阅读说明：本技术 研磨和/或腐蚀机，以及测定和/或核对机器的方法 (Grinding and/or etching machine, and method for testing and/or checking machine ) 是由 S.黑格勒 S.施奈布勒 于 2018-05-04 设计创作，主要内容包括：本发明涉及研磨和/或腐蚀机(10)以及用于测定和核对具有多个机器轴线(12)的组件(11)的方法,每一个机器轴线可以由旋转或平移机器轴线形成。为此,将测量盘(28)插入工具主轴(13)中,并将测试计(27)插入工件保持设备(14)中。测试计(27)电连接到参考电势,优选地连接到接地(M)。测量盘(28)电连接到电源电压电势(UV)。通过在测量盘(28)与测试计(27)之间建立接触,测量电流(IM)在电源电压电势(UV)与参考电势之间流动,例如从电源电压电势(UV)流到接地(M)。可以在监测设备(31)中检测测量电流(IM)的流动,并且可以确定测量电流(IM)的电流流动开始时机器轴线(12)的当前位置。经由轴线组件(11),可以接近测量盘(28)与测试计(27)之间的一个或多个接触位置(K),并且因此,可以核对或测量轴线组件(11)或机器。(The invention relates to a grinding and/or etching machine (10) and a method for determining and checking an assembly (11) having a plurality of machine axes (12), each of which can be formed by a rotating or translating machine axis. For this purpose, a measuring disk (28) is inserted into the tool spindle (13) and a test meter (27) is inserted into the workpiece holding device (14). The test meter (27) is electrically connected to a reference potential, preferably to ground (M). The measuring disk (28) is electrically connected to a supply voltage potential (UV). By establishing contact between the measuring disc (28) and the test meter (27), a measuring current (IM) flows between a supply voltage potential (UV) and a reference potential, for example from the supply voltage potential (UV) to ground (M). The flow of the measurement current (IM) can be detected in the monitoring device (31) and the current position of the machine axis (12) at the beginning of the current flow of the measurement current (IM) can be determined. Via the axis assembly (11), one or more contact positions (K) between the measuring disc (28) and the test meter (27) can be accessed and, thus, the axis assembly (11) or the machine can be checked or measured.)

1. Grinding and/or etching machine (10) having:

A tool spindle (13) which can be driven about a spindle axis (S) and which is configured to receive a grinding or etching tool (19),

A workpiece holding device (14) which is provided for accommodating a workpiece (20),

A machine axis arrangement (11) comprising a plurality of machine axes (12), the axis arrangement being configured for rotational or translational movement or for positioning of a tool spindle (13) and/or a workpiece holding device (14),

A position detection device (22) configured for detecting the position of each of the machine axes (12) present,

A first electrically conductive measuring body (27) which is configured to be accommodated in the workpiece holding device (14), and a second electrically conductive measuring body (28), which second electrically conductive measuring body (28) is configured to be accommodated in the tool spindle (13), wherein the second measuring body (28) accommodated in the tool spindle (13) can be connected to a supply voltage potential (UV) and a monitoring device (31), and wherein the first measuring body (27) accommodated in the workpiece holding device (14) can be connected to a specified reference potential (M),

A control device (21) connected to the monitoring device (31) and the position detection device (22) and configured to perform a method of determination and/or verification, comprising the steps of:

-driving at least one machine axis (12) in order to move the measuring bodies (27, 28) relative to each other and to bring them into contact with each other at a contact position (K),

-storing the actual position of at least one driven machine axis (12) in a memory when a monitoring device (31) detects that a measuring current (IM) flows between the measuring bodies (27, 28) due to contact.

2. Grinding and/or etching machine according to claim 1,

Characterized in that the control device (21) is configured to stop the drive of the at least one driven machine axis (12) when the monitoring device (31) detects a flow of a measurement current (IM) between the measurement bodies (27, 28) as a result of the contact.

3. Grinding and/or etching machine according to claim 1 or 2,

Characterized in that the control device (21) is configured to drive at least one machine axis (12) such that at least one existing rotating machine axis (12) displays a pre-specified rotational position upon contact between the measuring bodies (27, 28) at a contact position (K).

4. The grinding and/or etching machine of any one of the preceding claims,

Characterized in that the second measuring body is configured as a measuring disk (28) having an annularly closed outer circumferential surface (56) which surrounds a side surface (57).

5. Grinding and/or etching machine according to claim 4,

Characterized in that the control device (21) is configured to drive the at least one machine axis (12) such that the measuring disc (28) contacts the first measuring body (27) with its outer circumferential surface (56) or side surface (57).

