阅读说明：本技术 一种半导体设备零部件超洁净包装方法 (Ultra-clean packaging method for semiconductor equipment parts ) 是由 黎纠 于 2021-07-29 设计创作，主要内容包括：本发明公开了一种半导体设备零部件超洁净包装方法,包括所述半导体零部件包括超高真空使用条件下的半导体零部件；还包括,中、低真空使用条件下的半导体零部件；中、低真空使用条件下的不锈钢或塑料材料制成的半导体零部件；铜材料制成的半导体零部件；镍材料制成的半导体零部件；具有喷砂面且不可使用无尘布包覆的半导体零部件；具有易碎或易损伤的关键面的半导体零部件；具有电子元件的半导体零部件；具有具有O-Ring或Connector密封面的半导体零部件；本发明提出的半导体零部件超洁净包装方法能够对半导体零部件进行高效的洁净包装,避免灰尘或静电的影响,能够保证半导体零部件在后续的加工使用正常。(The invention discloses an ultra-clean packaging method for semiconductor equipment parts, which comprises the steps that the semiconductor parts comprise semiconductor parts under the condition of ultra-high vacuum use; also comprises semiconductor parts under the conditions of medium and low vacuum; semiconductor parts made of stainless steel or plastic materials under the conditions of medium and low vacuum use; semiconductor parts made of copper materials; a semiconductor component made of a nickel material; a semiconductor component having a sand blasting surface and being not coated with dust-free cloth; semiconductor components having critical surfaces that are fragile or vulnerable; a semiconductor component having an electronic element; a semiconductor component having an O-Ring or Connector sealing surface; the ultra-clean packaging method for the semiconductor parts can be used for efficiently and cleanly packaging the semiconductor parts, avoids the influence of dust or static electricity, and can ensure that the semiconductor parts are normally used in subsequent processing.)

1. An ultra-clean packaging method for semiconductor equipment parts is characterized in that the semiconductor parts comprise semiconductor parts under ultra-high vacuum use conditions; also comprises the following steps of (1) preparing,

semiconductor parts under medium and low vacuum use conditions;

semiconductor parts made of stainless steel or plastic materials under the conditions of medium and low vacuum use;

semiconductor parts made of copper materials;

a semiconductor component made of a nickel material;

a semiconductor component having a sand blasting surface and being not coated with dust-free cloth;

semiconductor components having critical surfaces that are fragile or vulnerable;

a semiconductor component having an electronic element;

a semiconductor component having an O-Ring or Connector sealing surface;

wherein the content of the first and second substances,

the packaging method of the semiconductor parts under the ultrahigh vacuum use condition comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

2. The ultra-clean packaging method for semiconductor equipment parts according to claim 1, wherein the semiconductor parts under the medium and low vacuum conditions of use comprise semiconductor parts made of stainless steel or aluminum alloy materials;

the packaging method of the semiconductor parts made of the stainless steel material comprises the following steps:

firstly, filling nitrogen into a first layer of PE bag before coating, then performing vacuum coating,

in the second step, the STOP label is attached,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

sixthly, sealing the opening by using an adhesive tape;

the packaging method of the semiconductor part made of the aluminum alloy material comprises the following steps:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

3. The ultra-clean packaging method for semiconductor equipment parts according to claim 1, wherein the packaging method for semiconductor parts made of plastic material under the conditions of medium and low vacuum is as follows:

firstly, filling nitrogen into the bag before using the first layer of PE bag for coating, then carrying out vacuum coating, secondly, pasting the STOP label,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

and sixthly, sealing the opening by using an adhesive tape.

4. The ultra-clean packaging method for the semiconductor equipment parts according to claim 1, wherein the packaging method for the semiconductor parts made of the copper material comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

5. The ultra-clean packaging method for semiconductor equipment parts according to claim 1, wherein the packaging method for the semiconductor parts made of nickel material comprises:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

seventh step，Sealing with adhesive tape.

6. The ultra-clean packaging method for semiconductor equipment parts according to claim 1, wherein the packaging method for semiconductor parts which have sand blasting surfaces and cannot be coated with dust-free cloth comprises the following steps:

in the first step, a nylon membrane is used for coating,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

7. The ultra-clean packaging method for semiconductor device parts according to claim 1, wherein the packaging method for semiconductor device parts with fragile or damageable critical surfaces comprises:

firstly, using dust-free cloth to coat,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

thirdly, using a liner to carry out buffer coating on the periphery,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

8. The ultra-clean packaging method for semiconductor equipment parts according to claim 1, wherein the packaging method for semiconductor parts with electronic components comprises:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

eighthly, sealing the opening by using an adhesive tape;

wherein the content of the first and second substances,

the first layer of PE bag has antistatic property.

