阅读说明：本技术 一种双模压成型的led产品及制作工艺 (Double-compression-molded LED product and manufacturing process thereof ) 是由 刘明剑 朱更生 周凯 吴振雷 罗仕昆 沈进辉 于 2019-10-12 设计创作，主要内容包括：本申请公开了一种双模压成型LED产品及制作工艺,该LED产品包括PCB板、固定安装在PCB板上的LED芯片、第一次模压成型的反光杯和第二次模压成型的保护板；反光杯设置在PCB板上,保护板设置在反光杯上,保护板的形状和大小与反光杯的形状和大小相适配,并与反光杯和PCB板共同形成用于容纳LED芯片的容纳空间。通过用第一有机材料进行第一次模压成型获得反光杯,然后将LED芯片固定在PCB板上,再用第二有机材料进行第二次模压成型获得保护板,这样便可以解决LED产品内应力释放问题,提升LED产品的可靠性及气密性。(The application discloses a double-compression molded LED product and a manufacturing process thereof, wherein the LED product comprises a PCB, an LED chip fixedly arranged on the PCB, a reflective cup formed by primary compression molding and a protective plate formed by secondary compression molding; the reflecting cup is arranged on the PCB, the protective plate is arranged on the reflecting cup, the shape and the size of the protective plate are matched with those of the reflecting cup, and an accommodating space for accommodating the LED chip is formed together with the reflecting cup and the PCB. Through carrying out compression molding for the first time with first organic material and obtaining reflection of light cup, then fix the LED chip on the PCB board, reuse second organic material carries out compression molding for the second time and obtains the protection shield, alright like this with solve LED product internal stress release problem, promote the reliability and the gas tightness of LED product.)

1. A dual compression molded LED product, comprising:

a PCB board;

the LED chip is fixedly arranged on the PCB;

the light reflecting cup is arranged on the PCB and is formed by primary compression molding;

the protective plate is arranged on the reflective cup and is manufactured by secondary compression molding; the shape and the size of the protection plate are matched with those of the reflection cup, and an accommodating space for accommodating the LED chip is formed by the protection plate, the reflection cup and the PCB.

2. The LED product of claim 1, wherein the reflector cup is made of a first organic material; the protective plate is made of a second organic material;

wherein the first organic material and the second organic material both comprise the same organic-based skeleton.

3. The LED product of claim 2, wherein the organo-based skeleton comprises at least one of an epoxy skeleton and a silicone skeleton.

4. The LED product of claim 1, wherein the reflector cup comprises:

the reflecting surface is conical and is used for reflecting the light emitted by the LED chip;

the fixing surface is fixedly connected with the PCB and matched with the PCB.

5. The LED product of claim 4, wherein the protective plate comprises a tapered portion abutting the reflective cup and the PCB plate;

the conical part comprises an arc surface, and the arc surface is matched with the light reflecting surface.

6. The LED product of claim 5, wherein the protective plate further comprises a planar portion, and the planar portion is a light emitting portion of the LED product.

7. The manufacturing process of the LED product formed by double-compression molding is characterized in that the LED product comprises a PCB (printed Circuit Board), an LED chip, a reflecting cup and a protective plate, and the manufacturing process comprises the following steps:

performing first compression molding on the PCB by using a first organic material to obtain a first combination by compressing the reflective cup on the PCB;

fixedly mounting the LED chip on the PCB on the first assembly to obtain a second assembly;

carrying out secondary compression molding on the PCB and the reflecting cup of the second combination by using a second organic material so as to mold the protection plate on the PCB and the reflecting cup of the second combination to obtain an LED packaging device;

and cutting the LED packaging device to obtain the single LED product.

8. The process of claim 7, wherein the first organic material and the second organic material both comprise the same organic-based skeleton.

9. The process according to claim 8, wherein the organic-based skeleton comprises at least one of an epoxy resin skeleton and a silicone resin skeleton.

