阅读说明：本技术 电子产品部件及其加工方法 (electronic product component and processing method thereof ) 是由 温辉科 黄武 陈景安 肖琦 唐斌 于 2019-08-16 设计创作，主要内容包括：本发明涉及一种电子产品部件及其加工方法。该电子产品部件的加工方法包括以下步骤：铝挤型材,铝挤成型出所述电子产品部件的外框；模内压铸,将所述外框进行复合压铸,使所述外框上压铸成型出所述电子产品部件的其他部分,得到压铸复合件；落料,冲压去除所述压铸复合件的多余部分；打磨加工,对落料处理后的压铸复合件机械打磨加工,得到所述电子产品部件的半成品；表面处理,对所述电子产品部件的半成品表面处理,使所述电子产品部件的半成品表面光亮、平滑,得到所述电子产品部件的成品。这种加工方法能够保证制成的电子产品部件外观面光滑、美观,不会产生流纹等不良现象,且制造成本低。(the invention relates to an electronic product component and a processing method thereof. The processing method of the electronic product component comprises the following steps: the aluminum extruded section is used for extruding the outer frame of the electronic product component; die-casting in the die, carrying out composite die-casting on the outer frame to form other parts of the electronic product part on the outer frame in a die-casting manner, so as to obtain a die-casting composite part; blanking, and removing the redundant part of the die-casting composite piece by punching; polishing, namely mechanically polishing the die-casting composite part subjected to blanking treatment to obtain a semi-finished product of the electronic product part; and surface treatment, namely treating the surface of the semi-finished product of the electronic product component to ensure that the surface of the semi-finished product of the electronic product component is bright and smooth, so as to obtain the finished product of the electronic product component. The processing method can ensure that the manufactured electronic product part has smooth and beautiful appearance surface, does not generate bad phenomena such as flow lines and the like, and has low manufacturing cost.)

1. A method for processing electronic product components is characterized by comprising the following steps:

The aluminum extruded section is used for extruding the outer frame of the electronic product component;

die-casting in the die, carrying out composite die-casting on the outer frame to form other parts of the electronic product part on the outer frame in a die-casting manner, so as to obtain a die-casting composite part;

Blanking, and removing the redundant part of the die-casting composite piece by punching;

Polishing, namely mechanically polishing the die-casting composite part subjected to blanking treatment to obtain a semi-finished product of the electronic product part;

and surface treatment, namely performing surface treatment on the semi-finished product of the electronic product component to obtain a finished product of the electronic product component.

2. The method for processing an electronic part according to claim 1, wherein in the aluminum extrusion step, the outer frame is extruded in a thickness direction of the electronic part.

3. the method of claim 1, further comprising the step of grinding: and after the step of extruding the aluminum profile, grinding the outer surface of the outer frame along the thickness direction.

4. The method for processing an electronic product component according to claim 3, wherein in the step of grinding the outer surface of the outer frame, double-sided grinding is adopted, the thickness of single-sided grinding is 0.15mm to 0.35mm, the grinding speed is 500rpm to 600rpm, the grinding time is: 5 s/pcs.

5. the method of manufacturing an electronic component of claim 3, further comprising a first CNC machining step of: after the grinding step, the outer peripheral surface of the outer frame is machined by CNC.

6. the method of claim 1, further comprising a laser etching step: and before the step of die casting in the die, carrying out laser etching on the position of the outer frame needing die casting combination.

7. The method for processing an electronic product component as claimed in claim 1, wherein in the surface treatment step, the semi-finished product of the electronic product component is deburred and cleaned first, and then is subjected to anodic oxidation treatment.

8. the method for manufacturing an electronic product component as claimed in claim 1, further comprising the step of attaching a wear pad: and adhering a wear-resistant plate on the semi-finished product of the electronic product part after surface treatment, and milling the redundant part of the wear-resistant plate to obtain the finished product of the electronic product part.

9. the method of manufacturing an electronic component of claim 1, comprising at least one of the following features:

the method also comprises a second CNC machining step: before the blanking step, the outer surface and the inner cavity of the die-casting composite part are polished in a finish machining mode;

further comprising a third CNC machining step: after the surface treatment step, tapping the semi-finished product of the electronic product component.