6. The grinding and/or etching machine of any one of the preceding claims,

characterized in that the control device (21) is configured to drive at least one machine axis (12) such that a series of different contact positions (K) is reached in succession.

7. The grinding and/or etching machine of any one of the preceding claims,

Characterized in that the control device (21) is configured to drive at least one machine axis (12) such that the number of contact positions (K) reached in succession corresponds to the number of those machine axes (12) which are configured to change the relative position between the measuring bodies (27, 28).

8. the grinding and/or etching machine of any one of the preceding claims,

Characterized in that the monitoring device (31) comprises a monitoring unit (32), the monitoring unit (32) being configured to monitor whether the second measurement body (28) is electrically connected to the supply voltage potential (UV).

9. Grinding and/or etching machine according to claim 8,

Characterized in that the monitoring unit (32) is a component of the control device (21) or is communicatively connected to the control device (21), and the control device (21) is configured to drive the axis arrangement (11) in a safe operation mode when the monitoring unit (32) has determined an electrical connection between the second measurement body (28) and the supply voltage potential (UV).

10. The grinding and/or etching machine of any one of the preceding claims,

characterized in that the second measuring body (28) is connected to the first contact piece (35) of the electrical connection part (33) via a connection line (41).

11. Grinding and/or etching machine according to claim 10,

Characterized in that the electrical connection part (33) has a second contact (36) and a third contact (37) which are short-circuited to each other.

12. The grinding and/or etching machine of any one of the preceding claims,

Characterized in that there is a mating electrical connection part (34) with a first mating contact (38) which is connected to a supply voltage potential (UV) by a first conductor (42) via a monitoring part (43) of the monitoring device (31).

13. grinding and/or etching machine according to claim 12,

Characterized in that the mating connection part (34) has a second mating contact (39) which is connected to a supply voltage potential (UV) by a second conductor (49), and in that the mating connection part (34) comprises a third mating contact (40) which is connected to a monitoring unit (32) of the monitoring device (31) by a third conductor (50).

14. Grinding and/or etching machine according to claim 10 and claim 12,

Characterized in that the first contact (35) is electrically connected to the first counterpart contact (38) with the establishment of an electrical connection between the connection part (33) and the counterpart connection part (34).

15. A grinding and/or etching machine according to claim 11 and claim 13,

Characterized in that, with the establishment of an electrical connection between the connection part (33) and the counterpart connection part (34), the second contact (36) is electrically connected to the second counterpart contact (39), and the third contact (37) is also electrically connected to the third counterpart contact (40).

16. A method of testing and/or checking a grinding and/or etching machine (10), said grinding and/or etching machine (10) having:

a tool spindle (13) which can be driven about a spindle axis (S) and which is configured to receive a grinding and etching tool (19),

A workpiece holding device (14) configured for accommodating a workpiece (20),

having a machine axis arrangement (11), the machine axis arrangement (11) comprising a plurality of machine axes (12), the axis arrangement being configured for a rotational or translational movement or positioning of the tool spindle (13) and/or the workpiece holding device (14),

A position detection device (22) configured for detecting the position of each of the machine axes (12) present,

A first electrically conductive measuring body (27) and a second electrically conductive measuring body (28),

And a control device (21),

wherein the method comprises the steps of:

-inserting a first measuring body (27) into the workpiece holding device (14) and electrically connecting the first measuring body (27) to a defined reference potential (M),

-inserting a second measuring body (28) into the tool spindle (13) and electrically connecting the second measuring body (28) to a supply voltage potential (UV) and monitoring device (31),

-driving at least one machine axis (12) in order to move the measuring bodies (27, 28) relative to each other and to bring them into contact with each other at a contact position (K),

-storing the actual position of the at least one driven machine axis (12) in a memory when the monitoring device (31) detects that a measuring current (IM) flows between the measuring bodies (27, 28) as a result of the contact.

Technical Field

the invention relates to a grinding and/or etching machine and a method for testing and checking a machine.

background

An abrading and/or eroding machine includes multiple machine axes to allow movement and positioning of a workpiece to be treated relative to a tool. For accurate machining, the position of the machine axis relative to the stationary coordinate system of the machine base or machine frame needs to be known.

