阅读说明：本技术 一种低通结构、滤波器及通信设备 (Low-pass structure, filter and communication equipment ) 是由 陈启泰 温世议 于 2020-05-11 设计创作，主要内容包括：本申请公开了一种低通结构、滤波器及通信设备,该低通结构至少包括：低通内导体,套设于低通内导体的热缩套管,热缩套管装配于滤波器的腔体内。其中,热缩套管至少包括：环状部和缓冲部,缓冲部相对于环状部凸起设置,环状部与低通内导体接触,缓冲部与滤波器的腔体接触,缓冲部用于在热缩套管装配时获取装配缓冲空间。因此,本申请提供的低通结构能够通过热缩套管的缓冲部来获取热缩套管与腔体之间的装配缓冲空间,提高低通结构装配的牢固性。(The application discloses low pass structure, wave filter and communication equipment, this low pass structure includes at least: the low-pass inner conductor is sleeved with the heat-shrinkable sleeve of the low-pass inner conductor, and the heat-shrinkable sleeve is assembled in the cavity of the filter. Wherein, the heat shrinkable sleeve includes at least: annular portion and buffer portion, buffer portion are for the protruding setting of annular portion, annular portion and low pass inner conductor contact, and buffer portion contacts with the cavity of wave filter, and buffer portion is used for obtaining the assembly buffering space when heat shrinkage bush assembles. Therefore, the low pass structure that this application provided can obtain the assembly buffering space between heat shrinkage bush and the cavity through heat shrinkage bush's buffer, improves the fastness of low pass structure assembly.)

1. A low-pass structure, characterized in that it comprises:

the low-pass inner conductor and the heat-shrinkable sleeve are sleeved on the low-pass inner conductor, and the heat-shrinkable sleeve is assembled in a cavity of the filter;

the heat-shrinkable sleeve at least comprises an annular part and a buffer part, wherein the buffer part is arranged in a protruding mode relative to the annular part, and the buffer part is used for obtaining an assembling buffer space when the heat-shrinkable sleeve is assembled.

2. A low-pass structure according to claim 1,

the cross-sectional shape of the annular part is a circular ring, and the buffer part is arranged on the outer surface of the circular ring.

3. A low-pass structure according to claim 2,

the buffer parts are sequentially arranged along the extending direction of the circular ring.

4. A low-pass structure according to claim 2,

the cross-sectional shape of the buffer part is conical.

5. A low-pass structure according to claim 2,

the cross-sectional shape of the buffer part comprises a trapezoid and a fan-shaped part positioned at the upper bottom of the trapezoid.

6. A low-pass structure according to claim 1,

the buffer part is arranged between two adjacent annular parts, and the thickness of the buffer part is equal to that of the annular parts.

7. A low-pass structure according to claim 6,

the cross-sectional shape of buffer portion is circular-arc, and the external diameter of buffer portion is less than the external diameter of annular portion.

8. A low-pass structure according to claim 5,

the annular part is sunken towards the inner cavity of the heat-shrinkable sleeve.

9. A filter, characterized in that it comprises a low-pass structure according to any of claims 1-8.

10. A communication device, characterized in that it comprises a low-pass structure according to any of claims 1-8.

Technical Field

The present application relates to the field of communications technologies, and in particular, to a low-pass structure, a filter, and a communication device.

Background

At present, the filter is used as a communication device for frequency selection and signal suppression, and plays an important role in the field of communication radio frequency. The filter often includes a low-pass inner conductor, and a heat-shrinkable sleeve is generally sleeved outside the low-pass inner conductor, so as to form a low-pass structure. When the low-pass inner conductor is assembled, the sleeve is assembled in the cavity of the filter, so that the low-pass structure is fixed.

