Touch sensor-antenna module and display device including the same

文档序号:1836212 发布日期:2021-11-12 浏览:4次 中文

阅读说明:本技术 触摸传感器-天线模块以及包括其的显示装置 (Touch sensor-antenna module and display device including the same ) 是由 金钟敏 吴伦锡 许润镐 于 2020-04-02 设计创作,主要内容包括:本发明实施例的触摸传感器-天线模块包括:包含活性区和接合区的衬底层;以及设置在衬底层上的触摸传感器电极层、辐射电极和天线焊盘。触摸传感器电极层包括设置在活性区上的感测电极、从感测电极延伸的迹线以及与迹线的末端连接且设置在接合区上的触摸传感器焊盘。天线焊盘与辐射电极电连接,并与触摸焊盘一同设置在接合区上。(The touch sensor-antenna module of the embodiment of the present invention includes: a substrate layer comprising an active region and a bonding region; and a touch sensor electrode layer, a radiation electrode, and an antenna pad disposed on the substrate layer. The touch sensor electrode layer includes a sensing electrode disposed on the active region, a trace extending from the sensing electrode, and a touch sensor pad connected to an end of the trace and disposed on the bonding region. The antenna pad is electrically connected to the radiation electrode and is disposed on the bonding area together with the touch pad.)

1. A touch sensor-antenna module, comprising:

a substrate layer comprising an active region and a bonding region;

a touch sensor electrode layer disposed on the substrate layer and comprising: a sense electrode disposed on the active region, a trace extending from the sense electrode, and a touch sensor pad connected to an end of the trace and disposed on the bonding region;

a radiation electrode disposed on the substrate layer; and

an antenna pad electrically connected to the radiation electrode and disposed on the bonding region together with the touch sensor pad.

2. The touch sensor-antenna module of claim 1, wherein the touch sensor pads and the antenna pads form a pad row on the landing area.

3. The touch sensor-antenna module of claim 2, wherein a plurality of the antenna pads are included in the pad row and are disposed between adjacent ones of the antenna pads.

4. The touch sensor-antenna module of claim 3, wherein a distance between adjacent ones of the antenna pads is equal to or greater than a half-wavelength of a wavelength corresponding to a resonant frequency of the radiation electrode.

5. The touch sensor-antenna module of claim 2, wherein the pad row further comprises a ground pad disposed around the antenna pad.

6. The touch sensor-antenna module of claim 5, wherein a pair of the ground pads are disposed facing each other one by one of the antenna pads.

7. The touch sensor-antenna module of claim 1, wherein the touch sensor pads and the antenna pads are located on a same layer.

8. The touch sensor-antenna module of claim 1, wherein the antenna pads are located at an upper level of the touch sensor pads.

9. The touch sensor-antenna module of claim 8, further comprising an insulating layer covering the sensing electrode, wherein the antenna pad is disposed on the insulating layer.

10. The touch sensor-antenna module of claim 8, further comprising an overlay pattern disposed on the touch sensor pads.

11. The touch sensor-antenna module of claim 10, further comprising a cover layer formed on the antenna pads.

12. The touch sensor-antenna module of claim 10, wherein the overlay pattern comprises a transparent conductive oxide.

13. The touch sensor-antenna module of claim 1, further comprising a flexible printed circuit board, wherein the flexible printed circuit board is bonded on the bonding area along with the antenna pads and the touch sensor pads.

14. The touch sensor-antenna module of claim 13, further comprising an antenna driver integrated circuit chip and a touch sensor driver integrated circuit chip electrically connected to the antenna pad and the touch sensor pad, respectively, through the flexible printed circuit board.

15. The touch sensor-antenna module of claim 1, wherein the radiating electrode and the sensing electrode have a mesh structure.

16. The touch sensor-antenna module of claim 1, wherein the radiation electrode is disposed on the same layer as the sense electrode.

17. A display device comprising the touch sensor-antenna module of claim 1.

Technical Field

The present invention relates to a touch sensor-antenna module and a display device including the same. More particularly, the present invention relates to a touch sensor-antenna module including an antenna pattern and a touch sensing structure and a display device including the same.

Background

In recent years, with the development of an information-oriented society, wireless communication technologies such as Wi-Fi, Bluetooth (Bluetooth), and the like have been incorporated into display devices to realize a form of, for example, a smart phone. In this case, the antenna may be coupled to the display device to perform a communication function.