The publication DE 102008004849B 4 suggests to provide a multi-axis verification sensor arrangement in order to perform a verification procedure with a component for machining and an axis of translation and rotation during the interruption, since the relative position between the workpiece holding device and the workpiece is determined in several dimensions. To this end, the multi-axis checkpair sensor arrangement comprises one checking sensor for each spatial direction, respectively, in which case the checking sensor may be configured as a contact sensor or a proximity sensor.

when using contact sensors or force sensors, it must be ensured that the force with which the tool or workpiece is pressed against the respective checking sensor can be adjusted very precisely. Therefore, the requirements on sensor accuracy and consistency are very high. If proximity sensors are used, these must be adjusted with a high degree of accuracy in order to set the position at which the proximity element is detected. All types of sensors must exhibit high detection accuracy with minimal tolerances. Furthermore, the use of contact, force or proximity sensors in machine tools is often problematic because they are exposed to contamination from debris, cooling fluids, etc.

Disclosure of Invention

It may therefore be considered an object of the present invention to provide a grinding and/or etching machine, and a method of testing or checking the machine, which provides a high degree of accuracy in a simple manner.

This object is achieved by a grinding and/or etching machine exhibiting the features of patent claim 1 and by a method exhibiting the features of patent claim 16.

According to the invention, the grinding and/or etching machine comprises a tool spindle, which can be driven about a spindle axis, at which a grinding or etching tool can be arranged. A workpiece holding apparatus for a workpiece to be machined is provided. The machine includes a machine axis arrangement having a plurality of machine axes. Each machine axis may be configured to rotate or translate the machine axis. Up to six machine axes may be provided, each being provided to position or move the tool spindle or a tool provided at the tool spindle relative to the workpiece holding device or a workpiece arranged there, in order to be able to carry out a desired process. The position detection device detects the position of each of the existing machine axes. To achieve this, the position detection device may comprise a position sensor that measures the position in the respective translational or rotational degree of freedom. The position detection device may also determine the position of the machine axis based on other parameters that are characteristic of the respective position. Thus, the position detection may be based on directly measured actual position values or on indirect parameters describing the actual position.

An electrically conductive measuring body, preferably an electrically conductive test spindle, and an electrically conductive measuring disk for determination or verification. A first measuring body, in particular a test spindle, can be arranged in the workpiece holding device, while a second measuring body, in particular a measuring disk, can be arranged in the tool spindle. For the determination or checking, the second measuring body is connected to a supply voltage potential, so that a voltage is applied to the second measuring body, which preferably corresponds to the supply voltage potential. The first measuring body arranged in the workpiece holding device is electrically connected to a defined reference potential which is lower than the supply voltage potential. The reference potential preferably serves as ground potential (0 volts). Furthermore, the second measuring body is connected to a monitoring device.

Via the control device, the measuring bodies can be moved, positioned or aligned relative to each other. The control device of the machine controls the machine axes in order to move the measuring bodies towards each other in an opposite manner so that they contact each other at the contact location. As soon as this contact occurs at the contact location, a measuring current flows between the measuring bodies and preferably from the second measuring body having the higher potential to the first measuring body having the lower potential. The measuring current is detected by a monitoring device connected to the second measuring body. As soon as the measuring current is detected, the actual position of at least one drive machine axis or all machine axes is stored in a memory. Thus, due to the contact between the two measuring bodies, a reference position can be determined at the contact position. The determination of the reference position may be very accurate. It has been found that the measuring current can be detected very accurately directly after the contact between the measuring bodies. At this time, appropriate actual positions may be detected and stored as reference positions, respectively. No difference due to a change in contact pressure between the measuring bodies occurs.

such machines and methods do not require expensive or complex sensor systems, respectively. The detection of the measuring current may be performed outside the operating range of the machine. No sensitive sensors are required within the machine operating range. Thus, the checking and the determination can be performed in a simple, cost-effective manner, respectively, while having a high accuracy.

Preferably, the drive of the at least one driven machine axis is stopped as soon as contact between the measuring bodies is detected. Thus, high contact pressures between the measuring bodies are avoided.

For the purpose of determination and verification, respectively, it is advantageous to approach a series of contact positions one after the other. For example, there may be at least two, three or more contact positions per series in order to perform a particular measurement or to compare the orientation between the machine axes with each other. In this case, the orientation of one or more rotating machine axes may be specified for at least one contact location. The approach movement directly before and up to the contact between the measuring bodies is preferably carried out by a single, in particular translational, machine axis.

in a preferred exemplary embodiment, the second measuring body can be configured as a measuring disk having an outer circumferential surface and a side surface which are closed in an annular manner, wherein the outer circumferential surface surrounds the side surface adjoining the surface. For example, the measuring disc may be a disc of circular outline. In connection with this, it is possible for the measuring disc to contact another first measuring body which has an outer circumferential surface or a side surface at the location of the contact. Depending on where the contact position on the first measuring body (e.g. the test spindle) is arranged and which machine axes are used for the relative movement before the contact position is reached.