10. an electronic product component produced by the processing method according to any one of claims 1 to 9, comprising:

The aluminum extrusion frame comprises a first frame body, a second frame body and a third frame body, wherein one end of the first frame body and one end of the third frame body are respectively arranged at two opposite ends of the second frame body, the other end of the first frame body and the other end of the third frame body extend to the same side of the second frame body, and an accommodating cavity is formed among the first frame body, the second frame body and the third frame body; and

And the aluminum core body is formed in the accommodating cavity in a die-casting manner.

Technical Field

the invention relates to the technical field of electronic products, in particular to an electronic product component and a processing method thereof.

background

The existing parts of electronic products, such as rotatable cameras, middle frames, etc., are usually manufactured by integrally die-casting the parts and then performing CNC machining and surface treatment.

When the same metal is integrally die-cast, more metal fluid is used, and the appearance surface of the integrally formed part is easy to have the bad phenomena of air holes and flow lines generated after anodic treatment after the high pressure in the cavity is applied, so that the appearance surface quality of the manufactured and processed electronic product is poor and the electronic product is not beautiful enough.

Disclosure of Invention

in view of the above, it is necessary to provide a method for processing an electronic product component that can ensure the aesthetic appearance of the electronic product component, and an electronic product component manufactured by the method, in order to solve the problem of poor appearance of the electronic product component formed by die-casting.

A processing method of electronic product parts comprises the following steps:

The aluminum extruded section is used for extruding the outer frame of the electronic product component;

die-casting in the die, carrying out composite die-casting on the outer frame to form other parts of the electronic product part on the outer frame in a die-casting manner, so as to obtain a die-casting composite part;

Blanking, and removing the redundant part of the die-casting composite piece by punching;

polishing, namely mechanically polishing the die-casting composite part subjected to blanking treatment to obtain a semi-finished product of the electronic product part;

and surface treatment, namely performing surface treatment on the semi-finished product of the electronic product component to obtain a finished product of the electronic product component.

According to the processing method, the electronic product part with better bonding force can be formed by die-casting in the aluminum extrusion outer frame rear die, compared with the operation mode of directly and integrally die-casting the electronic product part, and then CNC (computerized numerical control) processing and surface treatment, the combined die-casting can ensure that the appearance surface of the electronic product part is smoother through the aluminum extrusion outer frame, and the flow pattern phenomenon can not occur after the surface treatment of the outer frame. And the aluminum extrusion frame forms the periphery of the electronic product part, and the internal structure of a part of the electronic product part can be formed in die casting in the die, so that the area of direct CNC processing is reduced, the manufacturing cost is saved, and the product yield and the processing efficiency are improved.

In one embodiment, in the aluminum extrusion step, the outer frame is extruded in a thickness direction of the electronic product part. The different directions of the material grains can generate different effects on the appearance of the product part after the surface treatment. It should be noted that, the electronic product component is rotatably installed in the housing, part of the outer peripheral surface of the outer frame is exposed out of the housing, if the aluminum extruded section is horizontally extruded, the water gap is generated on the outer peripheral surface of the outer frame, and the outer peripheral surface of the outer frame is not good in appearance after polishing and surface treatment. By adopting the aluminum extrusion mode along the thickness direction, the water gap can be generated on the upper surface and the lower surface of the outer frame, the upper surface and the lower surface of the outer frame are usually hidden in the shell, and the appearance of the electronic product part cannot be influenced after the outer frame is polished and treated.

in one embodiment, the method further comprises the step of grinding: and after the step of extruding the aluminum profile, grinding the outer surface of the outer frame along the thickness direction. The upper surface and the lower surface of the outer frame are smoother, and the attractiveness of electronic product parts is improved.

in one embodiment, in the step of grinding the outer surface of the outer frame, double-sided grinding is adopted, the thickness of single-sided grinding is 0.15mm to 0.35mm, the grinding speed is 500rpm to 600rpm, the grinding time is as follows: 5 s/pcs. The grinding effect is better, and the high flatness of the outer surface of the processed outer frame can be ensured.

In one embodiment, the method further comprises a first CNC machining step: after the grinding step, the outer peripheral surface of the outer frame is machined by CNC. The outer peripheral surface of the outer frame is smoother, and the attractiveness of electronic product components is improved.

in one embodiment, the method further comprises a laser etching step: and before the step of die casting in the die, carrying out laser etching on the position of the outer frame needing die casting combination. After the laser etching operation, the die-casting composite part produced by die-casting on the outer frame has better structural strength.

