Gold plating method, system, readable storage medium and computer equipment
阅读说明：本技术 一种镀金方法、系统、可读存储介质及计算机设备 (Gold plating method, system, readable storage medium and computer equipment ) 是由 王林波 于 2021-09-24 设计创作，主要内容包括：本发明提供一种镀金方法、系统、可读存储介质及计算机设备,方法包括当获取到待加工产品的镀金任务时,获取待加工产品的产品信息,产品信息至少包括产品种类、待加工数量以及与产品种类对应的产品参数；在预设的产品数据库中查找与产品种类对应的产品类型；将产品类型及产品参数输入至预设的镀金数据库中,得到对应的镀金参数及镀金效率参数；根据镀金参数、镀金效率参数以及待加工数量计算镀金任务所需要的镀金时间。本发明通过设置产品数据库及镀金数据库,获取产品类型,选择最佳镀金电流参数及镀金效率参数,计算出对应的镀金时间,无需对产品的镀金过程进行多次称重,达到最佳的镀金效果,减小镀金损失；减小镀金误差率,提升产品质量。(The invention provides a gold plating method, a system, a readable storage medium and computer equipment, wherein the method comprises the steps of obtaining product information of a product to be processed when a gold plating task of the product to be processed is obtained, wherein the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types; searching a product type corresponding to the product type in a preset product database; inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters; and calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed. According to the invention, the product database and the gold plating database are arranged to obtain the product type, the optimal gold plating current parameter and gold plating efficiency parameter are selected, the corresponding gold plating time is calculated, the product is not required to be weighed for multiple times in the gold plating process, the optimal gold plating effect is achieved, and the gold plating loss is reduced; reduce the gold plating error rate and improve the product quality.)
1. A gold plating method, characterized by comprising:
when a gold plating task of a product to be processed is obtained, obtaining product information of the product to be processed, wherein the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
searching a preset product database for a product type corresponding to the product type;
inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
and carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
2. The gold plating method of claim 1, wherein prior to searching a preset product database for a product type corresponding to the product type, the method further comprises:
obtaining product types and product names of a plurality of products;
dividing a number of said products into product types according to physical external shape or individual surface area or total volume of the same said product type;
acquiring the types of a plurality of gold plating tools;
and associating the product type, the product name and the appliance type with the product type, and constructing a corresponding product database.
3. The gold plating method of claim 2, wherein the inputting of the product type and the product parameters into a predetermined gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters comprises:
when the product type of the product to be processed belongs to any one of the product types, inputting the corresponding product type into the gold plating database to obtain corresponding gold plating current and gold plating efficiency;
and calculating gold plating parameters according to the gold plating current and the product parameters.
4. The gold plating method according to claim 3, wherein after the step of performing the gold plating operation on the product to be processed according to the gold plating time and the gold plating parameter, the method further comprises:
after a preset time, calculating the weight of the product which is subjected to the gold plating operation in the gold plating task;
calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
recalculating the gold plating time according to the remaining weight of the gold plating task;
and continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time.
5. The gold plating method according to claim 4, wherein after the step of continuing the gold plating operation on the remaining products of the products to be processed in accordance with the gold plating time, the method further comprises:
and when the gold plating operation is completely finished, storing the gold plating record file of the whole gold plating operation.
6. A gold plating system, comprising:
the device comprises a first acquisition module, a second acquisition module and a third acquisition module, wherein the first acquisition module is used for acquiring product information of a product to be processed when a gold plating task of the product to be processed is acquired, and the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
the searching module is used for searching a product type corresponding to the product type in a preset product database;
the input module is used for inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
the processing module is used for calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
and the first control module is used for carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
7. The gold plating system of claim 6, further comprising:
the second acquisition module is used for acquiring product types and product names of a plurality of products;
the dividing module is used for dividing a plurality of products into product types according to physical external shapes, single surface areas or total volumes of the same product type;
the third acquisition module is used for acquiring the appliance types of the plurality of gold-plating appliances;
and the construction module is used for associating the product type, the product name and the appliance type with the product type and constructing a corresponding product database.
8. The gold plating system of claim 6, further comprising:
the first calculating module is used for calculating the weight of a product which is subjected to gold plating operation in the gold plating task after a preset time;
the second calculation module is used for calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
a third calculation module for recalculating the gold plating time based on the remaining weight of the gold plating job;
and the second control module is used for continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time.
9. A readable storage medium on which a computer program is stored, the computer program, when being executed by a processor, implementing a gold plating method according to any one of claims 1 to 5.
10. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor when executing the computer program implements the gold plating method of any of claims 1 to 5.
Technical Field
The invention relates to the technical field of surface treatment, in particular to a gold plating method, a gold plating system, a readable storage medium and computer equipment.
Background
Gold plating has been known for over two hundred years. The gold plating layer has golden yellow appearance, good chemical stability, discoloration resistance, conductivity, corrosion resistance and oxidation resistance, good weldability, low contact resistance and excellent hot-pressing bonding performance, so that the electroplated gold plating layer can be used as a decorative plating layer and a functional and protective plating layer. Therefore, the electrogilding is widely applied to the industrial fields of jewelry, clocks, artware, electronic instruments, aviation, aerospace and the like.
The traditional 3D hard gold production method adopts simple equipment such as a rectifier, a gold plating groove and a hanging cage, and a master worker manually operates according to work experience. The specific operation procedures are as follows: the estimated current is set by the users according to the type, specification and quantity of the products, the color of the products is continuously observed, whether the current is proper or not is judged, and the current is adjusted at any time; after a period of estimated electroplating, taking out the products, weighing one by one, and regarding the products as finished products if the weights are basically qualified; and (4) returning to the original place to continue electroplating when the weight is unqualified, taking out the product to re-weigh after the master worker estimates the electroplating for a period of time again, repeating the work content of the first weighing, and so on until the complete product is plated. The production of all products generally needs to be weighed for about four times, and the weighing is sometimes as many as six or seven times, the method has the advantages of long time consumption, large workload, low yield and large loss, and has high requirements on industrial experience and technical level of workers and masters.
Disclosure of Invention
In view of the foregoing, it is an object of the present invention to provide a gold plating method, system, readable storage medium and computer device to solve at least the above-mentioned deficiencies in the related art.
The invention provides a gold plating method, which comprises the following steps:
when a gold plating task of a product to be processed is obtained, obtaining product information of the product to be processed, wherein the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
searching a preset product database for a product type corresponding to the product type;
inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
and carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
In addition, according to the gold plating method provided by the invention, the following additional technical features can be provided:
further, before the searching for the product type corresponding to the product category in the preset product database, the method further includes:
obtaining product types and product names of a plurality of products;
dividing a number of said products into product types according to physical external shape or individual surface area or total volume of the same said product type;
acquiring the types of a plurality of gold plating tools;
and associating the product type, the product name and the appliance type with the product type, and constructing a corresponding product database.
Further, the step of inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters includes:
when the product type of the product to be processed belongs to any one of the product types, inputting the corresponding product type into the gold plating database to obtain corresponding gold plating current and gold plating efficiency;
and calculating gold plating parameters according to the gold plating current and the product parameters.
Further, after the step of performing the gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters, the method further comprises the following steps:
after a preset time, calculating the weight of the product which is subjected to the gold plating operation in the gold plating task;
calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
recalculating the gold plating time according to the remaining weight of the gold plating task;
and continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time.
Further, after the step of continuously performing the gold plating operation on the remaining products of the products to be processed according to the gold plating time, the method further comprises:
and when the gold plating operation is completely finished, storing the gold plating record file of the whole gold plating operation.
The present invention also provides a gold plating system comprising:
the device comprises a first acquisition module, a second acquisition module and a third acquisition module, wherein the first acquisition module is used for acquiring product information of a product to be processed when a gold plating task of the product to be processed is acquired, and the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
the searching module is used for searching a product type corresponding to the product type in a preset product database;
the input module is used for inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
the processing module is used for calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
and the first control module is used for carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
In addition, according to the gold plating system provided by the invention, the following additional technical features can be provided:
further, the system further comprises:
the second acquisition module is used for acquiring product types and product names of a plurality of products;
the dividing module is used for dividing a plurality of products into product types according to physical external shapes, single surface areas or total volumes of the same product type;
the third acquisition module is used for acquiring the appliance types of the plurality of gold-plating appliances;
and the construction module is used for associating the product type, the product name and the appliance type with the product type and constructing a corresponding product database.
Further, the system further comprises:
the first calculating module is used for calculating the weight of a product which is subjected to gold plating operation in the gold plating task after a preset time;
the second calculation module is used for calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
a third calculation module for recalculating the gold plating time based on the remaining weight of the gold plating job;
and the second control module is used for continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time.
The invention also proposes a readable storage medium on which a computer program is stored which, when executed by a processor, implements the above-mentioned gold plating method.
The invention also provides a computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor executes the program to realize the gold plating method.
