阅读说明：本技术 电子设备及其制作方法 (Electronic device and manufacturing method thereof ) 是由 单建富 邓子默 罗欣 董传宇 于 2021-08-19 设计创作，主要内容包括：本申请公开了一种电子设备及其制作方法,所述电子设备包括：壳体、扬声器单体、可形变隔离膜和吸声颗粒；所述壳体内设有容置空间,所述扬声器单体设于所述容置空间内并将所述容置空间分隔为前音腔和后音腔；所述可形变隔离膜贴合于所述后音腔的腔壁以形成密闭的吸声腔,所述吸声颗粒收容于所述吸声腔并充满所述后音腔。(The application discloses electronic equipment and a manufacturing method thereof, wherein the electronic equipment comprises: the loudspeaker comprises a shell, a loudspeaker monomer, a deformable isolating membrane and sound absorption particles; the loudspeaker single body is arranged in the accommodating space and divides the accommodating space into a front sound cavity and a rear sound cavity; the deformable isolating membrane is attached to the wall of the rear sound cavity to form a closed sound absorption cavity, and the sound absorption particles are contained in the sound absorption cavity and are filled in the rear sound cavity.)

1. An electronic device, comprising: the loudspeaker comprises a shell, a loudspeaker monomer, a deformable isolating membrane and sound absorption particles;

the loudspeaker single body is arranged in the accommodating space and divides the accommodating space into a front sound cavity and a rear sound cavity; the deformable isolating membrane is attached to the wall of the rear sound cavity to form a closed sound absorption cavity, and the sound absorption particles are contained in the sound absorption cavity and are filled in the rear sound cavity.

2. The electronic device of claim 1, wherein the deformable barrier film is a PET film or a PVC film.

3. The electronic device according to claim 1, wherein the housing is provided with a first through hole through which the sound-absorbing particles pass and which communicates with the rear sound chamber.

4. The electronic device according to claim 3, further comprising a main board, wherein the housing includes a screen support and a frame plate, the accommodating space is formed between the screen support and the frame plate, the screen support, the main board and the frame plate are stacked in sequence, the screen support, the main board, the frame plate and the speaker unit enclose the rear sound cavity, and the first through hole is formed in the screen support or the frame plate.

5. The electronic device of claim 4, wherein the main board is provided with an avoiding hole, the speaker unit is disposed in the avoiding hole and has a gap with a sidewall of the avoiding hole, and the gap is for the sound-absorbing particles to pass through.

6. The electronic device of claim 4, wherein the first through hole is disposed in the screen support, and a distance between the main board and the screen support is greater than a distance between the main board and the shelf board.

7. The electronic device according to claim 4, further comprising a screen assembly, wherein the screen assembly is located on a side of the screen support away from the frame plate, a screen cabin space is formed between the screen assembly and the screen support, the first through hole is formed in the screen support and communicates with the rear sound cavity and the screen cabin space, and the frame plate is provided with a second through hole which communicates with the rear sound cavity.

8. The electronic device of claim 7, wherein the deformable isolation film is attached to a wall of the rear sound cavity and a sidewall of the screen chamber space to form the sound absorption cavity, and the sound absorption particles fill the rear sound cavity and the screen chamber space.

9. The electronic device of claim 7, wherein a sealing member is disposed between the screen support and the main board and between the chassis and the main board, and the sealing member surrounds the rear sound cavity.

10. A method for manufacturing an electronic device, wherein the electronic device is the electronic device according to any one of claims 3-9, the method comprising:

placing the deformable isolation membrane at the first through hole;

inflating the rear sound cavity from the first through hole to enable the deformable isolating membrane to be unfolded in the rear sound cavity and attached to the cavity wall of the rear sound cavity;

and filling the sound absorption particles into the rear sound cavity from the first through hole, and filling the rear sound cavity with the sound absorption particles.