10. The manufacturing process of claim 7, wherein before the first molding with the first organic material on the PCB to obtain the first assembly, further comprises:

and carrying out copper cladding and etching on an insulating piece made of resin-based or glass fiber-like materials to obtain the PCB.

Technical Field

The application relates to the technical field of LEDs, in particular to a double-compression molded LED product and a manufacturing process thereof.

Background

Because of the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection and the like, the LED product is widely used in the lighting and display industries and becomes one of the most attention-focused products in recent years.

The package of an LED product refers to the package of a light emitting chip, and the package of an LED is required to protect a wick and transmit light. In the conventional LED package, after a chip is packaged on a support, the chip and the support are wrapped with glue, and the glue is cured by long baking, thereby completing the packaging process. The packaging structure is unreliable in connection and easy to fall off, and the air tightness of packaging glue is poor due to stress generated by heating of a chip or humidity of the environment.

Disclosure of Invention

In view of the above, the present application provides a dual-mold LED product and a manufacturing process thereof, which can effectively solve the above problems.

According to a first aspect of embodiments of the present application, there is provided a dual compression molded LED product, including:

a PCB board;

the LED chip is fixedly arranged on the PCB;

the light reflecting cup is arranged on the PCB and is formed by primary compression molding;

the protective plate is arranged on the reflective cup and is manufactured by secondary compression molding; the shape and the size of the protection plate are matched with those of the reflection cup, and an accommodating space for accommodating the LED chip is formed by the protection plate, the reflection cup and the PCB.

In the LED product provided in the embodiment of the present application, the reflective cup is made of a first organic material; the protective plate is made of a second organic material; wherein the first organic material and the second organic material both comprise the same organic-based skeleton.

In the LED product that this application embodiment provided, reflection of light cup includes reflection of light face and fixed surface, the shape of reflection of light face is the taper shape, the shape of fixed surface with the shape looks adaptation of PCB board.

In the LED product provided by the embodiment of the present application, the protection plate includes a tapered portion, and the tapered portion abuts against the reflection cup and the PCB;

the conical part comprises an arc surface and a plane, and the shape and the size of the arc surface are matched with those of the light reflecting surface.

In the LED product that this application embodiment provided, the protection shield includes still plane portion, plane portion does the position is sent to the light of LED product.

In the LED product provided by the embodiment of the present application, the organic-based skeleton includes at least one of an epoxy resin skeleton and an organic silicone skeleton.

According to a second aspect of the embodiments of the present application, there is provided a manufacturing process of a dual-compression molded LED product, where the LED product includes a PCB board, an LED chip, a reflective cup and a protective plate, the manufacturing process including:

performing first compression molding on the PCB by using a first organic material to obtain a first combination by compressing the reflective cup on the PCB;

fixedly mounting the LED chip on the PCB on the first assembly to obtain a second assembly;

carrying out secondary compression molding on the PCB and the reflecting cup of the second combination by using a second organic material so as to mold the protection plate on the PCB and the reflecting cup of the second combination to obtain an LED packaging device;

and cutting the LED packaging device to obtain the single LED product.

In the fabrication process provided in the embodiment of the present application, the first organic material and the second organic material both include the same organic-based skeleton.

In the fabrication process provided in the embodiment of the present application, the organic-based skeleton includes at least one of an epoxy resin skeleton and an organic silicone skeleton.

In the manufacturing process provided in the embodiment of the present application, before the first compression molding of the first organic material on the PCB to obtain the first assembly by compressing the reflective cup on the PCB, the method further includes:

and carrying out copper cladding and etching on an insulating piece made of resin-based or glass fiber-like materials to obtain the PCB.