In order to determine and verify all the machine axes of the grinding and/or etching machine, respectively, the number of successive series of contact positions preferably corresponds to the number of those machine axes which are provided to vary the relative position between the measuring bodies. In this case, the axis of rotation of the first measuring body about its longitudinal axis can be realized without taking into account one machine axis.

in a preferred exemplary embodiment, the monitoring device comprises a monitoring unit. The monitoring unit may be a component of the control device or communicatively connected to the control device.

Preferably, the monitoring unit is arranged to monitor whether the second measuring body is electrically connected to the supply voltage potential. The corresponding monitoring results may be transmitted to the control device or made available to the control device in another suitable way. The control device can be switched into the safe operating mode if the monitoring device determines that an electrical connection between the second measuring body and the supply voltage potential has been achieved. Therefore, it can be said that the workpiece processing has not been performed, but the measurement and the collation have been performed separately. Subsequently, a safe operation mode is initiated and the control device controls the machine axis arrangement to maintain at least one limit of the safe operation mode.

In the safety operating mode, for example, the operation of the tool spindle can be prevented, so that the second measuring body is prevented from rotating about the spindle axis. Alternatively or additionally, the driving force or torque of one or more machine axes may be limited to a maximum force or torque. Thus, damage to the measuring body due to a large contact pressure can be avoided. For this purpose, for example, the electric motors belonging to the respective machine axes and representing their drives can be subjected to a torque limitation, for example by appropriately limiting the motor current. In order to limit the force or torque of the respective machine axis, for example, a measurement and a limitation of the motor current can be carried out.

It is advantageous if the second measuring body is electrically connected to the first contact of the electrical connection member via a connection line. Further, the electrical connection member may include a second contact and a third contact that can be short-circuited to each other.

mating electrical connection components may be provided for making electrical connection with the connection components. The mating connection part comprises a first mating contact which is connected to a supply voltage potential via a monitoring device by means of a first conductor. In this first conductor, monitoring components of a monitoring device may be arranged, said device providing switching functions, such as transistors, relays, optocouplers, etc. Preferably, the monitoring component may additionally provide galvanic isolation of the first conductor from the measurement circuit.

Furthermore, it is advantageous if the mating connection part has a second mating contact which is connected to the supply voltage potential via a second conductor. Furthermore, an optional third mating contact may be provided, which is connected to the monitoring device, and in particular to the monitoring unit of the monitoring device, by a third conductor.

by establishing a connection between the connection part and the counterpart connection part, an electrical connection is achieved between the first contact and the first counterpart contact. If present, an electrical connection is also made between the second contact and the counter-contact and/or between the third contact and the third counter-contact. Due to the short circuit between the second contact and the third contact, an electrical connection between the supply voltage potential and the monitoring device and the monitoring unit, respectively, is achieved as the connection between the connection part and the counter-connection part is established. In this way, the connection of the second measuring body to the supply voltage potential can be detected and, for example, a safe operating mode can be initiated.

Drawings

Advantageous embodiments of the invention can be inferred from the dependent patent claims, the description and the drawings. Hereinafter, preferred exemplary embodiments of the present invention will be explained in detail with reference to the accompanying drawings. They are shown in the following figures:

Figure 1 is a schematic illustration of a similar block diagram of an exemplary embodiment of a grinding and/or etching machine,

Figure 2 is a schematic side view of an exemplary embodiment of a grinding and/or etching machine according to the block diagram of figure 1,

Figure 3 is a basic diagram of an exemplary embodiment of the electrical connection of the measuring disk to the supply voltage potential and the monitoring device and of the test spindle to the reference potential,

fig. 4 to 7 are schematic illustrations of a side view (fig. a) and a plan view (respectively fig. b) of the test spindle and the measuring disc of fig. 1 to 3 with different contact positions.

Detailed Description

Fig. 1 and 2 show an exemplary embodiment of a grinding and/or etching machine 10 in an extremely simplified manner. The grinding and/or etching machine 10 comprises a machine axis arrangement 11 comprising at least one, and preferably a plurality of translational and/or rotational machine axes 12. In the exemplary embodiment shown here, the axis arrangement 11 comprises three translation axes, namely an X-axis 12X, a Y-axis 12Y and a Z-axis 12Z. Furthermore, according to this example, the machine axis arrangement 11 comprises two rotating machine axes, namely an a-axis 12a and a C-axis 12C. Via the C-axis 12C, a rotation about a rotation axis R extending parallel to the Y-direction and the Y-axis 12Y, respectively, is possible. By means of the a-axis, rotation is possible about axes extending parallel to the X-direction and the X-axis 12X, respectively. Alternatively, there may be an axis of rotation with which a rotation about an axis of rotation is possible, said axes extending parallel to the Z direction and the Z axis 12Z, respectively. With reference to the exemplary embodiment shown in fig. 2, only five machine axes 12 are provided, namely three translational machine axes 12x, 12y, 12z, and two rotational machine axes 12a and 12 c.

