阅读说明：本技术 电子装置 (Electronic device ) 是由 袁伯朵 于 2020-05-12 设计创作，主要内容包括：本申请提供了一种电子装置,包括壳体组件及听筒组件。所述壳体组件包括第一壳体及第二壳体。所述第一壳体限定出用于收容所述听筒组件的容置空间。所述听筒组件包括听筒单元、电路板及导通件。所述导通件电连接所述听筒单元和所述电路板。所述第二壳体连接所述第一壳体,且一并连接所述导通件。本申请借助所述导通件实现听筒单元和电路板之间的信号导通。相较于现有技术中听筒排线模组的技术方案,本申请中所述导通件的设置简化了传统听筒排线模组的结构,并降低组装及维修的成本。(The application provides an electronic device, which comprises a shell assembly and an earphone assembly. The shell assembly comprises a first shell and a second shell. The first shell defines an accommodating space for accommodating the earphone assembly. The earphone assembly comprises an earphone unit, a circuit board and a conducting piece. The conducting piece is electrically connected with the earphone unit and the circuit board. The second shell is connected with the first shell and is also connected with the conducting piece. This application realizes the signal between earphone unit and the circuit board with the help of the piece that switches on. Compare in the technical scheme of earphone winding displacement module among the prior art, the structure of traditional earphone winding displacement module has been simplified in setting up of switch-on piece in this application to reduce the cost of equipment and maintenance.)

1. An electronic device comprises a shell assembly, wherein the shell assembly comprises a first shell and a second shell, and the electronic device is characterized by further comprising an earphone assembly, the first shell defines an accommodating space for accommodating the earphone assembly, the earphone assembly comprises an earphone unit, a circuit board and a conducting piece, the conducting piece is electrically connected with the earphone unit and the circuit board, and the second shell is connected with the first shell and is connected with the conducting piece in a lump.

2. The electronic device according to claim 1, wherein the conductive member includes a first conductive portion, a second conductive portion and a connecting portion, the first conductive portion is electrically connected to the earpiece unit and is also connected to the second housing; the second conduction part is electrically connected with the circuit board, and the connecting part is connected between the first conduction part and the second conduction part.

3. The electronic device according to claim 2, wherein the first conductive part includes a main body part and a plurality of extension parts, the main body part is connected to the connecting part, the plurality of extension parts are formed by extending an edge of the main body part outwards, and the plurality of extension parts are bent relative to the main body part in a direction away from the earpiece unit to form a receiving space together with the main body part.

4. The electronic device according to claim 3, wherein the plurality of extending portions are arranged at intervals, a gap is formed between two adjacent extending portions and between the connecting portion and the adjacent extending portion, and a part of the second housing is arranged in the accommodating space and the gap to connect the first conduction portion.

5. The electronic device according to claim 4, wherein the second conductive part is connected to an end of the connecting part away from the first conductive part and bent toward the connecting part relative to the circuit board, and a joint of the connecting part and the second conductive part is electrically connected to the circuit board.

6. The electronic device according to any one of claims 1 to 5, wherein an outer surface of the via is provided with a protective layer.

7. The electronic device according to any one of claims 1 to 5, wherein the first housing includes a bottom plate and a side plate facing away from the bottom plate, the side plate is protruded from an edge of the bottom plate to form the accommodating space together with the bottom plate, and the earpiece unit and the circuit board are both disposed on the bottom plate.

8. The electronic device of claim 7, wherein the bottom plate is provided with a receiving slot for receiving the earphone unit, the receiving slot comprises a slot bottom plate and a slot side plate, the slot bottom plate is arranged on the bottom plate, and the slot side plate is arranged around the periphery of the slot bottom plate to form the receiving slot.

9. The electronic device as claimed in claim 8, wherein a side of the circuit board is provided with a notch matching with the receiving slot, and the receiving slot is located in the notch.

10. The electronic device according to any one of claims 1 to 5, wherein the second housing is formed by in-mold injection molding.

Technical Field

The present application relates to electronic devices, and more particularly, to electronic devices having an earpiece assembly.

