阅读说明：本技术 一种可有效避免线路板背钻钻咀缠丝的加工工艺 (Processing technology capable of effectively avoiding wire winding of circuit board back drill bit ) 是由 刘振海 蔡志浩 杨东强 郭苹苹 于 2021-07-30 设计创作，主要内容包括：本发明涉及线路板加工技术领域,具体是涉及一种可有效避免线路板背钻钻咀缠丝的加工工艺,包括：将线路板确定钻孔位置后放置到机台上并固定,调整钻机的背钻钻咀对准钻孔位置,将背钻钻咀垂直上移,在线路板上盖一层专用铝板；然后,将背钻钻咀垂直下移,根据设定的钻孔方式进行背钻,直至终钻位；所述钻孔方式根据钻孔总深度进行设定,并采用分多段钻的钻孔方式进行背钻；所述专用铝板厚度为0.17-0.20mm。本发明工艺可有效降低钻咀缠丝的几率,减小加工时钻咀缠丝的长度,钻咀无缠丝缠绕,孔型好,易清理,不堵塞通孔,研磨前无需人工清理缠丝,效率高,该加工工艺可彻底改善钻咀缠丝问题,有效提高了背钻钻孔品质和钻咀研磨效率。(The invention relates to the technical field of circuit board processing, in particular to a processing technology capable of effectively avoiding wire winding of a circuit board back drilling drill bit, which comprises the following steps: after determining the drilling position, the circuit board is placed on a machine table and fixed, a back drill bit of a drilling machine is adjusted to be aligned to the drilling position, the back drill bit is vertically moved upwards, and a layer of special aluminum plate is covered on the circuit board; then, vertically moving the back drilling drill bit downwards, and performing back drilling according to a set drilling mode until a final drilling position is reached; the drilling mode is set according to the total depth of the drilled hole, and back drilling is carried out by adopting a drilling mode of multi-section drilling; the thickness of the special aluminum plate is 0.17-0.20 mm. The process can effectively reduce the probability of the wire winding of the drill bit, reduce the length of the wire winding of the drill bit during processing, ensure that the drill bit is not wound by the wire winding, has good hole pattern, is easy to clean, does not block through holes, does not need to clean the wire winding manually before grinding, has high efficiency, can thoroughly improve the wire winding problem of the drill bit, and effectively improves the quality of back drilling and the grinding efficiency of the drill bit.)

1. The utility model provides a can effectively avoid circuit board back drill to chew processing technology of silk winding which characterized in that includes: after determining the drilling position, the circuit board is placed on a machine table and fixed, a back drill bit of a drilling machine is adjusted to be aligned to the drilling position, the back drill bit is vertically moved upwards, and a layer of special aluminum plate is covered on the circuit board; then, vertically moving the back drilling drill bit downwards, and performing back drilling according to a set drilling mode until a final drilling position is reached;

the drilling mode is set according to the total depth of the drilled hole, and back drilling is carried out by adopting a drilling mode of multi-section drilling;

the thickness of the special aluminum plate is 0.17-0.20 mm.

2. The process for effectively avoiding the wire winding of the drill bit of the circuit board back drill according to claim 1, wherein the drill bit is soaked with the auxiliary liquid for 2-5s before each section of drilling.

3. The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board as claimed in claim 2, wherein the auxiliary liquid comprises, by mass, 3.5-5% of oleyl alcohol triethanolamine, 2-3% of dibenzyl disulfide or sulfurized isobutylene, 10-15% of ethylene glycol, and the balance of water.

4. The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board as claimed in claim 1, wherein the multi-section drilling is completed by dividing the drilling flow into 2-8 sections.

5. The process for machining a back drill bit capable of effectively avoiding wire wrapping of a circuit board according to claim 1, wherein the multi-section drill is divided into equal sections or unequal sections.

6. The process for machining a circuit board back drill bit capable of effectively avoiding wire winding according to claim 1, wherein negative pressure gas is used for pumping away drill cuttings in the back drilling process.

