阅读说明：本技术 一种利用液相沉积制备麦克风动圈的方法 (Method for preparing microphone moving coil by liquid phase deposition ) 是由 王威 洪金聪 于 2021-09-09 设计创作，主要内容包括：本发明公开了一种利用液相沉积制备麦克风动圈的方法,包括以下步骤：S1：清洗音圈和振膜,在音圈和振膜上通过液相沉积的方式分别形成厚度为微米级别的金属导线层；S2：清洗音圈和振膜,并通过液相沉积的方式在金属导线层表面形成光刻薄膜；S3：在光刻薄膜表面通过光刻的方式将所欲形成音圈导线和振膜导线的部分刻出,在金属导线层上通过腐蚀的方式将除音圈导线和振膜导线之外的部分腐蚀,以在音圈表面形成音圈导线。本发明所制成的音圈导线能够达到微米级别,大大提高了音圈导线密度,并降低音圈重量,提高了麦克风的灵敏度。(The invention discloses a method for preparing a microphone moving coil by liquid phase deposition, which comprises the following steps: s1: cleaning the voice coil and the vibrating diaphragm, and respectively forming metal wire layers with the thickness of micron grade on the voice coil and the vibrating diaphragm in a liquid phase deposition mode; s2: cleaning the voice coil and the vibrating diaphragm, and forming a photoetching film on the surface of the metal wire layer in a liquid phase deposition mode; s3: and etching the part of the photoetching film surface, on which the voice coil wire and the diaphragm wire are to be formed, in a photoetching mode, and etching the part except the voice coil wire and the diaphragm wire on the metal wire layer in an etching mode to form the voice coil wire on the voice coil surface. The voice coil wire manufactured by the invention can reach micron level, thereby greatly improving the density of the voice coil wire, reducing the weight of the voice coil and improving the sensitivity of the microphone.)

1. A method for preparing a microphone moving coil by liquid phase deposition is characterized by comprising the following steps:

s1: cleaning the voice coil and the vibrating diaphragm, and respectively forming metal wire layers with the thickness of 80-100 micrometers on the voice coil and the vibrating diaphragm in a liquid phase deposition mode;

s2: cleaning the voice coil and the vibrating diaphragm, and forming a photoetching film on the surface of the metal wire layer in a liquid phase deposition mode;

s3: etching the part of the photoetching film surface where the voice coil wire and the vibrating diaphragm wire are to be formed in a photoetching mode, and corroding the part except the voice coil wire and the vibrating diaphragm wire on the metal wire layer in a corrosion mode to form the voice coil wire on the voice coil surface and the vibrating diaphragm wire electrically connected with the voice coil wire on the vibrating diaphragm surface;

s4: and removing the photoresist on the surface of the photoetching film.

2. The method for preparing a moving coil of a microphone according to claim 1, wherein the liquid deposition in the step S1 is performed in an environment having a temperature lower than 50 ℃.

3. The method for preparing a moving coil of a microphone according to claim 1, wherein the liquid deposition in the step S3 is performed in an environment having a temperature lower than 50 ℃.

4. The method for preparing a moving coil of a microphone by liquid deposition as claimed in claim 1, wherein after the photoresist is removed in step S4, the diaphragm and the voice coil are cleaned to form a protective film on the surfaces of the diaphragm and the voice coil.

5. The method for preparing a moving coil of a microphone by liquid deposition as claimed in claim 1, further comprising the step of S5: and assembling the voice coil and the microphone bracket into a whole.

6. The method for preparing a microphone moving coil by liquid deposition as claimed in claim 5, wherein the step S3 forms two first press contact points on the diaphragm, and both of the first press contact points are electrically connected with the diaphragm lead wire and are electrically connected with a second press contact point on the microphone support through a lead wire.

7. The method for manufacturing a moving coil of a microphone by liquid deposition as claimed in claim 6, wherein the lead wire is connected to the first press contact by press-fitting, and the lead wire is connected to the second press contact by soldering.

8. The method of claim 7, wherein the lead wire is soldered to the second contact point before the lead wire is connected to the first contact point and before the voice coil is assembled with the microphone holder.

