阅读说明：本技术 磨削装置 (Grinding device ) 是由 平岩卓 武田昇 于 2021-05-06 设计创作，主要内容包括：本发明提供磨削装置,该磨削装置能够对磨削磨轮的基台进行清洗。磨削装置具有超声波清洗单元。超声波清洗单元包含：一对侧壁,它们围绕基台和磨削磨具的内侧和外侧；底面,其连接一对侧壁；喷射口,其形成于侧壁或底面的至少任意一方,朝向基台或磨削磨具的至少任意一方喷射清洗液；清洗液提供部,其向喷射口提供清洗液；超声波振子,其对从清洗液提供部提供的清洗液赋予超声波；以及电力提供部,其对超声波振子施加电力。(The invention provides a grinding device which can clean a base for grinding a grinding wheel. The grinding device has an ultrasonic cleaning unit. The ultrasonic cleaning unit includes: a pair of side walls surrounding the inner and outer sides of the abutment and the grinding stone; a bottom surface connecting the pair of side walls; an ejection port formed on at least one of the side wall and the bottom surface, for ejecting a cleaning liquid toward at least one of the base and the grindstone; a cleaning liquid supply unit that supplies a cleaning liquid to the ejection port; an ultrasonic vibrator that applies ultrasonic waves to the cleaning liquid supplied from the cleaning liquid supply unit; and a power supply unit that applies power to the ultrasonic transducer.)

1. A grinding device, wherein,

the grinding device comprises:

a holding table that holds a workpiece and rotates;

a grinding wheel including an annular base fixed to the rotary spindle and a plurality of grinding stones fixed to the base; and

an ultrasonic cleaning unit for cleaning the annular base,

the ultrasonic cleaning unit includes:

side walls surrounding inner and outer sides of the abutment and the grinding stone;

a bottom surface connecting the sidewalls;

an ejection port formed on at least one of the side wall and the bottom surface, for ejecting a cleaning liquid toward at least one of the base and the grinding wheel;

a cleaning liquid supply unit for supplying a cleaning liquid to the ejection port;

an ultrasonic vibrator for applying ultrasonic waves to the cleaning liquid supplied from the cleaning liquid supply unit; and

and a power supply unit that applies power to the ultrasonic transducer.

2. A grinding apparatus according to claim 1,

the bottom surface is connected to a cleaning liquid discharge pipe, and the bottom surface is inclined so as to be lower toward a portion to which the cleaning liquid discharge pipe is connected.

3. A grinding apparatus according to claim 1 or 2,

the ultrasonic transducer is disposed on at least one of the side wall and the bottom surface.

Technical Field

The present invention relates to a grinding apparatus.

Background

The following structures are known: in a grinding apparatus for grinding a workpiece on a rotating holding table by a grinding wheel including a plurality of grinding stones arranged in a ring shape, a cleaning liquid is sprayed onto a grinding surface of the grinding stones to clean the grinding surfaces (see patent document 1).

Patent document 1: japanese patent laid-open publication No. 2015-Asn 202545

Among grinding apparatuses, there is a grinding apparatus using a grinding wheel including an annular base and a plurality of grinding stones fixed to the base. In such a grinding apparatus, there are problems as follows: when the grinding wheel is rotated or replaced in a state where the base is contaminated, the processing chamber is contaminated. Moreover, there are problems as follows: when the grinding wheel is replaced, the dirt on the base may fall on the holding table or the grinding device, or may adhere to the workpiece after grinding.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a grinding apparatus capable of cleaning a base for grinding a grinding wheel.

According to the present invention, there is provided a grinding apparatus having: a holding table that holds a workpiece and rotates; a grinding wheel including an annular base fixed to the rotary spindle and a plurality of grinding stones fixed to the base; and an ultrasonic cleaning unit for cleaning the annular base, the ultrasonic cleaning unit including: side walls surrounding inner and outer sides of the abutment and the grinding stone; a bottom surface connecting the sidewalls; an ejection port formed on at least one of the side wall and the bottom surface, for ejecting a cleaning liquid toward at least one of the base and the grinding wheel; a cleaning liquid supply unit for supplying a cleaning liquid to the ejection port; an ultrasonic vibrator for applying ultrasonic waves to the cleaning liquid supplied from the cleaning liquid supply unit; and a power supply unit that applies power to the ultrasonic transducer.