11. A method for manufacturing an electronic device according to claim 8, the method comprising:

placing the deformable isolation membrane at the second through hole;

inflating the rear sound cavity from the second through hole to enable the deformable isolating membrane to be unfolded in the rear sound cavity and the screen cabin space and to be attached to the cavity wall of the rear sound cavity and the side wall of the screen cabin space;

and injecting the sound absorption particles into the rear sound cavity and the screen cabin space from the second through hole, and filling the sound absorption particles into the rear sound cavity and the screen cabin space.

Technical Field

The application belongs to the technical field of electronics, and particularly relates to electronic equipment and a manufacturing method thereof.

Background

The loudspeaker is an essential component of electronic equipment such as mobile phones, flat panels, computers and the like. The speaker generally includes a housing and a speaker unit, and the speaker unit is disposed in the housing to divide a space of the housing into a front sound cavity and a rear sound cavity. Wherein the back cavity mainly affects the low frequency part of the loudspeaker, which has a large impact on the sound quality. However, with the development of ultra-thinning and intelligence of these electronic devices, the installation space of the speaker can be left smaller and smaller, which results in the reduction of the rear sound cavity space of the speaker, and brings non-negligible influence on the sound quality of the electronic devices.

Disclosure of Invention

The application aims to provide electronic equipment and a manufacturing method thereof, and at least solves the problem that the tone quality of the electronic equipment is influenced because the installation space of the electronic equipment reserved for a loudspeaker is smaller and smaller in the prior art.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the present application provides an electronic device, comprising: the loudspeaker comprises a shell, a loudspeaker monomer, a deformable isolating membrane and sound absorption particles;

the loudspeaker is characterized in that an accommodating space is arranged in the shell, the loudspeaker monomer is arranged in the accommodating space and divides the accommodating space into a front sound cavity and a rear sound cavity, the deformable isolating membrane is attached to the wall of the rear sound cavity to form a closed sound absorption cavity, and the sound absorption particles are contained in the sound absorption cavity and are filled with the rear sound cavity.

According to the electronic equipment provided by the application, the deformable isolating membrane is a PET (polyethylene terephthalate) film or a PVC (polyvinyl chloride) film.

According to the electronic equipment that this application provided, the casing is equipped with first through-hole, first through-hole can supply sound absorption particle pass through and with the back sound chamber is linked together.

According to an electronic equipment that this application provided, still include the mainboard, the casing includes screen support and frame plate, the accommodation space form in the screen support with between the frame plate, the screen support the mainboard with the frame plate stacks gradually the setting, the screen support the mainboard the frame plate with the speaker monomer encloses to close and forms the back sound chamber, first through-hole is located the screen support or the frame plate.

According to the electronic equipment that this application provided, the mainboard is equipped with dodges the hole, the speaker monomer set up in dodge the hole and with there is the clearance between the lateral wall in dodging the hole, the clearance can supply sound absorption particle passes through.

According to the electronic equipment that this application provided, first through-hole is located the screen support, the mainboard is relative the distance of screen support is greater than the mainboard is relative the distance of frame plate.

According to the electronic equipment that this application provided, still include screen assembly, screen assembly is located screen support keeps away from one side of frame plate, screen assembly with be formed with screen storehouse space between the screen support, first through-hole is located screen support and intercommunication back sound chamber with screen storehouse space, the frame plate is equipped with the second through-hole, the second through-hole with back sound chamber is linked together.

According to the electronic equipment that this application provided, but deformable barrier film laminate in the chamber wall in back sound chamber with the lateral wall in screen storehouse space is in order to form the sound absorbing cavity, sound absorbing particles is full of back sound chamber with screen storehouse space.

According to the electronic equipment that this application provided, the screen support with between the mainboard and the frame plate with all be equipped with the sealing member between the mainboard, the sealing member surround in back sound chamber.

