阅读说明：本技术 采用非侵入方式测量电气设备内部温度的方法及系统 (Method and system for measuring internal temperature of electrical equipment in non-invasive manner ) 是由 罗远荣 刘晓 王少华 段宜廷 杨强 张裕汉 于 2019-09-19 设计创作，主要内容包括：本发明涉及一种采用非侵入方式测量电气设备内部温度的方法及系统。所述方法包括于所述电气设备的表面涂敷一层碳素材料；获取经所述碳素材料涂覆后的电气设备表面发射的红外辐射能量；对所述红外辐射能量进行处理、分析以获取所述电气设备内部的温度。上述采用非侵入方式测量电气设备内部温度的方法,通过在电气设备的表面涂敷一层碳素材料,使得电气设备表面的发射率增加,然后再获取经过所述碳素材料涂敷后的电气设备表面发射的红外辐射能量,并对获取到的红外辐射能量进行处理、分析,一方面,本申请不必深入电气设备的内部,另一方面,通过对所述红外辐射能量进行处理、分析再获取到所述电气设备内部的温度,可以使得获得的温度更加准确。(The invention relates to a method and a system for measuring the internal temperature of electrical equipment in a non-invasive manner. The method comprises the steps of coating a layer of carbon material on the surface of the electrical equipment; acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material; and processing and analyzing the infrared radiation energy to obtain the temperature inside the electrical equipment. According to the method for measuring the internal temperature of the electrical equipment in the non-invasive mode, the surface of the electrical equipment is coated with the layer of carbon material, so that the emissivity of the surface of the electrical equipment is increased, then the infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material is obtained, and the obtained infrared radiation energy is processed and analyzed.)

1. A method for non-invasively measuring the internal temperature of an electrical device, the method comprising:

coating a layer of carbon material on the surface of the electrical equipment;

acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material;

and processing and analyzing the infrared radiation energy to obtain the temperature inside the electrical equipment.

2. The method for non-invasively measuring the internal temperature of an electrical device of claim 1, further comprising:

focusing the infrared radiation energy emitted from the surface of the electrical equipment;

and filtering out the focused stray light in the infrared radiation energy.

3. The method of non-invasive measurement of the internal temperature of an electrical device according to claim 2, wherein said step of processing and analyzing said infrared radiant energy to obtain the internal temperature of said electrical device comprises:

acquiring temperature data corresponding to the infrared radiation energy after focusing and filtering;

carrying out temperature compensation and data correction processing on the temperature data;

and taking the processed temperature data as the temperature inside the electrical equipment.

4. The method for non-invasively measuring the internal temperature of an electrical device of claim 1, further comprising:

and judging whether the temperature in the electrical equipment exceeds a first preset threshold value or not, and outputting a first warning signal in response to the fact that the temperature does not exceed the first preset threshold value.

5. The method of non-invasively measuring the internal temperature of an electrical device of claim 4, further comprising:

responding to the fact that the temperature exceeds the first preset threshold value, and then judging whether the temperature exceeds a second preset threshold value; wherein the second preset threshold is greater than the first preset threshold;

and responding to the temperature exceeding the second preset threshold value, and outputting a second warning signal.

6. The method for non-invasively measuring the internal temperature of an electrical device of claim 5, further comprising:

and sending the temperature data exceeding the second preset threshold value to terminal equipment of operation and maintenance personnel within a preset time interval.

7. A system for non-invasively measuring the internal temperature of an electrical device, wherein the surface of the electrical device is coated with a layer of carbon material; the system comprises:

the photoelectric detection unit is used for acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material and converting the infrared radiation energy into corresponding electric signals;

and the processor is electrically connected with the photoelectric detection unit and used for processing and analyzing the electric signals to acquire temperature data corresponding to the electric signals.

8. The system of claim 7, further comprising:

and the optical unit is arranged between the electrical equipment and the photoelectric detection unit and used for focusing the infrared radiation energy emitted from the surface of the electrical equipment and filtering out the focused stray light in the infrared radiation energy.

