing structure is formed by a side wall covering the active side wall.

[I11] The SiC semiconductor device according to any one of I7 to I10, wherein a semiconductor element is formed on the active main surface of the active mesa.

[I12] In the SiC Semiconductor device according to I11, the Semiconductor element is a misfet (metal Insulator Semiconductor Field Effect transistor).

The above-mentioned [ a1] to [ a21], the above-mentioned [ B1] to [ B24], the above-mentioned [ C1] to [ C17], the above-mentioned [ D1] to [ D14], the above-mentioned [ E1] to [ E24], the above-mentioned [ F1] to [ F20], the above-mentioned [ G1] to [ G20], the above-mentioned [ H1] to [ H18], and the above-mentioned [ I1] to [ I12] may be combined in an arbitrary manner.

This application corresponds to Japanese patent application No. 2017-098423, published to the Homelan patent office on day 5 and 17 in 2017, Japanese patent application No. 2018-042133, published to the Homelan patent office on day 3 and 8 in 2018, Japanese patent application No. 2018-094956, published to the Homelan patent office on day 16 in month 5 in 2018, and Japanese patent application No. 2018-094957, published to the Homelan patent office on day 16 in month 5 in 2018, the entire disclosures of which are incorporated herein by reference.

Although the embodiments of the present invention have been described in detail, these are merely specific examples for clarifying the technical content of the present invention, and the present invention should not be construed as limited to these specific examples, and the scope of the present invention is defined only by the appended claims.

Description of the symbols

1-a semiconductor device, 2-a SiC semiconductor layer, 3-a first main surface of the SiC semiconductor layer, 1a second main surface of the SiC semiconductor layer, 7-a drain electrode, 10-a trench gate structure, 11-a trench source structure, 12-a gate trench, 13-a gate insulating layer, 14-a gate electrode layer, 15-a first side wall of the gate trench, 16-a first bottom wall of the gate trench, 18-a source trench, 19-a barrier formation layer, 20-a source electrode layer, 21-a deep well region, 22-a second side wall of the source trench, 23-a second bottom wall of the source trench, 24-a first wall of the second side wall, 25-a second wall of the second side wall, 26-a corner of the source trench, 27-a first region of the deep well region, 28-a second region of the deep well region, 30-a body region, 31-a source region, 32-a contact region, 46-a depletion layer, 51-a semiconductor device, 61-a semiconductor device, 71-a semiconductor device, 81-a semiconductor device, 91-a semiconductor device, 101-a semiconductor device, 171-a semiconductor device, 181-a semiconductor device, 191-a semiconductor device, 201-a semiconductor device, 211-a semiconductor device, 221-a semiconductor device, 231-a semiconductor device, 241-a semiconductor device, 251-a semiconductor device, 261-a semiconductor device, 271-a semiconductor device, 281-a semiconductor device, 291-a semiconductor device, 301-a semiconductor device, 311-a semiconductor device, 351-a semiconductor device, 361-a semiconductor device, 371-a semiconductor device, 401-a semiconductor device, 631-a semiconductor device, 651-a semiconductor device, 661-a semiconductor device, 671-a semiconductor device, 691-a semiconductor device, 711-a semiconductor device, 721-a semiconductor device, 705-a semiconductor device, 751-a semiconductor device, 752-a semiconductor device, 761-a semiconductor device, 762-a semiconductor device, 771-a semiconductor device, 783-a semiconductor device, 790-a semiconductor device, 791-a semiconductor device, 801-a semiconductor device, 811-a semiconductor device.