In a second aspect, the present application provides a method for manufacturing an electronic device, where the electronic device is any one of the electronic devices described above, and the method for manufacturing the electronic device includes:

placing the deformable isolation membrane at the first through hole;

inflating the rear sound cavity from the first through hole to enable the deformable isolating membrane to be unfolded in the rear sound cavity and attached to the cavity wall of the rear sound cavity;

and filling the sound absorption particles into the rear sound cavity from the first through hole, and filling the rear sound cavity with the sound absorption particles.

In a third aspect, the present application provides a method for manufacturing an electronic device, where the electronic device is the electronic device described above, and the method for manufacturing the electronic device includes:

placing the deformable isolation membrane at the second through hole;

inflating the rear sound cavity from the second through hole to enable the deformable isolating membrane to be unfolded in the rear sound cavity and the screen cabin space and to be attached to the cavity wall of the rear sound cavity and the side wall of the screen cabin space;

and injecting the sound absorption particles into the rear sound cavity and the screen cabin space from the second through hole, and filling the sound absorption particles into the rear sound cavity and the screen cabin space.

In the embodiment of the application, according to the electronic equipment of the embodiment of the application, through the deformable barrier film of the chamber wall laminating in the back sound chamber to form inclosed sound absorbing chamber in the back sound chamber, and be full of sound absorbing particles in the sound absorbing chamber. Under the condition of not changing the volume of the back sound cavity, the capacity expansion of the back sound cavity is realized. The deformable isolating membrane is tightly attached to the cavity wall of the rear sound cavity under the extrusion action of the sound absorption particles, so that the sealing type of the rear sound cavity is improved. Based on the expansion and the improvement of the tightness of the back sound cavity, the low-frequency effect of the back sound cavity is obviously improved, and the tone quality of the equipment is obviously improved. In addition, the wall of the sound absorption particles and the wall of the rear sound cavity are isolated by the deformable isolation film, so that the damage of the structural member caused by the direct contact of the sound absorption particles and the structural member can be avoided.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an exploded view of a part of the structure of an electronic device proposed in the present application;

fig. 2 is a sectional view of a part of the structure of an electronic apparatus proposed in the present application;

fig. 3 is one of the partial structural diagrams of the electronic device proposed in the present application;

fig. 4 is a second schematic structural diagram of a portion of an electronic device according to the present application;

reference numerals:

1. a housing; 11. A front sound cavity; 12. A rear sound cavity;

13. a first through hole; 14. A screen support; 141. A mounting surface;

142. a containing groove; 15. A frame plate; 151. A second through hole;

16. mounting grooves; 2. A speaker unit; 3. A deformable barrier film;

4. sound-absorbing particles; 5. A main board; 51. Avoiding holes;

6. a screen assembly; 61. A screen compartment space; 7. A rear cover plate;

8. and a seal.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

An electronic device according to an embodiment of the application is described below in conjunction with fig. 1-4.

Fig. 1 is an exploded schematic view of a partial structure of an electronic device, fig. 2 is a cross-sectional view of the partial structure of the electronic device, and fig. 3 is a schematic view of a partial structure of the electronic device.

The electronic equipment provided by the embodiment of the application comprises a shell 1, a loudspeaker single body 2, a deformable isolation film 3 and sound absorption particles 4. The deformable separating film 3 and the sound-absorbing particles 4 can be seen in fig. 3, which is not shown in fig. 1 and 2. The housing 1 is provided with a receiving space therein, and the speaker unit 2 is disposed in the receiving space and divides the receiving space into a front sound cavity 11 and a rear sound cavity 12. The deformable isolating membrane 3 is attached to the wall of the rear sound cavity 12 to form a closed sound absorption cavity, and the sound absorption particles 4 are contained in the sound absorption cavity and filled in the rear sound cavity 12.