In one embodiment, in the surface treatment step, the semi-finished product of the electronic product part is deburred and cleaned, and then is subjected to anodic oxidation treatment. The outer surface of the electronic product component can be made better in corrosion resistance and wear resistance.

In one embodiment, the method further comprises the step of adhering the wear-resistant sheet: and adhering a wear-resistant plate on the semi-finished product of the electronic product part after surface treatment, and milling the redundant part of the wear-resistant plate to obtain the finished product of the electronic product part. The wear-resistant sheet is adhered to the outer surface of the electronic product component, so that the wear resistance is better when the electronic product component is matched with other components, and the outer surface of the electronic product component cannot be easily worn.

In one embodiment, at least one of the following features is included: the method also comprises a second CNC machining step: before the blanking step, the outer surface and the inner cavity of the die-casting composite part are polished in a finish machining mode; further comprising a third CNC machining step: after the surface treatment step, tapping the semi-finished product of the electronic product component.

the invention also provides an electronic product part which is manufactured by adopting the processing method, and the electronic product part comprises the following components: the aluminum extrusion frame comprises a first frame body, a second frame body and a third frame body, wherein one end of the first frame body and one end of the third frame body are respectively arranged at two opposite ends of the second frame body, the other end of the first frame body and the other end of the third frame body extend to the same side of the second frame body, and an accommodating cavity is formed among the first frame body, the second frame body and the third frame body; and the aluminum core body is formed in the accommodating cavity in a die-casting mode. Since the electronic product component is manufactured by the processing method, at least all the beneficial effects are achieved, and details are not repeated herein. The electronic product component has better structural strength, smooth and beautiful appearance surface, no adverse phenomena such as flow lines and the like, and low manufacturing cost.

Drawings

FIG. 1 is a flowchart illustrating operation of one embodiment of a method for manufacturing an electronic component according to the present invention;

FIG. 2 is a schematic structural view of an embodiment of an outer frame formed by an extruded aluminum profile;

FIG. 3 is a schematic view of the outer frame of FIG. 2 at a position where the outer frame is to be ground;

FIG. 4 is a schematic structural view of an embodiment of a die cast composite;

FIG. 5 is a schematic view of the die cast composite of FIG. 4 in a position requiring sanding;

FIG. 6 is a schematic structural diagram of an embodiment of a finished electronic component made according to the process of FIG. 1;

Fig. 7 is a first view showing a state in which the electronic product part of the present invention is mounted on the handset case;

fig. 8 is a view showing a state in which the electronic product part of the present invention is mounted on a mobile phone case.

in the drawings, the components represented by the respective reference numerals are listed below:

1. An outer frame; 11. a first frame body; 12. a second frame body; 13. a third frame body; 14. an accommodating cavity; 15. an outer surface; 16. an inner surface; 17. an outer peripheral surface; 18. a rotation fitting portion; 2. an aluminum core; 21. mounting grooves; 22. a camera mounting position; 10. die casting the composite; 101. an outer surface of the die cast composite; 102. an inner cavity of the die-cast composite; 103. an excess portion; 20. a finished product of an electronic product component; 3. a handset housing; 31. a sliding groove; 4. a metal marble.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.

it will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

referring to fig. 1, in a first embodiment, a method for processing an electronic product component includes the following steps:

aluminum extrusion: referring to fig. 2, an outer frame 1 of the electronic product component is formed by aluminum extrusion along the thickness direction of the electronic product component;

Grinding: referring to fig. 3, the outer surface 15 and the inner surface 16 of the outer frame 1 along the thickness direction are polished, the single-side polishing thickness is 0.2mm, the polishing speed is 550rpm, and the polishing time is as follows: 5 s/pcs;

first CNC processing: positioning by the shape of the outer frame 1, and carrying out CNC grinding on the peripheral surface 17 of the ground outer frame 1;

Laser etching: laser etching is carried out on the inner side surface of the outer frame 1 to form a net-shaped joint surface;

Die casting in a die: referring to fig. 4, the outer frame 1 after laser etching is subjected to aluminum composite die casting, so that other parts of the electronic product component are die-cast on the net-shaped joint surface of the outer frame 1, and a die-cast composite part 10 is obtained;

blanking: stamping out the excess part 103 of the die-casting composite 10;

polishing: CNC grinding and processing the die-casting composite part 10 after blanking, cleaning, and obtaining a semi-finished product of the electronic product part after full inspection without defects;

Surface treatment: the semi-finished product of the electronic product component is deburred and cleaned, and then is subjected to anodic oxidation treatment, so that the surface of the semi-finished product of the electronic product component is bright and smooth, and the finished product 20 of the electronic product component shown in fig. 6 is obtained.