Preferably, the bottom surface is connected to a cleaning liquid discharge pipe, and the bottom surface is inclined so as to be lower toward a portion to which the cleaning liquid discharge pipe is connected.

Preferably, the ultrasonic transducer is disposed on at least one of the side wall and the bottom surface.

The base station of the grinding wheel can be cleaned.

Drawings

Fig. 1 is a sectional view showing a configuration example of a grinding apparatus according to embodiment 1.

Fig. 2 is a plan view showing a positional relationship between the components of the grinding apparatus shown in fig. 1.

Fig. 3 is an enlarged sectional view of an ultrasonic cleaning unit of the grinding apparatus of fig. 1.

Fig. 4 is a perspective view showing an ultrasonic cleaning unit of the grinding apparatus of fig. 1 from another angle.

Fig. 5 is a perspective view showing a water path of the ultrasonic cleaning unit of fig. 3.

Fig. 6 is an enlarged cross-sectional view of a main portion of the grinding apparatus according to embodiment 2.

Fig. 7 is an enlarged cross-sectional view of a main portion of the grinding apparatus according to embodiment 3.

Fig. 8 is an enlarged cross-sectional view of a main portion of a grinding apparatus according to a modification.

Fig. 9 is a perspective view illustrating an ultrasonic cleaning unit of the grinding apparatus of fig. 8.

Fig. 10 is a perspective view illustrating a water path of the ultrasonic cleaning unit of fig. 8.

Description of the reference symbols

1. 1-2, 1-3, 1-4: a grinding device; 10: a holding table; 11: a holding surface; 20: a grinding unit; 21: rotating the main shaft; 22: grinding the grinding wheel; 25: a base station; 25-1: an inner peripheral surface; 25-2: an outer peripheral surface; 26: grinding the grinding tool; 26-1: an inner peripheral surface; 26-2: an outer peripheral surface; 26-3: grinding the noodles; 30. 30-2, 30-3, 30-4: an ultrasonic cleaning unit; 31. 32: a side wall; 33: a bottom surface; 33-1, 33-2: an inclined surface; 34. 44: a waterway; 34-1, 44-1: a 1 st waterway; 34-2, 44-4: an ultrasonic wave application space; 34-3: a 2 nd waterway; 34-5, 44-5: an ejection port; 35: a cleaning liquid supply section; 36: an ultrasonic vibrator; 37: a power supply unit; 38: a cleaning liquid discharge pipe; 39: a discharge unit; 51: cleaning fluid; 100: a workpiece is processed.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include substantially the same components as can be easily conceived by those skilled in the art. The following structures can be combined as appropriate. Various omissions, substitutions, and changes in the structure can be made without departing from the spirit of the invention.

[ 1 st embodiment ]

A grinding apparatus 1 according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a sectional view showing a configuration example of a grinding apparatus 1 according to embodiment 1. Fig. 2 is a plan view showing a positional relationship between the components of the grinding apparatus 1 shown in fig. 1. Fig. 3 is an enlarged sectional view of the ultrasonic cleaning unit 30 of the grinding apparatus 1 of fig. 1. Fig. 4 is a perspective view showing the ultrasonic cleaning unit 30 of the grinding apparatus 1 of fig. 1 from another angle. Fig. 5 is a perspective view illustrating the water path 34 of the ultrasonic cleaning unit 30 of fig. 3. As shown in fig. 1, the grinding apparatus 1 includes a holding table 10, a grinding unit 20, an ultrasonic cleaning unit 30, and a control unit 40. The grinding apparatus 1 grinds the workpiece 100 held by the holding table 10 by the grinding unit 20.

The workpiece 100 to be ground by the grinding apparatus 1 is, for example, a wafer such as a disc-shaped semiconductor wafer or an optical device wafer based on silicon, sapphire, gallium arsenide, or the like. The workpiece 100 has devices formed in regions defined by a plurality of planned dividing lines formed in a lattice shape on a flat front surface, for example, and is ground from a back surface side opposite to the front surface. In the present invention, the workpiece 100 may be a rectangular package substrate, a ceramic plate, a glass plate, or the like, which includes a plurality of devices sealed with resin.