Compared with the prior art, the invention has the beneficial effects that: the method comprises the steps of setting a product database and a gold plating database, obtaining a corresponding product type in the product database according to product information of a product to be processed, selecting an optimal gold plating current parameter and a corresponding gold plating efficiency parameter through the gold plating database according to the product type and the product information, calculating corresponding gold plating time according to the gold plating current parameter and the gold plating efficiency parameter, and not needing to weigh the product for multiple times in a gold plating process, so that on one hand, the optimal gold plating effect can be achieved, and the loss of gold plating is reduced; on the other hand, the use of the optimal gold plating current parameters can reduce the error rate of gold plating, improve the quality of products, improve the yield of gold plating and improve the production efficiency.
Drawings
FIG. 1 is a flow chart of a gold plating method in a first embodiment of the present invention;
FIG. 2 is a flow chart of a gold plating method in a second embodiment of the present invention;
FIG. 3 is a block diagram of a gold plating system according to a third embodiment of the present invention;
fig. 4 is a block diagram showing a computer device according to a fourth embodiment of the present invention.
Description of the main element symbols:
memory device
10
Third acquisition module
14
Processor with a memory having a plurality of memory cells
20
Building block
15
Computer program
30
Search module
16
First acquisition module
11
Input module
17
Second acquisition module
12
Processing module
18
Partitioning module
13
First control module
19
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1, a gold plating method according to a first embodiment of the present invention is shown, and the method specifically includes steps S101 to S105:
s101, when a gold plating task of a product to be processed is obtained, obtaining product information of the product to be processed, wherein the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
in specific implementation, when a gold plating task of a product to be processed is obtained, product information of the product to be processed is obtained, and the product information comprises product types, the number to be processed and product parameters corresponding to the product types.
It should be noted that, in the present application, the product type of each product, the product parameter corresponding to the product type, and the appliance type of the corresponding electroplating appliance can be identified, and the product type, the product parameter, and the appliance type are input into the electroplating apparatus as input information, in some optional embodiments, a product type-product parameter mapping table may be established in advance, and all product types and corresponding product parameters in the market are entered into the product type-product parameter mapping table, and the product parameter corresponding to the product type can be determined by looking up the mapping table, please refer to table 1 below, which shows a product type-product parameter mapping table given in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type, rolling cage type or other types, the input product parameter is the gram weight of each product to be processed; when the type of the product to be processed is bracelet type or ring type, the input product parameter is the face width of each product to be processed (namely the surface width of the bracelet or ring); when the type of the product to be processed is bead type, the input product parameter is the outer diameter of each product to be processed (namely the size of the outer ring of the bead).
In the application, an electroplating tool is usually required to be used for electroplating products on the market, such as a spring cage, a line cage or a rolling cage, the selection of the electroplating tool is usually determined according to product parameters of products to be processed, when the product parameters corresponding to various product types are smaller than a preset first parameter, the electroplating operation is carried out in a rolling cage mode, and the electroplating operation of the rolling cage type has an independent product parameter; when the product parameters corresponding to the product types are larger than the preset first parameters and smaller than the preset second parameters, a rolling cage or a spring cage or an electroplating tool corresponding to the product types can be adopted for electroplating operation; when the product parameters corresponding to the product types are larger than the preset second parameters, only corresponding electroplating tools can be adopted for electroplating operation; for example: when the gram weight of the monomer of the Pixiu is less than 1g, a rolling cage is needed for electroplating; when the gram weight of the monomer of the Pixiu is more than 1g and less than 5g, electroplating can be carried out in a rolling cage or spring cage mode; when the gram weight of the monomer of the Pixiu is more than 5g, the electroplating can be carried out only by adopting a spring cage mode. It should be noted that products such as bracelets and rings cannot be plated with gold in a rolling cage manner, but only corresponding wire cages are used.
It is understood that the product information of the product to be processed may be provided by the supplier or measured by a corresponding device.
S102, searching a product type corresponding to the product type in a preset product database;
it should be noted that, in the present application, a product database of all products on the market may be created in advance, product types of all products are stored in the product database, in some optional embodiments, four product types are divided according to physical external shapes of all products on the market, a product type-product type mapping table may be created in advance in the product database, all product types in the market are entered into the product type-product type mapping table, and a product type corresponding to the product type may be determined by looking up the mapping table, as shown in table 2 below, which is a product type-product type mapping table provided in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type and other types, the type of the product corresponding to the product to be processed is a first type; when the type of the product to be processed is bracelet type or ring type, the type of the product corresponding to the product to be processed is a second type; when the type of the product to be processed is bead type, the type of the product corresponding to the product to be processed is a third type; the above product type judgment is that the condition of the electroplating tool corresponding to the product type of the product to be processed is adopted when the product parameter of the product to be processed is greater than the preset second parameter.