The technical scheme provided by the embodiment of the application can have the following beneficial effects: the application provides a double-compression molded LED product and a manufacturing process thereof, wherein the LED product comprises a PCB (printed Circuit Board), an LED chip fixedly arranged on the PCB, a reflective cup formed by primary compression molding and a protective plate formed by secondary compression molding; the reflecting cup is arranged on the PCB, the protective plate is arranged on the reflecting cup, the shape and the size of the protective plate are matched with those of the reflecting cup, and an accommodating space for accommodating the LED chip is formed together with the reflecting cup and the PCB. This LED product obtains anti-light cup through carrying out the first compression molding with organic material, then fixes the LED chip on the PCB board, and reuse organic material carries out the compression molding of second time and obtains the protection shield, alright like this with solve LED product internal stress release problem, promote the reliability and the gas tightness of LED product.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a bi-compression molded LED product according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the LED product of FIG. 1 at another angle;

FIG. 3 is an exploded schematic view of the LED product of FIG. 1;

FIG. 4 is a schematic diagram of a portion of the structure of the LED product of FIG. 1;

FIG. 5 is a schematic diagram of the reflector cup of FIG. 1;

FIG. 6 is a schematic view of the reflector cup of FIG. 1 at another angle;

fig. 7 is a schematic structural view of the protection plate in fig. 1;

FIG. 8 is a schematic diagram of a portion of the structure of the LED product of FIG. 1;

fig. 9 is a schematic view of the conductive member of fig. 8;

FIG. 10 is a schematic view of the conductive member of FIG. 8 at another angle;

FIG. 11 is a schematic diagram of electrical connections of the LED chips of FIG. 8;

FIG. 12 is a schematic flow chart of a manufacturing process of a double-compression molded LED product according to an embodiment of the present disclosure;

fig. 13 is another schematic flow chart of a manufacturing process of a bi-compression molded LED product according to an embodiment of the present disclosure.

Description of reference numerals:

10. a light reflecting cup; 110. a light-reflecting surface; 120. a fixed surface;

20. a protection plate; 210. a planar portion; 220. a tapered portion; 221. a plane; 222. a cambered surface;

30. a PCB board; 310. an insulating member; 320. a conductive member; 321. a first conductive surface; 322. a second conductive surface; 323. positioning holes;

40. an LED chip; 410. a light emitting chip; 420. a driving chip; 430. a bonding wire;

50. a conductive post;

60. an accommodation space.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1 to 3, an embodiment of the present application provides a dual-compression molded LED product, which includes a PCB 30, an LED chip 40 fixedly mounted on the PCB 30, a first compression molded reflective cup 10, and a second compression molded protective plate 20. The reflecting cup 10 is arranged on the PCB 30, the protective plate 20 is arranged on the reflecting cup 10, the shape and the size of the protective plate 20 are matched with those of the reflecting cup 10, and an accommodating space 60 for accommodating the LED chip 40 is formed by the protective plate 20, the reflecting cup 10 and the PCB 30.

After the technical scheme is adopted, because the protection board 20 and the reflection cup 10 are compression molding, the protection board 20 is used for replacing the traditional protection glue, the protection board 20 also adopts compression molding, the size precision is high, the warpage deformation is very small, and the protection board has the characteristics of small shrinkage and stable mechanical property, the sealing effect is better than the protection layer solidified by the protection glue, meanwhile, the manufacturing cost of the compression molding protection board 20 is lower, the mold structure is simpler, the manufacturing cost is generally lower than that of an injection mold or a transfer molding mold, and the price is relatively low during batch production.

In an alternative embodiment, the reflective cup 10 is made of a first organic material and the protective plate 20 is made of a second organic material. Wherein the first organic material and the second organic material both comprise the same organic-based skeleton.

In the packaging structure of the traditional LED product, protective glue is filled in the reflective cup 10 to surround the LED chip 40, the driving chip 420 in the LED chip 40 is made of semiconductor silicon material, the light-emitting wafer 410 is made of gallium nitride or aluminum gallium phosphide, the protective glue is generally formed by compounding various organic materials and inorganic materials, and the humidity sensitive characteristic of the LED product can be influenced by the protective glue compounded by various materials, so that the reliability of the LED product is also restricted. Because the water absorption and expansion rates of various materials forming the protective glue are not completely the same in the using or processing process of the traditional LED product, the interior of the protective glue is easy to expand under the condition of moisture or high temperature, and the stress generated in the process can damage the internal structure of the LED product or cause the protective glue to be separated from the frame, thereby causing the failure of the LED product. For example, the conventional LED product cannot be subjected to a high temperature SMT (surface mount Technology) process, otherwise the protective glue inside the reflective cup 10 is prone to expand due to high temperature, and the stress generated in the process may cause the bonding wire 430 in the LED chip 40 to break and fail.

