阅读说明：本技术 一种微孔加工装置以及超声波辅助钻削系统 (Micropore machining device and ultrasonic-assisted drilling system ) 是由 石红雁 高智森 陶沙 黄嘉奇 朱韬 陈壮沛 胡旭朋 刘仙文 于 2021-08-16 设计创作，主要内容包括：本发明属于高速电路板加工技术领域,尤其涉及一种微孔加工装置以及超声波辅助钻削系统。微孔加工装置用于对高速电路板进行钻孔加工,微孔加工装置包括钻孔结构和超声振动结构。钻孔结构包括底座和钻头机构,底座位于钻头机构的下方,且钻头机构用于对目标物进行钻孔。超声振动结构包括超声振动板以及连接超声振动板的超声机构,超声振动板平铺设置于底座并在超声机构的作用下沿竖直方向往复振动,目标物层叠固定于超声振动板并随超声振动板一并振动。本发明可以提高高速电路板的微孔的加工质量。(The invention belongs to the technical field of high-speed circuit board processing, and particularly relates to a micropore processing device and an ultrasonic auxiliary drilling system. The micropore processing device is used for drilling the high-speed circuit board and comprises a drilling structure and an ultrasonic vibration structure. The drilling structure comprises a base and a drill bit mechanism, wherein the base is located below the drill bit mechanism, and the drill bit mechanism is used for drilling a target object. The ultrasonic vibration structure comprises an ultrasonic vibration plate and an ultrasonic mechanism connected with the ultrasonic vibration plate, the ultrasonic vibration plate is flatly laid on the base and vibrates in a reciprocating mode along the vertical direction under the action of the ultrasonic mechanism, and the target object is fixed on the ultrasonic vibration plate in a laminating mode and vibrates along with the ultrasonic vibration plate. The invention can improve the processing quality of the micropores of the high-speed circuit board.)

1. A micro-hole machining apparatus for drilling a target object, comprising:

the drilling structure comprises a base and a drill bit mechanism, wherein the base is positioned below the drill bit mechanism, and the drill bit mechanism is used for drilling the target object; and

the ultrasonic vibration structure comprises an ultrasonic vibration plate and an ultrasonic mechanism connected with the ultrasonic vibration plate, the ultrasonic vibration plate is flatly laid on the base and vibrates in a reciprocating mode along the vertical direction under the action of the ultrasonic mechanism, and the target object is fixedly laminated on the ultrasonic vibration plate and vibrates along with the ultrasonic vibration plate.

2. The microporation apparatus of claim 1, wherein: the micropore machining device further comprises a guiding and positioning mechanism, and the guiding and positioning mechanism is used for guiding the ultrasonic vibration plate to vibrate in a reciprocating mode in the vertical direction.

3. The microporation apparatus of claim 2, wherein: the guide positioning mechanism comprises a first positioning column which is convexly arranged on the base, a plurality of first positioning columns are arranged at intervals, first positioning holes are formed in the positions, corresponding to the first positioning columns, of the ultrasonic vibration plates, and the free ends of the first positioning columns are located in the corresponding first positioning holes.

4. The microporation apparatus of claim 2, wherein: the guide positioning mechanism comprises a plurality of second positioning columns which are convexly arranged on the ultrasonic vibration plate, the second positioning columns are arranged at intervals, second positioning holes are formed in the positions, corresponding to the second positioning columns, of the base, and the free ends of the second positioning columns are located in the corresponding second positioning holes.

5. The microporation apparatus of any one of claims 1-4, wherein: the ultrasonic vibration plate comprises a plate body supporting the target object and a driving section which is connected with the plate body and is arranged in a hanging mode, and the ultrasonic mechanism is connected with the driving section.

6. The microporation apparatus of claim 5, wherein: the base is provided with a containing cavity, a notch is formed in the edge of a cavity opening of the containing cavity, and the plate body is located in the containing cavity and the driving section extends outwards through the notch.

7. The microporation apparatus of any one of claims 1-4, wherein: the micropore machining device further comprises a backing plate made of a flexible material, and the backing plate is located between the target and the ultrasonic vibration plate.