When the product to be processed needs to adopt the rolling cage, the product type corresponding to the product to be processed is the fourth type.
It is to be noted that the product types can also be divided according to the individual surface areas of all products on the market or the total volume of all products belonging to the same said product category.
S103, inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
in the present application, a plating database of all products on the market is constructed according to the relationship among product information, plating tool information, plating solution information, the magnitude of plating current required by the product, plating current variation, plating speed, and plating efficiency, and the plating database stores plating parameters and plating efficiency parameters of all products, in some optional embodiments, a mapping table of product type-product parameter-plating parameter may be pre-established in the plating database, and the plating parameter corresponding to the product type may be determined by looking up the mapping table, see table 3 below, which shows a mapping table of product type-product parameter-plating parameter provided in this embodiment:
in table 3, the gold plating current coefficient in the gold plating parameter is shown, and the algorithm formula of the gold plating parameter is:
λ=Ӑ*χ
in the above formula, λ represents a plating parameter; Ӑ denotes the current coefficient; χ represents a product parameter; the formula only calculates the numerical value change, the current coefficients adopted by different product types are different, and the required gold plating time is also greatly different.
In the rolling cage type in table 3, when the product parameter is grammage, the gold plating current coefficients corresponding to the gold plating operations performed on different products in the rolling cage type are also greatly different, for example: the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on the pendant in a rolling cage mode is 0.009-0.019, the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on the Pixiu in a rolling cage mode is 0.012-0.022, and the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on some accessories or sundries in a rolling cage mode is 0.01-0.05; when the product parameter is volume, the approximate range of the gold plating current coefficient adopted by the gold plating operation of the product in a rolling cage mode is 0.02-0.06.
In the present application, the selection of the gold plating current coefficient is selected from the gold plating current ranges described in table 3 above; the optimal gold plating current coefficient can be obtained through the experiment of the product in the gold plating current coefficient range and is used as the current coefficient of the gold plating operation.
In addition, the plating efficiency parameters of the plating tools are different according to the plating tools used by different products, and in some optional embodiments, a product type-tool type-plating efficiency parameter mapping table may be pre-established in a plating database, and the plating efficiency parameters corresponding to the tool types may be determined by looking up the mapping table, as shown in table 4 below, which is a product type-tool type-plating efficiency parameter mapping table provided in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type and other types and the product parameter of the product to be processed is larger than a preset second parameter, gold plating is performed by adopting a spring cage, and the gold plating efficiency is 82% -95%; when the types of the products to be processed are Pixiu types, pendant types, ear nails types and other types, and the products to be processed are subjected to gold plating operation by adopting a rolling cage, the gold plating efficiency is 96-99%; for example: when the gram weight of the monomer of the Pixiu is more than 5g, a spring cage is needed for electroplating, and the gold plating efficiency is 82% -95%; when the gram weight of the monomer of the Pixiu is more than 1g and less than 5g, electroplating can be carried out in a rolling cage or spring cage mode; the gold plating efficiency in the rolling cage mode is 96% -99%, and the gold plating efficiency in the spring cage mode is 82% -95%; when the gram weight of the monomer of the Pixiu is less than 5g, a rolling cage is needed for electroplating, and the gold plating efficiency is 96% -99%.
When the type of the product to be processed is bracelet type, carrying out gold plating operation by adopting a wire cage, wherein the gold plating efficiency is 80-92%; when the type of the product to be processed is a ring type, a wire cage is adopted for gold plating operation, and the gold plating efficiency is 85% -90%.
In some optional embodiments, the gold plating efficiency parameters corresponding to the types of the products and the types of the electroplating tools can be recorded in the gold plating database, and the user can directly input the corresponding types of the products and the types of the tools to obtain the corresponding gold plating efficiency parameters.
It should be noted that the gold plating efficiency parameter refers to the actual amount of gold plating per unit time under the corresponding condition state, and is related to the following factors:
the state of the plating solution;
the type, the use degree and the type of the electroplating tools;
the type, parameter, quantity, weight or volume of the product;
the type of mold material;
s104, calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
in the specific implementation, the total gold plating weight required by the gold plating task is recorded in the gold plating task, and the algorithm formula of the gold plating time is as follows:
W= T*λ*N*С*η；
in the above formula, W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter; the formula only calculates the numerical value change, and the gold plating time required by different product types is greatly different.
