阅读说明：本技术 基板处理装置 (Substrate processing apparatus ) 是由 朴庸硕 于 2019-05-28 设计创作，主要内容包括：本发明涉及一种基板处理装置,其照射紫外线使基板干燥,并且,能够进行使基板的表面具有亲水性的处理。本发明提供的基板处理装置包括：灯组件,包括紫外线灯和反射罩,上述紫外线灯将紫外线照射到通过传送装置传送的基板,上述反射罩配置在上述紫外线灯的上侧,将从上述紫外线灯照射的紫外线反射向基板；气体供应排出装置,设置在上述基板的上侧,用于向上述基板的上面供应气体并排出沿着上述基板的上表面移动的流体；以及壳体,具有容纳空间,上述容纳空间容纳通过上述紫外线灯加热的气体。(The present invention relates to a substrate processing apparatus that can perform a process of drying a substrate by irradiating ultraviolet rays and imparting hydrophilicity to the surface of the substrate. The substrate processing apparatus provided by the invention comprises: a lamp assembly including an ultraviolet lamp for irradiating ultraviolet rays to the substrate transferred by the transfer device, and a reflection cover disposed above the ultraviolet lamp for reflecting the ultraviolet rays irradiated from the ultraviolet lamp toward the substrate; a gas supply and discharge device provided above the substrate, for supplying a gas to an upper surface of the substrate and discharging a fluid moving along the upper surface of the substrate; and a housing having an accommodating space accommodating the gas heated by the ultraviolet lamp.)

1. A substrate processing apparatus, comprising:

A lamp assembly including an ultraviolet lamp for irradiating ultraviolet rays to the substrate transferred by the transfer device, and a reflection cover disposed above the ultraviolet lamp and reflecting the ultraviolet rays irradiated from the ultraviolet lamp toward the substrate;

A gas supply and discharge device disposed at an upper side of the substrate, for supplying a gas to an upper surface of the substrate and discharging a fluid moving along the upper surface of the substrate; and

A housing having an accommodating space accommodating gas heated by the ultraviolet lamp,

The gas supply and discharge device includes:

a gas supply chamber provided above the substrate and having a gas supply space formed therein, the lamp assembly being disposed in the gas supply space and having a gas supply port for supplying gas from outside to the gas supply space; and

And an exhaust chamber provided on one side of the air supply chamber along a transfer direction of the substrate, having an exhaust space formed therein, and having an exhaust port for discharging a fluid existing in the exhaust space.

2. The substrate processing apparatus according to claim 1, wherein a side wall of the gas supply chamber has a communicating portion for communicating a side of the gas supply space and a side of the gas exhaust space when the substrate moves on a lower side of the gas supply chamber and a lower side of the gas exhaust chamber.

3. The substrate processing apparatus of claim 1, wherein the gas supply and exhaust apparatus further comprises:

A gas supply fan provided at the gas supply port to supply gas from the outside to the gas supply space;

An exhaust fan disposed at the exhaust port to exhaust the fluid on the exhaust space to the outside; and

And support frames respectively disposed at both sides of the transfer device to support the air supply chamber on the transfer device.

4. The substrate processing apparatus according to claim 2, further comprising a flow guide member disposed on the communication portion so that the gas heated by the ultraviolet lamp can move along the upper surface of the substrate.

5. The substrate processing apparatus according to claim 4, wherein the flow guide member comprises:

A flow guide member fixing portion fixed to one side wall of the air supply chamber; and

And a fluid guide part formed to be inclined from one end of the flow guide member fixing part toward a direction in which the substrate is introduced, and guiding the fluid on the gas supply space to move along an upper surface of the substrate.

6. The substrate processing apparatus according to claim 1, wherein the reflection housing further comprises a slit portion formed at an upper portion of the reflection housing to move the gas supplied to the gas supply space to the ultraviolet lamp side.

