阅读说明：本技术 一种含有异形金属粒子的导电胶膜 (A kind of conductive adhesive film containing profiled metal particle ) 是由 吕松 于 2019-09-16 设计创作，主要内容包括：本发明涉及光伏胶膜技术领域,尤其是一种含有异形金属粒子的导电胶膜,包括离型膜和位于离型膜上表面的导电胶层,所述导电胶膜层的上表面有一层保护层,所述导电胶层包括改性环氧树脂和异形金属粒子,所述改性环氧树脂与异形金属粒子的质量比为1:1-3,所述异形金属粒子采用生物法制得；本发明中的含有异形金属粒子的导电胶膜,采用高品质的树脂及导电粒子点成而成,用于连接两种不同基材和线路,具有上下电气导通,左右绝缘的特性,可以提供优良的防湿接着导电及绝缘功能；本发明中的改性环氧树脂由高纯度的双酚A和环氧氯丙烷合成,这样结构的改性环氧树脂分子量小,粘度低、酣候性好,电性能优异。(The present invention relates to photovoltaic glue film technical fields; especially a kind of conductive adhesive film containing profiled metal particle; conductive adhesive layer including release film and positioned at release film upper surface; there is a protective layer in the upper surface of the conducting resinl film layer; the conductive adhesive layer includes modified epoxy and profiled metal particle; the mass ratio of the modified epoxy and profiled metal particle is 1:1-3, and the profiled metal particle is made using bioanalysis；The conductive adhesive film containing profiled metal particle in the present invention, there is upper and lower electrically conducting for connecting two kinds of different substrate materials and route using resin and conducting particles the point Cheng Ercheng of high-quality, the characteristic of left and right insulation can provide excellent damp proof then conductive and insulation function；Modified epoxy in the present invention is synthesized by the bisphenol-A and epoxychloropropane of high-purity, and the modified epoxy molecular weight of this spline structure is small, and viscosity is low, intoxicated time property is good, excellent electrical property.)

1. a kind of conductive adhesive film containing profiled metal particle, it is characterised in that: including release film and be located at release film upper surface Conductive adhesive layer, there is a protective layer in the upper surface of the conducting resinl film layer, the conductive adhesive layer include modified epoxy and The mass ratio of profiled metal particle, the modified epoxy and profiled metal particle is 1:1-3, and the profiled metal particle is adopted It is made with bioanalysis.

2. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the modified ring Oxygen resin is synthesized by the bisphenol-A and epoxychloropropane of high-purity.

3. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the protective layer Material be glass fibre modified PET and MODIFIED PP S mixture, mass ratio 1-5:1.

4. a kind of conductive adhesive film containing profiled metal particle according to claim 3, it is characterised in that: the protective layer Material be glass fibre modified PET and MODIFIED PP S mixture, mass ratio 3:1.

5. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the abnormity gold The shape for belonging to particle includes nanometer sheet, nano rod, nanometer rods, nano wire, platonic shape or one or more of shelly-shaped.

6. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the abnormity gold Belonging to particle includes one of nano silver, nano nickel, Nanometer Copper.

7. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the abnormity gold The Average Particle Diameters for belonging to particle are 6-12 μm.

8. a kind of conductive adhesive film containing profiled metal particle according to claim 1, it is characterised in that: the conducting resinl Layer with a thickness of 30-50 μm.

Technical field

The present invention relates to photovoltaic glue film technical field, especially a kind of conductive adhesive film containing profiled metal particle.

Background technique

As electronic product develops to miniaturization, portability direction, the during which continuous improvement of integrated level, traditional Pb/Sn There are a series of materials and technological problems for solder, are no longer satisfied technique requirement, there is an urgent need to develop novel connecting materials.By Have that film linear resolution is high, autologous density is small, dosage is few under the same terms in conductive adhesive film, meets electronic product micromation, thin Type and light-weighted demand for development.But the conduction of existing conductive adhesive film need to be improved.