8. The microporation apparatus of any one of claims 1-4, wherein: the ultrasonic mechanism comprises an ultrasonic generator, an ultrasonic energy transmission unit and an ultrasonic vibration unit, wherein the ultrasonic vibration unit is connected with the ultrasonic vibration plate, and the ultrasonic energy transmission unit is used for electrically connecting the ultrasonic generator with the ultrasonic vibration unit.

9. The microporation apparatus of any one of claims 1-4, wherein: the drill bit mechanism comprises a drill bit and a rotary driver for driving the drill bit to rotate, and the other end of the drill bit abuts against the target object.

10. An ultrasonic assisted drilling system comprising a micro-hole machining device according to any one of claims 1-9.

Technical Field

The invention belongs to the technical field of high-speed circuit board processing, and particularly relates to a micropore processing device and an ultrasonic auxiliary drilling system.

Background

With the development of 5G communication technology towards low-delay and high-speed transmission, high-speed circuit boards are produced to meet the current requirements of 56Gbps and future 112Gbps signal transmission. The high-speed Circuit Board has a lower dielectric constant (Dk) and dielectric loss (Df) value than a general Printed Circuit Board (PCB Printed Circuit Board). However, in order to improve the performance of the board, the high-speed circuit board uses non-polar resin, flat glass fiber, and hard filler, which all pose new challenges to the micro-via processing of the high-speed circuit board, and the quality of the micro-via is one of the determining factors of the performance of the high-speed circuit board and the electronic information product to which the high-speed circuit board is applied.

At present, the micro-holes processed on the high-speed circuit board usually have processing defects such as rough hole wall, burrs, nail heads and the like, so that the high-speed circuit board has low quality.

Disclosure of Invention

An object of the embodiment of the application is to provide a micropore processing device, aiming at solving the problem of how to improve the micropore processing quality of a high-speed circuit board.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: there is provided a micro-hole machining apparatus for performing a drilling process on a target object, the micro-hole machining apparatus including:

the drilling structure comprises a base and a drill bit mechanism, wherein the base is positioned below the drill bit mechanism, and the drill bit mechanism is used for drilling the target object; and

the ultrasonic vibration structure comprises an ultrasonic vibration plate and an ultrasonic mechanism connected with the ultrasonic vibration plate, the ultrasonic vibration plate is flatly laid on the base and vibrates in a reciprocating mode along the vertical direction under the action of the ultrasonic mechanism, and the target object is fixedly laminated on the ultrasonic vibration plate and vibrates along with the ultrasonic vibration plate.

In one embodiment, the micro-hole machining device further comprises a guide positioning mechanism for guiding the ultrasonic vibration plate to vibrate back and forth in a vertical direction.

In one embodiment, the guiding and positioning mechanism includes a plurality of first positioning posts protruding from the base, the first positioning posts are spaced apart from one another, first positioning holes are formed in positions of the ultrasonic vibration plate corresponding to the first positioning posts, and free ends of the first positioning posts are located in the corresponding first positioning holes.

In one embodiment, the guiding and positioning mechanism includes a plurality of second positioning posts protruding from the ultrasonic vibration plate, the second positioning posts are spaced apart from each other, a second positioning hole is formed in a position of the base corresponding to each of the second positioning posts, and a free end of each of the second positioning posts is located in the corresponding second positioning hole.

In one embodiment, the ultrasonic vibration plate includes a plate body supporting the target object and a driving section connected to the plate body and suspended in the air, and the ultrasonic mechanism is connected to the driving section.

In one embodiment, the base is provided with a containing cavity, the edge of a cavity opening of the containing cavity is provided with a notch, the plate body is located in the containing cavity, and the driving section extends outwards through the notch.

In one embodiment, the micro-hole machining apparatus further includes a backing plate made of a flexible material, the backing plate being located between the object and the ultrasonic vibrating plate.

In one embodiment, the ultrasonic mechanism comprises an ultrasonic generator, an ultrasonic energy transmission unit and an ultrasonic vibration unit, wherein the ultrasonic vibration unit is connected with the ultrasonic vibration plate, and the ultrasonic energy transmission unit is used for electrically connecting the ultrasonic generator and the ultrasonic vibration unit.