9. The method for preparing a moving coil of a microphone by liquid deposition as claimed in claim 1, wherein the voice coil and the diaphragm are cleaned by an ultrasonic cleaner in step S1.

10. The method for preparing a moving coil of a microphone by liquid deposition as claimed in claim 1, wherein the voice coil and the diaphragm are integrally formed in step S1.

Technical Field

The invention relates to the field of microphones, in particular to a method for preparing a moving coil of a microphone by liquid phase deposition.

Background

At present, more and more devices need to be equipped with microphones. The microphones can be divided into two types, namely an electric microphone and a capacitance microphone according to the transduction principle of the microphones, and the electric microphone can be subdivided into a moving coil microphone and an aluminum strip microphone. Although the condenser microphone has higher sensitivity and wider frequency spectrum, the dynamic and durability of the condenser microphone are not as good as those of a moving coil microphone; the dynamic microphone is better in dynamic and durability, but the high-frequency response of the moving coil microphone is far inferior to that of the capacitor microphone, so that the sound pickup effect is influenced.

The most important of the sound pick-up structure of the moving coil microphone is the voice coil, and the weight of the voice coil accounts for more than 80% of the total weight of the voice coil and the vibrating diaphragm. And traditional voice coil loudspeaker voice coil all chooses the enameled wire to form the voice coil loudspeaker voice coil wire in the surface winding of voice coil loudspeaker voice coil, because, no matter be enameled wire production technology or coiling technology can't make the diameter of enameled wire reduce, this has led to voice coil loudspeaker voice coil wire density lower relatively, and this also leads to the whole weight of voice coil loudspeaker voice coil to be big partially, leads to sensitivity and resonance frequency one of the not high reason inadequately.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the method for preparing the moving coil of the microphone by liquid phase deposition is provided, and the sensitivity of the microphone is improved on the premise of ensuring good dynamic performance and durability of the microphone.

In order to solve the technical problems, the invention adopts the technical scheme that:

a method for preparing a microphone moving coil by liquid phase deposition, comprising the following steps:

s1: cleaning the voice coil and the vibrating diaphragm, and respectively forming metal wire layers with the thickness of 80-100 microns on the voice coil and the vibrating diaphragm in a liquid phase deposition mode;

s2: cleaning the voice coil and the vibrating diaphragm, and forming a photoetching film on the surface of the metal wire layer in a liquid phase deposition mode;

s3: etching the part of the photoetching film surface where the voice coil wire and the vibrating diaphragm wire are to be formed in a photoetching mode, and corroding the part except the voice coil wire and the vibrating diaphragm wire on the metal wire layer in a corrosion mode to form the voice coil wire on the voice coil surface and the vibrating diaphragm wire electrically connected with the voice coil wire on the vibrating diaphragm surface;

s4: and removing the photoresist on the surface of the photoetching film.

The invention has the beneficial effects that: form range upon range of metal wire layer and the photoetching film of setting up through liquid phase deposition's mode, and the metal wire layer can reach the micron level, form the voice coil loudspeaker voice coil wire on the voice coil loudspeaker voice coil surface through the mode that photoetching and corruption combine, and form the vibrating diaphragm wire on the vibrating diaphragm surface, the voice coil loudspeaker voice coil wire that forms and vibrating diaphragm wire can reach the micron level, replace traditional enameled wire, the linear density of the coil that the voice coil loudspeaker voice coil wire made has greatly been promoted, and then the sensitivity of microphone has been improved, furthermore, the weight of voice coil loudspeaker voice coil and vibrating diaphragm has still been reduced, the high frequency response of microphone has been improved. The invention combines liquid phase deposition, photoetching and corrosion to prepare a voice coil wire and a vibrating diaphragm wire in micron level, and improves the sensitivity of the moving coil microphone on the premise of ensuring good dynamic performance and durability of the moving coil microphone.

Drawings

Fig. 1 is a partial exploded view of a microphone according to the present invention.