7. the substrate processing apparatus according to claim 3,

Also comprises a height adjusting device which is arranged on the air supply space to adjust the height of the ultraviolet lamp,

The height adjusting device includes:

The ultraviolet lamp is arranged below the setting plate, and the reflecting cover is arranged above the setting plate; and

And a ball screw having one end exposed to an outside of the air supply chamber and the other end coupled to the set plate, and moving the set plate in an up-and-down direction.

8. The substrate processing apparatus according to claim 7,

Further comprising a guide means for guiding the movement of the setting plate moved by the height adjusting means,

the guide device includes:

A first guide member and a second guide member having one end connected to an upper portion of the gas supply chamber and the other end connected to the support frame to guide movement of the setting plate;

A first bushing movably coupled to the first guide member in a state of being coupled to one side of the setting plate; and

And a second sleeve movably coupled to the second guide member in a state of being coupled to the other side of the setting plate.

9. The substrate processing apparatus according to claim 3,

In the housing, the accommodating space is communicated with the air supply space and the air discharge space, a part of the conveying device is arranged at the upper part of the accommodating space, and an introducing port for introducing the substrate and a discharging port for discharging the substrate are arranged at two sides,

The plurality of air supply ports and the plurality of air discharge ports are arranged along a width direction of the substrate.

10. the substrate processing apparatus of claim 9, further comprising a fixing member for fixing an upper end of the housing to a lower portion of the support frame.

Technical Field

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that can perform a process of drying a substrate by irradiating ultraviolet rays and hydrophilizing a surface of the substrate.

Background

Generally, a substrate drying apparatus for a large-area substrate has air knives disposed above and below a conveyed substrate, respectively, to spray dry air, and an exhaust structure to exhaust mist generated by the spray of the dry air to the outside.

The conventional exhaust structure is a structure for collectively exhausting air by using an exhaust fan provided at a lower portion of the drying chamber.

The conventional substrate drying apparatus includes: a drying chamber; an upper air knife and a lower air knife disposed inside the drying chamber at upper and lower sides of the transferred substrate, respectively, to spray dry air to the substrate; and an exhaust part arranged at the lower part of the drying chamber.

In such a conventional substrate drying apparatus, while a substrate is being conveyed, dry air is ejected from an upper air knife and a lower air knife. When such high-pressure dry air is ejected, the cleaning water or cleaning chemical on the surface of the substrate is moved to the opposite side of the substrate in the conveying direction, and the substrate is dried.

in this case, the sprayed liquid particles separated from the substrate by the high-pressure dry air are present in the inside of the groove in a mist form together with the air flow, and this mist is discharged to the outside through an exhaust part provided at a lower portion of the drying chamber.

however, it is difficult to completely remove the mist by the exhaust part provided at the lower part of the drying chamber, and there is a possibility that the mist is re-attached to the substrate.

That is, the following may occur: a vortex due to the spray of the high-pressure dry air is formed inside the groove, and the mist is reattached to the substrate having passed through the upper and lower air knives by the vortex.

Therefore, there is a problem that water stains remain on the substrate when the mist is reattached to the substrate, and the water stains act as defects and may cause process failures.

Further, after the drying process using the air knife, an ultraviolet irradiation apparatus is used in a surface treatment process for modifying the surface of the substrate for the subsequent PI coating fixation.

However, since the substrate is subjected to the surface treatment process by the ultraviolet irradiation device in a state where the mist remains, there is a problem that the yield of the surface treatment of the substrate is lowered.

Therefore, there is a need for the development of a substrate processing apparatus that can remove the mist remaining on the substrate after the drying process and can process the surface of the substrate.

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus capable of removing mist remaining on a substrate and performing a hydrophilic process on a surface of the substrate by a single apparatus including an air supply chamber and an exhaust chamber disposed above the substrate and an ultraviolet lamp inside the air supply chamber.