In one embodiment, the drill mechanism includes a drill bit and a rotary driver for driving the drill bit to rotate, and the other end of the drill bit abuts against the target.

It is also an object of the present invention to provide an ultrasonic assisted drilling system including the micro-hole machining apparatus.

The beneficial effect of this application lies in: when the drilling mechanism drills a high-speed circuit board, the ultrasonic vibration structure 20 applies high-frequency vibration to the high-speed circuit board, and the drilling mechanism is assisted to drill holes through vibration of the high-speed circuit board, so that the drilling quality of the micropores of the high-speed circuit board is effectively improved, the roughness of the hole walls of the micropores is reduced, and common micropore machining defects such as inlet burrs and pin heads are eliminated.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a micro-hole machining apparatus according to an embodiment of the present disclosure;

figure 2 is an exploded schematic view of the micro-hole machining apparatus of figure 1.

Wherein, in the figures, the respective reference numerals:

100. a micropore machining device; 10. a base; 11. a base; 12. a support plate; 20. an ultrasonic vibrating structure; 21. an ultrasonic mechanism; 22. an ultrasonic vibrating plate; 211. an ultrasonic vibration unit; 221. a plate body; 222. a drive section; 32. a first positioning hole; 31. a first positioning post; 30. a guiding and positioning mechanism; 121. a placement cavity; 122. a notch; 101. a high-speed circuit board;

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1 and 2, a micro-hole processing apparatus 100 for micro-hole processing of a plate-shaped object is provided according to an embodiment of the present disclosure. Optionally, the size of the micropores is in the order of millimeters. Optionally, the target object in this embodiment is a high-speed circuit board 101. The micro-hole machining apparatus 100 includes a drilling structure and an ultrasonic vibration structure 20. The drilling structure comprises a base 10 and a drill bit mechanism, wherein the base 10 is located below the drill bit mechanism, the high-speed circuit board 101 is located between the base 10 and the drill bit mechanism, and the drill bit mechanism is used for drilling the high-speed circuit board 101. The ultrasonic vibration structure 20 includes an ultrasonic vibration plate 22 and an ultrasonic mechanism 21 connected to the ultrasonic vibration plate 22, the ultrasonic vibration plate 22 is flatly laid on the base 10 and vibrates in a reciprocating manner in a vertical direction under the action of the ultrasonic mechanism 21, and the high-speed circuit board 101 is fixed to the ultrasonic vibration plate 22 in a stacked manner and vibrates together with the ultrasonic vibration plate 22. Optionally, the ultrasonic mechanism 21 applies a high-frequency ultrasonic vibration of 20kHz to the high-speed circuit board 101, so that the ultrasonic-assisted drilling machining of the high-speed circuit board 101 is realized.

When the drilling mechanism drills a hole in the high-speed circuit board 101, the ultrasonic vibration structure 20 applies high-frequency vibration to the high-speed circuit board 101, and the drilling mechanism is assisted to drill the hole through the vibration of the high-speed circuit board 101, so that the drilling quality of the micropore of the high-speed circuit board 101 is effectively improved, the roughness of the pore wall of the micropore is reduced, and the common micropore machining defects such as inlet burrs and pin heads are eliminated.

Optionally, in the embodiment of the present application, by directly applying the vibration in the vertical direction to the high-speed circuit board 101, the high-speed circuit board combines the ultrasonic auxiliary technology using the ultrasonic vibration structure 20 in the drilling process, and has the characteristics of being more direct, more effective, and more cost-saving.

Referring to fig. 1 and 2, in one embodiment, the micro-hole processing apparatus 100 further includes a guiding and positioning mechanism 30, and the guiding and positioning mechanism 30 is used for guiding the ultrasonic vibration plate 22 to vibrate back and forth in a vertical direction. Alternatively, the height circuit board can be vibrated regularly by the guide positioning mechanism 30, so that the reliability and quality of micro-hole processing are improved.