By means of the machine axis arrangement 11, the tool spindle 13 and/or the tool holding device 14 can be moved relative to the machine base 15, so that a relative movement between the tool spindle 13 and the workpiece holding device 14 can also be achieved. In this case, different axis configurations may be used. For moving the tool spindle 13, one or more translational or rotational machine axes 12 may be used, and for moving the workpiece holding device 14, the other translational or rotational machine axes 12 may be moved accordingly. Referring to the exemplary embodiment shown in fig. 2, the Y-axis 12Y and the Z-axis 12Z may be used to move the tool spindle 13, while the X-axis 12X and the C-axis 12C may be used to move the workpiece holding device 14. The A-axis 12a is arranged to drive the workpiece holding device 14 about the longitudinal axis L of the workpiece holding device 14

the machine axes 12 of the axis arrangement 11 are only symbolically shown in fig. 1 and are only shown in fig. 2 by their schematically shown axes of rotation or slides. The tool spindle 13 is located on a first slide 15, which first slide 15 can be moved by means of the Y axis 12Y relative to a second slide 16. The second slide 16 carrying the first slide 15 can move relative to the machine base 15 through the Z-axis 12Z. The third slider 17 is arranged on the machine base 15 so as to be movable via the X axis 12X and carries the C axis 12C. The C-axis 12C allows the carrier 18 to be rotated about the axis of rotation R. In turn, the Z-axis 12a and the workpiece holding device 14 are located on the carriage 18, in which case the a-axis 12a can drive the workpiece holding device 14 about the longitudinal axis L

Thus, by means of the machine axis arrangement 11, the tool spindle 13 can be aligned and positioned, respectively, with respect to the workpiece holding device 14. The tool spindle 13 is provided for receiving a tool 19, for example a grinding tool and/or an erosion tool. By means of the tool spindle 13, a tool 19, for example an abrasive disc, can be driven in rotation about the spindle axis S. The tool spindle 13 or an associated spindle drive (not shown) is actuated by a control device 21, which control device 21 can specify the desired rotation rate.

the workpiece holding device 14 is arranged for receiving and clamping a workpiece 20, respectively. The workpiece 20 may be rotated or pivoted about its longitudinal axis L by the a-axis 12a, or about the axis of rotation R by the C-axis 12C. The angle between the longitudinal axis L and the spindle axis S is adjusted due to the pivoting movement about the rotation axis R by the C-axis 12C. According to this example, the angle may vary between 0 ° and 180 °.

Via the control device 21, the machine axis arrangement 11 is also activated such that each machine axis 12 can be driven individually. The position of each machine axis 12 is detected by a position detection device 22. In this case, each machine axis 12 may be associated with a position sensor 23, in order to detect a respective position value a_ist、C_ist、X_ist、Y_ist、Z_ist("ist" [ as is)]= actual) and transmits it to the control device 21. If there are additional axes of rotation, the corresponding actual values can be transmitted by the position detection device 22 to the control device 21, which is shown in fig. 1 by dashed lines.

As an alternative to the proposed embodiment, the position detection may also be implemented by the position detection device 22 based on other values that are characteristic of the respective actual position. The actual position value need not be measured directly.

According to an example, the grinding and/or etching machine 10 is configured to perform a method of determining or checking a machine axis 12. For this purpose, not the workpiece, but a first, electrically conductive measuring body (according to the example, the test spindle 27) can be inserted into the workpiece holding device 14. Furthermore, instead of the tool 19, a second measuring body (according to the example, a measuring disk 28) which is electrically conductive can be inserted into the tool spindle 13. The test spindle 27 is electrically connected to a fixed reference potential and, according to the example, to ground M. This connection can be effected directly via the wire on the test spindle 27 or indirectly via the workpiece holding device 14.

The measuring disk 27 is electrically connected to the supply voltage potential UV. Via an electrical isolation 29, a shaft section 30 of the shaft connected to the measuring disc 28 is electrically isolated with respect to the measuring disc 28. Via a shaft section 30, a measuring disk 28 is accommodated in the tool spindle 13. Therefore, the supply voltage potential UV applied to measuring disk 28 is not applied to tool spindle 13, and current is prevented from flowing into or through tool spindle 13 by electrical isolation 29.

