阅读说明：本技术 异形面板及其制作方法 (Special-shaped panel and manufacturing method thereof ) 是由 何海龙 李荣荣 于 2021-10-13 设计创作，主要内容包括：本申请公开了一种异形面板及其制作方法,该异形面板的制作方法包括：提供玻璃基板；基于玻璃基板确定激光切割的影响区域；判断是否有走线位于影响区域；若是,则将走线进行分束处理,制作为多通道走线,以使每条走线在影响区域中有多条通道；若否,则不对走线进行更改。通过上述方法,降低玻璃基板的走线受激光烧蚀的风险。(The application discloses dysmorphism panel and manufacturing method thereof, and the manufacturing method of the dysmorphism panel comprises the following steps: providing a glass substrate; determining an area of influence of laser cutting based on the glass substrate; judging whether the routing is positioned in the affected area or not; if yes, performing beam splitting processing on the wires to manufacture multi-channel wires, so that each wire has a plurality of channels in the affected area; if not, the routing is not changed. By the method, the risk that the routing of the glass substrate is ablated by laser is reduced.)

1. The manufacturing method of the special-shaped panel is characterized by comprising the following steps:

providing a glass substrate;

determining an area of influence of laser cutting based on the glass substrate;

judging whether the routing is positioned in the influence area or not;

if yes, performing beam splitting processing on the routing to manufacture multi-channel routing, so that each routing has a plurality of channels in the affected area;

if not, the routing is not changed.

2. The method of claim 1, wherein the step of determining an area of influence of laser cutting based on the glass substrate comprises:

obtaining the thickness of the glass substrate, the refractive index of the glass substrate and the angle of the end face cut by the glass cutter wheel;

determining an area of influence of the laser cutting based on a law of ray refraction.

3. A method of making a profiled panel as claimed in claim 2 wherein the step of determining the area of influence of the laser cutting based on the law of refraction of light comprises:

based on the relational expressionObtaining the region of influence L1;

wherein β is a light refraction angle of the laser, ω is an end face angle of the glass cutter wheel, and T is a thickness of the glass substrate.

4. The method of claim 1, wherein the multi-channel trace comprises a plurality of parallel sub-traces, and both ends of the sub-traces are connected to the same trace.

5. The method as claimed in claim 1, wherein the multi-channel trace comprises a plurality of parallel sub-traces, each of the parallel sub-traces is connected to an adjacent sub-trace through a channel, and the channels connecting different sub-traces with the same sub-trace are located at different positions.

6. The method of claim 1, wherein the trace is at least one of a first metal layer, a second metal layer, or a transparent electrode layer.

7. A profiled panel whose panel edge is formed by the intersection of end points of straight segments and circular arc segments, the circular arc segments being formed by laser cutting, characterized in that the profiled panel further comprises:

the panel routing is arranged at least partially at intervals with the edge of the panel, and comprises multi-channel routing;

and the distance from the panel routing line to the panel edge is smaller than the influence area of the laser cutting.

8. The contoured panel of claim 7, wherein the panel trace is at least one of a first metal layer, a second metal layer, or a transparent electrode layer.

9. The contoured panel of claim 7,

the multi-channel wiring comprises a plurality of parallel sub-wirings, and two ends of the plurality of sub-wirings are connected to the same wiring.

10. The contoured panel of claim 7,

the multi-channel routing comprises a plurality of parallel sub-routing wires, each parallel sub-routing wire is connected with the adjacent sub-routing wire through a channel, and the channels, which are connected with different sub-routing wires by the same sub-routing wire, are located at different positions.

Technical Field

The invention relates to the field of display panels, in particular to a special-shaped panel and a manufacturing method thereof.

Background

As panel technology has matured, consumer demand for panels has increased. Curved profiles, rounded transitions, etc. products designed with panels are gradually coming into everyday life, such as, for example, displays with rounded top sides, vehicle screens with rounded contours, etc. Like the display with the rounded top side and the vehicle-mounted screen with the arc profile, the cutting requirements of the products cannot be met by adopting the conventional linear cutter wheel cutting, and generally, the mode of combining the cutter wheel cutting with the laser cutting is adopted.