As shown in fig. 1, the holding table 10 has a holding surface 11 facing upward and parallel to a horizontal plane. The holding table 10 is connected to a suction source, not shown, and sucks and holds the workpiece 100 by the holding surface 11 by negative pressure supplied from the suction source. The holding table 10 is connected to a rotation driving unit, not shown, and can be rotated by the rotation driving unit.

As shown in fig. 1, the grinding unit 20 has a rotating spindle 21 and a grinding wheel 22. The grinding wheel 22 includes: an annular base 25 fixed to a lower end of the rotary spindle 21; and a plurality of grinding stones 26 fixed to the base 25 and arranged in a ring shape. The grinding unit 20 rotates the grinding wheel 22 by the rotating spindle 21, and presses the workpiece 100 held by the holding surface 11 of the rotating holding table 10 in the Z-axis direction, thereby grinding the workpiece 100.

As shown in fig. 2, in the grinding apparatus 1, the rotation center of the holding table 10 and the rotation center of the grinding wheel 22 are arranged to be offset in the horizontal direction (X-axis direction in fig. 1). In the grinding apparatus 1, as shown in fig. 2, when the grinding wheel 22 is rotated, the path through which the base 25 and the grinding whetstone 26 pass includes an on-table path 28 in a region facing the holding surface 11 of the holding table 10 in the Z-axis direction and an off-table path 29 deviated from a region facing the holding surface 11 of the holding table 10 in the Z-axis direction. In the grinding apparatus 1, as shown in fig. 2, the ultrasonic cleaning unit 30 is disposed so as to sandwich the base 25 and the grinding whetstone 26 passing through the table outer path 29 from below. In the grinding apparatus 1, only one ultrasonic cleaning unit 30 is provided in the example shown in fig. 2, but a plurality of units may be provided at arbitrary intervals on the table outer path 29. In the grinding apparatus 1, the ultrasonic cleaning unit 30 may be formed in an arc shape along the table outer path 29 in a range wider than that shown in fig. 2.

As shown in fig. 1, 2, 3, 4 and 5, the ultrasonic cleaning unit 30 includes side walls 31 and 32, a bottom surface 33, a 1 st water passage 34-1, an ultrasonic wave application space 34-2, a 2 nd water passage 34-3, an ejection port 34-5, a cleaning liquid supply portion 35, an ultrasonic vibrator 36, a power supply portion 37, a cleaning liquid discharge pipe 38 and a discharge portion 39.

The side wall 31 is a member (the 1 st side wall member) having a constant thickness and provided radially opposite to the inner circumferential surfaces 25-1 and 26-1 of the base 25 and the grindstone 26 passing through the table outer path 29 and the inner circumferential surfaces 25-1 and 26-1 of the base 25 and the grindstone 26. An outer wall surface 31-1 of the side wall 31, which is opposed to the inner circumferential surface 25-1 and the inner circumferential surface 26-1 of the base 25 and the grindstone 26 in the radial direction, is formed into a curved surface shape that protrudes outward in the radial direction along the inner circumferential surfaces 25-1, 26-1. The side wall 32 is a member (2 nd side wall member) having a constant thickness and provided radially opposite to the outer circumferential surfaces 25-2 and 26-2 in the radial direction of the base 25 and the grindstone 26 and the base 25 and the grindstone 26 passing through the table outer path 29. An inner wall surface 32-1 of the side wall 32, which is opposed to the outer circumferential surfaces 25-2 and 26-2 of the base 25 and the grindstone 26 in the radial direction, is formed into a curved surface shape that protrudes outward in the radial direction along the outer circumferential surfaces 25-2 and 26-2. The side walls 31, 32 surround the inside and outside of the abutment 25 and the grinding stone 26. The bottom surface 33 is a member (bottom surface member) having a constant thickness and provided so as to face the lower side of the grinding stone 26 passing through the table outer path 29. The bottom surface 33 connects the lower ends of the side walls 31, 32 to each other, and connects the side walls 31, 32 in the lower radial direction. The bottom surface 33 is vertically opposed to a grinding surface 26-3, which is a surface of the grinding stone 26 grinding the workpiece 100. The side walls 31 and 32 and the bottom surface 33 are integrally formed into an "コ" shaped member, and the base 25 and the grindstone 26 passing through the table outer path 29 are sandwiched from below by the groove portion of the "コ" shaped member.