In recent years, with the evolution of mobile communication technology, antennas for performing communication of high-frequency or ultra-high-frequency bands corresponding to 3G to 5G, for example, need to be coupled to display devices.

On the other hand, electronic apparatuses that simultaneously realize an image display function and an information input function have been developed by combining a touch panel or a touch sensor (an input device that allows selection of a content of indication displayed on a screen by a hand or an object to input a user command) with a display device. For example, a touch screen panel has been developed in which a touch sensor is coupled to various image display devices as in korean patent application laid-open No. 2014-0092366.

When the antenna electrode and the touch sensing electrode are mounted together in a limited size and design of the display device, a desired gain characteristic of the antenna may be degraded due to mutual signal interference, and the resolution of the touch sensor may also be degraded. Further, bonding of an integrated circuit chip for controlling each of the antenna and the touch sensor may not be easily achieved in the limited size and design of the display device.

For example, korean patent application laid-open No. 2003-0095557 discloses an antenna structure built in a portable terminal, but does not consider compatibility with other electronic components (e.g., a touch sensor).

Disclosure of Invention

[ problem ] to

An object of the present invention is to provide a touch sensor-antenna module having improved reliability and efficiency of signal transceiving.

Another object of the present invention is to provide a display device including a touch sensor-antenna module having improved reliability and efficiency of signal transceiving.

[ solution ]

1. A touch sensor-antenna module, comprising:

a substrate layer comprising an active region and a bonding region;

a touch sensor electrode layer disposed on the substrate layer and comprising: a sense electrode disposed on the active region, a trace extending from the sense electrode, and a touch sensor pad connected to an end of the trace and disposed on the bonding region;

a radiation electrode disposed on the substrate layer; and

an antenna pad electrically connected to the radiation electrode and disposed on the bonding region together with the touch sensor pad.

2. The touch sensor-antenna module of claim 1, wherein the touch sensor pads and the antenna pads form a pad row on the landing area.

3. The touch sensor-antenna module according to the above 2, wherein a plurality of the antenna pads are included in the pad row, and a plurality of the touch sensor pads are arranged between the adjacent antenna pads.

4. The touch sensor-antenna module according to the above 3, wherein a distance between the adjacent antenna lands is equal to or greater than a half wavelength of a wavelength corresponding to a resonance frequency of the radiation electrode.

5. The touch sensor-antenna module of claim 2, wherein the pad row further comprises a ground pad disposed around the antenna pad.

6. The touch sensor-antenna module according to the above 5, wherein a pair of the ground pads are disposed to face each other with one antenna pad therebetween.

7. The touch sensor-antenna module of claim 1, wherein the touch sensor pads and the antenna pads are located on the same layer.

8. The touch sensor-antenna module as in 1, wherein the antenna pads are located at an upper level of the touch sensor pads.

9. The touch sensor-antenna module of claim 8, further comprising an insulating layer covering the sensing electrode, wherein the antenna pad is disposed on the insulating layer.

10. The touch sensor-antenna module of claim 8, further comprising an overlay pattern disposed on the touch sensor pads.

11. The touch sensor-antenna module of claim 10, further comprising a cover layer formed on the antenna pads.

12. The touch sensor-antenna module of above 10, wherein the overlay pattern comprises a transparent conductive oxide.

13. The touch sensor-antenna module of claim 1, further comprising a flexible printed circuit board, wherein the flexible printed circuit board is bonded to the bonding area together with the antenna pads and the touch sensor pads.

14. The touch sensor-antenna module according to the above item 13, further comprising an antenna driving integrated circuit chip and a touch sensor driving integrated circuit chip electrically connected to the antenna pad and the touch sensor pad, respectively, through the flexible printed circuit board.

15. The touch sensor-antenna module according to the above item 1, wherein the radiation electrode and the sensing electrode have a mesh structure.

16. The touch sensor-antenna module according to the above 1, wherein the radiation electrode and the sensing electrode are disposed on the same layer.

17. A display device comprising a touch sensor-antenna module according to the above embodiments.

[ Effect of the invention ]

According to an embodiment of the present invention, the touch sensor-antenna module may include both the antenna pads and the touch sensor pads in the same row in a planar direction. Therefore, it is not necessary to allocate an area separately for mounting the pad for driving the antenna and the pad can be formed by a single process. In addition, the antenna pad bonding process may also be performed together by the touch sensor pad bonding process.

