阅读说明：本技术 蓝宝石衬底切割片再生加工方法 (Sapphire Substrate cutting sheet process for regenerating ) 是由 徐良 蓝文安 占俊杰 阳明益 刘建哲 余雅俊 于 2019-08-09 设计创作，主要内容包括：本发明提供的一种蓝宝石衬底切割片再生加工方法,涉及半导体技术领域,步骤如下：a、选取待加工的衬底切割片；b、将衬底切割片的单面固定于万向平台上；c、通过研磨砂轮对所述衬底切割片的待加工面上具有厚度差异、表面晶体轴向偏轴的部位进行研磨修整。在上述技术方案中,搭配万向平台和研磨砂轮,可以修复切割衬底时由于金刚石线端跳、定角时角度定错等问题而造成的厚度差异过大、表面晶体轴向偏轴的缺陷,使缺陷衬底切割片经过研磨修整后能够重复使用。(A kind of Sapphire Substrate cutting sheet process for regenerating provided by the invention, is related to technical field of semiconductors, steps are as follows: a, choosing substrate cutting sheet to be processed；B, the single side of substrate cutting sheet is fixed in gimbaled platform；C, cutting down is carried out to the position with difference in thickness, surface crystal axial direction off-axis on the face to be processed of the substrate cutting sheet by grinding wheel.In the above-mentioned technical solutions, gimbaled platform of arranging in pairs or groups and grinding wheel, when can repair cutting substrate as when diamond line end jumps, determine angle the problems such as angle fixed mistake and caused by difference in thickness is excessive, defect of the axial off-axis of surface crystal, reuse defect substrate cutting sheet can after cutting down.)

1. a kind of Sapphire Substrate cutting sheet process for regenerating, which is characterized in that steps are as follows:

A, substrate cutting sheet to be processed is chosen；

B, the single side of the substrate cutting sheet is fixed in gimbaled platform；

C, by grinding wheel on the face to be processed of the substrate cutting sheet with difference in thickness, surface crystal axial direction off-axis Position carries out cutting down.

2. according to Sapphire Substrate cutting sheet process for regenerating described in claim 1, which is characterized in that in step a, utilize Calibrator measures the thickness of the substrate cutting sheet various pieces, when detecting the substrate cutting sheet difference in thickness When difference is between 30 microns~5 millimeters, the corresponding substrate cutting sheet is selected with to be processed.

3. according to Sapphire Substrate cutting sheet process for regenerating described in claim 1, which is characterized in that in stepb, adjustment Levelness of the substrate cutting sheet in the gimbaled platform, and make the crystal orientation face of the substrate cutting sheet side to be processed with The single side of the substrate cutting sheet, is fixed in gimbaled platform by the angle that 0.2 degree is formed between the grinding wheel with this.

4. according to Sapphire Substrate cutting sheet process for regenerating as claimed in claim 3, which is characterized in that in stepb, described Gimbaled platform selects magnechuck platform, and the magnechuck platform includes magnechuck and around one week side of magnechuck Wall, the circumferential direction of the side wall are evenly arranged with several threaded holes, adjusting bolt are equipped in the threaded hole；

The fixture for clamping the substrate cutting sheet, the end tool for adjusting bolt are assembled in absorption on the magnechuck There are inclined-plane, the bottom for adjusting bolt and abutting the fixture by the inclined-plane, to adjust the level of the substrate cutting sheet Degree；The gimbaled platform or the grinding wheel are driven by belt wheel mechanism to be rotated.

5. according to Sapphire Substrate cutting sheet process for regenerating as claimed in claim 4, which is characterized in that in stepb, use Levelness of the substrate cutting sheet in the gimbaled platform described in X-ray diffractometer auxiliary adjustment, the X-ray diffractometer include transmitting The transmitter and the receiver, are symmetricly set on the top of the magnechuck platform by device and receiver, and are made described Transmitter and the receiver relative to the magnechuck sucker face with same tilt angle towards the magnechuck It is obliquely installed；The adjustment process of the substrate cutting sheet levelness are as follows:

The substrate cutting sheet is fixed on the fixture, and the fixture and the electromagnetism are adjusted by the adjusting bolt Levelness between sucker, the detecting numerical value for guaranteeing that the receiver receives the transmitter transmitting signal is maximum value；Benefit The substrate cutting sheet is circumferentially rotated at least once by predetermined angle with the magnechuck, it is repeatedly above-mentioned after rotation every time Operation is adjusted, so that the crystal orientation face of the substrate cutting sheet and the sucker face of the magnechuck are parallel to each other；

Then, it then by the adjusting bolt by the substrate cutting sheet is adjusted to inclination, makes the crystal orientation of the substrate cutting sheet The angle that 0.2 degree is formed between face and the sucker face of the magnechuck, using the grinding wheel with tilt angle grinding The surface of the substrate cutting sheet.

6. according to Sapphire Substrate cutting sheet process for regenerating described in claim 1, which is characterized in that keep the abrasive sand Wheel do not rotate, rotate the gimbaled platform relative to the grinding wheel, with the face to be processed to the substrate cutting sheet into Row cutting down；

Alternatively, the gimbaled platform is kept not rotate, rotate the grinding wheel relative to the gimbaled platform, to described The face to be processed of substrate cutting sheet carries out cutting down；

Alternatively, relatively rotate the gimbaled platform and the grinding wheel, with the face to be processed to the substrate cutting sheet into Row cutting down.

7. according to Sapphire Substrate cutting sheet process for regenerating described in claim 1, which is characterized in that the substrate cutting sheet It attached resin, be fixed in the gimbaled platform by way of vacuum suction or side clamp；

Alternatively, the grinding wheel is made of diamond, boron carbide or sapphire；

Alternatively, being pasted with polishing pad on the grinding wheel.

8. according to Sapphire Substrate cutting sheet process for regenerating described in claim 1, which is characterized in that the difference in thickness Cutting down is carried out to the substrate cutting sheet when difference is between 30 microns~5 millimeters.

9. according to Sapphire Substrate cutting sheet process for regenerating according to any one of claims 8, which is characterized in that the substrate cutting sheet Size between 2~12 cun, the shape of the substrate cutting sheet is disk or square piece.

10. according to Sapphire Substrate cutting sheet process for regenerating according to any one of claims 8, which is characterized in that the substrate cutting Piece includes the substrate after silicon carbide substrates, gallium nitride monocrystal substrate and monocrystalline growing epitaxial layers.

Technical field

The present invention relates to technical field of semiconductors, more particularly, to a kind of Sapphire Substrate cutting sheet process for regenerating.

Background technique

Sapphire Substrate is the monocrystal of high growth temperature, and hardness is only second to diamond, fusing point is 2250 DEG C.Difficult life Elongate member brings up expensive sapphire crystal cost.Ultrahigh hardness brings up diamond wire and carries out ability cutting sapphire crystal bar. Sapphire Substrate is largely used to the growth of iii-v LED component nitride epitaxial film, it is desirable that substrate surface crystal axial direction off-axis (C 0.2 degree of the inclined M axis of axis).When sapphire ingot carries out multi-wire saw, crystal bar is cut after orienting by X-ray refractometer.After cutting Thickness value carries out twin grinding process in 780~800 microns (thickness difference is less than 30 microns in piece) of substrate in piece.After grinding Thickness value is at 690~710 microns (thickness difference is less than 10 microns in piece) in piece, then carries out chamfering, annealing, patch wax, copper below The processes such as throwing, chemically mechanical polishing complete Sapphire Substrate processing.

Because of the relationship of sapphire high rigidity, when multi-wire saw, diamond wire can be squeezed by crystal bar end face and (be jumped at end), cause to cut Cut that back substrate head, the substrate thickness homogeneity of tail region domain (head, each 1~3 panel region in tail region domain) are bad, Yi Jitou, cauda it is each There is side surface crystal axial direction off-axis excessive, does not meet needed for iii-v LED component nitride epitaxial growth.

In addition, if bonding is bad, causing substrate surface crystal axial direction off-axis, then whole number hundred when sapphire ingot is bonded Piece substrate cutting sheet will form defective products, can not carry out lower road grinding process.

Summary of the invention

The purpose of the present invention is to provide a kind of Sapphire Substrate cutting sheet process for regenerating, to solve in the prior art Existing substrate cutting sheet cuts bad technical problem.