As shown in fig. 3 and 4, the side walls 31 and 32 have a water passage 34 formed therein. As shown in fig. 3, 4 and 5, the water path 34 includes a 1 st water path 34-1, a plurality of ultrasonic wave applying spaces 34-2, a 2 nd water path 34-3 having the same number as the ultrasonic wave applying spaces 34-2, and a jet port 34-5 formed in the 2 nd water path 34-3. The 1 st water path 34-1 is a thin branch water path pipe, one end of which is connected to the cleaning liquid supply portion 35, and is branched into a plurality of (3 in embodiment 1) water paths at the center portion, and the other end of which is connected to the ultrasonic wave application space 34-2.

The ultrasonic wave application space 34-2 is a space having a plurality of, for example, cylindrical outer shapes provided inside the side walls 31 and 32, and an ultrasonic transducer 36 is disposed inside. In embodiment 1, 3 ultrasonic wave applying spaces 34-2 are provided on each of the side walls 31 and 32, and a connecting portion formed at one end is connected to the other end of the 1 st water path 34-1 and the other end is connected to the 2 nd water path 34-3. The 2 nd water channels 34-3 are each a thin water channel pipe, one end of which is connected to the ultrasonic wave application space 34-2, and a plurality of (3 in embodiment 1) ejection ports 34-5 opened to the outer wall surface 31-1 and the inner wall surface 32-1 of the side walls 31, 32 are formed on the other end side. The injection port 34-5 may be formed in a cylindrical shape extending from the 2 nd water passage 34-3 toward the outer wall surface 31-1 and the inner wall surface 32-1 as shown in fig. 3 and 4, or may be formed directly in the 2 nd water passage 34-3 as shown in fig. 5.

In embodiment 1, the 1 st water path 34-1, the ultrasonic wave applying space 34-2, the 2 nd water path 34-3, and the jet port 34-5 constituting the water path 34 are formed of ceramic or quartz glass. In the examples shown in fig. 3, 4 and 5, the water path 34 has 3 ultrasonic wave applying spaces 34-2 and 2 nd water paths 34-3 on the side walls 31 and 32, and has 9 ejection ports 34-5, but the number of these components is not limited to this in the present invention.

The cleaning liquid supply portion 35 is controlled by the control unit 40 to supply a predetermined volume of cleaning liquid 51 to the ejection port 34-5 at a predetermined pressure through the water passage 34 formed in each of the side walls 31 and 32. In embodiment 1, the cleaning liquid 51 supplied from the cleaning liquid supply unit 35 is, for example, pure water or cleaning water containing a cleaning agent. The cleaning liquid 51 supplied from the cleaning liquid supply unit 35 to the water path 34 is supplied to the ultrasonic wave application space 34-2 through the inside of the 1 st water path 34-1, and ultrasonic waves are applied by the ultrasonic transducer 36 in the ultrasonic wave application space 34-2 to be ejected from the ejection port 34-5 through the 2 nd water path 34-3 at a predetermined pressure.

The jet port 34-5 formed in the outer wall surface 31-1 of the side wall 31 jets the cleaning liquid 51 supplied from the cleaning liquid supply portion 35 toward the inner peripheral surface 25-1 of the base 25 passing through the outer peripheral side of the side wall 31, thereby cleaning the inner peripheral surface 25-1 of the base 25 passing through the outer peripheral side of the side wall 31. The jet port 34-5 formed in the inner wall surface 32-1 of the side wall 32 jets the cleaning liquid 51 supplied from the cleaning liquid supply portion 35 toward the outer peripheral surface 25-2 of the base 25 passing through the inner peripheral side of the side wall 32, thereby cleaning the outer peripheral surface 25-2 of the base 25 passing through the inner peripheral side of the side wall 32.