9. The system of claim 7, further comprising:

and the driving unit is fixedly connected with the photoelectric detection unit and is used for driving the photoelectric detection unit to rotate along a preset direction so as to scan the infrared radiation energy emitted by the electrical equipment.

10. The system of claim 7, wherein the processor is further configured to issue an alert signal when a temperature inside the electrical device exceeds a preset threshold; the system further comprises:

and the warning unit is connected with the processor and used for receiving and responding to the warning signal and generating a visual and/or auditory warning signal.

Technical Field

The invention relates to the technical field of power equipment, in particular to a method and a system for measuring the internal temperature of electrical equipment in a non-invasive mode.

Background

The common thermal fault of the switch cabinet in the power supply industry is caused by the fact that the contact resistance is increased due to a plurality of factors such as long-time heavy-load operation of a high-voltage switch, loosening of a joint, aging of a contact, insufficient pressure of a contact surface and the like, and the temperature of the contact is further increased. The damage of the equipment caused by the thermal fault affects the life of people and the normal production of enterprises, and certain economic loss and negative influence are caused to power supply companies. The structure environment is complicated in the cubical switchboard, is not convenient for the trouble seek, still wastes a large amount of manpower, material resources.

The temperature measuring means commonly adopted in the domestic transformer substation at present are a temperature indicating color changing wax sheet method, an infrared temperature measuring method and a contact type temperature measuring resistance method. The temperature measurement error of the temperature indicating color changing wax sheet method is large, the practicability is poor, and the infrared temperature measurement method cannot monitor the high temperature in the equipment through the equipment shell; the contact temperature measuring resistance method adopted in the equipment has the problems of high voltage isolation and overheating temperature of temperature measuring devices, and the practicability is poor. The limitations of the above approaches become more and more apparent as voltage levels increase and electrical loads increase year by year.

Disclosure of Invention

In view of the above, it is desirable to provide a method and system for measuring the internal temperature of an electrical device in a non-invasive manner.

A method of non-invasively measuring the internal temperature of an electrical device, the method comprising:

coating a layer of carbon material on the surface of the electrical equipment;

acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material;

and processing and analyzing the infrared radiation energy to obtain the temperature inside the electrical equipment.

In one embodiment, the method further comprises:

focusing the infrared radiation energy emitted from the surface of the electrical equipment;

and filtering out the focused stray light in the infrared radiation energy.

In one embodiment, the step of processing and analyzing the infrared radiant energy to obtain the temperature inside the electrical device includes:

acquiring temperature data corresponding to the infrared radiation energy after focusing and filtering;

carrying out temperature compensation and data correction processing on the temperature data;

and taking the processed temperature data as the temperature inside the electrical equipment.

In one embodiment, the method for measuring the internal temperature of the electrical device in a non-invasive manner further includes:

and judging whether the temperature in the electrical equipment exceeds a first preset threshold value or not, and outputting a first warning signal in response to the fact that the temperature does not exceed the first preset threshold value.

In one embodiment, the method for measuring the internal temperature of the electrical device in a non-invasive manner further includes:

responding to the fact that the temperature exceeds the first preset threshold value, and then judging whether the temperature exceeds a second preset threshold value; wherein the second preset threshold is greater than the first preset threshold;

and responding to the temperature exceeding the second preset threshold value, and outputting a second warning signal.

In one embodiment, the method for measuring the internal temperature of the electrical device in a non-invasive manner further includes:

and sending the temperature data exceeding the second preset threshold value to terminal equipment of operation and maintenance personnel within a preset time interval.

Based on the same inventive concept, the application also provides a system for measuring the internal temperature of the electrical equipment in a non-invasive mode, wherein the surface of the electrical equipment is coated with a layer of carbon material; the system comprises:

the photoelectric detection unit is used for acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material and converting the infrared radiation energy into corresponding electric signals;

and the processor is electrically connected with the photoelectric detection unit and used for processing and analyzing the electric signals to acquire temperature data corresponding to the electric signals.