Furthermore, the measuring disc 28 is electrically connected to a monitoring device 31. The monitoring device 31 comprises a monitoring unit 32. The monitoring device 31 or at least the monitoring unit 32 may be a component of the control device 21 or may be communicatively connected to the control device 21. The electrical connection between the monitoring device 31 and the measuring disc 28 is realized via a connecting device having a connecting part 33 and a counter-connecting part 34. The connection part 33 is preferably configured as a plug and the counterpart connection part 34 as a socket. For example, the counter-connecting part 34 can be attached to the grinding and/or etching machine 10 in the region of the tool spindle 13, for example to the first slide 15 or to a carrier for the tool spindle 13, which carrier of the tool spindle 13 is connected to the carrier of the first slide 15.

In the exemplary embodiment, the connection inlet 33 has a first electrical contact 35 and, according to the example, additionally a second electrical contact 36 and a third electrical contact 37. The electrical contacts 35, 36, 37 may be configured as pins. As can be inferred from fig. 3, the second contact 36 and the third contact 37 are electrically short-circuited by the connection part 33 and are located in the connection part 33, respectively.

the mating contact member 34 has at least one first electrical mating contact 38. In the exemplary embodiment, there is additionally a second electrical mating contact 39 and a third electrical mating contact 40. The mating contacts 38, 39, 40 may be configured as receptacles for receiving respectively associated pins.

The first electrical contact 35 is electrically connected to the measuring pad 28 via a connection line 41. The connection line 41 is a flexible line, such as a spiral cable.

The first mating contact 38 is connected to the monitoring device 31 by a first conductor 42. In the exemplary embodiment, first conductor 42 is electrically connected to supply voltage potential UV via monitoring component 43. The monitoring component 43 has an electrical switching function and is arranged to trigger an electrical switching operation when a measurement current IM flows through the first conductor 42. This electrical switching operation is detected by the monitoring unit 32 which is electrically connected to the monitoring part 43.

In the exemplary embodiment described herein, the monitoring component 43 also provides galvanic isolation. When the secondary side of the monitoring section 43 is arranged in the secondary circuit 44, the primary side of the monitoring section 43 is switched in the first conductor 42.

In an exemplary embodiment, the monitoring component 43 is an optical coupler 45. The optocoupler diode is electrically connected on the anode side to the supply voltage potential UV and on the cathode side to the first mating contact 38. The optocoupler transistor is electrically connected to the secondary voltage potential US on the collector side and to the first monitoring input 46 on the emitter side. As soon as the measurement current IM flows through the first conductor 42 and thus through the optocoupler diode, the optocoupler transistor becomes conductive and electrically connects the first monitoring input 46 to the secondary voltage potential US. However, if no measurement current IM flows through the optocoupler diode, the optocoupler transistor blocks and the secondary voltage potential US is electrically disconnected from the first monitoring input 46. Due to the switching operation of the optocoupler transistor, the presence of the measurement current IM in the first conductor 42 can be detected.

The secondary circuit 44 can also be configured electrically differently by means of the monitoring component 43 or the optocoupler 45. For example, the first monitoring input 46 may be directly connected to the secondary voltage potential US and the collector of the optocoupler transistor. The emitter of the optocoupler transistor may then be connected via a resistor to a potential lower than the secondary voltage potential US, e.g. a secondary ground potential. In this case, when the measurement current IM flows through the second conductor 42 on the primary side, a secondary ground potential is applied to the first monitoring input 46, while the optocoupler transistor is otherwise blocked, and a secondary voltage potential US is applied to the first monitoring input 46.

Further modifications of the monitoring device 31 and the secondary circuit 44, respectively, are also possible. Instead of the optocoupler 45, a relay or another monitoring component 43 causing a switching operation may be used, which component may or may not have galvanic isolation.

The second counter-contact 39 is electrically connected to the supply voltage potential UV via a second conductor 49, which is preferably directly connected. The third counterpart contact 40 is electrically connected, preferably directly electrically, to the second monitoring input 51 via a third conductor 50.