Background

Currently, a handset in a mobile device generally connects a channel to a motherboard through a handset cable module (the handset cable module includes a cable unit, a back adhesive, a stiffener, etc.), and a board-to-board connector or a spring sheet. However, there are the following problems in connecting the handset and the motherboard through the handset bus module and the board-to-board connector or the spring plate: (1) the parts are numerous, the assembly is complex and the yield is low; (2) the assembly and maintenance costs are high.

Disclosure of Invention

Accordingly, there is a need for an electronic device to solve the above problems.

The application provides an electronic device, including housing assembly, housing assembly includes first casing and second casing, electronic device still includes the earphone subassembly, first casing is injectd and is used for acceping the accommodation space of earphone subassembly, the earphone subassembly includes earphone unit, circuit board and switches on the piece, it connects to switch on the piece electricity the earphone unit with the circuit board, the second casing is connected first casing, and connect in the lump switch on the piece.

Optionally, the conducting piece includes a first conducting portion, a second conducting portion and a connecting portion, and the first conducting portion is electrically connected to the earpiece unit and is also connected to the second housing; the second conduction part is electrically connected with the circuit board, and the connecting part is connected between the first conduction part and the second conduction part.

Optionally, the first conduction part includes a main body part and a plurality of extension parts, the main body part is connected to the connection part, the plurality of extension parts are formed by extending the edge of the main body part outwards, and the plurality of extension parts are bent towards a direction back to the earpiece unit relative to the main body part to form a receiving space together with the main body part.

Optionally, the plurality of extending portions are arranged at intervals, gaps are formed between two adjacent extending portions and between the connecting portion and the adjacent extending portion, and a part of the second housing is arranged in the accommodating space and the gap to connect the first conduction portion.

Optionally, the second conduction part is connected to one end of the connection part, which is far away from the first conduction part, and is bent towards the connection part direction relative to the circuit board, wherein a connection part of the connection part and the second conduction part is electrically connected to the circuit board.

Optionally, the outer surface of the conducting piece is provided with a protective layer.

Optionally, the first housing includes a bottom plate and a side plate facing away from the bottom plate, the side plate is protruded at an edge of the bottom plate to form the accommodating space together with the bottom plate, and the earpiece unit and the circuit board are both disposed on the bottom plate.

Optionally, the bottom plate is provided with an accommodating groove for accommodating the earphone unit, the accommodating groove includes a groove bottom plate and a groove side plate, the groove bottom plate is disposed on the bottom plate, and the groove side plate is surrounded on the periphery of the groove bottom plate to form the accommodating groove.

Optionally, one side of the circuit board is provided with a notch matched with the accommodating groove, and the accommodating groove is located in the notch.

Optionally, the second housing is formed by in-mold injection molding.

This application realizes the signal between earphone unit and the circuit board with the help of the piece that switches on. Compare in the technical scheme of earphone winding displacement module among the prior art, the structure of traditional earphone winding displacement module has been simplified in setting up of switch-on piece in this application to reduce the cost of equipment and maintenance. In addition, through the connection of second casing and the piece that leads to the realization is right the piece that leads to's is fixed to guarantee to lead to the reliability of the electrical contact between piece and the earphone unit and the circuit board, promote the yield of earphone subassembly greatly.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic view of a portion of the electronic device shown in fig. 1.

Fig. 3 is an exploded view of a portion of the electronic device shown in fig. 2.

Fig. 4 is an exploded view of a portion of the electronic device shown in fig. 3.

Fig. 5 is a schematic structural view of the first housing shown in fig. 1.

Fig. 6 is a side view of the lead through shown in fig. 3.

Fig. 7 is a schematic structural view of the conductive member shown in fig. 3.

Fig. 8 is a schematic structural view of the conductive element shown in fig. 7 from another view angle.

Description of the main elements

Electronic device 100

Housing assembly 10

First housing 11

Accommodating space 111

Base plate 112

Side panel 113

Receiving groove 114

Trough floor 1141

Trough side plate 1142

Second housing 12

Earpiece assembly 20

Earpiece unit 21

Circuit board 22

Notch 221

Lead-through member 23

First conduction part 231

Body portion 2311

Extension 2312

Gap 2313

Accommodation space 2314

Second conduction part 232

Connecting part 233

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, an embodiment of the application discloses an electronic device 100. The electronic device 100 is not limited to a mobile phone, a tablet computer, etc. In this embodiment, the electronic device 100 will be described as a mobile phone. The structure of the mobile phone is not limited to the structure shown in fig. 1.