In the actual production process, a certain proportion of light rays can be emitted into the panel from the glass end face through total reflection during laser cutting, and due to the fact that laser energy is extremely high, routing on the surface can be ablated to a certain extent in a primary reflection area in the panel, and the method is particularly obvious for narrow-frame products. If the peripheral wires are ablated and not disconnected, the process is existed, the defective products can not be directly intercepted, and the serious quality problem is easily caused when the defective products subsequently flow into customers and market terminals.

At present, the main solution is to control the path of laser cutting, and ensure that the distance from the edge of the panel is greater than the diameter of a light spot, so as to prevent light from entering the panel from the end face. For this reason, there are problems that the glass edge is not cut through, the glass to be cut off needs to be removed by means of a splinter, which causes stress concentration and microcracks in the splinter area, and the subsequent panel is also prone to cracking during transportation and testing, with the same quality risk.

Disclosure of Invention

The technical problem that this application mainly solved provides a dysmorphism panel and preparation method thereof to reduce the risk that the line receives laser ablation.

In order to solve the above problems, the present application provides a method for manufacturing a special-shaped panel, which includes: providing a glass substrate; determining an area of influence of laser cutting based on the glass substrate; judging whether the routing is positioned in the influence area or not; if yes, performing beam splitting processing on the routing to manufacture multi-channel routing, so that each routing has a plurality of channels in the affected area; if not, the routing is not changed.

Therefore, the influence area of laser cutting is determined firstly, whether the wiring is located in the influence area is judged, if yes, the wiring is subjected to beam splitting processing, and the multi-channel wiring is obtained, so that the problem that the wiring is disconnected due to the fact that the wiring is completely ablated by the influence area of the laser cutting when the laser cutting is used subsequently is avoided, and the risk of burning-out of the wiring is reduced; in addition, the method can judge which glass substrate routing needs redesign, which glass substrate routing does not need redesign, and product production efficiency can be increased.

Preferably, the step of determining the impact area of laser cutting based on the glass substrate includes: obtaining the thickness of the glass substrate, the refractive index of the glass substrate and the angle of the end face cut by the glass cutter wheel; determining an area of influence of the laser cutting based on a law of ray refraction.

Therefore, the position from the primary reflection point of the laser to the edge of the glass substrate is obtained through the calculation of the thickness and the refractive index of the glass substrate and the angle of the end face cut by the cutter wheel, namely the influence area of the laser cutting, and the calculation method is simple.

Preferably, the step of determining the laser-cut influence region based on the light refraction law includes: based on the relational expressionObtaining the region of influence L1; wherein β is a light refraction angle of the laser, ω is an end face angle of the glass cutter wheel, and T is a thickness of the glass substrate.

Therefore, the influence area of the laser cutting is only related to the thickness and the refractive index of the glass substrate and the angle of the laser cutting, and is not related to other human factors, so that the influence area of the laser cutting can be calculated more accurately.

Preferably, the multi-channel routing comprises a plurality of parallel sub-routing wires, and two ends of the plurality of sub-routing wires are connected to the same routing wire.

Therefore, the wires are dispersed through a plurality of parallel sub-wires connected at two ends, so that the ductility of corrosion in the wire direction is damaged, and the wire breaking performance is greatly reduced.

Preferably, the multi-channel wire includes a plurality of parallel sub-wires, each parallel sub-wire is connected to an adjacent sub-wire through a channel, and the channels connecting different sub-wires with the same sub-wire are located at different positions.

Therefore, the multi-channel wire is formed by the plurality of parallel sub-wires, and each parallel sub-wire is connected with the adjacent sub-wire through the channel, so that the meshed multi-channel sub-wire is formed, the wire is dispersed, and the wire breaking continuity is reduced.

Preferably, the trace is at least one of the first metal layer, the second metal layer or the transparent electrode layer.

Therefore, the first metal layer, the second metal layer and the transparent electrode layer are the wiring of different layers of the glass substrate, and any layer of wiring of the glass substrate can be modified according to requirements.

In order to solve the above problem, the present application further provides a profiled panel, the panel edge of which is formed by intersecting end points of a straight line segment and a circular arc segment, the circular arc segment is formed by laser cutting, and the profiled panel further includes: the panel routing is arranged at least partially at intervals with the edge of the panel, and comprises multi-channel routing; and the distance from the panel routing line to the panel edge is smaller than the influence area of the laser cutting.

Therefore, the design of the multi-channel routing can avoid laser ablation to the maximum extent.