Description of reference numerals:

1. a voice coil; 11. a voice coil wire; 2. vibrating diaphragm; 21. a vibrating diaphragm wire; 22. a first press-contact point; 3. a microphone stand; 31. a second press-contact point; 32. and (6) leading out wires.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1, a method for preparing a moving coil of a microphone by liquid deposition includes the following steps:

s1: cleaning the voice coil and the vibrating diaphragm, and respectively forming metal wire layers with the thickness of 80-100 micrometers on the voice coil and the vibrating diaphragm in a liquid phase deposition mode;

s2: cleaning the voice coil and the vibrating diaphragm, and forming a photoetching film on the surface of the metal wire layer in a liquid phase deposition mode;

s3: etching the part of the photoetching film surface where the voice coil wire and the vibrating diaphragm wire are to be formed in a photoetching mode, and corroding the part except the voice coil wire and the vibrating diaphragm wire on the metal wire layer in a corrosion mode to form the voice coil wire on the voice coil surface and the vibrating diaphragm wire electrically connected with the voice coil wire on the vibrating diaphragm surface;

s4: and removing the photoresist on the surface of the photoetching film.

The working principle of the invention is as follows:

the voice coil wire and the vibrating diaphragm wire in the micron level are manufactured by combining liquid phase deposition, photoetching and corrosion, the linear density of the voice coil wire is improved, the sensitivity is further improved, the weight of the voice coil and the vibrating diaphragm is reduced, and the high-frequency response of the microphone is improved.

From the above description, the beneficial effects of the present invention are: form range upon range of metal wire layer and the photoetching film of setting up through liquid phase deposition's mode, and the metal wire layer can reach the micron level, form the voice coil loudspeaker voice coil wire on the voice coil loudspeaker voice coil surface through the mode that photoetching and corruption combine, and form the vibrating diaphragm wire on the vibrating diaphragm surface, the voice coil loudspeaker voice coil wire that forms and vibrating diaphragm wire can reach the micron level, replace traditional enameled wire, the linear density of the coil that the voice coil loudspeaker voice coil wire made has greatly been promoted, and then the sensitivity of microphone has been improved, furthermore, the weight of voice coil loudspeaker voice coil and vibrating diaphragm has still been reduced, the high frequency response of microphone has been improved. The invention combines liquid phase deposition, photoetching and corrosion to prepare a voice coil wire and a vibrating diaphragm wire in micron level, and improves the sensitivity of the moving coil microphone on the premise of ensuring good dynamic performance and durability of the moving coil microphone.

Further, the liquid phase deposition in the step S1 is performed in an environment at a temperature lower than 50 ℃.

Further, the liquid phase deposition in the step S3 is performed in an environment at a temperature lower than 50 ℃.

As can be seen from the above description, performing the liquid deposition in an environment below 50 ℃ can avoid deformation of the diaphragm.

Further, after the photoresist is removed in step S4, the diaphragm and the voice coil are cleaned, so that a protective film is formed on the surfaces of the diaphragm and the voice coil.

Further, the method also includes step S5: and assembling the voice coil and the microphone bracket into a whole.

Further, the step S3 forms two first press contact points on the diaphragm, where both of the first press contact points are electrically connected to the diaphragm lead wire and are used to be electrically connected to a second press contact point on the microphone stand through the lead wire.

Further, the outgoing line and the first press contact point are connected in a press connection mode, and the outgoing line and the second press contact point are connected in a welding mode.

As can be known from the above description, the outgoing line is connected with the first press contact point in a press connection mode, and compared with the traditional connection mode that the enameled wire is welded, the stress is more uniform, the nonuniform stress can be effectively reduced, and the pickup distortion phenomenon of the microphone is reduced.

Further, before the lead wire is connected with the first press contact point and before the voice coil is assembled with the microphone bracket, the lead wire and the second press contact point are welded.

As can be seen from the above description, in order to prevent the high temperature generated during welding from being conducted to the diaphragm, the lead-out wire and the second press contact point are first welded, then the lead-out wire and the first press contact point are pressed, and the voice coil and the microphone holder are assembled, so that the diaphragm can be prevented from being deformed.

Further, in step S1, the voice coil and the diaphragm are cleaned by an ultrasonic cleaning machine.

Further, in step S1, the voice coil and the diaphragm are integrally formed.