A kind of Sapphire Substrate cutting sheet process for regenerating provided by the invention, steps are as follows:

A, substrate cutting sheet to be processed is chosen；

B, the single side of the substrate cutting sheet is fixed in gimbaled platform；

C, have difference in thickness, surface crystal axially inclined on the face to be processed of the substrate cutting sheet by grinding wheel The position of axis carries out cutting down.

Further, it in step a, is measured using thickness of the calibrator to the substrate cutting sheet various pieces, When detecting that the difference of the substrate cutting sheet difference in thickness is between 30 microns~5 millimeters, the corresponding substrate is cut Pitch cutting is selected with to be processed.

Further, in stepb, levelness of the substrate cutting sheet in the gimbaled platform is adjusted, and makes institute It states and forms 0.2 degree of angle between the crystal orientation face and the grinding wheel of substrate cutting sheet side to be processed, with this by the lining The single side of undercutting pitch cutting is fixed in gimbaled platform.

Further, in stepb, the gimbaled platform selects magnechuck platform, and the magnechuck platform includes Magnechuck and around one week side wall of magnechuck, the circumferential direction of the side wall is evenly arranged with several threaded holes, the spiral shell Adjusting bolt is equipped in pit；

The fixture for clamping the substrate cutting sheet, the end for adjusting bolt are assembled in absorption on the magnechuck Portion has inclined-plane, the bottom for adjusting bolt and abutting the fixture by the inclined-plane, to adjust the substrate cutting sheet Levelness；The gimbaled platform or the grinding wheel are driven by belt wheel mechanism to be rotated.

Further, using levelness of the substrate cutting sheet in the gimbaled platform described in X-ray diffractometer auxiliary adjustment, The X-ray diffractometer includes transmitter and receiver, and the transmitter and the receiver are symmetricly set on the electromagnetism and inhaled The top of disk platform, and make the transmitter and the receiver relative to the sucker face of the magnechuck with same inclination Angle is obliquely installed towards the magnechuck；The adjustment process of the substrate cutting sheet levelness are as follows:

The substrate cutting sheet is fixed on the fixture, and by the adjustings bolt adjusting fixture with it is described Levelness between magnechuck, the detecting numerical value for guaranteeing that the receiver receives the transmitter transmitting signal is maximum Value；The substrate cutting sheet is circumferentially rotated at least once by predetermined angle using the magnechuck, every time weight after rotation Multiple above-mentioned adjusting operation, so that the crystal orientation face of the substrate cutting sheet and the sucker face of the magnechuck are parallel to each other；

Then, it then by the adjusting bolt by the substrate cutting sheet is adjusted to inclination, makes the substrate cutting sheet The angle that 0.2 degree is formed between crystal orientation face and the sucker face of the magnechuck, using the grinding wheel with the tilt angle Grind the surface of the substrate cutting sheet.

Further, it keeps the grinding wheel not rotate, rotates the gimbaled platform relative to the grinding wheel, Cutting down is carried out with the face to be processed to the substrate cutting sheet；

Alternatively, the gimbaled platform is kept not rotate, rotate the grinding wheel relative to the gimbaled platform, with right The face to be processed of the substrate cutting sheet carries out cutting down；

Alternatively, relatively rotating the gimbaled platform and the grinding wheel, to the to be processed of the substrate cutting sheet Face carries out cutting down.

Further, the substrate cutting sheet is attached resin, is fixed on institute by way of vacuum suction or side clamp It states in gimbaled platform；

Alternatively, the grinding wheel is made of diamond, boron carbide or sapphire；

Alternatively, being pasted with polishing pad on the grinding wheel.

Further, the substrate cutting sheet is carried out when the difference of the difference in thickness is between 30 microns~5 millimeters Cutting down.

Further, for the size of the substrate cutting sheet between 2~12 cun, the shape of the substrate cutting sheet is disk Or square piece.

Further, the substrate cutting sheet includes growing extension on silicon carbide substrates, gallium nitride monocrystal substrate and monocrystalline Substrate after layer.

