阅读说明：本技术 显示面板、显示装置及显示面板的制作方法 (Display panel, display device and manufacturing method of display panel ) 是由 肖云升 董向丹 于 2020-02-12 设计创作，主要内容包括：一种显示面板(1)、显示装置及显示面板(1)的制作方法。显示面板(1)包括显示区域(10)和围绕显示区域(10)的非显示区域(20)；显示面板(1)的结构包括基板(41),以及位于基板(41)的一侧且沿远离基板(41)的方向依次设置的缓冲层(42)、半导体层(43)、第一无机绝缘层(44)、第一金属层(45)、第二无机绝缘层(46)、第二金属层(47)、第三无机绝缘层(48)、第三金属层(49)、第一有机层(50)、阳极层(51)、像素界定层(52)、有机功能层(53)和阴极层(54)；非显示区域(20)包括电路板绑定区(201),在电路板绑定区(201),第一无机绝缘层(44)、第二无机绝缘层(46)和第三无机绝缘层(48)中的至少一个的边界与基板(41)的边界重合,第一有机层(50)的边界和像素界定层(52)的边界均与基板(41)的边界之间具有间距。(A display panel (1), a display device and a manufacturing method of the display panel (1) are provided. The display panel (1) includes a display area (10) and a non-display area (20) surrounding the display area (10); the structure of the display panel (1) comprises a substrate (41), and a buffer layer (42), a semiconductor layer (43), a first inorganic insulating layer (44), a first metal layer (45), a second inorganic insulating layer (46), a second metal layer (47), a third inorganic insulating layer (48), a third metal layer (49), a first organic layer (50), an anode layer (51), a pixel defining layer (52), an organic functional layer (53) and a cathode layer (54) which are positioned on one side of the substrate (41) and are sequentially arranged along the direction far away from the substrate (41); the non-display area (20) includes a circuit board bonding area (201), in the circuit board bonding area (201), a boundary of at least one of the first inorganic insulating layer (44), the second inorganic insulating layer (46), and the third inorganic insulating layer (48) coincides with a boundary of the substrate (41), and a boundary of the first organic layer (50) and a boundary of the pixel defining layer (52) each have a space from the boundary of the substrate (41).)

A display panel includes a display area and a non-display area surrounding the display area; the structure of the display panel comprises a substrate, and a buffer layer, a semiconductor layer, a first inorganic insulating layer, a first metal layer, a second inorganic insulating layer, a second metal layer, a third inorganic insulating layer, a third metal layer, a first organic layer, an anode layer, a pixel defining layer, an organic functional layer and a cathode layer which are positioned on one side of the substrate and are sequentially arranged along the direction far away from the substrate; wherein:

the first metal layer comprises a gate and a first plate, the second metal layer comprises a second plate, the third metal layer comprises a source and a drain connected with the semiconductor layer through a via hole, wherein: the semiconductor layer, the grid electrode, the source electrode and the drain electrode form a thin film transistor device located in the display area; the first polar plate and the second polar plate form a capacitor device positioned in the display area; the anode layer is connected with the drain electrode through a through hole, and the anode layer, the organic functional layer and the cathode layer form an organic light-emitting device positioned in the display area;

the non-display region includes a circuit board bonding region having a bonding portion exposed to a surface of the display panel, in which a boundary of at least one of the first inorganic insulating layer, the second inorganic insulating layer, and the third inorganic insulating layer coincides with a boundary of the substrate, and a boundary of the first organic layer and a boundary of the pixel defining layer have a space therebetween.

The display panel of claim 1, wherein: the bonding portion includes a third contact pad located at the third metal layer.

The display panel of claim 2, wherein: the binding portion further includes a first contact pad located at the first metal layer and/or a second contact pad located at the second metal layer.