In one embodiment, the guiding and positioning mechanism 30 includes a plurality of first positioning posts 31 protruding from the base 10, a first positioning hole 32 is formed at a position of the ultrasonic vibration plate 22 corresponding to each first positioning post 31, and a free end of each first positioning post 31 is located in the corresponding first positioning hole 32. Through the cooperation of first locating column 31 and first locating hole 32 to realize the direction and the location of ultrasonic vibration board 22, make high circuit board in the high-frequency vibration in-process, remain stable, improved micropore processingquality.

Referring to fig. 1 and fig. 2, in an embodiment, the guiding and positioning mechanism 30 includes a plurality of second positioning posts protruding on the ultrasonic vibration plate 22, the base 10 has a second positioning hole at a position corresponding to each second positioning post, and the free ends of the second positioning posts are located at the corresponding second positioning holes. Through the cooperation of second reference column and second locating hole to realize the direction and the location of ultrasonic vibration board 22, make high circuit board in the high-frequency vibration in-process, remain stable, improved micropore processingquality.

Referring to fig. 1 and 2, in an embodiment, the ultrasonic vibration plate 22 includes a plate body 221 supporting the high-speed circuit board 101 and a driving section 222 connected to the plate body 221 and suspended in the air, and the ultrasonic mechanism 21 is connected to the driving section 222. The suspension arrangement of the driving section 222 facilitates the connection between the ultrasonic mechanism 21 and the ultrasonic vibration plate 22, and has a compact structure.

Optionally, the first positioning hole 32 opens to the plate body 221.

Optionally, the second positioning column is protruded from the board body 221.

In one embodiment, the base 10 defines a receiving cavity, the edge of the opening of the receiving cavity defines a notch 122, the plate body 221 is located in the receiving cavity, and the driving section 222 extends outward through the notch 122. Alternatively, the base 10 includes a base 11 made of marble and a support plate 12 disposed on the base 11, the support plate 12 being made of an insulating bakelite plate. The accommodating cavity is opened in the support plate 12.

Referring to fig. 1 and 2, optionally, the first positioning pillar 31 is protruded from the bottom of the accommodating cavity 121.

Alternatively, the ultrasonic vibration plate 22 is connected to the support plate 12 through the guide positioning mechanism 30, no bolt is used for locking between the ultrasonic vibration plate 22 and the support plate 12, the accommodating cavity only limits the movement of the ultrasonic vibration plate 22 in the horizontal direction, and the vibration in the vertical direction is not limited.

Referring to fig. 1 and 2, in one embodiment, the ultrasonic mechanism 21 includes an ultrasonic generator, an ultrasonic energy transmission unit, and an ultrasonic vibration unit 211, the ultrasonic vibration unit 211 is connected to the ultrasonic vibration plate 22, and the ultrasonic generator transmits the high-frequency electric signal to the ultrasonic vibration unit 211 through the ultrasonic energy transmission unit. The driving section 222 extends outwardly by a predetermined distance with respect to the base 11, thereby facilitating the coupling of the ultrasonic vibration unit 211. Alternatively, the ultrasonic vibration unit 211 and the driving section 222 are completely fixed to each other by a welding process, and then an electric signal of the ultrasonic generator is transmitted to the ultrasonic vibration unit 211 through a wire, the ultrasonic generator is spaced from the ultrasonic vibration unit 211 by a certain distance, and the wire connecting the ultrasonic generator and the ultrasonic vibration unit 211 needs to have a certain length, so that when the ultrasonic vibration unit 211 moves and feeds along the base 10 in a predetermined direction, it is ensured that the ultrasonic generator is not pulled and damaged.

Alternatively, the ultrasonic generator is also called an ultrasonic power supply, and is mainly used for outputting high-frequency electric signals, and a digital integrated chip excitation type signal generation technology is generally adopted, and the ultrasonic signal generation technology is less affected by external environment and has high stability. While outputting the signal, the ultrasonic power supply is generally equipped with a real-time frequency tracking module, which tracks the resonant frequency of the system by an acoustic feedback method or an electric feedback method to adjust the frequency of the output signal.