In the above-mentioned technical solutions, collocation gimbaled platform and grinding wheel, due to diamond when can repair cutting substrate The problems such as line end jumps, fixed mistake of determine when angle angle and caused by difference in thickness is excessive, defect of the axial off-axis of surface crystal, make defect Substrate cutting sheet can be reused after cutting down.

Detailed description of the invention

It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor It puts, is also possible to obtain other drawings based on these drawings.

Fig. 1 is the working state schematic representation of substrate cutting sheet provided by one embodiment of the present invention；

Fig. 2 is the structure chart of gimbaled platform provided by one embodiment of the present invention；

Fig. 3 is the top view of gimbaled platform shown in Fig. 2；

Fig. 4 is the microcosmic schematic diagram of substrate cutting sheet provided by one embodiment of the present invention；

Fig. 5 is the assembling schematic diagram of transmitter provided by one embodiment of the present invention and receiver；

Fig. 6 is the assembling schematic diagram of substrate cutting sheet provided by one embodiment of the present invention；

Fig. 7 is the assembling plan view of substrate cutting sheet shown in fig. 6；

Fig. 8 is the assembling schematic diagram for the substrate cutting sheet that another embodiment of the present invention provides；

Fig. 9 is the top view for the fixture that embodiment shown in Fig. 8 provides.

Appended drawing reference:

1, gimbaled platform；2, substrate cutting sheet；3, grinding wheel；

4, transmitter 5, receiver；6, surface crystal is axial；

11, magnechuck；12, side wall；13, bolt is adjusted；

14, fixture；15, inclined-plane；16, resin；

17, vacuum sucking holes；18, sealing ring；

21, fit Plane；22, fit Plane normal vector；

23, crystal orientation face；24, crystal orientation face normal vector；

25, horizontal plane；26, horizontal plane normal vector.

Specific embodiment

Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical", The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ", " third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.

In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in invention.

As shown in Figure 1, a kind of 2 process for regenerating of Sapphire Substrate cutting sheet provided in this embodiment, steps are as follows:

A, substrate cutting sheet 2 to be processed is chosen；

B, the single side of the substrate cutting sheet 2 is fixed in gimbaled platform 1；

C, axial to having difference in thickness, surface crystal on the face to be processed of the substrate cutting sheet 2 by grinding wheel 3 The position of off-axis carries out cutting down.

In the process for regenerating, there is the position of difference in thickness for the surface of substrate cutting sheet 2, pass through abrasive sand Wheel 3 is ground, and the position of difference in thickness can be made to be trimmed to smooth, eliminates the difference in thickness on 2 surface of substrate cutting sheet, is guaranteed The quality of substrate cutting sheet 2.In step a, measured using thickness of the calibrator to the substrate cutting sheet various pieces, When detecting that the difference of the substrate cutting sheet difference in thickness is between 30 microns~5 millimeters, the corresponding substrate is cut Pitch cutting is selected with to be processed.Difference can be defined as between 30 microns~5 millimeters with difference in thickness, so, work as thickness Cutting down is carried out to the substrate cutting sheet 2 when spending the difference of difference between 30 microns~5 millimeters.It can when grinding Controlling difference in thickness within 30 microns, to meet quality requirement.

Similarly, it when axial 6 off-axis of the surface crystal of substrate cutting sheet 2, is ground by grinding wheel 3, it can be with It is trimmed to the position of axial 6 off-axis of surface crystal smooth, eliminates axial 6 off-axis of surface crystal of substrate cutting sheet 2, guarantee lining Undercut the quality of pitch cutting 2.Refering to what is shown in Fig. 1, axial 6 off-axis of surface crystal are the surface crystal axial 6 for indicating substrate cutting sheet 2 Angle is formed between the normal vector in its crystal orientation face 23, rather than is in the state being parallel to each other, so the position of the off-axis It will form angle between fit Plane 21 and crystal orientation face 23, rather than the plane being overlapped, the state can indicate the portion of the off-axis Position is uneven, may be trimmed by grinding.

In stepb, levelness of the substrate cutting sheet in the gimbaled platform is adjusted, and cuts the substrate 0.2 degree of angle is formed between the crystal orientation face and the grinding wheel of piece side to be processed, with this by the substrate cutting sheet Single side is fixed in gimbaled platform.