Die-casting in the mould behind the crowded frame 1 of aluminium, and radium carving earlier on frame 1 for die-casting composite 10 structural strength that the die-casting formed in the mould is better, and the electron product part cohesion that forms is stronger. Compare in direct whole die-casting shaping play electronic product part, CNC processing and surface treatment's operation mode again, this kind of aluminium extrusion frame 1 processing back that combines die-casting can guarantee that electronic product part's outward appearance face is more smooth, can not appear the flow line phenomenon behind the 1 surface treatment of frame. In addition, the aluminum extrusion frame 1 forms the periphery of the electronic product component, and can form the internal structure of a part of the electronic product component during die casting in the die, thereby reducing the area of direct CNC processing, saving the manufacturing cost and improving the product yield and the processing efficiency.

Before die casting in the die, the inner side surface of the outer frame 1 is subjected to laser carving, so that a net-shaped joint surface is formed at the position of the outer frame 1 needing die casting combination. When other parts of the electronic product component are die-cast on the reticular combined surface, the adhesive force of the die-cast other parts on the reticular combined surface of the outer frame is better, and the structural strength of the die-cast composite part 10 generated by die-casting and combining on the outer frame 1 is better.

in a second embodiment, a method for processing an electronic component includes the steps of:

Aluminum extrusion: referring to fig. 2, an outer frame 1 of the electronic product component is formed by aluminum extrusion along the thickness direction of the electronic product component;

Grinding: referring to fig. 3, the outer surface 15 and the inner surface 16 of the outer frame 1 along the thickness direction are double-side polished, the thickness of the single-side polishing is 0.3mm, the polishing speed is 590rpm, and the polishing time is as follows: 5 s/pcs;

first CNC processing: positioning by the shape of the outer frame 1, and carrying out CNC grinding on the peripheral surface 17 of the ground outer frame 1;

laser etching: laser etching is carried out on the inner side surface of the outer frame 1 to form a net-shaped joint surface;

Die casting in a die: referring to fig. 4, the outer frame 1 after laser etching is subjected to aluminum composite die casting, so that other parts of the electronic product component are die-cast on the net-shaped joint surface of the outer frame 1, and a die-cast composite part 10 is obtained;

water removing opening: removing the water gap waste of the die-casting composite part 10 by punching, and cleaning for the first time;

And (3) second CNC machining: referring to fig. 5, the outer surface 101 and the inner cavity 102 of the die-cast composite 10 are finish ground;

Blanking: the excess part 103 of the die-casting composite part 10 is removed by punching, and secondary cleaning is carried out;

polishing and deburring: deburring and polishing the die-casting composite part 10 after blanking, cleaning for the third time, and obtaining a semi-finished product of an electronic product component after full inspection is carried out without defects;

surface treatment: polishing and sand blasting the semi-finished product of the electronic product part, and then carrying out anodic oxidation treatment to ensure that the surface of the semi-finished product of the electronic product part is bright and smooth;

and (3) third CNC machining: and (4) performing CNC tapping on the semi-finished product after surface treatment, cleaning for the fourth time, and obtaining a finished product 20 of the electronic product component shown in the figure 6 after no defects are detected completely.

In a third embodiment, a method for processing an electronic component includes the steps of:

aluminum extrusion: referring to fig. 2, an outer frame 1 of the electronic product component is formed by aluminum extrusion along the thickness direction of the electronic product component;

grinding: referring to fig. 3, the outer surface 15 and the inner surface 16 of the outer frame 1 along the thickness direction are double-side polished, the thickness of the single-side polishing is 0.35mm, the polishing speed is 600rpm, and the polishing time is as follows: 5 s/pcs;

First CNC processing: positioning by the shape of the outer frame 1, and carrying out CNC grinding on the peripheral surface 17 of the ground outer frame 1;

First laser etching: laser etching is carried out on the inner side surface of the outer frame 1 to form a net-shaped joint surface;