As shown in fig. 3, 4, and 5, the ultrasonic transducer 36 is disposed in the ultrasonic wave application space 34-2 of the water channel 34 formed inside the side walls 31 and 32, respectively, and applies ultrasonic waves to the cleaning liquid 51 passing through the ultrasonic wave application space 34-2. In embodiment 1, the ultrasonic transducer 36 is a drop-type ultrasonic transducer disposed in the ultrasonic wave application space 34-2 or a nozzle-type ultrasonic transducer inserted into the ultrasonic wave application space 34-2. The power supply unit 37 is electrically connected to the ultrasonic transducer 36, and applies power to the ultrasonic transducer 36 under the control of the control unit 40, thereby realizing the ultrasonic wave applying function of the ultrasonic transducer 36.

The cleaning liquid discharge pipe 38 is provided at the radial center portion of the bottom surface 33 so as to vertically penetrate the bottom surface 33, and has an upper end opened to the bottom surface 33 and a lower end connected to the discharge portion 39. The bottom surface 33 has an inclined surface 33-1 on the surface side facing the grinding surface 26-3, and the inclined surface 33-1 is inclined so that the radial center portion becomes lower from the radial inner peripheral side connected to the side wall 31 toward the radial center portion connected to the cleaning liquid discharge pipe 38. In the ultrasonic cleaning unit 30, the cleaning liquid 51 ejected from the ejection port 34-5 on the side wall 31 side cleans the inner peripheral surface 25-1 of the base 25 to become a cleaning waste liquid 52 containing dirt such as grinding debris, and the cleaning waste liquid 52 is guided along the inclined surface 33-1 to the cleaning liquid discharge pipe 38.

The bottom surface 33 has an inclined surface 33-2 on the surface side facing the grinding surface 26-3, and the inclined surface 33-2 is inclined so that the radial center portion becomes lower from the radial outer peripheral side connected to the side wall 32 toward the radial center portion connected to the cleaning liquid discharge pipe 38. In the ultrasonic cleaning unit 30, the cleaning liquid 51 ejected from the ejection port 34-5 on the side wall 32 side cleans the outer peripheral surface 25-2 of the base 25 to become a cleaning waste liquid 52 containing dirt such as grinding debris, and the cleaning waste liquid 52 is guided along the inclined surface 33-2 to the cleaning liquid discharge pipe 38.

The discharge portion 39 is connected to a lower end of the cleaning liquid discharge pipe 38. The discharge unit 39 is controlled by the control unit 40, and sucks the cleaning waste liquid 52 guided to the cleaning liquid discharge pipe 38 and discharges the liquid outside the ultrasonic cleaning unit 30.

The control unit 40 controls each component of the grinding apparatus 1 to perform the grinding process of the grinding apparatus 1 and the cleaning process of the ultrasonic cleaning unit 30 on the base 25 of the grinding wheel 22. The control unit 40 grinds the workpiece 100 by the grinding wheel 22, for example, according to the grinding conditions of the workpiece 100 set by the operator input. The control unit 40 also cleans the base 25 of the grinding wheel 22 by the ultrasonic cleaning unit 30 according to the cleaning conditions of the base 25 of the grinding wheel 22 set by the operator input.

In embodiment 1, the control unit 40 includes a computer system. The control unit 40 has: an arithmetic Processing Unit having a microprocessor such as a CPU (Central Processing Unit); a storage device having a Memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory); and an input/output interface device. The arithmetic processing device of the control unit 40 executes arithmetic processing in accordance with a computer program stored in a storage device, and outputs a control signal for controlling the control unit 40 to each component of the grinding apparatus 1 via the input/output interface device, thereby realizing a control function of the control unit 40.