Means for solving the problems

In order to solve the above problems, the present invention provides a substrate processing apparatus including: a lamp assembly including an ultraviolet lamp for irradiating ultraviolet rays to the substrate transferred by the transfer device, and a reflection cover disposed above the ultraviolet lamp for reflecting the ultraviolet rays irradiated from the ultraviolet lamp toward the substrate; a gas supply and discharge device provided above the substrate, for supplying a gas to an upper surface of the substrate and discharging a fluid moving along the upper surface of the substrate; and a housing having an accommodating space for accommodating the gas heated by the ultraviolet lamp, the gas supply and discharge device including: a gas supply chamber provided above the substrate and having a gas supply space formed therein, the lamp assembly being disposed in the gas supply space and having a gas supply port for supplying gas from outside to the gas supply space; and an exhaust chamber provided on one side of the air supply chamber along a transfer direction of the substrate, having an exhaust space formed therein, and having an exhaust port for discharging a fluid existing in the exhaust space.

according to the substrate processing apparatus of the present invention, one side wall of the air supply chamber has a communicating portion for communicating one side of the air supply space and one side of the air discharge space when the substrate moves below the air supply chamber and below the air discharge chamber.

In the substrate processing apparatus according to the present invention, the gas supply/discharge device may further include: a gas supply fan provided at the gas supply port to supply gas from the outside to the gas supply space; an exhaust fan disposed at the exhaust port to discharge the fluid on the exhaust space to the outside; and support frames respectively provided at both sides of the transfer device to support the air supply chamber on the transfer device.

The substrate processing apparatus according to the present invention may further include a flow guide member disposed in the communication portion to allow the gas heated by the ultraviolet lamp to move along the upper surface of the substrate.

in the substrate processing apparatus according to the present invention, the flow guide member may include: a flow guide member fixing portion fixed to one side wall of the air supply chamber; and a fluid guide part which is formed to be inclined from one end of the flow guide member fixing part to the direction of introducing the substrate, and guides the fluid on the air supply space to move along the upper surface of the substrate.

In the substrate processing apparatus according to the present invention, the reflection cover may further include a slit portion formed at an upper portion of the reflection cover to move the gas supplied to the gas supply space to the ultraviolet lamp side.

The substrate processing apparatus according to the present invention may further include a height adjusting device disposed in the gas supply space to adjust a height of the ultraviolet lamp, the height adjusting device including: a setting plate, wherein the ultraviolet lamp is arranged below the setting plate, and the reflecting cover is arranged above the setting plate; and a ball screw having one end exposed to the outside of the air supply chamber and the other end coupled to the installation plate, and moving the installation plate in the vertical direction.

the substrate processing apparatus according to the present invention may further include a guide device for guiding the movement of the setting plate moved by the height adjusting device, and the guide device may include: a first guide member and a second guide member, each having one end connected to an upper portion of the air supply chamber and the other end connected to the support frame, for guiding movement of the setting plate; a first sleeve movably coupled to the first guide member in a state of being coupled to one side of the installation plate; and a second sleeve movably coupled to the second guide member in a state of being coupled to the other side of the set plate.

According to the substrate processing apparatus of the present invention, in the housing, the accommodation space communicates with the gas supply space and the gas exhaust space, a part of the transfer device is disposed above the accommodation space, an introduction port for introducing the substrate and a discharge port for discharging the substrate are provided on both sides, and the gas supply port and the gas exhaust port are disposed in a plurality along a width direction of the substrate.

The substrate processing apparatus according to the present invention may further include a fixing member for fixing an upper end of the housing to a lower portion of the support frame.

Drawings

Fig. 1 is a side view schematically showing the structure of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 2 is a perspective view illustrating a lamp assembly and a part of a gas supply and exhaust apparatus of a substrate processing apparatus according to an embodiment of the present invention.

Fig. 3 is a sectional view schematically showing the structures of a lamp assembly and a gas supply and discharge device according to an embodiment of the present invention.

Fig. 4 is a perspective view illustrating the structure of a reflection case according to an embodiment of the present invention.

fig. 5 is a diagram showing another example of the flow guide member according to the embodiment of the present invention.

