阅读说明：本技术 电触头装置 (Contact device ) 是由 S.瓦尔登迈尔 U.卡特岑瓦德尔 于 2018-03-27 设计创作，主要内容包括：本发明涉及一种用于将压入触头(100)连接到电子电路(26)的电触头装置,包括配备有电子电路(26)的印刷电路板(2)、贯通地配备有导电内壁(14)的容纳开口(4)以用于压入压入触头(100)以及至少一个与所述内壁(14)和所述电子电路(26)电连接的印刷电路板(2)的导体迹线(25a)。提出了,容纳开口(4)构造在与导体迹线(25a)电连接的接触体(3)处,所述接触体作为有SMT能力的器件施加到印刷电路板(2)的装配侧(21)上。(The contact device that the present invention relates to one kind to be connected to electronic circuit (26) for will be pressed into contact (100) is used to be pressed into the conductive traces (25a) of press-in contact (100) and at least one printed circuit board (2) being electrically connected with the inner wall (14) and the electronic circuit (26) including printed circuit board (2), the perforation ground equipped with electronic circuit (26) equipped with the receiving opening (4) of conductive inner wall (14).It proposes, accommodates opening (4) construction at the contact (3) being electrically connected with conductive traces (25a), the contact is applied on the assembly side (21) of printed circuit board (2) as the device for having SMT ability.)

1. for will be pressed into the contact device that contact (100) is connected to electronic circuit (26), including equipped with electronic circuit (26) printed circuit board (2), perforation ground is used to be pressed into press-in contact equipped with the receiving opening (4) of conductive inner wall (14) (100) and the conductor of at least one printed circuit board (2) being electrically connected with the inner wall (14) and the electronic circuit (26) Trace (25a), which is characterized in that opening (4) construction is accommodated at the contact (3) being electrically connected with printed traces (25a), it is described Contact is applied on the assembly side (21) of printed circuit board (2) as the device for having SMT ability.

2. contact device according to claim 1, which is characterized in that the contact (3) has towards the printing The mounting surface (6) of circuit board, the outer surface (5) away from the mounting surface (6) and circular outer peripheral surface (7), and the receiving Being open, (4) (5)s extended in contact (3) perpendicular to the assembly side (21) of printed circuit board (2) from the outer surface.

3. contact device according to claim 2, which is characterized in that the receiving opening (4) is configured to via openings, The via openings penetrate the contact (3) up to the mounting surface (6) from the outer surface (5).

4. contact device according to claim 3, which is characterized in that the printed circuit board (2), which has, is connected to institute State receiving portion (27) that is accommodating opening (4) and especially coaxially moving towards with the receiving opening (4).

5. contact device according to claim 4, which is characterized in that the contact (3) has from the mounting surface (6) center flange (16) in receiving portion (27) that is stretching out and being projected into printed circuit board (2) is to be used for contact (3) It is aligned printed circuit board (2).

6. contact device according to any one of claim 1 to 5, which is characterized in that contact (3) sleeve-shaped Ground is configured to the cylindrical outer peripheral surface (7) for having circular, and receiving opening (4) is in the contact (3) The heart is configured to cylindrical channel.

7. contact device according to claim 2, which is characterized in that contact (3) is applied directly to mounting surface (6) On the contact surface (25) connecting with conductive traces (25a) on the assembly side (21) of printed circuit board, and outer peripheral surface (7) is at least Partly apply (24) and the contact surface (25) electrically and mechanically by the solder around the outer peripheral surface (7).

8. contact device according to any one of claim 1 to 7, which is characterized in that the contact (3) completely by Metal is made or is made as the plastic components with inner metal sleeve cylinder, and arrangement accommodates opening in the inner metal sleeve cylinder (4).

9. the contact device according to claim 2 to 8, which is characterized in that electronic circuit (26) is in assembly side (21) At least partially with mould material (23) cover, the mould material (23) seal around the outer peripheral surface (7) of contact (3) and Contact (3) passes through mould material (23) with outer surface (5) and protrudes outward, so that accommodating opening (4) is come-at-able to be used for It is pressed into press-in contact (100).

10. the contact device according to claim 2 to 8, which is characterized in that electronic circuit (26) is in assembly side (21) It is covered at least partially with mould material (23), and the mould material (23) seals around the outer of the contact (3) Circumferential surface (7) and outer surface (5).

11. contact device according to any one of the preceding claims, which is characterized in that the contact device (1) It is a part for manipulating the drive apparatus control module of motor-vehicle transmissions.