Wherein, the inside wall of casing 1 is equipped with mounting groove 16, and preceding sound chamber 11 is formed between speaker monomer 2 and the tank bottom of mounting groove 16. The rear sound chamber 12 is formed between the speaker unit 2 and the inner side wall of the housing 1 except the mounting groove 16. The sound absorption particles 4 are Bass powder, and the sound absorption particles 4 are filled in the rear sound cavity 12 and used for expanding the rear sound cavity 12. The expansion principle is that micropores are formed among the sound absorption particles 4, and the repulsive force among air molecules is reduced after the air molecules enter the micropores, so that the space among the air molecules is reduced. Under the condition that the volume of the back sound cavity 12 is not changed, more air molecules can be actually contained, and therefore the effect of expanding the volume of the back sound cavity 12 is achieved.

It should be noted that, ignoring the thickness of the deformable barrier membrane 3, the sound absorbing chamber and the back sound chamber 12 are of equal size. The sound-absorbing particles 4 are accommodated in the sound-absorbing chamber and filled with the rear sound chamber 12, i.e. the sound-absorbing chamber 12 is filled with the sound-absorbing particles 4 at the same time. Wherein the deformable separating film 3 has deformable and airtight properties. Based on the deformable nature of the deformable isolation diaphragm 3, it can be deformed to extend into various regions within the rear sound chamber 12. Under the extrusion action of the sound absorption particles 4 filled in the rear sound cavity 12, the deformable isolation membrane 3 and the cavity wall of the rear sound cavity 12 can be kept in a joint state. Based on the airtight characteristic of the deformable isolating membrane 3, the loudspeaker single body 2 can be completely isolated from the rear sound cavity 12 through the air-tight characteristic, and the airtightness of the rear sound cavity 12 is improved.

According to the electronic equipment of this application embodiment, through the chamber wall laminating deformable barrier film 3 in back sound chamber 12 to form inclosed sound absorbing cavity in back sound chamber 12, and be full of sound absorption particle 4 in the sound absorbing cavity. Under the condition of not changing the volume of the rear sound cavity 12, the capacity expansion of the rear sound cavity 12 is realized; the deformable isolating membrane 3 is tightly attached to the cavity wall of the rear sound cavity 12 under the extrusion action of the sound absorption particles 4, so that the sealing type of the rear sound cavity 12 is improved. Based on the expansion of the back sound cavity 12 and the improvement of the tightness, the low-frequency effect of the back sound cavity of the electronic device is remarkably improved, and the tone quality of the device is obviously improved. In addition, the wall of the sound absorption particles 4 and the wall of the rear sound cavity 12 are isolated by the deformable isolation film 3, so that the damage of the structural member caused by the direct contact of the sound absorption particles 4 and the structural member can be avoided.

According to some embodiments of the present application, the casing 1 is provided with a first through hole 13, and the first through hole 13 is provided for the sound-absorbing particles 4 to pass through and communicates with the rear sound chamber 12. The first through holes 13 are used for arranging the deformable isolating membrane 3 and the sound-absorbing particles 4 towards the rear sound cavity 12. Specifically, the electronic device provided by the application uses the housing 1 of the electronic device as the housing of the loudspeaker, the housing 1 comprises a screen support 14, and the screen support 14 is used for supporting the screen assembly 6 of the electronic device. The first through hole 13 may be provided to the screen bracket 14 by using the screen bracket 14 as an upper case of the speaker. The lower case of the speaker may be specifically disposed according to the structure of the electronic device and the installation position of the speaker.

Taking a mobile phone as an example, when the speaker is an upper speaker of the mobile phone, the housing 1 further includes a main board support, and the main board support is used for supporting a main board of the electronic device. The accommodation space is formed between the screen support 14 and the main board support, the main board support is used as a lower shell of the loudspeaker, and the first through hole 13 can be opened in the main board support. When the speaker is a lower speaker of the mobile phone, the housing 1 further includes a Box cover plate, the accommodating space is formed between the screen bracket 14 and the Box cover plate, the Box cover plate is used as a lower housing of the speaker, and the first through hole 13 can be opened in the Box cover plate.