In some embodiments, multiple touch sensor pads may be disposed between antenna pads to ensure proper spacing distances so that mutual signal interference and noise are shielded.

In some embodiments, a ground pad may be provided around the antenna pads to prevent interference with the touch sensor pads while also achieving horizontal radiation characteristics.

Drawings

Fig. 1 and 2 are a schematic plan view and a cross-sectional view illustrating a touch sensing electrode structure of a touch sensor-antenna module according to an exemplary embodiment, respectively.

Fig. 3 is a schematic plan view illustrating an arrangement of a pad and an antenna electrode of a touch sensor-antenna module according to an exemplary embodiment.

Fig. 4 is a schematic plan view illustrating an arrangement of pads and antenna electrodes of a touch sensor-antenna module according to some exemplary embodiments.

Fig. 5 is a schematic cross-sectional view illustrating a pad arrangement of a touch sensor-antenna module according to an exemplary embodiment.

Fig. 6 is a schematic cross-sectional view illustrating a pad arrangement of a touch sensor-antenna module according to some exemplary embodiments.

Fig. 7 is a schematic plan view illustrating a display device according to an exemplary embodiment.

Detailed Description

Embodiments of the present invention provide a touch sensor-antenna module including a touch sensor electrode layer and an antenna electrode layer, in which a touch sensor pad and an antenna pad are disposed together in a bonding region. In addition, a display device having improved signal reliability and signal efficiency by the above touch sensor-antenna module is also provided.

Fig. 1 and 2 are a schematic plan view and a cross-sectional view illustrating a touch sensing electrode structure of a touch sensor-antenna module according to an exemplary embodiment, respectively. Specifically, fig. 2 is a sectional view taken in the thickness direction along line I-I' of fig. 1. For ease of illustration, the traces and pads are omitted from fig. 1.

Referring to fig. 1 and 2, a touch sensor electrode layer may be disposed on the substrate layer 100. The touch sensor electrode layer may include sensing electrodes 110, 130.

The substrate layer 100 is used in the meaning of including a support layer, an interlayer insulating layer, or a thin film type substrate for forming the sensing electrodes 110, 130. For example, the substrate layer 100 may use a thin film material commonly used in a touch sensor and is not particularly limited, and may include, for example, glass, polymer, and/or inorganic insulating material. Examples of the polymer include Cyclic Olefin Polymer (COP), polyethylene terephthalate (PET), Polyacrylate (PAR), Polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate (polyallylate), Polyimide (PI), Cellulose Acetate Propionate (CAP), Polyethersulfone (PES), cellulose Triacetate (TAC), Polycarbonate (PC), Cyclic Olefin Copolymer (COC), polymethyl methacrylate (PMMA), and the like. Examples of the inorganic insulating material include silicon oxide, silicon nitride, silicon oxynitride, and metal oxide.

In some embodiments, a layer or film member of the image display device in which the touch sensor is embedded may be used as the substrate layer 100. For example, an encapsulation layer or a passivation layer included in the display panel may be used as the substrate layer 100.

The upper surface of the substrate layer 100 may include an active area a and a peripheral area P around the active area a. The sensing electrodes 110, 130 may be disposed on the active area a of the substrate layer 100.

The sensing electrodes 110, 130 may be disposed on the upper surface of the substrate layer 100 of the active area a portion. When a touch of a user is input to the active region a, the sensing electrodes 110 and 130 may change capacitance. Thus, a physical touch can be converted to an electrical signal to perform a predetermined sensing function.

The sensing electrodes 110, 130 may include a first sensing electrode 110 and a second sensing electrode 130. The first and second sensing electrodes 110 and 130 may be arranged in directions crossing each other. The first sensing electrode 110 and the second sensing electrode 130 may be located on the same layer on the upper surface of the substrate layer 100.

For example, the first sensing electrodes 110 may be arranged along a column direction (e.g., Y direction). The first sensing electrodes 110 may be connected in the column direction through the sensing electrode connection part 115. The sensing electrode connection part 115 and the first sensing electrode 110 may be integrally connected to be substantially provided as a single member.