The display panel of claim 1, further comprising: a fourth inorganic insulating layer, a fourth metal layer and a second organic layer which are positioned between the first organic layer and the anode layer and are sequentially arranged along the direction far away from the substrate;

the boundary of the fourth inorganic insulating layer coincides with the boundary of the substrate;

the boundary of the second organic layer and the boundary of the substrate have a space therebetween.

The display panel of claim 4, wherein: the binding portion includes a fourth contact pad at the fourth metal layer.

The display panel of claim 5, wherein: the binding portion further includes at least one of a first contact pad located at the first metal layer, a second contact pad located at the second metal layer, and a third contact pad located at the third metal layer.

The display panel of claim 1, further comprising: lie in the cathode layer is kept away from one side of base plate and along keeping away from packaging structure layer, fifth metal layer, fifth inorganic insulating layer and the touch-control electrode layer that the direction of base plate set gradually, wherein:

the touch electrode layer comprises a plurality of touch electrode units arranged in an array manner and first connecting lines for connecting the adjacent touch electrode units along a first direction, and the fifth metal layer comprises second connecting lines for connecting the adjacent touch electrode units through via holes along a second direction;

the binding part comprises a fifth contact pad, and the fifth contact pad is positioned on the fifth metal layer or the touch electrode layer;

the boundary of the fifth inorganic insulating layer coincides with the boundary of the substrate.

The display panel of any one of claims 1-7, wherein: the first metal layer and the second metal layer are made of the same material.

The display panel of any one of claims 4-6, wherein: the third metal layer and the fourth metal layer are made of the same material.

A display panel includes a display area and a non-display area surrounding the display area; the structure of the display panel comprises a substrate, and a buffer layer, a semiconductor layer, a first inorganic insulating layer, a first metal layer, a second inorganic insulating layer, a second metal layer, a third inorganic insulating layer, a third metal layer, a first organic layer, an anode layer, a pixel defining layer, an organic functional layer and a cathode layer which are positioned on one side of the substrate and are sequentially arranged along the direction far away from the substrate; wherein:

the first metal layer comprises a gate and a first plate, the second metal layer comprises a second plate, the third metal layer comprises a source and a drain connected with the semiconductor layer through a via hole, wherein: the semiconductor layer, the grid electrode, the source electrode and the drain electrode form a thin film transistor device located in the display area; the first polar plate and the second polar plate form a capacitor device positioned in the display area; the anode layer is connected with the drain electrode through a through hole, and the anode layer, the organic functional layer and the cathode layer form an organic light-emitting device positioned in the display area;

the non-display region includes a circuit board bonding region having a bonding portion exposed to a surface of the display panel, in which a boundary of the first organic layer and a boundary of the pixel defining layer have a space therebetween and a boundary of the substrate, and at least one of the first organic layer and the pixel defining layer covers the boundaries of the first inorganic insulating layer, the second inorganic insulating layer, and the third inorganic insulating layer.

The display panel of claim 10, wherein: the bonding portion includes a third contact pad located at the third metal layer.

The display panel of claim 11, wherein: the binding portion further includes a first contact pad located at the first metal layer and/or a second contact pad located at the second metal layer.

The display panel of claim 10, further comprising: a fourth inorganic insulating layer, a fourth metal layer and a second organic layer which are positioned between the first organic layer and the anode layer and are sequentially arranged along the direction far away from the substrate;

in the circuit board binding region, a space is provided between the boundary of the second organic layer and the boundary of the substrate, and at least one of the second organic layer and the pixel defining layer covers the boundary of the fourth inorganic insulating layer.

The display panel of claim 13, wherein: the binding portion includes a fourth contact pad at the fourth metal layer.

The display panel of claim 14, wherein: the binding portion further includes at least one of a first contact pad located at the first metal layer, a second contact pad located at the second metal layer, and a third contact pad located at the third metal layer.