Referring to fig. 2 and fig. 3, the electronic device 100 includes a housing assembly 10 and an earpiece assembly 20. The housing assembly 10 includes a first housing 11 and a second housing 12. The first housing 11 defines a receiving space 111 for receiving the earpiece assembly 20. The earpiece assembly 20 includes an earpiece unit 21, a circuit board 22 and a conducting member 23. The conductive member 23 electrically connects the earpiece unit 21 and the circuit board 22. The second housing 12 is connected to the first housing 11 and also connected to the conductive member 23. In one embodiment, the second housing 12 and the conductive member 23 are electrically insulated.

The present application realizes signal conduction between the earpiece unit 21 and the circuit board 22 by means of the conducting member 23. Compared with the technical scheme of the telephone receiver cable module in the prior art, the arrangement of the conducting piece 23 simplifies the structure of the traditional telephone receiver cable module and reduces the assembly and maintenance cost. In addition, the second housing 12 is connected with the conducting part 23 to fix the conducting part 23, so that the reliability of the electrical contact between the conducting part 23 and the earpiece unit 21 and the circuit board 22 is ensured, and the yield of the earpiece assembly 20 is greatly improved.

Referring to fig. 2 and 4, in the present embodiment, the first housing 11 includes a bottom plate 112 and a side plate 113. The side plate 113 is protruded from an edge of the bottom plate 112 to form the accommodating space 111 with the bottom plate 112. Wherein the second casing 12 is connected to a side of the side plate 113 away from the bottom plate 112. The earpiece unit 21 and the circuit board 22 are disposed on the bottom plate 112.

The material of the first housing 11 may be metal, plastic, or a composite material of metal and plastic. The metal may be selected from one or more of steel alloys, aluminum alloys, iron alloys, copper alloys, nickel alloys and stainless steels. The plastic may be selected from one or more of Polystyrene (PS), polypropylene (PP), Polyethylene (PE), Polyester (PET), polyvinyl chloride (PVC), Polyimide (PI), Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC) and Polyamide (PA).

Referring to fig. 4 and 5, a receiving groove 114 for receiving the earpiece unit 21 is further formed on the bottom plate 112. The receiving slot 114 includes a slot bottom plate 1141 and a slot side plate 1142. In this embodiment, the trough floor 1141 is part of the base plate 112. In other embodiments, the trough floor 1141 is formed by a portion of the bottom plate 112 that is recessed downward or is raised upward. The trough side plate 1142 surrounds the periphery of the trough bottom plate 1141 to form the receiving trough 114.

Referring to fig. 5, in the present embodiment, the groove side plate 1142 connects part of the side plates 113 and surrounds the periphery of the groove bottom plate 1141 together to form the receiving groove 114. Of course, in other embodiments, the trough side plate 1142 is not connected to the side plate 113. That is, the tank side plate 1142 is separately provided around the periphery of the tank bottom plate 1141 to form the receiving tank 114.

Referring to fig. 3 and 4, a notch 221 is formed on one side of the circuit board 22 to fit the receiving slot 114. The circuit board 22 is disposed on the bottom plate 112, and the receiving groove 114 is located in the gap 221. In this way, one end of the conducting member 23 is connected to the earpiece unit 21, and the other end thereof is connected to the circuit board 22.

In one embodiment, the earpiece unit 21 and the circuit board 22 are respectively provided with an electrical connection terminal (not shown), so that the conduction member 23 can be respectively connected to the earpiece unit 21 and the circuit board 22 to realize signal conduction between the earpiece unit 21 and the circuit board 22. Wherein the electrical connection terminals are not limited to pads, connectors, gold fingers, etc.

Referring to fig. 3, in the present embodiment, the earpiece assembly 20 includes two conducting members 23. In other embodiments, the number of the conducting members 23 can be adjusted according to actual needs, and can be three, four, and the like.