Preferably, in stepb, the gimbaled platform 1 selects 11 platform of magnechuck, the 11 platform packet of magnechuck It includes magnechuck 11 and around 11 1 weeks side walls of magnechuck 12, the circumferential direction of the side wall 12 is evenly arranged with several screw threads Hole is equipped in the threaded hole and adjusts bolt 13；Absorption assembly is cut for clamping the substrate on the magnechuck 11 The fixture 14 of pitch cutting 2, the end for adjusting bolt 13 have inclined-plane 15, and the adjusting bolt 13 is abutted by the inclined-plane 15 The bottom of the fixture 14, to adjust the levelness between the fixture 14 and the magnechuck 11, so as to adjust the lining Undercut the levelness of pitch cutting 2；The gimbaled platform 1 or the grinding wheel 3 are driven by belt wheel mechanism to be rotated.

As shown in Figures 2 and 3, when substrate cutting sheet 2 is installed, substrate cutting sheet 2 can be fixed on folder first On tool 14, then fixture 14 is absorbed and fixed on magnechuck 11 by way of electromagnetic adsorption, thus can be completed pair The fixation of substrate cutting sheet 2.When adjusting 2 levelness of substrate cutting sheet by adjusting bolt 13, can be pressed from both sides indirectly by adjustment Has 14 levelness to realize.As shown in Fig. 2, adjusting bolt 13 is made to protrude into or move back along threaded hole by way of threaded engagement Out, bottom position of the end abutment in fixture 14 of bolt 13 can will be adjusted, the inclined-plane 15 for adjusting 13 end of bolt can be with The bottom of fixture 14 is opposite to be acted on, and is moved the bottom of fixture 14 along the inclined-plane 15 for adjusting 13 end of bolt, is adjusted folder with this The levelness of tool 14, and the levelness of substrate cutting sheet 2 is adjusted indirectly.

For example, adjusting bolt 13 when adjusting bolt 13 stretches in threaded hole and being moved close to fixture 14, can be made Fixture 14 rises along the inclined-plane 15 for adjusting 13 end of bolt.Similarly, when adjusting bolt 13 is exited to threaded hole, spiral shell is adjusted Bolt 13 is moved far from fixture 14, and fixture 14 can be made to decline along the inclined-plane 15 for adjusting 13 end of bolt.So by adjusting spiral shell The protruding into and exit of bolt 13 can adjust the axial any position of fixture 14 and rise or fall.And the side wall 12 is circumferential equal It is even to be provided with several threaded holes, namely it is evenly arranged with the adjusting bolt 13 of threaded hole and cooperation in the circumferential direction of fixture 14, so, It is cooperated and is adjusted by the adjusting bolt 13 to circumferential different location, it can be to the inclining relative to magnechuck 11 of fixture 14 Rake angle is adjusted, to also just indirectly have adjusted the crystal orientation face 23 of substrate cutting sheet 2 relative to magnechuck 11 and grind The tilt angle of grinding abrasive disk 3.Gimbaled platform 1 and grinding wheel 3 are that relatively flat luggage is matched, when by the inclination of substrate cutting sheet 2 Angle can carry out cutting down operation by surface of the grinding wheel 3 to substrate cutting sheet 2 when being adjusted to predetermined angle.

It should be noted that when carrying out cutting down to substrate cutting sheet 2, selected by the crystal orientation face 23 of substrate cutting sheet 2 Tilt angle can be 0 degree (i.e. with grinding wheel 3 phase level), or other predetermined inclination angles, such as 0.2 degree Deng.Those skilled in the art can adjust according to actual needs, it is not limited here.

Further, in stepb, using substrate cutting sheet 2 described in X-ray diffractometer auxiliary adjustment in the gimbaled platform Levelness on 1, includes transmitter 4 and receiver 5 by the X-ray diffractometer, and the transmitter 4 and the receiver 5 are symmetrical The top of 11 platform of magnechuck is set, and makes the transmitter 4 and the receiver 5 relative to the magnechuck 11 sucker face is obliquely installed with same tilt angle (such as 5 points of θ=20 degree) towards the magnechuck 11.