7. The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board according to claim 1, wherein the thickness of the special aluminum plate is 0.18 mm.

8. The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board according to claim 1, wherein the special aluminum plate is composed of resin and an aluminum plate.

9. The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board according to claim 8, wherein the special aluminum plate meets the requirements of uniform thickness, no warping, no deformation and difficult chip generation during cutting.

Technical Field

The invention relates to the technical field of circuit board processing, in particular to a processing technology capable of effectively avoiding wire winding of a back drill bit of a circuit board.

Background

And back drilling is mainly used for removing a copper plating layer on the hole wall and reducing the loss of transmission signals. In the prior art, a conventional method is a cutter drill, because the hole wall is a copper-plated layer, a copper wire is easily wound on a drill bit, cutting force is not enough in the drilling process, a drainage groove is filled with filaments, poor drainage is realized in the drilling process, the through hole is plugged by generated cutting scraps, etching liquid medicine is left, and resin cannot be normally filled, so that the cutter drill is scrapped; meanwhile, the drill bit is wound with copper wires, so that the problems that the hole wall is rough, the hole pattern is poor, the through hole is blocked, drill cuttings are not easy to clean, the winding wires need to be manually treated before the drill bit is ground, and the efficiency is affected are solved.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a processing technology capable of effectively avoiding the back drilling drill bit wire winding of a circuit board, and the processing technology can effectively reduce the probability of the drill bit wire winding and the length of the drill bit wire winding during processing by covering a layer of special aluminum plate on the circuit board and adopting a segmentation mode to carry out back drilling, so that the drill bit is not wound with the wire winding and has good hole patterns; the drill bit is soaked by the auxiliary liquid before each section of drilling, so that the service life of the drill bit can be effectively prolonged, and the drilling precision can be improved; the negative pressure is adopted to pump away the scraps, the cleaning effect is good, the through holes are not blocked, the winding wire is not required to be cleaned manually before grinding, and the efficiency is high; the machining process effectively improves the back drilling quality and the drill bit grinding efficiency.

The invention realizes a processing technology capable of effectively avoiding wire winding of a circuit board back drilling drill bit by the following technical scheme, which comprises the following steps: after determining the drilling position, the circuit board is placed on a machine table and fixed, a back drill bit of a drilling machine is adjusted to be aligned to the drilling position, the back drill bit is vertically moved upwards, and a layer of special aluminum plate is covered on the circuit board; then, vertically moving the back drilling drill bit downwards, and performing back drilling according to a set drilling mode until a final drilling position is reached;

the drilling mode is set according to the total depth of the drilled hole, and back drilling is carried out by adopting a drilling mode of multi-section drilling; the thickness of the special aluminum plate is 0.17-0.20 mm.

Furthermore, in the technical scheme, the drill bit is soaked in the auxiliary liquid for 2-5s before each section of drilling.

Further, the auxiliary liquid in the technical scheme comprises, by mass, 3.5-5% of oleyl alcohol triethanolamine, 2-3% of dibenzyl disulfide or sulfurized isobutylene, 10-15% of ethylene glycol, and the balance of water.

Further, the multi-section drilling in the technical scheme is completed by dividing the drilling process into 2-8 sections.

Further, in the above technical solution, the multi-segment drill is divided into equal segments or unequal segments.

Further, in the technical scheme, negative pressure gas is adopted to pump away the drill cuttings in the back drilling process.

Further, in the above technical solution, the thickness of the special aluminum plate is preferably 0.18 mm.

Further, in the above technical solution, the dedicated aluminum plate is composed of a resin and an aluminum plate.

Furthermore, the special aluminum plate in the technical scheme meets the requirements of uniform thickness, no warping, no deformation and difficult chip generation during cutting.