Further, the housing 1 also includes a rear cover plate 7. The rear cover plate 7 is assembled and connected with the screen bracket 14. The rear cover plate 7 can also be used as a containing space between the lower shell of the loudspeaker and the screen support 14, and the first through hole 13 can be arranged on the rear cover plate 7. The back cover 7 can also be stacked on the main board support or on the side of the Box cover remote from the screen support 14. In this case, the first through hole 13 penetrates the rear cover 7 and the main board support, or the first through hole 13 penetrates the rear cover 7 and the Box cover.

After the loudspeaker unit 2 and the shell 1 are assembled, the deformable isolation film 3 is blown into the rear sound cavity 12 from the first through hole 13 in an inflation mode until the deformable isolation film 3 is attached to the cavity wall of the rear sound cavity 12. After the deformable isolating membrane 3 is arranged, the sound-absorbing particles 4 are filled into the rear sound cavity 12 from the first through hole 13, and the rear sound cavity 12 is filled with the sound-absorbing particles 4. And tightly attaching the deformable isolating membrane 3 to the wall of the rear sound cavity 12 under the extrusion action of the sound absorption particles 4 to finish the powder filling operation.

Furthermore, the electronic device provided by the present application further includes a sealing cover, and the sealing cover is a cover plate made of PET or PVC, and can be used for sealing the first through hole 13. After the deformable isolating membrane 3 and the sound absorption particles 4 are arranged through the first through holes 13, the first through holes 13 are sealed and blocked through the sealing cover, so that the sealing performance of the rear sound cavity 12 is ensured. Wherein a side wall of the flap facing the rear sound chamber 12 forms part of the chamber wall of the rear sound chamber 12.

In the production process, after the deformable isolating membrane 3 is arranged in the rear sound cavity 12 through the first through hole 13, the deformable isolating membrane 3 is provided with an opening which is communicated with the first through hole 13 and the sound absorbing cavity. The sound-absorbing particles 4 are filled in the rear sound cavity 12 through the first through hole 13 and the opening, and the powder filling operation is completed.

In some embodiments, after the powder filling operation is completed, the deformable isolation film 3 is sealed, i.e. only the deformable isolation film 3 forms the sound absorption cavity. In other embodiments, after the powder filling operation is completed, the first through hole 13 is sealed by a sealing cover, that is, the sound absorbing cavity is formed by the deformable isolation film 3 tightly attached to the cavity wall of the rear sound cavity 12 and a part of the cavity wall of the rear sound cavity 12.

According to some embodiments of the present application, the deformable separation Film 3 is a Polyethylene Terephthalate Film (PET Film) or Polyvinyl chloride (PVC Film). The PET film and the PVC film have good mechanical property and air impermeability, the surfaces of the PET film and the PVC film have smaller fluid resistance coefficients, and the wall of the sound absorption cavity formed by the PET film and the PVC film has higher smoothness, so that the sound absorption particles 4 can be filled conveniently.

As shown in fig. 1, the electronic device proposed in the present application further includes a main board 5, and the housing 1 includes a screen support 14 and a shelf 15. An accommodation space is formed between the screen support 14 and the shelf 15. The screen support 14, the main board 5 and the frame plate 15 are sequentially stacked, and the screen support 14, the main board 5, the frame plate 15 and the speaker unit 2 enclose and form a rear sound cavity 12. The first through hole 13 is provided in the screen support 14 or the shelf 15. The shelf 15 may be the main board bracket, Box cover plate or rear cover plate 7 described in the above embodiments.

Specifically, the screen holder 14 has a mounting surface 141, and the mounting surface 141 is provided with a receiving groove 142. The mounting groove 16 is disposed in the receiving groove 142. After the main board 5 is stacked on the mounting surface 141, a certain space is formed between the main board 5 and the screen support 14, and when the first through hole 13 is disposed at the position of the screen support 14 relative to the main board 5, the deformable isolation film 3 and the sound absorption particles 4 are filled in the sound cavity 12 through the first through hole 13.