Preferably, the trace is at least one of the first metal layer, the second metal layer or the transparent electrode layer.

Therefore, the first metal layer, the second metal layer and the transparent electrode layer are the wires of different layers of the glass substrate, any one layer of the wires of the glass substrate can be modified according to needs, and the first metal layer is preferably selected as the wires, wherein the first metal layer is the metal layer positioned at the bottommost layer of the glass substrate.

Preferably, the multi-channel routing comprises a plurality of parallel sub-routing wires, and two ends of the plurality of sub-routing wires are connected to the same routing wire.

Therefore, the panel routing comprises a plurality of parallel routing, and laser ablation can be avoided to the greatest extent.

Preferably, the multi-channel wire includes a plurality of parallel sub-wires, each parallel sub-wire is connected to an adjacent sub-wire through a channel, and the channels connecting different sub-wires with the same sub-wire are located at different positions.

Therefore, connecting wires can be arranged among the plurality of parallel wires, so that the connection among the wires is ensured to the maximum extent, and the connectivity of the wires is ensured.

The beneficial effect of this application is: the method comprises the steps of providing a glass substrate, determining an influence area of laser cutting based on the glass substrate, optimizing routing of the glass substrate according to the influence area, determining that the influence area of the laser cutting is larger than the distance from the routing to the edge of the glass substrate by obtaining the influence area of the laser cutting, and optimizing the routing of the glass substrate to enable the routing on the glass substrate not to be affected by laser reflection energy in the laser cutting process to cause the routing to be ablated by laser, so that the risk that the routing is disconnected due to the fact that electrochemical corrosion continues to occur in the subsequent testing or environment storage process is avoided.

Drawings

FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a profiled panel according to the present application;

FIG. 2 is a schematic diagram of a reflective path of a laser dicing apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic flow chart illustrating an embodiment of step S13 in FIG. 1;

FIG. 4 is a schematic structural diagram of an embodiment of a profiled panel of the present application;

fig. 5 is a schematic structural diagram of an embodiment of the multi-channel trace of the present application;

fig. 6 is a schematic structural diagram of another embodiment of a multi-channel trace according to the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a special-shaped panel, as shown in fig. 1, the method includes the following steps:

step S11: a glass substrate is provided.

The glass substrate is a flat-surfaced glass plate with a certain thickness, is also called a glass panel, and can be a TFT glass substrate.

A contoured panel is a panel of irregular shape cut to a specific shape using a laser. In the present embodiment, the shaped panel is formed by laser cutting on a glass substrate.

Step S12: an area of influence of the laser cutting is determined based on the glass substrate.

The region affected by laser cutting is a region formed by primary reflection of laser light in the glass substrate.

Specifically, please refer to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a reflection path for laser dicing according to the present application. As shown in fig. 2, the incident light of the laser beam 1 is incident on the glass substrate 2 having a thickness T along an arrow, the incident angle of the laser beam 1 incident on the surface of the glass substrate 2 is θ, the refraction angle of the light beam is β, the angle of the end face of the glass cutter wheel cut is ω, and the distance from the primary reflection point to the edge of the glass substrate is L1. The glass substrate 2 is further provided with a trace 3, and the distance from the edge of the trace 3 to the edge of the glass substrate 2 is L2. In the present embodiment, the affected area of laser cutting refers to the distance L1 from the primary reflection point to the edge of the glass substrate. The trace 3 may be disposed between the first reflection point and the edge of the glass substrate, or disposed on a side of the first reflection point away from the edge of the glass substrate, where the position of the trace 3 is not limited. If the wiring 3 is arranged between the primary reflection point and the edge of the glass substrate, the wiring 3 is subjected to beam splitting design, and if the wiring is arranged on one side of the primary reflection point far away from the edge of the glass substrate, the wiring 3 is not subjected to beam splitting design.

Specifically, please further refer to fig. 3, wherein fig. 3 is a schematic flowchart illustrating an embodiment of a method for calculating an affected area of laser cutting according to the present application. As shown in fig. 3, includes:

step S31: and obtaining the thickness of the glass substrate, the refractive index of the glass substrate and the angle of the end face cut by the glass cutter wheel.