Die casting in a die: referring to fig. 4, the outer frame 1 after laser etching is subjected to aluminum composite die casting, so that other parts of the electronic product component are die-cast on the net-shaped joint surface of the outer frame 1, and a die-cast composite part 10 is obtained;

Water removing opening: removing the water gap waste of the die-casting composite part 10 by punching, and cleaning for the first time;

And (3) second CNC machining: referring to fig. 5, the outer surface 101 and the inner cavity 102 of the die-cast composite 10 are finish ground;

blanking: the excess part 103 of the die-casting composite part 10 is removed by punching, and secondary cleaning is carried out;

polishing and deburring: deburring and polishing the die-casting composite part 10 after blanking, cleaning for the third time, and obtaining a semi-finished product of an electronic product component after full inspection is carried out without defects;

surface treatment: polishing and sand blasting the semi-finished product of the electronic product part, and then carrying out anodic oxidation treatment to ensure that the surface of the semi-finished product of the electronic product part is bright and smooth;

and (3) third CNC machining: performing CNC tapping processing on the surface-treated semi-finished product, and cleaning for the fourth time;

Pasting the wear-resistant sheet: the method comprises the steps of pasting wear-resistant sheets on positions where the tapped semi-finished products and other components can be in sliding fit, milling away redundant parts 103 protruding out of the wear-resistant sheets through CNC machining, and enabling the electronic product components to be better in wear resistance when being installed in a matched mode with the other components through pasting the wear-resistant sheets, so that the outer surfaces of the electronic product components cannot be easily worn out;

and (3) laser etching for the second time: and radium carving LOGO, product information and the like on the surface of the semi-finished product pasted with the wear-resistant sheet, and obtaining a finished product 20 of the electronic product component shown in the figure 6 after full inspection without defects.

In an embodiment four, the method for processing the electronic product component includes the following steps:

aluminum extrusion: referring to fig. 2, an outer frame 1 of the electronic product component is formed by aluminum extrusion along the thickness direction of the electronic product component;

grinding: referring to fig. 3, the outer surface 15 and the inner surface 16 of the outer frame 1 along the thickness direction are double-side polished, the thickness of the single-side polishing is 0.25mm, the polishing speed is 520rpm, and the polishing time is as follows: 5 s/pcs;

first CNC processing: positioning by the shape of the outer frame 1, and carrying out CNC grinding on the peripheral surface 17 of the ground outer frame 1;

first laser etching: laser etching is carried out on the inner side surface of the outer frame 1 to form a net-shaped joint surface;

Die casting in a die: referring to fig. 4, the outer frame 1 after laser etching is subjected to aluminum composite die casting, so that other parts of the electronic product component are die-cast on the net-shaped joint surface of the outer frame 1, and a die-cast composite part 10 is obtained;

water removing opening: removing the water gap waste of the die-casting composite part 10 by punching, and cleaning for the first time;

Removing the flash: polishing to remove flash, burr and flash of the die-casting composite part 10;

aging treatment: aging the die-casting composite part 10 with the burrs removed for 2 to 5 hours at the temperature of 120 to 150 ℃;

and (3) second CNC machining: referring to fig. 5, the outer surface 101 and the inner cavity 102 of the die-cast composite 10 are finish ground;

Blanking: the excess part 103 of the die-casting composite part 10 is removed by punching, and secondary cleaning is carried out;

Polishing and deburring: deburring and polishing the die-casting composite part 10 after blanking, cleaning for the third time, and obtaining a semi-finished product of an electronic product component after full inspection is carried out without defects;

surface treatment: polishing and sand blasting the semi-finished product of the electronic product part, and then carrying out anodic oxidation treatment to ensure that the surface of the semi-finished product of the electronic product part is bright and smooth;

And (3) third CNC machining: performing CNC tapping processing on the surface-treated semi-finished product, and cleaning for the fourth time;

Pasting the wear-resistant sheet: the method comprises the steps of pasting wear-resistant sheets on positions where the tapped semi-finished products and other components can be in sliding fit, milling away redundant parts 103 protruding out of the wear-resistant sheets through CNC machining, and enabling the electronic product components to be better in wear resistance when being installed in a matched mode with the other components through pasting the wear-resistant sheets, so that the outer surfaces of the electronic product components cannot be easily worn out;

and (3) laser etching for the second time: and radium carving LOGO, product information and the like on the surface of the semi-finished product pasted with the wear-resistant sheet, and obtaining a finished product 20 of the electronic product component shown in the figure 6 after full inspection without defects.