Detailed Description

hereinafter, the description will be made with reference to the drawings of the preferred embodiments of the present invention, which can specifically solve the above-described problems. In describing the present embodiment, the same names and the same symbols are used for the same structures, and additional description thereof is omitted hereinafter.

fig. 1 is a side view schematically showing the structure of a substrate processing apparatus according to the present invention, and fig. 2 is a perspective view showing a part of a lamp assembly and a gas supply and exhaust apparatus of the substrate processing apparatus according to the present invention. Wherein arrows shown in fig. 1 indicate flows of supplying and discharging gases for substrate processing.

In addition, fig. 3 is a sectional view schematically showing the structures of a lamp assembly and a gas supply and discharge device according to the present invention, fig. 4 is a perspective view showing the structure of a reflection housing according to the present invention, and fig. 5 is a view showing another example of a flow guide member according to the present invention.

As shown in fig. 1 to 5, the substrate processing apparatus according to the present invention includes a transfer apparatus 100, a lamp assembly 200, a gas supply and exhaust apparatus 300, and a housing 800.

as shown in fig. 1, the transfer device 100 may include a plurality of transfer shafts 110 arranged along a transfer direction of the substrate S.

The transfer shafts 110 extend in a direction perpendicular to the direction in which the substrate S is transferred, and may be arranged parallel to each other at the same interval.

The transfer shaft 110 may be provided with a plurality of transfer rollers 120, and the plurality of transfer rollers 120 surround the transfer shaft 110 and directly contact a portion of the lower surface of the substrate S, thereby transferring the substrate S.

That is, the transfer roller 120 is also rotated by the rotation of the transfer shaft 110, and the transfer of the substrate S in contact with the transfer roller 120 is achieved by the rotation of the transfer roller 120.

The transferring shaft 110 obtains a rotational force from a driving part 130 connected to the transferring shaft 110.

As shown in fig. 2 and 3, the lamp assembly 200 may include an ultraviolet lamp 210 and a reflection housing 220 disposed in a gas supply space 311 of a gas supply chamber 310, which will be described later.

The ultraviolet lamp 210 irradiates the substrate S transferred by the transfer apparatus 100 with ultraviolet rays to remove mist present on the substrate S, and performs surface treatment for making the surface of the substrate S hydrophilic by ozone generated from the ultraviolet rays.

In this case, the — OH groups generated by ozone are attached to the surface of the substrate S, and the surface of the substrate S can be made hydrophilic.

That is, when the surface of the substrate S is treated to have hydrophilicity, the wettability of the chemical liquid with respect to the surface of the substrate S is improved in the PI coating process in the subsequent process, and the process yield can be improved.

The reflection cover 220 is disposed above the ultraviolet lamp 210, and can reflect the ultraviolet rays irradiated from the ultraviolet lamp 210 to the substrate S.

The reflection cover 220 may have a slit portion 221 so that gas supplied through a gas supply chamber 310, which will be described later, can move to the ultraviolet lamp 210 side.

In this case, the gas moved to the ultraviolet lamp 210 side by the slit portion 221 also plays a role of preventing the ultraviolet lamp 210 from being overheated.

As shown in fig. 4, in the present embodiment, the case where the plurality of slit portions 221 in the form of long holes are formed in the upper portion of the reflection cover 220 along the longitudinal direction of the reflection cover 220 is disclosed, but the plurality of slit portions 221 may be formed along the width direction of the reflection cover 220.

The gas supply and discharge device 300 is provided at an upper side of the substrate S and is capable of supplying gas to an upper surface of the substrate S, thereby discharging fluid moving along the upper surface of the substrate S. Such a gas supply and exhaust apparatus 300 may include a gas supply chamber 310, an exhaust chamber 320, and a support frame 330.

Air supply chamber 310 forms an air supply space 311 inside. Also, as described above, the lamp assembly 200 may be disposed in the gas supply chamber 311.