The grinding apparatus 1 according to embodiment 1 having the above-described configuration has the following operational advantages: in the grinding of the workpiece 100 by the grinding unit 20, the ultrasonic cleaning unit 30 applies ultrasonic waves to the cleaning liquid 51 supplied from the cleaning liquid supply portion 35 by the ultrasonic vibrator 36 and the power supply portion 37, and sprays the cleaning liquid from the spray ports 34-5 formed in the side walls 31 and 32 toward the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 of the grinding wheel 22 passing through the table outer path 29, thereby cleaning the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 of the grinding wheel 22 after the grinding treatment is performed in the table upper path 28. In the grinding apparatus 1 according to embodiment 1, the ultrasonic cleaning unit 30 is provided with the cleaning liquid 51 to which ultrasonic waves are applied from a short distance around the inner peripheral side and the outer peripheral side of the base 25 to be cleaned, thereby improving the cleaning effect. Thus, the grinding apparatus 1 according to embodiment 1 has the following operational effects: the possibility of dirt on the base 25 falling into the holding table 10 or the grinding device 1 when the grinding wheel 22 is replaced can be suppressed, and the possibility of adhesion to the workpiece 100 after grinding can be suppressed.

In the grinding apparatus 1 according to embodiment 1, the bottom surface 33 is connected to the cleaning liquid discharge pipe 38 on the surface side facing the grinding surface 26-3, and inclined surfaces 33-1 and 33-2 inclined so that the portion connected to the cleaning liquid discharge pipe 38 is lowered are formed. Therefore, the grinding apparatus 1 of embodiment 1 has the following operational effects: these inclined surfaces 33-1 and 33-2 can appropriately guide the cleaning waste liquid 52 obtained by cleaning the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 to the cleaning liquid discharge pipe 38, and can appropriately discharge the cleaning waste liquid outside the ultrasonic cleaning unit 30 through the discharge portion 39.

In the grinding apparatus 1 according to embodiment 1, the ultrasonic transducer 36 is disposed in the water channel 34 formed in the side walls 31 and 32. Therefore, the grinding apparatus 1 of embodiment 1 has the following operational effects: the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 can be cleaned with the cleaning liquid 51 to which ultrasonic waves are applied by the ultrasonic vibrator 36 immediately before the spraying.

[ 2 nd embodiment ]

A grinding apparatus 1-2 according to embodiment 2 of the present invention will be described with reference to the drawings. Fig. 6 is an enlarged cross-sectional view of a main portion of the grinding apparatus 1-2 according to embodiment 2. In fig. 6, the same portions as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 6, the ultrasonic cleaning unit 30-2 of the grinding device 1-2 according to embodiment 2 is formed with not only the injection port 34-5 for injecting the cleaning liquid 51 toward the inner circumferential surface 25-1 and the outer circumferential surface 25-2 but also an additional injection port 34-5 for injecting the cleaning liquid 51 toward the inner circumferential surface 26-1 and the outer circumferential surface 26-2 in the 2 nd water passage 34-3 inside the side walls 31 and 32 as in the ultrasonic cleaning unit 30.

In embodiment 2, the cleaning liquid 51 supplied from the cleaning liquid supply unit 35 to the water channel 34 and given ultrasonic waves by the ultrasonic vibrator 36 is jetted toward the inner circumferential surface 26-1 of the grinding stone 26 passing through the outer circumferential side of the side wall 31 through the jet port 34-5 additionally formed in the outer wall surface 31-1 of the side wall 31, thereby cleaning the inner circumferential surface 26-1 of the grinding stone 26 passing through the outer circumferential side of the side wall 31. In embodiment 2, the jet port 34-5 additionally formed in the inner wall surface 32-1 of the side wall 32 jets the cleaning liquid 51 supplied from the cleaning liquid supply unit 35 to the water channel 34 and given the ultrasonic waves by the ultrasonic vibrator 36 toward the outer peripheral surface 26-2 of the grindstone 26 passing through the inner peripheral side of the side wall 32, thereby cleaning the outer peripheral surface 26-2 of the grindstone 26 passing through the inner peripheral side of the side wall 32.