The invention calculates the optimal current required by the product according to the gold plating database (the optimal current is a certain numerical value in the current coefficient, and the numerical value is obtained by experiments), calculates the accurate gold plating time required by the total gold plating weight through the optimal current, the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed, then accurately provides the current required by the product, controls the gold plating production time, and achieves the purpose of automatic production.
And S105, carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
The invention establishes a corresponding database by collecting various information, establishes a corresponding data relation (algorithm relation) for the data in the database, calculates the required parameter (such as gold plating time) according to the relation, and carries out gold plating operation by the parameter, thereby further improving the quality of products, reducing the production time, improving the yield of gold plating, improving the production efficiency and improving the production speed.
In summary, in the gold plating method in the above embodiment of the present invention, by setting the product database and the gold plating database, the corresponding product type is obtained in the product database according to the obtained product information of the product to be processed, the optimal gold plating current parameter and the corresponding gold plating efficiency parameter are selected through the gold plating database according to the product type and the product information, the corresponding gold plating time is calculated according to the gold plating current parameter and the gold plating efficiency parameter, and multiple weighing is not required in the gold plating process of the product, so that on one hand, the optimal gold plating effect can be achieved, and the loss of gold plating is reduced; on the other hand, the use of the optimal gold plating current parameters can reduce the error rate of gold plating, improve the quality of products, improve the yield of gold plating and improve the production efficiency.
Example two
Referring to fig. 2, a gold plating method in a second embodiment of the present invention is shown, and the method specifically includes steps S201 to S211:
s201, when a gold plating task of a product to be processed is obtained, obtaining product information of the product to be processed, wherein the product information at least comprises product types, the number to be processed and product parameters corresponding to the product types;
in specific implementation, when a gold plating task of a product to be processed is obtained, product information of the product to be processed is obtained, and the product information comprises product types, the number to be processed and product parameters corresponding to the product types.
It should be noted that, in the present application, the product type of each product, the product parameter corresponding to the product type, and the appliance type of the corresponding electroplating appliance can be identified, and the product type, the product parameter, and the appliance type are input into the electroplating apparatus as input information, in some optional embodiments, a product type-product parameter mapping table may be established in advance, and all product types and corresponding product parameters in the market are entered into the product type-product parameter mapping table, and the product parameter corresponding to the product type can be determined by looking up the mapping table, please refer to table 5 below, which shows a product type-product parameter mapping table provided in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type, rolling cage type or other types, the input product parameter is the gram weight of each product to be processed; when the type of the product to be processed is bracelet type or ring type, the input product parameter is the face width of each product to be processed (namely the surface width of the bracelet or ring); when the type of the product to be processed is bead type, the input product parameter is the outer diameter of each product to be processed (namely the size of the outer ring of the bead).
In the application, an electroplating tool is usually required to be used for electroplating products on the market, such as a spring cage, a line cage or a rolling cage, the selection of the electroplating tool is usually determined according to product parameters of products to be processed, when the product parameters corresponding to various product types are smaller than a preset first parameter, the electroplating operation is carried out in a rolling cage mode, and the electroplating operation of the rolling cage type has an independent product parameter; when the product parameters corresponding to the product types are larger than the preset first parameters and smaller than the preset second parameters, a rolling cage or a spring cage or an electroplating tool corresponding to the product types can be adopted for electroplating operation; when the product parameters corresponding to the product types are larger than the preset second parameters, only corresponding electroplating tools can be adopted for electroplating operation; for example: when the gram weight of the monomer of the Pixiu is less than 1g, a rolling cage is needed for electroplating; when the gram weight of the monomer of the Pixiu is more than 1g and less than 5g, electroplating can be carried out in a rolling cage or spring cage mode; when the gram weight of the monomer of the Pixiu is more than 5g, the electroplating can be carried out only by adopting a spring cage mode. It should be noted that products such as bracelets and rings cannot be plated with gold in a rolling cage manner, but only corresponding wire cages are used.
It is understood that the product information of the product to be processed may be provided by the supplier or measured by a corresponding device.