In this case, it is preferable that the lower portion of the air supply chamber 310 is formed in an open structure so that the ultraviolet rays irradiated from the ultraviolet lamp 210 can be irradiated to the surface of the substrate S.

Since the lower portion of the air supply chamber 310 is formed in an open structure, the air supply space 311 can communicate with the accommodation space 810 of the housing 800, which will be described later.

In addition, the upper portion of the gas supply chamber 310 may have a gas supply port 312 for supplying gas from the outside to the gas supply space 311. In this case, a plurality of air supply ports 312 may be arranged in the width direction of the substrate S.

The gas supply and discharge device 300 according to the present invention may further include a gas supply fan 313.

The gas supply fan 313 may be provided on the gas supply port 312, and gas may be supplied from the outside to the gas supply space 311 through the gas supply port 312 by operation of the gas supply fan 313.

The discharge chamber 320 is provided at one side of the supply chamber 310 and may form a discharge space 321 therein.

In this case, the lower portion of the exhaust chamber 320 may be formed in an open structure. Also, since the lower portion of the discharge chamber 320 is formed in an open structure, the discharge space 321 and the receiving space 810 can communicate with each other.

in addition, the upper portion of the exhaust chamber 320 may have an exhaust port 322 for exhausting the fluid existing in the exhaust space 321 to the outside. In this case, the plurality of exhaust ports 322 may be arranged along the width direction of the substrate S.

The gas supply-discharge device 300 according to the present invention may further include an exhaust fan 323.

An exhaust fan 323 may be disposed on the exhaust port 322, and the fluid of the exhaust space 321 may be discharged to the outside through the exhaust port 322 by the operation of the exhaust fan 323.

In addition, the fluid may include the gas supplied to the gas supply space 311 and the ozone generated from the ultraviolet lamp 210, and may further include mist removed from the substrate S while drying the substrate S by the gas heated by the ultraviolet lamp 210.

In addition, the air supply chamber 310 may have a communication portion 400 on one side wall. The communicating portion 400 serves to communicate one side of the gas supply space 311 and one side of the gas discharge space 321 when the substrate S moves under the gas supply chamber 310 and under the gas discharge chamber 320.

More specifically, when the substrate S moves between the lower side of the gas supply chamber 310 and the lower side of the gas discharge chamber 320, only a minute space remains between the upper surface of the substrate S and the lower side of the gas discharge chamber 320 and the lower side of the gas supply chamber 310. In such a configuration, the fluid for processing the substrate S in the gas supply space 311 is less likely to move to the gas exhaust space 321 for exhaust.

that is, a communication portion 400 is formed at one side surface of the air supply chamber 310 to communicate one side of the air supply space 311 with one side of the air discharge space 321, so that the fluid processing the substrate S on the air supply space 311 is smoothly discharged to the air discharge space 321.

As a result, since the air supply chamber 310 and the air discharge chamber 320 are disposed at the upper side of the substrate S and the communication portion 400 communicating one side surface of the air supply space 311 and one side surface of the air discharge space 321 is formed, the air supply and discharge structure of the gas supply and discharge device 300 can realize the upper air supply and discharge structure to the upper surface of the substrate S.

Therefore, the fluid moves to the exhaust space 321 through the communication part 400 at one side of the gas supply space 311, thereby increasing an area where the upper surface of the substrate S contacts the fluid, and thus the drying performance of the substrate S and the surface treatment performance of the substrate S can be improved.

Although not shown in detail, the support frames 330 are respectively provided at both sides of the transfer device 100, and can support the air supply chamber 310 above the transfer device 100.

That is, the air supply chamber 310 is supported by the support frame 330, and the air discharge chamber 320 is provided at one side of the air supply chamber 310. Accordingly, the air supply chamber 310 and the air discharge chamber 320 can be disposed above the transferred substrate S.

The substrate processing apparatus according to the present invention may further include a flow guide member 500.