If an electrical connection, and preferably also a mechanical connection, is established between the connection part 33 and the counter-connection part 34, an electrical connection is performed between the first contact 35 and the first counter-contact 38, between the second contact 36 and the second counter-contact 39 and between the third contact 37 and the third counter-contact 40, respectively. Due to the short-circuit connection between the second contact 36 and the third contact 37, the first conductor 49 is electrically connected to the third conductor 50, as a result of which the supply voltage potential UV is applied to the second monitoring input 51. The monitoring device 31 of the monitoring unit 32 may detect via the second monitoring input 51 that an electrical connection is formed between the connecting part 33 and the counter-connecting part 34.

preferably, the monitoring unit 32 is arranged to generate a suitable signal when detecting an electrical connection between the connection part 33 and the counter-connection part 34 and to provide said signal to the control device 21. The control device 21 then operates the grinding and/or etching machine 10 in a safe operating mode. In the safety mode of operation, the tool spindle 13 is prevented from driving and/or the test spindle 27 from rotating about the spindle axis S about the longitudinal axis L. As a result, the measuring disc 28 inserted in the tool spindle 13 can be prevented from rotating.

alternatively or additionally, one or more machine axes 12 may be operated in a safe mode of operation while the force or torque is limited. As a result, excessive forces or torques are prevented from acting on the measuring disk 28 or the test spindle 27 when these measuring bodies 27, 28 are in contact with one another or with another component of the grinding and/or etching machine 10. For this purpose, the drive torque of the motor concerned of the respective machine axis 12 can be limited, for example, by suitable current limiting of the motor current.

When the measuring disc 28 and the test spindle 27 are moved relative to each other via the machine axis arrangement 11 and are in contact with each other at the contact position K, an electrically conductive connection is formed between the measuring disc 28 and the test spindle 27. Due to the potential difference between the supply voltage potential UV applied to the measuring disk 28 and the reference potential (ground M) applied to the test spindle 28, according to this example, a measuring current IM flows from the measuring disk 28 through the test spindle 27 and onto the ground M. This current flow causes the monitoring component 43 to switch so that the monitoring device 31 can detect the current flow of the measurement current IM. At this point, the current position of the respective machine axis detected via the position detection device 22 is stored or otherwise registered.

this arrangement enables contact between the measuring disc 28 and the test spindle 27 to be detected quickly and accurately (without the use of contact or proximity sensors in the working range of the grinding and/or etching machine 10).

In particular, the control device 21 is arranged to move the measuring disc 28 into contact with the test spindle 27 at a specified series of contact positions. Preferably, the measuring disc 28 has an outer peripheral surface 54, which outer peripheral surface 54 forms the edge of the measuring disc 28 and defines its contour. The outer circumferential surface 54 surrounds a side surface 55 facing away from the shaft section 30. The measuring disk 28 can be brought into contact with the test spindle 27 with its side surface 55 or with its peripheral surface 54.

Each of fig. 4 to 7 schematically shows the approach to the contact position in a specified alignment between the longitudinal axis L and the spindle axis S. For testing and/or checking the grinding and/or etching machine, a series of a plurality of contact positions K on the test spindle 27 can be approached and the measuring disk 28 can be brought into contact with the test spindle 27 there. For this purpose, the contact can be achieved with a side surface 55 or with an outer circumferential surface 54 on the measuring disk 28. The contact position K may be provided on the generating surface 56 or the face 57 of the test spindle 27.

the number of contact positions K corresponds to the number of machine axes 12 arranged to move the measuring disc 28 relative to the test spindle 27. According to this example, it is four machine axes, since the a-axis 12a can cause the test spindle 27 to rotate about its longitudinal axis L, which, however, does not change the relative position between the measuring disc 28 and the test spindle 27. Thus, the test spindle 27 approaches in three different contact positions K in a first position of the C-axis of a given rotation angle about the rotation axis R, corresponding to the three translation axes 12x, 12y and 12 z. Furthermore, at least one contact position K approaches in another rotational position of the C-axis 12C about the rotational axis R. For example, two rotational positions about the rotational axis R may differ from each other by 90 °.

In an exemplary embodiment, the longitudinal axis L may be initially aligned in the x-direction (fig. 4-6). In this alignment of the test spindle 27, using the Y axis 12Y, the measurement disc 28 is moved at a first contact position where the side surface 55 abuts against the generation surface 56, and the position of the first contact position is detected (fig. 4a and 4 b). Subsequently, using the Z axis 12Z, the outer circumferential surface 54 of the measuring disc 28 is moved against the generating surface 56 of the test spindle 27 in at least one further contact position K and this position is detected (fig. 5a and 5 b). Finally, another contact position K on the face 57 of the test spindle 27 is approached, in which case the X axis 12X is used, and in which case the relative movement takes place via the movement of the test spindle 27 towards the measuring disk 28. By detecting these three contact positions, the relative position of the translation axis with respect to the longitudinal axis L and the spindle axis S can be determined. For checking the rotation C-axis 12C, a rotation of the C-axis about the rotation axis R by a specified rotation angle, for example 90 °, is carried out, and subsequently, contact is established between the test spindle 27 and the measuring disk 28 using at least one of the translation axes 12x, 12y, 12 z. In the exemplary embodiment shown in fig. 7a and 7b, this relative movement is effected by the X-axis 12X. In this C-axis pivot position, further contact positions can be approached and the corresponding positions determined.