S202, searching a product type corresponding to the product type in a preset product database;
it should be noted that, in the present application, a product database of all products on the market may be created in advance, product types of all products are stored in the product database, in some optional embodiments, four product types are divided according to physical external shapes of all products on the market, a product type-product type mapping table may be created in advance in the product database, all product types in the market are entered into the product type-product type mapping table, and a product type corresponding to the product type may be determined by looking up the mapping table, please refer to table 6 below, which shows a product type-product type mapping table provided in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type and other types, the type of the product corresponding to the product to be processed is a first type; when the type of the product to be processed is bracelet type or ring type, the type of the product corresponding to the product to be processed is a second type; when the type of the product to be processed is bead type, the type of the product corresponding to the product to be processed is a third type; when the product type judgment is that the second parameter is preset for the product parameter of the product to be processed, the condition of the electroplating tool corresponding to the product type of the product to be processed is adopted.
When the product to be processed needs to adopt the rolling cage, the product type corresponding to the product to be processed is the fourth type.
It is to be noted that the product types can also be divided according to the individual surface areas of all products on the market or the total volume of all products belonging to the same said product category.
S203, when the product type of the product to be processed belongs to any one of the product types, inputting the corresponding product type into the gold plating database to obtain corresponding gold plating current and gold plating efficiency;
in the present application, a plating database of all products on the market is constructed according to the relationship among product information, plating tool information, plating solution information, the magnitude of plating current required by the product, plating current variation, plating speed, and plating efficiency, and the plating database stores plating parameters and plating efficiency parameters of all products, in some optional embodiments, a mapping table of product type-product parameter-plating parameter may be pre-established in the plating database, and the plating parameter corresponding to the product type may be determined by looking up the mapping table, see table 7 below, which shows a mapping table of product type-product parameter-plating parameter provided in this embodiment:
table 7 shows the gold plating current coefficients of the gold plating parameters.
In the present application, the selection of the gold plating current coefficient is selected from the gold plating current ranges described in table 7 above; the optimal gold plating current coefficient can be obtained through the experiment of the product in the gold plating current coefficient range and is used as the current coefficient of the gold plating operation.
In addition, the plating efficiency parameters of the plating tools are different according to the plating tools used by different products, and in some optional embodiments, a product type-tool type-plating efficiency parameter mapping table may be pre-established in a plating database, and the plating efficiency parameters corresponding to the tool types may be determined by looking up the mapping table, as shown in table 8 below, which is a product type-tool type-plating efficiency parameter mapping table provided in this embodiment:
when the type of the product to be processed is Pixiu type, pendant type, ear nail type and other types and the product parameter of the product to be processed is larger than a preset second parameter, gold plating is performed by adopting a spring cage, and the gold plating efficiency is 82% -95%; when the types of the products to be processed are Pixiu types, pendant types, ear nails types and other types, and the products to be processed are subjected to gold plating operation by adopting a rolling cage, the gold plating efficiency is 96-99%; for example: when the gram weight of the monomer of the Pixiu is more than 5g, a spring cage is needed for electroplating, and the gold plating efficiency is 82% -95%; when the gram weight of the monomer of the Pixiu is more than 1g and less than 5g, electroplating can be carried out in a rolling cage or spring cage mode; the gold plating efficiency in the rolling cage mode is 96% -99%, and the gold plating efficiency in the spring cage mode is 82% -95%; when the gram weight of the monomer of the Pixiu is less than 5g, a rolling cage is needed for electroplating, and the gold plating efficiency is 96% -99%.
When the type of the product to be processed is bracelet type, carrying out gold plating operation by adopting a wire cage, wherein the gold plating efficiency is 80-92%; when the type of the product to be processed is a ring type, a wire cage is adopted for gold plating operation, and the gold plating efficiency is 85% -90%.
In some optional embodiments, the gold plating efficiency parameters corresponding to the types of the products and the types of the electroplating tools can be recorded in the gold plating database, and the user can directly input the corresponding types of the products and the types of the tools to obtain the corresponding gold plating efficiency parameters.
It should be noted that the gold plating efficiency parameter refers to the actual amount of gold plating per unit time under the corresponding condition state, and is related to the following factors:
the state of the plating solution;
the type, the use degree and the type of the electroplating tools;
the type, parameter, quantity, weight or volume of the product;
the type of mold material.
S204, calculating gold plating parameters according to the gold plating current and the product parameters;
in specific implementation, the algorithm formula of the gold plating parameters is as follows:
λ=Ӑ*χ
in the above formula, λ represents a plating parameter; Ӑ denotes the current coefficient; χ represents a product parameter; the formula only calculates the numerical value change, the current coefficients adopted by different product types are different, and the required gold plating time is also greatly different.