Background technique

It is known from the prior art that matching to be electrically connected between printed circuit board and press-in contact to printed circuit board There are at least one conductive traces metallize and with printed circuit board to be electrically connected for standby receiving opening, the opening that accommodates The form of through-hole receiving portion.Press-in contact can be pressed into from the side of printed circuit board and accommodate in opening.For this purpose, press-in contact example At the inner wall of through-hole receiving portion for pressing against metallization in indentation such as the part with, the outer wall of the part, wherein can To use a variety of geometries.This electrical contact is connected for the contact pilotage of plug or electronic device to be connect with printed circuit board. In the literature, this printed circuit board contact, which is connected, is also referred to as penetration type installation (Durchsteckmontage), because being permitted In more situations press-in contact can be guided from assembly side up to the opposite side of printed circuit board.

Summary of the invention

The contact device that the present invention relates to a kind of to be connected to electronic circuit for will be pressed into contact.Contact apparatus includes matching Have electronic circuit printed circuit board, perforation equipped with conductive inner wall receiving opening with for be pressed into press-in contact and The conductive traces of at least one printed circuit board being electrically connected with the conductive inner wall and the electronic circuit.It mentions according to the present invention Out, opening construction is accommodated at the contact being electrically connected with conductive traces, and the contact is as the device for having SMT ability (SMT:Surface Mount Technologie(surface mounting technique)) it is applied on the assembly side of printed circuit board.This was both It include the embodiment with single contact, the single contact has what a proper appearance for single press-in contact Receive opening, also include the embodiment with multiple contacts, the multiple contact assembly on a printed circuit and Such as just what a receiving opening be respectively provided with.Conversion regime (Umsetzung) with one or more contacts is equally Possible, one or more of contacts are respectively provided with multiple openings that accommodate for being respectively allocated to the pressure that these accommodate opening Enter contact.

SMD device (SMD:Surface Mount Device(surface mount device)) it is understood to following device, with Penetration type install (THT:Through Hole Technology(through-hole technology)) device compare do not have for penetration type pacify The electric wire connecting pin of dress, but printing can be welded direct to by means of the solderable joint face at printed circuit board surface On the contact surface of circuit board.This surface mounting technique is also referred to as SMT(SMT: surface mounting technique).

Printed circuit board is understood at least one layer of also or on multiple layers equipped with the printing of the rigidity of conductive traces Circuit board substrate is preferably made of the epoxide resin material of glass fiber reinforcement, such as FR4 material, FR5 material or the skill Known much higher value in art.

Advantages of the present invention

The contact device proposed this have the advantage that the receiving that need not be arranged through on a printed circuit is open, or These accommodate opening and can be covered with contact.When being assembled to printed circuit using mould material on a printed circuit to protect When device on plate, this is particularly advantageous.PlacingJi Shu, also referred to as HCD(HCD:Hard Cover Dispense(hard shell point Hair)), more and more importance are won, recently also to use electronic circuit component and same in rugged environment When save usually have metal shell complicated covering.For this purpose, circular barrier material can be for example distributed to printing electricity On the assembly side of road plate.Then, by mould material, for example hardenable epoxy resin is filled on the assembly side of printed circuit board The surface region surrounded by the barrier material in.If the surface region has via openings, the mould material can Ground trickling downwards can be determined by gravity.For this reason, it is known that penetration type installation cannot easily with mould material knot Ground is closed to use.It is necessary that addition thereto that is expensive and needing space, such as surrounds the additional wall of via openings, Prevent mould material from trickling or invading in via openings during filling process.In the solution proposed herein, advantageously, Construct to accommodate that press-in contact is necessary, is open equipped with the receiving of conductive inner wall in contact, the contact can be with It is assembled on printed circuit board as individual component with SMT technology.Contact is advantageously enabled to will by press-in contact Electrical contact connection combines with the advantages of mould material for being used to cover the device on printed circuit board.For this purpose, contact There is body perforation ground to be open equipped with the receiving of conductive inner wall, and press-in contact can be pressed into the receiving opening.Accommodate opening It can for example be configured to simply drill, the throughbore being in particular designed as in metal contact.In indentation, the indentation Contact is pressed at inner wall (press-fit contact), and independently establishes with compression distance and to be electrically connected with contact.Contact can be with It is inexpensively made of metal completely, such as is formed to have the plastic components of inner metal sleeve cylinder, accommodate opening and be arranged in this In inner metal sleeve cylinder.It is advantageously achieved by using contact: connecting the printed circuit board of electronic device for contact After solder reflow process (Reflowl tvorgang), contact can also be will be pressed into and be pressed into receiving opening.

Advantageous design scheme and expansion scheme of the invention are realized by the feature for including in dependent claims.

Advantageously, contact has the mounting surface towards printed circuit board, the outer surface away from mounting surface and circular outer Circumferential surface (Mantelfl che), wherein accommodate opening from the outer surface perpendicular to printed circuit board assembly side extend Into contact.Mounting surface can be preferably constructed to flat, and realize connecing in the assembly side of printed circuit board The design (Anlage) of precise match at contacting surface.Contact can during manufacturing as compact component in a simple manner by means of SMD equipment device is applied on printed circuit board.Contact can for example be contained in by suction nozzle flat by SMD assembly device Outer surface, and be placed on the contact surface of printed circuit board.