In one embodiment, the system further comprises:

and the optical unit is arranged between the electrical equipment and the photoelectric detection unit and used for focusing the infrared radiation energy emitted from the surface of the electrical equipment and filtering out the focused stray light in the infrared radiation energy.

In one embodiment, the system further comprises:

and the driving unit is fixedly connected with the photoelectric detection unit and is used for driving the photoelectric detection unit to rotate along a preset direction so as to scan the infrared radiation energy emitted by the electrical equipment.

In one embodiment, the processor is further configured to issue an alert signal when the temperature inside the electrical device exceeds a preset threshold; the system further comprises:

and the warning unit is connected with the processor and used for receiving and responding to the warning signal and generating a visual and/or auditory warning signal.

According to the method and the system for measuring the internal temperature of the electrical equipment in the non-invasive mode, the surface of the electrical equipment is coated with the layer of carbon material, so that the surface emissivity of the electrical equipment is increased, then the infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material is obtained, and the obtained infrared radiation energy is processed and analyzed.

Drawings

FIG. 1 is a schematic flow chart illustrating a method for non-invasively measuring an internal temperature of an electrical device, in one embodiment;

FIG. 2 is a schematic flow chart illustrating a method for non-invasively measuring the internal temperature of an electrical device in another embodiment;

FIG. 3 is a flowchart illustrating a sub-step of step S106 in FIG. 1;

FIG. 4 is a schematic diagram of a system for non-invasively measuring the internal temperature of an electrical device, in accordance with an embodiment;

fig. 5 is a schematic structural diagram of a photoelectric detection unit in an embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring first to fig. 4, as shown in fig. 4, the present application provides a system for measuring the internal temperature of an electrical apparatus in a non-invasive manner, wherein a surface of the electrical apparatus 10 is coated with a layer of carbon material 102; the system may comprise a photo detection unit 20 and a processor 30; the photoelectric detection unit 20 is used for acquiring infrared radiation energy emitted by the surface of the electrical equipment 10 coated by the carbon material 102 and converting the infrared radiation energy into a corresponding electric signal; the processor 30 is electrically connected to the photodetection unit 20, and is configured to process and analyze the electrical signal to obtain temperature data corresponding to the electrical signal.

Specifically, the electrical device 10 of the present application may be a switch cabinet in the power supply industry, after being coated with a carbon material, the electric field distribution inside the switch cabinet may not be changed, and meanwhile, the surface of the switch cabinet after being coated with the carbon material also has a high emissivity. The photoelectric detection unit 20 of the present application may specifically be an infrared detector, and the model of the infrared detector may be an MLX90614 non-contact infrared temperature sensing chip, the temperature measurement range of the chip is-40 ℃ to 125 ℃, and meanwhile, an advanced low noise amplifier is further disposed in the MLX90614 non-contact infrared temperature sensing chip.

In order to enable the infrared radiation emitted from the surface of the electrical device 10 to be detected as much as possible, a layer of carbon material 102 is coated on the surface of the electrical device 10, so that the surface of the electrical device 10 has a high emissivity, and the infrared energy emitted from the coated electrical device 10 is detected and received by the photoelectric detection unit 20. Meanwhile, the infrared energy radiated by each part of the electrical equipment 10 is combined to obtain the infrared energy distribution pattern radiated by the electrical equipment 10, and an infrared thermal image about the infrared energy distribution on the surface of the electrical equipment 10 can be obtained after the receiving of the photoelectric detection unit 20 and the processing and analysis of the processor 30, and the thermal image corresponds to the thermal distribution field on the surface of the electrical equipment 10, so that the temperature anomaly point in the electrical equipment 10 can be accurately found by the method, and the temperature detection of each component in the electrical equipment 10 is realized.