In the rolling cage type in table 7, when the product parameter is grammage, the gold plating current coefficients corresponding to the gold plating operations performed on different products in the rolling cage type are also greatly different, for example: the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on the pendant in a rolling cage mode is 0.009-0.019, the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on the Pixiu in a rolling cage mode is 0.012-0.022, and the approximate range of gold-plating current coefficients adopted for carrying out gold-plating operation on some accessories or sundries in a rolling cage mode is 0.01-0.05; when the product parameter is volume, the approximate range of the gold plating current coefficient adopted by the gold plating operation of the product in a rolling cage mode is 0.02-0.06.
S205, calculating the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
in the specific implementation, the total gold plating weight required by the gold plating task is recorded in the gold plating task, and the algorithm formula of the gold plating time is as follows:
W= T*λ*N*С*η；
in the above formula, W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter; the formula only calculates the numerical value change, and the gold plating time required by different product types is greatly different.
The invention calculates the optimal current required by the product according to the gold plating database (the optimal current is a certain numerical value in the current coefficient, and the numerical value is obtained by experiments), calculates the accurate gold plating time required by the total gold plating weight through the optimal current, the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed, then accurately provides the current required by the product, controls the gold plating production time, and achieves the purpose of automatic production.
S206, carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters;
s207, calculating the weight of the product which is subjected to the gold plating operation in the gold plating task after a preset time;
in practice, since the gold plating result is related to the condition of the plating solution, the type of plating tools, the usage level, the type of hangers, the type of products, parameters, quantity, weight and volume, the type of mold materials, and other factors, in order to avoid errors, the weight of the products after the gold plating operation is counted up when more than half of the gold plating time of the gold plating task is passed, so as to ensure the gold plating quality.
S208, calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
s209, recalculating the gold plating time according to the residual weight of the gold plating task;
during the specific implementation, the corresponding gold plating parameters of the products which do not finish gold plating are calculated again, and then the gold plating time of the products which do not finish gold plating is calculated according to the residual weight of the gold plating task.
It is understood that this step is to avoid the quality error of gold plating caused by the condition of the plating solution, the type of plating tool, the degree of use, the type of hanger, the type of product, parameters, quantity, weight and volume, the type of mold material, and the like.
S210, continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time;
s211, when the gold plating operation is completed, storing the gold plating record file of the whole gold plating operation.
It can be understood that storing the whole gold plating record file of the gold plating operation can further improve the data accuracy of the whole product database and the gold plating database, so that the method has the calibration function.
It should be noted that, in the present application, when the gold plating weight of the one-cylinder gold plating solution (120L) exceeds 25 kg, the gold plating current is reduced by 1.5% for every one kg of gold plating weight, and the gold plating weight of the one-cylinder gold plating solution (120L) cannot exceed 35 kg at maximum.
In addition, because the electroplating solution and the electroplating tools of the manufacturers are different and have a certain difference, the method needs to weigh once in the production process when the electroplating solution and the electroplating tools of a new factory are produced, collects the relevant data of the electroplating solution, the electroplating tools and various products of the factory in real time, calculates the corresponding data model after sufficient data collection, and can achieve the purpose of complete automation without performing the steps S207 to S210.
The invention establishes a corresponding database by collecting various information, establishes a corresponding data relation (algorithm relation) for the data in the database, calculates the required parameter (such as gold plating time) according to the relation, and carries out gold plating operation by the parameter, thereby further improving the quality of products, reducing the production time, improving the yield of gold plating, improving the production efficiency and improving the production speed.
In summary, in the gold plating method in the above embodiment of the present invention, by setting the product database and the gold plating database, the corresponding product type is obtained in the product database according to the obtained product information of the product to be processed, the optimal gold plating current parameter and the corresponding gold plating efficiency parameter are selected through the gold plating database according to the product type and the product information, the corresponding gold plating time is calculated according to the gold plating current parameter and the gold plating efficiency parameter, and multiple weighing is not required in the gold plating process of the product, so that on one hand, the optimal gold plating effect can be achieved, and the loss of gold plating is reduced; on the other hand, the use of the optimal gold plating current parameters can reduce the error rate of gold plating, improve the quality of products, improve the yield of gold plating and improve the production efficiency.