Wherein, the heat shrinkable sleeve is made of heat shrinkable material, which is also called macromolecule shape memory material. The heat-shrinkable tube made of the material has a memory effect, namely, the heat-shrinkable tube is heated to a high elastic state and is expanded by applying a load during production, the heat-shrinkable tube is rapidly cooled under the condition of keeping the expansion, and the heat-shrinkable tube enters a glass state and keeps the expanded state after being cooled; the sleeve returns to the high elastic state upon heating during use, but then retracts without a load. Current heat shrink tubing heat shrink ratios are typically in the range of 20% to 50%.

Therefore, due to the memory effect of the heat-shrinkable sleeve, the interference magnitude between the low-pass structure and the cavity is large during assembly, the looseness of the heat-shrinkable sleeve is easily caused, and the assembly firmness of the low-pass structure is reduced.

Disclosure of Invention

In order to solve the above problems of the heat shrinkable tubing in the prior art, the present application provides a low pass structure, a filter and a communication device.

In order to solve the above problem, an embodiment of the present application provides a low pass structure, where the low pass structure includes a low pass inner conductor, and a heat shrink sleeve sleeved on the low pass inner conductor, and the heat shrink sleeve is assembled in a cavity of the filter. Wherein, the heat shrinkable sleeve includes at least: annular portion and buffer portion, buffer portion are for the protruding setting of annular portion, annular portion and low pass inner conductor contact, and buffer portion contacts with the cavity of wave filter, and buffer portion is used for obtaining the assembly buffering space when heat shrinkage bush assembles.

Further, the cross-sectional shape of the annular portion is a circular ring, and the buffer portion is provided on an outer surface of the circular ring.

Further, the buffer portions are sequentially provided along the extending direction of the annular portion.

Further, the cross-sectional shape of the buffer portion is conical.

Further, the cross-sectional shape of the buffer part includes a trapezoid and a sector located at the upper bottom of the trapezoid.

Further, the buffer part is arranged between two adjacent annular parts, and the thickness of the buffer part is equal to that of the annular parts.

Further, the cross-sectional shape of the buffer portion is circular arc, and the outer diameter of the buffer portion is smaller than the outer diameter of the annular portion.

Further, the annular part is arranged towards the inner cavity of the heat-shrinkable sleeve in a concave mode.

Furthermore, the material of the heat-shrinkable sleeve is a polymer shape memory material.

In order to solve the above problem, embodiments of the present application further provide a filter, where the filter includes any one of the low-pass structures described above.

In order to solve the above problem, an embodiment of the present application further provides a communication device including any one of the low-pass structures described above.

Compared with the prior art, the low-pass structure of the application at least comprises: the low-pass inner conductor and a heat-shrinkable sleeve sleeved on the low-pass inner conductor are assembled in the cavity of the filter. The heat-shrinkable sleeve at least comprises an annular part and a buffer part, wherein the buffer part is arranged in a protruding mode relative to the annular part, the annular part is in contact with the low-pass inner conductor, the buffer part is in contact with a cavity of the filter, and the buffer part is used for obtaining an assembling buffer space during assembly of the heat-shrinkable sleeve. Therefore, the low pass structure that this application provided can obtain the buffering space of assembly between heat shrinkage bush and the cavity through heat shrinkage bush's buffer, improves the fastness of low pass structure assembly.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a prior art low-pass structure;

FIG. 2 is a schematic cross-sectional view of a first embodiment of the low-pass structure of the present application;

FIG. 3 is a schematic diagram of the structure of the low pass inner conductor of the low pass structure of the present application;

FIG. 4 is a schematic diagram of the overall structure of the low-pass structure of the present application;

FIG. 5 is a cross-sectional schematic view of the heat shrink sleeve of the first embodiment of the low pass inner conductor of the present application;

FIG. 6 is a cross-sectional schematic view of a buffer of the heat shrink sleeve of the first embodiment of the low pass inner conductor of the present application;

FIG. 7 is a schematic cross-sectional view of a second embodiment of the low pass structure of the present application;

FIG. 8 is a cross-sectional schematic view of a heat shrink sleeve of a second embodiment of the low pass structure of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Referring to fig. 1, fig. 1 is a cross-sectional view of a low-pass structure 10 in the prior art.