9. The ultra-clean packaging method for the semiconductor equipment parts according to claim 1, wherein the packaging method for the semiconductor equipment parts with the O-Ring or Connector sealing surfaces comprises the following steps:

firstly, using dust-free cloth to coat,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

10. The ultra-clean packaging method for semiconductor equipment parts according to any one of claims 1 to 9, wherein the PE bag has a thickness of 1.5mm or 1.0, wherein the PE bag having a thickness of 1.5mm is used for semiconductor parts having a weight of 5Kg or more, and the PE bag having a thickness of 1.0mm is used for semiconductor parts having a weight of 5Kg or less;

the thickness of the PE bag with the antistatic property is more than or equal to 0.762 mm.

Technical Field

The invention belongs to the technical field of semiconductors, and particularly relates to an ultra-clean packaging method for semiconductor equipment parts.

Background

A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications. The semiconductor material can be used for manufacturing large-scale integrated circuits, power devices, photoelectric devices, pressure sensors, thermoelectric refrigeration and other purposes; the micro-electronic micro-machining technology can be used for manufacturing MEMS (micro-electromechanical system) and is applied to the fields of electronics and medical treatment.

With the rapid development of the semiconductor industry, higher requirements are also put forward on the packaging method of semiconductor equipment parts, the cleanliness of the package directly affects the performance of the subsequent semiconductor parts, and the existing known clean packaging method of semiconductor equipment parts is not mature and complete, so research and development are needed.

Disclosure of Invention

The invention aims to provide an ultra-clean packaging method for semiconductor equipment parts, which solves the problems mentioned in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: an ultra-clean packaging method for semiconductor equipment parts, wherein the semiconductor parts comprise semiconductor parts under ultra-high vacuum use conditions; also comprises the following steps of (1) preparing,

semiconductor parts under medium and low vacuum use conditions;

semiconductor parts made of stainless steel or plastic materials under the conditions of medium and low vacuum use;

semiconductor parts made of copper materials;

a semiconductor component made of a nickel material;

a semiconductor component having a sand blasting surface and being not coated with dust-free cloth;

semiconductor components having critical surfaces that are fragile or vulnerable;

a semiconductor component having an electronic element;

a semiconductor component having an O-Ring or Connector sealing surface;

wherein the content of the first and second substances,

the packaging method of the semiconductor parts under the ultrahigh vacuum use condition comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the semiconductor parts under the medium and low vacuum use conditions comprise semiconductor parts made of stainless steel or aluminum alloy materials;

the packaging method of the semiconductor parts made of the stainless steel material comprises the following steps:

firstly, filling nitrogen into a first layer of PE bag before coating, then performing vacuum coating,

in the second step, the STOP label is attached,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

sixthly, sealing the opening by using an adhesive tape;

the packaging method of the semiconductor part made of the aluminum alloy material comprises the following steps:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor parts made of the plastic materials under the medium and low vacuum use conditions comprises the following steps:

firstly, filling nitrogen into a first layer of PE bag before coating, then performing vacuum coating,

in the second step, the STOP label is attached,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

and sixthly, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor parts made of the copper material comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor component made of the nickel material comprises the following steps:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the method for packaging the semiconductor component which has the sandblasted surface and cannot be coated by the dust-free cloth comprises the following steps:

in the first step, a nylon membrane is used for coating,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the method for packaging the semiconductor component with fragile or damageable critical surfaces comprises the following steps:

firstly, using dust-free cloth to coat,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

thirdly, using a liner to carry out buffering coating on the periphery; ,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the method for packaging a semiconductor component having an electronic element comprises:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

eighthly, sealing the opening by using an adhesive tape;

wherein the content of the first and second substances,

the first layer of PE bag has antistatic property.

Preferably, the method for packaging the semiconductor component with the O-Ring or Connector sealing surface comprises the following steps:

firstly, using dust-free cloth to coat,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the PE bag has a thickness of 1.5mm or 1.0, wherein the PE bag with a thickness of 1.5mm is used for semiconductor parts with a weight of more than 5Kg, and the PE bag with a thickness of 1.0mm is used for semiconductor parts with a weight of less than 5 Kg;

the thickness of the PE bag with the antistatic property is more than or equal to 0.762 mm.