The reflecting cup 10 and the protecting plate 20 are fixedly connected, and the reflecting cup 10 and the protecting plate 20 are both molded by using an organic material comprising the same organic-based skeleton, so that the expansion rates of the reflecting cup 10 and the protecting plate 20 are substantially the same. Under the condition that the LED product is affected with damp or heated, the internal stress generated by the reflecting cup 10 and the protective plate 20 is also approximately the same, so that the relative deformation of the reflecting cup 10 and the protective plate 20 is relatively consistent, and the reliability and the air tightness of the LED product are improved. For example, when the LED chip 40 in the accommodating space 60 formed by the reflector cup 10, the protective plate 20 and the PCB 30 is powered on to generate internal stress due to heat generation of the reflector cup 10 and the protective plate 20, the relative deformation between the reflector cup 10 and the protective plate 20 is relatively consistent, so that the reliability and the air tightness of the LED product are further enhanced.

On the other hand, due to the functional characteristics of the light emission of the LED product itself, the protective plate 20 has high light transmittance or light diffusivity, and when the LED chip 40 emits light, the light generated by the LED chip 40 is transmitted or diffused to the outside from the protective plate 20 in cooperation with the reflective cup 10, so that the LED product can work normally, and meanwhile, the light emission mode of the LED product has diversity. The second organic material of the reflective cup 10 is opaque and plays a role of reflecting and condensing light. Compared with a general LED product with five-surface light emitting, the LED product provided by the embodiment of the application is provided with the lightproof reflecting cup 10, has a high light condensing effect, and enhances the light emitting intensity of the LED product in the designated direction.

In an alternative embodiment, in the LED product provided in this embodiment of the present application, the same organic-based skeleton included in the first organic material and the second organic material is at least one of an Epoxy (Epoxy) skeleton and a silicone skeleton. For example, when an EMC (Epoxy Molding Compound) is used as the organic material, the curing is convenient, the adhesive force is strong, the insulation is good, the shrinkage during curing of the EMC is low, the generated internal stress is small, which also helps to improve the adhesion, and compared with unsaturated polyester resin and phenolic resin, the Epoxy resin skeleton in the EMC shows very low shrinkage (less than 2%) during the curing process, so that the influence of thermal stress release on the LED product can be reduced.

Referring to fig. 5 and 6, in an alternative embodiment, the reflector cup 10 includes a reflective surface 110 and a fixing surface 120, the reflective surface 110 is conical, and the fixing surface 120 is adapted to the first conductive surface 321. Due to the arrangement of the reflecting surface 110, the light condensing performance of the LED product in the embodiment of the application is better, and the directional light intensity of the LED product is improved. The fixing surface 120 of the first compression molding of the reflective cup 10 contacts the PCB 30, and the shape of the fixing surface 120 is matched with that of the first conductive surface 321, so that the fixed connection between the reflective cup 10 and the PCB 30 is more stable, and the reliability of the LED product is further improved. Referring to fig. 4, four control interfaces are formed at the contact positions of the reflective cup 10 and the PCB 30, and the first conductive pin is disposed in the four control interfaces, so as to facilitate the subsequent input/output of power or electrical signals. The light-reflecting cup 10 is further provided with a fool-proof structure, in this embodiment, the fool-proof structure is a structure including a circular pattern, and after the LED package is completed, a projection of the fool-proof structure is located at a position where the first conductive pin on the PCB 30 is located.