Compared with the prior art, the invention has the following beneficial effects:

1. according to the invention, the special aluminum plate is additionally arranged on the circuit board, and back drilling is carried out in a multi-section drilling mode, so that the probability of drill bit wire winding can be effectively reduced, the length of the drill bit wire winding is reduced during processing, the drill bit is not wound with the wire winding, and the drilled hole is good in shape;

2. the auxiliary liquid is used for soaking the drill bit before each section of drilling, so that the lubricating effect is achieved, the drill bit can be rapidly cooled, the abrasion resistance of the drill bit is improved, the fragment adsorption is prevented, the service life of the drill bit can be effectively prolonged, and the drilling precision is improved;

3. the negative pressure is adopted to pump away the scraps, the cleaning effect is good, the through holes cannot be blocked, the winding wire does not need to be cleaned manually before grinding, and the efficiency is high;

4. the processing technology of the invention thoroughly improves the problem of wire winding of the drill bit and effectively improves the quality of back drilling and the grinding efficiency of the drill bit.

Drawings

FIG. 1 is a schematic cross-sectional view of a conventional back drill-in-bit mode;

FIG. 2 is a schematic cross-sectional view of a back-drilled sectional drill mode of the present invention;

FIG. 3 is a schematic view of a conventional cover plate construction;

fig. 4 is a schematic view of the cover plate structure of the present invention.

Number designations in the schematic drawings illustrate that:

1. circuit board, 2. drill bit, 3. final drill position.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the application, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it should be understood that the terms "first", "second", etc. are used to define the components, and are used only for the convenience of distinguishing the corresponding components, and if not otherwise stated, the terms have no special meaning, and thus, should not be construed as limiting the scope of the present application.

In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present application; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Referring to fig. 1 to 4, it should be noted that the drawings provided in the present embodiment are only schematic illustrations of the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the shape, number and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.

The processing technology capable of effectively avoiding wire wrapping of the back drill bit of the circuit board comprises the following steps: after determining the drilling position, the circuit board is placed on a machine table and fixed, a back drill bit of a drilling machine is adjusted to be aligned to the drilling position, the back drill bit is vertically moved upwards, and a layer of special aluminum plate is covered on the circuit board; then, vertically moving the back drilling drill bit downwards, and performing back drilling according to a set drilling mode until a final drilling position is reached;

the drilling mode is set according to the total depth of the drilled hole, and the back drilling is carried out by adopting the drilling mode of multi-section drilling. Generally, a mode of one-bit drilling is adopted, as shown in fig. 1, although the drilling efficiency is high, copper wires can be wound on a drill bit, so that poor back drilling is caused, the main reason is that the cutting amount is large, the copper wires cannot be timely drawn away by negative pressure gas, and meanwhile, through holes are easily blocked.

The invention adopts a multi-section drilling mode for back drilling, as shown in figure 2, the length of the filiform object can be effectively reduced during processing, the drill cuttings are easy to be drawn away, the drilling is clean, and the hole wall and the hole pattern can not be influenced.

In specific implementation, the multi-section drilling is completed by dividing the drilling process into 2-8 sections. Specifically, it can be divided into 2, 3, 4, 5, 6, 7, 8 segments.

In a specific implementation, the multi-segment drill is divided into equal segments or unequal segments. Specifically, the equal segmentation is divided into 2-8 sections according to the total depth of the drilled hole and then processed; it is also possible to perform the back drilling in unequal intervals, such as alternating intervals of wide, narrow, wide, and narrow, or wide, narrow, and narrow, but each back drilling is required to meet the requirement that the generated drill cuttings are easily extracted.

According to the invention, the drill bit is soaked in the auxiliary liquid for 2-5s before each section of drilling. Specifically, the auxiliary fluid may be a lubricant, a coolant, an antiwear agent, or the like. The lubricating property of the drill bit can be increased through the auxiliary liquid, the friction in the drilling process is reduced, the heat generation quantity is small, and meanwhile, the bits are not easy to stick; or through the volatilization of the liquid on the surface of the drill bit, the surface temperature is taken away, and the cooling is fast, so that the expansion caused by heating and the interference of drill cuttings in the drilling process can be reduced, the drilling is inaccurate, and the drilling precision is ensured.

