Connector assembly

文档序号:1877580 发布日期:2021-11-23 浏览:18次 中文

阅读说明:本技术 一种连接器组件 (Connector assembly ) 是由 孙安兵 杨简 于 2021-08-25 设计创作,主要内容包括:本发明涉及通信技术领域,公开了一种连接器组件包括印制电路板、第一连接器和第二连接器,第一连接器包括第一引脚组、第二引脚组,第二连接器包括第三引脚组、第四引脚组,印制电路板的第一表面具有第一焊盘组、第二焊盘组,印制电路板的第二表面具有第三焊盘组、第四焊盘组,第一引脚组、第二引脚组、第三引脚组以及第四引脚组在印制电路板上的正投影分别位于对应的焊盘组在印制电路板上的正投影内;第一焊盘组、第二焊盘组、第三焊盘组以及第四焊盘组在印制电路板上的正投影无交叠接。该连接器组件改善了PCB两面的高速信号线重叠,不能由距离焊盘最近处连接到过孔的问题。(The invention relates to the technical field of communication, and discloses a connector assembly which comprises a printed circuit board, a first connector and a second connector, wherein the first connector comprises a first pin group and a second pin group, the second connector comprises a third pin group and a fourth pin group, a first pad group and a second pad group are arranged on the first surface of the printed circuit board, a third pad group and a fourth pad group are arranged on the second surface of the printed circuit board, and orthographic projections of the first pin group, the second pin group, the third pin group and the fourth pin group on the printed circuit board are respectively positioned in orthographic projections of the corresponding pad groups on the printed circuit board; the orthographic projections of the first bonding pad group, the second bonding pad group, the third bonding pad group and the fourth bonding pad group on the printed circuit board are not overlapped. The connector assembly improves the problem that high speed signal lines on both sides of a PCB overlap and cannot be connected to vias by the closest distance from a pad.)

1. A connector assembly, comprising: the printed circuit board comprises a printed circuit board, a first connector and a second connector, wherein the first connector is arranged on a first surface of the printed circuit board, the second connector is arranged on a second surface of the printed circuit board, the first connector comprises a first pin group extending towards a first direction and a second pin group extending towards a second direction, the second connector comprises a third pin group extending towards the first direction and a fourth pin group extending towards the second direction, and the first direction and the second direction are opposite to each other;

the first surface of the printed circuit board has a first pad group corresponding to the first pin group, and a second pad group corresponding to the second pin group, the second surface of the printed circuit board having a third pad group corresponding to the third pin group, and a fourth pad group corresponding to the fourth pad group, an orthographic projection of the first pad group on the printed circuit board being within an orthographic projection of the first pad group on the printed circuit board, the orthographic projection of the second lead group on the printed circuit board is positioned in the orthographic projection of the second pad group on the printed circuit board, the orthographic projection of the third lead group on the printed circuit board is positioned in the orthographic projection of the third pad group on the printed circuit board, the orthographic projection of the fourth pin group on the printed circuit board is positioned in the orthographic projection of the fourth pad group on the printed circuit board;

the orthographic projections of the first pad group, the second pad group, the third pad group and the fourth pad group on the printed circuit board are not overlapped;

the printed circuit board is characterized in that metal wires are arranged inside the printed circuit board, and the first pad group, the second pad group, the third pad group and the fourth pad group are directly connected with the corresponding metal wires through via holes.

2. The connector assembly of claim 1, wherein an orthographic projection of the first pin group on the printed circuit board, an orthographic projection of the second pin group on the printed circuit board, an orthographic projection of the third pin group on the printed circuit board, and an orthographic projection of the fourth pin group on the printed circuit board are arrayed on the printed circuit board, and wherein the orthographic projection of the first pin group on the printed circuit board and the orthographic projection of the second pin group on the printed circuit board are located on a first diagonal, and the orthographic projection of the third pin group on the printed circuit board and the orthographic projection of the fourth pin group on the printed circuit board are located on a second diagonal.

3. The connector assembly of claim 1, wherein the first set of pins includes a plurality of first pins, the second set of pins includes a plurality of second pins, and the number of first pins is the same as the number of second pins.

4. The connector assembly of claim 1, wherein the third set of pins includes a plurality of third pins, the fourth set of pins includes a plurality of fourth pins, and the number of the third pins is the same as the number of the fourth pins.

5. The connector assembly of claim 1, wherein the first pin group and the second pin group each include two rows of pins arranged along the first direction.