The shelf 15 is stacked on a side of the main board 5 away from the receiving groove 142, and a projection of the shelf 15 to the mounting surface 141 completely covers the receiving groove 142. Thereby forming a rear sound chamber 12 between the screen support 14, the main board 5, the chassis 15 and the speaker unit 2. The shelf 15 may be configured as a cover, with the cover opening facing the main board 5. So that a certain space exists between the frame plate 15 and the main board 5, and the first through hole 13 can be disposed on the frame plate 15.

As shown in fig. 1 and 2, according to some embodiments of the present application, the main board 5 is provided with an avoiding hole 51, and the speaker unit 2 is disposed in the avoiding hole 51 and has a gap a with a side wall of the avoiding hole 51, where the gap a is for the sound absorbing particles 4 to pass through. Based on the orientation and position relationship shown in fig. 1, when the top surface of the speaker unit 2 is higher than the plane of the main board 5, the speaker unit 2 penetrates through the avoiding hole 51 by setting the avoiding hole 51 on the main board 5, so that the space for hardware upgrade of the electronic device can be reserved to a greater extent. In addition, the frame plate 15 and the periphery of the avoiding hole 51 are stacked, so that the assembly surface of the main board 5 and the frame plate 15 is smooth, and the sealing performance between the main board 5 and the frame plate 15 is guaranteed.

Wherein, there is a clearance a between the side wall of the avoiding hole 51 and the side wall of the speaker unit 2, so that the space between the main board 5 and the frame plate 15 is communicated with the space between the main board 5 and the screen support 14. It is possible to provide the deformable isolating membrane 3 to the rear sound chamber 12 through the first through-holes 13 and to fill the sound absorbing particles 4 to the rear sound chamber 12 regardless of whether the first through-holes 13 are provided to the screen support 14 or the chassis 15.

According to some embodiments of the present application, the first through hole 13 is disposed in the screen bracket 14, and a distance between the main board 5 and the screen bracket 14 is greater than a distance between the main board 5 and the shelf board 15. So, the mainboard 5 is less to blockking that first through-hole 13 formed to set up deformable barrier film 3 and sound absorption particle 4 in the backsound cavity 12 through first through-hole 13.

Fig. 4 is a second schematic structural diagram of the electronic device according to the present application. The electronic device proposed by the present application further comprises a screen assembly 6, the screen assembly 6 being located on a side of the screen support 14 remote from the shelf 15. A screen chamber space 61 is formed between the screen assembly 6 and the screen support 14, and the first through hole 13 is formed in the screen support 14 and communicated with the rear sound cavity 12 and the screen chamber space 61. The frame plate 15 is provided with a second through hole 151, and the second through hole 151 is communicated with the rear sound cavity 12. When the lower case of the speaker is a speaker cover, the second through hole 151 is formed in the speaker cover.

Specifically, the screen assembly 6 is assembled with the screen support 14, and an assembly gap existing between the two forms the screen chamber space 61. Wherein, but the first through-hole 13 of deformable barrier film 3 and sound absorption particle 4 accessible screen support 14 sets up in back sound chamber 12, also can set up in back sound chamber 12 through the second through-hole 151 on the frame plate 15, specifically can be according to the convenience of actual irritated powder and select first through-hole 13 or second through-hole 151. For example, when the first through hole 13 and the second through hole 151 are both opposite to the motherboard 5, if the distance between the first through hole 13 and the motherboard 5 is greater than the distance between the second through hole 151 and the motherboard 5, the deformable isolation film 3 and the sound absorption particles 4 are selectively arranged through the first through hole 13; otherwise, the second through hole 151 is selected.