The adjustment process of the substrate cutting sheet levelness are as follows: the substrate cutting sheet 2 is fixed on the fixture 14, And the levelness between the fixture 14 and the magnechuck 11 is adjusted by the adjusting bolt 13, guarantee the receiver 5, which receive the transmitter 4, emits the detecting numerical value of signal as maximum value；The substrate is cut using the magnechuck 11 Piece 2 is circumferentially rotated at least once by predetermined angle, above-mentioned adjusting operation is repeated after rotation every time, so that the substrate cutting sheet 2 crystal orientation face 23 and the sucker face of the magnechuck 11 are parallel to each other.

Then, it then by the adjusting bolt 13 by the substrate cutting sheet 2 is adjusted to inclination, makes the substrate cutting sheet 0.2 degree of angle is formed between 2 crystal orientation face 23 and the sucker face of the magnechuck 11, using the grinding wheel 3 with this Tilt angle grinds the surface of the substrate cutting sheet 2.

As shown in Figure 4 and Figure 5, more accurate substrate can be cut using X-ray diffractometer cooperation 11 platform of magnechuck The tilt angle of pitch cutting 2 is adjusted.During adjustment, positioned at the top of 11 platform of magnechuck transmitter 4 and connect Device 5 is received by symmetrically assembly setting, the transmitting of signal can be realized by the reflex in the crystal orientation face 23 of substrate cutting sheet 2 And reception.Refering to what is shown in Fig. 4, the surface of substrate cutting sheet 2 will form crystal orientation face 23 and fit Plane 21, crystal orientation face normal vector 24 Vertical with crystal orientation face 23, fit Plane normal vector 22 is vertical with fit Plane 21.Hurt when substrate cutting sheet 2 is assemblied in fixture 14 Afterwards, corresponding, horizontal plane 25 is the face parallel with the sucker face of grinding wheel 3 and magnechuck 11, horizontal reference Face normal vector 26 is vertical with horizontal plane 25.So when crystal orientation face 23 is parallel with horizontal plane 25, and crystal orientation face normal vector 24 is parallel with horizontal plane normal vector 26, i.e. the crystal orientation face 23 of expression substrate cutting sheet 2 is adjusted to and grinding wheel 3 or electromagnetism The parallel state in the sucker face of sucker 11.

It should be noted that the signal that transmitter 4 occurs is merely able to carry out by the crystal orientation face 23 of substrate cutting sheet 2 instead It penetrates, is unable to be reflected by fit Plane 21 or surface, so, the signal that transmitter 4 emits is anti-by crystal orientation face 23 After penetrating will directive receiver 5, receiver 5 will receive the signal at this time.At this point, receiving the state of signal in receiver 5 Under, if substrate cutting sheet 2 to be carried out to the fine tuning of tilt angle, it just will affect the detecting numerical value that receiver 5 receives signal, so, If detecting numerical value is maximum value, that is, indicate that the crystal orientation face 23 of substrate cutting sheet 2 at this time is adjusted to and grinding wheel 3 or magnechuck 11 sucker face is absolute parallel.

It can be real-time during being adjusted by adjusting bolt 13 to the tilt angle of fixture 14 based on this The signal for carrying out transmitter 4 and receiver 5 receives, when the receiver 5 on the in-plane that transmitter 4 and receiver 5 are constituted When the detecting numerical value received is maximum value, just it is able to demonstrate that the crystal orientation face 23 of substrate cutting sheet 2 in this direction realizes absolutely To parallel.Then and substrate cutting sheet 2 can be circumferentially rotated to an angle, continues to test the depth of parallelism in other directions.

For example, in conjunction with shown in Fig. 4 and Fig. 5, X-direction the detection of the depth of parallelism can be carried out now, then turned in Y-direction It is detected.It can also go back to after detection to be rechecked.It so carries out, substrate cutting sheet 2 can be detected in multiple directions The depth of parallelism, guarantee the entire crystal orientation face 23 of substrate cutting sheet 2 it is parallel with grinding wheel 3.