The flow guide member 500 is disposed in the communication portion 400, and can move the gas heated by the ultraviolet lamp 210 along the upper surface of the substrate S.

The flow guide member 500 may include a flow guide member fixing part 510 and a fluid guide part 520.

The flow guide member fixing portion 510 may fix the flow guide member 500 to one side wall of the air supply chamber 310 by another fastening member (not shown).

The fluid guide part 520 is formed to be inclined from one end of the flow guide member fixing part 510 toward a direction in which the substrate S is introduced, so that the fluid of the gas supply space 311 can be guided to move along the upper surface of the substrate S.

As shown in fig. 2, the fluid guide part 520 may be formed in an arc shape, and a portion inclined from one end of the flow guide member fixing part 510 may be directed toward the direction of drawing in the substrate S.

As another example of the fluid guide part 520, as shown in fig. 5, the fluid guide part 520 may be formed perpendicular to the substrate S being conveyed, and one side surface thereof, that is, a portion facing the gas supply space 311 may be formed in an arc shape.

That is, the fluid guide part 520 moves the fluid on the gas supply space 311 along the surface of the fluid guide part 520 by the coanda effect, and the fluid moving along the fluid guide part 520 widely spreads to the upper surface of the substrate S and moves along the upper surface of the substrate S, thereby removing the mist existing on the substrate S.

in addition, as the fluid is guided to the upper surface of the substrate by the fluid guide part 520, the substrate S is prevented from being lifted by the air flow, and thus the substrate S can be prevented from being damaged by the air flow to the maximum.

The substrate processing apparatus may further include a height adjusting device 600 to adjust the height of the ultraviolet lamp 210 according to the present invention.

That is, the height adjusting device 600 can adjust the height at which the ultraviolet lamp 210 is separated from the substrate S.

the height adjustment device 600 may include a setting plate 610 and a ball screw 620.

The ultraviolet lamp 210 may be disposed below the setting plate 610, and the reflection cover 220 may be disposed above the setting plate 610.

Although not shown in detail, the ball screw 620 is provided such that one end thereof is exposed to the outside of the air supply chamber 310 and the other end thereof is coupled to the installation plate 610, thereby enabling the installation plate 610 to move in the vertical direction.

That is, the setting plate 610 moves in the up and down direction with respect to the substrate S by operating the ball screw 620, so that the height of the ultraviolet lamp 210 can be adjusted. The ball screws 620 may be respectively disposed at both sides of the setting plate 610.

In addition, the substrate processing apparatus according to the present invention may further include a guide 700 for guiding the movement of the setting plate 610 moved by the height adjusting means 600.

the guide device 700 may include a first guide member 710, a second guide member 720, a first sleeve 730, and a second sleeve 740.

The first guide member 710 has one end connected to the upper portion of the gas supply chamber 310 and the other end connected to the support frame 330, thereby guiding the movement of the setting plate 610.

the second guide member 720 has one end connected to the upper portion of the air supply chamber 310 and the other end connected to the support frame 330 at a position spaced apart from the first guide member 710, and guides the movement of the set plate 610 together with the first guide member 710.

The first sleeve 730 may be movably coupled to the first guide 710 in a state of being coupled to one side of the setting plate 610.

the second sleeve 740 may be movably coupled to the second guide member 720 in a state of being coupled to the other side of the setting plate 610.

That is, when the setting plate 610 moves up and down by the height adjusting device 600, the first bushing 730 coupled to one side of the setting plate 610 is guided by the first guide member 710 to move up and down, and the second bushing 740 coupled to the other side of the setting plate 610 is guided by the second guide member 720 to move up and down.

Accordingly, the setting plate 610 is stably moved by the guide 700 in the process of adjusting the height of the ultraviolet lamp 210 by the height adjusting means. As a result, the ultraviolet lamp 210 can be stably moved.

The housing 800 may be disposed below the transferred substrate S, and has an accommodating space 810 accommodating gas heated by the ultraviolet lamp 210.