As shown in fig. 1, a low pass structure 10 in the prior art includes a low pass inner conductor 11 and a heat shrink 12, the heat shrink 12 is sleeved on the low pass inner conductor 11, and the heat shrink 12 is assembled in a cavity 13. As can be seen, the prior art heat shrink 12 comprises a wall of a casing having a uniform wall thickness. When the heat shrinkable sleeve 12 is assembled, the heat shrinkable sleeve 12 may be retracted, which may cause the heat shrinkable sleeve 12 to be crushed, or may cause the low-pass inner conductor 11 to be assembled unstably due to an excessively large gap with the cavity 13 outside the sleeve.

The present application provides a low-pass structure 20, which low-pass structure 20 can be firmly fitted in the cavity of a filter.

Referring to fig. 2, fig. 2 is a schematic cross-sectional view of a first embodiment of a low-pass structure 20 according to the present application.

The low pass structure 20 of the present embodiment includes a low pass inner conductor 21 and a heat shrink sleeve 22 sleeved on the low pass inner conductor 21, wherein the heat shrink sleeve 22 is assembled in a cavity 23 of the filter to realize the assembly of the low pass structure 20. Referring to fig. 3, fig. 3 is a schematic structural diagram of the low-pass inner conductor 21 of the low-pass structure 20 of the present application.

As shown in fig. 3, in the present embodiment, the low-pass inner conductor 21 includes a metal main rod 211 and a metal disc 212, wherein the metal disc 212 is disposed on the metal main rod 211. The low-pass inner conductor 21 may further include a tie bar 213, which may be disposed at least one end of the low-pass inner conductor 21. In this embodiment, the connection bars 213 are disposed at both ends of the low-pass inner conductor 21. It is understood that the metal main rod 211 may also be referred to as a high impedance segment of the low pass inner conductor 21, and the metal main rod 211 may also be referred to as a low impedance segment of the low pass inner conductor 21.

Referring further to fig. 4, fig. 4 is a schematic diagram of the overall structure of the low-pass structure 20 of the present application.

As shown in fig. 4, the low pass structure 20 includes a low pass inner conductor 21 and a heat shrink sleeve 22 sleeved outside the low pass inner conductor 21. That is, the heat shrink 22 is sleeved on the metal plate 212 of the low-pass inner conductor 21 to realize the assembly of the low-pass inner conductor 21 and the heat shrink 22.

Referring to fig. 5, fig. 5 is a cross-sectional view of a heat shrinkable sleeve 22 of a first embodiment of the low-pass inner conductor 21 of the present application.

Wherein, heat-shrinkable sleeve 22 specifically includes: a ring portion 221 and a buffer portion 222. In this embodiment, the buffer portion 222 is disposed to protrude from the annular portion 221. Buffer 222 is used to obtain an assembly buffer space with cavity 23 when heat shrink sleeve 22 is assembled with cavity 23.

Specifically, the heat-shrinkable sleeve 22 is sleeved outside the low-pass inner conductor 21 and is assembled in the cavity 23 of the filter, that is, the annular portion 221 of the heat-shrinkable sleeve 22 contacts the metal plate 212 of the low-pass inner conductor 21, and the buffer portion 222 contacts the cavity to fix the heat-shrinkable sleeve 22 in the cavity 23. Since the buffer portion 222 is protruded relative to the annular portion 221, a certain movable space, i.e. a buffer space, exists between the annular portion 221 of the heat shrinkable sleeve 22 and the cavity 23 through the buffer portion 222.

Therefore, the low pass structure 20 provided by the present application can obtain the buffering space for assembling through the buffering portion 222 of the heat shrinkable sleeve 22, and even if the heat shrinkable sleeve 22 retracts during assembling, the assembling firmness of the heat shrinkable sleeve 22 can be ensured due to the existence of the buffering portion 222.