After crystal orientation face 23 wait ensure substrate cutting sheet 2 is parallel with grinding wheel 3, in a side along substrate cutting sheet 2 Substrate cutting sheet 2 is tilted to (such as X-direction), substrate cutting sheet 2 is made to tilt 0.2 degree, is then inclined by grinding wheel 3 with this Rake angle grinds substrate cutting sheet 2.Because the substrate cutting sheet 2 of 0.2 degree of surface inclination is the product of actual demand.Certainly, lead to Cross which substrate cutting sheet 2 can also be adjusted to inclination other angles grind, it is not limited here.

Further, during grinding, the grinding wheel 3 is kept not rotate, make the gimbaled platform 1 relative to The grinding wheel 3 rotates, and carries out cutting down with the face to be processed to the substrate cutting sheet 2；Alternatively, keeping described universal Platform 1 does not rotate, and rotates the grinding wheel 3 relative to the gimbaled platform 1, to the to be added of the substrate cutting sheet 2 Work face carries out cutting down；Alternatively, relatively rotating the gimbaled platform 1 and the grinding wheel 3, to cut to the substrate The face to be processed of piece 2 carries out cutting down.

Gimbaled platform 1 and grinding wheel 3 are that relatively flat luggage is matched.From the foregoing, it will be observed that the surface to substrate cutting sheet 2 into When row grinding, it can be rotated using gimbaled platform 1, the fit system that grinding wheel 3 does not rotate, i.e., by substrate cutting sheet 2 It is fixed in gimbaled platform 1, gimbaled platform 1 and grinding wheel 3 are adjusted in place relatively, and grinding wheel 3 is made to touch substrate cutting The surface of piece 2 keeps grinding wheel 3 motionless, and driving gimbaled platform 1 rotates.To make substrate cutting sheet 2 relative to grinding wheel 3 rotations carry out cutting down using surface (i.e. to be processed face) of the grinding wheel 3 to substrate cutting sheet 2, and eliminating has thickness difference The position of axial 6 off-axis of different or surface crystal.

Similarly, it can not also be rotated using gimbaled platform 1, the fit system that grinding wheel 3 rotates cuts substrate Piece 2 is fixed in gimbaled platform 1, and gimbaled platform 1 and grinding wheel 3 are adjusted in place relatively, so that grinding wheel 3 is touched substrate and is cut The surface of pitch cutting 2 keeps gimbaled platform 1 motionless, and driving grinding wheel 3 rotates；Alternatively, using gimbaled platform 1 and grinding wheel 3 Substrate cutting sheet 2 is fixed in gimbaled platform 1 by the fit system of relative rotation, gimbaled platform 1 and grinding wheel 3 are opposite It is adjusted in place, grinding wheel 3 is made to touch the surface of substrate cutting sheet 2, drive gimbaled platform 1 and grinding wheel 3 with opposite Direction rotation.

Preferably, the substrate cutting sheet 2 is attached resin 16, is fixed on institute by way of vacuum suction or side clamp It states in gimbaled platform 1.As shown in Figure 6 and Figure 7, the substrate cutting sheet 2 is attached in gimbaled platform 1 using resin 16, specifically The fixture 14 for being attached to gimbaled platform 1 on.As shown in Figure 8 and Figure 9, the substrate cutting sheet 2 is by the way of vacuum suction It is adsorbed in gimbaled platform 1, is specifically adsorbed on the fixture 14 of gimbaled platform 1, there are vacuum sucking holes 17 inside fixture 14, it can Substrate cutting sheet 2 is adsorbed so that air is discharged by vacuum sucking holes 17, the bottom of fixture 14 is also provided with sealing ring 18 Keep sealing.In addition to this, those skilled in the art can also be according to demand using the fixed substrate cutting sheet 2, In of other modes This is without limitation.

Preferably, the grinding wheel 3 is made of diamond, boron carbide or sapphire.For example, grinding wheel 3 can be with It is #180 to #800 skive.

Further, polishing pad is pasted on the grinding wheel 3.Preferably, the size of the substrate cutting sheet 2 is 2 Between~12 cun, the shape of the substrate cutting sheet 2 is disk or square piece.Preferably, the substrate cutting sheet 2 includes silicon carbide Substrate after substrate, gallium nitride monocrystal substrate and monocrystalline growing epitaxial layers.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution The range of scheme.