阅读说明：本技术 一种显示模组、终端设备及显示模组的制作方法 (Display module, terminal equipment and manufacturing method of display module ) 是由 韦宏阳 于 2019-08-29 设计创作，主要内容包括：本发明提供一种显示模组、终端设备及显示模组的制作方法,显示模组,包括：第一玻璃和第二玻璃,所述第一玻璃的第一表面上设置有显示电路和驱动芯片,所述显示电路与所述驱动芯片电连接,所述第一玻璃的第二表面上设置有测试元件组测试点,所述TEG测试点与所述显示电路电连接,所述第一表面和所述第二表面为相对的表面；所述第二玻璃与所述第一表面层叠设置,且所述显示电路位于所述第一表面和所述第二玻璃之间,所述第二玻璃对应所述驱动芯片位置开设有避让槽,所述避让槽用于容置所述驱动芯片。本发明实施例可以提高显示模组的屏占比。(The invention provides a display module, terminal equipment and a manufacturing method of the display module, wherein the display module comprises the following components: the test device comprises first glass and second glass, wherein a display circuit and a driving chip are arranged on a first surface of the first glass, the display circuit is electrically connected with the driving chip, a test element group test point is arranged on a second surface of the first glass, the TEG test point is electrically connected with the display circuit, and the first surface and the second surface are opposite surfaces; the second glass with the range upon range of setting of first surface, just display circuit is located the first surface with between the second glass, the second glass corresponds the driver chip position has been seted up and has been dodged the groove, it is used for the holding to dodge the groove the driver chip. The embodiment of the invention can improve the screen ratio of the display module.)

1. A display module, comprising:

The display device comprises first glass, wherein a display circuit and a driving chip are arranged on a first surface of the first glass, the display circuit is electrically connected with the driving chip, a Testing Element Group (TEG) testing point is arranged on a second surface of the first glass, the TEG testing point is electrically connected with the display circuit, and the first surface and the second surface are opposite surfaces;

The second glass, the second glass with the range upon range of setting of first surface, just display circuit is located the first surface with between the second glass, the second glass corresponds the driver chip position has been seted up and has been dodged the groove, it is used for the holding to dodge the groove the driver chip.

2. the display module according to claim 1, wherein the first glass is provided with a through hole penetrating through the first surface and the second surface, and a conductive coating film electrically connected with the TEG test point and the display circuit respectively is arranged in the through hole.

3. The display module of claim 1, wherein the driving chip is located at a first edge of the first surface.

4. the display module of claim 3, wherein the driving chip is located at a middle position of the first edge.

5. The display module according to claim 3, further comprising a flexible circuit board, wherein the first edge is provided with a plurality of connecting wires, and the flexible circuit board is electrically connected to the first glass through the plurality of connecting wires.

6. A terminal device, characterized by comprising the display module of any one of claims 1-5.

7. a manufacturing method of a display module is characterized by comprising the following steps:

plating a display circuit, an electric connection circuit and a TEG test point on a first substrate to obtain first glass, wherein the display circuit is positioned on a first surface of the first substrate, the TEG test point is positioned on a second surface of the first substrate, the electric connection circuit is positioned on the first substrate and is respectively and electrically connected with the display circuit and the TEG test point, and the first surface and the second surface are oppositely arranged;

Forming an avoidance groove on the second substrate to obtain second glass;

and bonding the second glass and the first glass, packaging a driving chip at a position on the first surface corresponding to the avoidance groove, and electrically connecting the driving chip with the display circuit to obtain the display module.

8. the method of claim 7, wherein plating electrical connection lines on the first substrate comprises:

a through hole penetrating through the first surface and the second surface is formed in the first substrate;

and plating an electric connecting circuit in the through hole, wherein the electric connecting circuit is a conductive coating.

9. The method of claim 7, wherein plating the display circuitry, electrical connections, and TEG test points on the first substrate to obtain a first glass comprises:

plating a display circuit, an electric connection circuit and a TEG test point on a first substrate to obtain a cover plate to be detected;

and detecting the TEG test point of the cover plate to be detected, and determining the cover plate to be detected meeting the preset standard as the first glass.

10. The method according to any one of claims 7 to 9, wherein after the step of bonding the second glass to the first glass, encapsulating a driving chip on the first surface at a position corresponding to the avoiding groove, and electrically connecting the driving chip to the display circuit to obtain a display module, the method further comprises:

plating a connecting wire on a first edge of the first glass of the display module, wherein the connecting wire is electrically connected with the display circuit;

And electrically connecting one end of the flexible circuit board with the connecting wire to obtain the expanded display module.