6. The connector assembly of claim 1, wherein the third pin group and the fourth pin group each include two rows of pins arranged along the first direction.

7. The connector assembly of any of claims 1-6, wherein an orthographic projection of the first pin group on the printed circuit board coincides with an orthographic projection of the first pad group on the printed circuit board, an orthographic projection of the second pin group on the printed circuit board coincides with an orthographic projection of the second pad group on the printed circuit board, an orthographic projection of the third pin group on the printed circuit board coincides with an orthographic projection of the third pad group on the printed circuit board, and an orthographic projection of the fourth pin group on the printed circuit board coincides with an orthographic projection of the fourth pad group on the printed circuit board.

8. The connector assembly of any one of claims 1-6, wherein said first connector is directly opposite said second connector.

9. The connector assembly according to any one of claims 1-6, wherein the first pin group and the second pin group constitute a first pin unit, the first connector comprising a plurality of the first pin units distributed in a third direction;

the third pin group and the fourth pin group form a second pin unit, and the second pin unit corresponds to the first pin unit one by one;

the third direction is perpendicular to the first direction.

10. The connector assembly of any of claims 1-6, wherein the first pin group, the second pin group, the third pin group, and the fourth pin group each comprise a high-speed signal pin.

Technical Field

The invention relates to the technical field of communication, in particular to a connector assembly.

Background

In the field of high-speed computing and networks, the stacked bell-to-bell (back-to-back) optical port design is widely applied due to the advantages of improving the panel interface density of a super-large-scale data center and network exchange, saving the space of a Printed Circuit Board (PCB) to the maximum extent, reducing the design cost and the like.

Specifically, in the stacked bell-to-bell optical port design, as shown in fig. 1 and 2, two connector pairs 100 are attached to two sides of a PCB200, the pin packages of each connector are divided into two rows, and the two rows of pins of each connector are soldered to pads of the PCB in opposite directions (one row is to the left and one row is to the right in fig. 1 and 2); after the high-speed signal line is connected to the pad through the connector pin, the high-speed signal line needs to be connected to the inner high-speed line of the PCB through a via 201 on the PCB.

The high speed signal direction (as shown by the arrow in fig. 2) must be the same as the pin direction of the connector, from the middle to both sides of the connector, which causes the high speed signal lines on the upper and lower surfaces to overlap and not be connected to the vias by the nearest distance from the pad, and the vias on the upper and lower surfaces must be staggered by a longer length of the surface trace 206 (as shown in fig. 3 and 4), which deteriorates the high speed signal performance.

Disclosure of Invention

The invention provides a connector assembly which is used for improving the problem that high-speed signal wires on two sides of a PCB are overlapped and cannot be connected to a through hole from the nearest part to a bonding pad in a bell-to-bell optical port design.

In order to achieve the purpose, the invention provides the following technical scheme:

a connector assembly comprising: the printed circuit board comprises a printed circuit board, a first connector and a second connector, wherein the first connector is arranged on a first surface of the printed circuit board, the second connector is arranged on a second surface of the printed circuit board, the first connector comprises a first pin group extending towards a first direction and a second pin group extending towards a second direction, the second connector comprises a third pin group extending towards the first direction and a fourth pin group extending towards the second direction, and the first direction and the second direction are opposite to each other;

the first surface of the printed circuit board has a first pad group corresponding to the first pin group, and a second pad group corresponding to the second pin group, the second surface of the printed circuit board having a third pad group corresponding to the third pin group, and a fourth pad group corresponding to the fourth pad group, an orthographic projection of the first pad group on the printed circuit board overlapping with an orthographic projection of the first pad group on the printed circuit board, the orthographic projection of the second lead group on the printed circuit board is overlapped with the orthographic projection of the second pad group on the printed circuit board, an orthographic projection of the third pin group on the printed circuit board overlaps with an orthographic projection of the third pad group on the printed circuit board, the orthographic projection of the fourth pin group on the printed circuit board is overlapped with the orthographic projection of the fourth pad group on the printed circuit board;

the orthographic projections of the first pad group, the second pad group, the third pad group and the fourth pad group on the printed circuit board are not overlapped;

the printed circuit board is characterized in that metal wires are arranged inside the printed circuit board, and the first pad group, the second pad group, the third pad group and the fourth pad group are directly connected with the corresponding metal wires through via holes.