Since the plurality of first sensing electrodes 110 are connected through the sensing electrode connection part 115, a sensing channel column extending in a column direction may be defined. In addition, a plurality of sensing channel columns may be arranged along a row direction (e.g., X direction).

The second sensing electrodes 130 may be arranged along the row direction. Each of the second sensing electrodes 130 may have a spaced island pattern shape. The second sensing electrodes 130 adjacent in the second direction may be electrically connected to each other through the bridge electrode 135.

For example, a pair of second sensing electrodes 130 adjacent to each other by a sensing electrode connection part 115 included in a sensing channel column may be electrically connected to each other by a bridge electrode 135. Accordingly, a sensing channel row may be defined by the plurality of second sensing electrodes 130 and the bridge electrode 135 connected in the row direction described above. In addition, a plurality of sensing channel rows may be arranged in a column direction.

As shown in fig. 2, an insulating layer 120 covering the first and second sensing electrodes 110 and 130 may be formed, and the bridge electrode 135 may penetrate the insulating layer 120 and connect the adjacent second sensing electrodes 130.

The first and second sensing electrodes 110 and 130 may use silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy thereof, respectively, wherein they may be used alone or in combination of two or more.

In an embodiment, the first and second sensing electrodes 110 and 130 may include silver (Ag) or a silver alloy to achieve low resistance, for example, may include a silver-palladium-copper (APC) alloy.

In an embodiment, the first and second sensing electrodes 110 and 130 may include copper (Cu) or a copper alloy to achieve low resistance and a fine line width pattern. For example, the first and second sensing electrodes 110 and 130 may include a copper-calcium (Cu-Ca) alloy.

For example, the first and second sensing electrodes 110 and 130 may have a mesh structure including a metal or an alloy.

The first and second sensing electrodes 110 and 130 may also include a transparent conductive oxide (e.g., Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), zinc oxide (ZnO), Indium Zinc Tin Oxide (IZTO), Cadmium Tin Oxide (CTO), etc.) or a transparent conductive material (such as silver nanowire (AgNW), Carbon Nanotube (CNT), graphene, conductive polymer, etc.), respectively.

In some embodiments, the first and second sensing electrodes 110 and 130 may include a stacked structure of a transparent conductive oxide and a metal. For example, the first and second sensing electrodes 110 and 130 may have a three-layer structure of a transparent conductive oxide layer-a metal layer-a transparent conductive oxide layer. In this case, the signal transmission speed can be improved by the metal layer while improving the flexibility characteristic and reducing the resistance, and the corrosion resistance and the transparency can be improved by the transparent conductive oxide layer.

Although the sensing electrodes 110, 130 are illustrated in fig. 1 as having a diamond pattern shape, respectively, the shapes of the sensing electrodes 110, 130 may be appropriately changed in consideration of pattern density and compatibility with optical characteristics of an image display device. For example, the sensing electrodes 110, 130 may be formed to have wavy edges.

Although it is illustrated in fig. 1 that the column-direction sensing electrodes are integrally connected by the sensing electrode connection parts and the row-direction sensing electrodes are connected by the bridge electrodes, the above-described column direction and row direction are relative terms used with the intention of referring to two different directions crossing each other, and do not limit specific directions.

In addition, the number of sensing channel rows and the number of sensing channel columns and the number of sensing electrodes included therein shown in fig. 1 are only partially shown for convenience of description, and may be expanded according to the area of the active region a.

The peripheral region P may be defined as the region around the periphery of the active region a. For example, an area around the periphery of the active region a may be defined as the peripheral region.

The touch sensor electrode layer can also include traces 140 and touch sensor pads 150 (see fig. 3).

Traces 140 may branch from each sense channel row and sense channel column and extend over peripheral region P. The traces 140 may include a first trace 142 branching from a column of sense channels and a second trace 144 branching from a row of sense channels. The traces 140 may include conductive materials and/or stacked structures that are substantially the same as or similar to the conductive materials and/or stacked structures of the sensing electrodes 110, 130.

Traces 140 may extend over peripheral region P and gather in bonding region P. Touch sensor pads 150 connected to the ends of traces 140 may be disposed in the bonding region P.

On the bonding region P, the touch sensor pad 150 and the antenna pad 160 (refer to fig. 3) may be bonded with a circuit connection structure such as a Flexible Printed Circuit Board (FPCB) 200. A touch sensor driving Integrated Circuit (IC) chip 210 and an antenna driving IC chip 220 may be disposed on the flexible printed circuit board 200.