In specific implementation, the auxiliary liquid comprises, by mass, 3.5-5% of oleyl alcohol triethanolamine, 2-2.5% of dibenzyl disulfide or sulfurized isobutylene, 10-15% of ethylene glycol, and the balance of water. The oleyl alcohol triethanolamine serving as an oiliness agent has excellent emulsifying and dispersing performances and antirust capacity, is fine and soft in material quality and good in stability, and can improve the anti-wear effect of the drill bit after being compounded with the sulfur-containing extreme pressure agent; the dibenzyl disulfide is a white crystalline sulfur-containing organic compound, is used as an extreme pressure agent, has high decomposition temperature and excellent wear resistance, abrasion resistance and oxidation resistance; the sulfurized isobutylene as one kind of extreme pressure agent has excellent extreme pressure antiwear performance and low copper corrosion.

Specifically, the preparation method of the auxiliary liquid comprises the following steps: mixing oleyl alcohol triethanolamine and dibenzyl disulfide (or sulfurized isobutylene) at a certain ratio, dispersing for 10-20nin, adding ethylene glycol, mixing, adding water to balance, and mixing. The auxiliary liquid obtained by the invention can rapidly cool the drill bit, increase the abrasion resistance of the drill bit and prevent chip adsorption, can effectively prolong the service life of the drill bit and increase the precision of drilling.

In specific implementation, the back drilling process uses negative pressure gas to pump away drill cuttings. Specifically, the negative pressure gas extraction condition can be that the negative pressure gas extraction is carried out under negative 30-50KPa pressure, after the segmented back drilling, no long winding is formed, the obtained drill cuttings are easy to extract, manual cleaning is not needed, and the through holes are not blocked.

In specific implementation, the thickness of the special aluminum plate is 0.17-0.20 mm. Specifically, it may be 0.17mm, 0.18mm, 0.19mm, 0.20mm, or the like; the thickness of the special aluminum plate is preferably 0.18 mm.

In a specific implementation, the special aluminum plate is composed of resin and an aluminum plate. Conventional back drilling generally uses an aluminum plate as a cover plate, as shown in fig. 3, and the aluminum plate has a thickness of generally 0.15mm, is relatively thin, is easily warped or deformed, and is sucked up by negative pressure gas, thereby affecting the drilling position deviation and the drilling quality and efficiency. According to the invention, the special aluminum plate is used as the cover plate, as shown in fig. 4, the high-hardness resin is combined with the aluminum plate, the thickness of the cover plate is increased, the deformation problem of the cover plate can be effectively prevented, the precision of hole positions and the drilling efficiency are ensured, and meanwhile, the special aluminum plate has a cleaning effect on the drill bit, and the wire winding probability of the drill bit can be effectively reduced.

Specifically, the resin material is preferably a relatively hard resin material, and may be copal resin, polycarbonate resin, or modified resin of polyformaldehyde and polyamide. Resin and aluminum plate coincide in turn and process into special aluminum plate, and this special aluminum plate can satisfy even, the warp of thickness, indeformable, difficult clastic requirement of producing during the cutting.

In conclusion, the special aluminum plate is additionally arranged on the circuit board, and back drilling is carried out in a multi-section drilling mode, so that the probability of drill bit wire winding can be effectively reduced, the length of the drill bit wire winding during processing is reduced, the drill bit is not wound with the wire winding, and the hole pattern is good; the drill bit is soaked by the auxiliary liquid before each section of drilling, so that the service life of the drill bit can be effectively prolonged, and the drilling precision can be improved; the negative pressure is adopted to pump away the scraps, the cleaning effect is good, the through holes are not blocked, the winding wire is not required to be cleaned manually before grinding, and the efficiency is high; the machining process effectively improves the back drilling quality and the drill bit grinding efficiency.

Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, rather than limitations, and that many variations and modifications of the invention are possible to those skilled in the art, without departing from the spirit and scope of the invention.