The display panel of claim 10, further comprising: lie in the cathode layer is kept away from one side of base plate and along keeping away from packaging structure layer, fifth metal layer, fifth inorganic insulating layer and the touch-control electrode layer that the direction of base plate set gradually, wherein:

the touch electrode layer comprises a plurality of touch electrode units arranged in an array manner and first connecting lines for connecting the adjacent touch electrode units along a first direction, and the fifth metal layer comprises second connecting lines for connecting the adjacent touch electrode units through via holes along a second direction;

the binding part comprises a fifth contact pad, and the fifth contact pad is positioned on the fifth metal layer or the touch electrode layer;

the boundary of the fifth inorganic insulating layer coincides with the boundary of the substrate.

The display panel of claim 10, wherein: a metal structure at a boundary of at least one of the first inorganic insulating layer, the second inorganic insulating layer, and the third inorganic insulating layer;

at least one of the first organic layer and the pixel defining layer encases the metal structure.

The display panel of claim 13, wherein: a metal structure at a boundary of the fourth inorganic insulating layer;

at least one of the second organic layer and the pixel defining layer encases the metal structure.

The display panel according to claim 17 or 18, wherein:

the distance between the metal structure and the boundary of the substrate is 100-150 microns;

the distance between the boundary of the organic layer coating the metal structure and the boundary of the substrate is 80-95 microns.

The display panel according to claim 17 or 18, wherein: the metal structure and the metal layer farthest from the substrate in the binding part are made of the same material; alternatively, the first and second electrodes may be,

the material of the metal structure comprises at least one of the materials of the metal layers in the binding part farthest from the substrate.

The display panel according to claim 17 or 18, wherein:

a gap is formed between the boundary of the metal structure and the inorganic insulating layer; the inorganic insulating layer is at least one of the first inorganic insulating layer, the second inorganic insulating layer, the third inorganic insulating layer, and the fourth inorganic insulating layer.

A display device, comprising: the display panel of any of claims 1-21, and a circuit board bound to the circuit board binding region of the display panel.

A manufacturing method of a display panel comprises the following steps:

manufacturing a whole plate comprising a plurality of display panel units, wherein each display panel unit comprises a display area and a non-display area surrounding the display area, the non-display area comprises a circuit board binding area, and a cutting area is arranged between every two adjacent display panel units;

cutting the whole plate along the cutting area to separate the display panel units, wherein each independent display panel unit is a display panel;

wherein fabricating the full panel comprises:

forming a buffer layer, a semiconductor layer, a first inorganic insulating layer, a first metal layer, a second inorganic insulating layer, a second metal layer, a third inorganic insulating layer, a third metal layer, a first organic layer, an anode layer, a pixel defining layer, an organic functional layer and a cathode layer in sequence along a direction away from the substrate on one side of the substrate, wherein:

a boundary of at least one of the first inorganic insulating layer, the second inorganic insulating layer, and the third inorganic insulating layer coincides with a boundary of the substrate, and a boundary of the first organic layer and a boundary of the pixel defining layer each have a space therebetween.

A manufacturing method of a display panel comprises the following steps:

manufacturing a whole plate comprising a plurality of display panel units, wherein each display panel unit comprises a display area and a non-display area surrounding the display area, the non-display area comprises a circuit board binding area, and a cutting area is arranged between every two adjacent display panel units;

cutting the whole plate along the cutting area to separate the display panel units, wherein each independent display panel unit is a display panel;

wherein fabricating the full panel comprises:

forming a buffer layer, a semiconductor layer, a first inorganic insulating layer, a first metal layer, a second inorganic insulating layer, a second metal layer, a third inorganic insulating layer, a third metal layer, a first organic layer, an anode layer, a pixel defining layer, an organic functional layer and a cathode layer in sequence along a direction away from the substrate on one side of the substrate, wherein:

a space is provided between the boundary of the first organic layer and the boundary of the pixel defining layer and the boundary of the substrate, and at least one of the first organic layer and the pixel defining layer covers the boundaries of the first inorganic insulating layer, the second inorganic insulating layer, and the third inorganic insulating layer.