If set up deformable barrier film 3 and sound absorption particle 4 through second through-hole 151, because sound chamber 12 and screen storehouse space 61 behind first through-hole 13 intercommunication, deformable barrier film 3 and sound absorption particle 4 all can get into through first through-hole 13 and screen storehouse space 61. In this case, the screen chamber space 61 also functions as a rear sound chamber. The back sound cavity 12 and the screen chamber space 61 together constitute the actual back sound cavity of the loudspeaker, so that the volume of the actual back sound cavity is increased, and the sound quality is further improved. Alternatively, as shown in fig. 4, the sound-absorbing particles 4 fill the rear sound cavity 12 and the screen chamber space 61, and the deformable separating film 3 is attached to the wall of the rear sound cavity 12 and the side wall of the screen chamber space 61 to form the sound-absorbing cavity. This maximizes the use of the screen chamber space 61 to obtain a substantially larger volume of the rear sound cavity.

In some embodiments of the present application, in the case where only the first through hole 13 is provided, after the powder filling operation of the rear sound cavity 12 is completed through the first through hole 13, the first through hole 13 is sealed by a sealing cover.

Under the condition that the first through hole 13 and the second through hole 151 are simultaneously arranged and the sound absorption particles 4 are only accommodated in the rear sound cavity 12, if the deformable isolation film 3 and the sound absorption particles 4 are arranged through the first through hole 13, the second through hole 151 is firstly plugged through one sealing cover, and after the powder filling operation of the rear sound cavity 12 is completed, the first through hole 13 is plugged through the other sealing cover; if the deformable isolating membrane 3 and the sound absorption particles 4 are arranged through the second through holes 151, the first through holes 13 are sealed by one sealing cover, and after the powder filling operation of the rear sound cavity 12 is completed, the second through holes 151 are sealed by the other sealing cover.

Under the condition that the first through hole 13 and the second through hole 151 are simultaneously arranged and the sound absorption particles 4 are contained in the rear sound cavity 12 and the screen cabin space 61, after the powder filling operation of the rear sound cavity 12 and the screen cabin space 61 is completed through the second through hole 151, the second through hole 151 is sealed by a sealing cover.

Further, as shown in fig. 1, a sealing member 8 is disposed between the screen bracket 14 and the main board 5 and between the frame plate 15 and the main board 5, and the sealing member 8 surrounds the rear sound cavity 12. The sealing member 8 is used to isolate the rear sound cavity 12 from the outside, and ensure the sealing performance of the rear sound cavity 12 from the outside. Further, a sealing member 8 is also arranged between the speaker unit 2 and the mounting groove 16, and the sealing member 8 is used for isolating the front sound cavity 11 and the rear sound cavity 12, so that the sealing performance of the front sound cavity 11 and the rear sound cavity 12 is ensured, and the sound waves of the front sound cavity and the rear sound cavity are prevented from interfering. Optionally, the sealing member 8 is a sealing foam or a sealing silicone.

The present application further provides a method for manufacturing an electronic device, where the electronic device is the electronic device in any of the above embodiments, and the method for manufacturing the electronic device includes:

s11, placing the deformable isolation diaphragm 3 at the first through hole 13.

S12, the deformable isolation diaphragm 3 is expanded in the rear sound cavity 12 and attached to the cavity wall of the rear sound cavity 12 by inflating the rear sound cavity 12 from the first through hole 13.

S13, pouring the sound absorbing particles 4 into the rear sound chamber 12 from the first through hole 13, and filling the rear sound chamber 12 with the sound absorbing particles 4.

Specifically, the preformed deformable separating membrane 3 is placed at the first through hole 13. The deformable barrier membrane 3 is then blown into the rear sound chamber 12 by inflating the rear sound chamber 12 so that it expands within the rear sound chamber 12. Due to the deformable nature of the deformable barrier membrane 3, it can extend into each region of the back sound chamber 12 and conform to the wall of the back sound chamber 12. Meanwhile, due to the deformable characteristic of the deformable isolating membrane 3, the deformable isolating membrane can be better attached to the cavity wall of the rear sound cavity 12 through proper deformation. After the deformable isolation diaphragm 3 is completed, the sound absorption particles 4 are filled in the sound absorption cavity formed by the deformable isolation diaphragm 3 from the first through hole 13, that is, the sound absorption particles 4 are filled in the rear sound cavity 12.