The thickness of the glass substrate and the refractive index of the glass substrate are determined by the material of the glass substrate, and the thickness and the refractive index of the glass substrate can be obtained after the glass substrate is determined. The end face angle cut by the glass cutter wheel is the angle between the cutter wheel and the glass plane, and can be obtained when designing the special-shaped panel with which shape is obtained. In this embodiment, the thickness of the glass substrate, the refractive index of the glass substrate, and the angle of the end face cut by the glass cutter wheel can be measured.

Step S32: determining the influence area of the laser cutting based on the light refraction law.

In particular, the area of influence of the laser cutting can be determined on the basis of the law of refraction of light and the geometric relationship.

Obtaining the thickness of the glass substrate, the refractive index of the glass substrate and the end face angle of the glass cutter wheel cutting, and then obtaining the affected area of the laser cutting according to the following formula:

（1）

wherein beta is a laser ray refraction angle, omega is an end face angle cut by the glass cutter wheel, and T is the thickness of the glass substrate.

In the present embodiment, the light incident angle θ of the laser is the same as the end face angle ω of the glass cutter wheel cut, that is:

θ=ω（2）

the ratio of the sine value of the light incidence angle theta to the sine value of the light refraction angle omega is the refractive index n of the glass substrate, namely:

（3）

l1 in equation (1) can be obtained by substituting equation (2) and equation (3) into equation (1).

In the embodiment, the position from the primary reflection point of the laser to the edge of the glass substrate is obtained by calculating the thickness and the refractive index of the glass substrate and the angle of the end face cut by the cutter wheel, namely the influence area of the laser cutting.

Step S13: and judging whether the routing is positioned in the affected area.

If yes, go to step S14; if not, the process goes to step S15.

The trace is a trace on the glass substrate, and may be an inner layer of the glass substrate or a surface of the glass substrate, which is not limited herein. The wiring is a metal wire on the glass substrate and has the performances of electric conduction and signal transmission. The wiring of the glass substrate comprises a GND line and a COM line of the display panel.

In this embodiment, the trace is at least one of the first metal layer, the second metal layer, or the transparent electrode layer. In a preferred embodiment, the first metal layer is preferably selected for routing, that is, the first metal layer is subjected to beam splitting treatment.

In this embodiment, the routing of the glass substrate is optimally designed according to whether the distance from the routing of the outermost periphery of the glass substrate to the edge of the glass substrate is less than the influence area.

If the distance from the wires to the edge of the glass substrate is smaller than the influence area, optimizing the wires of the glass substrate according to the influence area, and performing beam splitting treatment on the wires to manufacture multi-channel wires; if not, the routing of the glass substrate does not need to be optimized.

In a specific embodiment, when the thickness T =0.5mm, the refractive index n =1.5 and the end face angle ω =75 ° of the cutting of the glass cutter wheel are obtained, the distance L1=0.325mm from the primary reflection point to the edge of the glass substrate can be calculated according to the formulas (1), (2) and (3). Further, when the distance L2=0.18mm from the peripheral GND line of the TFT glass substrate to the edge of the glass substrate is obtained, and the distance L2< L1 from the peripheral wire to the edge of the glass substrate, the wire in the affected area is optimally designed.

Step S14: and splitting the routing wires into multi-channel routing wires, so that each routing wire has a plurality of channels in the affected area.

Specifically, the routing of the glass substrate is subjected to beam splitting processing according to the affected area, so that a multi-channel routing is obtained. Wherein the multi-channel routing can reduce the risk that the routing is completely ablated and disconnected. In the embodiment, by adopting the multi-channel design, due to the certain isolation among the channels, the ductility of corrosion in the line width direction is damaged, so that the routing wires are kept independent, and the continuity of line breaking in the later period is greatly reduced. It should be noted that progressive means that the corrosion or ablation of the trace is increased until the trace is broken during the processing.

The splitting process includes splitting the closely adhered traces into multiple parallel traces with certain spacing.

In one embodiment, the multi-channel trace includes a plurality of parallel sub-traces, and both ends of the plurality of sub-traces are connected to the same trace.

In another embodiment, the multi-channel trace includes a plurality of parallel sub-traces, each of the parallel sub-traces is connected to an adjacent sub-trace through a channel, and different channels connected to the trace by the same sub-trace are located at different positions. Wherein, the channel can also be a routing line and is communicated with the channel through a metal wire.

In this embodiment, the design method of the multi-channel trace is not limited, the two trace design methods are only explained for the multi-channel trace, and any design method for forming the multi-channel trace belongs to the protection scope of the present application.