The grinding apparatus 1-2 according to embodiment 2 having the above-described configuration has the same operational advantages as the grinding apparatus 1 according to embodiment 1. The grinding apparatus 1-2 according to embodiment 2 has an effect that, in grinding the workpiece 100 by the grinding unit 20, the inner peripheral surface 26-1 and the outer peripheral surface 26-2 of the grinding stone 26 can be cleaned by using the additionally formed injection port 34-5 in addition to cleaning the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 as in the grinding apparatus 1 according to embodiment 1. Thus, the grinding apparatus 1-2 of embodiment 2 has the following operational effects: the possibility of dirt on the inner peripheral surface 26-1 and the outer peripheral surface 26-2 of the grinding wheel 26 falling onto the holding table 10 or the grinding device 1 when the grinding wheel 22 is replaced can be suppressed, and the possibility of dirt adhering to the workpiece 100 after grinding can be suppressed.

[ 3 rd embodiment ]

A grinding apparatus 1 to 3 according to embodiment 3 of the present invention will be described with reference to the drawings. Fig. 7 is a sectional view of an enlarged main portion of the grinding apparatus 1-3 of embodiment 3. In fig. 7, the same components as those in embodiment 1 and embodiment 2 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 7, the ultrasonic cleaning unit 30-3 of the grinding apparatus 1-3 according to embodiment 3 includes not only the 2 nd water path 34-3 formed inside the side walls 31 and 32 as in the ultrasonic cleaning unit 30-2 but also the 2 nd water path 34-3 additionally formed inside the bottom surface 33, and the 2 nd water path 34-3 supplies the cleaning liquid 51 to the injection port 34-5 for injecting the cleaning liquid 51 toward the grinding surface 26-3 of the grinding stone 26. In embodiment 3, one end of the 2 nd water channel 34-3 additionally formed in the bottom surface 33 at a position on the inner peripheral side of the radially central portion is connected to the ultrasonic wave applying space 34-2 common to the 2 nd water channel 34-3 formed in the side wall 31, and a plurality of (3 in embodiment 3) ejection ports 34-5 opening on the inclined surface 33-1 of the bottom surface 33 are formed on the other end side. In embodiment 3, one end of the 2 nd water channel 34-3 additionally formed in the bottom surface 33 at a position on the outer circumferential side of the radially central portion is connected to the ultrasonic wave applying space 34-2 common to the 2 nd water channel 34-3 formed in the side wall 32, and a plurality of (3 in embodiment 3) ejection ports 34-5 opening on the inclined surface 33-2 of the bottom surface 33 are formed on the other end side.

In embodiment 3, the portion of the grinding stone 26 on the inner peripheral side of the radial central portion of the grinding surface 26-3 is cleaned by jetting the cleaning liquid 51 supplied from the cleaning liquid supply portion 35 to the water channel 34 and given the ultrasonic waves by the ultrasonic vibrator 36 toward the portion of the grinding stone 26 passing above the bottom surface 33 on the inner peripheral side of the radial central portion of the grinding surface 26-3, through the jet port 34-5 formed in the 2 nd water channel 34-3 additionally formed at the position on the inner peripheral side of the radial central portion of the bottom surface 33. In embodiment 3, the portion of the grinding stone 26 on the outer circumferential side of the radial center of the grinding surface 26-3 is cleaned by jetting the cleaning liquid 51 supplied from the cleaning liquid supply unit 35 to the water channel 34 and given the ultrasonic waves by the ultrasonic vibrator 36 toward the portion of the grinding stone 26 passing above the bottom surface 33 on the outer circumferential side of the radial center of the grinding surface 26-3, through the jet port 34-5 formed in the 2 nd water channel 34-3 additionally formed in the bottom surface 33 on the outer circumferential side of the radial center.

The grinding apparatus 1-3 according to embodiment 3 having the above-described configuration has the same operational advantages as the grinding apparatus 1 according to embodiment 1 and the grinding apparatus 1-2 according to embodiment 2. The grinding apparatus 1-3 according to embodiment 3 has an effect of cleaning the grinding surface 26-3 of the grinding whetstone 26 by using the additionally formed injection port 34-5 in addition to the cleaning of the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 similarly to the grinding apparatus 1 according to embodiment 1 and the cleaning of the inner peripheral surface 26-1 and the outer peripheral surface 26-2 of the grinding whetstone 26 similarly to the grinding apparatus 1-2 according to embodiment 2 in the grinding of the workpiece 100 by the grinding unit 20. Thus, the grinding apparatus 1-3 of embodiment 3 has the following operational effects: the possibility of dirt on the grinding surface 26-3 of the grinding wheel 26 falling onto the holding table 10 or into the grinding device 1 when the grinding wheel 22 is replaced can be suppressed, and the possibility of dirt adhering to the workpiece 100 after grinding can be suppressed.

