阅读说明：本技术 一种纸蜂窝芯材浸渍胶及其制备方法 (A kind of paper honeycomb core material dipping glue and preparation method thereof ) 是由 周凯运 陈丽春 苏韬 于 2019-07-26 设计创作，主要内容包括：本发明涉及一种浸渍胶及其制备的方法,属于纸蜂窝芯材制备技术领域。所述浸渍胶包括氰酸酯树脂、催化剂、增韧剂、溶剂；所述增韧剂与氰酸酯树脂质量比为(5-40):100,所述催化剂的质量为增韧剂与氰酸酯树脂质量总和的1％-6％。本发明采用氰酸酯树脂作为纸蜂窝浸渍胶主体树脂,在催化剂作用下,可在相对较低温度下固化,形成三嗪环的树脂结构,该结构具有低介电常数、低介电损耗特性,同时具有低的吸湿率、高强度等特性,可以提高蜂窝的整体性能,尤其是透波特性。(The present invention relates to a kind of dipping glue and its methods of preparation, belong to paper honeycomb core material preparation technical field.The dipping glue includes cyanate ester resin, catalyst, toughener, solvent；The toughener and cyanate ester resin mass ratio are (5-40): 100, the quality of the catalyst is the 1%-6% of toughener and cyanate ester resin quality summation.The present invention impregnates glue matrix resin as paper honeycomb using cyanate ester resin, under the action of catalyst, it can solidify under relatively lower temp, form the resin structure of triazine ring, the structure has low-k, low-dielectric loss characteristic, there are the characteristics such as low hydroscopicity, high intensity simultaneously, cellular overall performance, especially wave transparent characteristic can be improved.)

1. a kind of paper honeycomb core material impregnates glue, it is characterised in that: the dipping glue include cyanate ester resin, catalyst, toughener, Solvent；The toughener and cyanate ester resin mass ratio are (5-40): 100, the quality of the catalyst is toughener and cyanic acid The 1%-6% of ester resin quality summation.

2. a kind of preparation method of paper honeycomb core material dipping glue as described in claim 1, which is characterized in that including following step It is rapid:

(1) monomer of cyanate ester resin is placed in container, the stirring at being 80 DEG C~150 DEG C in temperature is complete to cyanate ester monomer Full-fusing is filtered later；Then continue to stir 0.5h-5h at 100 DEG C~180 DEG C；With 0.5-5 DEG C/min rate of temperature fall 50 DEG C are cooled to hereinafter, solvent is added and dissolves cyanate, obtains cyanic acid ester solution；

(2) toughener is added in solvent, at room temperature mechanical stirring 1-3h, toughening agent solution is made；

(3) toughening agent solution is poured into cyanic acid ester solution, at room temperature mechanical stirring 1-3h, dissolves it sufficiently.Then plus Enter the 1%-6% catalyst of gross mass, continue mechanical stirring 1-3h at room temperature, paper honeycomb core material is made and impregnates glue.

3. preparation method according to claim 2, which is characterized in that whipping temp is 90 DEG C for the first time in step (1), again When stirring, whipping temp is 160 DEG C, mixing time 2.5h.

4. preparation method according to claim 2, which is characterized in that cyanate ester resin described in step (1) is bisphenol A-type One of cyanate, phenolic cyanate, dicyclopentadiene bisphenol type cyanate, bisphenol-f type cyanate, bis-phenol M type cyanate Or several mixture.

5. preparation method according to claim 2, which is characterized in that solvent described in step (1) includes acetone, and 1,2- bis- Chloroethanes, hexamethylene, any one in N ' dinethylformamide, N ' N- dimethyl acetamide.

6. preparation method according to claim 2, which is characterized in that toughener described in step (2) is epoxy resin, packet Include epoxy resin E20, any one in epoxy resin E31 epoxy resin E44, epoxy resin E51.

7. preparation method according to claim 2, which is characterized in that the solvent include polysulfones, polyether sulfone, polyphenylene oxide, Any one or a few mixture such as polyetherimide.

8. preparation method according to claim 2, which is characterized in that catalyst described in step (3) is containing active hydrogen Any one in the transition metal organometallic compounds such as compound, dibutyl tin dilaurate or several mixtures.

Technical field

The present invention relates to a kind of dipping glue and its methods of preparation, belong to paper honeycomb core material preparation technical field.

Background technique

Radome is a kind of cover for protecting radar or antenna, with the development of modern technologies, it is desirable that radome has strong Degree height, distort the characteristics such as small after light weight, wave is good, reflectivity is low and electromagnetic wave transmission.The material as used in manufacture radome The dielectric properties of material directly determine the overall dielectric performance of radome, so, the selection of material seems abnormal important.Ordinary circumstance Under, the dielectric properties of radar cover material are most important performance parameter, mainly permittivity ε and dielectric loss angle tangent tan δ.The permittivity ε of material is smaller, and reflection of the electromagnetic wave on the interface of radome and air is with regard to smaller；Dielectric loss angle tangent Tan δ is smaller, and the energy that electromagnetic wave is converted into heat and is lost during through antenna house is smaller, and material is required on radome With good wave transparent characteristic, to achieve the purpose that maximum transmitted and minimal reflection, it is desirable that dielectric constant is as low as possible, dielectric damage Consume the material close to zero.