Receiving opening can also be used as blind hole and extend in contact.It is configured to however, it is particularly preferred to accommodate opening The embodiment of via openings, the via openings up to mounting surface penetrate contact from the outer surface.

Additionally it can be stated that printed circuit board has the receiving portion for being connected to and accommodating opening.The receiving portion can be especially It is to be extended coaxially into receiving opening.The receiving portion can be used for accommodating the end of press-in contact, which when necessary can also be with It is stretched out on mounting surface from contact, to can will be pressed into contact compared with no additional receiving portion and deeper be pressed into It accommodates in opening.

The receiving portion of printed circuit board is preferably used for accommodating center flange.Contact can have to be stretched out simultaneously from mounting surface And it is projected into the center flange in the receiving portion of printed circuit board.By the design of center flange at the inner wall of receiving portion, It is directed at contact with printed circuit board.Due to press-in contact itself can by be pressed into contact receiving be open in and by Alignment, therefore contact can also advantageously be defined press-in contact and is assembled on printed circuit board using press-in contact when necessary Component (such as electrolytic capacitor or male component) position.

Advantageously, contact can be with extremely simple and cheap mode such as female type with circular cylindrical peripheral Face constructs.Accommodating opening for example can be configured to cylindrical channel by the centre-drilling hole in contact.

Contact can be advantageously employed mounting surface and be applied directly on the assembly side of printed circuit board and conductive traces On the contact surface of connection, and outer peripheral surface at least partially by means of around the outer peripheral surface solder apply (Lotauftrag) with Contact surface is electrically and mechanically.This can advantageously be realized in controlling good SMT technology.

Particularly advantageously contact is used in combination with the mould material of printed circuit board.Thus, for example in assembly side On electronic circuit completely or at least partially covered with mould material, wherein mould material seals around the outer of contact Circumferential surface and contact is protruded outward with outer surface across mould material, so that accommodating opening is come-at-able for being pressed into pressure Enter contact.Contact also allows for indentation press-in contact after applying mould material.In addition, installation is completely covered in contact Printed circuit board region below face, thus there in printed circuit on receiving portion also can be set, mould material cannot It invades in the receiving portion.

It provides, mould material is applied on printed circuit board in another embodiment after being pressed into press-in contact.In In this case, receiving portion is not provided with below contact in the printed circuit boards, is connect so that mould material can also be applied to It can invade on the outer surface of contact and from outer surface in receiving opening.

Contact device can be used particularly advantageously in the control mould of the transmission device for manipulating motor-vehicle transmissions At block.The drive apparatus control module is typically mounted in the hydraulic fluid of transmission device, so that by means of mould material pair The sealing of electronic circuit is shown herein as significant surcharge (Mehrwert).The contact device is herein advantageously So that the component that its electric connecting terminal is configured to press-in contact can also connect after having manufactured mould material with printed circuit board Touching.

Detailed description of the invention

Fig. 1 shows the segment of the cross section of the first embodiment of contact device,

Fig. 2 shows Fig. 1 without mould material and the not no top view of the embodiment of press-in contact,

Fig. 3 shows the segment of the cross section of the second embodiment of contact device,

Fig. 4 shows the segment of the cross section of the 3rd embodiment of contact device,

Fig. 5 shows the segment of the cross section of the fourth embodiment of contact device.

Specific embodiment

Fig. 1 shows the segment of the cross section of the first embodiment of contact device 1.Fig. 2 be not pressed into top view Contact and without showing identical device in the case where mould material.Contact apparatus 1 includes the printed circuit board 2 of rigidity, It is disposed with electronic circuit 26 on it.Fig. 1 illustrates only the individual devices of electronic circuit 26, and the connecting pin 27 of the device is being printed It is connect on the assembly side 21 of circuit board 2 with conductive traces 25a.Conductive traces 25a is integrally connected to the assembly of printed circuit board 2 For example circular contact surface 25 on side.Contact surface 25 can for example be configured to copper metallization portion.Contact 3 is assembled to printing electricity On the assembly side 21 of road plate 2.Contact 3 has towards the mounting surface 6 of printed circuit board 2, away from 5 and of the outer surface of mounting surface 6 Circular outer peripheral surface 7.In embodiment shown here, contact 3 is configured with inserting for circular cylindrical peripheral face 7 Seat.Receiving opening is configured in contact 3, receiving opening is from outer surface 5s perpendicular to the assembly side of printed circuit board 2 21 ground are inserted into contact 3.It accommodates opening 4 and cylindrical channel is for example for example configured to by drilling at the center of contact 3. While it may be possible to by accommodate opening be configured to blind hole, it is preferred that by accommodate opening be configured to via openings, the via openings from Outer surface 5 is until 6 ground of mounting surface runs through contact 3.