To sum up, the system of this application has been guaranteed the effect of temperature measurement on the one hand, has compensatied the too high shortcoming of thermal imaging cost simultaneously again, and is more economical, simple to operate, is applicable to new cubical switchboard and dispatches from the factory the installation or to old cubical switchboard transformation, can practice thrift huge expense under the prerequisite of ensureing equipment safe operation.

Generally, all objects above absolute zero (-273 ℃) emit infrared radiation, but the nature of the object and the material covered on the surface of the object can cause the infrared radiation emitted by the object to be not easy to detect, and further cause inaccurate measured temperature; in the conventional method, the distance between the optical detection unit and the object to be measured is usually adjusted, and precisely, the distance between the probe in the optical detection unit and the object to be measured is adjusted, because the distance between the probe and the object to be measured is directly related to the diameter of the measurement shift, it is required to ensure that the object to be measured is larger than the size of the dot measured by the photoelectric detection unit, and the smaller the object to be measured is, the closer the object to be measured should be.

Specifically, referring to fig. 5, a schematic structural diagram of the photodetecting unit 20 in an embodiment is shown. The photo detection unit 20 may include an optical filter 210, a black body 220, a photo sensor chip 230 and an ambient temperature sensor 240 integrated on a base (not shown); the optical filter 210 is mainly disposed on a side of the light-sensing chip 230 receiving light, that is, a light-incident side, and the optical filter 210 may be a silicon-based optical filter; the black body 220 is mainly used for providing emissivity reference, so that the temperature inside the electrical device 10 can be obtained more accurately through the obtained infrared radiation energy; a light sensing chip 230 disposed on the base around the black body 220, and mainly configured to receive the optical signal filtered by the optical filter 210 and convert the optical signal into a corresponding electrical signal; the ambient temperature sensor 240 is primarily used to obtain the temperature in the environment, which may be used in subsequent data processing to obtain more accurate temperature data.

In one embodiment, with continuing reference to fig. 4, in order to enable the electrical device 10 to emit infrared radiation energy to be detected by the photodetecting unit 20 as much as possible, the system of the present application further includes an optical unit 40 disposed between the photodetecting unit 20 and the electrical device 10, where the optical unit 40 is configured to focus the infrared radiation energy emitted from the surface of the electrical device 10 and filter stray light in the focused infrared radiation energy. The optical unit 40 may be a transparent mirror, which can focus the infrared radiation energy of the target in its field of view. The arrangement of the optical unit 40 is specifically designed mainly depending on the distance of the probe in the photodetection unit 20 to the electrical device 10. The stray light can be visible light and near infrared light, correspondingly, the stray light to be filtered by the optical unit 40 is visible light and near infrared light, the influence of an external non-target light source on a measurement result can be reduced, according to an infrared thermal phase rule, the internal temperature of the electrical equipment 10 is combined, the actual interval of the temperature detected by the photoelectric detection unit 20 is within 300 ℃, the frequency range of the detected light can be 8-141 mu m, the spectrum of the waveband can effectively avoid the attenuation of atmospheric dust and water vapor in infrared transmission, and the photoelectric detection unit 20 has strong-purposed infrared radiation detection capability.

Further, the processing and analyzing of the electrical signal by the processor 30 may be to convert the electrical signal transmitted by the photodetection unit 20 into temperature data, perform attenuation compensation on the temperature data according to the ambient temperature and the optical device (optical unit, photodetection unit), and perform data correction according to the emissivity of the electrical device 10 and the transmittance of the optical unit 40, so as to improve the accuracy of temperature output and reduce the external interference.

In order to ensure that the photodetecting unit 20 can detect more infrared radiation energy emitted by the electrical device 10, the system of the present application is further provided with a driving unit 50, the photodetecting unit 20 is fixedly disposed on the driving unit 50, and the driving unit 50 is configured to drive the photodetecting unit 20 to rotate along a preset direction to scan the infrared radiation energy emitted by the electrical device 10. Specifically, considering that the electrical apparatus 10 is a switch cabinet having a certain length, width and height, the driving unit 50 of the present application can drive the photodetecting unit 20 to rotate along the height direction of the switch cabinet, wherein the rotation range of the driving unit 50 is 180 °. It is understood that the photodetecting unit 20 of the present application may be disposed at a plurality of positions of the electrical device 10 in order to enable the temperatures of the various elements inside the electrical device 10 to be detected and collected.