The ultrasonic energy transmission unit is responsible for transmitting the high-frequency electric signal generated by the ultrasonic generator to the next ultrasonic transducer. The ultrasonic energy transmission unit generally comprises two types, namely a contact type high-efficiency and high-power energy transmission; the other is non-contact type which has high integration and is beneficial to automatic processing. The contact type ultrasonic energy transmission unit generally adopts a carbon brush-copper ring mechanism, and the structure is widely used due to simplicity, convenience and low cost.

The ultrasonic vibration unit 211 is a component that ultimately determines the vibration effect of the high-speed circuit board 101, and the ultrasonic vibration unit 211 may be an ultrasonic transducer or an ultrasonic horn. The ultrasonic transducer is mainly responsible for converting a received high-frequency electric signal into mechanical vibration, and is a piezoelectric ceramic transducer, a magnetostrictive transducer, a capacitive transducer and the like which are commonly used. The piezoelectric ceramic material has an electroacoustic conversion efficiency of more than 80%, and is widely applied due to the advantages of simple manufacturing and forming, variable shape, high amplitude expansion degree, low cost and the like. Optionally, the ultrasonic vibration unit 211 in this embodiment is an ultrasonic transducer.

The ultrasonic amplitude transformer is used for changing the amplitude or direction of the high-frequency mechanical vibration and then transmitting the high-frequency mechanical vibration to a machining tool or a workpiece. Commonly used ultrasonic horns can be classified according to their wavelength, cross-sectional shape, type of vibration, and their design is generally developed according to the corresponding vibration equation. The finally selected and manufactured ultrasonic amplitude transformer needs to meet the requirements of small energy transmission loss, high material fatigue strength, small acoustic resistance, convenience for processing and the like. Alternatively, in general, in the ultrasonic vibration mechanism, an ultrasonic transducer and an ultrasonic horn are combined and mounted together to be used as a combined unit, and the vibration frequencies of the ultrasonic transducer and the ultrasonic horn are ensured to be consistent, so that the ultrasonic vibration finally output to the machining tool or the workpiece is accurate and controllable.

In one embodiment, the micro-hole machining apparatus 100 further includes a backing plate made of a flexible material, the backing plate being located between the high-speed circuit board 101 and the ultrasonic vibrating plate 22. Alternatively, the height circuit board and the ultrasonic vibration plate 22 may be spaced apart by a certain distance by a pad plate, so that the ultrasonic vibration plate 22 is protected when the height circuit board is subjected to micro-hole processing. Alternatively, the ultrasonic vibration plate is made of a stainless steel material.

Referring to fig. 1 and 2, optionally, the backing plate and the high-speed circuit board 101 are also provided with first positioning holes 32 at positions corresponding to the ultrasonic vibration plate 22, and the first positioning posts 31 penetrate through the backing plate and penetrate into the first positioning holes 32 of the high-speed circuit board 101, so as to improve the stability of the high-speed circuit board in the vibration process.

In one embodiment, the drill mechanism includes a drill bit, the other end of which abuts the high speed circuit board 101, and a rotary driver that drives the drill bit to rotate.

Referring to fig. 1 and fig. 2, the present invention further provides an ultrasonic-assisted drilling system, which includes a micro-hole machining device 100, and the specific structure of the micro-hole machining device 100 refers to the above embodiments, and since the ultrasonic-assisted drilling system adopts all the technical solutions of all the embodiments, the ultrasonic-assisted drilling system also has all the beneficial effects brought by the technical solutions of the above embodiments, and no further description is provided herein.

Referring to fig. 1 and 2, optionally, the ultrasonic-assisted drilling system further includes a numerically controlled vertical drilling machine, and an insulating support plate 12 is fixed on the base 11 using bolts, and six degrees of freedom of the support plate 12 are completely limited with respect to the base 11 made of marble, mainly for supporting the ultrasonic vibration plate 22 and positioning the machining area.

Optionally, the numerically controlled vertical drilling machine is started according to the designed tool path, and the ultrasonic generator is started at the same time, so that the high-speed circuit board 101 and the ultrasonic vibration plate 22 perform high-frequency ultrasonic vibration together, and the ultrasonic-assisted drilling machining of the high-speed circuit board 101 is realized.

The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.