Example one

Referring to the drawings, a method for preparing a moving coil of a microphone by liquid phase deposition comprises the following steps:

s1: the voice coil 1 and the vibrating diaphragm 2 are integrally formed, the voice coil 1 and the vibrating diaphragm 2 are cleaned in an ultrasonic cleaning machine, metal conducting wire layers with the thickness of 80-100 micrometers are respectively formed on the voice coil 1 and the vibrating diaphragm 2 in a liquid phase deposition mode, and the liquid phase deposition is carried out in an environment with the temperature lower than 50 ℃; preferably, the liquid phase deposition temperature is 20 ℃.

S2: cleaning the voice coil 1 and the vibrating diaphragm 2, and forming a photoetching film on the surface of the metal wire layer in a liquid phase deposition mode, wherein the liquid phase deposition is carried out in an environment with the temperature lower than 50 ℃; preferably, the liquid phase deposition temperature is 20 ℃.

S3: etching the part of the photoetching film surface where the voice coil wire 11 and the vibrating diaphragm wire 21 are to be formed in a photoetching mode, and etching the part except the voice coil wire 11 and the vibrating diaphragm wire 21 on the metal wire layer in a copper chloride solution etching mode to form the voice coil wire 11 on the surface of the voice coil 1 and form the vibrating diaphragm wire 21 electrically connected with the voice coil wire 11 on the surface of the vibrating diaphragm 2;

s4: and removing the photoresist on the surface of the photoetching film by using a photoresist solvent. And cleaning the diaphragm 2 and the voice coil 1 to form a protective film on the surfaces of the diaphragm 2 and the voice coil 1.

S5: the voice coil 1 is assembled with the microphone holder 3 to form a whole.

Specifically, step S3 forms two first press-contact points 22 on the diaphragm 2, and each of the two first press-contact points 22 is electrically connected to the diaphragm lead wire 21 and is used to electrically connect to the second press-contact point 31 on the microphone holder 3 through the lead-out wire 32. Wherein the lead-out wire 32 is an enameled wire.

Specifically, the lead wire 32 is connected to the first press-contact point 22 by press-fitting, and the lead wire 32 is connected to the second press-contact point 31 by soldering. Before the lead wire 32 is connected to the first press-contact point 22 and before the voice coil 1 is assembled with the microphone holder 3, the lead wire 32 is soldered to the second press-contact point 31.

Optionally, in this embodiment, the metal wire layer is made of copper or silver.

Comparative example

Adopt voice coil loudspeaker voice coil and vibrating diaphragm that the enameled wire was made.

Watch 1

The test results of the table I show that the sensitivity of the embodiment I can reach 3.5mv/Pa +/-3 dB at most, and is far greater than that of the comparison example, the distortion degree of the embodiment I can reach 0.4 percent and is far less than that of the comparison example.

The above test is referred to the national standard GB/T12060.4-2012.

The voice coil wire and the vibrating diaphragm wire manufactured in the embodiment replace the traditional enameled wire, and the effect of the original multilayer enameled wire can be achieved only by a single layer or double layers. The moving coil microphone drives a coil connected with a vibrating diaphragm to cut magnetic lines of force in a magnetic field through air vibration to generate electric signals to work, the density of the coil determines the strength of the generated electric signals, the wire diameter of an enameled wire is difficult to be extremely fine, a micron-sized voice coil conducting wire can be formed through a mode of combining liquid phase deposition, photoetching and corrosion, the size of the voice coil conducting wire is increased from about 500 circles to about 2000 circles, and the sensitivity of the microphone is improved. And because the voice coil wire is extremely thin, its weight is extremely light, can promote the high frequency response of microphone.

In summary, according to the method for preparing the microphone moving coil by using liquid deposition provided by the invention, the metal conducting wire layer with the micron thickness is formed in a liquid deposition manner, and then the voice coil conducting wire is formed on the surface of the voice coil in a manner of combining photoetching and corrosion, so that the linear density of the voice coil conducting wire is improved, and the sensitivity of the microphone is further improved. In addition, in order to avoid the deformation of the diaphragm, liquid phase deposition is carried out in an environment of 20 ℃, so that the vibration effect of the diaphragm is ensured. The invention forms the micron-sized voice coil wire by combining the liquid phase deposition, the photoetching and the corrosion, improves the linear density of the voice coil wire, reduces the integral weight of the voice coil, improves the sensitivity of the microphone and reduces the distortion.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.