EXAMPLE III
In another aspect, the present invention further provides a gold plating system, referring to fig. 3, which shows a gold plating system according to a third embodiment of the present invention, the system includes:
the first acquisition module 11 is configured to acquire product information of a product to be processed when a gold plating task of the product to be processed is acquired, where the product information at least includes a product type, a number to be processed, and product parameters corresponding to the product type;
a second obtaining module 12, configured to obtain product types and product names of a plurality of products;
a dividing module 13 for dividing the plurality of products into product types according to physical external shapes, single surface areas or total volumes of the same product type;
a third obtaining module 14 for obtaining the tool types of the plurality of gold plating tools;
a building module 15, configured to associate the product type, the product name, and the appliance type with the product type, and build a corresponding product database;
the searching module 16 is configured to search a preset product database for a product type corresponding to the product type;
the input module 17 is used for inputting the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
further, the input module 17 is specifically configured to:
when the product type of the product to be processed belongs to any one of the product types, inputting the corresponding product type into the gold plating database to obtain corresponding gold plating current and gold plating efficiency;
and calculating gold plating parameters according to the gold plating current and the product parameters.
A processing module 18, configured to calculate, according to the gold plating parameter, the gold plating efficiency parameter, and the quantity to be processed, a gold plating time required by the gold plating task according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
and the first control module 19 is used for carrying out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
In addition, the gold plating system further includes:
the first calculating module is used for calculating the weight of a product which is subjected to gold plating operation in the gold plating task after a preset time;
the second calculation module is used for calculating the residual weight of the gold plating task according to the weight of the product which is subjected to the gold plating operation in the gold plating task;
a third calculation module for recalculating the gold plating time based on the remaining weight of the gold plating job;
and the second control module is used for continuously carrying out gold plating operation on the residual products in the products to be processed according to the gold plating time.
The functions or operation steps of the above modules when executed are substantially the same as those of the above method embodiments, and are not described herein again.
The gold plating system provided by the embodiment of the invention has the same implementation principle and technical effect as the method embodiments, and for the sake of brief description, no part of the system embodiments is mentioned, and reference may be made to the corresponding contents in the method embodiments.
Example four
Referring to fig. 4, a computer device according to a fourth embodiment of the present invention is shown, which includes a memory 10, a processor 20, and a computer program 30 stored in the memory 10 and executable on the processor 20, wherein the processor 20 implements the gold plating method as described above when executing the computer program 30.
In specific implementation, when acquiring a gold plating task of a product to be processed, the processor 20 acquires product information of the product to be processed, where the product information at least includes a product type, a quantity to be processed, and product parameters corresponding to the product type;
the processor 20 searches a preset product database for a product type corresponding to the product type;
the processor 20 inputs the product type and the product parameters into a preset gold plating database to obtain corresponding gold plating parameters and gold plating efficiency parameters;
the processor 20 calculates the gold plating time required by the gold plating task according to the gold plating parameters, the gold plating efficiency parameters and the quantity to be processed according to the following algorithm:
W= T*λ*N*С*η；
wherein W represents the total weight of gold plating; t represents the gold plating time; λ represents a gold plating parameter; n represents the number to be processed; c represents a gold plating coefficient; eta represents a plating efficiency parameter;
the processor 20 carries out gold plating operation on the product to be processed according to the gold plating time and the gold plating parameters.
The memory 10 includes at least one type of readable storage medium including a flash memory, a hard disk, a multimedia card, a card type memory (e.g., SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, and the like. The memory 10 may in some embodiments be an internal storage unit of the vehicle, such as a hard disk of the vehicle. The memory 10 may also be an external storage device in other embodiments, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like. Further, the memory 10 may also include both an internal storage unit and an external storage device of the vehicle. The memory 10 may be used not only to store application software installed in the vehicle and various types of data, but also to temporarily store data that has been output or is to be output.
In some embodiments, the processor 20 may be an Electronic Control Unit (ECU), a Central Processing Unit (CPU), a controller, a microcontroller, a microprocessor or other data Processing chip, and is configured to run program codes stored in the memory 10 or process data, such as executing an access restriction program.
It should be noted that the configuration shown in fig. 4 does not constitute a limitation of the computer device, and in other embodiments, the computer device may include fewer or more components than those shown, or some components may be combined, or a different arrangement of components may be used.
According to the computer equipment, the processor 20 is provided with a product database and a gold plating database, obtains a corresponding product type in the product database according to the obtained product information of a product to be processed, selects an optimal gold plating current parameter and a corresponding gold plating efficiency parameter through the gold plating database according to the product type and the product information, calculates corresponding gold plating time according to the gold plating current parameter and the gold plating efficiency parameter, does not need to weigh the product for multiple times in a gold plating process, and on one hand, can achieve an optimal gold plating effect and reduce gold plating loss; on the other hand, the use of the optimal gold plating current parameters can reduce the error rate of gold plating, improve the quality of products, improve the yield of gold plating and improve the production efficiency.
An embodiment of the present invention further provides a readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the gold plating method as described above.
Those of skill in the art will understand that the logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be viewed as implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.