[ modified example ]

A grinding apparatus 1 to 4 according to a modification of the present invention will be described with reference to the drawings. Fig. 8 is an enlarged cross-sectional view of a main portion of a grinding apparatus 1-4 according to a modification. Fig. 9 is a perspective view illustrating an ultrasonic cleaning unit 30-4 of the grinding apparatus 1-4 of fig. 8. Fig. 10 is a perspective view illustrating the water path 44 of the ultrasonic cleaning unit 30-4 of fig. 8. In fig. 8 to 10, the same components as those of embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 8, a grinding apparatus 1-4 according to a modification is configured such that an ultrasonic cleaning unit 30 having a water passage 34 is changed to an ultrasonic cleaning unit 30-4 having a water passage 44, as compared with the grinding apparatus 1 according to embodiment 1.

As shown in fig. 8, 9, and 10, the water path 44 of the ultrasonic cleaning unit 30-4 of the grinding apparatus 1-4 of the modification includes a 1 st water path 44-1 and a plurality of ultrasonic application spaces 44-4 to which the cleaning liquid 51 is supplied from the 1 st water path 44-1, and the ultrasonic application spaces 44-4 include the ultrasonic transducer 36 and the ejection port 44-5, respectively. The water passage 44 of the modification omits the 2 nd water passage 34-3 of the 1 st embodiment.

The 1 st water passage 44-1 of the modification is the same as the 1 st water passage 34-1 of the 1 st embodiment except that the number of branches to the other end side is increased. The ultrasonic wave applying space 44-4 of the modification is the same as the ultrasonic wave applying space 34-2 of the embodiment 1 except that the number of connections to the other end of the 1 st water path 44-1 is increased and the jet port 44-5 is formed not via the 2 nd water path 34-3. The ejection port 44-5 of the modification is the same as the ejection port 34-5 of the embodiment 1 except that it is formed in the ultrasonic wave applying space 44-4.

The grinding apparatus 1-4 of the modification having the above-described configuration has similar operational advantages to the grinding apparatus 1 of embodiment 1, because the water passage 34 of the ultrasonic cleaning unit 30 is changed to the water passage 44 in which the 2 nd water passage 34-3 is omitted, as compared with the grinding apparatus 1 of embodiment 1. The grinding apparatuses 1 to 4 of the modified examples also have the following effects: the ultrasonic wave application space 44-4 can eject the cleaning liquid 51 from the ejection port 44-5 by the vibration of the ultrasonic vibrator 36 in the ultrasonic wave application space 44-4, and can apply the ultrasonic wave to the cleaning liquid 51 immediately before the cleaning liquid 51 is ejected from the ejection port 44-5. Therefore, the grinding apparatus 1-4 of the modified example can more reliably spray the cleaning liquid 51 to which the ultrasonic waves are applied toward the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 of the grinding wheel 22, and thus further improves the cleaning effect of cleaning the inner peripheral surface 25-1 and the outer peripheral surface 25-2 of the base 25 of the grinding wheel 22. In the present invention, the same configuration as the water passage 44 of the modification can be applied to the water passages 34 of the grinding apparatus 1-2 according to embodiment 2 and the grinding apparatus 1-3 according to embodiment 3.

The present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the scope of the present invention. For example, the present invention also encompasses any mode in which the injection ports 34-5 and 44-5 are formed on at least one of the side walls 31 and 32 or the bottom surface 33 toward the inside of the letter "コ" formed by the side walls 31 and 32 and the bottom surface 33. The present invention also encompasses any mode in which the ultrasonic transducer 36 is disposed on at least one of the side walls 31, 32 or the bottom surface 33. That is, the present invention also includes any mode of cleaning by spraying the cleaning liquid 51 to the base 25 or the grinding stone 26 passing through the table outer path 29 by the spray ports 34-5 and 44-5 formed as described above.