The invention provides a connector assembly which comprises a printed circuit board, a first connector arranged on a first surface of the printed circuit board and a second connector arranged on a second surface of the printed circuit board, wherein the first connector comprises a first pin group extending towards a first direction and a second pin group extending towards a second direction, and the second connector comprises a third pin group extending towards the first direction and a fourth pin group extending towards the second direction. The first surface of the printed circuit board is provided with a first pad group corresponding to the first pin group and a second pad group corresponding to the second pin group, the orthographic projection of the first pin group on the printed circuit board is overlapped with the orthographic projection of the first pad group on the printed circuit board, and the orthographic projection of the second pin group on the printed circuit board is overlapped with the orthographic projection of the second pad group on the printed circuit board; the second surface of the printed circuit board is provided with a third pad group corresponding to the third pad group and a fourth pad group corresponding to the fourth pad group, the orthographic projection of the third pad group on the printed circuit board is overlapped with the orthographic projection of the third pad group on the printed circuit board, and the orthographic projection of the fourth pad group on the printed circuit board is overlapped with the orthographic projection of the fourth pad group on the printed circuit board; meanwhile, the orthographic projections of the first bonding pad group, the second bonding pad group, the third bonding pad group and the fourth bonding pad group on the printed circuit board are not overlapped (and a certain distance is reserved between the bonding pad groups). The connector assembly provided by the invention has no problem of overlapping of high-speed signal lines on two sides of a PCB, metal routing lines are arranged in the printed circuit board, the first pad group, the second pad group, the third pad group and the fourth pad group are directly connected with the corresponding metal routing lines through via holes, the via holes on the upper surface and the lower surface of the PCB are not required to be staggered through surface layer routing lines, high-speed routing can be realized in a shortest and optimal mode, and the high-speed signal performance of the connector assembly is improved (the high-speed signal rate can be upgraded to be more than 112 Gpbs).

Optionally, an orthographic projection of the first pin group on the printed circuit board, an orthographic projection of the second pin group on the printed circuit board, an orthographic projection of the third pin group on the printed circuit board, and an orthographic projection of the fourth pin group on the printed circuit board are arranged in an array on the printed circuit board, and the orthographic projection of the first pin group on the printed circuit board and the orthographic projection of the second pin group on the printed circuit board are located on a first diagonal, and the orthographic projection of the third pin group on the printed circuit board and the orthographic projection of the fourth pin group on the printed circuit board are located on a second diagonal.

Optionally, the first lead group includes a plurality of first leads, the second lead group includes a plurality of second leads, and the number of the first leads is the same as the number of the second leads.

Optionally, the third pin group includes a plurality of third pins, the fourth pin group includes a plurality of fourth pins, and the number of the third pins is the same as the number of the fourth pins.

Optionally, the first pin group and the second pin group each include two rows of pins arranged along the first direction.

Optionally, the third pin group and the fourth pin group each include two rows of pins arranged along the first direction.

Optionally, an orthographic projection of the first lead group on the printed circuit board coincides with an orthographic projection of the first pad group on the printed circuit board, an orthographic projection of the second lead group on the printed circuit board coincides with an orthographic projection of the second pad group on the printed circuit board, an orthographic projection of the third lead group on the printed circuit board coincides with an orthographic projection of the third pad group on the printed circuit board, and an orthographic projection of the fourth lead group on the printed circuit board coincides with an orthographic projection of the fourth pad group on the printed circuit board.

Optionally, the first connector is directly opposite to the second connector.

Optionally, the first pin group and the second pin group constitute a first pin unit, and the first connector includes a plurality of the first pin units distributed along a third direction;

the third pin group and the fourth pin group form a second pin unit, and the second pin unit corresponds to the first pin unit one by one;

the third direction is perpendicular to the first direction.

Optionally, the first pin group, the second pin group, the third pin group, and the fourth pin group all include high-speed signal pins.

Drawings

FIG. 1 is a side view of a prior art connector assembly;

FIG. 2 is a side view of a prior art connector assembly (the direction of the arrows in the figure being the high speed signal direction);

FIG. 3 is a schematic diagram of pads on both sides of a PCB in a prior art connector assembly (black and gray in the figure each represents a pad on one side of the PCB);

FIG. 4 is a cross-sectional view of a prior art connector assembly;

fig. 5 is a schematic perspective view of a connector assembly according to an embodiment of the present invention;

FIG. 6 is a side view of the connector assembly shown in FIG. 5;

fig. 7 is a diagram illustrating pin positions of a first connector and a second connector in a connector assembly according to an embodiment of the present invention; (the body portion of the second connector is not shown);

fig. 8 is a schematic structural diagram of a first connector in a connector assembly according to an embodiment of the present invention;

fig. 9 is a diagram illustrating a pin position relationship between a first connector and a second connector in a connector assembly according to an embodiment of the present invention;

fig. 10 is a diagram illustrating a positional relationship between a first lead unit and a second lead unit in a connector assembly according to an embodiment of the invention.