Contact 3 is mounted on printed circuit board as the SMD device in SMT technology, that is, contact is with mounting surface 6 It is put on contact surface 25 and is in electrical contact by surface welding with contact surface 25.As can be seen in Figure 1, solder applies example Such as circularly, 7 apply around outer peripheral surface, and electrically and mechanically by the lower edge of outer peripheral surface 7 and contact surface 25.

Contact 3 can be made of metal completely, or be can be used as the plastic components with inner metal sleeve cylinder and be made, In Arrangement accommodates opening 4 in the inner metal sleeve cylinder.In order to be in electrical contact inner sleeve and the contact surface 25 of contact, inner metal sleeve cylinder It can be for example by the circular gold of the conducting bridge connector for the plastics for being directed across contact and the outer peripheral surface of the outside of contact 3 The connection of category face, which can apply again by the solder in SMT technology welds together with contact surface 25.With contact Independently, inner wall 14 is equipped with perforative conductive inner wall 14 to the construction of body 3, for example, be contact by way of completely by metal It is made or with the inner metal sleeve cylinder.

The assembly side 21 of printed circuit board 2 is covered with hardenable mould material 23.Thermosetting can be preferably related to herein Property plastics, especially epoxy resin.Thus 23 overlay electronic circuit 26 of mould material simultaneously protecteds from external action.Such as scheming It can see well in 1, the outer surface 5 of contact 3 is measured as away from the distance of mounting surface 6, so that contact 3 is with appearance Face 5 passes through mould material 23 and protrudes outward, so that accommodating opening 4 is come-at-able in exterior space for being pressed into indentation touching First 100.Mould material 23 surrounds the outer peripheral surface 7 of contact 3 in a sealing manner, from can be along outer without corrosive medium Circumferential surface 7 penetrates into printed circuit board 2.

Press-in contact 100(such as electric component, actuator, sensor, male component or capacitor or other electric devices Connection terminal) can along the direction of arrow P from outer surface 5 be pressed into contact 3 receiving opening 4 in.Herein in the embodiment In, maximum compression distance is limited at contact surface 25 by the design of press-in contact.At least partly (the example of press-in contact 100 Such as using thickening) it presses against at penetratingly equipped with the receiving opening 4 of conductive inner wall 14, thus independently always with compression distance Ensure to be in electrical contact.

Fig. 3 shows second embodiment, wherein being additionally provided in receiving portion 27 in printed circuit board 2.The receiving portion 27 are arranged in contact surface 25, and can be used as drilling or breach and wear from assembly side 21 up to away from 22 ground of side of assembly side 21 Print through printed circuit board 2.Preferably, receiving portion 27 is coaxially constructed with opening (4) is accommodated, that is, receiving opening is vertical with receiving portion It is overlapped to axis.In addition, but not necessarily, the diameter of receiving portion 27 can correspond to accommodate the diameter of opening 4, so that accommodating Portion 27 is aligned with opening 4 is accommodated.The receiving portion 27 of printed circuit board 2, which advantageously enables to will be pressed into contact 100, deeper draws Enter into receiving opening 4.Nevertheless, still assuring that mould material is applying by the contact being welded on contact surface 25 Receiving portion 27 is not passed through when on to printed circuit board 2 to flow away.

Fig. 4 shows 3rd embodiment, and wherein contact 3, which has, stretches out from mounting surface 6 and be projected into printed circuit board 2 Center flange 16 in receiving portion 27 is for being directed at printed circuit board 2 for contact 3.Center flange 16 can have taper Edge is pressed against when being placed into contact with body 3 at the inner wall 28 of receiving portion 27, and thus makes contact 3 at it in printing electricity It is aligned in rigging position on road plate 2 and in addition placed in the middle.Center flange 16 can for example be equipped with the flank being circumferentially distributed. When being pressed into receiving portion 27, the tolerance of assembly side (x-y plane) can reduce.It can additionally be compensated by the flank Tolerance on the direction (z) perpendicular to this.

Fig. 5 shows fourth embodiment, wherein mould material is applied to printed circuit after indentation is pressed into contact 100 On plate 2.In this case, the printed circuit board 2 of 3 lower section of contact is configured to closed.In this embodiment, mould material 23 are also applied on the outer surface 5 of the contact 3 of mounting surface 6.In this example, mould material can also be from outer surface 5 penetrate into receiving opening 4, and filling accommodates the part for not being pressed into contact 100 and occupying of opening 4 completely or partially.In In this case, mould material has also wrapped up the insertion portion of press-in contact, to additionally protect the insertion portion.