In one embodiment, with continued reference to fig. 4, the processor 30 is further configured to issue an alarm signal when the temperature inside the electrical device 10 exceeds a preset threshold; the system may further comprise an alert unit 60 coupled to the processor 30 for receiving and generating a visual and/or audible alert signal in response to the alert signal; that is to say, after receiving the warning signal, the warning unit 60 may generate only a visual warning signal, may generate only an audible warning signal, and may also generate both the visual warning signal and the audible warning signal, and accordingly, the warning unit 60 may be an audio output device (e.g., a speaker) capable of generating the audible warning signal, may be a display unit (e.g., an LED, an LCD, etc.) capable of generating the visual warning signal, and may be a unit that includes both the audio output device (e.g., the speaker) and the display unit (e.g., the LED, the LCD, etc.); in this embodiment, the warning unit 60 is a unit having both an audio output device (e.g., a speaker) and a display unit (e.g., an LED, an LCD, etc.), wherein the display unit may be an LED (light emitting diode) displaying multiple colors, and the audio output device may be a buzzer.

Specifically, the processor 30 may be internally provided with two temperature limit values T1 and T2, wherein T1 < T2, and the temperature of the electrical apparatus 10 acquired by the processor 30 is denoted as T, from which three temperature states can be divided, namely: when the temperature T is less than or equal to T1, it is determined as a normal temperature, and at this time, the processor 30 may output a first warning signal, and under the action of the first warning signal, the green light of the warning unit 60 is on, and the buzzer does not sound; when T > T2 and it is determined that the temperature is seriously high, the processor 30 may output a second warning signal, and under the action of the second warning signal, the red light in the warning unit 60 is on and the buzzer sounds; further, when T is more than T1 and less than or equal to T2, the temperature is judged to be abnormally high, at the moment, a yellow lamp in the warning unit 60 is turned on, and a buzzer sounds;

furthermore, in order to facilitate the operation and maintenance personnel to grasp the situation, the processor 30 may further send an alarm short message to the terminal device of the operation and maintenance personnel at intervals of time t through the wireless transmission network.

In one embodiment, it can be known from the foregoing description that the system of the present application can be applied to factory installation of a new switch cabinet or modification of an old switch cabinet, so that, in order to make the modification more successful, the whole system can be firstly debugged in an early operation. Specifically, during operation and debugging, a temperature calibrator MX824-J can be used for simulating high temperature generation to check the temperature measurement accuracy and alarm condition of the system.

Although not shown, the system of the present application may further include a circuit for amplifying and filtering the electrical signal converted by the photoelectric detection unit, which is not described in detail herein.

Fig. 1 is a schematic flow chart illustrating a method for measuring an internal temperature of an electrical device in a non-invasive manner according to an embodiment. The method may be based on the system for non-invasively measuring the internal temperature of the electrical device as described above, with reference to fig. 4, and may include steps S102-S106.

Step S102, coating a layer of carbon material on the surface of the electrical equipment.

Specifically, the electrical device 10 may be a switch cabinet in the power supply industry, after being coated with the carbon material 102, the electric field distribution inside the switch cabinet is not changed, and meanwhile, the surface of the switch cabinet coated with the carbon material also has high emissivity, and it can be understood that the coating layer coated on the surface of the switch cabinet may also be other special materials capable of making the surface of the switch cabinet have high emissivity.

And step S104, acquiring infrared radiation energy emitted by the surface of the electrical equipment coated with the carbon material.

Specifically, the infrared radiation energy emitted from the surface of the electrical apparatus 10 coated with the carbon material can be obtained by the aforementioned optical unit 40 and the photodetection unit.