The invention also discloses an electronic product component which is manufactured by adopting the processing method. In one embodiment, referring to fig. 1 and 6, the electronic product component includes: an aluminum extrusion frame 1 and an aluminum core 2. The aluminum extrusion frame 1 comprises a first frame body 11, a second frame body 12 and a third frame body 13, wherein one end of the first frame body 11 and one end of the third frame body 13 are respectively arranged at two opposite ends of the second frame body 12, the other end of the first frame body 11 and the other end of the third frame body 13 extend to the same side of the second frame body 12, and an accommodating cavity 14 is formed among the first frame body 11, the second frame body 12 and the third frame body 13. The aluminum core body 2 is arranged in the accommodating cavity 14 in a die-casting mode. The electronic product component has the advantages of better structural strength, smooth and attractive appearance surface and low manufacturing cost.

the electronic product part can be a rotatable camera of a mobile phone, the processed rotatable camera of the mobile phone is assembled on the mobile phone, and the electronic product is packaged and delivered after being inspected completely without defects. Referring to fig. 6, a rotation matching portion 18 is protruded outward from the third frame 13, an arc surface is disposed outside the rotation matching portion 18, an installation groove 21 is disposed at a position of the aluminum core 2 close to the rotation matching portion 18, and a camera installation position 22 is further disposed on the aluminum core 2. Referring to fig. 7 and 8, a movable cavity is formed in the top end of the mobile phone shell 3, the top end of the movable cavity is open, the mobile phone rotatable camera is rotatably disposed in the movable cavity, and the mobile phone rotatable camera can be rotated to expose the mobile phone shell 3 through the top end opening of the movable cavity. The mobile phone shell 3 is provided with the sliding groove 31, the rotating fit part 18 extends into the sliding groove 31, the groove wall of the rotating fit part 18 and the sliding groove 31 are matched to realize that the mobile phone rotatable camera rotates relative to the mobile phone shell 3, and the radian of the rotating fit part 18 can limit the rotating angle of the mobile phone rotatable camera. Can the centre gripping installation metal marble 4 in the mounting groove 21, when the rotatable camera of cell-phone was rotatory for cell-phone shell 3, can keep the circular telegram state through metal marble 4 always. The mobile phone camera is arranged in the camera mounting position 22. The rotatable camera of cell-phone is rotatory for the top of cell-phone shell 3 to make the cell-phone camera expose cell-phone shell 3.

The outer side surface of the first frame body 11 is polished into a circular arc shape, when the mobile phone rotatable camera rotates in the sliding groove 31 by taking the rotation matching part 18 as a fulcrum, one end of the mobile phone rotatable camera far away from the rotation matching part 18 can be in sliding fit with the cavity wall of the movable cavity through the circular arc surface of the first frame body 11, so that stable and smooth rotation is realized, and the mobile phone camera is exposed out of the mobile phone shell 3.

on two surfaces of aluminium core 2 along thickness direction, all processed wear pad installation position, in wear pad installation was located wear pad installation position, when the relative cell-phone shell 3's of the rotatable camera of cell-phone top was rotatory like this, the friction between rotatable camera of cell-phone and the cell-phone shell 3 can effectively be alleviated to the wear pad, and it is serious to avoid the outer surface wear of the rotatable camera of cell-phone.

in combination with the processing method of the electronic product component, in the step of extruding the aluminum profile, the outer frame 1 is extruded and molded along the thickness direction of the electronic product component, so that the appearance effect of the electronic product component can be better ensured. The electronic product part is rotatable installs in cell-phone shell 3, and the partial outer peripheral face 17 of frame 1 can expose cell-phone shell 3, and specifically, the surface of first framework 11 and second framework 12 can expose cell-phone shell 3, if along the extruded section bar of horizontal direction aluminium, the mouth of a river can produce on the outer peripheral face 17 of frame 1, polishes and surface treatment back, and the outward appearance effect of the outer peripheral face 17 of frame 1 is not good. By adopting the aluminum extrusion mode along the thickness direction, the water gap can be generated on the upper surface and the lower surface of the outer frame 1, the upper surface and the lower surface of the outer frame 1 are usually hidden in the mobile phone shell 3, and the appearance of electronic product parts cannot be influenced after the outer frame 1 is polished and treated.

the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

the above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.