Referring to fig. 7, in an alternative embodiment, the protection plate 20 includes a flat portion 210 and a tapered portion 220. The tapered portion 220 includes an arc surface 222 and a plane 221, the shape and size of the arc surface 222 are adapted to the shape and size of the reflective surface 110 of the reflective cup 10, and the shape and size of the plane 221 are adapted to the shape and size of the first conductive surface 321 of the reflective cup 10. The conical part 220 of the protective plate 20 formed by the second compression molding is abutted to the reflective surface 110 of the reflective cup 10, so that the protective plate 20 is more stably fixedly connected with the reflective cup 10, and the reliability of the LED product is further improved. The flat surface portion 210 is a light emitting portion of the LED product, and in this case, the light emitting surface of the LED product is the entire flat surface portion 210, and the emitted light is scattered light, and thus, the light condensing property is weak, the luminance is low, but the irradiation surface is wide. It is understood that, in another alternative embodiment, the protection plate 20 does not include the planar portion 210, and the light emitting surface of the LED is the surface of the tapered portion 220 facing away from the reflective cup 10, and the light emitted by the LED product is collected light, which has strong light collection and high brightness, but has a narrow irradiation surface.

In some embodiments, the thickness of the flat portion 210 in the protective plate 20 is 0.1 mm to 7 mm, such as 0.1 mm, 2 mm, 5 mm or 7 mm, and the LED product has good light emitting effect. Under the condition that the thickness of the protection plate 20 is not changed, the smaller the thickness of the plane part 210 is, the closer the light-emitting angle of the light emitted by the LED product is to the included angle of the conical part 220 of the reflection cup 10, and the stronger the light-condensing property is; the larger the thickness of the planar portion 210 is, the closer the light emitting angle of light emitted from the LED product is to 180 degrees, and the weaker the light condensing property is.

Referring to fig. 8, in an alternative embodiment, the PCB 30 includes an insulating member 310 made of resin-based or glass fiber-like material and a conductive member 320 coated on a surface of the insulating member 310, wherein the conductive member 320 is used for connecting an external power source and/or a signal source.

Specifically, in the LED product provided in the embodiment of the present application, the reflective cup 10 and the protective plate 20 are made of organic materials, and the insulating member 310 is made of a resin-based material, so that the difference between the expansion coefficients of the reflective cup 10, the protective plate 20 and the insulating member 310 is small, and the reliability of the LED product is further improved. When the insulating member 310 is made of glass-like glass material, the insulating member 310 has high elastic coefficient and high rigidity, and has good adhesion with resin, so that the insulating member is more stably fixed to the reflective cup 10.

Referring to fig. 8 to 10, in an alternative embodiment, the insulating member 310 includes a bottom surface and a top surface opposite to each other, and the conductive member 320 includes a first conductive surface 321 and a second conductive surface 322. The first conductive surface 321 is coated on the top surface, and the second conductive surface 322 is coated on the bottom surface. Wherein the LED chip 40 is fixedly mounted on the first conductive surface 321.

Referring to fig. 8 to 10, in an alternative embodiment, the conductive member 320 further includes a plurality of conductive pins. The number of the conductive pins in the LED product is mainly designed according to the driving manner of the LED product, and the present application is not limited thereto. The first conductive pin is used for grounding, the second conductive pin is used for connecting a power supply, the third conductive pin is used for signal output, and the fourth conductive pin is used for signal input.

Referring to fig. 8 to 10, in an alternative embodiment, the conductive member 320 further includes a plurality of positioning holes 323, the PCB 30 further includes a plurality of conductive posts 50 adapted to the positioning holes 323, the conductive posts 50 are used to electrically connect the first conductive surface 321 and the second conductive surface 322, and the control signals and the output signals of the LED chip 40 are guided from the first conductive surface 321 to the second conductive surface 322 at the bottom for facilitating the subsequent SMT electrical connection.

Referring to fig. 11, in an alternative embodiment, the LED chip 40 includes a light emitting chip 410 for emitting light and a driving chip 420 for controlling the light emitting chip 410. The light emitting chip 410 and the driving chip 420 are electrically connected to the first conductive surface 321.