The electronic equipment that this application embodiment provided utilizes sound absorption particle 4 to carry out the dilatation of very big degree, the tone quality of promotion speaker that can great degree to back sound chamber 12 under the condition that does not change back sound chamber 12 volume.

The first through hole 13 may be disposed on the screen support 14 or the frame plate 15. When the first through hole 13 is provided in the screen support 14, the deformable barrier film 3 and the sound absorbing particles 4 may be provided from the first through hole 13 to the rear sound chamber 12 after the screen support 14, the chassis 15, the speaker unit 2, and the main board 5 are assembled. When the first through hole 13 is provided in the chassis 15, the deformable isolation film 3 and the sound absorbing particles 4 may be provided from the first through hole 13 to the rear sound cavity 12 after the screen support 14, the chassis 15, the screen assembly 6, the speaker unit 2, and the main board 5 are assembled.

The first through hole 13 may be provided in the screen bracket 14 or the speaker cover. When the first through hole 13 is provided in the screen bracket 14, the deformable isolating membrane 3 and the sound absorbing particles 4 may be provided from the first through hole 13 to the rear sound chamber 12 after the screen bracket 14, the speaker unit 2, and the speaker cover plate are assembled. When the first through hole 13 is provided in the speaker cover plate, the deformable isolating membrane 3 and the sound absorbing particles 4 may be provided from the first through hole 13 to the rear sound chamber 12 after the screen bracket 14, the speaker cover plate, and the speaker unit 2 are assembled.

The application also provides another manufacturing method of the electronic device, and the electronic device is the electronic device described in the above embodiment. When the screen support 14 is provided with the first through-holes 13 and the shelf 15 is provided with the second through-holes 151, the sound-absorbing particles 4 are filled into the rear sound chamber 12 through the second through-holes 151. The manufacturing method of the electronic equipment comprises the following steps:

s21, the deformable separation film 3 is placed at the second through hole 151.

S22, the deformable isolation diaphragm 3 is expanded and attached to the wall of the rear sound cavity 12 and the sidewall of the cabinet space 61 by inflating the rear sound cavity 12 from the second through hole 151 to the deformable isolation diaphragm 3.

S23, filling the sound-absorbing particles 4 into the rear sound chamber 12 and the screen chamber space 61 from the second through-hole 151, and filling the rear sound chamber 12 and the screen chamber space 61 with the sound-absorbing particles 4.

Specifically, after the screen support 14, the chassis 15, the main board 5, the speaker unit 2, and the screen assembly 6 are assembled, the preformed deformable separation film 3 is placed at the second through hole 151. The deformable barrier membrane 3 is then blown into the back sound cavity 12 and the screen chamber space 61 by inflating the back sound cavity 12 so that it expands within the back sound cavity 12 and the screen chamber space 61. Due to the deformable property of the deformable isolating membrane 3, it can extend into each area of the back sound cavity 12 and the screen chamber space 61 and be attached to the cavity wall of the back sound cavity 12 and the side wall of the screen chamber space 61. Meanwhile, due to the deformable characteristic of the deformable isolating membrane 3, the deformable isolating membrane can be better attached to the cavity wall of the rear sound cavity 12 and the side wall of the screen chamber space 61 through proper deformation. After the deformable isolating membrane 3 is arranged, the sound-absorbing particles 4 are filled in the rear sound cavity 12 and the screen chamber space 61 from the second through hole 151.

Wherein, the deformable isolating film 3 can be attached to the cavity wall of the back sound cavity 12 and part of the side wall of the screen chamber space 61; or the deformable isolating membrane 3 is attached to the wall of the rear sound cavity 12 and the whole side wall of the screen chamber space 61, so that the rear sound cavity is developed to the maximum extent, and the sound quality of the equipment is improved.

In the description herein, references to the description of "some embodiments" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.