And S106, processing and analyzing the infrared radiation energy to obtain the temperature inside the electrical equipment.

In particular, the method for non-invasively measuring the internal temperature of an electrical device may further comprise sub-steps S202-S204.

Step S202, focusing the infrared radiation energy emitted from the surface of the electrical equipment.

Step S204, stray light in the focused infrared radiation energy is filtered.

Specifically, the optical unit 40 (light-transmitting mirror) can be used for focusing the infrared radiation energy emitted from the surface of the electrical device 10 and filtering out the stray light in the focused infrared radiation energy. The optical unit 40 may be a transparent mirror, which can focus the infrared radiation energy of the target in its field of view. The arrangement of the optical unit 40 is specifically designed mainly depending on the distance of the probe in the photodetection unit 20 to the electrical device 10. The stray light may be visible light or near infrared light, and accordingly, the stray light to be filtered by the optical unit 40 is visible light or near infrared light, so that the influence of an external non-target light source on a measurement result can be reduced.

Further, the step S106 may include steps S302-S306.

Step S302, temperature data corresponding to the infrared radiation energy after focusing and filtering are obtained.

And step S304, performing temperature compensation and data correction processing on the temperature data.

And step S306, taking the processed temperature data as the internal temperature of the electrical equipment.

Specifically, the focused and filtered infrared radiation energy may be converted into an electrical signal by the photodetection unit 20, then the electrical signal transmitted by the photodetection unit 20 is converted into temperature data by the processor 30, then the temperature data is subjected to attenuation compensation of the ambient temperature and the optical device (optical unit, photodetection unit), and then data correction is performed according to the emissivity of the electrical device 10 and the transmittance of the optical unit 40, so as to improve the accuracy of temperature output and reduce external interference, and finally the processor 30 takes the temperature data subjected to attenuation compensation and data correction as the temperature inside the electrical device 10.

In one embodiment, the method may further comprise the steps of:

and judging whether the temperature in the electrical equipment exceeds a first preset threshold value or not, and outputting a first warning signal in response to the fact that the temperature does not exceed the first preset threshold value.

Specifically, a first preset threshold T1 may be set inside the processor 30, the temperature of the electrical device 10 obtained by the processor 30 is recorded as T, and when the temperature T is less than or equal to the first preset threshold T1, the temperature is determined to be a normal temperature, at this time, the processor 30 may output a first warning signal, and under the effect of the first warning signal, the green light of the warning unit 60 is turned on, and the buzzer does not sound.

Further, the method may further comprise the step of:

responding to the fact that the temperature exceeds the first preset threshold value, and then judging whether the temperature exceeds a second preset threshold value; wherein the second preset threshold is greater than the first preset threshold;

and responding to the temperature exceeding the second preset threshold value, and outputting a second warning signal.

Specifically, the processor 30 may further have a second preset threshold T2 disposed therein, wherein the second preset threshold T2 is greater than the first preset threshold T1; when T is greater than T2, it is determined that the temperature is seriously high, and at this time, the processor 30 may output a second warning signal, under the action of which the red light in the warning unit 60 is on and the buzzer sounds; further, when T is more than T1 and less than or equal to T2, the temperature is judged to be abnormally high, at the moment, a yellow lamp in the warning unit 60 is turned on, and a buzzer sounds.

Still further, the method may further comprise the step of:

and sending the temperature data exceeding the second preset threshold value to terminal equipment of operation and maintenance personnel within a preset time interval.

Specifically, in order to facilitate the operation and maintenance personnel to grasp the situation, the processor 30 may further send an alarm short message to the terminal device of the operation and maintenance personnel at intervals of time t through the wireless transmission network. The terminal device can be a smart phone, a tablet computer, a desktop computer and the like.

In summary, the method ensures the effect of temperature measurement, overcomes the defect of overhigh thermal imaging cost, is economic and convenient to install, is suitable for factory installation of new switch cabinets or transformation of old switch cabinets, and can save huge cost on the premise of ensuring safe operation of equipment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.