Specifically, the cross-sectional shape of the annular portion 221 of the heat shrinkable sleeve 22 of the present embodiment may be a circular ring, and the buffer portion 222 is provided on the outer surface of the annular portion 221. Preferably, the buffer portion 222 of the present embodiment is integrally formed with the ring portion 221 to reduce the manufacturing process and improve the fastening of the buffer portion 222.

Among them, the buffer portions 222 are sequentially arranged along the extending direction of the annular portion 221, that is, in the present embodiment, the buffer portions 222 are sequentially arranged along the extending direction of the central axis of the annular portion 221. More specifically, the extending direction of heat shrink 22 includes a plurality of cross sections having buffer portions 222 arranged in series, each cross section including at least three buffer portions 222.

The cross-sectional shape of the buffer portion 222 is conical. That is, the buffer portion 222 is a cone provided on the outer surface of the annular portion 221. That is, the buffer 222 is a rib provided on the outer surface of the heat shrinkable sleeve 22

In one embodiment, as shown in fig. 6, the cross section of the buffer portion 222 includes a trapezoid 31 and a fan 32 disposed at the upper bottom of the trapezoid 31. Specifically, the trapezoid 31 is an isosceles trapezoid, and the sector 32 is a semicircle. That is, the buffer portion 222 is integrally formed of a truncated cone provided on the outer surface of the annular portion 221 and a hemisphere provided on the upper surface of the truncated cone, and the bottom surface of the hemisphere overlaps the upper surface of the truncated cone.

The heat-shrinkable sleeve 22 abuts against the cavity 23 through the buffer portion 222 and deforms, and the annular portion 221 of the heat-shrinkable sleeve 22 does not contact the cavity 23, so that a certain buffer space is reserved between the annular portion 221 of the heat-shrinkable sleeve 22 and the cavity 23. Therefore, when the low pass structure 20 is assembled, even if the heat shrinkage bush 22 retracts, the heat shrinkage bush 22 can still tightly abut against the cavity 23 of the filter through the buffer portion 222 of the heat shrinkage bush 22, and the problem that the low pass structure 20 is assembled insecurely due to insecure contact between the heat shrinkage bush 22 and the cavity 23 is solved.

The embodiment at least has the following beneficial effects: the low pass structure 20 provided by this embodiment includes a low pass inner conductor 21 and a heat shrinkage bush 22 sleeved on the low pass inner conductor 21, wherein the heat shrinkage bush 22 is abutted against the inner wall of the cavity 23 through a buffer portion 222 and is deformed, so that a certain retraction buffer space is left between the annular portion 221 of the heat shrinkage bush 22 and the cavity 23. Therefore, even if the heat shrinkable sleeve 22 retracts during assembly, the buffer portion 222 can still tightly abut against the cavity 23, thereby avoiding the problem of loose assembly caused by retraction of the heat shrinkable sleeve 22.

Referring to fig. 7, fig. 7 is a schematic cross-sectional view of a second embodiment of a low-pass structure 20 according to the present application.

As shown in fig. 7, the low pass structure 20 includes a low pass inner conductor 21, a heat shrink sleeve 22 sleeved on the low pass inner conductor 21, and the heat shrink sleeve 22 is assembled in a cavity 23 of the filter to realize the assembly of the low pass structure 20.

Referring to fig. 8, fig. 8 is a cross-sectional view of a heat shrink sleeve 22 of a low-pass structure 20 according to a second embodiment of the present application.

Specifically, as shown in fig. 8, the buffer portion 222 of the heat shrinkable sleeve 22 of the low-pass structure 20 provided in the present embodiment is disposed between two adjacent annular portions 221, and the thickness of the buffer portion 222 is equal to that of the annular portion 221, so that the manufacturing is facilitated. The buffer portion 222 and the ring portion 221 are integrally formed to reduce the process and ensure the firmness of the heat shrinkable sleeve 20.

The cross-sectional shape of the buffer 222 is circular arc, and the outer diameter 223 and the inner diameter 224 of the buffer 222 are circular arc.