With the described grinding and/or etching machine 10, a number of geometric measurements can be performed. For example, the test spindle 27 may be moved by the measuring disk 28 along the longitudinal axis L to one or more contact positions K, for example using the Y-axis 12Y. Subsequently, the test spindle 27 can be rotated about the longitudinal axis L by a specified rotation angle and moved again to the same position along the longitudinal axis L by the measuring disk 28. In this way, the concentricity of the a-axis 12a can be determined.

The parallelism of the a-axis 12a relative to the X-axis 12X can also be determined. Using the X-axis 12X, the test spindle 27 and the measuring disc 28 can be brought into contact at the contact position. Subsequently, the C-axis is rotated by a specified rotation angle, preferably 180 °, and the X-axis 12X is used again to approximate the contact position between the test spindle 27 and the measuring disk 28. Based on this, the axis parallelism can be determined. Similarly, the Z axis may be used to determine the parallelism of the A axis 12a relative to the Z axis 12Z.

By using the Y axis 12Y to move across multiple contact locations K on the face 57 of the test spindle 27, for example, the right angle of the a axis 12a relative to the Y axis 12Y can be determined. If the face 57 is too small for this, a disk electrically connected to the ground M can be used as the first measuring body instead of the test spindle 27.

When the a-axis 12a is oriented parallel to the X-axis 12X, the axis of rotation R should bisect the longitudinal axis L. By moving to the contact position K at the intersection between the axis or rotation and the generating surface 56 of the test spindle 27 at different rotational or orbital positions about the axis of rotation R, a center offset between the axis of rotation R and the longitudinal axis L can be determined.

Additional measurements and checks may be made as desired by the above-described grinding and/or etching machine. For this purpose, a series of contact positions K can be approached in each case. For each contact position, a desired orientation of the longitudinal axis L relative to the spindle axis S may be specified. If there are further rotating machine axes in addition to the C-axis 12C explained according to the example, it is also possible to specify their angular position for each position detection of the contact position K.

The described determination or verification operation can similarly be performed with other axis arrangements. Whether the grinding spindle 13 is moved relative to the machine base 15 or whether the workpiece holding device 14 is moved relative to the machine base 15 depends on the respective specific axis arrangement.

The present invention relates to a grinding and/or etching machine 10, and a method for determining and checking an axis arrangement 11 comprising a plurality of machine axes 12, wherein each machine axis may be configured to rotate or translate a machine axis. For this purpose, a first measuring body (test spindle 27) is inserted into the workpiece holding device 14 and a second measuring body (measuring disk 28) is inserted into the tool spindle 13. The test spindle 27 is electrically connected to a reference potential, preferably to ground M. The measuring disk 28 is electrically connected to the supply voltage potential UV. By making contact between the measuring disc 28 and the test spindle 27, a measuring current IM flows between the supply voltage potential UV and the reference potential and, according to the example, from the supply voltage potential UV to the ground M. The flow of this measurement current IM can be detected in the monitoring device 31 and the actual position of the machine axis 12 at the beginning of the current flow of the measurement current IM can be determined. Via the axis arrangement 11, one or more contact positions K between the measuring disc 28 and the test spindle 27 can be accessed, and thus a check or determination of the axis arrangement 11 and the machine, respectively, can be carried out.

List of reference numerals

10 grinding and/or etching machine

11 axis arrangement

12 machine axis

12a A-axis

12c C-axis

12x X-axis

12y Y-axis

12z Z-axis

13 tool spindle

14 workpiece holding apparatus

15 first slide

16 second slide block

17 third slide block

18 bracket

19 tool

20 workpiece

21 control device

22 position detection device

27 test mandrel

28 measuring disc

29 spacer

30 shaft segment

31 monitoring device

32 monitoring unit

33 connecting part

34 mating connection parts

35 first contact member

36 second contact member

37 third contact member

38 first mating contact

39 second mating contact

40 third mating contact

41 connecting line

42 first conductor

43 monitoring component

44 Secondary circuit

45 optical coupler

46 first monitoring input

49 second conductor

50 third conductor

51 second monitoring input

54 measuring disc outer peripheral surface

55 side surface of measuring disk

56 test mandrel generating surface

57 testing the faces of the mandrel

IM measurement current

K contact position

l longitudinal axis

M ground

R axis of rotation

S spindle axis

US secondary voltage potential

UV power supply voltage potential.