Referring to fig. 3 and 6, each conductive member 23 includes a first conductive portion 231, a second conductive portion 232, and a connecting portion 233. The first conduction part 231 is electrically connected to the earpiece unit 21, the second conduction part 232 is connected to the circuit board 22, and the connection part 233 is connected between the first conduction part 231 and the second conduction part 232. In the present embodiment, the first conduction part 231 is disposed on a surface of the earpiece unit 21 facing away from the bottom plate 112. The second conductive part 232 is disposed on a surface of the circuit board 22 opposite to the bottom plate 112.

Referring to fig. 7 and 8, the first conduction parts 231 include a body part 2311 connected to the connection part 233 and a plurality of extension parts 2312 connected to the body part 2311. In the present embodiment, the main body portion 2311 is provided on a surface of the earpiece unit 21 facing away from the bottom plate 112.

The shape of the body portion 2311 is not limited to a regular shape such as a rectangle, a circle, a rhombus, or other irregular shapes. The shape of the extension 2312 is not limited to a regular shape such as a rectangle, a circle, a diamond, or other irregular shape.

Referring to fig. 7 and 8, the plurality of extensions 2312 are formed by extending outward from the edge of the body portion 2311. The extending portions 2312 are bent relative to the main body portion 2311 in a direction away from the earpiece unit 21, and form a receiving space 2314 with the main body portion 2311. In the present embodiment, the first conduction part 231 includes three extension parts 2312. In other embodiments, the number of the extension portions 2312 may be set according to the size, shape, etc. of the body portion 2311, and may be two, four, five, etc.

Referring to fig. 7 and 8, the plurality of extensions 2312 are provided at intervals. Thus, gaps 2313 are formed between two adjacent extension portions 2312 and between the connecting portion 233 and its adjacent extension portion 2312. Wherein, a part of the second housing 12 is disposed in the receiving space 2314 and the gap 2313 to fix the conducting piece 23, so as to ensure the reliability of the electrical contact between the conducting piece 23 and the earpiece unit 21 and the circuit board 22.

The plurality of extending portions 2312 are configured to enhance the connection between the second housing 12 and the conducting member 23, so as to prevent the conducting member 23 from falling off.

In one embodiment, the second housing 12 is not limited to being formed by in-mold injection molding. The material of the second housing 12 is not limited to one or more of Polystyrene (PS), polypropylene (PP), Polyethylene (PE), Polyester (PET), polyvinyl chloride (PVC), Polyimide (PI), Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC), and Polyamide (PA).

Referring to fig. 3, 6 and 7, it can be understood that, due to the height difference between the earpiece unit 21 and the circuit board 22, the connection part 233 is inclined toward the circuit board 22 with respect to the plane of the body part 2311. The connecting portion 233 has a flat plate shape.

Referring to fig. 3, 6, 7 and 8, the second conduction part 232 is connected to one end of the connection part 233 far from the first conduction part 231, and is bent toward the connection part 233 with respect to the circuit board 22. Wherein, the connection part 233 and the second conduction part 232 are electrically connected to the circuit board 22.

In the present embodiment, the conducting member 23 is integrally molded. Of course, in other embodiments, the first conduction part 231, the second conduction part 232 and the connection part 233 may be connected to the conduction member 23 through a welding process.

Further, the outer surface of the conducting member 23 is further provided with a protective layer. The protective layer is arranged to improve the durability of the conducting member 23, and ensure the power-on effect of the earpiece unit 21 and the circuit board 22. In one embodiment, the material of the passivation layer is gold. The protective layer may be formed on the outer surface of the via 23 through an electroplating process.

With reference to fig. 2 to 8, the assembling steps of the electronic device 100 will be briefly described as follows:

first, the first housing 11 is provided.

Next, the earpiece unit 21 is placed in the receiving groove 114, and the circuit board 22 is disposed on the bottom plate 112. The receiving groove 114 is located at the position of the notch 221 of the circuit board 22.

Then, the two conductive members 23 are electrically connected to the earpiece unit 21 and the circuit board 22, respectively.

Finally, the assembled components are placed in an injection mold (not shown), and then resin is injected to form a second housing 12 connected to the first housing 11. The resin is injected into the receiving space 2314 and the gap 2313 together, so that the second housing 12 is connected to the first conduction part 231, and the conduction piece 23 is fixed.

Although the present application has been described in detail with reference to preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present application.