Step S15: no modification is made to the traces.

The method also comprises the following steps: and cutting the glass substrate by utilizing laser to form the special-shaped panel to be subjected to circular arc. In the embodiment, the special-shaped panel is manufactured by combining the cutter wheel cutting and the laser cutting. Specifically, linear segments are cut by a linear cutter wheel, and then circular arc segments are cut at the intersection angles of the two linear segments by laser, so that the circular arc segments are intersected with the linear segments, and the special-shaped panel with the circular arc outer contour is formed.

The beneficial effect of this application is: the method comprises the steps of providing a glass substrate, determining an influence area of laser cutting based on the glass substrate, optimizing routing of the glass substrate according to the influence area, determining that the influence area of the laser cutting is larger than the distance from the routing to the edge of the glass substrate by obtaining the influence area of the laser cutting, and optimizing the routing of the glass substrate to enable the routing on the glass substrate not to be affected by laser reflection energy in the laser cutting process to cause the routing to be ablated by laser, so that the risk that the routing is disconnected due to the fact that electrochemical corrosion continues to occur in the subsequent testing or environment storage process is avoided.

Please refer to fig. 4, and fig. 4 is a schematic structural diagram of an embodiment of a profiled panel according to the present application. As shown in fig. 4, the contoured panel 10 includes: the panel edge 11 is an outer contour formed by intersecting straight line segments and end points of circular arc segments 112, wherein the circular arc segments 112 are formed by laser cutting; panel trace 12, panel trace 12 being disposed away from panel edge 11.

In this embodiment, the shaped panel includes a glass substrate, and the panel trace 12 may be disposed in the glass substrate or disposed on a surface of the glass substrate, which is not limited herein.

Specifically, the irregular panel 10 includes a first metal layer, a second metal layer and a transparent electrode layer, and in this embodiment, the trace is at least one of the first metal layer, the second metal layer or the transparent electrode layer. In an embodiment, the first metal layer is preferably selected as the routing line, that is, the first metal layer is subjected to beam splitting processing.

In this embodiment, the straight line segment may be cut by a laser, or may be cut by a cutter wheel, which is not limited herein.

In this embodiment, the distance of the panel trace 12 from the panel edge 11 is smaller than the affected area of laser cutting. And optimally setting the routing of the area, in which the distance from the panel routing 12 to the panel edge 11 is less than the laser cutting influence area. Wherein, the affected area of the laser cutting is obtained by calculation based on the following formula:

（1）

wherein, L1 is the influence area, beta is the refraction angle of laser, omega is the end face angle of the cutting of the glass cutter wheel, and T is the thickness of the glass substrate.

In a preferred embodiment, the panel trace 12 includes a plurality of parallel traces, please refer to fig. 5, and fig. 5 is a schematic structural diagram of an embodiment of the multi-channel trace of the present application, as shown in fig. 5, the panel trace 12 is shown as a shaded portion in fig. 5, and two ends of adjacent traces are connected, so that even if a portion of the panel trace 12 is ablated by laser, most of the panel trace 12 is not affected by the ablation. In this embodiment, the trace is divided into a plurality of parallel sub-traces to destroy the ductility of corrosion in the trace direction, so that the continuity of the trace breaking is greatly reduced.

In another preferred embodiment, the panel trace 12 includes a plurality of parallel traces, and a communication channel is disposed between adjacent traces, specifically referring to fig. 6, fig. 6 is a schematic structural diagram of another embodiment of the multi-channel trace of the present application. As shown in fig. 6, the panel trace 12 also includes a plurality of parallel sub-traces (shown by a shaded portion in fig. 6), each of the parallel sub-traces is connected to an adjacent sub-trace through a channel, and the channels connecting different sub-traces by the same sub-trace are located at different positions, where the channel and the sub-trace may be made of the same material, such as a metal wire, and the parallel sub-traces and the channels form a mesh multi-channel trace together. In this embodiment, the plurality of parallel traces are more and thinner, so that the traces can be better dispersed, which is not limited herein.

The beneficial effect of this embodiment is: the panel wiring is far away from the edge of the panel, and the panel wiring is divided into a plurality of wiring beams, so that most of panel wiring is not affected by laser ablation, and the risk of complete ablation disconnection of the wiring is reduced.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.