The electrical connection between the touch sensor driving IC chip 210 and the touch sensor pad 150 and the electrical connection between the antenna driving IC chip 220 and the antenna pad 160 may be achieved through the flexible printed circuit board 200. Accordingly, the antenna feeding and the touch sensing signal transmission can be simultaneously performed through one flexible circuit board 200.

In one embodiment, the touch sensor driving Integrated Circuit (IC) chip 210 and the antenna driving IC chip 220 may be directly mounted on the surface of the flexible printed circuit board 200.

Referring to fig. 1 and 2, the sensing electrodes 110, 130 may be arranged in a Mutual Capacitance (Mutual Capacitance) manner.

In some embodiments, the sensing electrodes 110, 130 may also be arranged in a Self Capacitance (Self Capacitance) manner. In this case, each sensing electrode 110, 130 may have an independent island pattern shape, and the trace 140 may branch from each sensing electrode 110, 130 having an island pattern shape. In addition, the sensing electrode connection part 115 and the bridge electrode 135 may be omitted.

Fig. 3 is a schematic plan view illustrating an arrangement of a pad and an antenna electrode of a touch sensor-antenna module according to an exemplary embodiment.

Referring to fig. 3, as described above, the touch sensor pad 150 may be connected to the end of the trace 140 in the bonding region B. According to an exemplary embodiment, the antenna pads 160 may be disposed in the bonding region B together with the touch sensor pads 150.

In an exemplary embodiment, the antenna pads 160 and the touch sensor pads 150 may together define a pad row in a planar direction. For example, a plurality of touch sensor pads 150 and antenna pads 160 may be repeatedly arranged randomly or regularly in one pad row.

In some embodiments, a plurality of antenna pads 160 may be included in a pad row, and a plurality of touch sensor pads 150 may be disposed between adjacent antenna pads 160.

The touch sensor pads 150 may be disposed between adjacent antenna pads 160 in consideration of a spacing distance for suppressing mutual radiation interference between the antenna patterns. In some embodiments, the distance between adjacent antenna pads 160 (e.g., the distance between the center lines of the antenna pads 160) may be equal to or greater than a half wavelength (λ/2) of the wavelength corresponding to the resonant frequency.

The antenna pattern may be electrically connected to the antenna pad 160. The antenna pattern may include a radiation electrode 165 and a transmission line 162.

The transmission line 162 may branch and extend from the radiation electrode 165 to be electrically connected to the antenna pad 160. The transmission line 162 and the radiation electrode 165 may be provided as a single member substantially integrally formed.

The radiation electrode 165 and/or the transmission line 162 may include the above-described metal or alloy. The radiation electrode 165 and/or the transmission line 162 may include the above-described transparent conductive oxide. The radiation electrode 165 and/or the transmission line 162 may include a stacked structure of the transparent conductive oxide layer and the metal layer described above.

In some embodiments, the radiation electrode 165 and/or the transmission line 162 may have a mesh structure, for example, including the aforementioned metals or alloys. In addition, the sensing electrodes 110 and 130 may also have a mesh structure. In this case, the transmittance of the touch sensor-antenna module can be improved.

In an embodiment, the antenna pads 160 and the touch sensor pads 150 may have a solid structure including a metal or an alloy to reduce signal resistance or channel resistance.

In one embodiment, the antenna pattern may be located at an upper level or level of the antenna pads 160. In this case, the antenna pattern may be disposed on the insulating layer 120, and the transmission line 162 may be electrically connected to the antenna pad 160 through a contact penetrating the insulating layer 120.

In one embodiment, the antenna pattern may be located at the same layer or level as the antenna pads 160. In this case, the antenna pattern and the antenna pad 160 may be disposed together on the insulating layer 120.

For example, the radiation electrode 165 may be disposed between the active region a and the bonding region B shown in fig. 1. In addition, the radiation electrode 165 may be formed on the insulating layer 120 and located at an upper level of the sensing electrodes 110 and 130. Thus, antenna radiation from radiation electrode 165 can be prevented from being shielded or disturbed by sensing electrodes 110, 130.

In some embodiments, the antenna pattern or radiating electrode 165 may be located on the same layer or level as the sensing electrodes 110, 130. In this case, for example, the transmission lines 162 may be arranged not to cross each other on the same plane as the traces 140.