Icon: 1-a first connector; 11-a first pin group; 12-a second pin group; 2-a second connector; 21-a third pin group; 22-a fourth pin group; 3-a first pin unit; 4-a second pin unit; 5-high speed signal pin; 100-a connector; 200-PCB (printed circuit board); 201-a via hole; 202-a first pad set; 203-a second pad set; 204-a third pad set; 205-a fourth pad group; 206-surface routing.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 5-7, the connector assembly provided in this embodiment includes a printed circuit board 200, a first connector 1 disposed on a first surface of the printed circuit board 200, and a second connector 2 disposed on a second surface of the printed circuit board 200, where the first connector 1 includes a first pin group 11 extending toward a first direction and a second pin group 12 extending toward a second direction, the second connector 2 includes a third pin group 21 extending toward the first direction and a fourth pin group 22 extending toward the second direction, and the first direction and the second direction are away from each other;

the first surface of the printed circuit board 200 has a first pad group 202 corresponding to the first pin group 11 and a second pad group 203 corresponding to the second pin group 12, and the second surface of the printed circuit board 200 has a third pad group 204 corresponding to the third pin group 21 and a fourth pad group 205 corresponding to the fourth pin group 22. The orthographic projection of the first lead group 11 on the printed circuit board 200 is positioned in the orthographic projection of the first pad group 202 on the printed circuit board 200, the orthographic projection of the second lead group 12 on the printed circuit board 200 is positioned in the orthographic projection of the second pad group 203 on the printed circuit board 200, the orthographic projection of the third lead group 21 on the printed circuit board 200 is positioned in the orthographic projection of the third pad group 204 on the printed circuit board 200, and the orthographic projection of the fourth lead group 22 on the printed circuit board 200 is positioned in the orthographic projection of the fourth pad group 205 on the printed circuit board 200;

the orthographic projections of the first pad group 202, the second pad group 203, the third pad group 204 and the fourth pad group 205 on the printed circuit board 200 are not overlapped;

the printed circuit board 200 has metal traces inside, and the first pad group 202, the second pad group 203, the third pad group 204, and the fourth pad group 205 are directly connected to the corresponding metal traces through vias 201.

The connector assembly provided by the embodiment includes a printed circuit board 200, a first connector 1 disposed on a first surface of the printed circuit board 200, and a second connector 2 disposed on a second surface of the printed circuit board 200, wherein the first connector 1 includes a first pin group 11 extending toward a first direction and a second pin group 12 extending toward a second direction, and the second connector 2 includes a third pin group 21 extending toward the first direction and a fourth pin group 22 extending toward the second direction. The first surface of the printed circuit board 200 is provided with a first pad group 202 corresponding to the first pin group 11 and a second pad group 203 corresponding to the second pin group 12, wherein the orthographic projection of the first pin group 11 on the printed circuit board 200 is in the orthographic projection of the first pad group 202 on the printed circuit board 200, and the orthographic projection of the second pin group 12 on the printed circuit board 200 is in the orthographic projection of the second pad group 203 on the printed circuit board 200; the second surface of the printed circuit board 200 has a third pad group 204 corresponding to the third pin group 21 and a fourth pad group 205 corresponding to the fourth pin group 22, an orthographic projection of the third pin group 21 on the printed circuit board 200 is within an orthographic projection of the third pad group 204 on the printed circuit board 200, and an orthographic projection of the fourth pin group 22 on the printed circuit board 200 is within an orthographic projection of the fourth pad group 205 on the printed circuit board 200; meanwhile, the orthographic projections of the first pad group 202, the second pad group 203, the third pad group 204 and the fourth pad group 205 on the printed circuit board 200 are not overlapped (and a certain distance is provided between the pad groups). This makes the connector assembly provided by this embodiment not have the problem of overlapping of high-speed signal lines on both sides of the PCB, the printed circuit board 200 has metal traces inside, the first pad group 202, the second pad group 203, the third pad group 204, and the fourth pad group 205 are all directly connected with corresponding metal traces through the via 201, and the via 201 on both sides of the PCB need not to be staggered through surface traces, so that high-speed traces can be realized in the shortest and optimal manner, and further the high-speed signal performance of the connector assembly is improved (the high-speed signal rate can be upgraded to over 112 Gpbs).