In addition, one side of the case 800 may have an introduction port 801 into which the substrate S is introduced, and the other side of the case 800 may have a discharge port from which the substrate S processed is discharged.

In addition, the upper portion of the case 800 may be formed in an open structure so as to communicate with the lower portion of the air supply space 311 and the lower portion of the air discharge space 321.

That is, since the air supply space 311, the air discharge space 321, and the housing space of the housing 800 are configured in a state where the air supply chamber 310 and the air discharge chamber 320 are disposed on the upper side of the substrate S and the housing 800 is disposed on the lower side of the substrate S with respect to the substrate S to be transferred, the air supply space 311, the air discharge space 321, and the housing space 800 are configured to be sealed except for the introduction port 801 through which the substrate S is introduced and the discharge port 802 through which the substrate S is discharged.

Therefore, the worker can be protected from the environment harmful to the human body due to the ultraviolet irradiation.

In addition, a part of the transfer device 100 can be disposed at an upper portion of the receiving space 810 of the case 800 so that the substrate S can move through the exhaust chamber 320 and the air supply chamber 310.

The function of the accommodating space 810 formed in the housing 800 is described as follows: before the substrate S passes through the introduction port 801, the gas heated by the ultraviolet lamp 210 is accommodated in the accommodation space 810.

In this case, when the substrate S is processed while passing through the introduction port 801, the upper surface of the substrate S is processed by the ultraviolet rays irradiated by the ultraviolet lamp 210 and the gas supplied through the gas supply port 312, and the lower surface of the substrate S is processed by the heated gas accommodated in the accommodation space 810.

As described above, by drying the upper and lower surfaces of the substrate S, the substrate drying performance can be further improved.

In addition, the lower portion of the support frame 330 may further include a fixing part 900 for fixing the upper end of the case 800.

The fixing member 900 may further include a support frame fastening portion 910 and a case fastening portion 920, the support frame fastening portion 910 may be fastened to a lower portion of the support frame 330 by another fastening member (not shown), and the case fastening portion 920 may be bent from the support frame fastening portion 910 and fastened to an upper end of the case 800 by another fastening member (not shown).

That is, the upper portion of the case 800 can be fixed to the lower portion of the support frame 330 by the fixing member 900.

as described above, the substrate processing apparatus according to the present invention has the effect of removing mist remaining on the substrate and performing a process of making the surface of the substrate hydrophilic by disposing the air supply chamber and the air discharge chamber on the upper side of the substrate and providing one apparatus having the ultraviolet lamp inside the air supply chamber.

In addition, the substrate processing apparatus according to the present invention has an effect of further improving the substrate drying performance by including the housing at the lower side of the substrate, accommodating the gas heated by the ultraviolet lamp, and drying the lower surface of the substrate by the accommodated gas.

In addition, the substrate processing apparatus according to the present invention has an effect that the height of the ultraviolet lamp can be selectively adjusted with respect to the substrate by including the height adjusting device.

In addition, the substrate processing apparatus according to the present invention has an effect that the ultraviolet lamp can be stably moved by the height adjusting device by including the guide device.

In addition, according to the substrate processing apparatus of the present invention, since the flow guide device is provided, the gas heated by the ultraviolet lamp in the gas supply space can be moved along the upper surface of the substrate, thereby further improving the drying performance of the substrate and the surface processing performance of the substrate.

In addition, according to the substrate processing apparatus of the present invention, the fluid is guided to the upper surface of the substrate by the flow guide member, thereby preventing the substrate from being lifted by the gas flow, and thus, the substrate can be prevented from being damaged by the gas flow to the maximum.

In addition, the substrate processing apparatus according to the present invention has an effect of protecting workers from an environment harmful to the human body due to ultraviolet irradiation by forming the air supply chamber, the exhaust chamber, and the housing to have a sealed structure.

As described above, the preferred embodiments of the present invention have been described with reference to the drawings, but those skilled in the art can make various modifications and changes without departing from the spirit and scope of the present invention described in the claims.