As described above, by disposing the antenna pads 160 and the touch sensor pads 150 together in the bonding region B, the bonding process of the touch sensor driving IC chip 210 and the antenna driving IC chip 220 can be performed together in one area.

Fig. 4 is a schematic plan view illustrating an arrangement of pads and antenna electrodes of a touch sensor-antenna module according to some exemplary embodiments.

Referring to fig. 4, a ground pad 162 may be disposed around the antenna pad 160. According to an exemplary embodiment, a pair of ground pads 162 may be disposed to face each other apart from the antenna pads 160. The ground pad 162 may be spaced apart from the antenna pad 160 and the touch sensor pad 150, and may be included in a pad row together with the antenna pad 160 and the touch sensor pad 150 in the bonding region B.

Since the ground pad 162 is disposed around the antenna pad 160, mutual interference and noise between the antenna pad 160 and the touch sensor pad 150 can be shielded. Further, by providing the ground pad 162, horizontal radiation can be achieved in addition to vertical radiation through the radiation electrode 165.

Fig. 5 is a schematic cross-sectional view illustrating a pad arrangement of a touch sensor-antenna module according to an exemplary embodiment.

Referring to fig. 5, the antenna pads 160 and the touch sensor pads 150 may be located on the same layer or the same height. For example, the antenna pads 160 and the touch sensor pads 150 can be disposed together on the upper surface of the substrate layer 100.

In this case, the insulating layer 120 may at least partially cover the antenna pad 160, and the antenna pattern may be disposed on the insulating layer 120. The transmission line 162 of the antenna pattern may be electrically connected to the antenna pad 160 through a contact penetrating the insulating layer 120.

Fig. 6 is a schematic cross-sectional view illustrating a pad arrangement of a touch sensor-antenna module according to some exemplary embodiments.

Referring to fig. 6, the antenna pads 160 may be located at an upper level with respect to the touch sensor pads 150. For example, the touch sensor pads 150 may be disposed on an upper surface of the substrate layer 100, and the antenna pads 160 may be disposed on the insulating layer 120.

In some embodiments, an overlay pattern 155 may be formed on the touch sensor pad 150. By covering the pattern 155, a step with respect to the antenna pad 160 located at an upper level can be reduced or removed, so that the bonding reliability of the flexible printed circuit board 200 can be improved.

In an embodiment, a cover layer 170 may also be formed on the antenna pad 160. The capping layer 170 may be formed of the same conductive layer as the capping pattern 155 through substantially the same etching process.

The cover layer 170 may be formed on the top surface and the sidewalls of the antenna pad 160. In an embodiment, the cover pattern 155 may also cover both the top surface and the sidewalls of the touch sensor pad 150.

In one embodiment, the capping pattern 155 or the capping layer 170 may include a transparent conductive oxide such as ITO or IZO. In this case, oxidation and corrosion of the touch sensor pad 150 and the antenna pad 160 by external air can be prevented.

Fig. 7 is a schematic plan view illustrating a display device according to an exemplary embodiment. For example, fig. 7 illustrates an outer shape of a window including a display device.

Referring to fig. 7, the display apparatus 300 may include a display region 310 and a peripheral region 320. The peripheral region 320 may be disposed at both sides and/or both ends of the display region 310. The peripheral region 320 may at least partially overlap with the peripheral region P of the touch sensor-antenna module.

In some embodiments, the touch sensor-antenna module may be disposed across the display area 310 and the peripheral area 320 of the display device 300, and the sensing electrodes 110 and 130 are formed in the display area 310.

The pads 150, 160 of the touch sensor-antenna module may be disposed in the peripheral region 320, and the driving IC chips 210, 220 may be disposed together in the peripheral region 320. By disposing the pads 150, 160 adjacent to the driver IC chips 210, 220 in the peripheral region 320, the signal transmission and reception path can be shortened to suppress signal loss. Further, by arranging the antenna pads 160 and the touch sensor pads 150 together in one pad row, the mounting space of the driving IC chips 210, 220 can be reduced.

In some embodiments, at least a portion of the radiation electrode 165 included in the antenna pattern may be disposed in the display region 310. As described above, the visibility of the radiation electrode 165 can be reduced by using the mesh structure.

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