The centers of the outer diameter 223 and the inner diameter 224 of the buffer portion 222 are both located in the inner cavity of the heat shrinkable sleeve 22, so that the buffer portion 222 protrudes outward.

Wherein the annular portion 221 is recessed toward the inner cavity of the heat shrink sleeve 22. Specifically, the annular portion 221 is arc-shaped, the outer diameter 225 and the inner diameter 226 of the annular portion 221 are both arc-shaped, and the center of the outer diameter 225 and the inner diameter 226 of the annular portion 221 is located outside the inner cavity of the heat-shrinkable sleeve 22, so that the annular portion 221 is recessed toward the inner cavity of the heat-shrinkable sleeve 22.

The length of the inner diameter 224 of the buffer part 222 is smaller than the length of the outer diameter 223, the length of the inner diameter 226 of the ring part 221 is larger than the length of the outer diameter 225 of the ring part 221, so that the outer diameter 225 of the ring part 221 and the outer diameter 223 of the buffer part 222 are smoothly connected, and the inner diameter 226 of the ring part 221 and the inner diameter 224 of the buffer part 222 are smoothly connected.

The curvature of the buffer portion 222 is greater than that of the annular portion 221, that is, the arc radius of the buffer portion 222 is smaller than that of the annular portion 221.

Therefore, the buffer portion 222 is provided to be convex with respect to the annular portion 221, and the buffer portion 222 can obtain a fitting buffer space with the cavity 23.

Wherein the length of the outer diameter 223 of the buffer portion 222 is smaller than the length of the outer diameter 225 of the ring portion 221, the length of the inner diameter 224 of the buffer portion 222 is smaller than the length of the inner diameter 226 of the ring portion 221, and the curvature of the buffer portion 222 is larger than that of the ring portion 221, so as to obtain a better buffer effect by the buffer portion 222.

When the heat-shrinkable sleeve 22 is sleeved on the low-pass inner conductor 21 and assembled in the cavity 23, the annular portion 221 of the heat-shrinkable sleeve 22 abuts against the low-pass inner conductor 21 and deforms, and a certain gap is left between the annular portion and the cavity 23; the buffer 222 of the heat shrink sleeve 22 collides with the cavity 23 and deforms, and a certain gap is left between the buffer and the low-pass inner conductor 21.

Therefore, when the low pass structure 20 is assembled, the buffer portion 222 of the heat shrink sleeve 22 is in contact with and deformed in the cavity 23, and the annular portion 221 is in contact with and deformed in the low pass inner conductor 21, so that the heat shrink sleeve 22 can still be firmly assembled in the cavity 23 by releasing the deformation of the buffer portion 222 and the annular portion 221 when the heat shrink sleeve 22 retracts. Moreover, even if the heat shrinkable sleeve 22 retracts, since a gap is left between the buffer portion 222 and the low pass inner conductor 21, a buffer space for a certain retraction can be provided for the heat shrinkable sleeve 22, so that the heat shrinkable sleeve 22 is not damaged by heat shrinkage.

The embodiment at least has the following beneficial effects: when assembling the low pass structure 20, since the buffer portion 222 of the heat shrinkable sleeve 22 contacts and deforms with the cavity 23, and the annular portion 221 contacts and deforms with the low pass inner conductor 23, when the heat shrinkable sleeve 22 retracts, the buffer portion 222 and the annular portion 221 are released to allow the heat shrinkable sleeve 22 to be still firmly assembled in the cavity 23, thereby avoiding the problem of loose assembly caused by retraction of the heat shrinkable sleeve 22. Further, since the retraction buffer space is provided between the buffer portion 222 of the heat shrink sleeve 22 and the low pass inner conductor 21, the heat shrink sleeve 22 is not damaged by retraction.

The embodiment of the present application also provides a filter, which includes the low-pass structure 20 described above.

The embodiment of the present application further provides a communication device, which includes the low pass structure 20 described above.

The principle and the implementation of the present application are explained herein by applying specific examples, and the above description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.