In an alternative embodiment, as shown in fig. 8, 9 and 11, the number of the light emitting chips 410 is three, wherein two light emitting chips 410 are mounted on the second conductive pin and the other light emitting chip 410 is mounted on the third conductive pin. In this embodiment, the number of the bonding wires 430 is nine, wherein seven bonding wires 430 are disposed on the driving chip 420 and electrically connected to the first conductive pin, the second conductive pin, the third conductive pin, the fourth conductive member 320 and the three light emitting chips 410, respectively, and the other two bonding wires are used to connect one of the light emitting chips 410 on the second conductive pin and the light emitting chip 410 of the third conductive pin to the second conductive pin, respectively.

Referring to fig. 12, an embodiment of the present application provides a manufacturing process of a dual-mold-formed LED product, where the LED product includes a PCB 30, an LED chip 40, a reflective cup 10 and a protective plate 20, and the manufacturing process includes the following steps:

s101, performing first-time compression molding on the PCB 30 by using a first organic material to mold the reflective cup 10 on the PCB 30 to obtain a first combination;

s102, fixedly mounting the LED chip 40 on the PCB 30 on the first assembly to obtain a second assembly;

s103, carrying out secondary compression molding on the PCB 30 and the reflecting cup 10 of the second combination by using a second organic material so as to compress the protective plate 20 on the PCB 30 and the reflecting cup 10 of the second combination to obtain the LED packaging device;

and S104, cutting the LED packaging device to obtain a single LED product.

Specifically, in step S101, the first organic material is an opaque material. In step S103, the second organic material is a highly transparent material. Wherein the first organic material and the second organic material both comprise the same organic-based skeleton.

Because of the luminous functional characteristic of LED product itself, the protection shield 20 of luminous direction is high light transmissivity to make the LED product work normally, and the second organic material of making reflection of light cup 10 is light tight, compares in the luminous LED product of general five sides, and the LED product that this application embodiment provided is equipped with lightproof reflection of light cup 10, has the effect of high spotlight, strengthens the luminous intensity of the appointed direction of LED product.

In an alternative embodiment, an LED product is provided in an embodiment of the present application, wherein the organic-based skeleton includes at least one of an epoxy resin skeleton and a silicone resin skeleton. For example, when the organic material adopts EMC, the curing is convenient, the adhesive force is strong, the insulation is good, the shrinkage during the curing of the EMC is low, the generated internal stress is small, which is also beneficial to improving the adhesion, and compared with unsaturated polyester resin and phenolic resin, the epoxy resin skeleton in the EMC shows very low shrinkage (less than 2%) in the curing process, thereby being capable of slowing down the influence of thermal stress release on the LED product.

Referring to fig. 12, in an alternative embodiment, a manufacturing process of a bi-compression molded LED product includes the following steps:

s201, copper is coated and etched on the insulating member 310 made of resin-based or glass fiber-like material to obtain the PCB 30.

S202, performing first-time compression molding on the PCB 30 by using a first organic material to mold the reflective cup 10 on the PCB 30 to obtain a first combination;

s203, fixedly mounting the LED chip 40 on the PCB 30 on the first combination to obtain a second combination;

s204, carrying out secondary compression molding on the PCB 30 and the reflecting cup 10 of the second combination by using a second organic material so as to compress the protective plate 20 on the PCB 30 and the reflecting cup 10 of the second combination to obtain the LED packaging device;

s205, cutting the LED packaging device to obtain a single LED product.

Specifically, in the LED product provided in the embodiment of the present application, the reflective cup 10 and the protective plate 20 are made of organic materials, and the insulating member 310 is made of a resin-based material, so that the difference between the expansion coefficients of the reflective cup 10, the protective plate 20 and the insulating member 310 is small, and the reliability of the LED product is further improved; when the insulating member 310 is made of glass-like glass material, the insulating member 310 has high elastic coefficient and high rigidity, and has good adhesion with resin, so that the insulating member is more stably fixed to the reflective cup 10.

In the description of the present application, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.