Summary of the invention

The purpose of the present invention is: overcome deficiency in the prior art, it is excellent, damp proof then conductive and exhausted to provide a kind of conduction The strong conductive adhesive film containing profiled metal particle of edge performance.

In order to solve the above technical problems, The technical solution adopted by the invention is as follows:

A kind of conductive adhesive film containing profiled metal particle, the conductive adhesive layer including release film and positioned at release film upper surface, institute There is a protective layer in the upper surface for stating conducting resinl film layer, and the conductive adhesive layer includes modified epoxy and profiled metal particle, The mass ratio of the modified epoxy and profiled metal particle is 1:1-3, and the profiled metal particle is made using bioanalysis.

Further, the modified epoxy is synthesized by the bisphenol-A and epoxychloropropane of high-purity.

Further, the material of the protective layer is the mixture of glass fibre modified PET and MODIFIED PP S, quality Than for 1-5:1.

Further, the material of the protective layer is the mixture of glass fibre modified PET and MODIFIED PP S, quality Than for 3:1.

Further, the shape of the profiled metal particle includes nanometer sheet, nano rod, nanometer rods, nano wire, Plato Formula shape is one or more of shelly-shaped.

Further, the profiled metal particle includes one of nano silver, nano nickel, Nanometer Copper.

Further, the Average Particle Diameters of the profiled metal particle are 6-12 μm.

Further, the conductive adhesive layer with a thickness of 30-50 μm.

It is using the beneficial effect of technical solution of the present invention:

The conductive adhesive film containing profiled metal particle in the present invention, using resin and conducting particles the point Cheng Ercheng of high-quality, For connecting two kinds of different substrate materials and route, there is upper and lower electrically conducting, the characteristic of left and right insulation can provide excellent damp proof Then conductive and insulation function.

Modified epoxy in the present invention is synthesized by the bisphenol-A and epoxychloropropane of high-purity, the modification of this spline structure Molecular weight of epoxy resin is small, and viscosity is low, intoxicated time property is good, excellent electrical property.

The mixture of PET and MODIFIED PP S that protective layer material in the present invention selects glass fibre modified, so that protective layer It is higher to the protection intensity of conductive adhesive film with stronger scratch-resistant.

Specific embodiment

In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, With reference to embodiment The present invention is described in further detail.

The conductive adhesive film containing profiled metal particle in the present invention, including release film and leading positioned at release film upper surface There are a protective layer in electric glue-line, the upper surface of the conducting resinl film layer, and the conductive adhesive layer includes modified epoxy and abnormity The mass ratio of metallic, the modified epoxy and profiled metal particle is 1:1-3, and the profiled metal particle is using life Object method is made.

Modified epoxy in the present invention is synthesized by the bisphenol-A and epoxychloropropane of high-purity, the modification of this spline structure Molecular weight of epoxy resin is small, and viscosity is low, intoxicated time property is good, excellent electrical property.

The material of protective layer in the present invention is the mixture of glass fibre modified PET and MODIFIED PP S, and mass ratio is 1-5:1, preferably 3:1, the modified PET of glass fibre has excellent physical mechanical property in wider temperature range, long Phase, electrical insulating property was excellent, or even under high-temperature high-frequency, electrical property is still preferable using temperature up to 120 DEG C, creep resistance, resistance to Fatigability, rub resistance, dimensional stability are all fine, processing with higher and impact resistance.

Profiled metal particle in the present invention includes nanometer sheet, nano rod, nanometer rods, nano wire, platonic shape or shell One or more of shape, metallic include one of nano silver, nano nickel, Nanometer Copper.

The Average Particle Diameters of profiled metal particle in the present invention are 6-12 μm, by the particle size of profiled metal particle Within this range, electric conductivity is more preferable, and under heated condition, the mobility of metallic is more preferable, leads to effectively increase for control The conduction of electric glue film.

Conductive adhesive layer in the present invention with a thickness of 30-50 μm.