Compared with the prior art, the invention has the beneficial effects that: the ultra-clean packaging method for the semiconductor parts can be used for efficiently and cleanly packaging the semiconductor parts, avoids the influence of dust or static electricity, and can ensure that the semiconductor parts are normally used in subsequent processing.

Drawings

FIG. 1 illustrates a method for packaging semiconductor components under ultra-high vacuum conditions of use;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1, the present invention provides an ultra-clean packaging method for semiconductor device parts, comprising: an ultra-clean packaging method for semiconductor equipment parts, wherein the semiconductor parts comprise semiconductor parts under ultra-high vacuum use conditions; also comprises the following steps of (1) preparing,

semiconductor parts under medium and low vacuum use conditions;

semiconductor parts made of stainless steel or plastic materials under the conditions of medium and low vacuum use;

semiconductor parts made of copper materials;

a semiconductor component made of a nickel material;

a semiconductor component having a sand blasting surface and being not coated with dust-free cloth;

semiconductor components having critical surfaces that are fragile or vulnerable;

a semiconductor component having an electronic element;

a semiconductor component having an O-Ring or Connector sealing surface;

wherein the content of the first and second substances,

the packaging method of the semiconductor parts under the ultrahigh vacuum use condition comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the semiconductor parts under the medium and low vacuum use conditions comprise semiconductor parts made of stainless steel or aluminum alloy materials;

the packaging method of the semiconductor parts made of the stainless steel material comprises the following steps:

firstly, filling nitrogen into a first layer of PE bag before coating, then performing vacuum coating,

in the second step, the STOP label is attached,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

sixthly, sealing the opening by using an adhesive tape;

the packaging method of the semiconductor part made of the aluminum alloy material comprises the following steps:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor parts made of the plastic materials under the medium and low vacuum use conditions comprises the following steps:

firstly, filling nitrogen into a first layer of PE bag before coating, then performing vacuum coating,

in the second step, the STOP label is attached,

and the third step, sticking a PP label,

fourthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

fifthly, using a bubble bag to cover,

and sixthly, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor parts made of the copper material comprises the following steps:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the packaging method of the semiconductor component made of the nickel material comprises the following steps:

firstly, using dust-free paper to cover,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the method for packaging the semiconductor component which has the sandblasted surface and cannot be coated by the dust-free cloth comprises the following steps:

in the first step, a nylon membrane is used for coating,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

and the third step, the STOP label is pasted,

fourthly, pasting a PP label,

fifthly, vacuum coating is carried out by using a second layer of PE bag, and then a yellow label is pasted,

sixthly, using a bubble bag for coating,

and step seven, sealing the opening by using an adhesive tape.

Preferably, the method for packaging the semiconductor component with fragile or damageable critical surfaces comprises the following steps:

firstly, using dust-free cloth to coat,

secondly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

thirdly, using a liner to carry out buffering coating on the periphery; ,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the method for packaging a semiconductor component having an electronic element comprises:

firstly, using dust-free paper to cover,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

eighthly, sealing the opening by using an adhesive tape;

wherein the content of the first and second substances,

the first layer of PE bag has antistatic property.

Preferably, the method for packaging the semiconductor component with the O-Ring or Connector sealing surface comprises the following steps:

firstly, using dust-free cloth to coat,

in the second step, aluminum foil is used for coating,

thirdly, filling nitrogen into the first layer of PE bag before coating, then performing vacuum coating,

the fourth step, the STOP label is pasted,

fifthly, sticking a PP label,

sixthly, using a second layer of PE bag to carry out vacuum coating, then pasting a yellow label,

the seventh step, using the bubble bag to cover,

and step eight, sealing the opening by using an adhesive tape.

Preferably, the PE bag has a thickness of 1.5mm or 1.0, wherein the PE bag with a thickness of 1.5mm is used for semiconductor parts with a weight of more than 5Kg, and the PE bag with a thickness of 1.0mm is used for semiconductor parts with a weight of less than 5 Kg;

the thickness of the PE bag with the antistatic property is more than or equal to 0.762 mm.

Circuits, electronic components and modules are all prior art and can be realized by those skilled in the art.

Needless to say, the present invention does not relate to improvements in software and methods. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.