To reduce cover weight and obtaining better dielectric properties and mechanical property, present radome selection is intended to fibre more Dimension enhancing composite material and sandwich material.Aramid fiber paper honeycomb has high specific strength, specific modulus, low dielectric, good weatherability and resistance Application of the good characteristics such as combustion in the sandwich of radome is more and more wider.Phenolic aldehyde tree is all made of in industrial production at present Impregnating resin of the rouge as paper honeycomb, this is because phenolic resin and aramid paper have good interface compatibility, while phenolic aldehyde tree Rouge has many advantages, such as rigidity big, fire-resistant corrosion-resistant, at low cost, but phenolic resin have compared to some low dielectric resins it is higher Dielectric constant and dielectric loss reduce the overall of radome to a certain extent for the core material of radome sandwich and be situated between Electrical property affects the wave transparent performance of radome.

Summary of the invention

Goal of the invention: the technical problem to be solved in the present invention is to provide a kind of paper honeycomb core material dipping glue and its preparation sides The dipping glue of method, this method preparation has lower dielectric constant and lower dielectric loss than traditional phenolic resin, thus The honeycomb for impregnating glue preparation has more preferably dielectric properties, while possessing higher flat crushing strength and shear strength, thus whole Improve transparent structure honeycomb core material performance.

Technical solution: to achieve the above object, the present invention adopts the following technical scheme:

A kind of paper honeycomb core material of the invention impregnates glue, and the dipping glue mainly includes cyanate ester resin, catalyst, toughening Agent, solvent；The toughener and cyanate ester resin mass ratio are (5-40): 100, the quality of the catalyst is toughener and cyanogen The 1%-6% of acid ester resin quality summation.

Optimal effect is reached using following preparation method, the specific steps are as follows:

(1) monomer of cyanate ester resin is placed in container, the stirring at being 80 DEG C~150 DEG C in temperature to cyanate list Body melts completely, is filtered later；Then continue to stir 0.5h-5h at 100 DEG C~180 DEG C；With 0.5-5 DEG C/min cooling Rate is cooled to 50 DEG C hereinafter, solvent is added and dissolves cyanate, obtains cyanic acid ester solution；Wherein, whipping temp is most for the first time Good is 90 DEG C, and the time that cyanate ester monomer melts completely is most short；Wherein, when being again stirring for, whipping temp is selected as 160 DEG C, stirs Time 2.5h is mixed, is optimal stirring condition, obtained paper honeycomb core material performance is best.

(2) toughener is added in solvent, at room temperature mechanical stirring 1-3h, toughening agent solution is made.

(3) toughening agent solution is poured into cyanic acid ester solution, at room temperature mechanical stirring 1-3h, dissolves it sufficiently.So The 1%-6% catalyst of gross mass is added afterwards, continues mechanical stirring 1-3h at room temperature, paper honeycomb core material is made and impregnates glue.

Cyanate described in step (1) includes, and the cyanate ester resin is bisphenol A cyanate ester, phenolic cyanate, double The mixture of one or more of cyclopentadiene bisphenol type cyanate, bisphenol-f type cyanate, bis-phenol M type cyanate

Solvent described in step (1) includes acetone, 1,2- dichloroethanes, hexamethylene, N ' dinethylformamide, N ' N- bis- Methylacetamide etc..

Toughener described in step (2) is epoxy resin, including epoxy resin E20, epoxy resin E31 epoxy resin E44, Epoxy resin E51 etc. is commercialized any one in epoxy resin, and solvent is polysulfones, polyether sulfone, polyphenylene oxide, polyetherimide etc. Any one or a few mixture.

Catalyst described in step (3) is that the transition metal such as compound, dibutyl tin dilaurate containing active hydrogen are organic Any one in compound or several mixtures.

Advantageous effects: the present invention impregnates glue matrix resin as paper honeycomb using cyanate ester resin, makees in catalyst Under, it can solidify under relatively lower temp, form the resin structure of triazine ring, which has low-k, low dielectric Loss characteristic, while there are the characteristics such as low hydroscopicity, high intensity, it is special that cellular overall performance, especially wave transparent can be improved Property.

Paper honeycomb of the invention impregnates glue, can be used for the preparation of transparent structure unitary member honeycomb core material, meets Demand of the components such as antenna radar cover to high wave transmission rate can be used widely in field in electronics, Aeronautics and Astronautics.

Specific embodiment