It should be noted that the orthographic projection of the lead group on the printed circuit board 200 is located in the orthographic projection of the corresponding pad group on the printed circuit board 200, that is, the orthographic projection of the lead group on the printed circuit board 200 may coincide with the orthographic projection of the corresponding pad group on the printed circuit board 200; or the area of the orthographic projection of the lead group on the printed circuit board 200 may be smaller than the area of the orthographic projection of the corresponding pad group on the printed circuit board 200, and the orthographic projection of the lead group on the printed circuit board 200 completely falls within the orthographic projection of the corresponding pad group on the printed circuit board 200.

Referring to fig. 7 to 8, in order to reduce the size of the connector and save the space on the PCB, in an alternative implementation manner, the orthographic projection of the first pin group 11 on the printed circuit board 200, the orthographic projection of the second pin group 12 on the printed circuit board 200, the orthographic projection of the third pin group 21 on the printed circuit board 200, and the orthographic projection of the fourth pin group 22 on the printed circuit board 200 are arranged in an array on the printed circuit board 200, and the orthographic projection of the first pin group 11 on the printed circuit board 200 and the orthographic projection of the second pin group 12 on the printed circuit board 200 are located on a first diagonal line, and the orthographic projection of the third pin group 21 on the printed circuit board 200 and the orthographic projection of the fourth pin group 22 on the printed circuit board 200 are located on a second diagonal line.

In a specific implementation manner, the first pin group 11 includes a plurality of first pins, the second pin group 12 includes a plurality of second pins, and the number of the first pins is the same as the number of the second pins.

In a specific implementation manner, the third pin group 21 includes a plurality of third pins, the fourth pin group 22 includes a plurality of fourth pins, and the number of the third pins is the same as the number of the fourth pins.

In order to reduce the size of the first connector 1 in the third direction while ensuring the performance of the first connector 1, and to facilitate the layout of the connector assembly, as shown in fig. 9, in an alternative implementation, each of the first pin group 11 and the second pin group 12 includes two rows of pins arranged along the first direction.

Similarly, in order to reduce the size of the second connector 2 in the third direction while ensuring the performance of the second connector 2, and to facilitate the layout of the connector assembly, in an alternative implementation, the third pin group 21 and the fourth pin group 22 each include two rows of pins arranged along the first direction.

In order to save space on the PCB, in an alternative implementation manner, the orthographic projection of the first lead group 11 on the printed circuit board 200 coincides with the orthographic projection of the first pad group 202 on the printed circuit board 200, the orthographic projection of the second lead group 12 on the printed circuit board 200 coincides with the orthographic projection of the second pad group 203 on the printed circuit board 200, the orthographic projection of the third lead group 21 on the printed circuit board 200 coincides with the orthographic projection of the third pad group 204 on the printed circuit board 200, and the orthographic projection of the fourth lead group 22 on the printed circuit board 200 coincides with the orthographic projection of the fourth pad group 205 on the printed circuit board 200.

In order to further facilitate the assembly and application of the connector assembly, in an alternative implementation, the first connector 1 is directly opposite to the second connector 2.

In order to make the performance of the connector assembly more powerful, in an alternative implementation, the first pin group 11 and the second pin group 12 form a first pin unit 3, and the first connector 1 includes a plurality of first pin units 3 distributed along a third direction; the third pin group 21 and the fourth pin group 22 form a second pin unit 4, and the second pin unit 4 corresponds to the first pin unit 3 one by one; wherein the third direction is perpendicular to the first direction.

Specifically, when the first connector 1 and the second connector 2 are arranged, as shown in fig. 10, in a specific implementation manner, the first pin group 11, the second pin group 12, the third pin group 21, and the fourth pin group 22 all include the high-speed signal pin 5.

In a specific implementation manner, the connector assembly provided in this embodiment may be a double-faced optical interface high-speed SMT connector assembly. When the high-speed signal is led out from the PCB pad, the high-speed signal can be connected to the via hole 201 through the shortest surface layer routing, and the signal speed can reach 112Gbps and above.

For example: the connector assembly provided by the embodiment can be a 400G optical interface SMT packaging high-speed connector which needs to realize a single signal channel speed of 112Gbps or more, and can be continuously expanded to 800G and higher speed versions while realizing double-sided crimping to ensure high-speed signal quality.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

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